CN112376009A - Copper wire tinning device and system capable of adjusting discharging angle - Google Patents
Copper wire tinning device and system capable of adjusting discharging angle Download PDFInfo
- Publication number
- CN112376009A CN112376009A CN202011060595.1A CN202011060595A CN112376009A CN 112376009 A CN112376009 A CN 112376009A CN 202011060595 A CN202011060595 A CN 202011060595A CN 112376009 A CN112376009 A CN 112376009A
- Authority
- CN
- China
- Prior art keywords
- wire
- copper wire
- liquid storage
- storage tank
- discharging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 108
- 238000007599 discharging Methods 0.000 title claims abstract description 53
- 238000003825 pressing Methods 0.000 claims abstract description 84
- 239000007788 liquid Substances 0.000 claims abstract description 53
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 238000007790 scraping Methods 0.000 claims description 14
- 239000010410 layer Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 8
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 description 19
- 239000010949 copper Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000001105 regulatory effect Effects 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- DKAGJZJALZXOOV-UHFFFAOYSA-N hydrate;hydrochloride Chemical compound O.Cl DKAGJZJALZXOOV-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
- C23C2/22—Removing excess of molten coatings; Controlling or regulating the coating thickness by rubbing, e.g. using knives, e.g. rubbing solids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
Abstract
The invention belongs to the technical field of copper wire tinning, and particularly relates to a copper wire tinning device and system with adjustable discharging angles; comprises a liquid storage tank for loading liquid tin, and a wire inlet frame, a wire pressing mechanism and a discharging frame which are sequentially erected on a notch of the liquid storage tank; the wire pressing mechanism comprises a positioning plate and a plurality of wire pressing rods, the wire pressing rods are movably connected to the positioning plate, sliding parts are arranged at two ends of the positioning plate, and the sliding parts are arranged on sliding rails of the groove openings of the liquid storage tanks; the discharging frame is provided with discharging holes with the same number as the line pressing rods in an array manner, two ends of the discharging frame are respectively connected with a scheduling plate, the top end of the scheduling plate is hinged to the edge of a notch at one end of the liquid storage tank, and the discharging frame can rotate relative to the liquid storage tank; the wire inlet frame is provided with wire inlet holes with the same number as the wire pressing rods in an array manner, and the bottom of the wire inlet frame is arranged on the edge of the notch at the other end of the liquid storage tank; eliminate the yin and yang side.
Description
Technical Field
The invention belongs to the technical field of copper wire tinning, and particularly relates to a copper wire tinning device and system capable of adjusting a discharging angle.
Background
Tinned copper wire is copper wire with a thin layer of metallic tin plated on the surface of the copper wire. The tinned copper wire is softer in material and good in conductivity, and compared with a bare copper wire, the tinned copper wire is higher in corrosion resistance and oxidation resistance, and the service life of a weak current cable can be greatly prolonged; furthermore, the exterior of the copper wire needs to be plated with tin because the copper wire is oxidized by air to form a film, i.e., verdigris, when the copper wire is exposed to air for a long time, and the electrical conductivity of the verdigris is poor, which increases the resistance.
When the existing cable is tinned, the process flow is generally as follows: the method comprises the steps of firstly discharging a copper wire from a coil, then putting the copper wire into a hydrochloric acid pool for acid washing to remove stains on the surface of the copper wire, then putting the copper wire into a clean water pool for washing away hydrochloric acid water, and then putting the copper wire into a soldering flux pool. After passing through the soldering flux pool, the copper wire enters a tinning bath, penetrates out of the tinning bath, and is packed by taking up an integrated coil; however, since the copper wire is pulled, the angle of the discharged material is deviated, once the angle is deviated, the thickness of the tin layer on the surface of the copper wire is uneven during discharging, a cable "male-female surface" is formed, the male-female surface causes that the copper wire is likely to be partially exposed to the outside, and the copper wire is oxidized to generate verdigris for a long time.
