CN112486892B - Calculation method of bonding IC (integrated circuit) management and control calculator - Google Patents
Calculation method of bonding IC (integrated circuit) management and control calculator Download PDFInfo
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- CN112486892B CN112486892B CN202011477904.5A CN202011477904A CN112486892B CN 112486892 B CN112486892 B CN 112486892B CN 202011477904 A CN202011477904 A CN 202011477904A CN 112486892 B CN112486892 B CN 112486892B
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- 238000004364 calculation method Methods 0.000 title claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/02—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators
- G06F15/0241—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators of the IC-card-like type
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/02—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators
- G06F15/025—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators adapted to a specific application
- G06F15/0258—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators adapted to a specific application for unit conversion
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/76—Architectures of general purpose stored program computers
- G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computing Systems (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
The invention relates to the technical field of management and control calculation, and discloses a calculation method of a bonding IC management and control calculator, which comprises the following steps: judging the position of the bonding IC, inputting the position of the bonding IC, selecting the copper thickness, and inputting the ratio of the client to the IC bonding pad tolerance value; clicking the calculation button calculator directly obtains the final result. The step of judging the position of the bonding IC and inputting the position of the bonding IC, and inputting the ratio of the client to the IC bonding pad tolerance value after selecting the copper thickness is as follows: bonding IC header (mil): indicated by the letter a; (1) Let us assume that the input customer design value requirement is 5, denoted by the letter V. According to the invention, the phenomena of manual calculation, conversion, comparison conflict, decision and value taking according to rules are omitted, the result is directly obtained after the operation is changed, the result is obtained after about 2 minutes on average, the efficiency is improved to about 90%, and the phenomena of manual input calculation errors, comparison judgment errors, final decision and value taking errors and the like are completely avoided.
Description
Technical Field
The invention relates to the technical field of management and control calculation, in particular to a calculation method of a bonding IC management and control calculator.
Background
At present, bonding plate numbers of companies are increased, but the difficulty of bonding plate control is in controlling the width of bonding IC, so that an engineer needs to give an accurate control range when engineering design; the control range has specificity, and the comparison image is twitched, and various conflicting factors are needed to be considered during conversion, so that a final control value is determined, and the human conversion and the conflict determination process need too much time and have high error rate; for this purpose, we propose a calculation method of the bonding IC management and control calculator.
Disclosure of Invention
(One) solving the technical problems
Aiming at the defects of the prior art, the invention provides a calculation method of a bonding IC management and control calculator.
(II) technical scheme
In order to achieve the above purpose, the present invention provides the following technical solutions: the calculation method of the bonding IC management and control calculator comprises the following steps:
judging the position of the bonding IC, inputting the position of the bonding IC, selecting the copper thickness, and inputting the ratio of the client to the IC bonding pad tolerance value;
clicking the calculation button calculator directly obtains the final result.
Preferably, the step of determining the position of the bonding IC and inputting the size of the position of the bonding IC, and inputting the ratio of the customer to the IC pad tolerance value after selecting the copper thickness, includes:
Bonding IC header (mil): indicated by the letter a;
(1) Assuming that the input customer design value requirement is 5, denoted by the letter V;
(2) Assuming that the minimum requirement of the bonding pad required by the input customer is 4.8, and the minimum requirement is denoted by the letter H;
(3) Assuming that the copper thickness required by the customer is Hoz, denoted by the letter T, the corresponding first-part design value tolerance is 0.3, denoted by the letter TF; the corresponding process design value tolerance is 0.4, which is indicated by the letter TC;
(4) Assume that the compensation value defined inside the company is 0.1, denoted by the letter Z.
Preferably, the bonding IC headpiece (mil) is calculated:
If V-TF < H+Z and H+Z is less than or equal to V+TF, then A= [ (H+Z) + (V+TF) ]/2.+ -. (V+TF) - (H+Z) ]/2, i.e., [ (4.8+0.1) + (5+0.3) ]/2.+ -. (5+0.3) - (4.8+0.1) ]/2.
If V-TF is equal to or greater than H+Z and V-TF is equal to or greater than V+TF, then A= [ (V-TF) + (V+TF) ]/2.+ - [ (V+TF) - (V-TF) ]/2, i.e., [ (5-0.3) + (5+0.3) ]/2.+ - [ (5+0.3) - (5-0.3) ]/2;
the output bonding IC first part is A.
Preferably, the step of determining the position of the bonding IC and inputting the size of the position of the bonding IC, and inputting the ratio of the customer to the IC pad margin value after selecting the copper thickness is as follows:
Bonding IC process (mil): indicated by letter B;
(1) Assuming that the input customer design value requirement is 5, denoted by the letter V;
(2) Assuming that the minimum requirement of the bonding pad required by the input customer is 4.8, and the minimum requirement is denoted by the letter H;
(3) Assuming that the copper thickness required by the customer is Hoz, denoted by the letter T, the corresponding first-part design value tolerance is 0.3, denoted by the letter TF; the corresponding process design value tolerance is 0.4, which is indicated by the letter TC;
(4) Assume that the compensation value defined inside the company is 0.1, denoted by the letter Z.
