CN112449550B - Heat radiator utilizing phase change heat transfer - Google Patents

Abstract

The present invention relates to a heat dissipation device utilizing phase change heat transfer, comprising a box body, a heat conducting block, a working fluid and a heat transfer component. The box body comprises a first shell plate and a second shell plate, a cavity is enclosed between the first shell plate and the second shell plate, and the first shell plate is provided with a through hole; the heat conducting block is installed corresponding to the through hole and a part of the area is formed inside the cavity, and another part of the area is exposed outside the first shell plate; the working fluid is arranged in the cavity and in contact with the heat conducting block; the heat transfer component has a heat receiving section, which is installed in the cavity and used to absorb the heat brought by the working fluid after the phase change. In this way, the heat dissipation efficiency of the overall device can be improved.

Description

Heat dissipation device using phase change heat transfer

Technical Field

The present invention relates to a heat dissipation device technology, in particular to a heat dissipation device utilizing phase change heat transfer.

Background Art

As the computing speed of electronic components continues to increase, the heat generated is also increasing. In order to effectively solve the problem of high heat generation, the industry has combined a vapor chamber or heat pipe with good thermal conductivity with other heat dissipation components into a heat dissipation device for use. However, there is room for improvement in the existing heat dissipation devices in terms of thermal conductivity and heat dissipation performance.

The existing heat dissipation device mainly includes a temperature averaging plate and a heat dissipation fin group. The heat dissipation fin group is bonded to one end surface of the temperature averaging plate by surface adhesive technology, and a capillary structure and a working fluid are respectively installed in the inner space of the temperature averaging plate.

However, although the existing heat dissipation device has a heat dissipation effect, it has the following problems in actual use. Since the temperature equalizer plate conducts heat quickly through the phase change of the internal working fluid, when this heat reaches the heat dissipation fin group, the heat dissipation efficiency of the heat dissipation fin group is much lower than the heat conduction rate of the working fluid, so it will cause heat accumulation and other undesirable conditions between the temperature equalizer plate and the heat dissipation fin group, thereby making the heat dissipation efficiency of the entire heat dissipation device poor.

In view of this, the inventor has focused on the defects of the above-mentioned prior art, conducted intensive research and applied theoretical knowledge to try his best to solve the above-mentioned technical problems, which has become the goal of the inventor's improvement.

Summary of the invention

One of the purposes of the present invention is to provide a heat dissipation device utilizing phase change heat transfer, which can quickly and massively conduct heat to a heat transfer component through the phase change of a working fluid after being heated, thereby improving the heat dissipation efficiency of the entire device.

In order to achieve the above-mentioned purpose, the present invention provides a heat dissipation device using phase change heat transfer, including a box body, a heat conductive block, a working fluid and a heat transfer component, the box body includes a first shell plate and a second shell plate corresponding to the first shell plate sealing cover, a cavity is surrounded between the first shell plate and the second shell plate, and the first shell plate is provided with a through hole; the heat conductive block is installed corresponding to the through hole, a part of the heat conductive block is formed inside the cavity, and another part of the heat conductive block is exposed to the outside of the first shell plate; the working fluid is arranged in the cavity and contacts the heat conductive block; the heat transfer component has a heat receiving section, the heat receiving section is installed in the cavity and is used to absorb the heat brought by the working fluid after the phase change.

Preferably, the heat dissipation device utilizing phase change heat transfer further comprises a heat dissipation module, the heat transfer component is a heat pipe, the heat pipe further comprises a heat release section extending from the heated section, the heat release section is formed on the outside of the box body, and the heat dissipation module is sleeved on the heat release section.

Preferably, the heat dissipation device utilizing phase change heat transfer also includes a heat dissipation module, the heat transfer component is a metal tube, the heat dissipation module includes two infusion tubes, a water pump and a water-cooling radiator, the two ends of one of the infusion tubes are respectively connected to one end of the metal tube and the water-cooling radiator, the two ends of the other infusion tube are respectively connected to the other end of the metal tube and the water-cooling radiator, and the water pump is installed on any of the infusion tubes.

Preferably, the heat dissipation module further includes a heat dissipation fan, and the heat dissipation fan is installed on the side of the water cooling radiator.

