CN112480831A - UV-cured hot-melt acrylate pressure-sensitive adhesive and electrical adhesive tape prepared from same - Google Patents
UV-cured hot-melt acrylate pressure-sensitive adhesive and electrical adhesive tape prepared from same Download PDFInfo
- Publication number
- CN112480831A CN112480831A CN202011402884.5A CN202011402884A CN112480831A CN 112480831 A CN112480831 A CN 112480831A CN 202011402884 A CN202011402884 A CN 202011402884A CN 112480831 A CN112480831 A CN 112480831A
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- Prior art keywords
- sensitive adhesive
- acrylate
- melt
- parts
- pressure
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 68
- 239000012943 hotmelt Substances 0.000 title claims abstract description 47
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 title claims abstract description 41
- 239000002390 adhesive tape Substances 0.000 title description 5
- 239000011347 resin Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000000178 monomer Substances 0.000 claims abstract description 33
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 25
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 25
- 239000003085 diluting agent Substances 0.000 claims abstract description 25
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 16
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 16
- 150000001336 alkenes Chemical class 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 7
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 24
- NPFYZDNDJHZQKY-UHFFFAOYSA-N 4-Hydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 NPFYZDNDJHZQKY-UHFFFAOYSA-N 0.000 claims description 22
- 238000002360 preparation method Methods 0.000 claims description 19
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 18
- 229920002554 vinyl polymer Polymers 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- 239000002994 raw material Substances 0.000 claims description 16
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 14
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 12
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 7
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
- 239000004902 Softening Agent Substances 0.000 claims description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 5
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- 239000004831 Hot glue Substances 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 4
- 238000004090 dissolution Methods 0.000 claims description 4
- LMAUULKNZLEMGN-UHFFFAOYSA-N 1-ethyl-3,5-dimethylbenzene Chemical compound CCC1=CC(C)=CC(C)=C1 LMAUULKNZLEMGN-UHFFFAOYSA-N 0.000 claims description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 3
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 claims description 3
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 claims description 3
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 claims description 3
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 3
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims description 3
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 claims description 3
- 229940119545 isobornyl methacrylate Drugs 0.000 claims description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 claims description 3
- 150000003505 terpenes Chemical class 0.000 claims description 3
- 235000007586 terpenes Nutrition 0.000 claims description 3
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 3
- 230000005012 migration Effects 0.000 abstract description 5
- 238000013508 migration Methods 0.000 abstract description 5
- 239000012634 fragment Substances 0.000 abstract description 4
- 238000004383 yellowing Methods 0.000 abstract description 4
- 230000032683 aging Effects 0.000 abstract description 3
- 230000001988 toxicity Effects 0.000 abstract description 3
- 231100000419 toxicity Toxicity 0.000 abstract description 3
- 238000006303 photolysis reaction Methods 0.000 abstract description 2
- 230000015843 photosynthesis, light reaction Effects 0.000 abstract description 2
- 230000003712 anti-aging effect Effects 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 27
- 230000009477 glass transition Effects 0.000 description 17
- 239000003292 glue Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000003848 UV Light-Curing Methods 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 238000004804 winding Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 230000005281 excited state Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000002283 diesel fuel Substances 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000006317 isomerization reaction Methods 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- ABCGFHPGHXSVKI-UHFFFAOYSA-O meso-tetrakis(n-methyl-4-pyridyl)porphine(4+) Chemical compound C1=C[N+](C)=CC=C1C(C1=CC=C(N1)C(C=1C=C[N+](C)=CC=1)=C1C=CC(=N1)C(C=1C=C[N+](C)=CC=1)=C1C=CC(N1)=C1C=2C=C[N+](C)=CC=2)=C2N=C1C=C2 ABCGFHPGHXSVKI-UHFFFAOYSA-O 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a UV-cured hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared from the same, wherein the anti-aging rubber type pressure-sensitive adhesive comprises, by weight, 20-60 parts of acrylic resin, 20-40 parts of tackifying resin, 2-15 parts of reactive diluent, 2-15 parts of alkene monomer, 2-10 parts of softener and 0.1-2.0 parts of antioxidant. The pressure-sensitive adhesive and the electrical tape prepared by the method have excellent initial viscosity, peeling strength and permanent viscosity, and simultaneously, the problems of photoinitiator residue, easy migration and volatilization of photolysis fragments, easy aging and yellowing of cured products, easy occurrence of odor and toxicity and the like are solved because the acrylic resin in the pressure-sensitive adhesive is obtained by prepolymerization of a polymerizable macromolecular photoinitiator.
