CN112352142B - Method and device for measuring temperature - Google Patents
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- CN112352142B CN112352142B CN201980039655.0A CN201980039655A CN112352142B CN 112352142 B CN112352142 B CN 112352142B CN 201980039655 A CN201980039655 A CN 201980039655A CN 112352142 B CN112352142 B CN 112352142B
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
- G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/026—Control of working procedures of a pyrometer, other than calibration; Bandwidth calculation; Gain control
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- G—PHYSICS
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G01J5/047—Mobile mounting; Scanning arrangements
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G01J5/07—Arrangements for adjusting the solid angle of collected radiation, e.g. adjusting or orienting field of view, tracking position or encoding angular position
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0893—Arrangements to attach devices to a pyrometer, i.e. attaching an optical interface; Spatial relative arrangement of optical elements, e.g. folded beam path
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- G—PHYSICS
- G01—MEASURING; TESTING
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0896—Optical arrangements using a light source, e.g. for illuminating a surface
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- G—PHYSICS
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/12—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance
- G01K11/125—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance using changes in reflectance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0864—Measuring electromagnetic field characteristics characterised by constructional or functional features
- G01R29/0878—Sensors; antennas; probes; detectors
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H01—ELECTRIC ELEMENTS
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
Description
技术领域Technical Field
本公开内容的各方面一般涉及用于测量温度的方法和设备。进一步地,本公开内容的各方面涉及用于处理腔室的非接触温度测量。Aspects of the present disclosure generally relate to methods and apparatus for measuring temperature. Further, aspects of the present disclosure relate to non-contact temperature measurement for a processing chamber.
背景技术Background technique
相关联于半导体装置等制造的处理期间,在基板上实现众多的热处理操作。热处理一般使用用于处理控制的温度测量。不精确的温度测量可导致糟糕的处理结果,而可不利地影响半导体装置效能和/或制造良率。During processing associated with the manufacture of semiconductor devices and the like, numerous thermal processing operations are performed on substrates. Thermal processing generally uses temperature measurements for process control. Inaccurate temperature measurements can lead to poor process results, which can adversely affect semiconductor device performance and/or manufacturing yield.
有时使用光学高温计以在半导体装置制造处理中测量基板温度。自基板表面所发射的电磁辐射的强度由光学高温计传感器来测量且相关于使用普朗克定律的温度以决定基板温度。在典型的热处理腔室中,光学高温计暴露于来自许多来源的电磁辐射,例如腔室内部的灯具及热表面,而遮蔽基板所发射的电磁辐射。腔室中来自电磁噪声的干扰可使得决定真实基板温度为困难的,而可导致错误的温度决定及导致糟糕的处理结果。Optical pyrometers are sometimes used to measure substrate temperature in semiconductor device manufacturing processes. The intensity of electromagnetic radiation emitted from the substrate surface is measured by the optical pyrometer sensor and related to the temperature using Planck's law to determine the substrate temperature. In a typical thermal processing chamber, the optical pyrometer is exposed to electromagnetic radiation from many sources, such as lamps and hot surfaces inside the chamber, while shielding the electromagnetic radiation emitted by the substrate. Interference from electromagnetic noise in the chamber can make it difficult to determine the true substrate temperature, which can lead to erroneous temperature determinations and cause poor processing results.
因此,具有针对改良的用于基板温度测量的设备和方法的需求。Therefore, there is a need for improved apparatus and methods for substrate temperature measurement.
发明内容Summary of the invention
提供用于测量基板温度的设备和方法。在一个或多个实施方式中,用于估计温度的设备包含:多个电磁辐射来源,放置该多个电磁辐射来源以发射电磁辐射朝向反射平面;和多个电磁辐射检测器,放置每一电磁辐射检测器以对由该多个电磁辐射来源的对应电磁辐射来源所发射的电磁辐射采样。该设备也包含高温计,放置该高温计以接收源自该多个电磁辐射来源且自该反射平面反射的电磁辐射;和处理器,该处理器经配置以基于由该高温计和由所述电磁辐射检测器所接收的电磁辐射来估计温度。An apparatus and method for measuring substrate temperature is provided. In one or more embodiments, an apparatus for estimating temperature includes: a plurality of electromagnetic radiation sources positioned to emit electromagnetic radiation toward a reflective plane; and a plurality of electromagnetic radiation detectors, each electromagnetic radiation detector positioned to sample electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources. The apparatus also includes a pyrometer positioned to receive electromagnetic radiation originating from the plurality of electromagnetic radiation sources and reflected from the reflective plane; and a processor configured to estimate temperature based on electromagnetic radiation received by the pyrometer and by the electromagnetic radiation detector.