Preferably, the amount of the working fluid is limited to the heat receiving section which does not contact the heat transfer member.

Preferably, the first shell plate comprises a bottom plate and a surrounding plate extending and bending from the periphery of the bottom plate, an annular frame extends from the bottom plate, and the through hole is formed at the center position of the annular frame.

Preferably, the heat conductive block comprises a block body and a flat plate extending from one end of the block body, the block body is connected to and penetrates the through hole, and the flat plate is stopped on the end surface of the annular frame.

Preferably, an annular groove is provided on the top surface of the annular frame, a sealing ring is installed in the annular groove, and the sealing ring is clamped between the annular frame and the flat plate.

Preferably, two through holes are formed on the side of the enclosure away from the annular frame, a U-shaped fixing frame is formed on one side of the annular frame, the heated section is composed of two tubes bent in parallel, one end of the heated section is arranged in the U-shaped fixing frame and fixed by a pressure plate, and the rest of the heated section bypasses the outer periphery of the annular frame and passes through each of the through holes to the outside of the first shell plate.

Preferably, the top surface of the enclosure plate is provided with an annular groove, a sealing gasket is installed in the annular groove, and the sealing gasket is clamped between the first shell plate and the second shell plate.

The present invention also has the following effects: the heating section is composed of two parallel bent tubes and bypasses the outer periphery of the annular frame, so that the heating area of the heating section can be increased and the heat conduction efficiency can be improved. The sealing effect of the heat conducting block and the first shell plate and the first shell plate and the second shell plate can be improved by setting the sealing pad and the sealing ring. The heat dissipation device of the present invention can be used regardless of whether the display card module is arranged vertically or horizontally.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a three-dimensional exploded view of a heat dissipation device utilizing phase change heat transfer according to the present invention.

FIG. 2 is a perspective view of a heat dissipation device assembly utilizing phase change heat transfer according to the present invention.

FIG3 is a cross-sectional view of a heat dissipation device assembly utilizing phase change heat transfer according to the present invention.

FIG. 4 is a cross-sectional view of the heat dissipation device utilizing phase change heat transfer according to the present invention in another direction.

FIG. 5 is a schematic diagram of the present invention applied to a vertical display card module assembly.

FIG. 6 is a cross-sectional view of the present invention applied to a vertical display card module assembly.

FIG. 7 is a cross-sectional view of the present invention applied to a horizontal display card module assembly.

FIG. 8 is a schematic diagram of another embodiment of the present invention applied to a vertical display card module assembly.

Among them, 10, box body; 11, first shell plate; 111, bottom plate; 112, enclosure; 113, annular frame; 114, through hole; 115, annular groove; 116, U-shaped fixing frame; 117, through hole 118, annular groove; 119, screw hole; 12, second shell plate; 121, through hole; 13, sealing gasket; A, cavity; 20, heat conductive block; 21, block; 22, flat plate; 23, sealing ring; 30, working fluid; 40, 40A, heat transfer component; 41, heating section; 42, heat release section; 43, pressure plate; 50, 50A, heat dissipation module; 51, heat dissipation fins; 52, infusion tube; 53, water pump; 54, water cooling radiator; 55, cooling fan; 8, display card module.

DETAILED DESCRIPTION

The detailed description and technical contents of the present invention are described as follows in conjunction with the accompanying drawings. However, the accompanying drawings are only provided for reference and description and are not intended to limit the present invention.

1 to 4 , the present invention provides a heat dissipation device utilizing phase change heat transfer, which mainly includes a box body 10 , a heat conductive block 20 , a working fluid 30 and a heat transfer component 40 .

The box body 10 includes a first shell plate 11 and a second shell plate 12. The first shell plate 11 and the second shell plate 12 can be made of materials such as aluminum, copper or their alloys. The first shell plate 11 has a bottom plate 111 and a surrounding plate 112 bent and extended from the periphery of the bottom plate 111. An annular frame 113 extends from the left side of the bottom plate 111. A through hole 114 is provided in the center of the annular frame 113, and an annular groove 115 is provided on the top surface of the annular frame 113.

