CN112508763B - Laser processing method, laser processing apparatus, and storage medium - Google Patents
Laser processing method, laser processing apparatus, and storage medium Download PDFInfo
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
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- G06T1/00—General purpose image data processing
- G06T1/0014—Image feed-back for automatic industrial control, e.g. robot with camera
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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Abstract
The invention discloses a laser processing method, which comprises the following steps: generating three-dimensional cutting path data; determining the offset parameter of the workpiece to be processed according to the CCD positioning data; correcting the three-dimensional cutting path data according to the offset parameter; determining a light control parameter according to the three-dimensional cutting path; and controlling the three-dimensional cutting path data to control the five-axis linkage motion platform to move, and controlling the laser module to emit light according to the light emission control parameters. The invention also discloses laser processing equipment and a computer readable storage medium, which achieve the effect of improving the richness of the processing function of the traditional processing machine tool.
Description
Technical Field
The present invention relates to the field of machine tool technology, and in particular, to a laser processing method, a laser processing apparatus, and a computer-readable storage medium.
Background
Along with the diversification of market demands, the machining integration of workpieces can be directly realized by using large-scale multi-shaft composite machining equipment, the utilization efficiency of a machine tool is improved, the workpiece clamping flow is simplified, and the machining efficiency and the machining precision are improved. However, when different workpieces are machined by the conventional multi-axis machining equipment, the machining tool bit needs to be frequently replaced according to the material and machining requirements of the workpieces, so that the conventional machining equipment has limitations.
The above is only for the purpose of assisting understanding of the technical aspects of the present invention, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention mainly aims to provide a laser processing method, laser processing equipment and a computer readable storage medium, aiming at achieving the effect of improving the richness of the processing function of the traditional processing machine tool.
In order to achieve the above object, the present invention provides a laser processing method including the steps of:
generating three-dimensional cutting path data;
determining the offset parameter of the workpiece to be processed according to the CCD positioning data;
correcting the three-dimensional cutting path data according to the offset parameter;
determining a light control parameter according to the three-dimensional cutting path;
and controlling the three-dimensional cutting path data to control the five-axis linkage motion platform to move, and controlling the laser module to emit light according to the light emission control parameters.
Optionally, before the step of generating three-dimensional cutting path data, the method further includes:
acquiring target three-dimensional graphic data;
the step of generating three-dimensional cutting path data comprises:
and generating the three-dimensional cutting path data according to the three-dimensional graphic data.
Optionally, the step of determining the light control parameter according to the three-dimensional cutting path includes:
generating interpolation motion data according to the three-dimensional cutting path data;
determining a three-dimensional space distance and an equidistant interpolation laser control command according to the interpolation motion data;
and determining the light emitting control parameters according to the three-dimensional space distance and the equidistant interpolation laser control command.
Optionally, the step of controlling the three-dimensional cutting path data to control the five-axis linkage motion platform to move and controlling the laser module to emit light according to the light emission control parameter includes:
the interpolation motion data are sent to a control card, so that the control card can control the five-axis linkage motion platform to move based on the interpolation motion data;
and controlling the laser module to emit light according to the light emitting control parameters.
Optionally, the interpolated motion data is linear interpolated motion data.
Optionally, before the step of determining the offset parameter of the workpiece to be processed according to the CCD positioning data, the method further includes:
acquiring mechanical errors and CCD positioning data;
the step of determining the offset parameter of the workpiece to be processed according to the CCD positioning data comprises the following steps:
and determining the offset parameter of the workpiece to be processed according to the mechanical error and the CCD positioning data.
Optionally, after the step of controlling the three-dimensional cutting path data to control the five-axis linkage motion platform to move and controlling the laser module to emit light according to the light emission control parameter, the method further includes:
and outputting the prompt information that the machining is finished after the workpiece to be machined is machined.
In addition, in order to achieve the above object, the present invention also provides a laser processing apparatus, which includes a memory, a processor, and a laser processing program stored on the memory and executable on the processor, wherein the laser processing program, when executed by the processor, implements the steps of the laser processing method as described above.
Further, to achieve the above object, the present invention also provides a computer-readable storage medium having stored thereon a laser processing program which, when executed by a processor, implements the steps of the laser processing method as described above.