在其他实施方式中,用于估计温度的方法包含以下步骤:由多个电磁辐射来源的每一者发射电磁辐射朝一基板;和由多个电磁辐射检测器的每一者对由该多个电磁辐射来源的对应电磁辐射来源所发射的电磁辐射采样。该方法也包含以下步骤:由高温计接收自该基板所反射的电磁辐射及由该基板所发射的电磁辐射;和使用处理器以基于该基板所发射的电磁辐射来估计该基板的温度。In other embodiments, a method for estimating temperature includes the steps of: emitting electromagnetic radiation from each of a plurality of electromagnetic radiation sources toward a substrate; and sampling electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources by each of a plurality of electromagnetic radiation detectors. The method also includes the steps of: receiving, by a pyrometer, electromagnetic radiation reflected from the substrate and electromagnetic radiation emitted by the substrate; and using a processor to estimate the temperature of the substrate based on the electromagnetic radiation emitted by the substrate.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
于是可以详细理解本公开内容上述特征中的方式,可通过参考实施方式而具有本公开内容的更特定描述(简短总结如上),其中一些图示于所附附图中。然而,注意所附附图仅图示本公开内容的典型的实施方式,因此不考虑限制其范围,因为本公开内容可允许其他等效实施方式。So that the manner in which the above-described features of the present disclosure may be understood in detail, a more particular description of the present disclosure may be had by reference to embodiments (briefly summarized above), some of which are illustrated in the accompanying drawings. Note, however, that the accompanying drawings illustrate only typical embodiments of the present disclosure and are therefore not intended to limit its scope, as the present disclosure may admit to other equally effective embodiments.
图1根据本公开内容的一个方面描绘温度测量系统的简化示意图。FIG. 1 depicts a simplified schematic diagram of a temperature measurement system according to one aspect of the present disclosure.
图2A、2B和2C根据本公开内容的一个方面图标脉冲列信号的范例。2A , 2B, and 2C illustrate examples of pulse train signals according to one aspect of the present disclosure.
图3A、3B和3C根据本公开内容的一个方面图标脉冲列信号的其他范例。3A , 3B and 3C illustrate other examples of pulse train signals according to one aspect of the present disclosure.
图4根据本公开内容的各方面图示处理腔室的示意横截面,图1的温度测量系统并入至此。4 illustrates a schematic cross-section of a processing chamber into which the temperature measurement system of FIG. 1 is incorporated, according to aspects of the present disclosure.
图5为根据本公开内容的各方面用于检测陈化处理的终点的示范方法的流程图。5 is a flow chart of an exemplary method for detecting an endpoint of an aging process according to aspects of the present disclosure.
思量可有利地将一个实施方式的元件和特征并入其他实施方式中,而无须进一步叙述。然而,注意附图仅图示本公开内容示范的实施方式,因此不考虑限制其范围,因为本公开内容可允许其他等效实施方式。It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. Note, however, that the appended drawings illustrate only exemplary embodiments of the disclosure and are therefore not to be considered limiting of its scope, as the disclosure may admit to other equally effective embodiments.
具体实施方式Detailed ways
在一个或多个实施方式中,提供用于估计温度的设备。该设备包含:多个电磁辐射来源,放置该多个电磁辐射来源以发射电磁辐射朝向反射平面;和多个电磁辐射检测器。放置每一电磁辐射检测器以对由该多个电磁辐射来源的对应电磁辐射来源所发射的电磁辐射采样。该设备也包含高温计,放置该高温计以接收自该多个电磁辐射来源所发射及自设置于反射平面处的基板所反射的电磁辐射及基板所发射的电磁辐射。该设备包含处理器,该处理器经配置以基于基板所发射的电磁辐射来估计基板温度。也提供估计温度的方法。图1为根据本公开内容的一个方面的温度测量系统100的简化示意图。温度测量系统100包含电磁辐射来源102及106、电磁辐射检测器103及108、高温计110、及放置相邻于基板101的控制器120。In one or more embodiments, an apparatus for estimating temperature is provided. The apparatus includes: a plurality of electromagnetic radiation sources, the plurality of electromagnetic radiation sources are positioned to emit electromagnetic radiation toward a reflecting plane; and a plurality of electromagnetic radiation detectors. Each electromagnetic radiation detector is positioned to sample electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources. The apparatus also includes a pyrometer, the pyrometer is positioned to receive electromagnetic radiation emitted from the plurality of electromagnetic radiation sources and reflected from a substrate disposed at the reflecting plane and electromagnetic radiation emitted by the substrate. The apparatus includes a processor, the processor being configured to estimate the substrate temperature based on the electromagnetic radiation emitted by the substrate. A method for estimating temperature is also provided. FIG. 1 is a simplified schematic diagram of a temperature measurement system 100 according to one aspect of the present disclosure. The temperature measurement system 100 includes electromagnetic radiation sources 102 and 106, electromagnetic radiation detectors 103 and 108, a pyrometer 110, and a controller 120 positioned adjacent to a substrate 101.
基板101可为晶片或能够有材料沉积于其上的面板基板。在一个或多个范例中,基板101可为硅(掺杂或未掺杂)、结晶硅、氧化硅、掺杂或未掺杂多晶硅等、锗基板、锗化硅(SiGe)基板、III-V族化合物基板,例如砷化镓基板、碳化硅(SiC)基板、图案化或未图案化绝缘体上半导体(SOI)基板、掺杂碳的氧化物、氮化硅、太阳能阵列、太阳能面板、发光二极管(LED)基板、或任何其他材料例如金属、金属合金、及其他导体材料。在一些范例中,基板101可为基板保持器或基板底座、吸座平板等。基板101也可包含多个层,例如半绝缘性材料及半导电性材料,其中半绝缘性材料具有较半导电性材料更高的电阻性。基板101不限于任何特定大小及形状。根据靠近基板101表面的基板材料的电阻性,基板101反射具有约50μm至约100cm的波长的入射电磁辐射。The substrate 101 may be a wafer or a panel substrate capable of having materials deposited thereon. In one or more examples, the substrate 101 may be silicon (doped or undoped), crystalline silicon, silicon oxide, doped or undoped polysilicon, etc., a germanium substrate, a silicon germanium (SiGe) substrate, a III-V compound substrate, such as a gallium arsenide substrate, a silicon carbide (SiC) substrate, a patterned or unpatterned semiconductor on insulator (SOI) substrate, a carbon-doped oxide, silicon nitride, a solar array, a solar panel, a light emitting diode (LED) substrate, or any other material such as metal, metal alloy, and other conductive materials. In some examples, the substrate 101 may be a substrate holder or substrate base, a suction seat plate, etc. The substrate 101 may also include multiple layers, such as a semi-insulating material and a semi-conductive material, wherein the semi-insulating material has a higher resistivity than the semi-conductive material. The substrate 101 is not limited to any particular size and shape. According to the resistivity of the substrate material near the surface of the substrate 101, the substrate 101 reflects incident electromagnetic radiation having a wavelength of about 50 μm to about 100 cm.