Disclosure of Invention
The invention aims to provide a copper wire tinning device and a system capable of adjusting a discharging angle, wherein the copper wire tinning device and the system can keep a discharging path of a copper wire and a discharging hole in a vertical angle during discharging.
In order to achieve the purpose, the main technical solution of the invention is a copper wire tinning device with an adjustable discharging angle, which comprises a liquid storage tank for loading liquid tin, and a wire inlet frame, a wire pressing mechanism and a discharging frame which are sequentially erected on a notch of the liquid storage tank; the wire pressing mechanism comprises a positioning plate and a plurality of wire pressing rods, the wire pressing rods are movably connected to the positioning plate, sliding parts are arranged at two ends of the positioning plate, and the sliding parts are arranged on sliding rails of the groove openings of the liquid storage tanks; the discharging frame is provided with discharging holes with the same number as the line pressing rods in an array manner, two ends of the discharging frame are respectively connected with a scheduling plate, the top end of the scheduling plate is hinged to the edge of a notch at one end of the liquid storage tank, and the discharging frame can rotate relative to the liquid storage tank; the wire inlet frame is provided with wire inlet holes with the same number as the wire pressing rods in an array manner, and the bottom of the wire inlet frame is arranged on the edge of the notch at the other end of the liquid storage tank; through adjusting the angle of the discharging frame and/or the direction of the sliding positioning plate, the copper wire can be ensured to be perpendicular to the discharging hole for discharging.
In some examples, a plurality of die carriers are arranged on the discharge frame, the distance between every two adjacent die carriers is the same, a die is arranged on every two adjacent die carriers, and the die carriers and the dies are enclosed to form one discharge hole.
In some examples, the diameter of the discharge hole is equal to the outer diameter of the copper wire plus the thickness of the tin coating.
In some examples, the discharge hole is provided with a scraping blade towards the edge of the hole diameter in the liquid storage tank, and the scraping blade is used for scraping the tin-plated surface layer of the copper wire with excessive thickness; the section of the scraping blade is in an inverted triangle shape.
In some examples, a plurality of positioning grooves are formed in the positioning plate in an array manner, and each wire pressing rod can be movably arranged in each positioning groove; in the tinning process, the wire pressing rod is moved or rotated, and the bottom of the wire pressing rod is stretched into the liquid storage tank.
In some examples, the positioning plate is provided with a cross rod, the wire pressing rod is connected to the cross rod through a hinge, the wire pressing rod is rotated and placed into the positioning groove in the tinning process, and the bottom of the wire pressing rod extends into the liquid storage groove.
In some examples, the bottom of the wire pressing rod is provided with a wire pressing port for pressing a copper wire, and the inner wall of the wire pressing port is provided with a wear-resistant layer made of a ceramic material.
In some examples, the path of the copper wire entering from the wire inlet hole, passing through the wire pressing rod and discharging from the material outlet hole is a processing path, and the adjacent processing paths are parallel to each other.
In some examples, a heater and a temperature sensor are arranged in the liquid storage tank, the temperature sensor is used for detecting the temperature in the liquid storage tank, the heater is used for heating the interior of the tank, and the heater and the temperature sensor are in signal connection with the controller.
A copper wire tinning system comprises the copper wire tinning device.
Due to the adoption of the technical scheme, the invention achieves the following effects: through the angle of slip line ball mechanism and/or regulation play work or material rest to adjust the ejection of compact angle of copper line, keep the ejection of compact direction of copper line and discharge opening to be vertical angle, take place with the condition such as eliminating because ejection of compact angle skew leads to the produced "negative and positive face" of copper line tin-plating.