According to the laser processing method, the laser processing equipment and the computer readable storage medium, three-dimensional cutting path data are generated firstly, then the offset parameter of a workpiece to be processed is determined according to CCD positioning data, the three-dimensional cutting path data are corrected according to the offset parameter, the light control parameter is determined according to the three-dimensional cutting path, finally the three-dimensional cutting path data are controlled to control the five-axis linkage motion platform to move, and the light emitting of a laser module is controlled according to the light emitting control parameter. Due to the integrated design of the three-dimensional laser cutting technology in the large-scale multi-axis linkage numerical control high-speed processing equipment, the laser cutting function is integrated in the traditional mechanical processing machine tool, the traditional cutting process is replaced by the advanced laser manufacturing process, the processing function of the traditional mechanical processing machine tool is effectively expanded, and the effect of improving the richness of the processing function of the traditional mechanical processing machine tool is achieved.
Drawings
Fig. 1 is a schematic terminal structure diagram of a hardware operating environment according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of an embodiment of a laser processing method of the present invention;
fig. 3 is a schematic flow chart of another embodiment of the laser processing method of the present invention.
The implementation, functional features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Along with the diversification of market demands, the machining integration of workpieces can be directly realized by using large-scale multi-shaft composite machining equipment, the utilization efficiency of a machine tool is improved, the workpiece clamping flow is simplified, and the machining efficiency and the machining precision are improved. However, when different workpieces are machined by the conventional multi-axis machining equipment, the machining tool bit needs to be frequently replaced according to the material and machining requirements of the workpieces, so that the conventional machining equipment has limitations.
In order to solve the above-mentioned defects of the existing machine tool, the embodiment of the invention provides a laser processing method, and the main solution thereof comprises the following steps:
generating three-dimensional cutting path data;
determining the offset parameter of the workpiece to be processed according to the CCD positioning data;
correcting the three-dimensional cutting path data according to the offset parameter;
determining a light control parameter according to the three-dimensional cutting path;
and controlling the three-dimensional cutting path data to control the five-axis linkage motion platform to move, and controlling the laser module to emit light according to the light emission control parameters.
Due to the integrated design of the three-dimensional laser cutting technology in the large-scale multi-axis linkage numerical control high-speed processing equipment, the laser cutting function is integrated in the traditional mechanical processing machine tool, the traditional cutting process is replaced by the advanced laser manufacturing process, the processing function of the traditional mechanical processing machine tool is effectively expanded, and the effect of improving the richness of the processing function of the traditional mechanical processing machine tool is achieved.
As shown in fig. 1, fig. 1 is a schematic terminal structure diagram of a hardware operating environment according to an embodiment of the present invention.
The terminal of the embodiment of the invention can be laser processing equipment.
As shown in fig. 1, the terminal may include: a processor 1001, e.g. a CPU, a network interface 1004, a user interface 1003, a memory 1005, a communication bus 1002. The communication bus 1002 is used to implement connection communication among these components. The user interface 1003 may include a Display screen (Display), an input unit such as a Keyboard (Keyboard), a mouse, etc., and the optional user interface 1003 may also include a standard wired interface, a wireless interface. The network interface 1004 may optionally include a standard wired interface, a wireless interface (e.g., WI-FI interface). The memory 1005 may be a high-speed RAM memory or a non-volatile memory such as a disk memory. The memory 1005 may alternatively be a storage device separate from the processor 1001.
Those skilled in the art will appreciate that the terminal structure shown in fig. 1 is not intended to be limiting and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
As shown in fig. 1, a memory 1005, which is a kind of computer storage medium, may include therein an operating system, a network communication module, a user interface module, and a laser machining program.
In the terminal shown in fig. 1, the network interface 1004 is mainly used for connecting a background server and communicating data with the background server; the processor 1001 may be configured to invoke a laser machining program stored in the memory 1005 and perform the following operations:
generating three-dimensional cutting path data;
determining the offset parameter of the workpiece to be processed according to the CCD positioning data;
correcting the three-dimensional cutting path data according to the offset parameter;
determining a light control parameter according to the three-dimensional cutting path;
and controlling the three-dimensional cutting path data to control the five-axis linkage motion platform to move, and controlling the laser module to emit light according to the light emission control parameters.
Further, the processor 1001 may call the laser processing program stored in the memory 1005, and further perform the following operations:
acquiring target three-dimensional graphic data;
the step of generating three-dimensional cutting path data comprises:
and generating the three-dimensional cutting path data according to the three-dimensional graphic data.
