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CN112415366B - Structure for constructing test microenvironment - Google Patents

Structure for constructing test microenvironment Download PDF

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Publication number
CN112415366B
CN112415366B CN202011299259.2A CN202011299259A CN112415366B CN 112415366 B CN112415366 B CN 112415366B CN 202011299259 A CN202011299259 A CN 202011299259A CN 112415366 B CN112415366 B CN 112415366B
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test
area
tested
constructing
microporous
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CN112415366A (en
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冯雪
付浩然
张柏诚
唐瑞涛
周涛
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Tsinghua University
Institute of Flexible Electronics Technology of THU Zhejiang
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2881Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
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  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)

Abstract

The application relates to a structure for constructing a test microenvironment, which comprises a microporous matrix and at least two channels formed inside the microporous matrix, wherein the at least two channels comprise at least two of an electric heating channel, a gas circulation channel and a liquid circulation channel, and the microporous matrix is matched with the area of a region to be tested and can be supported above the region to be tested. The structure space of this application occupies for a short time, and can provide stable environmental parameter, is applicable to the test of small-size device.

Description

用于构建测试微环境的结构The structure used to build the test microenvironment

技术领域technical field

本申请涉及测试技术领域,具体涉及一种用于构建测试微环境的结构。The present application relates to the technical field of testing, in particular to a structure for building a testing microenvironment.

背景技术Background technique

可靠性试验,是指通过试验测定和验证产品的可靠性,在有限的样本、时间和使用费用下,找出产品薄弱环节,是为了解、评价、分析和提高产品的可靠性而进行的各种试验的总称。在芯片可靠性测试方法中,不同使用环境下的芯片结构和性能稳定性是芯片的重要测试项目之一,在目前的芯片测试当中,温湿度环境主要由温湿度箱提供,由于芯片面积微小,这类装置不仅空间占用大,也无法保证环境参数的稳定性,影响测试结果的准确性。Reliability test refers to the determination and verification of the reliability of the product through the test, and to find out the weak link of the product under the limited sample, time and use cost. It is to understand, evaluate, analyze and improve the reliability of the product. The general term for all kinds of tests. In the chip reliability test method, the chip structure and performance stability under different usage environments are one of the important test items of the chip. In the current chip test, the temperature and humidity environment is mainly provided by the temperature and humidity chamber. Due to the small chip area, This kind of device not only takes up a lot of space, but also cannot guarantee the stability of environmental parameters, which affects the accuracy of test results.

发明内容Contents of the invention

针对上述技术问题,本申请提供一种用于构建测试微环境的结构,空间占用小,可以提供稳定的环境参数,适用于小型器件的测试。In view of the above technical problems, the present application provides a structure for building a test microenvironment, which occupies a small space and can provide stable environmental parameters, and is suitable for testing small devices.

为解决上述技术问题,本申请提供一种用于构建测试微环境的结构,包括微孔基体及形成于所述微孔基体内部的至少两条通道,所述至少两条通道包括电加热通道、气体循环通道、液体循环通道中的至少两种,所述微孔基体与待测试区域的面积相匹配并可支撑于所述待测试区域的上方。In order to solve the above technical problems, the present application provides a structure for constructing a test microenvironment, including a microporous matrix and at least two channels formed inside the microporous matrix, and the at least two channels include electric heating channels, At least two of the gas circulation channel and the liquid circulation channel, the microporous matrix matches the area of the area to be tested and can be supported above the area to be tested.

可选的,所述至少两条流道均包括叉指部分,所述至少两条流道的所述叉指部分之间相向错位配合;和/或,所述至少两条流道均分别包括至少两个环形部分,所有所述环形部分同心设置,不同流道的所述环形部分之间交替设置。Optionally, each of the at least two flow channels includes interdigitated parts, and the interdigitated parts of the at least two flow channels are mutually misaligned; and/or, the at least two flow channels each include There are at least two annular parts, all the annular parts are concentrically arranged, and the annular parts of different flow channels are alternately arranged.

可选的,所述微孔基体为水凝胶、微孔分子筛、微孔泡沫、微孔陶瓷中的一种;和/或,所述微孔基体的微孔直径为0.1nm-1μm。Optionally, the microporous matrix is one of hydrogel, microporous molecular sieve, microporous foam, and microporous ceramic; and/or, the micropore diameter of the microporous matrix is 0.1 nm-1 μm.

