CN112445089B - Photosensitive drum, image forming device, and photosensitive drum regeneration method - Google Patents
Photosensitive drum, image forming device, and photosensitive drum regeneration method Download PDFInfo
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- CN112445089B CN112445089B CN202010907883.XA CN202010907883A CN112445089B CN 112445089 B CN112445089 B CN 112445089B CN 202010907883 A CN202010907883 A CN 202010907883A CN 112445089 B CN112445089 B CN 112445089B
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- 238000011069 regeneration method Methods 0.000 title claims abstract description 7
- 238000005498 polishing Methods 0.000 claims abstract description 90
- 239000011241 protective layer Substances 0.000 claims abstract description 36
- 239000006061 abrasive grain Substances 0.000 claims abstract description 23
- 238000000227 grinding Methods 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims description 26
- 239000011164 primary particle Substances 0.000 claims description 19
- 230000007246 mechanism Effects 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 230000001172 regenerating effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 108091008695 photoreceptors Proteins 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003902 lesion Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/75—Details relating to xerographic drum, band or plate, e.g. replacing, testing
- G03G15/751—Details relating to xerographic drum, band or plate, e.g. replacing, testing relating to drum
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/14—Inert intermediate or cover layers for charge-receiving layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/14—Inert intermediate or cover layers for charge-receiving layers
- G03G5/142—Inert intermediate layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/14—Inert intermediate or cover layers for charge-receiving layers
- G03G5/147—Cover layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/14—Inert intermediate or cover layers for charge-receiving layers
- G03G5/147—Cover layers
- G03G5/14704—Cover layers comprising inorganic material
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Photoreceptors In Electrophotography (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Cleaning In Electrography (AREA)
Abstract
The invention provides a photosensitive drum capable of obtaining good characteristics even after grinding, an image forming device with the photosensitive drum and a photosensitive drum regeneration method. The surface of the protective layer (4) of the photosensitive drum (1) is polished by a polishing device (100) having agglomerated abrasive grains. The surface of the protective layer (4) has an arithmetic average roughness Ra of less than 0.03 μm and an arithmetic average waviness Wa of 0.05 μm or more. In this way, by reducing the surface roughness at a relatively microscopic level, the surface relief shape is left at a relatively large level, and good characteristics can be obtained even for the photosensitive drum after polishing.
Description
Technical Field
The invention relates to a photosensitive drum, an image forming apparatus and a photosensitive drum regenerating method.
Background
In general, in an image forming apparatus, an electrostatic latent image is formed on a photosensitive drum by an optical writing device, the electrostatic latent image is developed into a toner image by a developing device, and the toner image is transferred onto a transfer belt. Then, the toner remaining on the surface of the photosensitive drum is removed by a cleaning device. In this way, by repeating the formation of the toner image and the removal of the toner, damage or the like may occur on the surface of the photosensitive drum.
Then, a photoreceptor recycling apparatus has been proposed in which the surface of a photoreceptor is polished and collected (for example, see patent document 1). In the photoreceptor recycling apparatus described in patent document 1, the surface roughness Rmax of the photoreceptor after polishing is set to 4.5 μm or less, whereby the adhering matter on the photoreceptor surface is removed.
However, it is only necessary to polish the photoreceptor to reduce the surface roughness, and the same characteristics as those of the unused photoreceptor may not be obtained, and further improvement of the characteristics of the photoreceptor after polishing is desired.
The invention aims to provide a photosensitive drum which can obtain good characteristics even after grinding, an image forming device with the photosensitive drum and a photosensitive drum regeneration method.
Japanese patent laid-open publication No. 2002-351098
Disclosure of Invention
In order to solve the above problem, a photosensitive drum according to an aspect of the present invention is a photosensitive drum comprising a hollow cylindrical sleeve, a photosensitive layer and a protective layer sequentially laminated on an outer peripheral surface of the sleeve, the photosensitive drum comprising: in the surface of the protective layer, JISB0601:2001, the arithmetic average roughness Ra at a cutoff value of 0.25mm is less than 0.03 μm, defined by JISB0601: the arithmetic average waviness Wa defined in 2001 is 0.05 μm or more at a cutoff value of 2.5 mm.
