CN112389074B - Substrate bonding method and substrate bonding device - Google Patents
Substrate bonding method and substrate bonding device Download PDFInfo
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- CN112389074B CN112389074B CN202011131821.0A CN202011131821A CN112389074B CN 112389074 B CN112389074 B CN 112389074B CN 202011131821 A CN202011131821 A CN 202011131821A CN 112389074 B CN112389074 B CN 112389074B
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- 239000000758 substrate Substances 0.000 title claims abstract description 255
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000003825 pressing Methods 0.000 claims abstract description 31
- 239000003292 glue Substances 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 230000009471 action Effects 0.000 claims description 25
- 230000008569 process Effects 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000011521 glass Substances 0.000 description 10
- 238000010030 laminating Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of manufacturing of display components, and discloses a substrate bonding method and a substrate bonding device. The substrate attaching method includes the steps of: s1, fixing a first substrate on a carrier assembly; s2, coating glue on a preset position of the first substrate; s3, pressing the second substrate at a preset position of the first substrate; s4, standing the first substrate and the second substrate together for a preset time to enable glue to be level and repeated; s5, calibrating the position of the second substrate so as to push the second substrate to the preset position of the first substrate again. The substrate bonding method can reduce the influence of glue flow on the bonding relative position of two substrates and improve the substrate bonding precision. The substrate bonding device of the invention can improve the bonding position precision of two substrates by adopting the substrate bonding method.
Description
Technical Field
The invention relates to the technical field of display component processing, in particular to a substrate bonding method and a substrate bonding device.
Background
The display assembly includes a step of attaching a glass substrate to a wafer via a liquid optical adhesive during a manufacturing process. The process of attaching the glass panel to the wafer in the prior art includes: and fixing the wafer on a carrier, coating liquid optical cement on the upper surface of the wafer, photographing the wafer and the glass substrate respectively, and precisely pressing the glass panel on the wafer according to the comparison result of photographing information. The substrate attaching method can ensure the position accuracy when the glass substrate is placed on the wafer, but when the glass substrate is pressed on the wafer, the liquid optical adhesive is extruded to deform and flow, and after the pressing is finished, the liquid optical adhesive flows to a certain extent in the standing and leveling process, so that the glass substrate is driven to shift relative to the wafer. The glass panel bonded by the substrate bonding method in the prior art has an error of about 0.15mm in the horizontal X direction and the horizontal Y direction, and the levelness is about 0.05mm, so that the requirements of customers with high precision cannot be met.
Therefore, there is a need to provide a substrate bonding method and a substrate bonding apparatus to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a substrate bonding method, which has high relative position accuracy of two bonded substrates.
A second object of the present invention is to provide a substrate bonding apparatus capable of improving the positional accuracy of bonding two substrates by using the substrate bonding method described above.
To achieve the purpose, the invention adopts the following technical scheme:
a substrate bonding method comprising the steps of:
s1, fixing a first substrate on a carrier assembly;
s2, coating glue on a preset position of the first substrate;
s3, pressing the second substrate at a preset position of the first substrate;
s4, standing the first substrate and the second substrate together for a preset time to enable glue to be level and complex;
s5, calibrating the position of the second substrate so as to push the second substrate to the preset position of the first substrate again.
Optionally, in step S5, the position of the second substrate is calibrated by a calibration assembly, where the calibration assembly includes two pushing rods capable of performing a clamping action and an opening action in a horizontal plane, and the process of calibrating the second substrate in step S5 includes:
s51, performing a first preset clamping action on the two push rods, enabling the two push rods to respectively abut against one group of opposite sides of the second substrate, and then opening the push rods;
s52, the carrier assembly drives the first substrate and the second substrate to rotate together by 90 degrees in a horizontal plane;
and S53, performing a second preset clamping action on the two push rods so that the two push rods are respectively abutted against the two opposite sides of the other group of the second substrate.
Optionally, the preset position of the second substrate on the first substrate includes a first horizontal direction position and a second horizontal direction position, where the first horizontal direction is perpendicular to the second horizontal direction;
the strokes of the first preset clamping action and the strokes of the second preset clamping action of the two push rods are correspondingly set according to the first horizontal direction position and the second horizontal direction position respectively.
Optionally, a distance H is provided between the lower surface of the push rod and the upper surface of the first substrate along the vertical direction.
Optionally, the thickness of the second substrate is B, wherein H is more than or equal to 0.2mm and less than or equal to 0.6B.