温度测量系统100也包含信号产生器104及107。信号产生器104及107个别应用时变功率至电磁辐射来源102及106。在一个或多个实施方式中,每一信号产生器104、107可产生具有不同周期性、形状(例如,正弦脉冲或三角形脉冲)、图案、及/或振幅的多种波形。在一些情况中,信号产生器104及107可将功率脉冲发送至电磁辐射来源102及106。信号产生器104及107的使用允许短脉冲的电磁辐射自电磁辐射来源102及106发射以决定来自基板101的反射率。The temperature measurement system 100 also includes signal generators 104 and 107. The signal generators 104 and 107 apply time-varying power to the electromagnetic radiation sources 102 and 106, respectively. In one or more embodiments, each signal generator 104, 107 may generate a variety of waveforms having different periodicities, shapes (e.g., sinusoidal pulses or triangular pulses), patterns, and/or amplitudes. In some cases, the signal generators 104 and 107 may send power pulses to the electromagnetic radiation sources 102 and 106. The use of the signal generators 104 and 107 allows short pulses of electromagnetic radiation to be emitted from the electromagnetic radiation sources 102 and 106 to determine the reflectivity from the substrate 101.
电磁辐射来源102发射电磁辐射L1,具有根据信号产生器104所提供的信号朝向基板101的时变强度。电磁辐射来源106发射电磁辐射L2,具有根据信号产生器107所提供的信号朝向基板101的时变强度。在一个或多个实施方式中,电磁辐射来源102及106的每一者可为热来源(例如,加热灯具)以提供热能至基板101以用于升高基板101的温度。The electromagnetic radiation source 102 emits electromagnetic radiation L 1 with a time-varying intensity toward the substrate 101 according to the signal provided by the signal generator 104. The electromagnetic radiation source 106 emits electromagnetic radiation L 2 with a time-varying intensity toward the substrate 101 according to the signal provided by the signal generator 107. In one or more embodiments, each of the electromagnetic radiation sources 102 and 106 may be a heat source (e.g., a heating lamp) to provide thermal energy to the substrate 101 for increasing the temperature of the substrate 101.
电磁辐射检测器103具有设置相邻于电磁辐射来源102的探针头141,且检测来自电磁辐射来源102的发射圆锥131的部分的电磁辐射L3。电磁辐射L3对应于自基板101所反射且由高温计110检测为电磁辐射R1的电磁辐射L1。检测器103的探针头141设置于至电磁辐射来源102的发射元件142的视线(line-of-sight)中。发射圆锥131中的电磁辐射在发射圆锥131内所有发射角度具有实质相同强度。在一个或多个实施方式中,检测器103的探针头141与电磁辐射来源102的发射圆锥131的圆锥表面对齐。在一个或多个实施方式中,检测器103耦接至采样电路105以决定检测器103的采样率。The electromagnetic radiation detector 103 has a probe head 141 disposed adjacent to the electromagnetic radiation source 102 and detects electromagnetic radiation L 3 from a portion of the emission cone 131 of the electromagnetic radiation source 102. The electromagnetic radiation L 3 corresponds to the electromagnetic radiation L 1 reflected from the substrate 101 and detected by the pyrometer 110 as electromagnetic radiation R 1. The probe head 141 of the detector 103 is disposed in a line-of-sight to the emission element 142 of the electromagnetic radiation source 102. The electromagnetic radiation in the emission cone 131 has substantially the same intensity at all emission angles within the emission cone 131. In one or more embodiments, the probe head 141 of the detector 103 is aligned with a conical surface of the emission cone 131 of the electromagnetic radiation source 102. In one or more embodiments, the detector 103 is coupled to a sampling circuit 105 to determine a sampling rate of the detector 103.
检测器108设置于至电磁辐射来源106的发射元件144的视线中。电磁辐射来源106包含设置于反射器146内的发光元件144。检测器108包含设置相邻于来源106的探针头143,且检测来自对应于电磁辐射L2的来源106的发射圆锥132的电磁辐射L4。在一个或多个实施方式中,检测器108的探针头143与电磁辐射来源106的发射圆锥132的圆锥表面对齐。在一个或多个实施方式中,检测器108耦接至采样电路109以决定检测器108的采样率。温度测量系统100可以较高采样率取得较高温度分辨率。The detector 108 is disposed in a line of sight to an emission element 144 of an electromagnetic radiation source 106. The electromagnetic radiation source 106 includes a light emitting element 144 disposed within a reflector 146. The detector 108 includes a probe head 143 disposed adjacent to the source 106 and detects electromagnetic radiation L 4 from an emission cone 132 of the source 106 corresponding to electromagnetic radiation L 2. In one or more embodiments, the probe head 143 of the detector 108 is aligned with a conical surface of the emission cone 132 of the electromagnetic radiation source 106. In one or more embodiments, the detector 108 is coupled to a sampling circuit 109 to determine a sampling rate of the detector 108. The temperature measurement system 100 can achieve higher temperature resolution at a higher sampling rate.