According to the photosensitive drum of the present invention, even if a damage is formed on the surface by using the photosensitive drum, the influence of the damage can be reduced by grinding by the arithmetic average roughness Ra being less than 0.03 μm. Therefore, when the surface of the photosensitive drum is cleaned by the cleaning blade, cleaning failure due to surface damage can be suppressed, and streak-like contamination or the like due to surface damage at the time of image formation can be suppressed. In addition, by setting the arithmetic average waviness Wa to 0.05 μm or more, the cleaning characteristics of the cleaning blade can be ensured, and the contact of one side of the cleaning blade can be suppressed. In this way, by reducing the surface roughness at a relatively microscopic level, the surface relief shape is left at a relatively large level, and good characteristics can be obtained even for the photosensitive drum after polishing.
Drawings
Fig. 1 is a cross-sectional view of a photosensitive drum according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view showing a surface state of the photosensitive drum not in use.
Fig. 3 is a cross-sectional view showing a surface state of the photosensitive drum after use.
Fig. 4 (a) and 4 (b) are perspective views of a polishing apparatus for polishing the photosensitive drum.
Fig. 5 is a cross-sectional view showing a surface state of the photosensitive drum polished by a polishing mechanism having loose abrasive grains.
Fig. 6 is a cross-sectional view showing a surface state of the photosensitive drum polished by a polishing mechanism having fixed abrasive grains.
Fig. 7 is a graph showing a relationship between primary particles and average polishing rate when polishing the surface of a photosensitive drum by a polishing mechanism having agglomerated abrasive grains.
Fig. 8 is a graph showing the arithmetic average waviness Wa of the photosensitive drums before and after grinding.
Fig. 9 is a diagram showing electrostatic capacitances of the photosensitive drums before and after polishing.
Detailed Description
Hereinafter, various embodiments of the present invention will be described with reference to the drawings. As shown in fig. 1, a photosensitive drum 1 of the present embodiment includes a hollow cylindrical sleeve member 2, a photosensitive layer 3 laminated on the outer peripheral surface of the sleeve member 2, and a protective layer 4 laminated on the outer peripheral surface of the photosensitive layer 3. That is, the photosensitive layer 3 and the protective layer 4 are sequentially laminated on the outer peripheral surface of the sleeve member 2. The photosensitive drum 1 is used in an image forming apparatus such as a copying machine, a facsimile machine, a laser printer, and a multifunction peripheral thereof, and an electrostatic latent image is formed on a surface by an optical writing device, and the electrostatic latent image is developed into a toner image by a developing device, and the toner image is transferred onto a transfer belt.
The photosensitive layer 3 is constituted of, for example, an undercoat layer, a charge generation layer, and a charge transport layer. The protective layer 4 is formed by dispersing a filler such as a resin in a binder resin such as polycarbonate constituting the charge transport layer. The structures and materials of the photosensitive layer 3 and the protective layer 4 may be appropriately selected.
Fig. 2 schematically shows the surface shape of the protective layer 4 in the photosensitive drum 1 in an unused state (new state), and fig. 2 schematically shows the surface shape of the protective layer 4 in the photosensitive drum 1 after a predetermined number of uses.
As shown in fig. 2 and 3 (see the inside of the dotted line), when the photosensitive drum 1 is used, the rough surface is deteriorated due to abrasion or film formation. In addition, when the photosensitive drum 1 is used, damages 41 to 43 are formed due to one-side contact of the cleaning blade or the developing material. In addition, the surface of the protective layer 4 also has an undulating shape before or after use of the photosensitive drum 1.
