CN112415297A - A system and method for locating failure of cryogenic electronic components - Google Patents
A system and method for locating failure of cryogenic electronic components Download PDFInfo
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- CN112415297A CN112415297A CN202011052166.XA CN202011052166A CN112415297A CN 112415297 A CN112415297 A CN 112415297A CN 202011052166 A CN202011052166 A CN 202011052166A CN 112415297 A CN112415297 A CN 112415297A
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 62
- 239000000523 sample Substances 0.000 claims abstract description 39
- 238000001514 detection method Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 230000005611 electricity Effects 0.000 abstract description 9
- 230000000246 remedial effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a low temperature electronic components positioning system that became invalid, includes the location probe, the location probe includes that electricity connects, temperature sensor, fixed band, heating plate and heat conduction pad, the heating plate sets up on the heat conduction pad, and temperature sensor and fixed band set up on the heating plate, electricity connect respectively with temperature sensor, heating plate electric connection, be connected to external power source and switch through the electricity. The invention provides a low-temperature electronic component failure positioning method based on the system, which is characterized in that each electronic component in a failed electronic product is sequentially heated to the normal working temperature through a heating sheet, whether the electronic product recovers the function or not is detected after the heating is finished, whether each electronic component in the failed electronic product fails at a low temperature or not is checked, the electronic components do not need to be lapped and flying, and the electronic components are not damaged.
Description
Technical Field
The invention relates to the field of electronic components, in particular to a system and a method for positioning failure of a low-temperature electronic component.
Background
Certain classes of electronic products may require performance that is compatible with high and low temperature operating environments. The electronic product only has functional failure at low temperature, and is often caused by the failure of electronic components during the low-temperature performance test of the electronic product. At present, the principle of troubleshooting electronic products in low-temperature environments is to collect electric signals related to fault functions in a flying wire mode, analyze and compare the electric signals, and then locate faulty electronic components. One function of an electronic product is usually related to dozens of electric signals, and the electric signals of only a few electronic components can be collected once by overlapping a flying line, and meanwhile, the assembly, welding and three-prevention of the electronic components can be damaged, and secondary reworking repair is needed; the secondary flying line lapping can not be carried out at low temperature, so that the failed electronic component needs to be positioned by carrying out multiple low-temperature tests; and the judgment of the fault electric signal has higher requirement on the technical level of the debugging personnel. The defects lead to long failure positioning period, low efficiency and high cost of the electronic components in the low-temperature environment.
Disclosure of Invention
The invention aims to: the low-temperature electronic component failure positioning system is provided, a low-temperature electronic component failure positioning method is provided based on the system, each electronic component in a failed electronic product is sequentially heated to a normal working temperature through a heating sheet, whether the electronic product recovers the function after heating is finished is detected, whether each electronic component in the failed electronic product fails at a low temperature is checked, and the problem is solved.
The technical scheme adopted by the invention is as follows:
the utility model provides a low temperature electronic components positioning system that became invalid, includes the location probe, the location probe includes that electricity connects, temperature sensor, fixed band, heating plate and heat conduction pad, the heating plate sets up on the heat conduction pad, and temperature sensor and fixed band set up on the heating plate, electricity connect respectively with temperature sensor, heating plate electric connection, be connected to external power source and switch through the electricity.
In order to better implement the scheme, the system further comprises a temperature display, the temperature display is electrically connected with the temperature sensor, and the temperature display is used for displaying the temperature value measured by the temperature sensor.
In order to better realize the scheme, the system is further provided with a plurality of groups of positioning probes, and the electric connector of each group of positioning probes is connected with an independent switch and an external power supply, so that the temperature sensor, the heating sheet, the electric connector, the switch and the external power supply of each group of positioning probes form an independent loop.
In order to better implement the scheme, further, the temperature sensor selects a platinum resistor.
In order to better implement the scheme, further, the heating plate is a ceramic plate.
A low-temperature electronic component failure positioning method is based on any one of the above-mentioned low-temperature electronic component failure positioning systems, and includes the following steps:
step S1: sequentially placing a positioning probe of a failure positioning system on each low-temperature electronic component of a failed electronic product;
step S2: heating each low-temperature electronic component in the electronic product by using a heating sheet through a heat conducting pad in sequence;
step S3: after each low-temperature electronic component is heated in step S2, whether the electronic product recovers its function is detected, and if the function has been recovered, it is determined that a low-temperature failure has occurred in the low-temperature electronic component; if the function is not recovered, the other low-temperature electronic components of the electronic product are repeatedly subjected to failure positioning detection.
In order to better implement the scheme, the system further comprises a temperature display, wherein the temperature display is electrically connected with the temperature sensor; in step S2, the temperature display is used to display the temperature value of each low-temperature electronic component in the electronic product heated by the heating sheet through the thermal pad, which is measured by the temperature sensor.
In order to better implement the present solution, in step S1, the positioning probe is fixed on the low-temperature electronic component by using a fixing band of the positioning probe.
A low-temperature electronic component failure positioning system is provided based on the system, the system comprises a positioning probe, the positioning probe comprises an electric connector, a temperature sensor, a fixing band, a heating plate and a heat conducting pad, the electric connector is respectively electrically connected with the temperature sensor and the heating plate and is connected with an external power supply and a switch through the electric connector, whether the temperature sensor and the heating plate are electrified or not is controlled through the switch, when the switch is closed, the temperature sensor and the heating plate are electrified, the heating plate starts to generate heat, the heating plate uniformly and softly transfers heat to the low-temperature electronic component which is attached and fixed through the heat conducting pad, the low-temperature electronic component is heated to the normal working temperature of the low-temperature electronic component, when the temperature sensor detects that the temperature of the low-temperature electronic component reaches the normal working temperature, whether the function of the electronic product is recovered to the normal state or not is detected, if the electronic product is recovered to be normal, the low-temperature failure of the electronic product is indicated, the electronic component can be replaced or other repair or remedial measures can be taken for the electronic component due to the low-temperature failure of the electronic component in the electronic product, if the electronic product is not recovered to be normal, the low-temperature failure of the electronic product is indicated, the low-temperature failure of the electronic product is not caused by the low-temperature failure of the electronic component in the electronic product, and therefore the detection for other electronic components in the electronic product is repeated.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. the invention relates to a low-temperature electronic component failure positioning system, and provides a low-temperature electronic component failure positioning method based on the system, wherein each electronic component in a failed electronic product is sequentially heated to a normal working temperature through a heating sheet, after heating is finished, whether the electronic product recovers the function is detected, whether each electronic component in the failed electronic product fails at a low temperature is checked, and the electronic components do not need to be lapped and flying, so that the electronic components are not damaged;
2. the invention provides a low-temperature electronic component failure positioning system and a low-temperature electronic component failure positioning method based on the system.
Drawings
In order to more clearly illustrate the technical solution, the drawings needed to be used in the embodiments are briefly described below, and it should be understood that, for those skilled in the art, other related drawings can be obtained according to the drawings without creative efforts, wherein:
FIG. 1 is a system architecture connection diagram of the present invention;
FIG. 2 is a block diagram of a temperature sensor and heat patch of the present invention;
FIG. 3 is a flow chart of a method of the present invention;
in the figure, 1-an electric connector, 2-a temperature sensor, 3-a fixing band, 4-a heating plate and 5-a heat conducting pad.
Detailed Description
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and therefore should not be considered as a limitation to the scope of protection. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The present invention will be described in detail with reference to fig. 1 to 3.
Example 1
The utility model provides a low temperature electronic components positioning system that loses efficacy, as figure 1, figure 2, includes the positioning probe, the positioning probe includes that electricity connects 1, temperature sensor 2, fixed band 3, heating plate 4 and heat conduction pad 5, heating plate 4 sets up on heat conduction pad 5, and temperature sensor 2 and fixed band 3 set up on heating plate 4, electricity connect 1 respectively with temperature sensor 2, 4 electric connection of heating plate, be connected to external power source and switch through electricity connect 1.
The working principle is as follows: a positioning system for failure of low-temperature electronic components comprises a positioning probe, wherein the positioning probe comprises an electric connector 1, a temperature sensor 2, a fixing belt 3, a heating plate 4 and a heat conducting pad 5, the electric connector 1 is respectively electrically connected with the temperature sensor 2 and the heating plate 4 and is connected with an external power supply and a switch through the electric connector 1, the switch is used for controlling the electrification of the temperature sensor 2 and the heating plate 4, when the switch is closed, the temperature sensor 2 and the heating plate 4 are electrified, the heating plate 4 starts to generate heat, the heating plate 4 uniformly and softly transfers heat to the low-temperature electronic components which are jointed and fixed by the heat conducting pad 5, so that the low-temperature electronic components are heated to the normal working temperature of the low-temperature electronic components, when the temperature sensor 2 detects that the temperature of the low-temperature electronic components reaches the normal working temperature, whether the function of the electronic product is recovered, if the electronic product is recovered to be normal, the low-temperature failure of the electronic product is indicated, the electronic component can be replaced or other repair or remedial measures can be taken for the electronic component due to the low-temperature failure of the electronic component in the electronic product, if the electronic product is not recovered to be normal, the low-temperature failure of the electronic product is indicated, the low-temperature failure of the electronic product is not caused by the low-temperature failure of the electronic component in the electronic product, and therefore the detection for other electronic components in the electronic product is repeated.
Example 2
On the basis of embodiment 1, the system of this embodiment still includes the temperature display, temperature display and temperature sensor 2 electric connection, the temperature display is used for showing the temperature value that temperature sensor 2 measured.
The system is provided with a plurality of groups of positioning probes, wherein an electric connector 1 of each group of positioning probes is connected with an independent switch and an external power supply, so that the temperature sensor 2, the heating plate 4, the electric connector 1, the switch and the external power supply of each group of positioning probes form an independent loop.
The temperature sensor 2 is a platinum resistor. The heating plate 4 is a ceramic plate.
The working principle is as follows: a kind of low-temperature electronic components positioning system that fails, the said system includes the multiunit locating probe, the locating probe includes the electric connector 1, the temperature pick-up 2, the fixed band 3, the heating plate 4 and the heat-conducting cushion 5, the electric connector 1 connects with the temperature pick-up 2, the heating plate 4 connects electrically, connect to external power and switch through the electric connector 1, through the switch control temperature pick-up 2 and the energization of the heating plate 4 or not, fix each locating probe to an electronic component of the electronic product to be detected, close the switch that a series of locating probes correspond to sequentially, make the temperature pick-up 2 and heating plate 4 of the locating probe of this group energize, the heating plate 4 begins to generate heat, the heating plate 4 transmits the heat to its low-temperature electronic components that are laminated and fixed evenly and softly through the heat-conducting cushion 5, make the electronic components of this low-temperature rise to the temperature that the, when the temperature sensor 2 detects that the temperature of the low-temperature electronic component reaches the temperature of normal operation, whether the function of the electronic product is recovered to be normal or not is detected, if the function is recovered to be normal, the low-temperature failure of the electronic product is indicated, because the low-temperature failure of the electronic component in the electronic product causes, the electronic component can be replaced or other repair or remedial measures can be taken for the electronic component, if the low-temperature failure of the electronic product does not occur, the low-temperature failure of the electronic product is indicated, and not caused by the low-temperature failure of the electronic component in the electronic product, the switch corresponding to the other positioning probe is opened, the switch corresponding to the other positioning probe is closed, and the other electronic components in the electronic product are detected to determine the failed electronic component.
Other parts of this embodiment are the same as those of embodiment 1, and thus are not described again.
Example 3
A method for locating a failure of a low-temperature electronic component, as shown in fig. 3, based on the system for locating a failure of a low-temperature electronic component described in embodiment 1 or 2, includes the following steps:
step S1: sequentially placing a positioning probe of a failure positioning system on each low-temperature electronic component of a failed electronic product;
step S2: heating each low-temperature electronic component in the electronic product by using a heating plate 4 through a heat conducting pad 5 in sequence;
step S3: after each low-temperature electronic component is heated in step S2, whether the electronic product recovers its function is detected, and if the function has been recovered, it is determined that a low-temperature failure has occurred in the low-temperature electronic component; if the function is not recovered, the other low-temperature electronic components of the electronic product are repeatedly subjected to failure positioning detection.
The working principle is as follows: the embodiment is based on a low-temperature electronic component failure positioning system, and provides a low-temperature electronic component failure positioning method, the system comprises a positioning probe, the positioning probe comprises an electric connector 1, a temperature sensor 2, a fixing belt 3, a heating sheet 4 and a heat conducting pad 5, the electric connector 1 is respectively electrically connected with the temperature sensor 2 and the heating sheet 4, the electric connector 1 is connected with an external power supply and a switch, the switch controls the electrification of the temperature sensor 2 and the heating sheet 4, when the switch is closed, the temperature sensor 2 and the heating sheet 4 are electrified, the heating sheet 4 starts to generate heat, the heating sheet 4 uniformly and softly transmits heat to the low-temperature electronic component which is attached and fixed by the heat conducting pad 5, so that the low-temperature electronic component is heated to the normal working temperature of the low-temperature electronic component, when the temperature sensor 2 detects that the temperature of the low-temperature electronic component reaches the normal working temperature, whether the function of the electronic product is recovered to be normal or not is detected, if the function is recovered to be normal, the low-temperature failure of the electronic product is indicated, the electronic component can be replaced or other repair or remedial measures can be taken for the electronic component due to the low-temperature failure of the electronic component in the electronic product, if the electronic product is not recovered to be normal, the low-temperature failure of the electronic product is indicated, the low-temperature failure of the electronic product is not caused by the low-temperature failure of the electronic component in the electronic product, and therefore the detection on other electronic components in the electronic product is repeatedly carried out.
Example 4
In this embodiment, on the basis of embodiment 3, the system further includes a temperature display, and the temperature display is electrically connected to the temperature sensor 2; in step S2, the temperature display is used to display the temperature value of each low-temperature electronic component in the electronic product heated by the heating sheet 4 through the thermal pad 5, which is measured by the temperature sensor 2.
In step S1, the positioning probe is fixed to the low-temperature electronic component by using the fixing tape 3 of the positioning probe.
The working principle is as follows: in this embodiment, the temperature display is used to display the temperature of the heated electronic component, so as to control the temperature of the electronic component to be kept at the standard temperature of the electronic component.
The other parts of this embodiment are the same as those of embodiment 3, and thus are not described again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all simple modifications and equivalent variations of the above embodiments according to the technical spirit of the present invention are included in the scope of the present invention.
Claims (8)
1. The utility model provides a low temperature electronic components positioning system that loses efficacy which includes the location probe, its characterized in that: the utility model discloses a location probe is including connecing (1), temperature sensor (2), fixed band (3), heating plate (4) and heat conduction pad (5), heating plate (4) set up on heat conduction pad (5), and temperature sensor (2) and fixed band (3) set up on heating plate (4), connect electric joint (1) respectively with temperature sensor (2), heating plate (4) electric connection, be connected to external power source and switch through electric joint (1).
2. The system for locating failure of a low-temperature electronic component as claimed in claim 1, wherein: the system further comprises a temperature display, the temperature display is electrically connected with the temperature sensor (2), and the temperature display is used for displaying a temperature value measured by the temperature sensor (2).
3. A low-temperature electronic component failure positioning system as claimed in claim 1 or 2, wherein: the system is provided with a plurality of groups of positioning probes, and an electric connector (1) of each group of positioning probes is connected with an independent switch and an external power supply, so that the temperature sensor (2), the heating plate (4), the electric connector (1), the switch and the external power supply of each group of positioning probes form an independent loop.
4. The system for locating failure of a low-temperature electronic component as claimed in claim 1, wherein: the temperature sensor (2) is a platinum resistor.
5. The system for locating failure of a low-temperature electronic component as claimed in claim 1, wherein: the heating plate (4) is a ceramic plate.
6. A failure positioning method for a low-temperature electronic component, which is based on the failure positioning system for the low-temperature electronic component of any one of claims 1 to 5, and is characterized in that: the method comprises the following steps:
step S1: sequentially placing a positioning probe of a failure positioning system on each low-temperature electronic component of a failed electronic product;
step S2: heating each low-temperature electronic component in the electronic product by using a heating sheet (4) through a heat conducting pad (5) in sequence;
step S3: after each low-temperature electronic component is heated in step S2, whether the electronic product recovers its function is detected, and if the function has been recovered, it is determined that a low-temperature failure has occurred in the low-temperature electronic component; if the function is not recovered, the other low-temperature electronic components of the electronic product are repeatedly subjected to failure positioning detection.
7. The method for locating the failure of the low-temperature electronic component as claimed in claim 6, wherein the method comprises the following steps: the system also comprises a temperature display, wherein the temperature display is electrically connected with the temperature sensor (2); in step S2, the temperature display is used to display the temperature value of each low-temperature electronic component in the electronic product heated by the heating sheet (4) through the thermal pad (5) and measured by the temperature sensor (2).
8. The method for locating the failure of the low-temperature electronic component as claimed in claim 6, wherein the method comprises the following steps: in step S1, the positioning probe is fixed to the low-temperature electronic component by using the fixing tape (3) of the positioning probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011052166.XA CN112415297A (en) | 2020-09-29 | 2020-09-29 | A system and method for locating failure of cryogenic electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011052166.XA CN112415297A (en) | 2020-09-29 | 2020-09-29 | A system and method for locating failure of cryogenic electronic components |
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| Publication Number | Publication Date |
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| CN112415297A true CN112415297A (en) | 2021-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011052166.XA Pending CN112415297A (en) | 2020-09-29 | 2020-09-29 | A system and method for locating failure of cryogenic electronic components |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104297655A (en) * | 2013-11-28 | 2015-01-21 | 中国航空工业集团公司洛阳电光设备研究所 | Circuit board low-temperature fault locating method and heating device thereof |
| TWM515649U (en) * | 2015-07-31 | 2016-01-11 | 陽榮科技股份有限公司 | Device for forcing temperature of IC |
| CN107490736A (en) * | 2017-08-07 | 2017-12-19 | 北京工业大学 | The method and device that a kind of nondestructive measurement electronic functional module internal temperature and thermal resistance are formed |
| CN208715560U (en) * | 2018-09-18 | 2019-04-09 | 珠海隆鑫科技有限公司 | A kind of miniature PTC adhesive tape heating device of electronic component braid equipment |
| CN111366807A (en) * | 2020-04-01 | 2020-07-03 | 成都为辰信息科技有限公司 | Adjustable constant-temperature high-temperature testing equipment for components |
| CN214150880U (en) * | 2020-09-29 | 2021-09-07 | 成都凯天电子股份有限公司 | Low-temperature failure positioning probe for electronic component |
-
2020
- 2020-09-29 CN CN202011052166.XA patent/CN112415297A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104297655A (en) * | 2013-11-28 | 2015-01-21 | 中国航空工业集团公司洛阳电光设备研究所 | Circuit board low-temperature fault locating method and heating device thereof |
| TWM515649U (en) * | 2015-07-31 | 2016-01-11 | 陽榮科技股份有限公司 | Device for forcing temperature of IC |
| CN107490736A (en) * | 2017-08-07 | 2017-12-19 | 北京工业大学 | The method and device that a kind of nondestructive measurement electronic functional module internal temperature and thermal resistance are formed |
| CN208715560U (en) * | 2018-09-18 | 2019-04-09 | 珠海隆鑫科技有限公司 | A kind of miniature PTC adhesive tape heating device of electronic component braid equipment |
| CN111366807A (en) * | 2020-04-01 | 2020-07-03 | 成都为辰信息科技有限公司 | Adjustable constant-temperature high-temperature testing equipment for components |
| CN214150880U (en) * | 2020-09-29 | 2021-09-07 | 成都凯天电子股份有限公司 | Low-temperature failure positioning probe for electronic component |
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