可选的,所述通道的内径为0.1mm-5mm,所述微孔基体的厚度为2mm-5cm。Optionally, the inner diameter of the channel is 0.1mm-5mm, and the thickness of the microporous matrix is 2mm-5cm.

可选的,所述至少两条通道包括电加热通道,所述电加热通道中填充液态金属。Optionally, the at least two channels include an electric heating channel, and the electric heating channel is filled with liquid metal.

可选的,所述至少两条通道包括气体循环通道,所述气体循环通道的内壁设置气体分离膜。Optionally, the at least two channels include a gas circulation channel, and an inner wall of the gas circulation channel is provided with a gas separation membrane.

可选的,所述微孔基体的朝向所述待测试区域的一侧设有微凸起结构,所述微孔基体通过所述微凸起结构接触所述待测试区域的表面。Optionally, a side of the microporous substrate facing the region to be tested is provided with a microprotrusion structure, and the microporous substrate contacts the surface of the region to be tested through the microprotrusion structure.

可选的,所述微孔基体的朝向所述待测试区域的一侧设有至少一凹槽,所述凹槽的面积大于所述待测试区域的面积,所述凹槽的深度大于所述待测试区域的厚度。Optionally, at least one groove is provided on the side of the microporous substrate facing the region to be tested, the area of the groove is larger than the area of the region to be tested, and the depth of the groove is larger than that of the region to be tested. The thickness of the area to be tested.

可选的,所述用于构建测试微环境的结构还包括壳体,所述微孔基体收容于所述壳体,所述壳体的朝向所述待测试区域的一侧开口。Optionally, the structure for constructing the test microenvironment further includes a casing, the microporous matrix is housed in the casing, and one side of the casing is open toward the area to be tested.

可选的,所述待测试区域为芯片接线脚。Optionally, the area to be tested is a chip connection pin.

本申请的用于构建测试微环境的结构,包括微孔基体及形成于微孔基体内部的至少两条通道,至少两条通道包括电加热通道、气体循环通道、液体循环通道中的至少两种,微孔基体与待测试区域的面积相匹配并可支撑于待测试区域的上方。本申请的结构空间占用小,可以提供稳定的环境参数,适用于小型器件的测试。The structure used to construct the test microenvironment of the present application includes a microporous matrix and at least two channels formed inside the microporous matrix, and at least two channels include at least two of an electric heating channel, a gas circulation channel, and a liquid circulation channel. , the microporous matrix matches the area of the area to be tested and can be supported above the area to be tested. The structural space of the present application is small, can provide stable environmental parameters, and is suitable for testing small devices.

附图说明Description of drawings

图1是根据第一实施例示出的用于构建测试微环境的结构的俯视图;Fig. 1 is a top view of a structure for constructing a test microenvironment shown according to a first embodiment;

图2是根据第一实施例示出的用于构建测试微环境的结构的使用状态示意图;Fig. 2 is a schematic view of the state of use of the structure for constructing the test microenvironment shown according to the first embodiment;

图3是图2所示的结构沿I-I线的剖视图;Fig. 3 is the sectional view of structure shown in Fig. 2 along I-I line;

图4是根据第一实施例示出的用于构建测试微环境的结构的另一种使用状态示意图;Fig. 4 is a schematic diagram of another usage status of the structure for building a test microenvironment shown according to the first embodiment;

图5是根据第二实施例示出的用于构建测试微环境的结构的俯视图;Fig. 5 is a top view of a structure for constructing a test microenvironment shown according to a second embodiment;

图6是根据第三实施例示出的用于构建测试微环境的结构处于使用状态时的剖视图;Fig. 6 is a cross-sectional view of the structure for constructing the test microenvironment according to the third embodiment when it is in use;

图7是根据第四实施例示出的用于构建测试微环境的结构处于使用状态时的剖视图;Fig. 7 is a cross-sectional view of the structure for constructing the test microenvironment according to the fourth embodiment when it is in use;

图8是根据第五实施例示出的用于构建测试微环境的结构处于使用状态时的剖视图。Fig. 8 is a cross-sectional view of the structure for constructing a test microenvironment according to the fifth embodiment when it is in use.

具体实施方式Detailed ways

以下由特定的具体实施例说明本申请的实施方式,熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本申请的其他优点及功效。The implementation of the present application will be described by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

在下述描述中,参考附图,附图描述了本申请的若干实施例。应当理解,还可使用其他实施例,并且可以在不背离本申请的精神和范围的情况下进行机械组成、结构、电气以及操作上的改变。下面的详细描述不应该被认为是限制性的,这里使用的术语仅是为了描述特定实施例,而并非旨在限制本申请。In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the application. It is to be understood that other embodiments may be utilized, and mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered limiting, and the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application.

