CN112505855B - Optical module - Google Patents
Optical module Download PDFInfo
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- CN112505855B CN112505855B CN202011507499.7A CN202011507499A CN112505855B CN 112505855 B CN112505855 B CN 112505855B CN 202011507499 A CN202011507499 A CN 202011507499A CN 112505855 B CN112505855 B CN 112505855B
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- 230000003287 optical effect Effects 0.000 claims abstract description 118
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000000919 ceramic Substances 0.000 claims abstract description 32
- 230000008054 signal transmission Effects 0.000 claims abstract description 7
- 239000011324 bead Substances 0.000 claims description 50
- 239000003990 capacitor Substances 0.000 claims description 37
- 230000000903 blocking effect Effects 0.000 claims description 24
- 238000002955 isolation Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 19
- 239000013307 optical fiber Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 15
- 238000004891 communication Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 7
- 230000002457 bidirectional effect Effects 0.000 description 5
- 230000010365 information processing Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The application provides an optical module which comprises a circuit board and a light emitting device, wherein the light emitting device comprises a ceramic substrate, an EML laser component and a plurality of channels, one channel comprises a driving component, a driving multiplexing bonding pad, a driving power supply bonding pad and an EML multiplexing bonding pad, wherein the driving multiplexing bonding pad is arranged near a driving chip to ensure the normal operation of the driving chip, the main function of the driving multiplexing bonding pad is to provide a first voltage for the driving chip and realize the transmission of signals to the EML laser chip, the main function of the driving power supply bonding pad is to provide a second voltage for the driving chip, and the main function of the EML multiplexing bonding pad is to provide the voltage for the EML laser chip and ensure the EML laser chip to receive the signals from the driving chip. Through the driving peripheral circuit, the EML peripheral circuit and the like which can be distributed on the ceramic substrate in multiple channels, the normal operation of the driving chip and the EML laser chip is ensured.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical module.
Background
The EML laser comprises an electroabsorption modulation area and a light emitting area, the electroabsorption modulation area and the light emitting area are respectively realized through an EA modulator and a DFB laser, a modulator driver in the existing optical module is usually arranged on a circuit board and then connected with a packaging shell through a flexible circuit board, so that the distance between the modulator driver and the EA modulator is long, and the channel link loss is increased; in addition, the peripheral circuits of the modulator driver and the peripheral circuits of the EA modulator are required to be placed near the modulator driver, and under the premise, a large area reserved on the circuit board for placing the peripheral circuits of the modulator driver and the peripheral circuits of the EA modulator can be caused for the multichannel optical module, so that the layout of the circuit board is more tension and the available space is smaller. Therefore, a solution is needed to implement the layout of peripheral circuit devices of a multi-channel optical module.
Disclosure of Invention
The application provides an optical module, which realizes the layout of devices such as a driving peripheral circuit, an EML peripheral circuit and the like of a multichannel optical module.
An optical module, comprising:
A circuit board;
the light emitting device is electrically connected with the circuit board and is used for converting the electric signal into an optical signal;
The light emitting device includes:
a ceramic substrate for carrying the device;
an EML laser assembly including an EML laser chip;
A plurality of channels carried by the ceramic substrate, wherein one channel comprises:
the driving assembly is arranged on the surface of the ceramic substrate and comprises a driving chip;
the driving multiplexing pad is arranged on the surface of the ceramic substrate and is used for electrically connecting the signal pad of the driving chip with one end of a first magnetic bead, and the other end of the first magnetic bead is connected with a first voltage;
the magnetic bead is also used for electrically connecting one end of the blocking capacitor with one end of the first magnetic bead;
The EML multiplexing pad is arranged on the surface of the ceramic substrate and is used for electrically connecting the other end of the blocking capacitor with the other end of the second magnetic bead;
and the device is also used for electrically connecting the EML laser component with the other end of the second magnetic bead, and one end of the second magnetic bead is connected with the power supply voltage of the EML laser chip.
