CN112417191B - Defect scanning result processing method, device, system and storage medium - Google Patents
Defect scanning result processing method, device, system and storage medium Download PDFInfo
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Abstract
The application provides a method, a device, a system and a storage medium for processing a defect scanning result, which are used for acquiring a scanning result file containing defect information of one or more wafers; and converting the scanning result file into a text file, and correcting the defect information in the text file. The application can automatically process in real time, solves the problems of manual error rate and timeliness and preservation limitation of the paper record, and solves the problems of slow inquiry speed and complicated process of the paper record.
Description
Technical Field
The present application relates to the field of semiconductor manufacturing, and in particular, to a method, apparatus, system, and storage medium for processing a defect scan result.
Background
The existing defect scanning machine for non-graphic wafers can be divided into a technician paper record and an EAP system for collecting the results after scanning the wafer defects according to different operation modes. The error condition of the manual record is unavoidable, and the timeliness and the storage place of the paper record are limited. The defect scanning result collected by the EAP system at present can be only checked on a machine table and cannot be stored, so that the process is complicated and the speed is low when the result is inquired. In addition, for the two modes, when the scanning result is abnormal, an engineer can only query the particle value of the wafer, and cannot check the distribution of defects on the wafer and the size of the defects, and at the moment, the wafer needs to be scanned again and shot or photographed, but the abnormal wafer is often recovered, so that the abnormal wafer cannot be re-detected. If the defect scanning result can be stored and the defect distribution and the real size on the wafer are restored, then the engineer can conveniently judge the defect source through the real-time inquiry of the system, so that an abnormal machine can be found in time, and the working efficiency of the wafer production and processing is improved.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present application is to provide a defect scan result processing method, apparatus, system and storage medium, which solve the problems in the prior art.
To achieve the above and other related objects, the present application provides a defect scan result processing method, including: acquiring a scanning result file containing defect information of one or more wafers; and converting the scanning result file into a text file, and correcting the defect information in the text file.
In an embodiment of the present application, the defect information includes: any one or more of defect size information, defect coordinate information, and defect number information.
In an embodiment of the present application, the method for converting the scan result file into a text file further includes: adding ID information corresponding to each wafer to the scanning result file so as to match the defect information corresponding to each wafer; the ID information includes: wafer Lot ID information and wafer ID information.
In an embodiment of the present application, the method for obtaining ID information includes: extracting time stamp information corresponding to each wafer to scan in the scanning result file, and obtaining ID information corresponding to each wafer according to the arrangement sequence or scanning sequence of each wafer; or directly providing the ID information corresponding to the wafer according to manual work.
In an embodiment of the present application, the method further includes: setting the acquired scanning result file as a shared file for real-time capturing and processing; and/or uploading the corrected text file for real-time inquiry.
In an embodiment of the present application, the method for correcting the defect information in the text file includes: determining that each defect in the defect information is a large particle defect or a small particle defect according to the numerical information in the converted text file; converting the defect size information corresponding to each defect in the text file into a real size according to a conversion formula; the conversion formula includes: (XSIZE 10-32768)/100.
In an embodiment of the present application, the method for correcting the defect information in the text file further includes: detecting the notch condition of each wafer before the wafer is subjected to defect scanning; searching whether the scanning result file formed after defect scanning contains notch detection information corresponding to each wafer; if yes, judging the direction followed by the defect information according to the gap detection information; if not, the direction followed by the defect information is determined to be uncertain.
To achieve the above and other related objects, the present application provides an electronic device comprising: the acquisition module is used for acquiring a scanning result file containing defect information of one or more wafers; and the processing module is used for converting the scanning result file into a text file and correcting the defect information in the text file.
To achieve the above and other related objects, the present application provides a computer system comprising: a memory, a processor, and a communicator; the memory is used for storing computer instructions; the processor executing computer instructions to implement the method as described above; the communicator is used for communicating with external equipment.
To achieve the above and other related objects, the present application provides a non-transitory computer-readable storage medium storing computer instructions which, when executed, perform a method as described above.
In summary, the method, apparatus, system and storage medium for processing a defect scan result according to the present application are provided by obtaining a scan result file containing defect information of one or more wafers; and converting the scanning result file into a text file, and correcting the defect information in the text file.