As described above, the photosensitive drum 1 is recycled by polishing the photosensitive drum 1 degraded by use as described below.
Fig. 4 shows a polishing apparatus (polishing mechanism) 100 for polishing the photosensitive drum 1. The polishing apparatus 100 includes a cylindrical elastic member 101 and a polishing film 102 attached to the top surface of the elastic member 101, and is configured to be rotated by a power source in the axial direction of the height direction of the cylindrical elastic member 101.
The elastic member 101 is made of, for example, foamed polyurethane, foamed EVA sponge, suede, nonwoven fabric, or the like.
The polishing film 102 has agglomerated abrasive grains as polishing abrasive grains, and functions as a polishing mechanism. The agglomerated abrasive particles are agglomerates composed of a plurality of fine primary particles, and the plurality of primary particles are gradually bonded to each other while forming voids in part, thereby forming a granular porous body.
To obtain such agglomerated abrasive particles, the particles (secondary particles) having a particle diameter of about 1 to 300 μm are first granulated by a spray dryer. Then, the particles are subjected to a heat treatment in order to form a porous body structure. The compressive fracture strength of the agglomerated abrasive grain after the heat treatment is preferably 20MPa or less. If the compressive failure strength is too high, scratches are easily generated during grinding.
The average particle diameter of primary particles of the agglomerated abrasive particles is preferably 4 μm or less. The primary particles are preferably inorganic oxides such as alumina, zirconia, silica, ceria, silica, and iron oxide.
Next, the abrasive grains obtained as described above were mixed with a liquid polyurethane resin, methyl ethyl ketone was added as a solvent, and the mixture was prepared by adjusting the solution viscosity, and then mixing and stirring the mixture for about 10 minutes using a stirrer. Stirring is carried out at room temperature at a rotational speed of 100rpm which is not so high as to destroy the abrasive grains. The mixture was applied to a base material (for example, a PET film having a thickness of about 75 μm) using a bar coater, and then dried in a constant temperature bath maintained at 60℃for 1 hour to obtain a ground film.
The polishing process is performed by rotating the photosensitive drum 1 by a power source and reciprocating the polishing apparatus 100 in the vertical direction in the drawing while rotating it by the power source. At this time, the polishing film 102 rotates together with the elastic member 101 in a state of biting into the surface of the photosensitive drum 1 by a certain amount, and the surface of the photosensitive drum 1 is polished.
The surface of the protective layer 4 is subjected to polishing treatment by the polishing apparatus 100 as described above to obtain a regenerated photosensitive drum 1, which is deteriorated by being used a predetermined number of times. The surface of the protective layer 4 is provided with an arithmetic average roughness Ra defined by JISB0601:2001 of less than 0.03 mu m in a cutoff value of 0.25mm, an arithmetic average waviness Wa defined by JISB0601:2001 of 0.05 mu m or more in a cutoff value of 2.5mm, and a maximum height roughness Rz defined by JISB0601:2001 of 0.5 mu m or less in a cutoff value of 0.25 mm. In addition, in the regenerated photosensitive drum, the average thickness of the protective layer 4 is 0.2 μm or more.
According to this embodiment, the following effects are obtained. That is, by the arithmetic average roughness Ra in the surface of the protective layer 4 being less than 0.03 μm, even if the lesions 41 to 43 are formed on the surface by using the photosensitive drum 1, the influence of the lesions 41 to 43 can be reduced by grinding. When the surface of the photosensitive drum is cleaned by the cleaning blade, cleaning failure due to surface damage can be suppressed, and streak-like contamination or the like due to surface damage at the time of image formation can be suppressed.
In addition, by making the arithmetic average waviness Wa in the surface of the protective layer 4 0.05 μm or more, the cleaning characteristics of the cleaning blade can be ensured while also suppressing one-sided contact of the cleaning blade. In this way, by reducing the surface roughness at a relatively microscopic level, the surface relief shape is left at a relatively large level, and good characteristics can be obtained even for the photosensitive drum after polishing.