The beneficial effects are that: the application provides an optical module, which comprises a circuit board and a light emitting device, wherein the light emitting device comprises a ceramic substrate, a plurality of channels are borne on the surface of the ceramic substrate, shielding and isolation are carried out between adjacent channels, each channel comprises a driving component, an EML laser component, a driving multiplexing bonding pad, a driving power supply bonding pad and an EML multiplexing bonding pad, the driving component comprises a driving chip and a first substrate, the EML laser component comprises an EML laser chip and a second substrate, the driving multiplexing bonding pad is arranged near the driving chip to ensure the normal operation of the driving chip, the main function of the driving multiplexing bonding pad is to provide a first voltage for the driving chip and realize signal transmission for the EML laser chip, the main function of the driving power supply bonding pad is to provide a second voltage for the driving chip, and the main function of the EML multiplexing bonding pad is to provide voltage for the EML laser chip and ensure the EML laser chip to receive signals from the driving chip. The specific connection mode is as follows: one end of the driving chip is electrically connected with the driving multiplexing bonding pad, the driving multiplexing bonding pad is electrically connected with the first magnetic bead, the first magnetic bead is electrically connected with a power supply pin on the circuit board to provide a first voltage for the driving chip, one end of the driving chip is electrically connected with the driving multiplexing bonding pad, the driving multiplexing bonding pad is electrically connected with the blocking capacitor, and the blocking capacitor is electrically connected with the EML multiplexing bonding pad to realize communication between the driving chip and the EML laser chip; one end of the driving chip is electrically connected with one end of the driving power supply bonding pad, the other end of the driving power supply bonding pad is electrically connected with one end of the filter capacitor, and the other end of the filter capacitor is electrically connected with a power supply pin on the circuit board so as to input a second voltage to the driving chip; the EML multiplexing pad is connected with the second magnetic bead to supply voltage to the EML laser chip and connected with the blocking capacitor to receive signals from the driving chip. Through the process, a multi-channel driving peripheral circuit, an EML peripheral circuit and the like can be arranged on the ceramic substrate, and normal operation of the driving chip and the EML laser chip is ensured.
Drawings
In order to more clearly illustrate the technical solution of the present application, the drawings that are needed in the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic diagram of the connection relationship of an optical communication terminal;
fig. 2 is a schematic diagram of an optical network unit structure;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;
fig. 4 is an exploded view of an optical module according to an embodiment of the present application;
FIG. 5 is a block diagram of a circuit board according to an embodiment of the present application;
FIG. 6 is an exploded view of a circuit board according to an embodiment of the application;
Fig. 7 is a schematic view of an appearance structure of a light emitting device according to an embodiment of the present application;
Fig. 8 is an exploded view of a light emitting device according to an embodiment of the present application;
fig. 9 is a schematic connection diagram of internal structures of a light emitting device according to an embodiment of the present application;
Fig. 10 is a partial schematic view of internal structures of a light emitting device according to an embodiment of the present application;
fig. 11 is an equivalent circuit schematic diagram of connection of components in a light emitting device according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
One of the key links of optical fiber communication is the mutual conversion of optical signals and electric signals. The optical fiber communication uses the optical signal carrying information to transmit in the information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by utilizing the passive transmission characteristic of the light in the optical fiber/optical waveguide; in order to establish an information connection between an information transmission device such as an optical fiber and an information processing device such as a computer, it is necessary to perform interconversion between an electric signal and an optical signal.
The optical module realizes the function of the mutual conversion of the optical signal and the electric signal in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electric signal is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the golden finger has become the mainstream connection mode of the optical module industry, and on the basis of the main connection mode, the definition of pins on the golden finger forms various industry protocols/specifications.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.
One end of the optical fiber 101 is connected with a remote server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.
