CN112449035B - Electronic equipment - Google Patents
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- CN112449035B CN112449035B CN201910819064.7A CN201910819064A CN112449035B CN 112449035 B CN112449035 B CN 112449035B CN 201910819064 A CN201910819064 A CN 201910819064A CN 112449035 B CN112449035 B CN 112449035B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
- H04W4/80—Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
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Abstract
本申请实施例提供一种电子设备,包括:近场通信芯片,用于提供差分激励电流;接地平面,形成有导电路径;导体结构;电容传感器,所述电容传感器包括第一极板;所述导体结构、所述导电路径以及所述第一极板共同形成供所述差分激励电流传输的导电回路。所述电子设备中,由于所述导体结构、所述第一极板可以根据电子设备内部空间设计的需求,分别设置在电子设备的不同部位,进而通过所述接地平面上形成的导电路径连接形成回路,从而可以通过电子设备不同部位的导体结构和电容传感器配合接地平面来实现NFC天线的设计,因此可以复用电容传感器的极板作为NFC天线,不仅可以节省NFC天线的占用空间,而且使得NFC天线的布局可以更灵活。
An embodiment of the present application provides an electronic device, including: a near-field communication chip, configured to provide a differential excitation current; a ground plane, formed with a conductive path; a conductor structure; a capacitive sensor, the capacitive sensor includes a first plate; The conductor structure, the conductive path and the first plate jointly form a conductive loop for transmission of the differential excitation current. In the electronic device, due to the conductor structure and the first plate can be respectively arranged in different parts of the electronic device according to the requirements of the internal space design of the electronic device, and then connected by the conductive path formed on the ground plane to form a loop, so that the design of the NFC antenna can be realized through the conductor structure of different parts of the electronic device and the capacitive sensor with the ground plane, so the polar plate of the capacitive sensor can be reused as the NFC antenna, which can not only save the space occupied by the NFC antenna, but also make the NFC The layout of the antenna can be more flexible.
Description
技术领域technical field
本申请涉及电子技术领域,特别涉及一种电子设备。The present application relates to the field of electronic technology, in particular to an electronic device.
背景技术Background technique
随着通信技术的发展,诸如智能手机等电子设备能够实现的功能越来越多,电子设备的通信模式也更加多样化。例如,通常的电子设备可以支持蜂窝网络通信、无线保真(Wireless Fidelity,Wi-Fi)通信、全球定位系统(Global Positioning System,GPS)通信、蓝牙(Bluetooth,BT)通信等多种通信模式。此外,随着通信技术的进步,近来电子设备逐渐可以实现近场通信(Near Field Communication,NFC)。With the development of communication technology, electronic devices such as smart phones can realize more and more functions, and the communication modes of electronic devices are also more diversified. For example, a common electronic device may support various communication modes such as cellular network communication, Wireless Fidelity (Wi-Fi) communication, Global Positioning System (Global Positioning System, GPS) communication, Bluetooth (Bluetooth, BT) communication, and the like. In addition, with the advancement of communication technology, electronic devices can gradually realize Near Field Communication (NFC) recently.
而另一方面,伴随着电子技术的发展,电子设备越来越小型化、轻薄化,电子设备的内部空间也越来越小,各种通信系统的天线以及诸如传感器等电子器件占用了电子设备中大量的内部空间。从而,如何合理地设计电子设备的NFC天线成为了难题。On the other hand, with the development of electronic technology, electronic equipment is becoming more and more miniaturized and thinner, and the internal space of electronic equipment is also getting smaller and smaller. Antennas of various communication systems and electronic devices such as sensors occupy a lot of space in electronic equipment. Lots of interior space. Therefore, how to reasonably design the NFC antenna of the electronic device has become a difficult problem.
发明内容Contents of the invention
本申请实施例提供一种电子设备,可以节省电子设备中NFC天线的占用空间,并且NFC天线的布局可以更灵活。The embodiment of the present application provides an electronic device, which can save the space occupied by the NFC antenna in the electronic device, and the layout of the NFC antenna can be more flexible.
本申请实施例提供一种电子设备,包括:An embodiment of the present application provides an electronic device, including:
近场通信芯片,包括第一差分信号端和第二差分信号端,所述第一差分信号端和所述第二差分信号端用于提供差分激励电流;A near-field communication chip, including a first differential signal terminal and a second differential signal terminal, the first differential signal terminal and the second differential signal terminal are used to provide a differential excitation current;
接地平面,包括间隔设置的第一接地点和第二接地点,所述接地平面在所述第一接地点和所述第二接地点之间形成导电路径;a ground plane, including a first ground point and a second ground point arranged at intervals, and the ground plane forms a conductive path between the first ground point and the second ground point;
导体结构,包括间隔设置的第一馈电端和第一接地端,所述第一馈电端与所述第一差分信号端电连接,所述第一接地端与所述第一接地点电连接;The conductor structure includes a first feeding end and a first grounding end arranged at intervals, the first feeding end is electrically connected to the first differential signal end, and the first grounding end is electrically connected to the first grounding point. connect;
电容传感器,用于检测外部导体的距离,所述电容传感器包括第一极板,所述第一极板包括间隔设置的第二馈电端和第二接地端,所述第二馈电端与所述第二差分信号端电连接,所述第二接地端与所述第二接地点电连接;A capacitive sensor, used to detect the distance of the external conductor, the capacitive sensor includes a first pole plate, and the first pole plate includes a second feeding terminal and a second grounding terminal arranged at intervals, and the second feeding terminal and The second differential signal terminal is electrically connected, and the second ground terminal is electrically connected to the second ground point;
其中,所述导体结构、所述导电路径以及所述第一极板共同形成供所述差分激励电流传输的导电回路。Wherein, the conductor structure, the conductive path and the first plate jointly form a conductive loop for the transmission of the differential excitation current.