虽然在一些实例中术语第一、第二等在本文中用来描述各种元件,但是这些元件不应当被这些术语限制。这些术语仅用来将一个元件与另一个元件进行区分。Although in some instances the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

再者,如同在本文中所使用的,单数形式“一”、“一个”和“该”旨在也包括复数形式,除非上下文中有相反的指示。应当进一步理解,术语“包含”、“包括”表明存在所述的特征、步骤、操作、元件、组件、项目、种类、和/或组,但不排除一个或多个其他特征、步骤、操作、元件、组件、项目、种类、和/或组的存在、出现或添加。此处使用的术语“或”和“和/或”被解释为包括性的,或意味着任一个或任何组合。因此,“A、B或C”或者“A、B和/或C”意味着“以下任一个:A;B;C;A和B;A和C;B和C;A、B和C”。仅当元件、功能、步骤或操作的组合在某些方式下内在地互相排斥时,才会出现该定义的例外。Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms "comprising", "comprising" indicate the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not exclude one or more other features, steps, operations, The existence, occurrence or addition of an element, component, item, species, and/or group. The terms "or" and "and/or" as used herein are to be construed as inclusive, or to mean either one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C" . Exceptions to this definition will only arise when combinations of elements, functions, steps or operations are inherently mutually exclusive in some way.

本申请的用于构建测试微环境的结构,包括微孔基体及形成于微孔基体内部的至少两条通道,至少两条通道包括电加热通道、气体循环通道、液体循环通道中的至少两种,微孔基体与待测试区域的面积相匹配并可支撑于待测试区域的上方。The structure used to construct the test microenvironment of the present application includes a microporous matrix and at least two channels formed inside the microporous matrix, and at least two channels include at least two of an electric heating channel, a gas circulation channel, and a liquid circulation channel. , the microporous matrix matches the area of the area to be tested and can be supported above the area to be tested.

其中,微孔基体中设置电加热通道、气体循环通道、液体循环通道中的至少两种,电加热通道、气体循环通道、液体循环通道可以分别是一条、两条或多条。电加热通道用于对环境进行加热;气体循环通道可以提供所需类型的气体,如腐蚀性气体、惰性气体、臭氧等,不同气体循环通道可以通入不同的气体;液体循环通道可以提供所需类型的液体,如纯水、腐蚀性液体等,不同的液体循环通道可以通入不同的液体。通过不同通道的组合可以提供不同的测试环境,如温湿度环境、腐蚀性气体环境、温度腐蚀性环境等,增加测试项目的多样性。此外,微孔基体在提供气体、液体扩散微孔的同时,可以使温度、气体浓度、湿度的分布更加均匀,通过将微孔基体设计成与待测试区域的面积相匹配并支撑于待测试区域的上方,空间占用小,并能提供稳定的微环境,使得环境参数的控制更加精确,尤其适用于在芯片等小型器件的可靠性测试中使用,提高测试的准确性。Wherein, at least two kinds of electric heating channels, gas circulation channels and liquid circulation channels are arranged in the microporous matrix, and there may be one, two or more electric heating channels, gas circulation channels and liquid circulation channels respectively. The electric heating channel is used to heat the environment; the gas circulation channel can provide the required type of gas, such as corrosive gas, inert gas, ozone, etc., and different gas circulation channels can be fed with different gases; the liquid circulation channel can provide the required Types of liquids, such as pure water, corrosive liquids, etc., different liquid circulation channels can lead to different liquids. Different test environments can be provided through the combination of different channels, such as temperature and humidity environment, corrosive gas environment, temperature corrosive environment, etc., increasing the diversity of test items. In addition, the microporous matrix can make the distribution of temperature, gas concentration and humidity more uniform while providing gas and liquid diffusion micropores. By designing the microporous matrix to match the area of the area to be tested and supported on the area to be tested Above, it takes up less space and can provide a stable micro-environment, making the control of environmental parameters more precise. It is especially suitable for use in the reliability testing of small devices such as chips to improve the accuracy of testing.

以下通过不同实施例对本申请的用于构建测试微环境的结构进行详细介绍。The structure for constructing the test microenvironment of the present application will be described in detail below through different embodiments.