Description
Technical Field
The invention relates to a pressure-sensitive adhesive technology, in particular to a UV-cured hot-melt acrylate pressure-sensitive adhesive and an electrical adhesive tape prepared from the same.
Background
The electrician adhesive tape is an adhesive tape used by electricians for preventing electric leakage and playing an insulating role. The cable has the characteristics of good insulation, pressure resistance, flame retardance, weather resistance, high peel strength and the like, and is suitable for wire connection, electrical insulation protection and the like. Electrical tapes are generally composed of a PVC substrate with a pressure sensitive adhesive applied thereto. Traditional glue adopts rubber type glue, though has good performance in the aspect of peel strength, but rubber type glue can use the solvent in process of production, for example need use toluene, dries the solvent again after the coating, has great environmental protection problem, and causes great harm to production research personnel health. The environment-friendly glue is difficult to achieve the performance of the rubber glue, so that the glue which has the same performance as the rubber glue and is environment-friendly needs to be developed.
The UV-cured hot-melt pressure-sensitive adhesive is a key direction developed at present, does not contain solvent components, is coated by melting at high temperature, is cured and crosslinked by UV to improve the cohesive force, is environment-friendly, and has excellent electrical performance and mechanical performance. However, the compatibility of the small-molecule photoinitiator existing in the traditional UV curing system and a polymer is poor, so that the problems of photoinitiator residue, easy migration and volatilization of photolysis fragments, easy aging and yellowing of a cured product, easy odor and toxicity and the like are caused, the performance of the UV curing system is influenced, and the application of the UV curing system is restricted.
Disclosure of Invention
In order to solve the problems, the first aspect of the invention provides a UV-cured hot-melt acrylate pressure-sensitive adhesive, which comprises 20-60 parts by weight of acrylic resin, 20-40 parts by weight of tackifying resin, 2-15 parts by weight of reactive diluent, 2-15 parts by weight of alkene monomer, 2-10 parts by weight of softener and 0.1-2.0 parts by weight of antioxidant.
As a preferable technical scheme, the raw materials for preparing the acrylic resin comprise acrylic acid, vinyl monomers and a photoinitiator.
As a preferable technical scheme, the photoinitiator is a polymerizable high molecular weight photoinitiator, and the preparation raw materials comprise 4-hydroxybenzophenone, MDI and 2-hydroxyethyl acrylate.
As a preferable technical scheme, the MDI is the mixture of 4, 4 '-diphenylmethane diisocyanate and 2, 4' -diphenylmethane diisocyanate, and the weight ratio is (0.8-1.2): 1.
As a preferred technical scheme, the active diluent comprises one or more of butyl acrylate, isooctyl acrylate, isobutyl acrylate, sec-butyl acrylate, n-propyl acrylate, 2-ethylhexyl acrylate, 2-hydroxypropyl acrylate, lauryl methacrylate and ethyl acrylate.
As a preferable technical scheme, the vinyl monomer comprises one or more of methyl acrylate, ethyl methacrylate, methyl methacrylate, n-butyl methacrylate, tert-butyl acrylate, isobornyl methacrylate, 2-hydroxypropyl methacrylate, vinyl acetate, acrylonitrile and styrene.
As a preferable technical scheme, the tackifying resin comprises one or a mixture of rosin resin, rosin resin derivatives, terpene resin and petroleum resin.
As a preferable technical scheme, the rosin resin is hydrogenated rosin resin.
The invention provides a preparation method of a UV-cured hot-melt acrylate pressure-sensitive adhesive, which comprises the following steps:
according to the formula, acrylic resin, a softening agent, an antioxidant and an active diluent are added into a melt adhesive tank, nitrogen is introduced for protection, heating and stirring are started for dispersion and dissolution, so that UV-cured hot melt adhesive is completely melted, then tackifying resin and vinyl monomers are added, heating is stopped after complete melting and uniform stirring, the mixture is naturally cooled to about 80-150 ℃, and then the UV-cured hot melt acrylate pressure-sensitive adhesive is obtained after discharging.
The third aspect of the present invention provides an electrical tape, which is prepared from the UV-curable hot-melt acrylate pressure-sensitive adhesive according to any one of claims 1 to 8.
Has the advantages that:
1. the photoinitiator is a polymerizable high molecular weight photoinitiator, so that the residue and migration of the photoinitiator in the pressure-sensitive adhesive are reduced, and the stability of the pressure-sensitive adhesive is improved.