Drawings
Figure 1 is a schematic structural view of an embodiment of the present invention,
FIG. 2 is a schematic view showing the structure of the copper wire tinning apparatus of the embodiment of FIG. 1,
figure 3 is a schematic diagram of the reservoir of the embodiment of figure 1,
figure 4 is a schematic structural view of the crimping mechanism of the embodiment of figure 1,
figure 5 is a schematic view of the mold of the embodiment of figure 1 installed in a mounting groove defined by the drum,
figure 6 is an exploded view of the tap frame of the embodiment of figure 1,
figure 7 is a schematic structural view of the delivery device of the embodiment of figure 1,
in the figure: the device comprises a liquid storage tank 1, a fixed seat 11, an adjusting column 12, a wire pressing mechanism 2, a wire pressing rod 21, a wire pressing port 211, a positioning plate 22, a positioning groove 221, a second claw-shaped connecting part 23, a first claw-shaped connecting part 24, a cross rod 25, a wire inlet frame 3, a wire inlet hole 31, a material outlet frame 4, a workpiece 42, a scraping blade 43, a material outlet hole 44, a scheduling plate 45, a mold 46, a delivery device 5, a winding frame 51, a fixed rod 52, a conveying wheel 53, a circumferential groove 531, a groove wall 532, an interference rod 54 and an adjusting plate 55.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.
It is to be understood that the terms "a" and "an" are to be interpreted as meaning that a number of one element may be one in one embodiment or multiple in another embodiment, and the terms "a" and "an" are not to be interpreted as limiting the number.
The first embodiment is as follows:
referring to fig. 1 to 7 of the drawings accompanying this specification, there is shown a copper wire tinning machine according to a preferred embodiment of the present invention; the copper wire tinning machine comprises a copper wire tinning device, a delivery device 5 and a receiving tray, wherein the copper wire tinning device is used for wrapping a layer of tin material on a copper wire in a processing operation, and the delivery device 5 is used for delivering the tin material-plated copper wire and delivering the tin material-plated copper wire to the receiving tray for loading; and then realize the processes such as tin-plating of copper line and receipts material relatively fast, improve its work efficiency.
Specifically, the copper wire tinning device comprises a liquid storage tank 1 for loading liquid tin and a wire pressing mechanism 2 erected on a notch of the liquid storage tank 1; the straight line distance from at least the middle part of the liquid storage tank 1 to the notch is the farthest distance, and the straight line distance from the rest part of the tank bottom to the notch is gradually shortened; in this embodiment, the cross section in the liquid storage tank 1 is V-shaped, but in other embodiments, the cross section in the liquid storage tank 1 may be in an inverted trapezoid shape or a semicircular arc shape, but in comparison, the V-shape is more preferable, and it is advantageous that the symmetrical bottom surface of the tank and the notch of the V-shape have an inclined flat surface which is excessively obliquely connected with each other, so that when a copper wire enters the liquid storage tank 1 for a tin plating process, the copper wire can move down to the bottom of the tank along the inclined flat surface and then move up from the other inclined flat surface; in addition, the V-shaped structure is used for prolonging the tinning path of the copper wire so as to ensure that the copper wire has sufficient tinning time and avoid the situation that some parts of the copper wire cannot be tinned in time due to too short tinning path; a heater and a temperature sensor are arranged in the liquid storage tank 1, the temperature sensor is used for detecting the temperature in the liquid storage tank 1, the heater is used for heating the interior of the tank, and the heater and the temperature sensor are in signal connection with a controller; the temperature sensor is used for detecting the temperature in the liquid storage tank 1, and if the temperature is lower than a preset value, the heater is triggered to heat, so that the temperature in the liquid storage tank 1 is kept in a constant temperature state, and the preset value can refer to the tin plating temperature in the prior art.