第一实施例first embodiment

图1是根据第一实施例示出的用于构建测试微环境的结构的俯视图。如图1所示,本实施例的用于构建测试微环境的结构,包括微孔基体1及形成于微孔基体1内部的第一通道11、第二通道12。Fig. 1 is a top view of a structure for constructing a test microenvironment according to the first embodiment. As shown in FIG. 1 , the structure for constructing a test microenvironment in this embodiment includes a microporous matrix 1 and a first channel 11 and a second channel 12 formed inside the microporous matrix 1 .

微孔基体1为水凝胶、微孔分子筛、微孔泡沫、微孔陶瓷中的一种,优选的,微孔基体1为水凝胶,在具有亲水性、提供合适的微孔尺寸的同时具有柔性,水凝胶材料包括但不限于透明质酸、壳聚糖、聚丙烯酸、聚甲基丙烯酸、聚丙烯酰胺、聚N-聚代丙烯酰胺等。可选的,微孔基体1的微孔直径为0.1nm-1μm,第一通道11、第二通道12的内径为0.1mm-5mm,微孔基体1的厚度为2mm-5cm。The microporous matrix 1 is one of hydrogel, microporous molecular sieve, microporous foam, and microporous ceramics. Preferably, the microporous matrix 1 is a hydrogel, which is hydrophilic and provides suitable micropore size. Also flexible, hydrogel materials include, but are not limited to, hyaluronic acid, chitosan, polyacrylic acid, polymethacrylic acid, polyacrylamide, poly-N-polyacrylamide, and the like. Optionally, the micropore diameter of the microporous matrix 1 is 0.1 nm-1 μm, the inner diameters of the first channel 11 and the second channel 12 are 0.1 mm-5 mm, and the thickness of the microporous matrix 1 is 2 mm-5 cm.

第一通道11、第二通道12可以是电加热通道、气体循环通道、液体循环通道中的两种,在本实施例中,第一通道11为电加热通道,电加热通道中填充液态金属,第一通道11的两端连接加热电路111,实现温度可控,控温范围为0-90℃。由于液态金属的表面容易形成氧化膜,在第一通道11中填充液态金属不会导致液态金属从微孔基体1的微孔中泄露,可以正常起到通电加热环境的作用,同时,采用液态金属可以与微孔基体1的柔性相适应,结构整体具有柔性,可以更好地匹配待测试区域的表面形状,提供稳定、均一的微环境。The first channel 11 and the second channel 12 can be two types of electric heating channels, gas circulation channels, and liquid circulation channels. In this embodiment, the first channel 11 is an electric heating channel, and the electric heating channel is filled with liquid metal. Both ends of the first channel 11 are connected to a heating circuit 111 to realize temperature control, and the temperature control range is 0-90°C. Since the surface of the liquid metal is easy to form an oxide film, filling the first channel 11 with liquid metal will not cause the liquid metal to leak from the micropores of the microporous substrate 1, and it can normally play the role of heating the environment with electricity. At the same time, the use of liquid metal It can adapt to the flexibility of the microporous matrix 1, and the overall structure is flexible, which can better match the surface shape of the area to be tested and provide a stable and uniform microenvironment.

第二通道12为液体循环通道,液体循环通道中可以通入纯水,第二通道12的两端连接微循环泵121或水泵,实现湿度可控,湿度范围20%-100%。第二通道12中也可以通入0.9%的生理盐水,提供温湿度并具有腐蚀性的环境。The second channel 12 is a liquid circulation channel, and pure water can be passed into the liquid circulation channel, and the two ends of the second channel 12 are connected with a microcirculation pump 121 or a water pump to realize controllable humidity, and the humidity range is 20%-100%. 0.9% physiological saline can also pass through the second channel 12 to provide a corrosive environment with temperature and humidity.

