CN112484004A

CN112484004A - LED lamp radiator and LED lamp

Info

Publication number: CN112484004A
Application number: CN202011392233.2A
Authority: CN
Inventors: 李磊; 李伟进; 胡齐桂; 苑珂; 郑雪云
Original assignee: Gree Electric Appliances Inc of Zhuhai
Current assignee: Gree Electric Appliances Inc of Zhuhai
Priority date: 2020-12-02
Filing date: 2020-12-02
Publication date: 2021-03-12
Anticipated expiration: 2040-12-02
Also published as: CN112484004B

Abstract

The present application relates to an LED lamp radiator and an LED lamp, and belongs to the technical field of LED lamps. The present application includes: a first heat dissipation part and a second heat dissipation part, a space interval exists between the first heat dissipation part and the second heat dissipation part, and the first heat dissipation part and the second heat dissipation part are connected by a connecting piece, wherein the first heat dissipation part and the second heat dissipation part are connected by a connecting piece. One of the heat dissipation part and the second heat dissipation part is used to dissipate heat from the power supply board of the LED lamp, and the other is used to dissipate heat from the LED lamp board of the LED lamp. Through the present application, it is helpful to ensure the heat dissipation of the LED lamp board of the LED lamp while simultaneously ensuring the heat dissipation of the power supply board, thereby improving the heat dissipation performance of the whole lamp of the LED lamp.

Description

LED lamp radiator and LED lamp

Technical Field

This application belongs to LED lamp technical field, concretely relates to LED lamp radiator and LED lamp.

Background

The LED lamp has the advantages of energy conservation, high lighting effect and the like, and the LED lamp panel is driven by the power panel to emit light by the LED lamp on the LED lamp panel during the work of the LED lamp. When the electric energy is converted into the light energy, the LED lamp panel generates a large amount of heat, for example, the power of the mining lamp is large, which may be hundreds of watts, and the LED lamp panel of the mining lamp generates a relatively high amount of heat. In the related art, the LED lamp panel is cooled by configuring a radiator. In the practical product of the LED lamp, still taking the industrial and mining lamp as an example, the power panel is placed on the heat sink, and there is a problem that when the heat productivity of the LED lamp panel is too large, the temperature born by the power panel is quite high through the heat conduction of the heat sink, and in addition, the heat produced by the power panel itself can not ensure the reliability of the power panel.

Disclosure of Invention

For overcoming the problem that exists in the correlation technique to a certain extent at least, this application provides LED lamp radiator and LED lamp, helps also giving consideration to the heat dissipation of guarantee power strip at the LED lamp plate heat dissipation of guarantee LED lamp simultaneously, and then promotes the whole lamp heat dispersion of LED lamp.

In order to achieve the purpose, the following technical scheme is adopted in the application:

in a first aspect,

the application provides a LED lamp radiator, includes:

the LED lamp comprises a first radiating part and a second radiating part, wherein a space interval exists between the first radiating part and the second radiating part, the first radiating part and the second radiating part are connected through a connecting piece, one of the first radiating part and the second radiating part is used for radiating a power panel of the LED lamp, and the other one of the first radiating part and the second radiating part is used for radiating an LED lamp panel of the LED lamp.

Further, the first heat sink member is formed to be disposed around the second heat sink member.

Further, a plurality of first heat dissipation fins are formed on the first heat dissipation part, and a plurality of second heat dissipation fins are formed on the second heat dissipation part.

Further, the air conditioner is provided with a fan,

a plurality of the first heat dissipating fins are formed to be circumferentially uniformly distributed on the first heat dissipating part, and

the plurality of second radiating fins are uniformly distributed on the second radiating part in the circumferential direction.

Furthermore, one of the first heat sink part and the second heat sink part for dissipating heat of the power supply board is recessed to form an accommodating space for accommodating the power supply board.

Further, the accommodating space is multiple, so that when the power supply board is multiple, each accommodating space accommodates one power supply board.

Further, a plurality of the accommodation spaces are formed to be circumferentially uniformly distributed on the one for dissipating heat from the power supply board.

Furthermore, a channel is formed between every two adjacent accommodating spaces for communication.

Further, a boss protruding the first heat dissipation part is formed on the outer peripheral side of the first heat dissipation part, and a mounting hole is formed in the boss.

Furthermore, the first heat dissipation part and the second heat dissipation part are respectively provided with wire passing holes for external wiring connection.

Furthermore, the first heat dissipation part is used for dissipating heat of the power panel, and the second heat dissipation part is used for dissipating heat of the LED lamp panel.