The optical port of the optical module 200 is externally connected to the optical fiber 101, and bidirectional optical signal connection is established with the optical fiber 101; the electrical port of the optical module 200 is externally connected into the optical network terminal 100, and bidirectional electrical signal connection is established with the optical network terminal 100; the optical module is internally provided with an optical module, and the optical module is internally provided with an optical signal and an electric signal, so that information connection between the optical fiber and the optical network terminal is established. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.
The optical network terminal is provided with an optical module interface 102, which is used for accessing the optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104 which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable, transmits the signal from the network cable to the optical module, and monitors the operation of the optical module as an upper computer of the optical module.
So far, the remote server establishes a bidirectional signal transmission channel with the local information processing equipment through the optical fiber, the optical module, the optical network terminal and the network cable.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, which provides data signals for the optical module and receives data signals from the optical module, and the common optical module upper computer also includes an optical line terminal and the like.
Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 includes a circuit board 105, and a cage 106 is provided on a surface of the circuit board 105; an electrical connector is arranged in the cage 106 and is used for accessing an optical module electrical port such as a golden finger; the cage 106 is provided with a radiator 107, and the radiator 107 has a convex portion such as a fin that increases a heat radiation area.
The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical connector inside the cage 106 is inserted into an electrical port of the optical module, and the optical port of the optical module is connected to the optical fiber 101.
The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged inside the cage; the light module is inserted into the cage, the light module is fixed by the cage, and the heat generated by the light module is conducted to the cage 106 and then diffused through the heat sink 107 on the cage.
Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application, and fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present application. As shown in fig. 3 and 4, the optical module 200 provided in the embodiment of the application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, and an optical transceiver assembly 400.
The upper case 201 is covered on the lower case 202 to form a packing cavity having two openings; the outer contour of the wrapping cavity generally presents a square shape. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers the two side plates of the upper shell to form a wrapping cavity; the upper case may further include two sidewalls disposed at both sides of the cover plate and perpendicular to the cover plate, and the two sidewalls are combined with the two side plates to realize the covering of the upper case 201 on the lower case 202.
The two openings can be two ends openings (204, 205) in the same direction or two openings in different directions; one opening is an electric port 204, and a golden finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect with the optical transceiver assembly 400 inside the optical module; the circuit board 300, the optical transceiver assembly 400, and other optoelectronic devices are located in the encapsulation cavity.
The upper shell and the lower shell are combined to be assembled, so that devices such as the circuit board 300, the optical transceiver assembly 400 and the like can be conveniently installed in the shells, and the upper shell and the lower shell form an encapsulation protection shell of the outermost layer of the module; the upper shell and the lower shell are made of metal materials, electromagnetic shielding and heat dissipation are realized, the shell of the optical module is not made into an integral part, and therefore, when devices such as a circuit board and the like are assembled, the positioning part, the heat dissipation and the electromagnetic shielding part cannot be installed, and the production automation is not facilitated.
The unlocking component 203 is located on the outer wall of the lower housing 202, and is used for realizing or releasing the fixed connection between the optical module and the host computer.
The unlocking part 203 is provided with a clamping part matched with the upper computer cage; pulling the end of the unlocking member can relatively move the unlocking member on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; the unlocking part is pulled, and the clamping part of the unlocking part moves along with the unlocking part, so that the connection relation between the clamping part and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be pulled out of the cage of the upper computer.
The circuit board 300 is provided with circuit wiring, electronic components (such as capacitor, resistor, triode, MOS tube) and chips (such as MCU, laser driving chip, limiting amplifying chip, clock data recovery CDR, power management chip, data processing chip DSP), etc.
The circuit board 300 connects the electrical devices in the optical module together according to a circuit design through circuit wiring, so as to realize electrical functions such as power supply, electrical signal transmission, grounding and the like.
The circuit board is generally a hard circuit board, and the hard circuit board can also realize bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear chips; when the optical transceiver component is positioned on the circuit board, the hard circuit board can provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, specifically, a metal pin/golden finger is formed on the end surface of one side of the hard circuit board and is used for being connected with the electric connector; these are all inconvenient to implement with flexible circuit boards.