Has the following beneficial effects:
1. the system automatically processes in real time, so that the problem of manual error rate is solved;
2. the database records the scanning result, and solves the problems of timeliness and preservation limitation of the paper record;
3. the web page system queries in real time and historic, and solves the problems of low query speed and tedious process of the paper records;
4. the wafer defect distribution and defect size are completely recorded and restored, and the analysis of specific distribution or directional defect problems is facilitated.
Drawings
FIG. 1 is a flow chart illustrating a defect scan result processing method according to an embodiment of the application.
FIG. 2 is a schematic diagram showing the distribution of defect scan results according to an embodiment of the application.
Fig. 3 is a schematic block diagram of an electronic device according to an embodiment of the application.
FIG. 4 is a schematic diagram of a computer system according to an embodiment of the application.
Detailed Description
Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
The embodiments of the present application will be described in detail below with reference to the attached drawings so that those skilled in the art to which the present application pertains can easily implement the present application. This application may be embodied in many different forms and is not limited to the embodiments described herein.
In order to clearly explain the present application, components irrelevant to the description are omitted, and the same or similar components are given the same reference numerals throughout the description.
Throughout the specification, when a component is said to be "connected" to another component, this includes not only the case of "direct connection" but also the case of "indirect connection" with other elements interposed therebetween. In addition, when a certain component is said to "include" a certain component, unless specifically stated to the contrary, it is meant that other components are not excluded, but other components may be included.
When an element is referred to as being "on" another element, it can be directly on the other element but be accompanied by the other element therebetween. When a component is stated to be "directly on" another component, it is stated that there are no other components between them.
Although the terms first, second, etc. may be used herein to describe various elements in some examples, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Such as a first interface and a second interface, etc. Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and/or "including" specify the presence of stated features, steps, operations, elements, components, items, categories, and/or groups, but do not preclude the presence, presence or addition of one or more other features, steps, operations, elements, components, items, categories, and/or groups. The terms "or" and/or "as used herein are to be construed as inclusive, or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a, A is as follows; b, a step of preparing a composite material; c, performing operation; a and B; a and C; b and C; A. b and C). An exception to this definition will occur only when a combination of elements, functions, steps or operations are in some way inherently mutually exclusive.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the language clearly indicates the contrary. The meaning of "comprising" in the specification is to specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but does not preclude the presence or addition of other features, regions, integers, steps, operations, elements, and/or components.
Terms representing relative spaces such as "lower", "upper", and the like may be used to more easily describe the relationship of one component relative to another component illustrated in the figures. Such terms refer not only to the meanings indicated in the drawings, but also to other meanings or operations of the device in use. For example, if the device in the figures is turned over, elements described as "under" other elements would then be oriented "over" the other elements. Thus, the exemplary term "lower" includes both upper and lower. The device may be rotated 90 deg. or at other angles and the terminology representing relative space is to be construed accordingly.
Although defined differently, including technical and scientific terms used herein, all have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The term addition defined in the commonly used dictionary is interpreted as having a meaning conforming to the contents of the related art document and the current hint, so long as no definition is made, it is not interpreted as an ideal or very formulaic meaning too much.
The method is mainly provided for solving the problems of the existing scanning results of the non-graphic wafer.
For example, a KLA-Tencor defect scanner of usa department epitaxy company scans a wafer to form a particle map, which can see defect information such as defect size, defect coordinates, defect number, etc. on the machine, for example, the defect number (which can be divided into a plurality of size intervals, such as 0.2-0.3 um, 0.3-0.4 um), and the large particle defect number (such as more than 0.5 um). However, the file containing the defect information is exported to be a tff format file, but the file cannot be effectively opened, that is, the file cannot be opened to obtain all the defect information, for example, only the defect number information can be seen, and other information such as defect coordinate information or defect size (defect size) information is lost, so that the scanning result file cannot be exported and stored truly and completely.
However, the scanning result cannot be queried in real time, and when an engineer needs to query or restore the scanning result when judging the source of the defect, or when the defect scanning machine accumulates more files or fails, the query process is often troublesome, thereby affecting the efficiency of searching for abnormal machines.
In summary, the present application proposes a method, apparatus, system and storage medium for processing a defect scan result, so as to solve the above-mentioned problems.
As shown in fig. 1, a defect scan result processing method according to an embodiment of the application is shown. As shown, the illustrated method includes:
step S101: a scan result file containing defect information for one or more wafers is obtained.
In this embodiment, the scan result file containing the defect information of one or more wafers is an original defect scan result file obtained by scanning the wafers by the existing defect scanner for the non-patterned wafers.