Further, by setting the maximum height roughness Rz of the surface of the protective layer 4 to 0.5 μm or less, new damage due to polishing can be less likely to occur.
In addition, by making the average thickness of the protective layer 4 to be 0.2 μm or more, it is possible to suppress the variation in the electrostatic characteristics of the photosensitive layer 3 and to lengthen the service life of the photosensitive drum 1 after the regeneration.
By polishing the surface of the protective layer 4 using the polishing film 102 having agglomerated abrasive grains, the arithmetic average roughness Ra in the surface of the protective layer 4 after polishing can be made smaller than 0.03 μm, and the arithmetic average waviness Wa can be made 0.05 μm or more.
In contrast, when polishing is performed using a polishing means having free abrasive grains (for example, a soft polishing pad such as a nonwoven fabric or a sponge), as shown in fig. 5 (the solid line shows the surface S0 before polishing, and the broken line shows the surface S1 after polishing), the reduction of the arithmetic mean waviness Wa can be suppressed while maintaining the undulating shape, but as polishing proceeds, the scratches 41 to 43 may progress, and deep ones of the scratches 41 to 43 may not be removed.
In addition, when polishing is performed using a polishing mechanism (e.g., polishing paper) having fixed abrasive grains, as shown in fig. 6, although the damages 41 to 43 are easily removed, the undulating shape cannot be maintained, and the arithmetic average waviness Wa is lowered.
That is, by polishing using the polishing film 102 having agglomerated abrasive grains as in the present embodiment, the scratches 41 to 43 can be removed while maintaining the undulating shape.
In addition, by using particles having an average primary particle diameter of 4 μm or less as agglomerated abrasive grains, it is possible to suppress polishing damage such as scratches on the surface of the protective layer 4, which is the processed surface. On the other hand, when the average particle diameter of the primary particles is too large, polishing efficiency is improved, but polishing damage such as scratches is likely to occur on the surface to be polished, and the quality may be degraded.
In addition, by using the agglomerated abrasive grains having a compressive fracture strength of 20MPa or less, abrasion of the abrasive grains is gradually performed during polishing, a new edge is easily generated, the processing efficiency is improved during polishing of the surface of the protective layer 4, the quality is improved, and further, the state can be easily maintained for a long period of time. On the other hand, if the compressive fracture strength of the agglomerated abrasive grains is too high, new polishing damage may be applied to the surface of the protective layer 4 during polishing, and the surface quality may be degraded.
Further, by using primary particles composed of an inorganic oxide as agglomerated abrasive grains, contamination and damage of the surface of the protective layer 4 can be easily removed.
The present invention is not limited to the above-described embodiments, and other configurations, etc., which can achieve the object of the present invention, are included in the present invention as modified examples shown below.
For example, in the above-described embodiment, the maximum height roughness Rz in the surface of the protective layer 4 is set to 0.5 μm or less in the cutoff value of 0.25mm, but the maximum height roughness Rz may be larger than 0.5 μm if the arithmetic average roughness Ra is smaller than 0.03 μm in the cutoff value of 0.25 mm.
In the above embodiment, the average thickness of the protective layer is set to 0.2 μm or more, but for example, when the initial image quality is desired to be good, the average thickness of the protective layer may be set to less than 0.2 μm.
In the above embodiment, as the agglomerated abrasive particles, particles in which the average particle diameter of the primary particles is 4 μm or less, the compressive fracture strength is 20MPa or less, and the primary particles are made of an inorganic oxide are used, but the polishing mechanism may be any mechanism as long as it has agglomerated abrasive particles in which flaws on the surface of the protective layer 4 are removed and the corrugated shape can be maintained, and the average particle diameter, compressive fracture strength, and material of the primary particles may be appropriately selected.