在一个或多个实施方式中,检测器103及106由光纤制成。在其他实施方式中,检测器103及106包含以个别角度弯曲的探针头141、143以个别与辐射束L3及L4对齐。在其他实施方式中,在电磁辐射来源102中的反射器145中形成开口102a。开口102a设置于一位置中以经由开口102a通过电磁辐射L5至检测器,例如检测器103,经放置以接收经由开口102a的电磁辐射L5。虽然未展示,电磁辐射来源106也可包含相似于开口102a的开口。In one or more embodiments, the detectors 103 and 106 are made of optical fibers. In other embodiments, the detectors 103 and 106 include probe heads 141, 143 bent at respective angles to align with the radiation beams L3 and L4 , respectively. In other embodiments, an opening 102a is formed in a reflector 145 in the electromagnetic radiation source 102. The opening 102a is disposed in a position to pass electromagnetic radiation L5 through the opening 102a to a detector, such as the detector 103, which is positioned to receive the electromagnetic radiation L5 through the opening 102a. Although not shown, the electromagnetic radiation source 106 may also include an opening similar to the opening 102a.
个别电磁辐射来源102及106的发射元件142、144发射在所有方向上具有一般相似强度的电磁辐射。因此,电磁辐射L3具有与对应的电磁辐射L1实质相同的强度。相似地,电磁辐射L4具有与电磁辐射L2实质相同的强度。在操作中,控制器120由对应的电磁辐射L3的强度来估计电磁辐射L1的强度。控制器120也由对应的电磁辐射L4的强度来估计电磁辐射L2的强度。The emitting elements 142, 144 of the respective electromagnetic radiation sources 102 and 106 emit electromagnetic radiation having generally similar intensities in all directions. Therefore, electromagnetic radiation L3 has substantially the same intensity as the corresponding electromagnetic radiation L1 . Similarly, electromagnetic radiation L4 has substantially the same intensity as electromagnetic radiation L2 . In operation, the controller 120 estimates the intensity of electromagnetic radiation L1 from the intensity of the corresponding electromagnetic radiation L3 . The controller 120 also estimates the intensity of electromagnetic radiation L2 from the intensity of the corresponding electromagnetic radiation L4 .
高温计110检测自基板101所发射和/或反射的电磁辐射。高温计110处所接收的电磁辐射包含自基板101所发射的电磁辐射T1,及自基板101所反射的电磁辐射,例如L1及L2。在一个或多个实施方式中,高温计110包含光学窄频带滤波器,在小于950nm波长处具有约20nm的带通,即,处于约1.1eV(约1.1μm)的硅带隙上方的光子能量。带通可替代地表示为基板101的带隙波长下方的光子波长。使用具有窄频带功能性的高温计减低了来自其他频谱带中的其他来源的噪声,因而改良了测量精确性。The pyrometer 110 detects electromagnetic radiation emitted and/or reflected from the substrate 101. The electromagnetic radiation received at the pyrometer 110 includes electromagnetic radiation T1 emitted from the substrate 101, and electromagnetic radiation reflected from the substrate 101, such as L1 and L2 . In one or more embodiments, the pyrometer 110 includes an optical narrowband filter having a bandpass of about 20 nm at wavelengths less than 950 nm, i.e., photon energies above the silicon bandgap of about 1.1 eV (about 1.1 μm). The bandpass may alternatively be expressed as a photon wavelength below the bandgap wavelength of the substrate 101. Using a pyrometer with narrowband functionality reduces noise from other sources in other spectral bands, thereby improving measurement accuracy.
在一些实施方式中,可以不同波长来操作电磁辐射来源102及106。在此实施方式中,高温计110包含针对不同波长的检测元件以在频谱上分开来自个别电磁辐射来源的辐射。在这样的情况中,温度测量系统100可决定基板101的反射率,同时操作电磁辐射来源。在这样的范例中,电磁辐射来源102及106经配置以发射具有多个波长(例如,自红外光至紫外光)的辐射的频谱。在一个或多个实施方式中,快速傅立叶变换(FFT)分析器111耦接至高温计110以根据波长分开由高温计110所接收的反射的辐射。在一些实施方式中,锁定(lock-in)放大器可耦接至高温计110以分开接收的反射的辐射。在其他实施方式中,以相同波长或不同波长一次操作电磁辐射来源102及106的一者。In some embodiments, the electromagnetic radiation sources 102 and 106 may be operated at different wavelengths. In this embodiment, the pyrometer 110 includes detection elements for different wavelengths to spectrally separate the radiation from the individual electromagnetic radiation sources. In such a case, the temperature measurement system 100 may determine the reflectivity of the substrate 101 while operating the electromagnetic radiation sources. In such an example, the electromagnetic radiation sources 102 and 106 are configured to emit a spectrum of radiation having multiple wavelengths (e.g., from infrared light to ultraviolet light). In one or more embodiments, a fast Fourier transform (FFT) analyzer 111 is coupled to the pyrometer 110 to separate the reflected radiation received by the pyrometer 110 according to wavelength. In some embodiments, a lock-in amplifier may be coupled to the pyrometer 110 to separate the received reflected radiation. In other embodiments, one of the electromagnetic radiation sources 102 and 106 is operated at the same wavelength or at different wavelengths at a time.