For example, a KLA-Tencor defect scanner from Usco may scan a wafer to form a particle map. And exporting the particle map to obtain the scanning result file.
The scan result file may include defect scan results for one or more wafers. The defect scanning machine can scan one or more wafers at a time to form one or more scanning results, and a scanning result file is formed for one scanning result or for all wafers of a Lot Lot.
In an embodiment of the present application, the defect information includes: any one or more of defect size information, defect coordinate information, and defect number information.
In the present embodiment, specifically, the defect information may be presented in the form of a defect MAP (MAP). FIG. 2 is a schematic diagram showing the distribution of defect scan results according to an embodiment of the application. The number of defects, the size of the defects, and the location of the defects can be read from the defect MAP (MAP) in the figure. For example, common defects include large particle defects, small particle defects, and the like.
In the actual production and processing process, the problems of the corresponding machine for processing the wafers can be known by analyzing the scanning results of the wafers, so that the problems can be rapidly solved.
Because the original defect scanning result file is only stored in the local part of the defect scanning machine, when the defect scanning machine accumulates more files or fails, huge trouble is brought to searching the scanning result file.
In an embodiment of the present application, the step S101 further includes: and setting the acquired scanning result file as a shared file for capturing and processing in real time.
In this embodiment, by setting the file sharing device as a shared file, other terminals or remote servers can grab the file in real time, so as to achieve the purpose of real-time processing.
It should be noted that, the processing herein is mainly early simple operation processing, for example, by checking a scanning result file, whether the scanning result is normal or not is judged in advance, and whether the content of the file is normal or not is judged in advance, so as to prompt to re-perform defect scanning in time. For example, there are cases where display is impossible, or a problem occurs in the scanning process, and a scanning result file or the like cannot be read.
In the embodiment, the method can set automatic circulation operation, grasp and process the defect scanning result file in real time, and store the database for a long time so as to achieve the purpose of inquiring the current scanning result and the historical scanning result in real time.
Step S102: and converting the scanning result file into a text file, and correcting the defect information in the text file.
It should be noted that, as can be seen from the foregoing, the obtained scan result file cannot completely read out the defect information, and even the unreadable file, and in order to be able to store the file containing the defect information, it is necessary to convert it into a readable text file. The converted result file is a txt format file, the content of which is similar to excel, the first row column name, and each row displays one piece of defect information.
In short, the backup is performed, but the backup necessarily occupies extra memory, so that the backup is converted into a text file with smaller memory.
In this embodiment, the conversion of the scan result file may be performed by file conversion software used in the field of defect scanning for patterned wafers, such as file conversion software designed for defect scanning for patterned wafers by KLA series of usa epitaxy company. Alternatively, the conversion can be performed by file software which is autonomously designed based on the defect scanner.
However, the defect information contained in the text file converted in the above manner is also incomplete or erroneous, and there is no software or technology for converting the scan result file specifically for the non-patterned wafer. Therefore, it is also necessary to supplement, modify or restore defect information in the converted text file.
In an embodiment of the present application, the converted text file contains defect coordinate information, but lacks defect size information and defect number information, and lacks ID information of the corresponding wafer.
In order to facilitate the subsequent query of the scanning result for any wafer, the method of the present application needs to match the information of each wafer with the wafer in the scanning result.
In an embodiment of the present application, for lack of ID information of the corresponding wafer, step S102 includes:
adding ID information corresponding to each wafer to the scanning result file so as to match the defect information corresponding to each wafer; the ID information includes: wafer Lot ID information and wafer ID information.
Specifically, before conversion, ID information corresponding to each wafer is added to the scan result file.
The wafer Lot is a Lot of wafers, for example, a wafer Lot includes 25 wafers.
In an embodiment of the present application, the method for obtaining ID information includes:
A. and extracting the time stamp information corresponding to each wafer in the scanning result file for scanning, and obtaining the ID information corresponding to each wafer according to the arrangement sequence or the scanning sequence of each wafer.
In an embodiment, the acquiring method is based on an EAP operation mode, and the obtained scanning result file includes time stamp information corresponding to each wafer to be scanned. For example, at 9:00 scans for the first time, 9:05 a list of secondary equal time information is scanned. Correspondingly, the ID information of each corresponding wafer in the scanning result file can be matched by recording the arrangement sequence or the scanning sequence of each wafer.
Or B, directly providing the ID information corresponding to the wafer according to manual work.