Optionally, in step S3, the step of pressing the second substrate at a preset position includes:
s31, photographing the first substrate and obtaining position information of the first substrate;
s32, photographing the second substrate and obtaining position information of the second substrate;
s33, conveying the second substrate to a preset position of the first substrate and pressing according to the comparison result of the position information of the first substrate and the second substrate.
The substrate laminating device adopts the substrate laminating method, and comprises the following components:
the carrier assembly is used for bearing and fixing the first substrate;
the grabbing and pressing assembly is used for grabbing the second substrate and pressing the second substrate at a preset position of the first substrate;
the rotary driving assembly is used for driving the carrying platform assembly to rotate in a horizontal plane;
the calibration assembly comprises a push rod driving source and two push rods, wherein the push rod driving source can drive the two push rods to approach each other so as to respectively abut against two opposite sides of the second substrate.
Optionally, the push rod includes:
the body part is connected with the push rod driving source;
the pushing part is connected to one end of the pushing part, the pushing part comprises a vertical surface, the vertical surface is used for being abutted to the side face of the second substrate, and chamfers are not arranged at the upper end and the lower end of the vertical surface.
Optionally, the dimension of the pushing part in the vertical direction is smaller than the dimension of the body part in the vertical direction;
a guide surface is arranged between the pushing part and the body part.
Optionally, the carrier assembly includes a carrier body and a first vacuum chuck disposed on an upper surface of the carrier body, where the carrier body is configured to support the first substrate, and the first vacuum chuck is configured to adsorb and fix the first substrate on the carrier body; and/or
The grabbing and pressing assembly comprises a second vacuum chuck, and the grabbing and pressing assembly is used for grabbing the second substrate through the second vacuum chuck.
The invention has the beneficial effects that:
according to the substrate laminating method, after the second substrate is laminated on the first substrate, the second substrate is firstly kept stand for a certain time to enable glue to be level and compound, in the process, the second substrate is shifted relative to the first substrate along with the level and compound flow of the glue, after the standing is finished, the position of the second substrate relative to the first substrate is calibrated, the influence of the glue flow on the laminating relative position of the two substrates is reduced, and the laminating precision of the substrates is improved.
The substrate bonding device of the present invention can improve the positional accuracy of bonding two substrates by using the substrate bonding method described above.
Drawings
FIG. 1 is a flow chart of a first method for bonding a substrate according to an embodiment of the present invention;
FIG. 2 is a flow chart of a second method for bonding substrates according to an embodiment of the present invention;
FIG. 3 is a schematic view of a mechanism of a first substrate according to an embodiment of the present invention in one orientation;
FIG. 4 is a schematic view of a first substrate according to an embodiment of the present invention in another orientation;
FIG. 5 is a front view of a putter in accordance with an embodiment of the present invention;
FIG. 6 is a bottom view of FIG. 5;
fig. 7 is a side view of fig. 3.
In the figure:
1-a first substrate;
2-a second substrate;
3-pushing rod; 31-a body portion; 32-pushing part; 33-guiding surface.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
The embodiment relates to the technical field of display component production and provides a substrate attaching method. The present embodiment will be described taking as an example a process of applying the substrate bonding method to bond a glass substrate to a wafer, wherein a first substrate represents the wafer and a second substrate represents the glass substrate. Of course, in other embodiments, the substrate attaching method may also be used in other fields, where the two plate-shaped workpieces are precisely attached by glue. As shown in fig. 1, the substrate bonding method of the present embodiment includes the steps of:
s1, fixing a first substrate 1 on a carrier assembly;
s2, coating glue on a preset position of the first substrate 1;
s3, pressing the second substrate 2 at a preset position of the first substrate 1;
s4, standing the first substrate 1 and the second substrate 2 together for a preset time to make the glue level;
s5, calibrating the position of the second substrate 2 to push the second substrate 2 to the preset position of the first substrate 1 again.
According to the substrate attaching method of the embodiment, after the second substrate 2 is pressed on the first substrate 1, the second substrate 2 is firstly placed for a certain time to enable glue to be restored, in the process, the second substrate 2 is shifted relative to the first substrate 1 along with the smooth flow of the glue, after the placement is finished, the position of the second substrate 2 relative to the first substrate 1 is recalibrated, the influence of the glue flow on the attaching relative positions of the two substrates is reduced, and therefore the attaching precision of the substrates is improved.