The activities of NCO groups in molecules of the 2, 4 '-diphenylmethane diisocyanate and the 2, 4' -diphenylmethane diisocyanate are different, so that the NCO groups can respectively and sequentially react with the photoinitiator and OH groups in the 2-hydroxyethyl acrylate, the stable and stable reaction process is ensured, and the obtained high-molecular-weight photoinitiator has a stable structure.
3. The 2-hydroxyethyl acrylate is combined with NCO groups in MDI to further improve the molecular weight of the photoinitiator, and in addition, the photoinitiator also has unsaturated carbon-carbon double bonds which can generate polymerization reaction with acrylic monomers, thereby improving the curing crosslinking cohesion of the pressure sensitive adhesive and improving the caking property.
4. The reactive diluent with lower glass transition temperature reduces the interaction between main chains, thereby playing the role of internal plasticization and improving the initial viscosity of the pressure-sensitive adhesive.
5. The glass transition temperature of the vinyl monomer with high glass transition temperature is lower than 100 ℃, which is beneficial to improving the cohesive strength and the service temperature of the copolymer generated by the vinyl monomer with high glass transition temperature and the reactive diluent with low glass transition temperature, thereby avoiding the environmental pollution of residual glue caused by residual glue remained on the base material because the cohesive force is smaller than the stripping force.
Detailed Description
The invention will be further understood by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. To the extent that a definition of a particular term disclosed in the prior art is inconsistent with any definition provided in the present disclosure, the definition of the term provided in the present disclosure controls.
As used herein, a feature that does not define a singular or plural form is also intended to include a plural form of the feature unless the context clearly indicates otherwise. It will be further understood that the term "prepared from …," as used herein, is synonymous with "comprising," including, "comprising," "having," "including," and/or "containing," when used in this specification means that the recited composition, step, method, article, or device is present, but does not preclude the presence or addition of one or more other compositions, steps, methods, articles, or devices. Furthermore, the use of "preferred," "preferably," "more preferred," etc., when describing embodiments of the present invention, is meant to refer to embodiments of the invention that may provide certain benefits, under certain circumstances. However, other embodiments may be preferred, under the same or other circumstances. In addition, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
In order to solve the problems, the first aspect of the invention provides a UV-cured hot-melt acrylate pressure-sensitive adhesive, which comprises, by weight, 20-60 parts of acrylic resin, 20-40 parts of tackifying resin, 2-15 parts of reactive diluent, 2-15 parts of vinyl monomer, 2-10 parts of softener and 0.1-2.0 parts of antioxidant.
The traditional photoinitiator does not participate in polymerization in general except for initiating polymerization, so that the problems of strength reduction, yellowing, peculiar smell and the like of a finished product can be caused by the residual excess and photo-cleavage residues of the photoinitiator in a polymerized product.
In order to reduce the residue and migration of the photoinitiator in the pressure-sensitive adhesive and improve the stability of the pressure-sensitive adhesive, in some preferred embodiments, the raw materials for preparing the acrylic resin comprise 70-90 parts of acrylic acid, 10-20 parts of vinyl monomer and 0.1-1 part of the initiator. The vinyl monomer is selected from vinyl acetate, and the photoinitiator is a polymerizable high molecular weight photoinitiator.
In some preferred embodiments, the preparation raw materials of the high molecular weight photoinitiator include: 4-hydroxybenzophenone, MDI, 2-hydroxyethyl acrylate.
The 4-hydroxybenzophenone is excited by light to form an excited state, and after a hydrogen atom is extracted from a monomer or matrix resin by excited state molecules, a free radical is formed, so that no pyrolytic fragments are generated, and the negative influence of a cracking product on an ultraviolet curing system is reduced.
MDI can be combined with 4-hydroxybenzophenone to increase the molecular weight of the photoinitiator. In order to control the reaction rate of NCO groups in MDI molecules and OH groups in 4-hydroxybenzophenone molecules, in some preferred embodiments, the MDI is a mixture of 4, 4 '-diphenylmethane diisocyanate and 2, 4' -diphenylmethane diisocyanate in a weight ratio of (0.8-1.2): 1. The activities of NCO groups in molecules of 4, 4 '-diphenylmethane diisocyanate and 2, 4' -diphenylmethane diisocyanate are different, so that the NCO groups can respectively and sequentially react with the photoinitiator and OH groups in the 2-hydroxyethyl acrylate, the reaction process is ensured to be stable and stable, and the obtained high molecular weight photoinitiator has a stable structure.