In another embodiment, the acquisition method is based on manual operation mode, wherein the wafer lot ID and wafer ID information are entered by a technician.
When the scanning result is abnormal, the engineer can only inquire the particle value of the wafer and cannot check the distribution and specific size of the defects on the wafer, so that certain processing is required to be carried out on the defect information of each wafer corresponding to the scanning result file.
In an embodiment, the method of the present application needs to extract and restore the required information from the scan result file, and the scan result file is stored in a specific manner after being converted into a readable text; therefore, judgment and processing according to the rule are required.
In an embodiment of the present application, for lack of ID information of the corresponding wafer, step S102 further includes:
A. and determining that each defect in the defect information is a large particle defect or a small particle defect according to the numerical value information in the converted text file.
In one embodiment, whether the value of the CLASSENUMBER column in the converted text file is 1 is used for judging whether the text file is a small particle defect, if 1 is a small particle, and if not 1 is a large particle.
B. Converting the defect size information corresponding to each defect in the text file into a real size according to a conversion formula; the conversion formula includes: (XSIZE 10-32768)/100.
In one embodiment, the text file after transformation contains Xsize, ysize, DEFECTAREA and Dsize columns, but the numerical values are not actual defect sizes, and the numerical values of Xsize columns need to be subjected to a fixed formula to obtain the defect actual sizes, specifically, the transformation formula includes: (XSIZE 10-32768)/100. In this method, the real value is written into DSIZE column (diameter size) for the subsequent system.
In addition, the large particle defects in the machine scanning result have only a number and no specific defect size, so that specific values cannot be obtained in the method, and the size of the large particle defects is fixedly defined as 999 as the representative value.
For example, the conversion formula includes two modes, namely a first mode and a second mode, which are two methods for two different machines, and are two conversion modes of not the same file:
mode one: and counting defects with the value of 1 in the CLASSENUMBER column according to the text file, namely confirming the corresponding defects as small particle defects and obtaining the number of the small particle defects. Correspondingly, converting DSIZE (defect diameter) values in the text file through calculation of a formula (XSIZE 10-32768)/1000 so as to obtain the actual size of the small particle defect; and counting defects with the number of not 1 in the CLASSENUMBER column, namely confirming the corresponding defects as large particle defects and obtaining the number of the defects. Since there is no specific defect size value for large-grain defects in the original scan result file, their DSIZE (defect diameter) is uniformly rewritten to 999.
Mode two: calculating DSIZE (defect diameter) in the text file by a formula (XSIZE 10-32768)/1000, and when the converted value is not 0, confirming the corresponding defect as a small particle defect and obtaining the number of the small particle defect, and the converted value is the defect size; the entry number with a calculated value of 0 is rewritten to 999, which corresponds to the number of large particle defects.
In some cases, because the unpatterned wafer has no pattern, it is sometimes impossible to determine the correspondence between the defect distribution map and the wafer direction, and therefore, a method is needed to accurately determine the correspondence between the defect distribution map and the wafer direction. The specific method comprises the following steps:
in an embodiment of the present application, the step S102 specifically further includes:
A. detecting the notch condition of each wafer before carrying out defect scanning on each wafer;
B. searching whether the scanning result file contains notch detection information corresponding to each wafer;
C. if yes, judging the direction followed by the defect information according to the gap detection information; if not, the direction followed by the defect information is determined to be uncertain.
In particular, most wafers have a small notch or linear boundary on the wafer to facilitate confirming the orientation of the wafer.
For example, find gap before each scan (notch) is set, and save option is set as scan result file in extended mode, path is machine local folder, or save in association with defect scan result file.
After the defect scanning is completed, detecting whether the scanning result file exists [ Sample Orientation Mark Type NOTCH; if any, it can be determined that the wafer MAP (distribution MAP) direction is downward; if not, it indicates that no wafer gap is detected before scanning, and the defect MAP is in an indefinite direction.
In an embodiment of the present application, the corrected text file is uploaded for real-time query.
And finally, importing the corrected result file into the existing defect management system database to realize webpage end inquiry.
In some embodiments, the method of the present application may be implemented by performing corresponding program setting on an existing defect management system: storing each wafer scanning result file to a machine hard disk, capturing the scanning result file by a remote server, inquiring a wafer lot ID and a wafer ID corresponding to the wafer scanning time by utilizing the uniqueness of the wafer scanning time in the file, writing the two IDs into the wafer scanning result file, converting the wafer scanning result file into a text format file, converting the data value of the defect size according to a fixed condition formula, storing the data value into a defect management system database, realizing real-time inquiry of a webpage end, and completely restoring the wafer scanning result information (defect distribution and size).