In a second aspect of the present invention,

the application provides a LED lamp, includes:

the LED lamp heat sink of any one of the above claims;

an LED lamp panel; and

and the power panel is electrically connected with the LED lamp panel.

Furthermore, the power strip is a plurality of, and each power strip forms the series connection, and is a plurality of in the power strip, including a main power strip and at least one from the power strip, wherein, main power strip is used for being connected with external power electricity, and with the LED lamp plate forms the electricity and connects, just main power strip can be to each from the power strip controls.

Further, the LED lamp further includes:

the lens board, with the LED lamp plate forms the cooperation, so that the light that LED lamp pearl on the LED lamp plate sent passes through the lens that corresponds on the lens board is worn out.

Further, the LED lamp further includes:

and the decorative plate is used for being arranged on the front surface of the LED lamp.

This application adopts above technical scheme, possesses following beneficial effect at least:

the utility model provides a LED lamp radiator has first radiating part and second radiating part, one is used for dispelling the heat to the LED lamp plate of LED lamp, another is used for dispelling the heat to the power strip of LED lamp, there is space interval between two radiating parts, and connect through the connecting piece and form whole stable structure, because of space interval's existence, can realize radiating effective isolation of LED lamp plate and power strip both, the radiating influence of LED lamp plate heat dissipation to the power strip can be effectively reduced, help also guaranteeing the power strip heat dissipation simultaneously in the radiating of the LED lamp plate of guarantee LED lamp, and then promote the whole lamp heat dispersion of LED lamp, also help promoting LED lamp life-span.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram illustrating a first angular configuration of an LED lamp heat sink in accordance with an exemplary embodiment;

FIG. 2 is a second angular configuration of an LED lamp heat sink according to an exemplary embodiment;

FIG. 3 is a schematic diagram of a power strip and an LED light panel for mounting an LED light heat sink according to an exemplary embodiment;

fig. 4 is a schematic diagram illustrating an exploded structure of an LED lamp according to an exemplary embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail below. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, 2, 3 and 4, fig. 1 is a schematic diagram illustrating a first angle structure of an LED lamp heat sink according to an exemplary embodiment, fig. 2 is a schematic diagram illustrating a second angle structure of an LED lamp heat sink according to an exemplary embodiment, fig. 3 is a schematic diagram illustrating a structure of an LED lamp heat sink mounting power board and an LED lamp panel according to an exemplary embodiment, fig. 4 is a schematic diagram illustrating an explosion structure of an LED lamp according to an exemplary embodiment, as shown in fig. 1 to 4, the LED lamp heat sink 11 includes:

the LED lamp comprises a first heat dissipation part 101 and a second heat dissipation part 102, wherein a space interval exists between the first heat dissipation part 101 and the second heat dissipation part 102, and the first heat dissipation part 101 is connected with the second heat dissipation part 102 through a connecting piece 103, wherein one of the first heat dissipation part 101 and the second heat dissipation part 102 is used for dissipating heat of a power panel 12 of the LED lamp 1, and the other one is used for dissipating heat of an LED lamp panel 13 of the LED lamp 1.

Referring to fig. 1 to 4, the LED lamp heat sink 11 provided by the present application has a first heat sink portion 101 and a second heat sink portion 102, wherein one is used for dissipating heat of the LED lamp panel 13 of the LED lamp 1, and the other is used for dissipating heat of the power board 12 of the LED lamp 1. Specifically, the first heat dissipation part 101 may be used for dissipating heat of the power panel 12 of the LED lamp 1, and the second heat dissipation part 102 may be used for dissipating heat of the LED lamp panel 13 of the LED lamp 1; the first heat sink portion 101 may be configured to dissipate heat from the LED lamp panel 13 of the LED lamp 1, and the second heat sink portion 102 may be configured to dissipate heat from the power supply board 12 of the LED lamp 1. In fig. 3 and 4 of the present application, a first heat sink part 101 is used for dissipating heat of the power panel 12 of the LED lamp 1, and a second heat sink part 102 is used for dissipating heat of the LED lamp panel 13 of the LED lamp 1, and the following description of related embodiments of the present application is described with reference to the drawings of the present application.