A flexible circuit board is also used in part of the optical modules and is used as a supplement of the hard circuit board; the flexible circuit board is generally used in cooperation with the hard circuit board, for example, the hard circuit board and the optical transceiver assembly can be connected by using the flexible circuit board.
The optical transceiver component comprises a light emitting device and an optical receiving component, which are respectively used for realizing the emission of optical signals and the reception of the optical signals. Fig. 5 is a schematic structural diagram of a circuit board 300 according to an embodiment of the present application, and fig. 6 is an exploded structural diagram of the circuit board 300 according to an embodiment of the present application. As shown in fig. 5 and 6, the optical module 200 includes at least two light emitting devices and a light receiving component 402, the at least two light emitting devices are electrically connected with the circuit board 300 through a first flexible board, the light receiving component 402 is electrically connected with the circuit board 300 through a second flexible board 500, and the light emitting devices and the light receiving component 402 are stacked, instead of the light emitting devices and the light receiving component being disposed on the surface of the circuit board 300, so that the space requirement of the circuit board 300 is not increased, thereby reducing the volume size of the optical module and realizing miniaturized package of the optical module.
In this example, the at least two light emitting devices may include a first light emitting device 401 and a second light emitting device 403, the first light emitting device 401 is electrically connected to the circuit board 300 through the first flexible board 700, and the second light emitting device 403 is electrically connected to the circuit board 300 through the third flexible board 800, so as to realize a layout of multiple light emitting chips.
The light emitting device generally comprises a housing, a light emitter and a lens assembly, the light emitter being fixed inside the housing for emitting a light beam; the lens component is positioned on the luminous light path of the light emitter and fixed in the shell, and is used for changing the transmission direction of the light beam so that the laser beam enters the external optical fiber. That is, light from the light emitter is reflected by the lens assembly and enters the optical fiber.
It should be noted that, the above description is given by taking the dual transmitting structure and the dual receiving structure as examples, and the single transmitting structure and the single receiving structure are also within the protection scope of the present application.
Fig. 7 is a schematic view of an appearance structure of a light emitting device according to an embodiment of the present application; fig. 8 is an exploded view of a light emitting device according to an embodiment of the present application; as shown in fig. 7 and 8, the light emitting device 401 provided by the application includes a cover plate 401a and a cavity 401b, the cover plate 401a and the cavity 401b are connected in a covering manner, and the cavity 401b is internally provided with a ceramic substrate 601, a driving chip 602, an EML laser chip 603 and other structures.
Fig. 9 is a schematic connection diagram of internal structures of a light emitting device according to an embodiment of the present application; taking an integrated eight-channel example in fig. 9, the light emitting device includes a ceramic substrate, an EML laser component, and a plurality of channels, where one channel includes a driving component, a driving multiplexing pad, and an EML multiplexing pad, and each structure is described in detail below with reference to fig. 9 and 10.
Fig. 9 is a schematic connection diagram of internal structures of a light emitting device according to an embodiment of the present application; fig. 10 is a partial schematic view of internal structures of a light emitting device according to an embodiment of the present application; in the embodiment of the application, a driving component is arranged on the surface of a ceramic substrate 601, the driving component comprises a driving chip 602 and a first substrate, a positive electrode connecting area and a negative electrode connecting area are arranged on the first substrate, the positive electrode of the driving chip 602 is electrically connected with the positive electrode connecting area, and the negative electrode is electrically connected with the negative electrode connecting area. A drive multiplexing pad 6042 and a drive power supply pad 6044 are arranged near the drive chip 602, wherein the drive multiplexing pad 6042 is used for electrically connecting a signal pad of the drive chip 602 with one end of a first magnetic bead 606, and the other end of the first magnetic bead 606 is connected with a first voltage; and also serves to electrically connect one end of the blocking capacitor 608 with one end of the first magnetic bead 606.