本申请实施例提供的电子设备,通过设置导体结构以及复用电容传感器的第一极板,并将所述导体结构和所述第一极板连接到同一接地平面的两个不同接地点,并利用两个接地点之间的地平面形成导电路径,从而可以通过所述导体结构、所述第一极板以及所述导电路径形成供NFC差分激励电流传输的导电回路。由于所述导体结构、所述第一极板可以根据电子设备内部空间设计的需求,分别设置在电子设备的不同部位,进而通过所述接地平面上形成的导电路径连接形成回路,从而可以通过电子设备不同部位的导体结构和电容传感器配合接地平面来实现NFC天线的设计,因此可以复用电容传感器的极板作为NFC天线,不仅可以节省NFC天线的占用空间,而且使得NFC天线的布局可以更灵活。In the electronic device provided in the embodiment of the present application, by setting the conductor structure and the first plate of the multiplexing capacitive sensor, and connecting the conductor structure and the first plate to two different ground points of the same ground plane, and The ground plane between the two ground points is used to form a conductive path, so that a conductive loop for NFC differential excitation current transmission can be formed through the conductor structure, the first plate and the conductive path. Since the conductor structure and the first plate can be arranged in different parts of the electronic device according to the requirements of the internal space design of the electronic device, and then connected to form a circuit through the conductive path formed on the ground plane, the electronic The conductor structure of different parts of the device and the capacitive sensor cooperate with the ground plane to realize the design of the NFC antenna, so the plate of the capacitive sensor can be reused as the NFC antenna, which not only saves the space occupied by the NFC antenna, but also makes the layout of the NFC antenna more flexible .
附图说明Description of drawings
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative efforts.
图1为本申请实施例提供的电子设备的第一种结构示意图。FIG. 1 is a schematic diagram of a first structure of an electronic device provided by an embodiment of the present application.
图2为本申请实施例提供的电子设备的第二种结构示意图。FIG. 2 is a schematic diagram of a second structure of an electronic device provided by an embodiment of the present application.
图3为本申请实施例提供的电子设备中天线装置的设置示意图。Fig. 3 is a schematic diagram of setting an antenna device in an electronic device according to an embodiment of the present application.
图4为本申请实施例提供的电子设备的第三种结构示意图。FIG. 4 is a schematic diagram of a third structure of an electronic device provided by an embodiment of the present application.
图5为本申请实施例提供的电子设备的第四种结构示意图。FIG. 5 is a schematic diagram of a fourth structure of an electronic device provided by an embodiment of the present application.
图6为本申请实施例提供的电子设备的第五种结构示意图。FIG. 6 is a schematic diagram of a fifth structure of an electronic device provided by an embodiment of the present application.
图7为本申请实施例提供的电子设备的第六种结构示意图。FIG. 7 is a schematic diagram of a sixth structure of an electronic device provided by an embodiment of the present application.
图8为本申请实施例提供的电子设备的第七种结构示意图。FIG. 8 is a schematic diagram of a seventh structure of an electronic device provided by an embodiment of the present application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.
本申请实施例提供一种电子设备。所述电子设备可以是智能手机、平板电脑等设备,还可以是游戏设备、AR(Augmented Reality,增强现实)设备、汽车装置、数据存储装置、音频播放装置、视频播放装置、笔记本电脑、桌面计算设备等。An embodiment of the present application provides an electronic device. The electronic equipment can be devices such as smart phones and tablet computers, and can also be game equipment, AR (Augmented Reality, augmented reality) equipment, automotive equipment, data storage devices, audio playback devices, video playback devices, notebook computers, desktop computing devices, etc. equipment etc.
参考图1,图1为本申请实施例提供的电子设备100的第一种结构示意图。Referring to FIG. 1 , FIG. 1 is a schematic diagram of a first structure of an
电子设备100包括显示屏10、壳体20、电路板30以及电池40。The
其中,显示屏10设置在壳体20上,以形成电子设备100的显示面,用于显示图像、文本等信息。其中,显示屏10可以包括液晶显示屏(Liquid Crystal Display,LCD)或有机发光二极管显示屏(Organic Light-Emitting Diode,OLED)等类型的显示屏。Wherein, the
可以理解的,显示屏10可以包括显示面以及与所述显示面相对的非显示面。所述显示面为所述显示屏10朝向用户的表面,也即所述显示屏10在电子设备100上用户可见的表面。所述非显示面为所述显示屏10朝向电子设备100内部的表面。其中,所述显示面用于显示信息,所述非显示面不显示信息。It can be understood that the
可以理解的,显示屏10上还可以设置盖板,以对显示屏10进行保护,防止显示屏10被刮伤或者被水损坏。其中,所述盖板可以为透明玻璃盖板,从而用户可以透过盖板观察到显示屏10显示的内容。可以理解的,所述盖板可以为蓝宝石材质的玻璃盖板。It can be understood that a cover plate may also be provided on the
壳体20用于形成电子设备100的外部轮廓,以便于容纳电子设备100的电子器件、功能组件等,同时对电子设备内部的电子器件和功能组件形成密封和保护作用。例如,电子设备100的摄像头、电路板、振动马达都功能组件都可以设置在壳体20内部。可以理解的,所述壳体20可以包括中框和电池盖。The