The best constitution, method, etc. for carrying out the present invention are as described above, but the present invention is not limited thereto. That is, the present invention has been particularly shown and described with respect to specific embodiments, and various modifications may be made to the above-described embodiments by those skilled in the art without departing from the technical spirit and scope of the present invention.
Accordingly, the descriptions of the above-disclosed shapes, materials, and the like are merely illustrative for easy understanding of the present invention, and are not intended to limit the present invention. The description of the names of the components after some or all of the restrictions on the shape, material, etc. are removed is also included in the present invention.
[ Example ]
[ Surface State before and after polishing ]
A polishing film having an average particle diameter of the primary particles of 3 μm and a compressive fracture strength of 7.7MPa was used, and the unused photosensitive drum and the photosensitive drum after use were polished, and the arithmetic average roughness Ra and the maximum height roughness Rz before and after polishing were measured. The measurement used was Form Talysurf S4C manufactured by Taylor Hobson, inc. In addition, measurement was performed at 4 places (at intervals of 90 °) in the circumferential direction in the surface of the photosensitive drum. The results are shown in Table 1.
TABLE 1
By using the photosensitive drum, both the arithmetic average roughness Ra and the maximum height roughness Rz become large. In addition, in both the unused photosensitive drum and the photosensitive drum after use, the arithmetic average roughness Ra becomes smaller by grinding. The maximum height roughness Rz of the unused photosensitive drum is somewhat increased by grinding. By polishing the photosensitive drum after use, the maximum height roughness Rz becomes smaller, but is a larger value than before polishing of the photosensitive drum that is not used.
[ Type of polishing mechanism and polishing result ]
The surface of the photosensitive drum after use was polished by using the polishing mechanism of examples 1 to 5 and comparative examples 1 to 3 shown in table 2.
TABLE 2
The ultra-precise polishing film of comparative example 1 was a LAPIKA series 1200# film manufactured by KOVAX company. The ultra-precise polishing film of comparative example 2 was LAPIKA series 10000# film manufactured by KOVAX company, and the particle size was finer than that of comparative example 1. The polishing pad of comparative example 3 was SURFIN-3 of suede type manufactured by FUJIMI INCORPORATED, and the alumina slurry was obtained by mixing abrasive grains having an average particle diameter of 0.5 μm manufactured by FUJIMI INCORPORATED with water at a weight ratio of 5 wt%. In comparative example 3, alumina slurry was supplied to the polishing pad at a supply rate of 20cc/min during polishing.
The polishing results using the polishing mechanisms of examples 1 to 5 and comparative examples 1 to 3 are shown in Table 3.
TABLE 3 Table 3
In each of examples 1 to 6, occurrence of new damage due to polishing was suppressed. In particular, in examples 1 to 4, the occurrence of new damage due to polishing can be suppressed. In comparative example 1, new damage was generated by grinding. In addition, the occurrence of new damage was evaluated visually.
In each of examples 1 to 6, the generated damage can be removed by using a photosensitive drum. Neither comparative examples 2,3 could remove the generated damage by using a photosensitive drum.
That is, in any of examples 1 to 6, both suppression of the occurrence of new damage due to polishing and removal of damage due to use of the photosensitive drum can be achieved, but in comparative examples 1 to 3, both suppression of new damage and removal of damage can not be achieved. In any of examples 1 to 6, the arithmetic average roughness Ra was less than 0.03 μm at a cutoff value of 0.25mm, and the arithmetic average waviness Wa was 0.05 μm or more at a cutoff value of 2.5 mm.
The maximum height roughness Rz when the unused photosensitive drums were polished by the polishing mechanism of examples 1 to 6 is shown in table 4.
TABLE 4 Table 4
Rz(μm) | |
Example 1 | 0.25~0.35 |
Example 2 | 0.33~0.48 |
Example 3 | 0.25~0.35 |
Example 4 | 0.33~0.48 |
Example 5 | 0.6~0.11 |
Example 6 | 0.8~1.5 |
It can be seen that the larger the average particle diameter of the primary particles, the larger the maximum height roughness Rz, and the greater the compressive failure strength, the larger the maximum height roughness Rz.