The driving multiplexing pad 6042 mainly integrates power supply and signal transmission functions to the EML laser chip 603, the driving multiplexing pad 6042 can provide a first voltage for the driving chip 602, the driving power supply pad 6044 can provide a second voltage for the driving chip 602, and the first voltage and the second voltage are different, and can provide different voltages for the driving chip 602 to ensure normal operation of the driving chip. Specifically, the positive electrode of the driving chip 602 is electrically connected to the positive electrode connection region on the first substrate, the positive electrode connection region is wire-bonded to the driving multiplexing pad 6042, the driving multiplexing pad 6042 is electrically connected to the first magnetic bead 606, and the first magnetic bead 606 is electrically connected to the power supply pin on the circuit board 300, so that the voltage on the power supply pin is transmitted to the driving chip 602 through the first magnetic bead and the driving multiplexing pad 6042 to provide the first voltage for the driving chip 602; the positive electrode of the driving chip 602 is electrically connected with the positive electrode connection area on the first substrate, the positive electrode connection area is in wire-bonding connection with the driving multiplexing bonding pad 6042, the driving multiplexing bonding pad 6042 is electrically connected with the filter capacitor 609, and the filter capacitor 609 is electrically connected with the power supply pin on the circuit board 300, so that the voltage on the power supply pin is transmitted to the driving chip 602 through the filter capacitor 609 and the driving multiplexing bonding pad 6042 to provide a second voltage for the driving chip 602; wherein the voltage values of the first voltage and the second voltage are different.
The surface of the ceramic substrate 601 is further provided with an EML laser component, the EML laser component comprises an EML laser chip 603 and a second substrate, the second substrate is also provided with a positive electrode connection area and a negative electrode connection area, the positive electrode of the EML laser chip 603 is electrically connected with the positive electrode connection area, and the negative electrode is electrically connected with the negative electrode connection area. An EML multiplexing pad 6052 is provided near the EML laser chip 603, and the EML multiplexing pad 6052 is used to electrically connect the other end of the blocking capacitor 608 and the other end of the second magnetic bead 607; and is further configured to electrically connect the EML laser assembly to another end of the second magnetic bead 607, where one end of the second magnetic bead 607 is connected to the power supply voltage of the EML laser chip 603.
The EML multiplexing pad 6052 mainly integrates two functions of supplying voltage to the EML laser chip 603 and receiving a driving signal from the driving chip 602. Specifically, the positive electrode of the EML laser chip 603 is electrically connected to the positive electrode connection area on the second substrate, the positive electrode connection area is wire-bonded to the EML multiplexing pad 6052, the EML multiplexing pad 6052 is electrically connected to the second magnetic bead 607, and the second magnetic bead 607 is electrically connected to the power supply pin on the circuit board 300, so that the voltage on the power supply pin is transmitted to the EML laser chip 603 through the two magnetic beads 607 and the EML multiplexing pad 6052 to provide the voltage for the EML laser chip 603.
The positive pole of the driving chip 602 is electrically connected with a positive pole connection area on the first substrate, the positive pole connection area is in wire bonding connection with a driving multiplexing pad 6042, the driving multiplexing pad 6042 is electrically connected with one end of a blocking capacitor 608, the other end of the blocking capacitor 608 is electrically connected with an EML multiplexing pad 6052, the EML multiplexing pad 6052 is electrically connected with a positive pole connection area of the second substrate, and the positive pole connection area of the second substrate is electrically connected with the positive pole of the EML laser chip 603, so that driving signals generated by the driving chip 602 are transmitted to the EML laser chip 603, and the EML laser chip 603 works normally according to the driving signals.
Taking the left-right direction in fig. 7 as an example, the driving multiplexing pad 6042 firstly makes the driving chip 602 transmit the driving signal to the right, and secondly provides the voltage to the left for the driving chip 602, and the two branches work in opposite directions and in parallel.