The wire pressing mechanism 2 comprises a positioning plate 22 and a plurality of wire pressing rods 21, the wire pressing rods 21 can be arranged on the positioning plate 22 in an array manner and are movably connected to the positioning plate 22, and wire pressing ports 211 for pressing copper wires are formed in the bottom ends of the wire pressing rods 21; in the tinning process, the bottom end of the wire pressing rod 21 extends into the liquid storage tank 1, and the wire pressing port 211 is tightly pressed on the copper wire; in this embodiment, as shown in fig. 4, a cross bar 25 is disposed on the positioning plate 22, a plurality of positioning grooves 221 are disposed on the positioning plate 22 in an array, and each wire pressing rod 21 can be movably disposed in the positioning groove 221; the number of the positioning grooves 221 is the same as that of the wire pressing rods 21, the positioning grooves 221 are in a semicircular arc opening shape, the rod bodies of the wire pressing rods 21 are hinged on the cross rod 25 through a hinge member, the hinge member comprises a first claw-shaped connecting portion 24 and a second claw-shaped connecting portion 23, the two claw-shaped connecting portions rotate relatively, the first claw-shaped connecting portion 24 is in transverse connection, the second claw-shaped connecting portion 23 is in longitudinal connection, the first claw-shaped connecting portion 24 in transverse connection is connected and fixed on the cross rod 25, the second claw-shaped connecting portion 23 in longitudinal connection is fixedly connected on the rod body of the wire pressing rods 21, so that the wire pressing rods 21 can rotate relative to the cross rod 25, when the wire pressing rods 21 are idle, the top ends of the wire pressing rods 21 are squeezed, the bottom ends of the wire pressing rods 21 are tilted to leave the liquid storage tanks 1, when the tin plating process is performed, the wire pressing rods 21 are rotated into the positioning grooves, and the wire pressing port 211 of the wire pressing rod 21 extends into the liquid storage tank 1; of course, in other embodiments, the wire pressing rod 21 is fixed on the cross rod 25 through a claw-shaped member connection, the wire pressing rod 21 is movably connected in the claw-shaped member, the wire pressing rod 21 is relatively perpendicular to the cross rod 25, and the wire pressing rod 21 can be lifted or pressed downwards, so that the wire pressing rod 21 moves up and down in the claw-shaped member; the scheme that the bottom end of the line pressing rod 21 extends into the liquid storage tank 1 in a rotating mode is more convenient and simpler, and labor is saved; the pulling or pressing is more laborious than the embodiment; in addition, in the embodiment, the wire pressing mechanism 2 is located right above the groove bottom surface which is the farthest away from the notch, and in the tinning process, the wire pressing rod 21 vertically extends into the groove bottom surface and the wire pressing opening 211 is abutted against the groove bottom surface for positioning, so that the tinning path of the copper wire is further increased, the copper wire can completely move downwards along the groove bottom surface and cannot move upwards when moving downwards to a half way; the inner wall of line ball mouth 211 is equipped with a wearing layer, the wearing layer adopts ceramic material to make, because the copper line all walks from line ball mouth 211, long-time so operation can damage line ball mouth 211, and leads to the fracture of line ball mouth 211, perhaps also influences the quality of copper line itself, and this problem is then solved effectively to ceramic material's wearing layer in setting up, can reduce the degree of wear of line ball mouth 211.