其中,所述中框可以为薄板状或薄片状的结构,也可以为中空的框体结构。中框用于为电子设备100中的电子器件或功能组件提供支撑作用,以将电子设备100的电子器件、功能组件安装到一起。例如,所述中框上可以设置凹槽、凸起、通孔等结构,以便于安装电子设备100的电子器件或功能组件。可以理解的,中框的材质可以包括金属或塑胶等。Wherein, the middle frame may be a thin plate or sheet structure, or a hollow frame structure. The middle frame is used to provide support for electronic devices or functional components in the
所述电池盖与所述中框连接。例如,所述电池盖可以通过诸如双面胶等粘接剂贴合到中框上以实现与中框的连接。其中,电池盖用于与所述中框、所述显示屏10共同将电子设备100的电子器件和功能组件密封在电子设备100内部,以对电子设备100的电子器件和功能组件形成保护作用。可以理解的,电池盖可以一体成型。在电池盖的成型过程中,可以在电池盖上形成后置摄像头安装孔等结构。可以理解的,电池盖的材质也可以包括金属或塑胶等。The battery cover is connected to the middle frame. For example, the battery cover can be bonded to the middle frame by an adhesive such as double-sided tape to realize the connection with the middle frame. Wherein, the battery cover is used together with the middle frame and the
电路板30设置在所述壳体20内部。例如,电路板30可以安装在壳体20的中框上,以进行固定,并通过电池盖将电路板30密封在电子设备内部。其中,电路板30可以为电子设备100的主板。所述电路板30上还可以集成有处理器、摄像头、耳机接口、加速度传感器、陀螺仪、马达等功能组件中的一个或多个。同时,显示屏10可以电连接至电路板30,以通过电路板30上的处理器对显示屏10的显示进行控制。可以理解的,由于电子设备100内部设计空间的限制,所述电路板30还可以包括多个彼此间隔设置的独立电路板,例如可以包括彼此间隔设置的主电路板和副电路板,所述主电路板、副电路板上都可以集成电子器件或功能组件。The
电池40设置在壳体20内部。例如,电池40可以安装在壳体20的中框上,以进行固定,并通过电池盖将电池40密封在电子设备内部。同时,电池40电连接至所述电路板30,以实现电池40为电子设备100供电。其中,电路板30上可以设置有电源管理电路。所述电源管理电路用于将电池40提供的电压分配到电子设备100中的各个电子器件。The
其中,所述电子设备100中还设置有天线装置。所述天线装置用于实现电子设备100的无线通信功能,例如所述天线装置可以用于实现近场通信(NFC通信)功能。所述天线装置设置在电子设备100的壳体20内部。其中,可以理解的,所述天线装置的部分器件可以集成在所述壳体20内部的电路板30上,例如所述天线装置中的信号处理芯片以及信号处理电路可以集成在所述电路板30上。此外,所述天线装置的部分器件还可以直接设置在所述壳体20内部。例如所述天线装置用于辐射信号的辐射体或者导体结构可以直接设置在所述壳体20内部。Wherein, the
参考图2,图2为本申请实施例提供的电子设备100的第二种结构示意图。其中,所述天线装置包括近场通信芯片21、接地平面22以及导体结构23。所述电子设备100还包括电容传感器31以及传感器处理电路32。Referring to FIG. 2 , FIG. 2 is a second schematic structural diagram of an
其中,近场通信芯片(NFC芯片)21可以用于提供差分激励电流。所述差分激励电流包括两个电流信号。所述两个电流信号的振幅相同,并且相位相反,或者理解为所述两个电流信号的相位相差180度。此外,所述差分激励电流为平衡信号。可以理解的,模拟信号在传输过程中,如果被直接传送就是非平衡信号;如果把原始的模拟信号反相,然后同时传送反相的模拟信号和原始的模拟信号,反相的模拟信号和原始的模拟信号就叫做平衡信号。平衡信号在传送过程中经过差动放大器,原始的模拟信号和反相的模拟信号相减,得到加强的原始模拟信号,由于在传送过程中,两条传送线路受到相同的干扰,在相减的过程中,减掉了相同的干扰信号,因此平衡信号的抗干扰性能更好。Wherein, a near field communication chip (NFC chip) 21 may be used to provide differential excitation current. The differential excitation current includes two current signals. The amplitudes of the two current signals are the same and the phases are opposite, or it can be understood that the phases of the two current signals differ by 180 degrees. In addition, the differential excitation current is a balanced signal. It can be understood that if the analog signal is directly transmitted during the transmission process, it is an unbalanced signal; if the original analog signal is inverted, then the inverted analog signal and the original analog signal are transmitted at the same time, and the inverted analog signal and the original The analog signal is called a balanced signal. The balanced signal passes through the differential amplifier during the transmission process, and the original analog signal and the inverted analog signal are subtracted to obtain an enhanced original analog signal. Since the two transmission lines are subject to the same interference during the transmission process, the subtraction In the process, the same interference signal is subtracted, so the anti-interference performance of the balanced signal is better.
所述NFC芯片21包括第一差分信号端211和第二差分信号端212。例如,所述第一差分信号端211可以为所述NFC芯片21的正(+)端口,所述第二差分信号端212可以为所述NFC芯片21的负(-)端口。所述第一差分信号端211和所述第二差分信号端212用于提供所述差分激励电流。例如,所述NFC芯片21提供的差分激励电流可以经由所述第一差分信号端211输出到所述天线装置中,并经由所述第二差分信号端212回流到所述NFC芯片21中,从而形成电流回路。The
其中,可以理解的,所述NFC芯片21可以设置在电子设备100的电路板30上,或者也可以在电子设备100中设置一个较小的独立电路板,并将所述NFC芯片21集成到所述独立电路板上。所述独立电路板例如可以为电子设备100中的副电路板。Wherein, it can be understood that the
所述接地平面22用于形成公共地。其中,所述接地平面22可以通过电子设备100中的导体、印刷线路或者金属印刷层等形成。例如,所述接地平面22可以设置在电子设备100的电路板30上。所述接地平面22还可以形成在电子设备100的壳体20上,例如可以通过壳体20的中框来形成所述接地平面22,或者也可以通过所述壳体20的电池盖来形成所述接地平面22。The
所述接地平面22包括间隔设置的第一接地点221和第二接地点222。所述第一接地点221、所述第二接地点222例如可以为所述接地平面22的端部,或者也可以为所述接地平面22上的凸起结构,或者也可以为所述接地平面22上形成的焊盘,或者还可以为所述接地平面22上一定面积的区域,等等。The
其中,所述接地平面22在所述第一接地点221和所述第二接地点222之间形成导电路径,所述导电路径可以用于传导电流。也即,当在所述第一接地点221与所述第二接地点222施加电压信号时,所述第一接地点221与所述第二接地点222之间可以产生电流,从而形成电流回路。可以理解的,当所述NFC芯片21提供差分激励电流时,所述第一接地点221和所述第二接地点222之间的导电路径可以用于传输所述差分激励电流。Wherein, the