Further, the processor 1001 may call the laser processing program stored in the memory 1005, and further perform the following operations:
generating interpolation motion data according to the three-dimensional cutting path data;
determining a three-dimensional space distance and an equidistant interpolation laser control command according to the interpolation motion data;
and determining the light emitting control parameters according to the three-dimensional space distance and the equidistant interpolation laser control command.
Further, the processor 1001 may call the laser processing program stored in the memory 1005, and further perform the following operations:
the interpolation motion data are sent to a control card, so that the control card can control the five-axis linkage motion platform to move based on the interpolation motion data;
and controlling the laser module to emit light according to the light emitting control parameters.
Further, the processor 1001 may call the laser processing program stored in the memory 1005, and also perform the following operations:
acquiring mechanical errors and CCD positioning data;
the step of determining the offset parameter of the workpiece to be processed according to the CCD positioning data comprises the following steps:
and determining the offset parameter of the workpiece to be processed according to the mechanical error and the CCD positioning data.
Further, the processor 1001 may call the laser processing program stored in the memory 1005, and further perform the following operations:
and outputting the prompt information that the machining is finished after the workpiece to be machined is machined.
Referring to fig. 2, in an embodiment of the laser processing method of the present invention, the laser processing method includes the steps of:
s10, generating three-dimensional cutting path data;
s20, determining an offset parameter of the workpiece to be processed according to the CCD positioning data;
s30, correcting the three-dimensional cutting path data according to the offset parameter;
s40, determining a light control parameter according to the three-dimensional cutting path;
and S50, controlling the three-dimensional cutting path data to control the five-axis linkage motion platform to move, and controlling the laser module to emit light according to the light emission control parameters.
Along with the diversification of market demands, the machining integration of workpieces can be directly realized by using large-scale multi-shaft composite machining equipment, the utilization efficiency of a machine tool is improved, the workpiece clamping flow is simplified, and the machining efficiency and the machining precision are improved. However, when different workpieces are machined by the conventional multi-axis machining equipment, the machining tool bit needs to be frequently replaced according to the material and machining requirements of the workpieces, so that the conventional machining equipment has limitations.
The application provides a laser processing device and a laser processing method, and the laser cutting function is integrated in the traditional mechanical processing machine tool through the integrated design of a three-dimensional laser cutting technology in large-scale multi-axis linkage numerical control high-speed processing equipment, and the traditional cutting process is replaced by an advanced laser manufacturing process, so that the processing function of the traditional mechanical processing machine tool is effectively expanded.
In this embodiment, a three-dimensional pattern of a workpiece to be processed is rendered by software capable of rendering a three-dimensional pattern, such as CAD (Computer Aided Design) software, to form three-dimensional pattern data. Then, the three-dimensional graphic data is converted into control data executable by the processing equipment, that is, the three-dimensional cutting path data, based on the three-dimensional graphic data generated in advance by a CAM (computer Aided Manufacturing) system.
The CAM system is configured to convert a design result (CAD data) into a control command and/or data that can be recognized by a processing machine. The CAM system may be pre-loaded in the laser processing apparatus so that the laser processing apparatus may directly produce the three-dimensional cutting path data according to CAD data input by a user.
The laser processing equipment is also provided with an automatic feeding system, so that the laser processing equipment can automatically move a workpiece to be processed (namely, a material to be processed) to a processing station of the laser processing equipment. Or, as an implementation manner, the material to be processed can be added to the processing station of the laser processing equipment in a manual feeding manner. The machining station is arranged on the five-axis linkage motion platform, so that the five-axis linkage motion platform can drive the workpiece to be machined to move together when moving.
The five-axis linkage motion platform is provided with an x axis, a y axis and a z axis which can move in the direction perpendicular to each other in pairs. And the rotating shaft and the swing shaft can rotate 360 degrees, and the swing shaft can swing within a designed angle.
Further, after the workpiece to be machined is added into the machining station, a difference exists between a coordinate corresponding to the workpiece and a standard coordinate of the laser machining equipment due to errors of workpiece clamping errors, machine tool gaps, shaft included angles and the like. Therefore, the work piece machining path obtained by the CAM system cannot be used directly, and data compensation is required for the machining path.
Wherein the mechanical error can be measured. In addition, the laser processing apparatus is also provided with a CCD (charge coupled device) positioning system. CCD positioning data corresponding to a currently processed workpiece in a station to be processed can be acquired through a laser processing device through a CCD positioning system. And then positioning the CCD data. And then determining the offset parameter of the workpiece to be processed according to the mechanical error and the CCD positioning data. Wherein the offset parameters may include an offset value and a deflection angle.