In conclusion, the method can automatically process in real time, and solve the problem of manual error rate; the database records the scanning result, and solves the problems of timeliness and preservation limitation of the paper record; the web page system queries in real time and historic, and solves the problems of low query speed and tedious process of the paper records; the wafer defect distribution and defect size are completely recorded and restored, and the analysis of specific distribution or directional defect problems is facilitated.
As shown in fig. 3, a block diagram of an electronic device according to an embodiment of the application is shown. As shown, the apparatus 300 includes:
an obtaining module 301, configured to obtain a scan result file containing defect information of one or more wafers;
and a processing module 302, configured to convert the scan result file into a text file, and correct the defect information in the text file.
It should be noted that, because the content of information interaction and execution process between the modules/units of the above-mentioned device is based on the same concept as the method embodiment of the present application, the technical effects brought by the content are the same as the method embodiment of the present application, and the specific content can be referred to the description in the foregoing illustrated method embodiment of the present application, which is not repeated herein.
It should be further noted that, it should be understood that the division of the modules of the above apparatus is merely a division of a logic function, and may be fully or partially integrated into a physical entity or may be physically separated. And these units may all be implemented in the form of software calls through the processing element; or can be realized in hardware; the method can also be realized in a form of calling software by a processing element, and the method can be realized in a form of hardware by a part of modules. For example, the processing module 302 may be a processing element that is set up separately, may be implemented in a chip of the above-mentioned apparatus, or may be stored in a memory of the above-mentioned apparatus in the form of program codes, and may be called by a processing element of the above-mentioned apparatus to execute the functions of the above-mentioned processing module 302. The implementation of the other modules is similar. In addition, all or part of the modules can be integrated together or can be independently implemented. The processing element described herein may be an integrated circuit having signal processing capabilities. In implementation, each step of the above method or each module above may be implemented by an integrated logic circuit of hardware in a processor element or an instruction in a software form.
For example, the modules above may be one or more integrated circuits configured to implement the methods above, such as: one or more application specific integrated circuits (Application Specific Integrated Circuit, abbreviated as ASIC), or one or more microprocessors (digital signal processor, abbreviated as DSP), or one or more field programmable gate arrays (Field Programmable Gate Array, abbreviated as FPGA), or the like. For another example, when a module above is implemented in the form of a processing element scheduler code, the processing element may be a general-purpose processor, such as a central processing unit (Central Processing Unit, CPU) or other processor that may invoke the program code. For another example, the modules may be integrated together and implemented in the form of a system-on-a-chip (SOC).
FIG. 4 is a schematic diagram of a computer system according to an embodiment of the application. As shown, the computer system 400 includes: a memory 401, a processor 402, and a communicator 403; the memory 401 is used for storing computer instructions; the processor 402 executes computer instructions to implement the method as described in fig. 1. The communicator 403 communicates with an external device.
For example, the external device may be a defect scanner. The computer system 400 may be a defect scan management system.
In some embodiments, the number of the memories 401 in the computer system 400 may be one or more, the number of the processors 402 may be one or more, and the number of the communicators 403 may be one or more, and one is exemplified in fig. 4.
In an embodiment of the present application, the processor 402 in the computer system 400 loads one or more instructions corresponding to the processes of the application program into the memory 401 according to the steps described in fig. 1, and the processor 402 executes the application program stored in the memory 401, so as to implement the method described in fig. 1.
The memory 401 may include a random access memory (Random Access Memory, abbreviated as RAM) or may include a non-volatile memory (non-volatile memory), such as at least one magnetic disk memory. The memory 401 stores an operating system and operating instructions, executable modules or data structures, or a subset thereof, or an extended set thereof, wherein the operating instructions may include various operating instructions for implementing various operations. The operating system may include various system programs for implementing various underlying services and handling hardware-based tasks.
The processor 402 may be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU for short), a network processor (Network Processor, NP for short), etc.; but also digital signal processors (Digital Signal Processing, DSP for short), application specific integrated circuits (Application Specific Integrated Circuit, ASIC for short), field-programmable gate arrays (Field-Programmable Gate Array, FPGA for short) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.