所述导体结构23包括间隔设置的第一馈电端231和第一接地端232。所述第一馈电端231与所述NFC芯片21的第一差分信号端211电连接,从而实现所述第一差分信号端211向所述第一馈电端231馈电。例如,所述NFC芯片21提供的差分激励电流可以经由所述第一差分信号端211传输到所述第一馈电端231,以实现向所述导体结构23馈电。所述第一接地端232与所述接地平面22的第一接地点221电连接,从而实现所述导体结构23的回地。The
可以理解的,所述导体结构23可以为所述电子设备100中的金属结构或者电路板上的金属走线等结构。例如,所述导体结构23可以为所述壳体20上形成的金属枝节,例如所述导体结构23可以为壳体20的中框上形成的金属枝节,或者所述导体结构23可以为壳体20的电池盖上形成的金属枝节。再例如,电子设备100可以包括摄像头,所述摄像头周围可以设置有金属材质的装饰圈,所述导体结构23可以为所述装饰圈。再例如,所述导体结构23也可以为电子设备100中的柔性电路板(Flexible Printed Circuit,FPC)上的金属走线,所述FPC例如可以为显示屏的FPC、摄像头的FPC、马达的FPC等结构。再例如,所述导体结构23还可以为电子设备100的电路板30上的印刷线路。It can be understood that the
所述电容传感器31设置在所述壳体20内部。例如,所述电容传感器31可以设置在壳体20的中框上进行固定。或者,所述电容传感器31也可以设置在电路板30上。其中,所述电容传感器31用于检测外部导体的距离。所述外部导体例如可以为人体,例如用户的手部、脸部等部位。所述外部导体还可以为外部金属物体等,例如NFC接收机(诸如地铁刷卡机)等。所述电容传感器31可以作为电子设备100的接近传感器,用于检测外部导体的距离,从而实现检测人体或者金属物体等外部物体的接近或者远离。此外,所述电容传感器31还可以作为电子设备100的触控传感器,用于检测用户的触摸操作。The
所述电容传感器31包括第一极板,诸如第一极板24。所述第一极板24可以复用为NFC天线,以实现通过所述第一极板24传输所述差分激励电流。其中,所述第一极板24包括间隔设置的第二馈电端241和第二接地端242。所述第二馈电端241与所述NFC芯片21的第二差分信号端212电连接,从而实现所述第二差分信号端212向所述第二馈电端241馈电。例如,所述NFC芯片21提供的差分激励电流可以经由所述第二馈电端241传输到所述第二差分信号端212,以实现向所述第一极板24馈电。所述第二接地端242与所述接地平面22的第二接地点222电连接,从而实现所述第一极板24的回地。The
可以理解的,所述电容传感器31还包括第二极板,诸如第二极板311。所述第二极板311与所述第一极板24间隔设置。其中,所述第二极板311、所述第一极板24均为金属极板,例如可以都为铜合金极板。所述第二极板311可以与所述第一极板24平行设置,以形成平行板电容器;或者,所述第一极板24可以围绕所述第二极板311的外周缘设置。可以理解的,所述第二极板311与所述第一极板24之间还可以设置绝缘介质。It can be understood that the
所述传感器处理电路32与电容传感器31电连接。其中,可以理解的,所述传感器处理电路32可以所述电容传感器31的第一极板24、第二极板311均电连接,从而实现对所述电容传感器31检测到的信号进行处理。其中,所述传感器处理电路32可以设置在电子设备100的电路板30上,或者所述传感器处理电路32也可以集成在电子设备100的处理器中。The
此外,为了实现所述第一极板24在传输所述差分激励电流与传输检测到的信号之间的隔离,或者提高传输两个信号时的隔离度,可以在所述第一极板24与所述传感器处理电路32之间设置滤波电路。所述滤波电路可以允许所述电容传感器31检测到的信号通过,并且阻止所述差分激励电流通过。In addition, in order to realize the isolation between the first
其中,所述导体结构23、所述接地平面22上的导电路径以及所述第一极板24共同形成供所述差分激励电流传输的导电回路。也即,所述差分激励电流从所述NFC芯片21的一个信号端输出,例如从所述第一差分信号端211输出,随后被馈入所述导体结构23,经由所述导体结构23传输到所述接地平面22上的导电路径,随后经由所述导电路径传输到所述第一极板24,最终通过所述第一极板24回流到所述NFC芯片21的第二差分信号端212,从而形成完整的电流回路。Wherein, the
可以理解的,所述导电回路在传输所述差分激励电流时,所述导体结构23、所述接地平面22上的导电路径、所述第一极板24可以共同产生交变电磁场,从而向外辐射NFC信号,以实现所述电子设备100的NFC通信。It can be understood that when the conductive loop transmits the differential excitation current, the
其中,所述导电回路在传输所述差分激励电流时,所述导体结构23产生第一近场通信辐射场(第一NFC辐射场)。所述第一NFC辐射场可以覆盖电子设备100周围一定空间的区域。所述第一极板24产生第二近场通信辐射场(第二NFC辐射场)。所述第二NFC辐射场也可以覆盖电子设备100周围一定空间的区域。其中,所述第二NFC辐射场与所述第一NFC辐射场至少部分重叠,从而既可以增强电子设备100周围的NFC辐射场的区域,又可以增强重叠区域的场强。因此,既可以增加电子设备100的NFC天线的有效读写(刷卡)面积,又可以提高电子设备100的NFC天线在读写(刷卡)时的稳定性。Wherein, when the conductive loop transmits the differential excitation current, the
此外,所述导电回路在传输所述差分激励电流时,所述接地平面22可以产生第三近场通信辐射场(第三NFC辐射场)。所述第三NFC辐射场也可以覆盖电子设备100周围一定空间的区域。其中,所述第三NFC辐射场与所述第一NFC辐射场至少部分重叠,并且所述第三NFC辐射场与所述第二NFC辐射场至少部分重叠。因此,可以进一步增强电子设备100周围的NFC辐射场的区域,并且能够增强重叠区域的场强。In addition, when the conductive loop transmits the differential excitation current, the
例如,在实际应用中,当NFC接收机(例如地铁刷卡机)靠近所述导体结构23的位置读取NFC信号时,所述导体结构23所形成的第一NFC辐射场作为主辐射场,所述第一极板24所形成的第二NFC辐射场、所述接地平面22所形成的第三NFC辐射场都可以对所述主辐射场进行补偿,从而可以对所述主辐射场中场强较弱的位置进行补偿,以增强所述主辐射场整个区域的场强。同样的,当NFC接收机靠近所述第一极板24的位置读取NFC信号时,所述第一极板24所形成的第二NFC辐射场作为主辐射场,所述第一NFC辐射场、所述第三NFC辐射场都可以对所述主辐射场进行补偿。For example, in practical applications, when an NFC receiver (such as a subway card reader) reads an NFC signal near the position of the
因此,本申请的电子设备100中,可以保证在所述导体结构23、所述第一极板24、所述接地平面22所形成的NFC辐射场的任意位置都可以实现NFC信号的收发,从而实现电子设备100与其它电子设备之间的NFC通信。Therefore, in the
同时参考图3,图3为本申请实施例提供的电子设备100中天线装置的设置示意图。Referring to FIG. 3 at the same time, FIG. 3 is a schematic diagram of the arrangement of the antenna device in the
其中,近场通信芯片(NFC芯片)可以集成在电子设备的电路板上,导体结构可以设置在电子设备的一端部,例如导体结构可以设置在电子设备的顶端,接地平面可以形成在电子设备的电路板上,第一极板可以设置在电子设备的一个侧边,例如第一极板可以设置在电子设备的右侧。从而,所述NFC芯片提供的差分激励电流可以从NFC芯片传输到电子设备顶端的导体结构,再从导体结构传输到电子设备的电路板上的接地平面,再从电路板上的接地平面传输到电子设备右侧的第一极板,最后从第二导体结构回流到NFC芯片中。Wherein, the near field communication chip (NFC chip) can be integrated on the circuit board of the electronic device, the conductor structure can be arranged on one end of the electronic device, for example, the conductor structure can be arranged on the top of the electronic device, and the ground plane can be formed on the electronic device. On the circuit board, the first polar plate can be arranged on one side of the electronic device, for example, the first polar plate can be arranged on the right side of the electronic device. Thus, the differential excitation current provided by the NFC chip can be transmitted from the NFC chip to the conductor structure at the top of the electronic device, then from the conductor structure to the ground plane on the circuit board of the electronic device, and then from the ground plane on the circuit board to the ground plane. The first polar plate on the right side of the electronic device is finally reflowed from the second conductor structure into the NFC chip.