Preferably, the bonding IC process (mil) specifically comprises the following steps:
If V-TC is less than H+Z and H+Z is less than or equal to V+TC, then A is more than or equal to H+Z, namely more than or equal to 4.8+0.1;
If V-TC is greater than or equal to H+Z and V-TC is greater than or equal to V+TC, then A= [ (V-TC) + (V+TC) ]/2 + - [ (V+TC) - (V-TC) ]/2, i.e., [ (5-0.4) + (5+0.4) ]/2 ] (5+0.4) - (5-0.4) ]/2;
The output bonding IC process is B.
Preferably, the specific algorithm for directly obtaining the H09 same PCS requirement <1/6 range (mil) in the final result by the click calculation button calculator is as follows:
h09 the same PCS requires <1/6 very bad (mil): indicated by letter C;
(1) Assuming that the input customer design value requirement is 5, denoted by the letter V;
(2) Assuming an extremely poor requirement of 1/6, denoted by the letter G;
then c= (V/G) rounding off to 2-bit fraction, i.e., (5/1/6)) rounding off to 2-bit fraction;
The H09 output is the same PCS requiring <1/6 very bad (mil) as C.
(III) beneficial effects
Compared with the prior art, the invention provides a calculation method of the bonding IC management and control calculator, which has the following beneficial effects:
The calculation method of the bonding IC management and control calculator omits the phenomena of manual calculation, conversion, comparison conflict, decision and value taking according to rules, directly outputting the result after the operation is changed, averaging the result about 2 minutes, improving the efficiency by about 90 percent, and completely avoiding the phenomena of how many manual inputs are used for calculation errors, comparison judgment errors, final decision and value taking errors and the like.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Examples: a calculation method of a bonding IC management and control calculator comprises the following steps:
judging the position of the bonding IC, inputting the position of the bonding IC, selecting the copper thickness, and inputting the ratio of the client to the IC bonding pad tolerance value;
clicking the calculation button calculator directly obtains the final result.
The step of judging the position of the bonding IC and inputting the position of the bonding IC, and inputting the ratio of the client to the IC bonding pad tolerance value after selecting the copper thickness is as follows:
Bonding IC header (mil): indicated by the letter a;
(1) Assuming that the input customer design value requirement is 5, denoted by the letter V;
(2) Assuming that the minimum requirement of the bonding pad required by the input customer is 4.8, and the minimum requirement is denoted by the letter H;
(3) Assuming that the copper thickness required by the customer is Hoz, denoted by the letter T, the corresponding first-part design value tolerance is 0.3, denoted by the letter TF; the corresponding process design value tolerance is 0.4, which is indicated by the letter TC;
(4) Assume that the compensation value defined inside the company is 0.1, denoted by the letter Z.
The bonding IC headpiece (mil) is calculated:
If V-TF < H+Z and H+Z is less than or equal to V+TF, then A= [ (H+Z) + (V+TF) ]/2.+ -. (V+TF) - (H+Z) ]/2, i.e., [ (4.8+0.1) + (5+0.3) ]/2.+ -. (5+0.3) - (4.8+0.1) ]/2.
If V-TF is equal to or greater than H+Z and V-TF is equal to or greater than V+TF, then A= [ (V-TF) + (V+TF) ]/2.+ - [ (V+TF) - (V-TF) ]/2, i.e., [ (5-0.3) + (5+0.3) ]/2.+ - [ (5+0.3) - (5-0.3) ]/2;
the output bonding IC first part is A.
The step of bonding IC process (mil) in the proportion of the difference value of the bonding pads of the customer and the IC after the copper thickness is selected is as follows:
Bonding IC process (mil): indicated by letter B;
(1) Assuming that the input customer design value requirement is 5, denoted by the letter V;
(2) Assuming that the minimum requirement of the bonding pad required by the input customer is 4.8, and the minimum requirement is denoted by the letter H;
(3) Assuming that the copper thickness required by the customer is Hoz, denoted by the letter T, the corresponding first-part design value tolerance is 0.3, denoted by the letter TF; the corresponding process design value tolerance is 0.4, which is indicated by the letter TC;
(4) Assume that the compensation value defined inside the company is 0.1, denoted by the letter Z.
The bonding IC process (mil) comprises the following specific calculation steps:
If V-TC is less than H+Z and H+Z is less than or equal to V+TC, then A is more than or equal to H+Z, namely more than or equal to 4.8+0.1;
If V-TC is greater than or equal to H+Z and V-TC is greater than or equal to V+TC, then A= [ (V-TC) + (V+TC) ]/2 + - [ (V+TC) - (V-TC) ]/2, i.e., [ (5-0.4) + (5+0.4) ]/2 ] (5+0.4) - (5-0.4) ]/2;
The output bonding IC process is B.