The first heat sink piece 101 and the second heat sink piece 102 are spaced apart from each other and connected by a connecting piece 103 to form an integral stable structure. In fig. 1 and 2, a plurality of connection members 103 are shown to ensure a stable connection between the first heat sink member 101 and the second heat sink member 102. The first heat sink part 101 and the second heat sink part 102 and the connecting part 103 therebetween can be made of the same heat sink material (e.g., aluminum alloy), so that the LED lamp heat sink 11 can be integrally formed. Because of the existence of space interval between first heat dissipation part 101 and the second heat dissipation part 102, first heat dissipation part 101 and second heat dissipation part 102 both separate the space relative, though, it connects to have connecting piece 103 between the two, however, the influence of connecting piece 103 heat conduction heat is very little, therefore can realize the radiating effective isolation of LED lamp plate 13 and power strip 12 both, the radiating influence of LED lamp plate 13 to power strip 12 can be effectively reduced, and then help also giving consideration to the heat dissipation of guarantee power strip 12 in the radiating LED lamp plate 13 of guarantee LED lamp 1, help promoting the whole lamp heat dispersion of LED lamp 1, also help promoting LED lamp 1 life-span.

Referring to fig. 1 and 2, in one embodiment, the first heat sink member 101 is formed to surround the second heat sink member 102.

Specifically, in the related art of the LED lamp, there is a design idea that the power board is disposed above the heat sink, and in the design idea, hot air formed by heat radiated from the heat sink rises upward, so that the power board is always in a hot air environment, which is disadvantageous to performance guarantee of the power board. In the above scheme of the present application, the first heat dissipation portion 101 is formed to surround the second heat dissipation portion 102, as shown in fig. 1 and fig. 2, the first heat dissipation portion 101 is a ring as a whole, the second heat dissipation portion 102 is a disc as a whole, the ring is formed to surround the disc, the first heat dissipation portion 101 and the second heat dissipation portion 102 are formed to be parallel in the transverse direction and have an interval arrangement, so that the parallel in the transverse direction is also formed between the LED lamp panel 13 and the power panel 12 and have an interval arrangement, hot air formed by respective heat radiated by the first heat dissipation portion 101 and the second heat dissipation portion 102 rises, and the defects existing above the heat sink when the power panel 12 is arranged in the related art can be effectively overcome.

Referring to fig. 1 and 2, in one embodiment, a plurality of first heat dissipation fins 101a are formed on the first heat dissipation part 101, and a plurality of second heat dissipation fins 102a are formed on the second heat dissipation part 102.

Specifically, the heat dissipation fins are formed on the first heat dissipation part 101 and the second heat dissipation part 102, respectively, so that the heat dissipation effect can be increased. In the first heat sink member 101 and the second heat sink member 102 shown in fig. 1 and 2, the heat sink fins of the first heat sink member 101 and the second heat sink member 102 are vertically provided on the back surface and are independent of each other. The upward heat conduction and dissipation is formed, the heat conduction and dissipation direction is the same as the rising direction of hot air, so that the heat dissipation is more efficient, and the heat dissipation effect can be effectively improved.

Referring to fig. 1 and 2, in one embodiment, a plurality of first heat dissipation fins 101a are uniformly distributed on the first heat dissipation part 101 in a circumferential direction, and a plurality of second heat dissipation fins 102a are uniformly distributed on the second heat dissipation part 102 in the circumferential direction.

Specifically, the plurality of first heat dissipation fins 101a on the first heat dissipation member 101 shown in fig. 1 and 2 are uniformly distributed circumferentially on the back surface of the first heat dissipation member 101, each first heat dissipation fin 101a is directed from the outer edge of the first heat dissipation member 101 to the center, the plurality of second heat dissipation fins 102a on the second heat dissipation member 102 are also uniformly distributed circumferentially on the back surface of the second heat dissipation member 102, and each second heat dissipation fin 102a is directed from the outer edge of the second heat dissipation member 102 to the center. The back of each heat dissipation part is uniformly dispersed and distributed, so that the uniformity of heat dissipation can be guaranteed.

Referring to fig. 2, in one embodiment, one of the first heat sink piece 101 and the second heat sink piece 102 for dissipating heat of the power board 12 is recessed to form a receiving space 101b for receiving the power board 12.

Specifically, fig. 2 shows that the first heat sink member 101 is used for dissipating heat from the power supply board 12, and an accommodating space 101b is formed in the front surface of the first heat sink member 101, and on one hand, the accommodating space 101b enables the power supply board 12 to be placed therein, which is helpful for reducing the overall volume of the product, and more importantly, the accommodating space 101b formed by the concave inside of the first heat sink member 101 can further increase the heat absorption area, thereby having a better absorption effect on heat emitted from the power supply board 12, and being capable of more efficiently dissipating heat emitted from the power supply board 12.

Referring to fig. 2 to 4, in an embodiment, there are a plurality of accommodating spaces 101b, so that when there are a plurality of power supply boards 12, each accommodating space 101b accommodates one power supply board 12.