需要说明的是,所述导体结构设置在电子设备顶端、所述第一极板设置在电子设备右侧仅仅是举例,而不是用于对本申请实施例的限定。可以理解的,所述导体结构还可以设置在电子设备的其它部位,所述第一极板也可以设置在电子设备的其它部位,从而实现通过所述电子设备的不同部位都可以与其它电子设备之间进行NFC通信,例如通过所述电子设备的正面(也即电子设备的显示屏所在的一面)可以实现NFC通信,通过所述电子设备的背面(也即电子设备的电池盖所在的一面)也可以实现NFC通信。It should be noted that the arrangement of the conductor structure on the top of the electronic device and the arrangement of the first plate on the right side of the electronic device is merely an example, rather than limiting the embodiment of the present application. It can be understood that the conductor structure can also be arranged on other parts of the electronic device, and the first electrode plate can also be arranged on other parts of the electronic device, so that different parts of the electronic device can communicate with other electronic devices. For example, NFC communication can be realized through the front of the electronic device (that is, the side where the display screen of the electronic device is located), and through the back of the electronic device (that is, the side where the battery cover of the electronic device is located) NFC communication is also possible.
需要说明的是,当所述电子设备向外辐射NFC信号时,所述电子设备中的NFC芯片可以主动提供差分激励电流。而当所述电子设备作为NFC接收机接收其它电子设备辐射的NFC信号时,所述电子设备中可以产生感应电流,所述感应电流也可以理解为所述NFC芯片提供的差分激励电流,或者理解为所述NFC芯片被动提供的差分激励电流。也即,无论所述电子设备作为NFC发射机向外辐射NFC信号,还是作为NFC接收机接收其它电子设备辐射的NFC信号,所述电子设备中的NFC芯片都可以提供差分激励电流。It should be noted that when the electronic device radiates an NFC signal, the NFC chip in the electronic device can actively provide a differential excitation current. And when the electronic device receives NFC signals radiated by other electronic devices as an NFC receiver, an induced current may be generated in the electronic device, and the induced current can also be understood as the differential excitation current provided by the NFC chip, or understood The differential excitation current passively provided for the NFC chip. That is, whether the electronic device acts as an NFC transmitter to radiate NFC signals, or acts as an NFC receiver to receive NFC signals radiated by other electronic devices, the NFC chip in the electronic device can provide a differential excitation current.
本申请实施例提供的电子设备,通过设置导体结构以及复用电容传感器的第一极板,并将所述导体结构和所述第一极板连接到同一接地平面的两个不同接地点,并利用两个接地点之间的地平面形成导电路径,从而可以通过所述导体结构、所述第一极板以及所述导电路径形成供NFC差分激励电流传输的导电回路。由于所述导体结构、所述第一极板可以根据电子设备内部空间设计的需求,分别设置在电子设备的不同部位,进而通过所述接地平面上形成的导电路径连接形成回路,从而可以通过电子设备不同部位的导体结构和电容传感器配合接地平面来实现NFC天线的设计,因此可以复用电容传感器的极板作为NFC天线,不仅可以节省NFC天线的占用空间,而且使得NFC天线的布局可以更灵活。In the electronic device provided in the embodiment of the present application, by setting the conductor structure and the first plate of the multiplexing capacitive sensor, and connecting the conductor structure and the first plate to two different ground points of the same ground plane, and The ground plane between the two ground points is used to form a conductive path, so that a conductive loop for NFC differential excitation current transmission can be formed through the conductor structure, the first plate and the conductive path. Since the conductor structure and the first plate can be arranged in different parts of the electronic device according to the requirements of the internal space design of the electronic device, and then connected to form a circuit through the conductive path formed on the ground plane, the electronic The conductor structure of different parts of the device and the capacitive sensor cooperate with the ground plane to realize the design of the NFC antenna, so the plate of the capacitive sensor can be reused as the NFC antenna, which not only saves the space occupied by the NFC antenna, but also makes the layout of the NFC antenna more flexible .