Furthermore, a U-shaped fixing frame 116 is formed on the left side of the annular frame 113. Two through holes 117 are formed on the side of the enclosure 112 away from the annular frame 113, and an annular groove 118 is formed on the top surface of the enclosure 112. Furthermore, a plurality of screw holes 119 are respectively formed at the four corners and the middle of the enclosure 112.

The second shell plate 12 is a cover corresponding to the first shell plate 11 , and a cavity A is enclosed between the first shell plate 11 and the second shell plate 12 . Through holes 121 are respectively formed at positions of the second shell plate 12 corresponding to the aforementioned screw holes 119 .

Furthermore, a sealing gasket 13 is installed in the annular groove 118. The sealing gasket 13 is clamped between the first shell plate 11 and the second shell plate 12. A through hole 121 is penetrated by a screw or other screw-fastening element and the screw hole 119 is locked, thereby achieving a sealed combination of the first shell plate 11 and the second shell plate 12.

The heat conductive block 20 is made of a material with good thermal conductivity such as copper or its alloy. The heat conductive block 20 of this embodiment mainly includes a block body 21 and a flat plate 22 extending outward from each side of one end of the block body 21. The block body 21 is connected to the aforementioned through hole 114, and the flat plate 22 is stopped on the end surface of the annular frame 113. A sealing ring 23 is installed at a position corresponding to the aforementioned annular groove 115. The sealing ring 23 is clamped between the annular frame 113 and the flat plate 22; wherein the flat plate 22 is formed inside the cavity A, and the end of the block body 21 away from the flat plate 22 is exposed to the outside of the first shell plate 11.

The working fluid 30 may be a liquid such as pure water (as shown in FIG. 6 ), which is injected into the cavity A and contacts the flat plate 22 of the heat conducting block 20 .

The heat transfer component 40 of this embodiment is a heat pipe, which has a heat receiving section 41 and a heat releasing section 42 extending from the heat receiving section 41. There are capillary structures and working fluid inside the heat pipe. The heat receiving section 41 is installed in the cavity A and is used to absorb the heat brought by the working fluid 30 after the phase change. The heat receiving section 41 of this embodiment is composed of two parallel bent tubes, and its closed end is placed in the aforementioned U-shaped fixing frame 116 and is locked and fixed by a pressing plate 43 and two screws. The rest of the heat receiving section 41 bypasses the outer periphery of the annular frame 113 and passes through the first shell plate 11 from the through hole 117. The area formed outside the first shell plate 11 constitutes the aforementioned heat releasing section 42.

Please refer to Figures 5 and 6. The heat dissipation device using phase change heat transfer of the present invention can be applied to the heat dissipation of the display card module 8, which also includes a heat dissipation module 50. The heat dissipation module 50 of this embodiment is composed of a plurality of heat dissipation fins 51 stacked together, and each heat dissipation fin 51 is sequentially sleeved on the aforementioned heat release section 42.

When assembled, the box body 10 is vertically arranged on the side of the display card module 8, and the end surface of the block 21 of the heat conductive block 20 is attached to the heat source of the display card module 8. The display card module 8 of this embodiment is arranged vertically, and the amount of the working fluid 30 is limited to the heat receiving section 41 that does not contact the heat transfer component 40.

When in use, when the heat source of the display card module 8 is in operation, high temperature and heat will be generated. Such high heat will be transferred to the liquid working fluid 30 through the heat conductive block 20. After continuously receiving a large amount of heat, the liquid working fluid 30 will evaporate and form a vapor working fluid 30. This vapor working fluid 30 moves toward the heat receiving section 41 of the heat transfer component 40 with a large amount of heat value. After absorbing the heat brought by the working fluid 30 after the phase change, the heating section 41 also changes the working fluid inside from liquid to vapor, and brings the heat to the heat releasing section 42, so as to achieve a secondary rapid heat conduction performance.

Please refer to FIG. 7 . In addition to being arranged vertically as described above, the display card module 8 can also be arranged horizontally to meet various usage requirements. The amount of the working fluid 30 is also limited to the heating section 41 that does not contact the heat transfer component 40 .