The EML multiplexing pad 6052 receives signals from the driving chip 602, and supplies voltages to the right to the EML laser chip 603, and the two branches operate in parallel.
In the embodiment of the present application, one end of the filter capacitor 609 is electrically connected to the power supply pin on the circuit board 300, and the other end is grounded.
In the embodiment of the present application, one end of the first magnetic bead 606 is electrically connected to the power supply pin on the circuit board 300, the other end is electrically connected to the blocking capacitor 608, one end of the second magnetic bead 607 is electrically connected to the power supply pin on the circuit board 300, and the other end is electrically connected to the blocking capacitor 608. Taking the left-right direction in fig. 7 as an example, the driving chip 602 is located at the left side, the EML laser chip 603 is located at the right side, the direction of the first magnetic bead transmission voltage is to the left to provide voltage for the driving chip 602, and the direction of the second magnetic bead transmission voltage is to the right to provide voltage for the EML laser chip 603, in order to avoid the interference of mutual current, the first magnetic bead 606 and the second magnetic bead 607 are electrically connected with the blocking capacitor 608, and the blocking capacitor 608 acts as blocking direct current to avoid the interference of the current flowing through the first magnetic bead 606 and the second magnetic bead 607.
In the embodiment of the present application, the surface of the ceramic substrate 601 is further provided with a first grounding pad 6041, which is disposed adjacent to the driving chip 602 and is used for electrically connecting the negative electrode of the driving chip 602 with the ceramic substrate 601 to realize grounding of the negative electrode of the driving chip 602; specifically, the negative electrode of the driving chip 602 is electrically connected to the negative electrode connection region of the first substrate, the negative electrode connection region of the first substrate is wire-bonded to the first ground pad 6041, the first ground pad 6041 is wire-bonded to the ceramic substrate 601, and the ceramic substrate 601 is electrically connected to the ground pin on the circuit board 300, so as to realize the negative electrode grounding of the driving chip 602.
A second ground pad 6043 is disposed adjacent to the driver chip 602 for electrically connecting the cathode of the driver chip 602 and the cathode of the EML laser chip to achieve isolation between the channels. Specifically, the cathode wire of the driving chip 602 is connected to the second ground pad 6043, the second ground pad 6043 is electrically connected to the fourth ground pad 6053, the fourth ground pad 6053 is connected to the cathode connection region of the second substrate, and the cathode connection region of the second substrate is electrically connected to the EML laser chip 603, so that the cathode of the driving chip 602 is electrically connected to the EML laser chip 603 to realize isolation between channels.
A third grounding pad 6051 is disposed adjacent to the EML laser chip 603 for electrically connecting the negative electrode of the EML laser chip 603 and the ceramic substrate to be grounded with the negative electrode of the EML laser chip; specifically, the negative electrode of the EML laser chip 603 is electrically connected to the negative electrode connection region of the second substrate, the negative electrode connection region of the second substrate is wire-bonded to the third ground pad 6051, the third ground pad 6051 is wire-bonded to the ceramic substrate 601, and the ceramic substrate 601 is electrically connected to the ground pin on the circuit board 300 to realize the negative electrode grounding of the driving chip 602.
Fig. 11 is a schematic diagram of an equivalent circuit for connecting components in a light emitting device according to an embodiment of the present application, as shown in fig. 11, a peripheral circuit of a driving chip 602 includes a first branch 6061 connected in series to a power line and a second branch 6062 connected in parallel to the power line, where the first branch includes a first magnetic bead 607, and provides a first voltage to the driving chip 602 through the first magnetic bead 607; the peripheral circuit of the EML laser chip 603 includes a third branch 6071 connected in series to the power line and a fourth branch 6072 connected in parallel to the power line, the third branch 6071 having a second magnetic bead 608, and the voltage is supplied to the EML laser chip 603 via the second magnetic bead 608. The peripheral circuit of the driving chip 602 and the peripheral circuit of the EML laser chip 603 are isolated from each other by the blocking capacitor 608, so that the voltage between the peripheral circuit of the driving chip 602 and the peripheral circuit of the EML laser chip 603 is not interfered with each other.