参考图4,图4为本申请实施例提供的电子设备100的第三种结构示意图。其中,图4所示电子设备100与图3所示电子设备100的不同之处在于:可以复用电容传感器31的第二极板311作为所述导体结构23。也即,所述导体结构23包括所述第二极板311。所述导体结构23上的第一馈电端231、第一接地端232间隔设置在所述第二极板311上。Referring to FIG. 4 , FIG. 4 is a schematic diagram of a third structure of an
可以理解的,所述NFC芯片21提供的差分激励电流可以包括第一电流和第二电流,所述第一电流的相位与所述第二电流的相位相反。其中,所述NFC芯片21的第一差分信号端211用于输出所述第一电流,所述NFC芯片21的第二差分信号端212用于输出所述第二电流。It can be understood that the differential excitation current provided by the
需要说明的是,由于所述第一极板24、所述第二极板311共同形成所述电容传感器31,因此所述第一极板24与所述第二极板311之间的距离较小。例如,所述第一极板24与所述第二极板311之间的距离可以为3mm(毫米)。此时,所述第一极板24形成的NFC辐射场与所述第二极板311形成的NFC辐射场几乎重叠。而当所述第一极板24传输的电流与所述第二极板311传输的电流之间的相位相反时,所述第一极板24形成的NFC辐射场与所述第二极板311形成的NFC辐射场的方向也是相反的,此时两个NFC辐射场之间会互相削弱,甚至互相抵消。It should be noted that since the
为了使所述第一极板24形成的NFC辐射场与所述第二极板311形成的NFC辐射场互相增强,需要使所述第一极板24形成的NFC辐射场与所述第二极板311形成的NFC辐射场的方向相同。因此,可以通过移相器来调整所述第二极板311传输的电流的相位,以使得所述第二极板311传输的电流的相位与所述第一极板24传输的电流的相位相同。In order to make the NFC radiation field formed by the
其中,电子设备100包括移相器234。所述移相器234与所述第一差分信号端211、所述第一馈电端231均电连接。也即,所述第一馈电端231通过所述移相器234与所述第一差分信号端211电连接。所述移相器234用于对所述第一差分信号端211输出的第一电流的相位进行调整,以使得调整后的第一电流的相位与所述第二差分信号端212输出的第二电流的相位相同。从而,所述第二极板311在传输所述第一电流、所述第一极板24在传输所述第二电流的过程中,所述第二极板311形成的NFC辐射场的方向即可与所述第一极板24形成的NFC辐射场的方向相同,从而使得所述第二极板311形成的NFC辐射场与所述第一极板24形成的NFC辐射场互相增强,以提高电子设备100向外辐射NFC信号时的信号强度。Wherein, the
参考图5,图5为本申请实施例提供的电子设备100的第四种结构示意图。其中,图5所示电子设备100与图3所示电子设备100的不同之处在于:电子设备100包括主电路板33、副电路板34以及柔性电路板(FPC)35。所述主电路板33、所述副电路板34可以间隔设置在电子设备100中的不同位置。其中,所述主电路板33通过所述FPC 35与所述副电路板34电连接,以实现所述主电路板33与所述副电路板34的电连接。所述FPC 35上设置有金属走线351,可以复用所述金属走线351作为所述导体结构23。也即,所述导体结构23包括所述金属走线351。其中,所述第一馈电端231、所述第一接地端232间隔设置在所述金属走线351上。Referring to FIG. 5 , FIG. 5 is a schematic diagram of a fourth structure of an
其中,可以理解的,所述近场通信芯片21、所述接地平面22都可以设置在所述主电路板33上。Wherein, it can be understood that both the near
参考图6,图6为本申请实施例提供的电子设备100的第五种结构示意图。其中,所述电子设备100的天线装置还包括第一非近场通信芯片25、第二非近场通信芯片26。可以理解的,所述第一非近场通信芯片25、所述第二非近场通信芯片26都可以集成在电子设备100的电路板30上。Referring to FIG. 6 , FIG. 6 is a schematic diagram of a fifth structure of an
在本申请的描述中,需要理解的是,诸如“第一”、“第二”等术语仅用于区分类似的对象,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。In the description of this application, it should be understood that terms such as "first" and "second" are only used to distinguish similar objects, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the indicated technology number of features.
所述第一非近场通信芯片25用于提供第一非近场通信激励信号。其中,所述第一非近场通信激励信号为非平衡信号。所述第一非近场通信激励信号可以包括蜂窝网络信号、Wi-Fi信号、GPS信号、BT信号中的一种。相应的,所述第一非近场通信芯片25可以为蜂窝通信芯片,用于提供所述蜂窝网络信号;所述第一非近场通信芯片25可以为Wi-Fi芯片,用于提供所述Wi-Fi信号;所述第一非近场通信芯片25可以为GPS芯片,用于提供所述GPS信号;所述第一非近场通信芯片25还可以为BT芯片,用于提供所述BT信号。The first non-near-
所述导体结构23还包括第三馈电端233。所述第三馈电端233与所述第一馈电端231、所述第一接地端232间隔设置。所述第三馈电端233与所述第一非近场通信芯片25电连接,并且所述第一非近场通信芯片25接地。从而,所述第一非近场通信芯片25可以通过所述第三馈电端233向所述导体结构23馈入所述第一非近场通信激励信号。因此,所述导体结构23还可以用于传输所述第一非近场通信激励信号。The
可以理解的,所述导体结构23既可以用于传输所述NFC芯片21提供的差分激励电流,又可以用于传输所述第一非近场通信芯片25提供的第一非近场通信激励信号,从而可以实现所述导体结构23的复用,能够减少电子设备100中用于传输无线信号的导体结构的数量,从而可以节省电子设备100的内部空间。It can be understood that the
其中,需要说明的是,NFC信号的频率通常为13.56MHz(兆赫兹),蜂窝网络信号的频率通常在700MHz以上,Wi-Fi信号的频率通常为2.4GHz(吉赫兹)或5GHz,GPS信号的频率通常包括1.575GHz、1.227GHz、1.381GHz、1.841GHz等多个频段,BT信号的频率通常为2.4GHz。因此,相对于蜂窝网络信号、Wi-Fi信号、GPS信号、BT信号而言,NFC信号为低频信号,而蜂窝网络信号、Wi-Fi信号、GPS信号、BT信号均为高频信号。或者也可以理解为,NFC信号为低频信号,所述第一非近场通信激励信号为高频信号,NFC信号的频率小于所述第一非近场通信激励信号的频率。Among them, it should be noted that the frequency of NFC signals is usually 13.56MHz (megahertz), the frequency of cellular network signals is usually above 700MHz, the frequency of Wi-Fi signals is usually 2.4GHz (gigahertz) or 5GHz, and the frequency of GPS signals The frequency usually includes multiple frequency bands such as 1.575GHz, 1.227GHz, 1.381GHz, 1.841GHz, etc., and the frequency of the BT signal is usually 2.4GHz. Therefore, compared to cellular network signals, Wi-Fi signals, GPS signals, and BT signals, NFC signals are low-frequency signals, while cellular network signals, Wi-Fi signals, GPS signals, and BT signals are all high-frequency signals. Or it can also be understood that the NFC signal is a low-frequency signal, the first non-near-field communication excitation signal is a high-frequency signal, and the frequency of the NFC signal is lower than the frequency of the first non-near-field communication excitation signal.