温度测量系统100连接至控制器120以在处理期间控制温度测量系统100的各方面。控制器120包含中央处理单元(CPU)121、存储器(memory)122、储存器(storage)124、及针对CPU 121的支持电路123。控制器120便于温度测量系统100的部件的控制,并潜在地便于使用温度测量系统100的设备的其他部件的控制。控制器120可为通用计算机,可使用于工业设定以用于控制多种腔室及子处理器。存储器122存储可经执行或调用而以此处所述方式控制温度测量系统100的总体操作的软件(原或目标代码)。控制器120操纵温度测量系统100中的可控制部件的个别操作。控制器120可包含针对温度测量系统100的部件的电源。The temperature measurement system 100 is connected to a controller 120 to control various aspects of the temperature measurement system 100 during processing. The controller 120 includes a central processing unit (CPU) 121, a memory 122, a storage 124, and support circuits 123 for the CPU 121. The controller 120 facilitates the control of the components of the temperature measurement system 100, and potentially facilitates the control of other components of the device using the temperature measurement system 100. The controller 120 can be a general-purpose computer that can be used in an industrial setting for controlling a variety of chambers and sub-processors. The memory 122 stores software (source or object code) that can be executed or called to control the overall operation of the temperature measurement system 100 in the manner described herein. The controller 120 manipulates the individual operations of the controllable components in the temperature measurement system 100. The controller 120 may include power supplies for the components of the temperature measurement system 100.
控制器120耦接至多个信号产生器104及107且控制个别来自信号产生器104及107要应用至电磁辐射来源102及106的信号。控制器105也接收来自高温计110和/或对应至高温计110的电路(例如,FFT分析器(或锁定放大器)111)的辐射数据。控制器105处理高温计110所接收的辐射数据以估计基板101的温度,如下述。The controller 120 is coupled to the plurality of signal generators 104 and 107 and controls the signals from the respective signal generators 104 and 107 to be applied to the electromagnetic radiation sources 102 and 106. The controller 105 also receives radiation data from the pyrometer 110 and/or circuitry corresponding to the pyrometer 110 (e.g., FFT analyzer (or lock-in amplifier) 111). The controller 105 processes the radiation data received by the pyrometer 110 to estimate the temperature of the substrate 101, as described below.
在图1中,电磁辐射来源102及106、检测器103及108、及高温计110被图示成位于基板101下方。然而,这些部件可设置于任何便利位置处(例如基板101上方的位置)、或在基板101垂直定向时设置至基板101的一侧。也可使用任何数量的来源102、106及检测器103、108。进一步地,可使用多于一个高温计110以测量多个位置处或基板101的不同区内的温度。多个来源、检测器、及高温计能对信噪比改良。In FIG. 1 , electromagnetic radiation sources 102 and 106, detectors 103 and 108, and pyrometer 110 are illustrated as being located below substrate 101. However, these components may be located at any convenient location, such as a location above substrate 101, or to a side of substrate 101 when substrate 101 is oriented vertically. Any number of sources 102, 106 and detectors 103, 108 may also be used. Further, more than one pyrometer 110 may be used to measure the temperature at multiple locations or within different regions of substrate 101. Multiple sources, detectors, and pyrometers can improve the signal-to-noise ratio.
在监测基板101的温度的操作期间,信号产生器104及107输入时变信号进入电磁辐射来源102及106。电磁辐射来源102及106接收时变信号且个别基于输入时变信号发射电磁辐射L1及L2朝向基板101。辐射L1以入射角θ1照射基板101且部分被吸收、部分被传送及/或部分被反射。相似地,辐射L2以入射角θ2照射基板101且部分被吸收、部分被传送及/或部分被反射。反射的辐射R1及R2继续朝向高温计110。During operation of monitoring the temperature of substrate 101, signal generators 104 and 107 input time-varying signals into electromagnetic radiation sources 102 and 106. Electromagnetic radiation sources 102 and 106 receive the time-varying signals and transmit electromagnetic radiation L1 and L2 toward substrate 101, respectively, based on the input time-varying signals. Radiation L1 strikes substrate 101 at an incident angle θ1 and is partially absorbed, partially transmitted, and/or partially reflected. Similarly, radiation L2 strikes substrate 101 at an incident angle θ2 and is partially absorbed, partially transmitted, and/or partially reflected. Reflected radiation R1 and R2 continue toward pyrometer 110.
检测器103及108检测辐射L3及L4,个别对应至辐射L1及L2。辐射L3具有与对应的辐射L1实质相同的强度,或两个辐射部件的强度具有定义的关系,所以可使用辐射L3的强度(由检测器103所测量)以决定辐射L1的强度。辐射L4及辐射L2共享相似的关系,便于使用检测器108来决定辐射L2。Detectors 103 and 108 detect radiation L3 and L4 , corresponding to radiation L1 and L2 , respectively. Radiation L3 has substantially the same intensity as corresponding radiation L1 , or the intensities of the two radiation components have a defined relationship, so the intensity of radiation L3 (measured by detector 103) can be used to determine the intensity of radiation L1 . Radiation L4 and radiation L2 share a similar relationship, facilitating the use of detector 108 to determine radiation L2 .