[ Average particle diameter and grinding efficiency ]
The average polishing rate (polishing efficiency) when polishing using a polishing mechanism having primary particles with different average particle diameters was evaluated by making the compressive fracture strength substantially constant (8 Mpa). The results are shown in FIG. 7. The larger the average particle diameter of the primary particles, the higher the polishing efficiency, and when the average particle diameter is 3 μm or more, good polishing efficiency is obtained.
[ Variation in arithmetical average waviness due to grinding ]
The photoreceptor drum after use was subjected to polishing using the polishing mechanism of example 3, and the arithmetic average waviness Wa before and after polishing (before and after regeneration) was measured. The results are shown in FIG. 8. In each sample, the arithmetic average waviness Wa became smaller by grinding, and it became 0.05 μm or more even after grinding.
[ Thickness of protective layer after grinding ]
The photosensitive drum after use was polished by using the polishing mechanism of example 3, and the average thickness of the protective layer was 0.2 μm. Good results were obtained when the photosensitive drum thus polished was assembled into an image forming apparatus and subjected to a life test.
[ Change in capacitance due to polishing ]
Polishing was performed on the photosensitive drum after use using the polishing mechanism of example 3, and the electrostatic capacitance of the surface of the photosensitive drum 1 was measured before and after polishing. The results are shown in FIG. 9. The electrostatic capacitance was reduced by polishing, but no change was observed that affected the quality.
Claims (7)
1. A photosensitive drum in which a photosensitive layer and a protective layer are laminated in this order on an outer peripheral surface of a hollow cylindrical sleeve, characterized in that:
The surface of the protective layer has an arithmetic average roughness Ra of less than 0.03 μm at a cutoff value of 0.25mm and an arithmetic average waviness Wa of 0.05 μm or more at a cutoff value of 2.5mm,
Wherein the photosensitive drum is produced by subjecting the photosensitive drum after use to a grinding process,
Wherein in the polishing treatment, a polishing mechanism having agglomerated abrasive grains is used as polishing abrasive grains to polish the surface of the protective layer,
Wherein the agglomerated abrasive particles are agglomerates composed of a plurality of primary particles that are partially and slowly bonded to each other while forming voids to form a granular porous body.
2. The photosensitive drum according to claim 1, wherein:
The maximum height roughness Rz is 0.5 μm or less when the cut-off value is 0.25mm on the surface of the protective layer.
3. The photosensitive drum according to claim 1 or 2, wherein:
the protective layer has an average thickness of 0.2 μm or more.
4. An image forming apparatus, characterized in that:
a photosensitive drum having any one of claims 1 to 3.
5. A photosensitive drum regenerating method for producing the photosensitive drum according to any one of claims 1 to 3 by subjecting a used photosensitive drum to a grinding treatment, characterized in that:
In the polishing treatment, a polishing mechanism having agglomerated abrasive grains is used as polishing abrasive grains to polish the surface of the protective layer,
Wherein the agglomerated abrasive particles are agglomerates composed of a plurality of primary particles that are partially and slowly bonded to each other while forming voids to form a granular porous body.
6. The photosensitive drum regeneration method according to claim 5, characterized in that:
the agglomerated abrasive particles used herein have an average primary particle diameter of 4 μm or less and a compressive fracture strength of 20MPa or less.
7. The photosensitive drum regeneration method according to claim 5 or 6, characterized in that:
as the agglomerated abrasive particles, primary particles made of an inorganic oxide are used.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2019159469A JP7375385B2 (en) | 2019-09-02 | 2019-09-02 | Photoconductor drum, image forming device, and photoconductor drum regeneration method |
JP2019-159469 | 2019-09-02 |
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CN112445089A CN112445089A (en) | 2021-03-05 |
CN112445089B true CN112445089B (en) | 2024-11-19 |
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