此外,需要说明的是,在传输无线信号时,无线信号的频率越低,所需的辐射体长度越长;而无线信号的频率越高,所需的辐射体长度越短。也即,传输所述NFC信号所需的辐射体的长度大于传输所述第一非近场通信激励信号所需的辐射体长度。In addition, it should be noted that when transmitting a wireless signal, the lower the frequency of the wireless signal, the longer the required length of the radiator; and the higher the frequency of the wireless signal, the shorter the required length of the radiator. That is, the length of the radiator required for transmitting the NFC signal is greater than the length of the radiator required for transmitting the first non-near-field communication excitation signal.
因此,在所述导体结构23中,所述第一馈电端231与所述第一接地端232的距离大于所述第三馈电端233与所述第一接地端232的距离。从而,即可使得在所述导体结构23中,传输所述NFC信号的辐射体的长度大于传输所述第一非近场通信激励信号的辐射体的长度。Therefore, in the
此外,为了减小导体结构23的整体长度,可以设置为所述第三馈电端233与所述第一馈电端231位于所述第一接地端232的同一侧。也即,所述第三馈电端233位于所述第一馈电端231与所述第一接地端232之间。相较于所述第三馈电端233与所述第一馈电端231位于所述第一接地端232的不同侧而言,所述第三馈电端233与所述第一馈电端231位于所述第一接地端232的同一侧可以复用所述第三馈电端233与所述第一接地端232之间的部分,从而可以减小导体结构23的整体长度。In addition, in order to reduce the overall length of the
所述第二非近场通信芯片26用于提供第二非近场通信激励信号。其中,所述第二非近场通信激励信号为非平衡信号。所述第二非近场通信激励信号可以包括蜂窝网络信号、无线保真信号(Wi-Fi信号)、全球定位系统信号(GPS信号)、蓝牙信号(BT信号)中的一种。相应的,所述第二非近场通信芯片26可以为蜂窝通信芯片,用于提供所述蜂窝网络信号;所述第二非近场通信芯片26可以为Wi-Fi芯片,用于提供所述Wi-Fi信号;所述第二非近场通信芯片26可以为GPS芯片,用于提供所述GPS信号;所述第二非近场通信芯片26还可以为BT芯片,用于提供所述BT信号。The second non-near-
其中,需要说明的是,所述第二非近场通信激励信号与所述第一非近场通信激励信号既可以相同通信类型的信号,也可以是不同通信类型的信号。相应的,所述第二非近场通信芯片26与所述第一非近场通信芯片25既可以是相同类型的芯片,也可以是不同类型的芯片。Wherein, it should be noted that the second non-near-field communication excitation signal and the first non-near-field communication excitation signal may be signals of the same communication type, or may be signals of different communication types. Correspondingly, the second non-near-
所述第一极板24还包括第四馈电端243。所述第四馈电端243与所述第二馈电端241、所述第二接地端242间隔设置。所述第四馈电端243与所述第二非近场通信芯片26电连接,并且所述第二非近场通信芯片26接地。从而,所述第二非近场通信芯片26可以通过所述第四馈电端243向所述第一极板24馈入所述第二非近场通信激励信号。因此,所述第一极板24还可以用于传输所述第二非近场通信激励信号。The
可以理解的,所述第一极板24既可以用于传输所述NFC芯片21提供的差分激励电流,又可以用于传输所述第二非近场通信芯片26提供的第二非近场通信激励信号,从而可以实现所述第一极板24的复用,能够进一步减少电子设备100中用于传输无线信号的导体结构的数量,从而可以进一步节省电子设备100的内部空间。It can be understood that the
同样的,在所述第一极板24中,所述第二馈电端241与所述第二接地端242的距离大于所述第四馈电端243与所述第二接地端242的距离。从而,即可使得在所述第一极板24中,传输所述NFC信号的辐射体的长度大于传输所述第二非近场通信激励信号的辐射体的长度。Similarly, in the
此外,为了减小第一极板24的整体长度,可以设置为所述第四馈电端243与所述第二馈电端241位于所述第二接地端242的同一侧。也即,所述第四馈电端243位于所述第二馈电端241与所述第二接地端242之间。相较于述第四馈电端243与所述第二馈电端241位于所述第二接地端242的不同侧而言,所述第四馈电端243与所述第二馈电端241位于所述第二接地端242的同一侧可以复用所述第四馈电端243与所述第二接地端242之间的部分,从而可以减小所述第一极板24的整体长度。In addition, in order to reduce the overall length of the
参考图7,图7为本申请实施例提供的电子设备100的第六种结构示意图。其中,所述电子设备100的天线装置还包括第一匹配电路271、第二匹配电路272、第三匹配电路273、第一滤波电路281、第二滤波电路282、第三滤波电路283以及第四滤波电路284。可以理解的,匹配电路也可以称为匹配网络、调谐电路、调谐网络等。滤波电路也可以称为滤波网络。Referring to FIG. 7 , FIG. 7 is a schematic diagram of a sixth structure of an
所述第一匹配电路271与所述NFC芯片21的第一差分信号端211、所述NFC芯片21的第二差分信号端212、所述导体结构23的第一馈电端231、所述第一极板24的第二馈电端241电连接。所述第一匹配电路271用于对所述导电回路传输所述差分激励电流时的阻抗进行匹配。The