高温计110检测电磁辐射的总强度,即辐射T1、R1及R2组合的总强度。因此,由高温计110所检测的组合的电磁辐射的强度(标示为I_SP)为辐射T1的强度I_T1加上辐射R1的强度I_R1加上辐射R2的强度I_R2。因此,组合的电磁辐射的强度I_SP表示为:The pyrometer 110 detects the total intensity of electromagnetic radiation, i.e., the total intensity of the combined radiations T 1 , R 1 , and R 2. Therefore, the intensity of the combined electromagnetic radiation (denoted as I_SP ) detected by the pyrometer 110 is the intensity of the radiation T 1 I_T 1 plus the intensity of the radiation R 1 I_R 1 plus the intensity of the radiation R 2 I_R 2. Therefore, the intensity of the combined electromagnetic radiation I_SP is expressed as:
I_SP=I_T1+I_R1+I_R2 (1) I_SP = I_T1 + I_R1 + I_R2 (1)
将基板101的反射率ρ定义为反射束(例如,R1)的强度对入射束(例如,L1)的比率。因此,基板101的反射率ρ表示为:The reflectivity ρ of the substrate 101 is defined as the ratio of the intensity of the reflected beam (eg, R 1 ) to the incident beam (eg, L 1 ). Therefore, the reflectivity ρ of the substrate 101 is expressed as:
此处,△L1为辐射L1的最大强度(例如,图2A的峰值201)减掉辐射L1的最小强度(例如,图2A的202)。相似地,△R1为反射的辐射R1的最大强度减掉反射的辐射R1的最小强度。相似地,△L2为辐射L2的最大强度(例如,图2B的211)减掉辐射L2的最小强度(例如,图2B的212)。相似地,△R2为反射的辐射R2的最大强度减掉反射的辐射R2的最小强度。Here, ΔL1 is the maximum intensity of radiation L1 (e.g., peak 201 of FIG. 2A ) minus the minimum intensity of radiation L1 (e.g., 202 of FIG. 2A ). Similarly, ΔR1 is the maximum intensity of reflected radiation R1 minus the minimum intensity of reflected radiation R1 . Similarly, ΔL2 is the maximum intensity of radiation L2 (e.g., 211 of FIG. 2B ) minus the minimum intensity of radiation L2 (e.g., 212 of FIG. 2B ). Similarly, ΔR2 is the maximum intensity of reflected radiation R2 minus the minimum intensity of reflected radiation R2 .
在一个或多个实施方式中,为了决定反射率ρ,温度测量系统100可仅启动电磁辐射来源102、106的其中一者以发射电磁辐射并测量反射的辐射。反射率ρ取决于基板101的温度,便于决定基板101的温度。In one or more embodiments, to determine the reflectivity p, the temperature measurement system 100 may activate only one of the electromagnetic radiation sources 102 , 106 to emit electromagnetic radiation and measure the reflected radiation. The reflectivity p depends on the temperature of the substrate 101 , facilitating determination of the temperature of the substrate 101 .
发射的辐射T1的强度(I_T1)由以下等式来表示:The intensity of the emitted radiation T 1 (I_T 1 ) is expressed by the following equation:
I_T1=I_SP-I_R1-I_R2=I_SP-ρxI_L1-ρxI_L2 (3)I_T 1 = I_SP - I_R 1 - I_R 2 = I_SP - ρxI_L 1 - ρxI_L 2 (3)
如上述,电磁辐射L1及L2的每一者个别具有与对应的电磁辐射L3及L4(I_L3、I_L4)实质相同的强度(I_L1、I_L2)(个别由电磁辐射检测器103、108采样及测量)。因此,由于此等效性,等式3可重写成:As described above, each of electromagnetic radiations L1 and L2 has substantially the same intensity ( I_L1 , I_L2 ) as corresponding electromagnetic radiations L3 and L4 ( I_L3 , I_L4 ), respectively (sampled and measured by electromagnetic radiation detectors 103, 108, respectively). Therefore, due to this equivalence, Equation 3 can be rewritten as:
I_T1=I_SP-I_R1-I_R2=I_SP-ρxI_L3-ρxI_L4 (4)I_T 1 = I_SP - I_R 1 - I_R 2 = I_SP - ρxI_L 3 - ρxI_L 4 (4)
通过应用普朗克定律(维持发射的辐射T1=Bv(v,T))来计算样本的绝对温度T,其中给定在绝对温度T来自主体的频率v的光谱辐射为:The absolute temperature T of the sample is calculated by applying Planck's law (maintaining that the emitted radiation T 1 =B v (v, T)) given the spectral radiation of frequency v from the body at absolute temperature T as:
此处kB为玻尔兹曼常数,h为普朗克常数,且c为光在介质(无论为材料或真空)中的速度,且T为基板101的绝对温度。一般由物体的发射率来调节遵守普朗克定律,该发射率根据普朗克定律被定义为实际热辐射输出对理论输出的比率。因此,可使用普朗克定律以估计物体的温度,例如基板101。Here k B is the Boltzmann constant, h is the Planck constant, and c is the speed of light in a medium (whether a material or a vacuum), and T is the absolute temperature of the substrate 101. Planck's law is generally regulated by the emissivity of the object, which is defined according to Planck's law as the ratio of the actual thermal radiation output to the theoretical output. Therefore, Planck's law can be used to estimate the temperature of an object, such as the substrate 101.