The 2-hydroxyethyl acrylate not only contains double bonds, but also has OH groups capable of reacting with NCO groups in MDI, so that the molecular weight of the photoinitiator is further improved, and in addition, the 2-hydroxyethyl acrylate also has unsaturated carbon-carbon double bonds capable of carrying out polymerization reaction with acrylic monomers, so that the curing crosslinking cohesion of the pressure-sensitive adhesive is improved, and the cohesiveness is improved.
The preparation method of the high molecular weight photoinitiator comprises the following steps:
preparing equimolar amounts of 4-hydroxybenzophenone, MDI and 2-hydroxyethyl acrylate into 50% toluene solution by mass percent respectively. Adding a toluene solution of MDI into a three-neck flask placed in a constant-temperature water bath at 70-80 ℃, introducing nitrogen for protection, and dropwise adding a toluene solution of 4-hydroxybenzophenone containing dibutyltin dilaurate (accounting for 0.4 percent of the total amount of reactants) at a proper stirring speed. The dropwise addition was completed in about 1 h. Then the temperature is raised by 10 ℃, and the toluene solution of 2-hydroxyethyl acrylate is added dropwise. The dropwise addition was completed in about 1 h. Cooling to room temperature, discharging, and drying to obtain the polymerizable high molecular weight photoinitiator. And placing the synthesized ultraviolet curing agent in a dry closed container to be stored in a dark place.
The preparation method of the acrylic resin comprises the following steps:
according to the weight parts, 70-90 parts of vinyl acetate, 10-20 parts of acrylic acid and 0.1-1 part of high molecular weight photoinitiator are uniformly mixed, polymerization reaction is carried out under the protection of nitrogen, and when the viscosity of a system reaches 400-600 mPa.s, air is introduced to stop the reaction, so that the acrylic resin is obtained.
In order to improve the capability of filling the adhesive surface in the use of the pressure-sensitive adhesive so as to obtain better initial adhesion and peel strength, a reactive diluent with lower glass transition temperature is added. In some preferred embodiments, the reactive diluent comprises one or more of butyl acrylate, isooctyl acrylate, isobutyl acrylate, sec-butyl acrylate, n-propyl acrylate, 2-ethylhexyl acrylate, 2-hydroxypropyl acrylate, lauryl methacrylate, ethyl acrylate. The long side chains of the reactive diluents reduce the interaction between the pressure-sensitive adhesive polymer main chains, thereby playing a role of internal plasticization, and improving the initial adhesiveness of the pressure-sensitive adhesive. Butyl acrylate having a glass transition temperature of-55 ℃ is preferred.
The addition of a reactive diluent with a lower glass transition temperature can increase the initial tack and peel strength of the pressure sensitive adhesive, but can cause the pressure sensitive adhesive to be softer. To ameliorate this problem, vinyl monomers having a higher glass transition temperature are added. In some preferred embodiments, the ethylenic monomer comprises one or more of methyl acrylate, ethyl methacrylate, methyl methacrylate, n-butyl methacrylate, t-butyl acrylate, isobornyl methacrylate, 2-hydroxypropyl methacrylate, vinyl acetate, acrylonitrile, and styrene.
In some preferred embodiments, the glass transition temperature of the vinyl monomer with a high glass transition temperature is lower than 100 ℃, which is beneficial to improving the cohesive strength and the service temperature of the copolymer generated by the vinyl monomer with a high glass transition temperature and the reactive diluent with a low glass transition temperature, thereby avoiding the environmental pollution caused by residual glue because the cohesive force is less than the stripping force and remains on the substrate. In some more preferred embodiments, the high glass transition temperature vinyl monomer is ethyl methacrylate with a glass transition temperature of 65 ℃.
In some more preferred embodiments, the weight ratio of the reactive diluent to the ethylenic monomer is 1:1, and the pressure sensitive adhesive has better initial tack and cohesion.
In order to increase the wettability of the pressure-sensitive adhesive, the adhesive force of the pressure-sensitive adhesive to the surface of the non-polar substance is improved. In some preferred embodiments, the tackifying resin comprises one or more blends of natural resins, such as rosin resins and their derivatives formed by disproportionation or isomerization, polymerization, dimerization or hydrogenation, or terpene resins, petroleum resins. In order to increase the compatibility of the tackifying resin with the acrylate polymer, in some more preferred embodiments, the tackifying resin is selected from hydrogenated rosin resins.