可选的,第二通道12还可以是气体循环通道,气体循环通道的内壁设置气体分离膜,气体分离膜的材料包括但不限于聚亚酰胺材料或聚砜材料,通过在第二通道12的内壁设置气体分离膜,可以有效控制气体从第二通道12中进入环境的速度,提高气体浓度的稳定性。实际实现时,可以先制作聚亚酰胺材料或聚砜材料的管子,外面再包覆水凝胶材料,从而将气体分离膜形成于第二通道12的内壁。气体循环通道内可通入惰性气体、臭氧或腐蚀性气体(如氯气),以用于改变环境的含氧量、腐蚀气体浓度等,可以测试待测试区域在不同气体氛围下的稳定情况。Optionally, the second channel 12 can also be a gas circulation channel, the inner wall of the gas circulation channel is provided with a gas separation membrane, the material of the gas separation membrane includes but not limited to polyimide material or polysulfone material, through the second channel 12 The inner wall is provided with a gas separation membrane, which can effectively control the speed of the gas entering the environment from the second channel 12 and improve the stability of the gas concentration. In actual implementation, a tube made of polyimide material or polysulfone material can be made first, and then coated with a hydrogel material, so that the gas separation membrane is formed on the inner wall of the second channel 12 . Inert gas, ozone or corrosive gas (such as chlorine) can be introduced into the gas circulation channel to change the oxygen content of the environment, the concentration of corrosive gas, etc., and can test the stability of the area to be tested under different gas atmospheres.

在本实施例中,第一通道11包括第一叉指部分112,第二通道12包括第二叉指部分122,第一叉指部分112与第二叉指部分122之间相向错位配合,也即第一叉指部分112的叉指对应插入第二叉指部分122的叉指间的间隙中,形成错位配合结构。通过第一叉指部分112与第二叉指部分122可以有效限定出加热、加湿的范围,同时保证温度环境与湿度环境之间的均匀配合,形成稳定、均一的微环境。In this embodiment, the first channel 11 includes a first interdigitated portion 112, and the second channel 12 includes a second interdigitated portion 122, and the first interdigitated portion 112 and the second interdigitated portion 122 are mutually misaligned, and also That is, the fingers of the first finger portion 112 are correspondingly inserted into the gaps between the fingers of the second finger portion 122 to form a dislocation matching structure. The range of heating and humidification can be effectively limited by the first interdigitated part 112 and the second interdigitated part 122, and at the same time, the uniform cooperation between the temperature environment and the humidity environment can be ensured to form a stable and uniform microenvironment.

请一并结合图2与图3,微孔基体1与待测试区域的面积相匹配并可支撑于待测试区域的上方,在本实施例中,待测试区域为芯片接线脚21,芯片接线脚21位于芯片2的相对两侧,用于芯片2与衬底22上的电路之间的电连接。Please combine Fig. 2 and Fig. 3 together, microporous substrate 1 matches the area of the area to be tested and can be supported above the area to be tested. In this embodiment, the area to be tested is the chip wiring pin 21, and the chip wiring pin 21 are located on opposite sides of the chip 2 for electrical connection between the chip 2 and the circuit on the substrate 22 .

如图2所示,芯片2两侧的芯片接线脚21上分别覆盖一微孔基体1,微孔基体1的面积略大于芯片接线脚21所在的区域的面积,第一通道11和第二通道12的叉指部分位于芯片接线脚21的上方。本申请的微孔基体1采用水凝胶,可以根据芯片接线脚21所在区域的大小采用3D打印技术进行制备,方法简单且可尺寸定制。As shown in Figure 2, a microporous matrix 1 is respectively covered on the chip wiring pins 21 on both sides of the chip 2, and the area of the microporous matrix 1 is slightly larger than the area of the area where the chip wiring pins 21 are located. The first channel 11 and the second channel The interdigitated part of 12 is located above the pin 21 of the chip. The microporous matrix 1 of the present application is made of hydrogel, which can be prepared by 3D printing technology according to the size of the area where the chip wiring pin 21 is located. The method is simple and the size can be customized.

如图3所示,微孔基体1的朝向待测试区域的一侧设有微凸起结构13,微孔基体1通过微凸起结构13接触待测试区域的表面,同时可以保证微孔基体1与芯片2、芯片接线脚21的表面之间具有一定的微空间,使得温湿度更加均一。微凸起结构13的高度为0.5mm-20mm,微孔基体1的厚度为2mm-5cm(不含微凸起结构13的高度),每个微凸起结构13在高度方向上的投影面积为微孔基体1在厚度方向上的投影面积的5%-10%,微凸起结构13的数量可根据微孔基体1的厚度和面积进行调整,以达到合适的支撑力及微空间结构。As shown in Figure 3, the side of the microporous substrate 1 towards the area to be tested is provided with a micro-protrusion structure 13, and the microporous substrate 1 contacts the surface of the area to be tested through the micro-protrusion structure 13, while ensuring that the microporous substrate 1 There is a certain micro space between the surface of the chip 2 and the chip wiring pin 21, so that the temperature and humidity are more uniform. The height of the micro-protrusion structure 13 is 0.5mm-20mm, the thickness of the microporous substrate 1 is 2mm-5cm (excluding the height of the micro-protrusion structure 13), and the projected area of each micro-protrusion structure 13 in the height direction is The projected area of the microporous matrix 1 in the thickness direction is 5%-10%, and the number of micro-protruding structures 13 can be adjusted according to the thickness and area of the microporous matrix 1 to achieve proper supporting force and microspace structure.