上方系列的等式描述了如何基于两个辐射样本来估计基板101的温度。然而,可将这些等式延伸至高温计接收不定数量的辐射样本的任何实施方式,如下方将进一步讨论。The above series of equations describe how to estimate the temperature of substrate 101 based on two radiation samples. However, these equations can be extended to any embodiment where the pyrometer receives a varying number of radiation samples, as will be discussed further below.
图2A、2B、及2C根据本公开内容的一个方面图标脉冲列信号的范例。在图2A及2B中图标时变功率信号的范例。可使用时变功率信号(例如,脉冲信号)以在使用每一新基板实现校准处理期间测量基板的反射率,例如图1中所展示的基板101。在新基板导入具有此处的温度测量系统的设备时(与图1连接描述该温度测量系统),每一电磁辐射来源发出脉冲多次,例如10次,以决定基板的反射率。在一个或多个实施方式中,温度测量系统可在电磁辐射来源发出脉冲的同时旋转基板,以免反射率跨基板表面变化。在其他实施方式中,温度测量系统可同步发出脉冲与旋转,所以系统使用不同检测器103及108来双采样反射率。2A, 2B, and 2C illustrate examples of pulse train signals according to one aspect of the present disclosure. Examples of time-varying power signals are illustrated in FIGS. 2A and 2B. A time-varying power signal (e.g., a pulse signal) may be used to measure the reflectivity of a substrate, such as substrate 101 shown in FIG. 1, during a calibration process performed with each new substrate. When a new substrate is introduced into an apparatus having a temperature measurement system herein (described in connection with FIG. 1), each electromagnetic radiation source pulses a plurality of times, such as 10 times, to determine the reflectivity of the substrate. In one or more embodiments, the temperature measurement system may rotate the substrate while the electromagnetic radiation source pulses to prevent reflectivity from varying across the surface of the substrate. In other embodiments, the temperature measurement system may synchronize the pulsing and the rotation so that the system uses different detectors 103 and 108 to double sample the reflectivity.
图2A图示要应用至电磁辐射来源102的信号200,电磁辐射来源102接着根据信号200发射具有时变强度的电磁辐射L1。图2B图示要应用至电磁辐射来源106的信号210,电磁辐射来源106接着根据信号210发射具有时变强度的电磁辐射L2。信号200为具有峰值201(在周期时间t1中峰值201具有峰值电压VL1)的时变电压。信号210为具有两个峰值211(在周期时间t2中每一峰值211具有峰值电压VL2)的时变电压。在此实施方式中,峰值201及211在时间上不会重叠。图2C图标在根据信号200及210个别操作电磁辐射来源102及106时由高温计110所接收的示范的信号220。高温计110接收源自个别的电磁辐射来源102及106的反射的辐射R1及R2,及源自基板101的发射的辐射T1(导因于基板101的热能)。接收的信号220具有三个脉冲,第一脉冲221对应至信号200的峰值201,且第二脉冲222及第三脉冲223对应至信号210的峰值211。FIG2A illustrates a signal 200 to be applied to electromagnetic radiation source 102, which then emits electromagnetic radiation L1 having a time-varying intensity in accordance with signal 200. FIG2B illustrates a signal 210 to be applied to electromagnetic radiation source 106, which then emits electromagnetic radiation L2 having a time-varying intensity in accordance with signal 210. Signal 200 is a time-varying voltage having a peak 201, with peak 201 having a peak voltage VL1 during a cycle time t1 . Signal 210 is a time-varying voltage having two peaks 211, with each peak 211 having a peak voltage VL2 during a cycle time t2 . In this embodiment, peaks 201 and 211 do not overlap in time. FIG2C illustrates an exemplary signal 220 received by pyrometer 110 when electromagnetic radiation sources 102 and 106 are operated in accordance with signals 200 and 210, respectively. The pyrometer 110 receives reflected radiation R1 and R2 from respective electromagnetic radiation sources 102 and 106, and emitted radiation T1 from the substrate 101 (due to thermal energy of the substrate 101). The received signal 220 has three pulses, a first pulse 221 corresponding to the peak 201 of the signal 200, and a second pulse 222 and a third pulse 223 corresponding to the peak 211 of the signal 210.
在图3A及3B中图标时变功率信号的不同范例。图3A图示要应用至电磁辐射来源102的信号300,且图3B图示要供应至电磁辐射来源106的信号310。信号300为具有峰值301(在周期时间t1中峰值301具有峰值电压VL1)的时变电压。信号310为具有两个峰值311、312(在周期时间t2中每一峰值具有峰值电压VL2)的时变电压。此处,在时间上一个峰值301与峰值311重叠。Different examples of time-varying power signals are shown in FIGS. 3A and 3B . FIG. 3A shows a signal 300 to be applied to the electromagnetic radiation source 102, and FIG. 3B shows a signal 310 to be supplied to the electromagnetic radiation source 106. Signal 300 is a time-varying voltage having a peak value 301 (peak value 301 having a peak voltage V L1 in a cycle time t 1 ). Signal 310 is a time-varying voltage having two peak values 311, 312 (each having a peak voltage V L2 in a cycle time t 2 ). Here, one peak value 301 overlaps with the peak value 311 in time.