A wire inlet frame 3 is arranged on the edge of a notch at one end of the liquid storage tank 1, a material outlet frame 4 is arranged on the edge of a notch at the other end of the liquid storage tank 1, a plurality of wire inlet holes 31 are arranged on the wire inlet frame 3 in an array mode, the number of the wire inlet holes 31 is consistent with that of the wire pressing rods 21, and each wire inlet hole 31 corresponds to one wire pressing rod 21; a plurality of discharge holes 44 are arranged on the discharge frame 4 in an array manner, the aperture of each discharge hole 44 is equal to the outer diameter of a copper wire plus the thickness of a layer to be plated with tin, each discharge hole 44 corresponds to one wire pressing rod 21, the wire pressing device is positioned between the wire inlet frame 3 and the discharge frame 4, the path of the copper wire entering from the wire inlet hole 31, passing through the wire pressing rods 21 and then discharging from the discharge holes 44 is a processing path, and adjacent processing paths are parallel to each other; in this embodiment, a plurality of the die pieces 42 are arranged on the discharging frame 4 in an array, the spacing distances between adjacent die pieces 42 are consistent, an installation groove is formed between adjacent die pieces 42, each installation groove can be separately embedded with a die 46, the die 46 is provided with a discharging hole 44, and the inner aperture of the discharging hole 44 is equal to the outer diameter of the copper wire plus the thickness of the layer to be plated with tin; the discharging hole 44 can scrape the tin coating with excessive thickness, and the diameter of the copper wire after tin coating can be kept consistent; in order to further prevent the tin coating scraped from the discharging hole 44 from adhering to the edge of the discharging hole 44 and recycle the excess tin coating, as shown in fig. 5, in the present embodiment, the discharging hole 44 is provided with a scraping blade 43 facing the edge of the aperture in the liquid storage tank 1, and the scraping blade 43 is used for scraping the tin coating of the copper wire with excess thickness; the scraping piece 43 ring is cylindrical, the inner wall of the scraping piece 43 is flush with the inner wall of the discharging hole 44, and the section of the outer wall of the scraping piece 43 is in an inverted triangle; after the copper wire is plated with tin, the copper wire is discharged from the discharging hole 44, the scraping blade 43 can scrape off the redundant tin plating layer, and the scraped tin material can be rolled into a circle and rolled back into the liquid storage tank 1 for reuse because the outer wall of the scraping blade 43 is an inclined surface; in addition, in the embodiment, the mold member 42 is used to enclose a mounting groove, so that the mold 46 can be inserted into the mounting groove, which is for the purpose of easy assembly and disassembly and easy replacement of the worn mold 46; in addition, another embodiment is provided for forming the discharge hole 44, namely, a plurality of die carriers are fixedly arranged on the discharge frame 4 in an array manner, semicircular grooves are symmetrically formed in the side walls of two sides of each die carrier, and the semicircular grooves of two adjacent die carriers can enclose to form one discharge hole 44.
In addition, the delivery device 5 comprises a bobbin 51 and a fixing rod 52 arranged on the bobbin 51, the fixing rod 52 is movably connected with conveying wheels 53 with the same number as the discharging holes 44, each conveying wheel 53 can independently rotate around a connecting point with the fixing rod 52, the distance between every two adjacent conveying wheels 53 is the same, the copper wires after being tinned are discharged from the discharging holes 44 and hung in the corresponding conveying wheels 53, and finally are placed in a collecting tray, and the tinning process is continuously completed through the rotation of the collecting tray; in order to prevent the copper wire from being separated from the conveying wheel 53 when sliding on the conveying wheel 53, in the embodiment, a circumferential groove 531 is provided on the surface along the circumferential direction of the conveying wheel 53, the caliber of the opening of the circumferential groove 531 is equal to or larger than the outer diameter of the copper wire, the copper wire can be inserted into the circumferential groove 531 and delivered, the groove wall 532 of the circumferential groove 531 limits the axial moving range of the copper wire, and the groove wall 532 of the circumferential groove 531 can prevent the copper wire from being separated from the conveying wheel 53; in addition, an anti-interference rod 54 is arranged on the fixed rod 52 between the adjacent conveying wheels 53, the anti-interference rod 54 divides the fixed rod 52 into a plurality of independent delivery areas, each delivery area is provided with at least one conveying wheel 53, and the purpose is that when the copper wire on one conveying wheel 53 is broken, the broken copper wire is limited on the anti-interference rod 54, so that the broken copper wire cannot be wound on other copper wires to cause the damage of other copper wires; the purpose of additionally arranging the delivery device is to ensure that the copper wire which is just plated with tin has a period of cooling time, the temperature of the surface of the copper wire is reduced so as to improve the bonding degree of tin materials on the copper wire, and the tin materials are placed to fall off, so that the rejection rate is reduced.