The specific algorithm for directly obtaining H09 and the same PCS in the final result by clicking the calculation button calculator, wherein the requirement of the specific algorithm is <1/6 (mil):
h09 the same PCS requires <1/6 very bad (mil): indicated by letter C;
(1) Assuming that the input customer design value requirement is 5, denoted by the letter V;
(2) Assuming an extremely poor requirement of 1/6, denoted by the letter G;
then c= (V/G) rounding off to 2-bit fraction, i.e., (5/1/6)) rounding off to 2-bit fraction;
The H09 output is the same PCS requiring <1/6 very bad (mil) as C.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. The calculation method of the bonding IC management and control calculator is characterized by comprising the following steps of:
judging the position of the bonding IC, inputting the position of the bonding IC, selecting the copper thickness, inputting the ratio of the client to the IC bonding pad polar value, and bonding the first piece of the IC, wherein the bonding IC comprises the following steps:
bonding IC first part: indicated by the letter a;
(1) Assuming that the input customer design value requirement is 5, denoted by the letter V;
(2) Assuming that the minimum requirement of the bonding pad required by the input customer is 4.8, and the minimum requirement is denoted by the letter H;
(3) Assuming that the copper thickness required by the customer is Hoz, denoted by the letter T, the corresponding first-part design value tolerance is 0.3, denoted by the letter TF; the corresponding process design value tolerance is 0.4, which is indicated by the letter TC;
(4) Assume that the compensation value defined inside the company is 0.1, denoted by the letter Z;
the bonding IC first part is calculated by:
If V-TF < H+Z and H+Z is less than or equal to V+TF, then A= [ (H+Z) + (V+TF) ]/2.+ -. (V+TF) - (H+Z) ]/2, i.e., [ (4.8+0.1) + (5+0.3) ]/2.+ -. (5+0.3) - (4.8+0.1) ]/2.
If V-TF is equal to or greater than H+Z and V-TF is equal to or greater than V+TF, then A= [ (V-TF) + (V+TF) ]/2.+ - [ (V+TF) - (V-TF) ]/2, i.e., [ (5-0.3) + (5+0.3) ]/2.+ - [ (5+0.3) - (5-0.3) ]/2;
the output bonding IC first part is A;
Bonding IC process: indicated by letter B;
(1) Assuming that the input customer design value requirement is 5, denoted by the letter V;
(2) Assuming that the minimum requirement of the bonding pad required by the input customer is 4.8, and the minimum requirement is denoted by the letter H;
(3) Assuming that the copper thickness required by the customer is Hoz, denoted by the letter T, the corresponding first-part design value tolerance is 0.3, denoted by the letter TF; the corresponding process design value tolerance is 0.4, which is indicated by the letter TC;
(4) Assume that the compensation value defined inside the company is 0.1, denoted by the letter Z;
the bonding IC process comprises the following specific calculation steps:
If V-TC is less than H+Z and H+Z is less than or equal to V+TC, then A is more than or equal to H+Z, namely more than or equal to 4.8+0.1;
If V-TC is greater than or equal to H+Z and V-TC is greater than or equal to V+TC, then A= [ (V-TC) + (V+TC) ]/2 + - [ (V+TC) - (V-TC) ]/2, i.e., [ (5-0.4) + (5+0.4) ]/2 ] (5+0.4) - (5-0.4) ]/2;
the output bonding IC process is B;
Clicking the calculation button calculator directly to obtain the final result, and the specific algorithm of H09 same PCS requiring <1/6 extremely bad is as follows:
h09 same PCS requires <1/6 very bad: indicated by letter C;
(1) Assuming that the input customer design value requirement is 5, denoted by the letter V;
(2) Assuming an extremely poor requirement of 1/6, denoted by the letter G;
then c= (V/G) rounding off to 2-bit fraction, i.e., (5/1/6)) rounding off to 2-bit fraction;
the output H09 is equal to PCS and requires <1/6 to be very bad as C.
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| JP2522458B2 (en) * | 1990-10-01 | 1996-08-07 | 日本電気株式会社 | Method of generating land pattern data for wire bonding |
| JP3923248B2 (en) * | 1996-12-27 | 2007-05-30 | 松下電器産業株式会社 | Method of mounting electronic component on circuit board and circuit board |
| US20030113947A1 (en) * | 2001-12-19 | 2003-06-19 | Vandentop Gilroy J. | Electrical/optical integration scheme using direct copper bonding |
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Patent Citations (2)
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| CN104051675A (en) * | 2014-06-06 | 2014-09-17 | 昆山工研院新型平板显示技术中心有限公司 | Display device and binding method thereof |
| CN104409371A (en) * | 2014-12-03 | 2015-03-11 | 无锡中微高科电子有限公司 | Method for improving long-term reliability of gold-aluminum bonding |
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