In some preferred embodiments, the softening agent is selected from the group consisting of naphthenic oil, dioctyl phthalate (DOP), dibutyl phthalate (DBP), tricresyl phosphate (TMPP), kerosene, diesel oil, and a blend of one or more of low molecular olefin polymers. In order to improve the plasticity and electrical insulation properties of the pressure sensitive adhesive, in some preferred embodiments, the softening agent is dioctyl phthalate.
In some preferred embodiments, the antioxidant is one or a mixture of several of antioxidant 1010, antioxidant 1076, antioxidant CA and antioxidant 300.
The second aspect of the invention provides a preparation method of a UV-cured hot-melt acrylate pressure-sensitive adhesive, which comprises the following preparation steps:
according to the formula, firstly, acrylic resin, a softening agent, an antioxidant and an active diluent are added into a melt adhesive tank, nitrogen is introduced for protection for 5 minutes, heating and stirring are started, the stirring speed is controlled to be 500-1000 r/min for dispersion and dissolution, when the temperature reaches 100-190 ℃, the temperature is kept for 50-60 minutes to ensure that UV curing hot melt adhesive is completely melted, then tackifying resin and alkene monomers are added, heating is stopped after complete melting and uniform stirring, the mixture is naturally cooled to about 80-150 ℃, and then the UV curing hot melt acrylate pressure-sensitive adhesive is obtained after discharging, and is subpackaged for standby use. The preparation process is carried out in the dark.
The third aspect of the present invention provides an electrical tape, which is prepared from the UV-curable hot-melt acrylate pressure-sensitive adhesive according to any one of claims 1 to 8. The preparation method comprises the following steps:
this was done on a conventional hot melt coater equipped with a UV lamp. Firstly, setting the temperature of a glue melting machine to be 120-160 ℃, and adjusting the ratio of the rotating speed of a glue pump to the speed of a main machine according to the weight of gluing, wherein the ratio is generally 1.5-3.0; mounting the PVC base material on a reel shaft, and leading the PVC base material out to a winding shaft; the hot melt pressure sensitive adhesive can be directly coated after being melted for 1-2 hours, the winding tension and the unwinding tension are set to be 5-10 kg, and the cooling device is opened to cool. And when the coating is started, slowly leaning the coating head against the surface of the substrate, starting a glue pump switch for coating, determining the coating speed, starting a UV lamp switch, setting the UV radiation amount to be 20-100 mJ, and simultaneously winding to obtain the electrical fabric tape product.
The UV-curable crosslinking improves the cohesive force of the electrical tape, so that the electrical tape has excellent electrical and mechanical properties. And a solvent is not needed in the UV curing process, so that the UV curing agent is more environment-friendly.
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Examples
The technical solution of the present invention is described in detail by the following examples, but the scope of the present invention is not limited to the examples.
Example 1
Embodiment 1 provides a UV-curable hot-melt acrylate pressure-sensitive adhesive, which comprises, by weight, 40 parts of an acrylic resin, 30 parts of a tackifying resin, 7 parts of a reactive diluent, 7 parts of an alkene monomer, 6 parts of a softener and 1 part of an antioxidant.
The acrylic resin is polymerized by 80 parts of acrylic acid, 15 parts of vinyl acetate and 0.5 part of initiator.
The photoinitiator is a polymerizable high molecular weight photoinitiator, and the preparation raw materials comprise: 4-hydroxybenzophenone, MDI, 2-hydroxyethyl acrylate. The MDI is the mixture of 4, 4 '-diphenylmethane diisocyanate and 2, 4' -diphenylmethane diisocyanate, and the weight ratio is 1: 1.
The preparation method of the polymerizable high molecular weight photoinitiator comprises the following steps:
preparing equimolar amounts of 4-hydroxybenzophenone, MDI and 2-hydroxyethyl acrylate into 50% toluene solution by mass percent respectively. MDI in toluene was added to a three-necked flask placed in a thermostatic water bath at 75 ℃, nitrogen was introduced for protection, and a toluene solution of 4-hydroxybenzophenone containing dibutyltin dilaurate (0.4% of the total amount of reactants) was added dropwise at an appropriate stirring rate. The dropwise addition was completed in about 1 h. Then the temperature is raised by 10 ℃, and the toluene solution of 2-hydroxyethyl acrylate is added dropwise. The dropwise addition was completed in about 1 h. And cooling to room temperature, discharging, and drying to obtain the polymerizable high molecular weight photoinitiator. The polymerizable high molecular weight photoinitiator is placed in a dry closed container and stored in a dark place.