图4是根据第一实施例示出的用于构建测试微环境的结构的另一种使用状态示意图。如图4所示,微孔基体1也可以整体覆盖在芯片2与芯片接线脚21的上方,第一通道11和第二通道12的叉指部分位于芯片2的上方,为芯片2与芯片接线脚21整体提供测试微环境。Fig. 4 is a schematic diagram of another use state of the structure for building a test microenvironment according to the first embodiment. As shown in Figure 4, the microporous substrate 1 can also cover the top of the chip 2 and the chip wiring pin 21 as a whole, and the interdigitated parts of the first channel 11 and the second channel 12 are located above the chip 2, and are used for connecting the chip 2 and the chip. Foot 21 provides a test microenvironment as a whole.

本申请的用于构建测试微环境的结构,包括微孔基体及形成于微孔基体内部的至少两条通道,至少两条通道包括电加热通道、气体循环通道、液体循环通道中的至少两种,微孔基体与待测试区域的面积相匹配并可支撑于待测试区域的上方。本申请的结构空间占用小,可以为狭小测试的空间稳定的环境参数,适用于小型器件的测试。The structure used to construct the test microenvironment of the present application includes a microporous matrix and at least two channels formed inside the microporous matrix, and at least two channels include at least two of an electric heating channel, a gas circulation channel, and a liquid circulation channel. , the microporous matrix matches the area of the area to be tested and can be supported above the area to be tested. The structural space of the present application is small, and can provide stable environmental parameters for a narrow test space, and is suitable for testing small devices.

第二实施例second embodiment

图5是根据第二实施例示出的用于构建测试微环境的结构的俯视图。如图5所示,本实施例的用于构建测试微环境的结构,包括微孔基体3及形成于微孔基体3内部的第一通道31、第二通道32。Fig. 5 is a top view of a structure for constructing a test microenvironment according to the second embodiment. As shown in FIG. 5 , the structure for constructing a test microenvironment in this embodiment includes a microporous matrix 3 and a first channel 31 and a second channel 32 formed inside the microporous matrix 3 .

与第一实施例的主要不同在于,本实施例的第一通道31与第二通道32均分别包括环形部分,第一通道31的环形部分与第二通道32的环形部分之间同心设置,第一通道31与第二通道32的环形部分之间交替设置,也即第一通道31的相邻两个环形部分之间具有一个第二通道32的环形部分。The main difference from the first embodiment is that the first channel 31 and the second channel 32 of this embodiment each include an annular portion, and the annular portion of the first channel 31 and the annular portion of the second channel 32 are arranged concentrically. The annular portions of a channel 31 and the second channel 32 are arranged alternately, that is, there is a annular portion of the second channel 32 between two adjacent annular portions of the first channel 31 .

通过第一通道31与第二通道32的环形部分可以有效限定出加热、加湿的范围,同时保证温度环境与湿度环境之间的均匀配合,形成稳定、均一的微环境。The range of heating and humidification can be effectively limited by the annular parts of the first passage 31 and the second passage 32, and at the same time, the uniform cooperation between the temperature environment and the humidity environment can be ensured to form a stable and uniform microenvironment.

本实施例的用于构建测试微环境的结构的其他特征可参考第一实施例的相关描述,在此不再赘述。For other features of the structure for constructing the test microenvironment in this embodiment, reference may be made to the relevant description of the first embodiment, which will not be repeated here.

第三实施例third embodiment

图6是根据第三实施例示出的用于构建测试微环境的结构处于使用状态时的剖视图。如图6所示,本实施例的用于构建测试微环境的结构包括壳体与第一实施例的区别在于,微孔基体4收容于壳体42,壳体42的朝向待测试区域的一侧开口。Fig. 6 is a cross-sectional view of the structure for constructing the test microenvironment according to the third embodiment when it is in use. As shown in FIG. 6 , the structure for constructing the test microenvironment of this embodiment includes a housing. Side opening.