Specifically, fig. 2 shows that the front surface of the first heat dissipation part 101 has a plurality of accommodating spaces 101b, fig. 4 shows that the first heat dissipation part has a plurality of power supply boards 12, the accommodating spaces 101b are isolated from each other, so that the heat absorption effect of the accommodating spaces is increased as much as possible, and one power supply board 12 can be installed in each accommodating space 101 b.

Referring to fig. 2, in an embodiment, the plurality of accommodating spaces 101b are uniformly distributed in the circumferential direction on the one for dissipating heat from the power board 12.

Specifically, the plurality of receiving spaces 101b are annularly distributed on the front surface of the annular first heat sink member 101 shown in fig. 2, and the power supply boards 12 can be distributed around the lamp and kept at a predetermined distance from the second heat sink member 102.

In one embodiment, the adjacent accommodating spaces 101b are communicated with each other by a channel.

The adjacent accommodating spaces 101b are communicated with each other through a channel, so that the adjacent power panels 12 can be connected in a wiring manner, and the channel can be in a hole shape or a groove shape.

Referring to fig. 1, in one embodiment, a boss 101c protruding from the first heat sink member 101 is formed on an outer peripheral side of the first heat sink member 101, and a mounting hole is formed on the boss 101 c.

Specifically, a plurality of bosses 101c are arranged on the periphery of the heat sink, and mounting holes are formed in the bosses 101c and used for mounting a lamp.

Referring to fig. 1 and 2, in one embodiment, the first heat sink piece 101 and the second heat sink piece 102 are respectively provided with wire through holes (101d, 101e, 102b) for external connection.

Specifically, as shown in fig. 1, the first heat sink part 101 is provided with two wire through holes (101d, 101e) for external connection, one wire through hole 101d for connecting the power board 12 to the power input line of the external power source, and one wire through hole 101e for connecting the power board 12 to the power output line 101f of the LED lamp panel 13, and a wire through hole 102b is formed in the center of the second heat sink part 102 and connected to the power output line 101f LED out from the first heat sink part 101, and the power output line 101f passes through the wire through hole 102b of the second heat sink part 102 and then is connected to the LED lamp panel 13, so that power is supplied to the LED lamp panel 13 through the power board 12.

Referring to fig. 3 and 4, the present application further provides an LED lamp solution, where the LED lamp 1 includes:

the LED lamp heat sink 11 of any of the above;

an LED lamp panel 13; and

and the power panel 12 is electrically connected with the LED lamp panel 13.

In particular, regarding the modification of the LED lamp 1 around the LED lamp heat sink 11 for the LED lamp panel 13 and the power supply board 12, the specific description thereof has been described in detail in the above related embodiments, and will not be elaborated herein.

In one embodiment, the power panel 12 has a plurality of power panels 12, each of the power panels 12 is connected in series, and the plurality of power panels 12 includes a main power panel and at least one slave power panel, wherein the main power panel is electrically connected to an external power source and to the LED light panel 13, and the main power panel can control each of the slave power panels.

Each power supply board 12 of this solution is installed, and may be applied to the above-mentioned related solution, where there are a plurality of the accommodating spaces 101b, so that when there are a plurality of the power supply boards 12, each accommodating space 101b accommodates one of the power supply boards 12. For the fitting installation of the power supply boards 12 and the accommodating spaces 101b, reference may be made to the above description, and repeated description is omitted here.

Through the scheme, the power panels 12 are designed in a distributed mode, each power panel 12 has a series connection function and an independent control function, and all the power panels 12 can be connected in series to meet the requirement of the total power of a product. Through the distributed power panel 12, the product can be controlled in a distributed mode when dimming and power adjustment are achieved, if the whole product needs 200w of total power, the distributed power panel divides 200w into 10 parts, each part of power supply is 20w, and the 20w power supplies are connected in series, so that the requirement of the total power of 200w is met. When the light is adjusted by adjusting the power, the power can be reduced by closing part of the power panel 12, and the brightness of the light is reduced.

As shown in fig. 3, the power panel 12 includes a main power panel 12a and a plurality of auxiliary power panels 12b, the main power panel 12a has a function of incoming and outgoing lines, the main power panel 12a has a power input line connected to an external power source and a power output line connected to the LED lamp panel 13, and the main power panel 12a and the auxiliary power panels 12b form a series connection together. The master power board 12a can control the slave power board 12b, and the master power board 12a selectively controls the slave power board 12b to change the dimming mode of the lamp, for example, the total power of the LED lamp power is 200w, and by the distributed design of the power boards 12, 10 power boards of 20w can be designed, including: 1 main power supply board 12a and 19 slave power supply boards 12b, one or more slave power supply boards 12b can be individually turned off by the control of the main power supply board 12 a. Such as: when 5 slave power supply boards 12b are turned off, the total power of the lighting product becomes 100w, and the corresponding brightness is synchronously reduced, i.e. the power and the brightness of the LED lamp can be controlled by controlling the switches of the slave power supply boards 12b, so as to achieve the purpose of dimming and adjusting the power.