The preparation method of the acrylic resin comprises the following steps:
according to the weight portion, 80 portions of vinyl acetate, 15 portions of acrylic acid and 0.5 portion of polymerizable high molecular weight photoinitiator are evenly mixed, the mixture is heated to 60 ℃ under the protection of nitrogen for polymerization reaction, and when the viscosity of the system reaches 400 mPa.s-600 mPa.s, air is introduced to stop the reaction, so that the acrylic resin is obtained.
The tackifying resin is hydrogenated rosin resin which is purchased from chemical industry Co., Ltd., of Jinnandong, and is available under the brand name T-110.
The reactive diluent is butyl acrylate, the glass transition temperature is-55 ℃, and the reactive diluent is purchased from Shandong Ju and Biotechnology Co.
The vinyl monomer is ethyl methacrylate, the glass transition temperature is 65 ℃, and the vinyl monomer is purchased from Nantong Runfeng petrochemical company Limited.
The softener is dioctyl phthalate which is purchased from Jiangsu Ke De only chemical engineering Co., Ltd, and is JWD-DOP.
The antioxidant is a mixture of an antioxidant 1010 and an antioxidant 1076, and the weight ratio is 1: 1.
The second aspect of example 1 provides a method for preparing a UV-curable hot-melt acrylate pressure-sensitive adhesive, comprising the steps of:
according to the formula, firstly, acrylic resin, a softening agent, an antioxidant and an active diluent are added into a melt adhesive tank, nitrogen is introduced for protection for 5 minutes, heating and stirring are started, the stirring speed is controlled to be 800r/min for dispersion and dissolution, when the temperature reaches 150 ℃, the temperature is kept for 50-60 minutes to ensure that the UV-cured hot melt adhesive is completely melted, then tackifying resin and alkene monomers are added, the heating is stopped after the complete melting and uniform stirring, the mixture is naturally cooled to about 80 ℃, and then the UV-cured hot melt acrylate pressure-sensitive adhesive is obtained by discharging and subpackaging for later use. The preparation process is protected from light.
The third aspect of example 1 provides an electrical tape, which is prepared from the UV curable hot melt acrylate pressure sensitive adhesive according to any one of claims 1 to 8. The preparation method comprises the following steps:
this was done on a conventional hot melt coater equipped with a UV lamp. Firstly, setting the temperature of a melt adhesive machine at 130 ℃, and adjusting the ratio of the rotating speed of a glue pump to the speed of a host machine to 2.0; mounting the PVC base material on a reel shaft, and leading the PVC base material out to a winding shaft; when the hot-melt pressure-sensitive adhesive is melted for 1.5 hours, the hot-melt pressure-sensitive adhesive can be directly coated, the winding tension and the unwinding tension are set to be 8 kilograms, and the cooling device is opened for cooling. And when the coating is started, slowly leaning the coating head against the surface of the substrate, opening a glue pump switch for coating, determining the coating speed, opening a UV lamp switch, setting the UV radiation amount to be 50 mJ, and simultaneously winding to obtain the electrical fabric tape.
Example 2
Similarly to example 1, a UV-curable hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared therefrom are provided, but the raw materials for preparing the UV-curable hot-melt acrylate pressure-sensitive adhesive comprise, by weight, 20 parts of an acrylic resin, 20 parts of a tackifying resin, 2 parts of a reactive diluent, 2 parts of an alkene monomer, 2 parts of a softener, and 0.1 part of an antioxidant.
Example 3
Similarly to example 1, a UV-curable hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared therefrom are provided, but the raw materials for preparing the UV-curable hot-melt acrylate pressure-sensitive adhesive comprise, by weight, 60 parts of an acrylic resin, 40 parts of a tackifying resin, 15 parts of a reactive diluent, 15 parts of an alkene monomer, 10 parts of a softener, and 2 parts of an antioxidant.
Comparative example 1
Similarly to example 1, a UV-curable hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared therefrom are provided, but the raw materials for preparing the UV-curable hot-melt acrylate pressure-sensitive adhesive comprise, by weight, 40 parts of an acrylic resin, 30 parts of a tackifying resin, 0 part of a reactive diluent, 7 parts of an alkene monomer, 6 parts of a softener, and 1 part of an antioxidant.
Comparative example 2
Similarly to example 1, a UV-curable hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared therefrom are provided, but the raw materials for preparing the UV-curable hot-melt acrylate pressure-sensitive adhesive comprise, by weight, 40 parts of an acrylic resin, 30 parts of a tackifying resin, 7 parts of a reactive diluent, 0 part of an alkene monomer, 6 parts of a softener, and 1 part of an antioxidant.