微孔基体4的朝向待测试区域的一侧设有微凸起结构43,微孔基体4通过微凸起结构43接触芯片2或芯片接线脚的表面,同时可以保证微孔基体4与芯片2或芯片接线脚的表面具有一定的微空间,提高微环境的均匀性。The side of the microporous substrate 4 facing the area to be tested is provided with a micro-protrusion structure 43, and the microporous substrate 4 contacts the surface of the chip 2 or the chip wiring pin through the micro-protrusion structure 43, while ensuring that the microporous substrate 4 and the chip 2 Or the surface of the chip wiring pin has a certain microspace, which improves the uniformity of the microenvironment.

壳体42可采用壳聚糖材料或有机材料如聚二甲基硅氧烷(PDMS)、硅胶等制备得到,利用壳体42对微孔基体4的外侧表面进行覆盖,以保证内部的微环境不因外部环境改变而产生波动,提高测试微环境的稳定性。The shell 42 can be prepared by chitosan material or organic material such as polydimethylsiloxane (PDMS), silica gel, etc., and the outer surface of the microporous matrix 4 is covered by the shell 42 to ensure the internal microenvironment It does not fluctuate due to changes in the external environment and improves the stability of the test microenvironment.

本实施例的用于构建测试微环境的结构的其他特征可参考第一实施例的相关描述,在此不再赘述。For other features of the structure for constructing the test microenvironment in this embodiment, reference may be made to the relevant description of the first embodiment, which will not be repeated here.

第四实施例Fourth embodiment

图7是根据第四实施例示出的用于构建测试微环境的结构处于使用状态时的剖视图。如图7所示,本实施例的用于构建测试微环境的结构与第一实施例的区别在于,微孔基体5的朝向待测试区域的一侧设有凹槽53,凹槽53的面积大于待测试区域的面积,凹槽53的深度大于待测试区域的厚度。Fig. 7 is a cross-sectional view of the structure for constructing a test microenvironment according to the fourth embodiment when it is in use. As shown in Figure 7, the difference between the structure used to build the test microenvironment of this embodiment and the first embodiment is that a groove 53 is provided on the side of the microporous substrate 5 towards the region to be tested, and the area of the groove 53 is Greater than the area of the area to be tested, the depth of the groove 53 is greater than the thickness of the area to be tested.

通过设置面积大于待测试区域的面积、深度大于待测试区域的厚度的凹槽53,微孔基体5形成框架式结构,可直接架在衬底22上将测试区域整体覆盖,如同时覆盖芯片2与芯片接线脚21,实现芯片2与芯片接线脚21整体的测试,同时测试微环境的稳定性高。By setting the groove 53 with an area greater than the area to be tested and a depth greater than the thickness of the area to be tested, the microporous substrate 5 forms a frame structure, which can be directly mounted on the substrate 22 to cover the entire test area, such as covering the chip 2 at the same time. With the chip connection pin 21, the overall test of the chip 2 and the chip connection pin 21 is realized, and the stability of the test micro-environment is high at the same time.

为保证结构的稳定性,微孔基体5可优选采用微孔分子筛、微孔泡沫或微孔陶瓷等具有一定结构强度的材料。In order to ensure the stability of the structure, the microporous substrate 5 can preferably be made of materials with certain structural strength such as microporous molecular sieves, microporous foams or microporous ceramics.

本实施例的用于构建测试微环境的结构的其他特征可参考第一实施例的相关描述,在此不再赘述。For other features of the structure for constructing the test microenvironment in this embodiment, reference may be made to the relevant description of the first embodiment, which will not be repeated here.

第五实施例fifth embodiment

图8是根据第五实施例示出的用于构建测试微环境的结构处于使用状态时的剖视图。如图8所示,本实施例的用于构建测试微环境的结构与第四实施例的主要区别在于,微孔基体6的朝向待测试区域的一侧设有第一凹槽61与第二凹槽62,第一凹槽61与第二凹槽62的面积分别大于对应待测试区域的面积,第一凹槽61与第二凹槽62的深度分别大于对应待测试区域的厚度。Fig. 8 is a cross-sectional view of the structure for constructing a test microenvironment according to the fifth embodiment when it is in use. As shown in Figure 8, the main difference between the structure used to build the test microenvironment of this embodiment and the fourth embodiment is that the side of the microporous substrate 6 facing the area to be tested is provided with a first groove 61 and a second groove. The area of the groove 62 , the first groove 61 and the second groove 62 are respectively larger than the area of the corresponding area to be tested, and the depths of the first groove 61 and the second groove 62 are respectively greater than the thickness of the corresponding area to be tested.