After the offset parameter is currently determined, the three-dimensional cutting path data directly obtained from the CAD data can be corrected according to the offset parameter.
As an alternative implementation manner, an algorithm for generating the three-dimensional cutting path data may be generated according to a CAM system, and a coordinate list of the workpiece to be processed may be obtained by reverse extrapolation. And then, determining the actual offset angle and the offset value of each coordinate direction corresponding to the workpiece to be processed according to the offset parameters, and then correcting the coordinate value corresponding to the coordinate list of the workpiece to be processed according to the actual offset angle and the offset value to obtain the target coordinate parameters. And generating the corrected three-dimensional cutting path data according to the target coordinate parameters.
Further, the light control parameter can be determined according to the three-dimensional cutting path.
Specifically, interpolation motion data may be generated according to the three-dimensional cutting path data, then a three-dimensional spatial distance and an equidistant interpolation laser control command may be determined according to the interpolation motion data, and the light extraction control parameter may be determined according to the three-dimensional spatial distance and the equidistant interpolation laser control command.
For example, when generating interpolation motion data from the three-dimensional cutting path data, the path code list may be read first, then the maximum distance between five axes of two codes is calculated, and then the number of split pieces is calculated, and interpolation between path codes is performed (an increment of each axis is calculated).
Illustratively, when the light extraction control parameters are determined according to the three-dimensional space distance and the equidistant interpolation laser control command, the path code list may be read, and then the work coordinate list may be obtained by performing a back-stepping according to a path generation algorithm. And further calculating the space distance between the two codes, namely the three-dimensional space distance, and finally inserting the control light-emitting code during interpolation according to an interpolation data generation method.
After the three-dimensional cutting path data and the light emitting control parameters are determined currently, the three-dimensional cutting path data can be controlled to control the five-axis linkage motion platform to move, and the light emitting of the laser module is controlled according to the light emitting control parameters, so that a workpiece is machined through laser. Thereby completing the laser processing of the three-dimensional pattern.
Specifically, interpolation motion data are generated according to the three-dimensional cutting path data, the interpolation motion data are sent to a control card, the control card controls the five-axis linkage motion platform to move based on the interpolation motion data, and light emitting of a laser module is controlled according to the light emitting control parameters.
In the technical scheme disclosed in this embodiment, three-dimensional cutting path data is generated first, then an offset parameter of a workpiece to be processed is determined according to CCD positioning data, the three-dimensional cutting path data is corrected according to the offset parameter, an optical control parameter is determined according to the three-dimensional cutting path, and finally the three-dimensional cutting path data is controlled to control the five-axis linkage motion platform to move, and light emission of the laser module is controlled according to the light emission control parameter. Due to the integrated design of the three-dimensional laser cutting technology in the large-scale multi-axis linkage numerical control high-speed processing equipment, the laser cutting function is integrated in the traditional mechanical processing machine tool, the traditional cutting process is replaced by the advanced laser manufacturing process, the processing function of the traditional mechanical processing machine tool is effectively expanded, and the effect of improving the richness of the processing function of the traditional mechanical processing machine tool is achieved.
Referring to fig. 3, based on the foregoing embodiment, in another embodiment, after the foregoing step S50, the method further includes:
and S60, outputting the prompt information that the machining is finished after the machining of the workpiece to be machined is finished.
In this embodiment, whether the processing progress of the workpiece to be processed is completed may be determined according to the execution progress of the control data. And after the workpiece to be processed is determined to be processed, outputting prompt information that the processing is finished. Wherein, the output mode of the prompt message that the processing is finished comprises at least one of the following modes:
controlling a preset indicator lamp to be on or flash normally;
controlling a preset indicator lamp to change the lighting color;
sending a prompt message that the processing is finished to a target terminal so as to display the prompt message that the processing is finished through the target terminal;
displaying prompt information that the processing is finished in a display panel of the laser processing equipment;
outputting a voice prompt of the prompt information of which the processing is finished;
and controlling the buzzer to sound at a preset frequency.
In the technical scheme disclosed in this embodiment, after the workpiece to be machined is machined, the prompt information that the machining is finished is output. This achieves the effect of preventing the user from operating erroneously or repeatedly.
In addition, an embodiment of the present invention further provides a laser processing apparatus, where the laser processing apparatus includes a memory, a processor, and a laser processing program stored in the memory and executable on the processor, and when the laser processing program is executed by the processor, the steps of the laser processing method according to the above embodiments are implemented.