The application provides an optical module, which comprises a circuit board and a light emitting device, wherein the light emitting device comprises a ceramic substrate, a plurality of channels are carried on the surface of the ceramic substrate, shielding and isolation are carried out between adjacent channels, each channel comprises a driving chip, an EML laser driving chip, a driving multiplexing bonding pad, a driving power supply bonding pad and an EML multiplexing bonding pad, wherein the driving multiplexing bonding pad is arranged near the driving chip to ensure the normal operation of the driving chip, the main function of the driving multiplexing bonding pad is to provide a first voltage for the driving chip and realize signal transmission to the EML laser chip, the main function of the driving power supply bonding pad is to provide a second voltage for the driving chip, and the main function of the EML multiplexing bonding pad is to provide voltage for the EML laser chip and ensure the EML laser chip to receive signals from the driving chip. The specific connection mode is as follows: one end of the driving chip is electrically connected with the driving multiplexing bonding pad, the driving multiplexing bonding pad is electrically connected with the first magnetic bead, the first magnetic bead is electrically connected with a power supply pin on the circuit board to provide a first voltage for the driving chip, one end of the driving chip is electrically connected with the driving multiplexing bonding pad, the driving multiplexing bonding pad is electrically connected with the blocking capacitor, and the blocking capacitor is electrically connected with the EML multiplexing bonding pad to realize communication between the driving chip and the EML laser chip; one end of the driving chip is electrically connected with one end of the driving power supply bonding pad, the other end of the driving power supply bonding pad is electrically connected with one end of the filter capacitor, and the other end of the filter capacitor is electrically connected with a power supply pin on the circuit board so as to input a second voltage to the driving chip; the EML multiplexing pad is connected with the second magnetic bead to supply voltage to the EML laser chip and connected with the blocking capacitor to receive signals from the driving chip. Through the process, a multi-channel driving peripheral circuit, an EML peripheral circuit and the like can be arranged on the ceramic substrate, and normal operation of the driving chip and the EML laser chip is ensured.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. An optical module, comprising:
A circuit board;
the light emitting device is electrically connected with the circuit board and is used for converting the electric signal into an optical signal;
The light emitting device includes:
a ceramic substrate for carrying the device;
an EML laser assembly including an EML laser chip;
A plurality of channels carried by the ceramic substrate, wherein one channel comprises:
the driving assembly is arranged on the surface of the ceramic substrate and comprises a driving chip;
the driving multiplexing pad is arranged on the surface of the ceramic substrate and is used for electrically connecting the signal pad of the driving chip with one end of a first magnetic bead, and the other end of the first magnetic bead is connected with a first voltage;
the magnetic bead is also used for electrically connecting one end of the blocking capacitor with one end of the first magnetic bead;
The EML multiplexing pad is arranged on the surface of the ceramic substrate and is used for electrically connecting the other end of the blocking capacitor with the other end of the second magnetic bead;
and the device is also used for electrically connecting the EML laser component with the other end of the second magnetic bead, and one end of the second magnetic bead is connected with the power supply voltage of the EML laser chip.
2. The optical module of claim 1, wherein the channel further comprises:
The driving power supply pad is arranged on the surface of the ceramic substrate and is used for electrically connecting the signal pad of the driving chip with the filter capacitor, and the filter capacitor is electrically connected with the power supply pin on the circuit board so as to provide a second voltage for the driving chip.
3. The optical module of claim 1, wherein the channel further comprises:
The first grounding pad is arranged adjacent to the driving chip and is used for electrically connecting the negative electrode of the driving chip and the ceramic substrate so as to realize the grounding of the negative electrode of the driving chip;
and the second grounding pad is arranged adjacent to the driving chip and is used for electrically connecting the negative electrode of the driving chip and the negative electrode of the EML laser chip so as to realize isolation between channels.