Comparative example 3
Similarly to example 1, a UV-curable hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared therefrom are provided, but in the preparation of a polymerizable high molecular weight photoinitiator, MDI is 4, 4' -diphenylmethane diisocyanate.
Comparative example 4
Similarly to example 1, a UV-curable hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared therefrom are provided, but in the preparation of a polymerizable high molecular weight photoinitiator, MDI is 2, 4' -diphenylmethane diisocyanate.
Comparative example 5
Similarly to example 1, a UV-curable hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared by the same are provided, but the content of the 2-hydroxyethyl acrylate in the raw materials for preparing the polymerizable high molecular weight photoinitiator is 0.
Comparative example 6
Similarly to example 1, a UV-curable hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared therefrom were provided, but in the raw material for preparing the acrylic resin, the acrylic acid content was 0.
Comparative example 7
Similarly to example 1, a UV-curable hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared therefrom were provided, except that the vinyl monomer content in the raw material for preparing the acrylic resin was 0.
Comparative example 8
Similarly to example 1, a UV-curable hot-melt acrylate pressure-sensitive adhesive and an electrical tape prepared therefrom were provided, the tackifying resin content being rosin resin, available from shanghai Chuanzhen chemical Co., Ltd.
Evaluation of Performance
The electrical tape prepared in the examples 1 to 3 and the comparative examples 1 to 8 was tested for each performance technical index according to the following test method:
1. initial tack test: according to the GB-T2794 test method, the larger the number of the steel ball is, the higher the initial viscosity is, the ball number is more than 15, the steel ball is marked as qualified, otherwise, the steel ball is marked as unqualified, and the result is recorded in the table 1.
2. 180 ° peel strength test: the test was carried out using a bench-top tensile tester according to GB/T2792-2014, and the results are reported in Table 1.
3. Tack-holding test: the test was carried out according to GB/T4851-2014 using a tape retention tester, and the results are reported in Table 1.
TABLE 1
The embodiments 1 to 3 and the comparative examples 1 to 8 show that the pressure-sensitive adhesive and the electrical tape prepared from the same have excellent initial viscosity, peeling strength and permanent viscosity, and the problems of photoinitiator residue, easy migration and volatilization of photolytic fragments, easy aging and yellowing of cured products, easy odor and toxicity and the like are solved because the acrylic resin in the pressure-sensitive adhesive is obtained by prepolymerization of a polymerizable macromolecular photoinitiator.
Finally, it should be understood that the above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The UV-cured hot-melt acrylate pressure-sensitive adhesive is characterized in that: the preparation raw materials comprise, by weight, 20-60 parts of acrylic resin, 20-40 parts of tackifying resin, 2-15 parts of reactive diluent, 2-15 parts of alkene monomer, 2-10 parts of softener and 0.1-2.0 parts of antioxidant.
2. The UV-curable hot-melt acrylate pressure-sensitive adhesive according to claim 1, wherein: the raw materials for preparing the acrylic resin comprise acrylic acid, vinyl monomers and a photoinitiator.
3. The UV-curable hot-melt acrylate pressure-sensitive adhesive according to claim 2, wherein: the photoinitiator is a polymerizable high molecular weight photoinitiator, and the preparation raw materials comprise 4-hydroxybenzophenone, MDI and 2-hydroxyethyl acrylate.
4. The UV-curable hot-melt acrylate pressure-sensitive adhesive according to claim 3, wherein: the MDI is the mixture of 4, 4 '-diphenylmethane diisocyanate and 2, 4' -diphenylmethane diisocyanate, and the weight ratio is (0.8-1.2): 1.
5. The UV-curable hot-melt acrylate pressure-sensitive adhesive according to claim 1, wherein: the active diluent comprises one or more of butyl acrylate, isooctyl acrylate, isobutyl acrylate, sec-butyl acrylate, n-propyl acrylate, 2-ethylhexyl acrylate, 2-hydroxypropyl acrylate, lauryl methacrylate and ethyl acrylate.
6. The UV-curable hot-melt acrylate pressure-sensitive adhesive according to claim 1, wherein: the vinyl monomer comprises one or more of methyl acrylate, ethyl methacrylate, methyl methacrylate, n-butyl methacrylate, tert-butyl acrylate, isobornyl methacrylate, 2-hydroxypropyl methacrylate, vinyl acetate, acrylonitrile and styrene.