Furthermore, an embodiment of the present invention further provides a computer-readable storage medium, on which a laser processing program is stored, and the laser processing program, when executed by a processor, implements the steps of the laser processing method according to the above embodiments.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of other like elements in a process, method, article, or system comprising the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the description of the foregoing embodiments, it is clear to those skilled in the art that the method of the foregoing embodiments may be implemented by software plus a necessary general hardware platform, and certainly may also be implemented by hardware, but in many cases, the former is a better implementation. Based on this understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) as described above and includes instructions for causing a laser processing apparatus to execute the methods according to the embodiments of the present invention.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. A laser processing method is characterized in that the laser processing method is applied to laser processing equipment, the laser processing equipment is provided with a five-axis linkage motion platform, and the laser processing method comprises the following steps:
acquiring target three-dimensional graphic data;
generating three-dimensional cutting path data according to the three-dimensional graphic data through a CAM system, wherein the CAM system is loaded in the laser processing equipment;
determining an offset parameter of a workpiece to be processed according to the mechanical error and the CCD positioning data, wherein the offset parameter comprises an offset value and a deflection angle;
generating an algorithm of the three-dimensional cutting path data according to the CAM system, reversely deducing to obtain a coordinate list of the workpiece to be processed, correcting a coordinate value corresponding to the coordinate list according to the deviation value and the deflection angle to obtain a target coordinate parameter, and generating the corrected three-dimensional cutting path data according to the target coordinate parameter;
reading a code list of the three-dimensional cutting path data;
determining the maximum distance between five axes of every two codes in the code list;
calculating the number of split strips according to the maximum distance, and generating interpolation motion data;
reading the code list, and performing reverse-deducing according to the algorithm to obtain the coordinate list of the workpiece to be processed;
determining the three-dimensional space distance between the codes according to the coordinate list;
determining a light control parameter according to the three-dimensional space distance and the equidistant interpolation laser control command;
and controlling the three-dimensional cutting path data to control the five-axis linkage motion platform to move, and controlling the laser module to emit light according to the light emission control parameters.
2. The laser processing method of claim 1, wherein the step of controlling the three-dimensional cutting path data to control the five-axis linkage motion platform to move and controlling the laser module to emit light according to the light emission control parameters comprises:
the interpolation motion data are sent to a control card, so that the control card can control the five-axis linkage motion platform to move based on the interpolation motion data;
and controlling the laser module to emit light according to the light emitting control parameters.
3. The laser processing method according to claim 1, wherein the interpolation motion data is linear interpolation motion data.
4. The laser processing method of claim 1, wherein the step of determining the offset parameter of the workpiece to be processed based on the mechanical error and the CCD positioning data is preceded by the step of:
acquiring mechanical errors and CCD positioning data;
the step of determining the offset parameter of the workpiece to be processed according to the CCD positioning data comprises the following steps:
and determining the offset parameter of the workpiece to be processed according to the mechanical error and the CCD positioning data.
5. The laser processing method of claim 1, wherein after the step of controlling the three-dimensional cutting path data to control the five-axis linkage motion platform to move and controlling the laser module to emit light according to the light emission control parameters, the method further comprises:
and outputting the prompt information of the finished processing after the processing of the workpiece to be processed is finished.
6. A laser machining apparatus, characterized by comprising: memory, a processor and a laser machining program stored on the memory and executable on the processor, the laser machining program, when executed by the processor, implementing the steps of the laser machining method as claimed in any one of claims 1 to 5.
7. A computer-readable storage medium, on which a laser machining program is stored, which, when executed by a processor, implements the steps of the laser machining method according to any one of claims 1 to 5.
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| CN114054879A (en) * | 2021-10-20 | 2022-02-18 | 深圳泰德激光技术股份有限公司 | Molten tin welding method, three-dimensional five-axis laser processing device and readable storage medium |
| CN114083111A (en) * | 2021-10-20 | 2022-02-25 | 深圳泰德激光技术股份有限公司 | Laser processing method, terminal device, and computer-readable storage medium |
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| JP2017194942A (en) * | 2016-04-15 | 2017-10-26 | マシン・ツール・テクノロジーズ・リサーチ・ファウンデーションＭａｃｈｉｎｅ Ｔｏｏｌ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｒｅｓｅａｒｃｈ Ｆｏｕｎｄａｔｉｏｎ | Control data generation method, information processing apparatus, machine tool, and program |
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