Because traditional tinning equipment often makes the tin coating of copper line inhomogeneous when the copper line tin-plating ejection of compact, the copper line after the ejection of compact forms "yin yang face"; the most important thing for preventing the generation of the 'negative and positive surfaces' during the discharging of the copper wires is to keep the copper wires and the discharging holes 44 in the vertical (90 DEG) discharging direction; the embodiment adopts the following technical scheme, specifically, two ends of the positioning plate 22 are slidably arranged on a notch of the liquid storage tank 1, sliders are arranged at bottoms of two ends of the positioning plate 22, a chute is formed in the notch of the liquid storage tank 1, the sliders are placed in the chute, so that the wire pressing mechanism 2 can slide transversely, in order to relatively position a position of the wire pressing mechanism 2, regulators are respectively arranged on the notches at two ends of the positioning plate 22, each regulator comprises a fixed seat 11 and a regulating column 12 arranged on the fixed seat 11, the regulating column 12 is connected to the fixed seat 11 through a thread, one end of the regulating column 12 is abutted against an end of the positioning plate 22, and the movement of the wire pressing mechanism 2 is relatively limited by rotating the regulating columns 12 at two sides, so that the position of the wire pressing mechanism 2 is fixed; when the position of line ball mechanism 2 needs to be adjusted, only need finely tune line ball mechanism 2's position through rotating the regulator for whole line ball mechanism 2 can carry out lateral shifting, go up to discharge opening 44 on the copper line of pressing in line ball mouth 211 respectively in order to adjust and be perpendicular.
In this embodiment, both sides of play work or material rest 4 are a fixedly connected with dispatch board 45 respectively, the notch both ends of reservoir 1 are equipped with the stand respectively, dispatch board 45 articulates on the stand, and relative stand can rotate, and indirect messenger goes out work or material rest 4 and takes place to rotate, and then adjusts the angle of the relative reservoir 1 of play work or material rest 4 to be 90 for discharge opening 44 when guaranteeing the copper line ejection of compact.
In addition, this embodiment still provides a scheme, promptly the one end of dead lever 52 is connected with an regulating plate 55, regulating plate 55 articulates on bobbin 51, dead lever 52 takes place to rotate for bobbin 51, and after the rigidity of play work or material rest 4, can adjust the height position of delivery wheel 53 through adjusting regulating plate 55 to the angle of being qualified for the next round of competitions of adjustment copper line makes copper line and discharge opening 44 be the ejection of compact of vertical direction.
The discharging angle of the copper wire and the discharging hole 44 can be adjusted by one of the three modes, so that the generation of a 'sun and shade surface' of the copper wire can be prevented during discharging, then the required effect can be achieved by combining any two modes or implementing the three modes together, the dispatching plate 45 and the conveying wheel 53 are adjusted to be trimmed at a large angle, the position of the wire pressing device is adjusted to be fine adjusted, the combined effect is better than that of the single use, and the primary and secondary adjusting functions are achieved; and thus should not be considered as limiting, but merely as enabling one of them.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention.
The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (10)
1. A copper wire tinning device with an adjustable discharging angle is characterized by comprising a liquid storage tank (1) for loading liquid tin, and a wire inlet frame (3), a wire pressing mechanism (2) and a discharging frame (4) which are sequentially erected on a notch of the liquid storage tank (1); the wire pressing mechanism (2) comprises a positioning plate (22) and a plurality of wire pressing rods (21), the wire pressing rods (21) are movably connected to the positioning plate (22), sliding parts are arranged at two ends of the positioning plate (22), and the sliding parts are arranged on sliding rails of a notch of the liquid storage tank (1); the discharging frame (4) is provided with discharging holes (44) in the same number as the line pressing rods (21) in an array manner, two ends of the discharging frame (4) are respectively connected with a scheduling plate, the top end of the scheduling plate is hinged to the edge of a notch at one end of the liquid storage tank (1), and the discharging frame (4) can rotate relative to the liquid storage tank (1); the wire inlet frame (3) is provided with wire inlet holes (31) in the same number as the wire pressing rods (21), and the bottom of the wire inlet frame (3) is arranged on the edge of the notch at the other end of the liquid storage tank (1); the copper wire can be discharged perpendicular to the discharging hole (44) by adjusting the angle of the discharging frame (4) and/or the direction of the sliding positioning plate (22).