Specifically, in this embodiment, the second substrate 2 is attached to the first substrate 1 and then left to stand for five minutes. In other embodiments, the glue can be used as a standard, and the preset standing time is selected and set according to the actual situation.
Preferably, the carrier assembly used in the substrate attaching method of the present embodiment includes a carrier body and a first vacuum chuck disposed on an upper surface of the carrier body, where the carrier body is used for supporting the first substrate 1, and the first vacuum chuck is used for fixing the first substrate 1 on the carrier in an adsorption manner; further, in the process of pressing the second substrate 2 on the first substrate, the grabbing pressing assembly is adopted, the grabbing pressing assembly comprises a second vacuum chuck, the grabbing pressing assembly is used for grabbing the second substrate 2 through the second vacuum chuck in an adsorption mode and pressing the second substrate 2 on the first substrate 1, and the vacuum adsorption mode is convenient for taking and placing the substrate and is not easy to damage the substrate. In this embodiment, the grabbing and pressing assembly further includes a manipulator, the second vacuum chuck is connected with the manipulator, and after the second vacuum chuck adsorbs the second substrate 2, the manipulator conveys and presses the second substrate 2 at the preset position of the first substrate 1.
Preferably, as shown in fig. 2, in step S3, the step of pressing the second substrate 2 at a predetermined position of the first substrate 1 includes:
s31, the first CCD detection assembly photographs the first substrate 1 and obtains position information of the first substrate 1;
s32, the second CCD detection assembly photographs the second substrate 2 and obtains position information of the second substrate 2;
s33, conveying the second substrate 2 to the preset position of the first substrate 1 and pressing according to the comparison result of the position information of the first substrate 1 and the second substrate 2.
Accurate position information of the first substrate 1 and the second substrate 2 is obtained through the first CCD detection assembly and the second CCD detection assembly respectively, and the relative position relation between the first substrate 1 and the second substrate 2 can be calculated, namely the position where the grabbing pressing assembly is actually required to move is calculated, so that the position accuracy of placing the second substrate 2 on the first substrate 1 is improved.
Preferably, in step S5, the position of the second substrate 2 is calibrated by a calibration assembly, as shown in fig. 2 to 4, the calibration assembly includes two pushing rods 3 capable of performing a clamping action and an opening action in a horizontal plane, and in step S5, the process of calibrating the second substrate 2 includes:
s51, the two push rods 3 perform a first preset clamping action, so that the two push rods 3 respectively abut against one group of opposite sides of the second substrate 2, and then perform an opening action;
s52, the carrier drives the first substrate 1 and the second substrate 2 to rotate 90 degrees in the horizontal plane together;
s53, the two push rods 3 perform a second preset clamping action, so that the two push rods 3 respectively abut against the two opposite sides of the other group of the second substrate.
In this embodiment, with the first substrate 1 itself as a reference, the preset position of the second substrate 2 on the first substrate 1 includes a first horizontal direction position (i.e. the position in the X direction in fig. 3) and a second horizontal direction position (i.e. the position in the Y direction in fig. 3), and the first horizontal direction is perpendicular to the second horizontal direction. In the calibration process, the two push rods 3 perform a first preset clamping action and can push and abut against a pair of side surfaces of the second substrate 2 along the first horizontal direction of the first substrate 1, namely the X direction, so that the position calibration of the second substrate 2 relative to the first substrate 1 along the X direction is realized; then the first substrate 1 and the second substrate 2 are rotated together by 90 °; at this time, as shown in fig. 4, when the clamping direction of the push rods 3 is the second horizontal direction, i.e., the Y direction, with respect to the first substrate 1, the two push rods 3 perform the second preset clamping operation, and can be respectively abutted against the other pair of side surfaces of the second substrate 2 along the second horizontal direction, i.e., the Y direction, of the first substrate 1, thereby realizing the positional alignment of the second substrate 2 with respect to the first substrate 1 along the Y direction, and finally realizing the positional alignment of the entire second substrate 2 with respect to the first substrate 1.
Specifically, the clamping action and the opening action of the two push rods 3 are realized through push rod driving sources, wherein the push rod driving sources are provided with two groups, each group of linear driving sources is used for driving one push rod 3 to move, each group of push rod driving sources comprises a servo motor and a group of screw-nut pairs, the push rods 3 are connected with nuts, and the servo motor drives the screw rods to rotate so that the nuts drive the push rods 3 to do linear motion. In other embodiments, the pushrod driving source may be two linear cylinders, or other components or assemblies capable of driving the pushrod 3 in a linear motion.