4. The optical module of claim 1, wherein the channel further comprises:
A third grounding pad, which is arranged adjacent to the EML laser chip and is used for electrically connecting the negative electrode of the EML laser chip and the ceramic substrate so as to realize the grounding of the negative electrode of the EML laser chip;
And the fourth grounding pad is arranged adjacent to the EML laser chip and is used for electrically connecting the negative electrode of the EML laser chip and the negative electrode of the driving chip so as to realize isolation between channels.
5. The optical module of claim 2, wherein one end of the filter capacitor is electrically connected to a power supply pin on the circuit board, and the other end is grounded.
6. The optical module of claim 1, wherein one end of the first magnetic bead is electrically connected to a power supply pin of the circuit board, the other end is electrically connected to the blocking capacitor, and one end of the second magnetic bead is electrically connected to a power supply pin of the circuit board, and the other end is electrically connected to the blocking capacitor.
7. The optical module of claim 1, wherein one end of the driving multiplexing pad is electrically connected to the driving chip, the other end is electrically connected to one end of the first magnetic bead, and the other end of the first magnetic bead is electrically connected to a power supply pin of the circuit board to provide a first voltage to the driving chip.
8. The optical module of claim 1, wherein one end of the driving multiplexing pad is electrically connected to the driving chip, the other end of the driving multiplexing pad is electrically connected to one end of the blocking capacitor, the other end of the blocking capacitor is connected to the EML multiplexing pad, and the EML multiplexing pad is electrically connected to the EML laser chip, so as to realize signal transmission between the driving chip and the EML laser chip.
9. The optical module of claim 2, wherein one end of the driving power supply pad is electrically connected to one end of the filter capacitor, and the other end of the filter capacitor is electrically connected to a power supply pin of the circuit board to provide the second voltage to the driving chip.
10. The optical module of claim 1, wherein one end of the EML multiplexing pad is electrically connected to the EML laser chip, the other end is electrically connected to one end of the second magnetic bead, and the other end of the second magnetic bead is electrically connected to a power supply pin of the circuit board to provide a voltage to the EML laser chip.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011507499.7A CN112505855B (en) | 2020-12-18 | 2020-12-18 | Optical module |
| PCT/CN2021/103117 WO2022127073A1 (en) | 2020-12-18 | 2021-06-29 | Optical module |
| US17/853,742 US20220337022A1 (en) | 2020-02-18 | 2022-06-29 | Light Emission Assembly and an Optical Module |
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| CN202011507499.7A CN112505855B (en) | 2020-12-18 | 2020-12-18 | Optical module |
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| CN112505855B true CN112505855B (en) | 2024-10-22 |
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| WO2022127073A1 (en) * | 2020-12-18 | 2022-06-23 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113805289B (en) * | 2021-09-16 | 2023-01-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN117353825B (en) * | 2023-12-04 | 2024-02-09 | 成都英思嘉半导体技术有限公司 | High-speed light emitting system integrating single-end welding FPC and driving and control method |
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| US20060092642A1 (en) * | 2004-10-29 | 2006-05-04 | Hideki Nakata | Light emitting module, optical head, and optical disc recording and reproducing apparatus |
| JP2006220942A (en) * | 2005-02-10 | 2006-08-24 | Murata Mfg Co Ltd | Optical transceiver module |
| CN105610040A (en) * | 2014-11-25 | 2016-05-25 | 青岛海信宽带多媒体技术有限公司 | Laser transmitter |
| JP6322154B2 (en) * | 2015-03-23 | 2018-05-09 | 日本電信電話株式会社 | Optical circuit |
| CN204947313U (en) * | 2015-08-24 | 2016-01-06 | 宁波环球广电科技有限公司 | Multichannel array fiber laser |
| CN110780397B (en) * | 2019-11-08 | 2021-07-27 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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