2. The copper wire tinning device according to claim 1, wherein a plurality of die frames are arranged on the discharge frame (4), the distance between every two adjacent die frames is the same, a die (46) is arranged on every two adjacent die frames, and the die frames and the die (46) enclose the discharge hole (44).
3. The copper wire tinning apparatus of claim 2, characterized in that the diameter of the tap hole (44) is equal to the outer diameter of the copper wire plus the thickness of the layer to be tinned.
4. The copper wire tinning device according to claim 2, characterized in that the discharge hole (44) is provided with a wiper (43) towards the edge of the hole diameter in the liquid storage tank (1), and the wiper (43) is used for wiping off the excessive thickness of the copper wire tinning surface layer; the section of the scraping blade (43) is in an inverted triangle shape.
5. The copper wire tinning device according to claim 1, characterized in that a plurality of positioning grooves (221) are arrayed on the positioning plate (22), and each wire pressing rod (21) can be movably arranged in the positioning groove (221); during the tin plating process, the wire pressing rod (21) is moved or rotated, and the bottom of the wire pressing rod (21) extends into the liquid storage tank (1).
6. The copper wire tinning device according to claim 4, characterized in that the positioning plate (22) is provided with a cross bar (25), the wire pressing rod (21) is connected to the cross bar (25) through a hinge, and during tinning, the wire pressing rod (21) is rotated and put into the positioning groove (221), and the bottom of the wire pressing rod extends into the liquid storage tank (1).
7. The copper wire tinning device according to claim 1, wherein a wire pressing port (211) for pressing a copper wire is formed in the bottom of the wire pressing rod (21), and a wear-resistant layer is formed on the inner wall of the wire pressing port (211) and is made of a ceramic material.
8. The copper wire tinning apparatus according to claim 1, characterized in that the path of the copper wire entering from the wire inlet hole (31) and passing through the wire pressing rod (21) and then discharging from the discharging hole (44) is a processing path, and the adjacent processing paths are parallel to each other.
9. The copper wire tinning device according to claims 1 to 8, characterized in that a heater and a temperature sensor are arranged in the liquid storage tank (1), the temperature sensor is used for detecting the temperature in the liquid storage tank (1), the heater is used for heating the inside of the tank, and the heater and the temperature sensor are in signal connection with a controller.
10. A copper wire tinning system comprising the copper wire tinning apparatus according to any one of claims 1 to 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011060595.1A CN112376009A (en) | 2020-09-30 | 2020-09-30 | Copper wire tinning device and system capable of adjusting discharging angle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011060595.1A CN112376009A (en) | 2020-09-30 | 2020-09-30 | Copper wire tinning device and system capable of adjusting discharging angle |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112376009A true CN112376009A (en) | 2021-02-19 |
Family
ID=74580957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011060595.1A Withdrawn CN112376009A (en) | 2020-09-30 | 2020-09-30 | Copper wire tinning device and system capable of adjusting discharging angle |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112376009A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112853246A (en) * | 2021-03-08 | 2021-05-28 | 江苏亨通精工金属材料有限公司 | Copper doubling hot tinning device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202170360U (en) * | 2011-08-10 | 2012-03-21 | 深圳市神州线缆有限公司 | Tinned furnace with temperature control function |