Specifically, the stroke of the first preset clamping action and the stroke of the second preset clamping action of the two push rods 3 are respectively set correspondingly according to the preset first horizontal direction position and the preset second horizontal direction position on the drawing, so that the stroke of each clamping action of the two push rods 3 can be matched with the direction of the first substrate 1 at the moment. By adopting the substrate bonding method of the present embodiment, the positional accuracy of the first substrate 1 and the second substrate 2 can be controlled within 0.05mm in both the X direction and the Y direction.
As shown in fig. 5 and 6, the pushing rods 3 used in the substrate bonding method of the present embodiment include a main body portion 31 and a pushing portion 32 connected to one end of the main body portion 31, and the pushing portion 32 includes a vertical surface for bonding and contacting with the end surface of the second substrate 2, so that the vertical surfaces of the pushing portions 32 of the two pushing rods 3 respectively contact with the end surfaces of the opposite ends of the second substrate, and the levelness of the second substrate 2 can be corrected. Specifically, in the present embodiment, the body portion 31 is connected to the output end of the push rod driving source. Preferably, no chamfer is provided at the upper and lower ends of the vertical surface, so that the contact surface between the pushing portion 32 and the second substrate 2 is ensured to be a strict plane, and the leveling effect on the second substrate 2 is improved. By adopting the substrate bonding method of the present embodiment, the levelness of the second substrate 2 can be controlled within 0.03 mm.
Further, as shown in fig. 6, the dimension of the pushing portion 32 in the vertical direction is smaller than the dimension of the body portion 31 in the vertical direction, and since the machining accuracy requirement of the vertical surface of the pushing portion 32 is high, the height dimension of the pushing portion 32 is smaller than the height dimension of the body portion 31, the machining cost of the push rod 3 can be appropriately reduced; in addition, the guiding surface 33 is arranged between the pushing part 32 and the body part 31, so that the connection between the body part 31 and the pushing part 32 is smoother, and the problem of stress concentration between the body part 31 and the pushing part 32 is avoided.
Preferably, as shown in fig. 7, in the substrate attaching method of the present embodiment, when the clamping and opening actions are performed, a space H is provided between the lower surface of the push rod 3 and the upper surface of the first substrate 1 along the vertical direction, so as to ensure that the push rod 3 does not scratch the upper surface of the first substrate 1 when the clamping and opening actions are performed, and avoid the damage of the first substrate 1. Further, the thickness of the second substrate 2 is B, where H is 0.2mm and less than or equal to 0.6B, which on one hand can ensure that the pushing rod 3 has a sufficient distance from the first substrate 1 to avoid the first substrate 1 from being scratched, and when the pushing rod 3 pushes the second substrate 2, the lowest stress point of the second substrate 2 is not too high, so that the second substrate 2 is easy to push.
The embodiment also provides a substrate attaching device, which adopts the substrate attaching method and can improve the relative position precision when two substrates are attached. Specifically, the substrate laminating device comprises a carrier assembly, a grabbing and pressing assembly, a rotary driving assembly and a calibration assembly, wherein the carrier assembly is used for bearing and fixing a first substrate 1, the grabbing and pressing assembly is used for grabbing a second substrate 2 and pressing the second substrate 2 at a preset position of the first substrate 1, the rotary driving assembly is used for driving the carrier assembly to rotate in a horizontal plane, the calibration assembly comprises a push rod driving source and two push rods 3, and the push rod driving source can drive the two push rods 3 to be close to each other so as to respectively abut against two opposite sides of the second substrate 2. The carrier assembly, the grabbing and pressing assembly and the calibration assembly can all be supported on the frame of the substrate laminating device.