The communicator 403 is configured to implement a communication connection between the database access apparatus and other devices (e.g., clients, read-write libraries, and read-only libraries). The communicator 303 may comprise one or more sets of modules of different communication means, for example CAN communication modules communicatively coupled to a CAN bus. The communication connection may be one or more wired/wireless communication means and combinations thereof. The communication mode comprises the following steps: any one or more of the internet, CAN, intranet, wide Area Network (WAN), local Area Network (LAN), wireless network, digital Subscriber Line (DSL) network, frame relay network, asynchronous Transfer Mode (ATM) network, virtual Private Network (VPN), and/or any other suitable communication network. For example: any one or more of WIFI, bluetooth, NFC, GPRS, GSM, and ethernet.
In some specific applications, the various components of computer system 400 are coupled together by a bus system, which may include a power bus, a control bus, a status signal bus, and the like, in addition to a data bus. But for purposes of clarity of illustration the various buses are referred to in fig. 4 as a bus system.
In one embodiment of the present application, a non-transitory computer readable storage medium is provided, on which a computer program is stored, which when executed by a processor, implements the method as described in fig. 1.
The computer-readable storage medium, as will be appreciated by one of ordinary skill in the art: embodiments of the system and the functions of the units may be implemented by means of hardware related to a computer program. The aforementioned computer program may be stored in a computer readable storage medium. When executed, the program performs an embodiment including the functions of the system and the units; and the aforementioned storage medium includes: various media that can store program code, such as ROM, RAM, magnetic or optical disks.
In summary, the present application provides a method, apparatus, system and storage medium for processing a defect scan result, which obtain a scan result file containing defect information of one or more wafers; and converting the scanning result file into a text file, and correcting the defect information in the text file.
The application effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present application and its effectiveness, and are not intended to limit the application. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the application. Accordingly, it is intended that all equivalent modifications and variations of the application be covered by the claims, which are within the ordinary skill of the art, be included within the scope of the appended claims.
Claims (8)
1. A method for processing a defect scan result, the method comprising:
acquiring a scanning result file containing defect information of one or more wafers;
converting the scanning result file into a text file, and correcting the defect information in the text file; the defect information comprises defect size information and defect coordinate information;
judging whether each defect is a large particle defect or a small particle defect according to the converted value of the CLASSENUMBER column in the text file; respectively obtaining the real size of the large particle defect and the real size of the small particle defect; the true size of the large particle defect is set to 999; the transformation formula of the true size of the small particle defect is (XSIZE 10-32768)/100.
2. The method of claim 1, wherein the method of converting the scan result file to a text file further comprises: adding ID information corresponding to each wafer to the scanning result file so as to match the defect information corresponding to each wafer; the ID information includes: wafer Lot ID information and wafer ID information.
3. The method according to claim 2, wherein the ID information acquisition method includes:
extracting time stamp information corresponding to each wafer to scan in the scanning result file, and obtaining ID information corresponding to each wafer according to the arrangement sequence or scanning sequence of each wafer;
or directly providing the ID information corresponding to the wafer according to manual work.
4. The method according to claim 1, wherein the method further comprises: setting the acquired scanning result file as a shared file for real-time capturing and processing; and/or uploading the corrected text file for real-time inquiry.
5. The method of claim 1, wherein the method of correcting the defect information in the text file further comprises:
detecting the notch condition of each wafer before the wafer is subjected to defect scanning;
searching whether the scanning result file formed after defect scanning contains notch detection information corresponding to each wafer;
if yes, judging the direction followed by the defect information according to the gap detection information; if not, the direction followed by the defect information is determined to be uncertain.
6. An electronic device, the device comprising:
the acquisition module is used for acquiring a scanning result file containing defect information of one or more wafers;
the processing module is used for converting the scanning result file into a text file and correcting the defect information in the text file; the defect information comprises defect size information and defect coordinate information; judging whether each defect is a large particle defect or a small particle defect according to the converted value of the CLASSENUMBER column in the text file; respectively obtaining the real size of the large particle defect and the real size of the small particle defect; the true size of the large particle defect is set to 999;
the transformation formula of the true size of the small particle defect is (XSIZE 10-32768)/100.
7. A computer system, the system comprising: a memory, a processor, and a communicator; the memory is used for storing computer instructions; the processor executing computer instructions to implement the method of any one of claims 1 to 5; the communicator is used for communicating with the outside.
8. A non-transitory computer readable storage medium storing computer instructions which, when executed, perform the method of any one of claims 1 to 5.
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