CN203960314U (en) * | 2014-07-04 | 2014-11-26 | 西部超导材料科技股份有限公司 | A kind of line ball wicking for wire rod hot tinning is crossed die device |
CN109929971A (en) * | 2019-05-06 | 2019-06-25 | 鹰潭毅鹏智能科技有限公司 | A kind of glass-coated microwire annealing tin-plating machine production line |
JP2019157224A (en) * | 2018-03-14 | 2019-09-19 | 日立金属株式会社 | Tin plated copper wire, method for manufacturing the same, insulated wire and cable |
CN209722257U (en) * | 2019-03-21 | 2019-12-03 | 广东丹海金属有限公司 | A copper wire tinning equipment |
CN110835009A (en) * | 2019-10-19 | 2020-02-25 | 东莞市稳畅电子制品有限公司 | Production process of copper wire soldering tin |
CN110904401A (en) * | 2019-12-30 | 2020-03-24 | 江苏山峰铜业科技有限公司 | Bare copper tinning process |
-
2020
- 2020-09-30 CN CN202011060595.1A patent/CN112376009A/en not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202170360U (en) * | 2011-08-10 | 2012-03-21 | 深圳市神州线缆有限公司 | Tinned furnace with temperature control function |
CN203960314U (en) * | 2014-07-04 | 2014-11-26 | 西部超导材料科技股份有限公司 | A kind of line ball wicking for wire rod hot tinning is crossed die device |
JP2019157224A (en) * | 2018-03-14 | 2019-09-19 | 日立金属株式会社 | Tin plated copper wire, method for manufacturing the same, insulated wire and cable |
CN209722257U (en) * | 2019-03-21 | 2019-12-03 | 广东丹海金属有限公司 | A copper wire tinning equipment |
CN109929971A (en) * | 2019-05-06 | 2019-06-25 | 鹰潭毅鹏智能科技有限公司 | A kind of glass-coated microwire annealing tin-plating machine production line |
CN110835009A (en) * | 2019-10-19 | 2020-02-25 | 东莞市稳畅电子制品有限公司 | Production process of copper wire soldering tin |
CN110904401A (en) * | 2019-12-30 | 2020-03-24 | 江苏山峰铜业科技有限公司 | Bare copper tinning process |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112853246A (en) * | 2021-03-08 | 2021-05-28 | 江苏亨通精工金属材料有限公司 | Copper doubling hot tinning device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112376010A (en) | Go out work or material rest and copper line tinning stack thereof | |
US4385967A (en) | Electroplating apparatus and method | |
US4395320A (en) | Apparatus for producing electrodeposited wires | |
CN210516319U (en) | Cable insulation layer cladding device | |
CN113755917B (en) | Electroplating system | |
JP2005519200A (en) | Horizontal processing line and method by conveyor for wet processing of workpieces | |
US4459183A (en) | Electroplating apparatus and method | |
CN110062822B (en) | Electroplating method for metal zipper and electroplating device for metal zipper | |
CN112376009A (en) | Copper wire tinning device and system capable of adjusting discharging angle | |
US4367125A (en) | Apparatus and method for plating metallic strip | |
CN112251703A (en) | Copper wire tinning method | |
CN102453939A (en) | Machine and process for selective electroplating of flexible circuit boards for roll-to-roll delivery | |
CN215163042U (en) | Photovoltaic solder strip coating device | |
CN112251701A (en) | Liquid storage tank | |
CN112251702A (en) | Copper wire tinning machine | |
KR100661456B1 (en) | FLC film production apparatus and FLC film production method | |
CN220665497U (en) | Electroplating carrier and equipment | |
CN109023458B (en) | A kind of electroplanting device and method of PCB circuit board | |
KR101294913B1 (en) | Ash and dross preventing apparatus in snout and plated steel sheet manufacturing apparatus using the same | |
KR920000247B1 (en) | Device and process for the electro-deposition of metals | |
CN209759607U (en) | Continuous local tinning stack | |
CN212669815U (en) | Local area surface treatment device | |
CN221141830U (en) | Hot-dip coating device for metal coating processing | |
CN2175240Y (en) | High-efficiency electroplating machine for wire metal | |
KR100647805B1 (en) | Horizontal Continuous Plating Equipment Using Cathode Roller |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210219 |