It is to be understood that the foregoing examples of the invention are provided for the purpose of illustration only and are not intended to limit the scope of the invention, which is defined by the claims, since modifications in both the detailed description and the application scope of the invention will become apparent to those skilled in the art upon consideration of the teachings of the invention. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (7)
1. A substrate bonding method is characterized by comprising the following steps:
s1, fixing a first substrate (1) on a carrier assembly;
s2, coating glue on a preset position of the first substrate (1);
s3, pressing the second substrate (2) at a preset position of the first substrate (1);
s4, standing the first substrate (1) and the second substrate (2) together for a preset time to enable glue to be level;
s5, calibrating the position of the second substrate (2) to push the second substrate (2) to the preset position of the first substrate (1) again; calibrating the position of the second substrate (2) by a calibration assembly comprising two push rods (3) capable of performing a clamping action and an opening action in a horizontal plane, the process of calibrating the second substrate (2) in step S5 comprising:
s51, performing a first preset clamping action on the two push rods (3) so that the two push rods (3) respectively abut against one group of opposite sides of the second substrate (2), and then are opened;
s52, the carrier assembly drives the first substrate (1) and the second substrate (2) to rotate together for 90 degrees in a horizontal plane;
s53, performing a second preset clamping action on the two push rods (3) so that the two push rods (3) are respectively abutted against the two opposite sides of the other group of the second substrate (2);
along the vertical direction, the lower surface of the push rod (3) and the upper surface of the first substrate (1) are provided with a distance H, and the thickness of the second substrate (2) is B, wherein H is more than or equal to 0.2mm and less than or equal to 0.6B.
2. The substrate bonding method according to claim 1, wherein the preset position of the second substrate (2) on the first substrate (1) includes a first horizontal direction position and a second horizontal direction position, wherein the first horizontal direction is perpendicular to the second horizontal direction;
the strokes of the first preset clamping action and the strokes of the second preset clamping action of the two push rods (3) are correspondingly set according to the first horizontal direction position and the second horizontal direction position respectively.
3. The substrate bonding method according to any one of claims 1 to 2, wherein in step S3, the step of pressing the second substrate (2) at a predetermined position includes:
s31, photographing the first substrate (1) and obtaining position information of the first substrate (1);
s32, photographing the second substrate (2) and obtaining the position information of the second substrate (2);
s33, conveying the second substrate (2) to a preset position of the first substrate (1) and pressing according to the comparison result of the position information of the first substrate (1) and the second substrate (2).
4. A substrate bonding apparatus, characterized in that the substrate bonding method according to any one of claims 1 to 3 is adopted, the substrate bonding apparatus comprising:
a stage assembly for carrying and fixing the first substrate (1);
the grabbing and pressing assembly is used for grabbing the second substrate (2) and pressing the second substrate (2) at a preset position of the first substrate (1);
the rotary driving assembly is used for driving the carrying platform assembly to rotate in a horizontal plane;
the calibration assembly comprises a push rod driving source and two push rods (3), wherein the push rod driving source can drive the two push rods (3) to be close to each other so as to respectively abut against two opposite sides of the second substrate (2).
5. The substrate bonding apparatus according to claim 4, wherein the push rod (3) includes:
a body (31) connected to the push rod drive source;
the pushing part (32) is connected to one end of the body part (31), the pushing part (32) comprises a vertical surface, the vertical surface is used for being abutted to the side face of the second substrate (2), and chamfers are not arranged at the upper end and the lower end of the vertical surface.
6. The substrate bonding apparatus according to claim 5, wherein a dimension of the pushing portion (32) in a vertical direction is smaller than a dimension of the body portion (31) in a vertical direction;
a guide surface (33) is provided between the pushing portion (32) and the body portion (31).
7. The substrate bonding apparatus according to claim 4, wherein the stage assembly comprises a stage body for supporting the first substrate (1) and a first vacuum chuck provided on an upper surface of the stage body for suction-fixing the first substrate (1) on the stage body; and/or
The grabbing and pressing assembly comprises a second vacuum chuck, and the grabbing and pressing assembly is used for grabbing the second substrate (2) through the second vacuum chuck.
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| CN108263071A (en) * | 2018-03-23 | 2018-07-10 | 沭阳崇至工贸有限公司 | A kind of multi-plate bonding device convenient for gluing |
| CN108177420A (en) * | 2018-03-26 | 2018-06-19 | 沭阳崇至工贸有限公司 | A kind of multiple-plate laminating apparatus |
| CN109397840A (en) * | 2018-10-25 | 2019-03-01 | 浙江西溪玻璃有限公司 | A kind of doubling glass laminating apparatus for avoiding generating bubble |
| CN109555766A (en) * | 2018-10-30 | 2019-04-02 | 信利半导体有限公司 | A kind of full fitting production method of display module |
| CN111483210A (en) * | 2020-04-20 | 2020-08-04 | 丽水学院 | A method for making a corrosion-resistant titanium door with a double-layer sandwich structure and its processing equipment |
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| CN112389074A (en) | 2021-02-23 |
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