7. The UV-curable hot-melt acrylate pressure-sensitive adhesive according to claim 1, wherein: the tackifying resin comprises one or a mixture of rosin resin, rosin resin derivatives, terpene resin and petroleum resin.
8. The UV-curable hot-melt acrylate pressure-sensitive adhesive according to claim 7, wherein the rosin resin is a hydrogenated rosin resin.
9. A method for preparing a UV-curable hot-melt acrylate pressure sensitive adhesive according to any one of claims 1 to 8, comprising the steps of:
according to the formula, acrylic resin, a softening agent, an antioxidant and an active diluent are added into a melt adhesive tank, nitrogen is introduced for protection, heating and stirring are started for dispersion and dissolution, so that UV-cured hot melt adhesive is completely melted, then tackifying resin and vinyl monomers are added, heating is stopped after complete melting and uniform stirring, the mixture is naturally cooled to about 80-150 ℃, and then the UV-cured hot melt acrylate pressure-sensitive adhesive is obtained after discharging.
10. An electrical tape, characterized in that the raw material for preparation comprises the UV-curable hot-melt acrylate pressure-sensitive adhesive according to any one of claims 1 to 8.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113061409A (en) * | 2021-04-19 | 2021-07-02 | 昆山石梅新材料科技有限公司 | Acrylic adhesive resin and preparation method and application thereof |
| CN113801609A (en) * | 2021-10-14 | 2021-12-17 | 常州邦瑞新材料科技有限公司 | Nanometer hot melt adhesive for automotive upholstery and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0183386A2 (en) * | 1984-10-26 | 1986-06-04 | Sartomer Company, Inc. | Acrylic hot melt pressure sensitive adhesive compounds |
| CN102127173A (en) * | 2010-12-22 | 2011-07-20 | 哈尔滨工业大学 | High-polymer ultraviolet light initiator and preparation method thereof |
| CN104927697A (en) * | 2015-03-04 | 2015-09-23 | 河北华夏实业有限公司 | Automotive wire harness cloth-based adhesive tape manufactured with UV-curable hot-melt pressure-sensitive adhesive, and manufacturing technology thereof |
| CN105859551A (en) * | 2016-05-08 | 2016-08-17 | 南昌航空大学 | Method for preparing polymerizable photoinitiators |
| CN107201180A (en) * | 2017-06-09 | 2017-09-26 | 无锡市万力粘合材料股份有限公司 | Ultraviolet curing acrylic ester hot-fusible pressure-sensitive adhesive and preparation method thereof |
-
2020
- 2020-12-02 CN CN202011402884.5A patent/CN112480831A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0183386A2 (en) * | 1984-10-26 | 1986-06-04 | Sartomer Company, Inc. | Acrylic hot melt pressure sensitive adhesive compounds |
| CN102127173A (en) * | 2010-12-22 | 2011-07-20 | 哈尔滨工业大学 | High-polymer ultraviolet light initiator and preparation method thereof |
| CN104927697A (en) * | 2015-03-04 | 2015-09-23 | 河北华夏实业有限公司 | Automotive wire harness cloth-based adhesive tape manufactured with UV-curable hot-melt pressure-sensitive adhesive, and manufacturing technology thereof |
| CN105859551A (en) * | 2016-05-08 | 2016-08-17 | 南昌航空大学 | Method for preparing polymerizable photoinitiators |
| CN107201180A (en) * | 2017-06-09 | 2017-09-26 | 无锡市万力粘合材料股份有限公司 | Ultraviolet curing acrylic ester hot-fusible pressure-sensitive adhesive and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113061409A (en) * | 2021-04-19 | 2021-07-02 | 昆山石梅新材料科技有限公司 | Acrylic adhesive resin and preparation method and application thereof |
| CN113801609A (en) * | 2021-10-14 | 2021-12-17 | 常州邦瑞新材料科技有限公司 | Nanometer hot melt adhesive for automotive upholstery and preparation method thereof |
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Address after: 512000 chlor alkali characteristic industrial base of hougongdu Economic Development Zone, Rucheng Town, Ruyuan County, Shaoguan City, Guangdong Province Applicant after: Guangdong Shuocheng Technology Co.,Ltd. Address before: 512000 chlor alkali characteristic industrial base of hougongdu Economic Development Zone, Rucheng Town, Ruyuan County, Shaoguan City, Guangdong Province Applicant before: GUANGDONG SHUOCHENG TECHNOLOGY Co.,Ltd. |
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Application publication date: 20210312 |