其中,所述第一匹配电路271包括第一输入端271a、第二输入端271b、第一输出端271c、第二输出端271d。所述第一输入端271a与所述NFC芯片21的第一差分信号端211电连接,所述第二输入端271b与所述NFC芯片21的第二差分信号端212电连接,所述第一输出端271c与所述导体结构23的第一馈电端231电连接,所述第二输出端271d与所述第一极板24的第二馈电端241电连接。Wherein, the
所述第一滤波电路281设置在所述NFC芯片21的第一差分信号端211与所述第一匹配电路271的第一输入端271a之间。所述第一滤波电路281用于滤除所述第一差分信号端211与所述第一输入端271a之间的第一干扰信号。所述第一干扰信号即为所述NFC芯片21提供的差分激励电流之外的电信号。The
所述第二滤波电路282设置在所述NFC芯片21的第二差分信号端212与所述第一匹配电路271的第二输入端271b之间。所述第二滤波电路282用于滤除所述第二差分信号端212与所述第二输入端271b之间的第二干扰信号。所述第二干扰信号即为所述NFC芯片21提供的差分激励电流之外的电信号。The
所述第二匹配电路272与所述第一非近场通信芯片25、所述导体结构23的第三馈电端233电连接。所述第二匹配电路272用于对所述导体结构23传输所述第一非近场通信激励信号时的阻抗进行匹配。The
所述第三滤波电路283设置在所述第一非近场通信芯片25与所述第二匹配电路272之间。所述第三滤波电路283用于滤除所述第一非近场通信芯片25与所述第二匹配电路272之间的第三干扰信号。所述第三干扰信号即为所述第一非近场通信芯片25提供的第一非近场通信激励信号之外的电信号。The
所述第三匹配电路273与所述第二非近场通信芯片26、所述第一极板24的第四馈电端243电连接。所述第三匹配电路273用于对所述第一极板24传输所述第二非近场通信激励信号时的阻抗进行匹配。The
所述第四滤波电路284设置在所述第二非近场通信芯片26与所述第三匹配电路273之间。所述第四滤波电路284用于滤除所述第二非近场通信芯片26与所述第三匹配电路273之间的第四干扰信号。所述第四干扰信号即为所述第二非近场通信芯片26提供的第二非近场通信激励信号之外的电信号。The
其中,可以理解的,所述第一匹配电路271、所述第二匹配电路272、所述第三匹配电路273都可以包括由电容、电感的任意串联或者任意并联所组成的电路。所述第一滤波电路281、所述第二滤波电路282、所述第三滤波电路283、所述第四滤波电路284也可以包括由电容、电感的任意串联或者任意并联所组成的电路。Wherein, it can be understood that the
参考图8,图8为本申请实施例提供的电子设备100的第七种结构示意图。Referring to FIG. 8 , FIG. 8 is a schematic diagram of a seventh structure of an
所述第一匹配电路271例如可以包括四个电容C1、C2、C3、C4。其中,电容C1与NFC芯片21的第一差分信号端211串联,电容C2与NFC芯片21的第二差分信号端212串联。电容C3与电容C4串联,并且串联之后与所述NFC芯片21并联,并且电容C3与电容C4之间接地。可以理解的,电容C1、C2、C3、C4的电容值可以根据实际需要进行设置。The
所述第一滤波电路281例如可以包括电感L1和电容C5。其中,电感L1串联在所述第一差分信号端211与所述第一匹配电路271之间,电容C5与所述NFC芯片21并联并接地。可以理解的,电感L1的电感值、电容C5的电容值都可以根据实际需要进行设置。The
所述第二滤波电路282例如可以包括电感L2和电容C6。其中,电感L2串联在所述第二差分信号端212与所述第一匹配电路271之间,电容C6与所述NFC芯片21并联并接地。可以理解的,电感L2的电感值、电容C6的电容值都可以根据实际需要进行设置。The
所述第二匹配电路272例如可以包括电容C7、C8。其中,电容C7串联在导体结构23的第三馈电端233与第一非近场通信芯片25之间,电容C8与所述第一非近场通信芯片25并联并接地。可以理解的,电容C7、C8的电容值可以根据实际需要进行设置。The
所述第三滤波电路283例如可以包括电感L3和电容C9。其中,电感L3串联在第一非近场通信芯片25与所述第二匹配电路272之间,电容C9与所述第一非近场通信芯片25并联并接地。可以理解的,电感L3的电感值、电容C9的电容值都可以根据实际需要进行设置。The
所述第三匹配电路273例如可以包括电容C10、C11。其中,电容C10串联在第一极板24的第四馈电端243与第二非近场通信芯片26之间,电容C11与所述第二非近场通信芯片26并联并接地。可以理解的,电容C10、C11的电容值可以根据实际需要进行设置。The
所述第四滤波电路284例如可以包括电感L4和电容C12。其中,电感L4串联在第二非近场通信芯片26与所述第三匹配电路273之间,电容C12与所述第二非近场通信芯片26并联并接地。可以理解的,电感L4的电感值、电容C12的电容值都可以根据实际需要进行设置。The
以上对本申请实施例提供的电子设备进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请。同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。The electronic device provided by the embodiments of the present application has been introduced in detail above. In this paper, specific examples are used to illustrate the principles and implementation methods of the present application, and the descriptions of the above embodiments are only used to help understand the present application. At the same time, for those skilled in the art, based on the idea of this application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as limiting the application.
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