Referring to fig. 4, in an embodiment, the LED lamp 1 further includes:

the lens plate 14 is matched with the LED lamp panel 13, so that light emitted by LED lamp beads on the LED lamp panel 13 passes through the corresponding lenses on the lens plate 14 to penetrate out.

Specifically, at the positive installation LED lamp plate 13 of second heat dissipation portion 102, second heat dissipation portion 102 dispels the heat to LED lamp plate 13, and in the correlation technique, LED lamp plate 13 is including LED lamp pearl and aluminium base board, and LED lamp pearl paster is on aluminium base board, and the laminating of aluminium base board accessible heat conduction silicone grease is fixed at the front of second heat dissipation portion 102, accessible screw between the two. The LED lamp panel 13 is provided with a lens plate 14 in a matched mode, the lens plate 14 can be installed on the second heat dissipation portion 102 through screws, the lens plate 14 is opposite to the LED lamp panel 13, a convex point lens is arranged on the lens plate 14, each lamp bead is opposite to the center of the convex point lens, and light emitted by the LED lamp beads on the LED lamp panel 13 passes through the corresponding lens on the lens plate 14 to penetrate out.

Referring to fig. 4, in an embodiment, the LED lamp 1 further includes:

and the decorative plate 15 is used for being arranged on the front surface of the LED lamp 1.

Specifically, the decorative plate 15 is installed on the periphery of the front surface of the radiator to play a decorative role.

It is understood that the same or similar parts in the above embodiments may be mutually referred to, and the same or similar parts in other embodiments may be referred to for the content which is not described in detail in some embodiments.

It should be noted that, in the description of the present application, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present application, the meaning of "plurality" means at least two unless otherwise specified.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present; when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, and further, as used herein, connected may include wirelessly connected; the term "and/or" is used to include any and all combinations of one or more of the associated listed items.

Any process or method descriptions in flow charts or otherwise described herein may be understood as: represents modules, segments or portions of code which include one or more executable instructions for implementing specific logical functions or steps of a process, and the scope of the preferred embodiments of the present application includes other implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present application.

It should be understood that portions of the present application may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.

It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.

In addition, functional units in the embodiments of the present application may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.

The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. An LED lamp heat sink, comprising:

2. The LED lamp heat sink of claim 1, wherein the first heat sink portion is formed to be disposed around the second heat sink portion.

3. The LED lamp heat sink of claim 1, wherein a plurality of first heat sink fins are formed on the first heat sink portion, and a plurality of second heat sink fins are formed on the second heat sink portion.

4. The LED lamp heat sink of claim 2,

5. The LED lamp heat sink according to claim 1, wherein one of the first heat sink portion and the second heat sink portion for dissipating heat from the power supply board is recessed to form a receiving space for receiving the power supply board.

6. The LED lamp heat sink as claimed in claim 5, wherein the accommodating space is plural, and when the power supply board is plural, each accommodating space accommodates one power supply board.

7. The LED lamp heat sink according to claim 6, wherein the plurality of receiving spaces are evenly distributed circumferentially on the one for dissipating heat from the power strip.

8. The LED lamp heat sink as claimed in claim 6, wherein the adjacent accommodating spaces are communicated with each other via a channel.

9. The LED lamp heat sink according to claim 1, wherein a boss protruding from the first heat sink member is formed on an outer peripheral side of the first heat sink member, and a mounting hole is formed in the boss.

10. The LED lamp radiator of claim 1, wherein the first radiating portion and the second radiating portion are respectively provided with wire passing holes for external wiring connection.

11. The LED lamp heat sink according to any one of claims 1-10, wherein the first heat sink portion is configured to dissipate heat from the power board, and the second heat sink portion is configured to dissipate heat from the LED lamp panel.

12. An LED lamp, comprising:

the LED lamp heat sink of any of claims 1-11;

an LED lamp panel; and

and the power panel is electrically connected with the LED lamp panel.

13. The LED lamp of claim 12, wherein the power strip is a plurality of power strips, each of the plurality of power strips is connected in series, and the plurality of power strips includes a master power strip and at least one slave power strip, wherein the master power strip is configured to be electrically connected to an external power source and to the LED light panel, and the master power strip is configured to control each of the slave power strips.

14. The LED lamp of claim 12, further comprising:

15. The LED lamp of claim 12, further comprising: