CN112397503A

CN112397503A - Monitoring device, integrated circuit device, and electronic apparatus

Info

Publication number: CN112397503A
Application number: CN202011221467.0A
Authority: CN
Inventors: 周号
Original assignee: Zhuhai Maiju Microelectronics Co Ltd
Current assignee: Zhuhai Maiju Microelectronics Co Ltd
Priority date: 2020-11-05
Filing date: 2020-11-05
Publication date: 2021-02-23
Also published as: CN114005823B; CN114005823A; CN218647942U

Abstract

The present disclosure provides a monitoring device, comprising: at least one overload times monitoring module, including a comparator and a counter, wherein a first input end of the comparator receives between a fuse element and an element containing a PN junction of a current and/or voltage overload protection device The second input terminal of the comparator receives the voltage reference signal, the output terminal of the comparator is connected to the counter, and the voltage signal between the fuse element of the counter to the current and/or voltage overload protection device and the element containing the PN junction is greater than the voltage The events of the reference signal are counted as the number of overloads. The present disclosure also provides integrated circuit devices, electronic devices, battery protection systems, and battery systems.

Description

Monitoring device, integrated circuit device, and electronic apparatus

Technical Field

The present disclosure belongs to the technical field of circuits, and particularly relates to a monitoring device, an integrated circuit device, an electronic apparatus, a battery protection system, and a battery system.

Background

For integrated circuit devices and electronic equipment (e.g., battery systems), overload protection of current and overload protection of voltage are important, and are directly related to the normal operation of the integrated circuit devices and the electronic equipment and the reliability of the integrated circuit devices and the electronic equipment.

Excessive heat (EOS) generated when the current or voltage applied to the electronic device exceeds a defined value will cause damage to the electronic device. Electrostatic discharge (ESD) can damage the microchip. The ESD discharge voltage can be as high as tens of thousands of volts.

In the prior art, a fuse is often used for current overload protection, when overcurrent flows through the fuse, the fuse is fused, a current source is disconnected with electronic equipment, and the electronic equipment does not work any more.

In the prior art, surge devices (such as diodes) are often used for voltage overload protection, and when overvoltage is applied to the surge devices, the surge devices are broken down to form short circuits, and the electronic equipment does not work any more.

When the fusible fuse or surge device is destroyed, the electronic equipment must be replaced with the fusible fuse or surge device.

Furthermore, monitoring of current and/or voltage overload protection devices is also of vital importance.

Disclosure of Invention

In order to solve one of the above technical problems, the present disclosure provides a monitoring device, an integrated circuit device, an electronic apparatus, a battery protection system, and a battery system.

According to an aspect of the present disclosure, there is provided a monitoring device comprising: at least one overload number of times monitoring module, overload number of times monitoring module includes comparator and counter, the first input of comparator receive current and/or voltage overload protection device's fusing element and contain the voltage signal between the PN junction component, the second input of comparator receives voltage reference signal, the output of comparator with the counter is connected, the counter is greater than current and/or voltage overload protection device's fusing element and contain the voltage signal between the PN junction component the event of voltage reference signal is counted, is regarded as the overload number of times.

The monitoring device according to at least one embodiment of the present disclosure further includes: the voltage monitoring module collects voltage signals between a fusing element of the current and/or voltage overload protection device and a PN junction-containing element in real time so as to monitor the voltage between the fusing element and the PN junction-containing element.

The monitoring device according to at least one embodiment of the present disclosure further includes: at least one current monitoring module comprising a voltage integrating amplifier, the current monitoring module obtaining an average value of a discharging current during a current and/or voltage overload based on at least an integration time of the voltage integrating amplifier, an integrated voltage over the integration time, and a resistance value of the fuse element.

According to the monitoring device of at least one embodiment of the present disclosure, the overload number monitoring module further includes a low-pass filter, the low-pass filter performs low-pass filtering on the signal output by the comparator, and the counter counts the low-pass filtered signal.

According to the monitoring device of at least one embodiment of the present disclosure, the current monitoring module further includes an analog-to-digital converter and a low-pass filter, the analog-to-digital converter performs analog-to-digital conversion on the integrated voltage output by the voltage integrating amplifier, the low-pass filter performs low-pass filtering on the integrated voltage after the analog-to-digital conversion, and the current monitoring module obtains the average value of the discharging current during the current and/or voltage overload period based on at least the integration time of the voltage integrating amplifier, the integrated voltage after the low-pass filtering within the integration time, and the resistance value of the fuse element.

According to the monitoring devices of at least one embodiment of this disclosure, voltage monitoring module includes adc and the low pass filter who is connected with adc, adc carries out analog-to-digital conversion to the voltage signal between fuse element and the component that contains the PN junction of the current and/or voltage overload protection device who gathers, outputs digital signal, low pass filter is right the digital signal of adc output carries out low pass filtering, in order to be right fuse element and the voltage that contains between the PN junction component monitor.

According to the monitoring device of at least one embodiment of the present disclosure, the resistance measurement module includes a reference current providing unit, an analog-to-digital converter, and a low-pass filter, where the reference current providing unit provides a reference current flowing through the fuse element to obtain the voltage drop of the fuse element, the analog-to-digital converter performs analog-to-digital conversion on the voltage drop, the low-pass filter performs low-pass filtering on the voltage drop after the analog-to-digital conversion, and the resistance measurement module obtains the resistance of the fuse element based on at least the reference current and the voltage drop after the low-pass filtering of the fuse element. The monitoring device according to at least one embodiment of the present disclosure further includes: the fuse element comprises at least one resistance value measuring module, wherein the resistance value measuring module obtains the resistance value of the fuse element at least based on the reference current and the voltage drop of the fuse element.

According to the monitoring device of at least one embodiment of this disclosure, the current and/or voltage overload protection device includes:

at least one protection component;

the protection component comprises at least one fusing element and at least one element which is connected with the fusing element in series and contains a PN junction;

wherein, when the current is overloaded, the fusing element can be fused to realize the current overload protection, and when the voltage is overloaded, the element containing the PN junction can be broken down to realize the voltage overload protection.

According to the monitoring device of at least one embodiment of the present disclosure, a first end of the current and/or voltage overload protection device is connected to a signal receiving end of a protection target device, and a second end of the current and/or voltage overload protection device is connected to a power supply end or a ground end of the protection target device.

According to the monitoring device of at least one embodiment of the present disclosure, the signal receiving terminal of the protection target device is configured to receive an external input signal.

According to the monitoring device of at least one embodiment of the present disclosure, the protection target device is an integrated circuit chip.

According to the monitoring device of at least one embodiment of this disclosure, the external input signal is an external input power signal.

According to the monitoring device of at least one embodiment of the present disclosure, the number of the protection components is two or more than three, and the two or more than three protection components form a parallel structure between a signal receiving end of the protection target device and a power supply end or a ground end of the protection target device.

According to the monitoring device of at least one embodiment of the present disclosure, the fuse element is formed of a metal material.

According to the monitoring device of at least one embodiment of the present disclosure, the PN junction-containing element is preferably a diode, a triode, a MOS transistor and/or a combination thereof.

According to the monitoring device of at least one embodiment of this disclosure, the protection subassembly includes two fusing element and one with two contain PN junction component of fusing element series connection, contain PN junction component and set up between two fusing element.

According to the monitoring device of at least one embodiment of the present disclosure, the fuse element is a resistive device.

According to the monitoring apparatus of at least one embodiment of the present disclosure, the protection target device determines whether or not the corresponding fuse element is fused based on the voltage monitored by the voltage monitoring module.

According to another aspect of the present disclosure, there is provided an integrated circuit device comprising:

at least two current and/or voltage overload protection devices;

at least two monitoring devices according to any one of the preceding claims, each monitoring device monitoring a current and/or voltage overload protection device; and

at least one integrated circuit chip;

the current and/or voltage overload protection device, the monitoring device and the integrated circuit chip are formed on a common substrate, at least one current and/or voltage overload protection device is arranged between a power supply end of the integrated circuit chip and a signal receiving end of the integrated circuit chip, and at least another current and/or voltage overload protection device is arranged between a grounding end of the integrated circuit chip and the signal receiving end of the integrated circuit chip.

According to yet another aspect of the present disclosure, there is provided an electronic device including the integrated circuit device described above.

According to still another aspect of the present disclosure, there is provided a battery protection system including: at least one current and/or voltage overload protection device that overload protects the battery assembly; and at least one monitoring device as claimed in any one of the preceding claims, each monitoring device monitoring a current and/or voltage overload protection device.

According to still another aspect of the present disclosure, there is provided a battery system including: a battery assembly; and the battery protection system.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the disclosure and together with the description serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural diagram of an integrated circuit device according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

Fig. 3 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

Fig. 4 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

Fig. 5 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

Fig. 6 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

Fig. 7 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

Fig. 8 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

Fig. 9 is a schematic structural diagram of a current and/or voltage overload protection apparatus according to an embodiment of the present disclosure.

Fig. 10 is a schematic structural view of a current and/or voltage overload protection apparatus according to still another embodiment of the present disclosure.

Description of the reference numerals

100 monitoring device

101 overload number monitoring module

102 voltage monitoring module

103 current monitoring module

104 resistance value measuring module

200 current and/or voltage overload protection device

201 fusing element

202 containing PN junction element

300 protecting a target device

302 signal receiving end

1000 integrated circuit device

1011 comparator

1012 counter

1021 analog-to-digital converter

1022 Filter

1031 voltage integrating amplifier.

Detailed Description

The present disclosure will be described in further detail with reference to the drawings and embodiments. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limitations of the present disclosure. It should be further noted that, for the convenience of description, only the portions relevant to the present disclosure are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present disclosure may be combined with each other without conflict. Technical solutions of the present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Unless otherwise indicated, the illustrated exemplary embodiments/examples are to be understood as providing exemplary features of various details of some ways in which the technical concepts of the present disclosure may be practiced. Accordingly, unless otherwise indicated, features of the various embodiments may be additionally combined, separated, interchanged, and/or rearranged without departing from the technical concept of the present disclosure.

The use of cross-hatching and/or shading in the drawings is generally used to clarify the boundaries between adjacent components. As such, unless otherwise noted, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, size, proportion, commonality between the illustrated components and/or any other characteristic, attribute, property, etc., of a component. Further, in the drawings, the size and relative sizes of components may be exaggerated for clarity and/or descriptive purposes. While example embodiments may be practiced differently, the specific process sequence may be performed in a different order than that described. For example, two processes described consecutively may be performed substantially simultaneously or in reverse order to that described. In addition, like reference numerals denote like parts.

When an element is referred to as being "on" or "on," "connected to" or "coupled to" another element, it can be directly on, connected or coupled to the other element or intervening elements may be present. However, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element, there are no intervening elements present. For purposes of this disclosure, the term "connected" may refer to physically, electrically, etc., and may or may not have intermediate components.

For descriptive purposes, the present disclosure may use spatially relative terms such as "below … …," below … …, "" below … …, "" below, "" above … …, "" above, "" … …, "" higher, "and" side (e.g., as in "side wall") to describe one component's relationship to another (other) component as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and/or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below … …" can encompass both an orientation of "above" and "below". Further, the devices may be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, when the terms "comprises" and/or "comprising" and variations thereof are used in this specification, the presence of stated features, integers, steps, operations, elements, components and/or groups thereof are stated but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof. It is also noted that, as used herein, the terms "substantially," "about," and other similar terms are used as approximate terms and not as degree terms, and as such, are used to interpret inherent deviations in measured values, calculated values, and/or provided values that would be recognized by one of ordinary skill in the art.

Fig. 1 is a schematic diagram of an integrated circuit device 1000 according to an embodiment of the present disclosure.

Fig. 5 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure.

As shown in fig. 1 and 5, a monitoring device 100 according to an embodiment of the present disclosure includes: at least one overload number monitoring module 101, the overload number monitoring module 101 includes a comparator 1011 and a counter 1012, a first input terminal of the comparator 1011 receives a voltage signal between the fuse element 201 and the PN junction-containing element 202 of the current and/or voltage overload protection apparatus 200, a second input terminal of the comparator 1011 receives a voltage reference signal (Vref), an output terminal of the comparator 1011 is connected to the counter 1012, and the counter 1012 counts events in which the voltage signal between the fuse element 201 and the PN junction-containing element 202 of the current and/or voltage overload protection apparatus 200 is greater than the voltage reference signal as the overload number.

According to a preferred embodiment of the present disclosure, the overload number monitoring module 101 further includes a low pass filter, the low pass filter low-pass filters the signal output by the comparator 1011, and the counter 1012 counts the low-pass filtered signal as the overload number.

Two monitoring devices 100 are shown in both fig. 1 and 5, and those skilled in the art will appreciate that the present disclosure is not particularly limited as to the number of monitoring devices 100 in an integrated circuit device 1000.

Two current and/or voltage overload protection devices 200 are shown in both fig. 1 and 5.

As shown in fig. 1 and 5, the current and/or voltage overload protection apparatus 200 includes: a protection component; the protection component comprises a fusing element 201 and a component 202 which is connected with the fusing element 201 in series and comprises a PN junction; wherein, when the current is overloaded, the fusing element 201 can be fused to realize the current overload protection, and when the voltage is overloaded, the element 202 containing the PN junction can be broken down to realize the voltage overload protection.

Through the structural design of the current and/or voltage overload protection device 200, the self-adaptive uniform distribution of the leakage current can be realized, and due to the arrangement of the fusing element, the short circuit cannot occur when the element containing the PN junction is broken down.

Fig. 2 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure.

As shown in fig. 2, in addition to the monitoring apparatus 100 shown in fig. 1 or 5, the monitoring apparatus 100 further includes: and the voltage monitoring module 102 is used for acquiring a voltage signal between the fuse element 201 and the PN junction containing element 202 of the current and/or voltage overload protection device 200 in real time so as to monitor the voltage between the fuse element 201 and the PN junction containing element 202.

Preferably, as shown in fig. 6 of the integrated circuit device 1000, the voltage monitoring module 102 includes an analog-to-digital converter 1021 and a filter 1022 connected to the analog-to-digital converter 1021.

The analog-to-digital converter 1021 performs analog-to-digital conversion on the collected voltage signal between the fuse element 201 and the PN junction containing element 202 of the current and/or voltage overload protection device 200 to output a digital signal, and the filter 1022 (low pass filter) performs low pass filtering on the digital signal output by the analog-to-digital converter 1021 to monitor the voltage between the fuse element 201 and the PN junction containing element 202.

Fig. 3 is a schematic diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure. Fig. 7 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure.

As shown in fig. 3 and 7, in addition to the monitoring apparatus 100 shown in fig. 1, 2, 5, or 6, the monitoring apparatus 100 further includes: at least one current monitoring module 103, wherein the current monitoring module 103 comprises a voltage integrating amplifier 1031, and the current monitoring module 103 obtains a discharging current average value during the current and/or voltage overload period based on at least an integration time of the voltage integrating amplifier 1031, an integrated voltage within the integration time, and a resistance value of the fuse element 201.

According to a preferred embodiment of the present disclosure, the current monitoring module 103 further includes an analog-to-digital converter for performing analog-to-digital conversion on the integrated voltage output by the voltage integrating amplifier 1031, and a low-pass filter for low-pass filtering the integrated voltage after the analog-to-digital conversion, and the current monitoring module 103 obtains the average value of the discharging current during the current and/or voltage overload period based on at least the integration time of the voltage integrating amplifier 1031, the low-pass filtered integrated voltage during the integration time, and the resistance value of the fuse element 201.

Fig. 4 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure. Fig. 8 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure.

As shown in fig. 4 and 8, in addition to the monitoring apparatus 100 shown in fig. 1, 2, 3, 5, 6, or 7, the monitoring apparatus 100 further includes: and the resistance value measuring module 104 obtains the resistance value of the fuse element 201 at least based on the reference current and the voltage drop of the fuse element 201.

According to a preferred embodiment of the present disclosure, the resistance measurement module 104 includes a reference current providing part, an analog-to-digital converter, and a low-pass filter, the reference current providing part provides a reference current flowing through the fuse element 201 to obtain a voltage drop of the fuse element 201, the analog-to-digital converter performs analog-to-digital conversion on the voltage drop, the low-pass filter performs low-pass filtering on the voltage drop after the analog-to-digital conversion, and the resistance measurement module 104 obtains the resistance of the fuse element 201 based on at least the reference current and the voltage drop after the low-pass filtering of the fuse element 201.

As the resistance of the fuse element 201 changes with an overload event (e.g., an ESD event), the resistance measurement module 104 can measure the resistance of the fuse element 201 in real time.

In each of the above embodiments, preferably, the current and/or voltage overload protection apparatus 200 in the integrated circuit apparatus 1000 includes: at least one protection component; the protection assembly includes at least one fuse element 201 and at least one PN junction-containing element 202 connected in series with the fuse element 201; wherein, when the current is overloaded, the fusing element 201 can be fused to realize the current overload protection, and when the voltage is overloaded, the element 202 containing the PN junction can be broken down to realize the voltage overload protection.

In the above embodiments, the first terminal of the current and/or voltage overload protection apparatus 200 in the integrated circuit apparatus 1000 is connected to the signal receiving terminal 302 of the protection target device 300, and the second terminal of the current and/or voltage overload protection apparatus 200 is connected to the power supply terminal (VDD) or the ground terminal of the protection target device 300.

In the above embodiments, the signal receiving terminal 302 of the protection target device 300 is used for receiving an external input signal.

In the above embodiments, the protection target device 300 may be an integrated circuit chip.

In the above embodiments, the external input signal may be an external input power signal.

In the above embodiments, the fuse element 201 is formed of a metal material.

In the above embodiments, the fuse element 201 is a resistive device.

In the above embodiments, the PN junction containing element 202 is preferably a diode, a transistor, a MOS transistor, and/or a combination thereof.

Illustratively, the fuse element is a wire and the PN junction containing element is a diode.

According to one embodiment of the present disclosure, as shown in fig. 1 to 8, a current and/or voltage overload protection apparatus 200 includes a protection component including a fuse element 201 and a PN junction-containing element.

According to another embodiment of the present disclosure, the number of the protection components of the current and/or voltage overload protection apparatus 200 is two or more than three, and the two or more than three protection components form a parallel structure between the signal receiving terminal 302 of the protection target device 300 and the power supply terminal (VDD) or the ground terminal of the protection target device 300, as shown in fig. 9 and 10.

According to a preferred embodiment of the present disclosure, as shown in fig. 10, each protection component of the current and/or voltage overload protection apparatus 200 includes two fuse elements 201 and one PN junction-containing element 202 connected in series with the two fuse elements 201, the PN junction-containing element 202 being disposed between the two fuse elements 201.

According to a preferred embodiment of the present disclosure, the protection target device 300 determines whether the corresponding fuse element is blown based on the voltage monitored by the voltage monitoring module 102.

An integrated circuit device 1000 according to one embodiment of the present disclosure includes:

at least two current and/or voltage overload protection devices 200;

at least two monitoring devices 100 of any of the above, each monitoring device 100 monitoring a current and/or voltage overload protection device 200; and

at least one integrated circuit chip;

wherein the current and/or voltage overload protection device 200, the monitoring device 100 and the integrated circuit chip are formed on a common substrate, at least one current and/or voltage overload protection device 200 is disposed between a power supply terminal of the integrated circuit chip and a signal receiving terminal of the integrated circuit chip, and at least another current and/or voltage overload protection device 200 is disposed between a ground terminal of the integrated circuit chip and the signal receiving terminal of the integrated circuit chip.

As shown in fig. 1 to 8, the number of the current and/or voltage overload protection devices 200 is two, the number of the monitoring devices 100 is two, and the number of the integrated circuit chips is one.

In the above embodiments, the chip function of the integrated circuit chip is not particularly limited.

The integrated circuit device having the current and/or voltage overload protection device 200 and the monitoring device 100 in the above embodiments can implement ESD/EOS protection for the integrated circuit chip, and can monitor the state of the current and/or voltage overload protection device 200, and determine the environment where the integrated circuit device/integrated circuit chip/electronic equipment is located, whether the fuse element and/or the PN junction-containing element in the current and/or voltage overload protection device 200 needs to be replaced, and the like, through the state monitoring of the current and/or voltage overload protection device 200.

The electronic device having the integrated circuit device of the above embodiment may be a mobile phone, a computer, an automobile power supply system, or the like.

A battery protection system according to an embodiment of the present disclosure includes: at least one current and/or voltage overload protection device 200, the current and/or voltage overload protection device 200 performing overload protection on the battery assembly; and at least one monitoring device 100 of any of the above embodiments, each monitoring device 100 monitoring one current and/or voltage overload protection device 200.

A battery system according to an embodiment of the present disclosure includes: a battery assembly; and the battery protection system of the above embodiment.

In the description herein, reference to the description of the terms "one embodiment/mode," "some embodiments/modes," "example," "specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment/mode or example is included in at least one embodiment/mode or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to be the same embodiment/mode or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments/modes or examples. Furthermore, the various embodiments/aspects or examples and features of the various embodiments/aspects or examples described in this specification can be combined and combined by one skilled in the art without conflicting therewith.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

It will be understood by those skilled in the art that the foregoing embodiments are merely for clarity of illustration of the disclosure and are not intended to limit the scope of the disclosure. Other variations or modifications may occur to those skilled in the art, based on the foregoing disclosure, and are still within the scope of the present disclosure.

Claims

1. A monitoring device, comprising:

at least one overload number of times monitoring module, overload number of times monitoring module includes comparator and counter, the first input of comparator receive current and/or voltage overload protection device's fusing element and contain the voltage signal between the PN junction component, the second input of comparator receives voltage reference signal, the output of comparator with the counter is connected, the counter is greater than current and/or voltage overload protection device's fusing element and contain the voltage signal between the PN junction component the event of voltage reference signal is counted, is regarded as the overload number of times.

2. The monitoring device of claim 1, wherein the overload number monitoring module further comprises a low-pass filter, wherein the low-pass filter low-pass filters the signal output by the comparator, and wherein the counter counts the low-pass filtered signal.

3. The monitoring device of claim 1, further comprising: the voltage monitoring module collects voltage signals between a fusing element of the current and/or voltage overload protection device and a PN junction-containing element in real time so as to monitor the voltage between the fusing element and the PN junction-containing element.

4. The monitoring device of any one of claims 1-3, further comprising: at least one current monitoring module comprising a voltage integrating amplifier, the current monitoring module obtaining an average value of a discharging current during a current and/or voltage overload based on at least an integration time of the voltage integrating amplifier, an integrated voltage over the integration time, and a resistance value of the fuse element.

5. The monitoring device of claim 4, wherein the current monitoring module further comprises an analog-to-digital converter for analog-to-digital converting the integrated voltage output by the voltage integrating amplifier, and a low-pass filter for low-pass filtering the analog-to-digital converted integrated voltage, and wherein the current monitoring module obtains the average value of the discharging current during the current and/or voltage overload based on at least an integration time of the voltage integrating amplifier, the low-pass filtered integrated voltage during the integration time, and a resistance value of the fuse element.

6. The monitoring device of claim 3, wherein the voltage monitoring module comprises an analog-to-digital converter and a low-pass filter connected to the analog-to-digital converter, the analog-to-digital converter performs analog-to-digital conversion on the voltage signal between the fuse element and the element having the PN junction of the collected current and/or voltage overload protection device to output a digital signal, and the low-pass filter performs low-pass filtering on the digital signal output by the analog-to-digital converter to monitor the voltage between the fuse element and the element having the PN junction.

7. An integrated circuit device, comprising:

at least two current and/or voltage overload protection devices;

at least one integrated circuit chip;

8. An electronic device comprising the integrated circuit apparatus of claim 7.

9. A battery protection system, comprising:

at least one current and/or voltage overload protection device that overload protects the battery assembly; and

at least one monitoring device as claimed in any one of the preceding claims, each monitoring device monitoring a current and/or voltage overload protection device.

10. A battery system, comprising:

a battery assembly; and

the battery protection system of claim 9.