通过设置面积大于待测试区域的凹槽的面积、深度大于待测试区域的厚度,微孔基体6形成框架式结构,可直接架在衬底22上将测试区域整体覆盖,如同时覆盖芯片2与芯片接线脚21,实现芯片2与芯片接线脚21整体的测试,同时,多个凹槽可以用于多个对象的批量测试,提高测试的效率。实际实现时,凹槽的数量还可以大于两个并呈阵列设置。By setting the area of the groove larger than the area to be tested and the depth greater than the thickness of the area to be tested, the microporous substrate 6 forms a frame structure, which can be directly mounted on the substrate 22 to cover the entire test area, such as covering the chip 2 and the test area at the same time. The chip connection pin 21 realizes the overall test of the chip 2 and the chip connection pin 21, and at the same time, multiple grooves can be used for batch testing of multiple objects to improve the test efficiency. In actual implementation, the number of grooves may be greater than two and arranged in an array.

为保证结构的稳定性,微孔基体6可优选采用微孔分子筛、微孔泡沫或微孔陶瓷等具有一定结构强度的材料。In order to ensure the stability of the structure, the microporous matrix 6 can preferably be made of materials with certain structural strength such as microporous molecular sieves, microporous foams or microporous ceramics.

本实施例的用于构建测试微环境的结构的其他特征可参考第一实施例的相关描述,在此不再赘述。For other features of the structure for constructing the test microenvironment in this embodiment, reference may be made to the relevant description of the first embodiment, which will not be repeated here.

上述实施例仅例示性说明本申请的原理及其功效,而非用于限制本申请。任何熟悉此技术的人士皆可在不违背本申请的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本申请所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本申请的权利要求所涵盖。The above-mentioned embodiments are only illustrative to illustrate the principles and effects of the present application, but are not intended to limit the present application. Any person familiar with the technology can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical ideas disclosed in the application shall still be covered by the claims of the application.

Claims (11)

1. A structure for constructing a test microenvironment is characterized by being applied to chip reliability test, and comprising a microporous matrix and at least two channels formed in the microporous matrix, wherein the at least two channels comprise at least two of an electric heating channel, a gas circulation channel and a liquid circulation channel, the microporous matrix is matched with the area of a region to be tested and can be supported above the region to be tested, the microporous matrix is used for providing gas and liquid diffusion micropores, and the gas circulation channel is used for providing gas for forming a test atmosphere; the liquid circulation channel is used for providing liquid for adjusting humidity, or the liquid circulation channel is used for providing liquid for forming a humidity and corrosive environment.
2. The structure for constructing a test microenvironment of claim 1, wherein the at least two channels each include interdigitated portions, the interdigitated portions of the at least two channels being in a phase-to-phase mismatch; and/or the at least two channels each comprise at least two annular portions, all the annular portions are concentrically arranged, and the annular portions of different channels are alternately arranged.
3. The structure for constructing a test microenvironment of claim 1, wherein the microporous matrix is one of a hydrogel, a microporous molecular sieve, a microporous foam, a microporous ceramic.
4. The structure for constructing test microenvironments of claim 1, wherein said microporous matrix has micropores of 0.1nm-1 μm diameter.
5. The structure for constructing test microenvironments according to any one of claims 1 to 4, wherein the inner diameter of the channel is 0.1mm-5mm and the thickness of the microporous matrix is 2mm-5cm.
6. The structure for constructing a test microenvironment of claim 1, wherein the at least two channels include the electrical heating channel filled with a liquid metal.
7. The structure for constructing a test microenvironment of claim 1, wherein the at least two channels include the gas circulation channel, an inner wall of the gas circulation channel being provided with a gas separation membrane.
8. The structure for constructing a testing microenvironment of claim 1, wherein a side of the microporous matrix facing the area to be tested is provided with a microprotrusion structure, the microporous matrix contacting a surface of the area to be tested through the microprotrusion structure.
9. The structure for constructing test microenvironments of claim 1, wherein a side of said microporous matrix facing said area to be tested is provided with at least one groove, said groove having an area larger than the area of said area to be tested and a depth larger than the thickness of said area to be tested.
10. The structure for constructing a testing microenvironment of claim 1, further comprising a housing, wherein the microporous matrix is received in the housing, and a side of the housing facing the area to be tested is open.
11. The structure for constructing a test microenvironment of claim 1, wherein the areas to be tested are chip terminal pins.
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