Please refer to FIG. 8 . The heat dissipation device utilizing phase change heat transfer of the present invention can be configured as in the above-mentioned embodiment or in the present embodiment, wherein the heat transfer member 40A is a metal tube, and the metal tube also has a heat receiving section 41 . The heat dissipation module 50A mainly includes two infusion pipes 52, a water pump 53, a water cooling radiator 54, a heat dissipation fan 55 and a coolant (not shown in the figure). The two ends of one infusion pipe 52 are respectively connected to a tube body of the heat transfer component 40A and a water inlet of the water cooling radiator 54, and the two ends of the other infusion pipe 52 are respectively connected to another tube body of the heat transfer component 40A and a water outlet of the water cooling radiator 54. The water pump 53 is installed on the infusion pipe 52, and the heat dissipation fan 55 is installed on the side of the water cooling radiator 54. The coolant is filled in the metal pipe, the infusion pipe 52 and the water cooling radiator 54. When the heat receiving section 41 absorbs the heat brought by the phase change of the working fluid 30, the heat of the heat receiving section 41 is taken away through the operation of the water pump 53, and is dissipated and discharged by the water cooling radiator 54 and the heat dissipation fan 55.

In summary, the heat dissipation device using phase change heat transfer of the present invention can achieve the expected purpose of use and solve the problems existing in the prior art.

Claims (8)

1. A heat sink utilizing phase change heat transfer, comprising:

The box body comprises a first shell plate and a second shell plate corresponding to the sealing cover of the first shell plate, a containing cavity is formed between the first shell plate and the second shell plate in a surrounding mode, and a through hole is formed in the first shell plate;

The heat conducting block is arranged corresponding to the through hole, one part of the area of the heat conducting block is formed inside the containing cavity, and the other part of the area of the heat conducting block exposes out of the first shell plate;

a working fluid disposed in the cavity and in contact with the thermally conductive block; and

The heat transfer component is provided with a heated section which is arranged in the accommodating cavity and used for absorbing heat carried by the working fluid after phase change;

The first shell plate is provided with a bottom plate and a coaming which is bent and extended from the periphery of the bottom plate, an annular frame is extended on the bottom plate, and the through hole is formed in the central position of the annular frame;

two through holes are formed in one side, away from the annular frame, of the coaming, a U-shaped fixing frame is formed in one side of the annular frame, the heated section is formed by two parallel bent pipe bodies, one end of the heated section is arranged in the U-shaped fixing frame and is fixed through a pressing plate, the other parts of the heated section bypass the periphery of the annular frame and penetrate out of the first shell plate from the through holes.

2. The heat dissipating device utilizing phase change heat transfer of claim 1 further comprising a heat dissipating module, wherein the heat transfer member is a heat pipe, the heat pipe further comprising a heat release section extending from the heat receiving section, the heat release section being formed outside the case, the heat dissipating module being sleeved on the heat release section.

3. The heat dissipating device utilizing phase change heat transfer as set forth in claim 1, further comprising a heat dissipating module, wherein the heat transfer member is a metal tube, the heat dissipating module comprises two infusion tubes, a water pump and a water cooling row, wherein two ends of one of the infusion tubes are respectively communicated with one end of the metal tube and the water cooling row, two ends of the other infusion tube are respectively communicated with the other end of the metal tube and the water cooling row, and the water pump is mounted on any one of the infusion tubes.

4. The heat dissipating device utilizing phase change heat transfer as recited in claim 3 wherein said heat dissipating module further comprises a heat dissipating fan mounted on a side of said water cooled row.

5. The heat sink utilizing phase change heat transfer as set forth in claim 1, wherein the amount of said working fluid in the liquid state is limited to not contacting said heated section of said heat transfer member.

6. The heat dissipating device utilizing phase change heat transfer as set forth in claim 1, wherein said heat conducting block comprises a block body and a flat plate extending from one end of said block body, said block body being penetrated corresponding to said through hole, said flat plate being stopped on an end face of said annular frame.

7. The heat sink for heat transfer using phase change as claimed in claim 6, wherein the top surface of the annular frame is provided with an annular groove, and the annular groove is provided with a sealing ring, and the sealing ring is clamped between the annular frame and the flat plate.

8. The heat dissipating device utilizing phase change heat transfer of claim 1 wherein the top surface of said coaming is provided with an annular groove, a gasket is provided in said annular groove, and said gasket is sandwiched between said first shell plate and said second shell plate.