图3C图标在根据信号300及310个别操作电磁辐射来源102及106时由高温计110所接收的示范的信号320。接收的信号320具有两个脉冲,第一脉冲321对应至重叠的峰值301及311,且第二脉冲322对应至峰值312。由来自同时由高温计110接收的电磁辐射来源102及106两者的反射的电磁辐射来产生第一脉冲321。3C illustrates an exemplary signal 320 received by the pyrometer 110 when the electromagnetic radiation sources 102 and 106 are operated according to the signals 300 and 310, respectively. The received signal 320 has two pulses, a first pulse 321 corresponding to the overlapping peaks 301 and 311, and a second pulse 322 corresponding to the peak 312. The first pulse 321 is generated by reflected electromagnetic radiation from both electromagnetic radiation sources 102 and 106 that are simultaneously received by the pyrometer 110.
再次参考图1,电磁辐射来源102及106以所有方位角度以个别的发射圆锥131及132朝向基板101发射电磁辐射。电磁辐射照射基板101且在不同波长时部分被吸收、部分被传送、及以对应反射圆锥以变化量部分被反射。以某范围的反射角度反射的电磁辐射继续朝向高温计110且可由高温计110检测。例如,针对清晰使用射线追踪方式,来自电磁辐射来源102及106以对应发射圆锥131及132发射的辐射L1及L2以入射角θ1及θ2个别入射于基板101处,且部分在基板101处反射。反射的辐射R1及R2继续在反射面积133朝向高温计110且由高温计110检测,如图1中所图示。由高温计110所采样的反射面积133含有由高温计110所见的方位所定义的来自每一发射圆锥131及132的基板101所反射的辐射的频带的一部分。在入射角θ1及θ2处于特定范围内时,由高温计110在高温计110所见的方位上检测反射的辐射。Referring again to FIG. 1 , electromagnetic radiation sources 102 and 106 emit electromagnetic radiation at all azimuth angles in respective emission cones 131 and 132 toward substrate 101. The electromagnetic radiation strikes substrate 101 and is partially absorbed, partially transmitted, and partially reflected by varying amounts in corresponding reflection cones at different wavelengths. Electromagnetic radiation reflected at a range of reflection angles continues toward pyrometer 110 and can be detected by pyrometer 110. For example, using a ray tracing approach for clarity, radiation L1 and L2 emitted from electromagnetic radiation sources 102 and 106 in respective emission cones 131 and 132 is incident at substrate 101 at angles of incidence θ1 and θ2 , respectively, and is partially reflected at substrate 101. Reflected radiation R1 and R2 continues toward and is detected by pyrometer 110 at reflection area 133, as illustrated in FIG. 1 . The reflection area 133 sampled by the pyrometer 110 contains a portion of the band of radiation reflected by the substrate 101 from each emission cone 131 and 132 defined by the azimuth seen by the pyrometer 110. The reflected radiation is detected by the pyrometer 110 at the azimuth seen by the pyrometer 110 when the angles of incidence θ1 and θ2 are within a particular range.
图4图示处理腔室400的示意横截面,并入图1的温度测量系统100。处理腔室400特征为封闭体402、设置于封闭体402中的基板支撑404、耦接至封闭体402的处理模块403、多个电磁辐射来源405(405-1、405-2、405-3、405-4、405-5、及405-6)、及耦接至多个来源405的信号产生器407(407-1、407-2、407-3、407-4、407-5、及407-6)、多个检测器406(406-1、406-2、406-3、406-4、406-5、及406-6)、及高温计408。4 illustrates a schematic cross-section of a processing chamber 400 incorporating the temperature measurement system 100 of FIG 1. The processing chamber 400 features an enclosure 402, a substrate support 404 disposed in the enclosure 402, a process module 403 coupled to the enclosure 402, a plurality of electromagnetic radiation sources 405 (405-1, 405-2, 405-3, 405-4, 405-5, and 405-6), and a signal generator 407 (407-1, 407-2, 407-3, 407-4, 407-5, and 407-6) coupled to the plurality of sources 405, a plurality of detectors 406 (406-1, 406-2, 406-3, 406-4, 406-5, and 406-6), and a pyrometer 408.
处理模块403包含一个或多个管道411(展示了两个)以用于将材料导入封闭体402。可使用管道411以用于引导气体或液体,且可为直线的,如图4中所展示,或曲折至任何需要的程度。在图4中展示两个管道411,但可使用任何数量。例如,处理模块403可包含喷淋头,可具有多个区或通路。处理模块403可穿过合适管道耦接至任何需要的输送设备,例如气体盒、蒸发器、安瓿等。The processing module 403 includes one or more conduits 411 (two are shown) for introducing materials into the enclosure 402. The conduits 411 can be used to guide gases or liquids, and can be straight, as shown in Figure 4, or tortuous to any desired degree. Two conduits 411 are shown in Figure 4, but any number can be used. For example, the processing module 403 can include a showerhead, which can have multiple zones or passages. The processing module 403 can be coupled to any desired delivery device, such as a gas box, vaporizer, ampoule, etc., through suitable conduits.
由嵌入基板支撑404中的加热灯具来加热基板支撑404。也可例如使用偏压元件将基板支撑404电气化以提供基板支撑404上的基板401的静电固定。旋转驱动(未展示)可耦接至基板支撑404以提供处理期间、处理周期之间或两者的旋转运动。在实施方式(其中基板401在处理期间旋转)中,可在选择的间隔探测基板401以监测基板401上不同位置的温度,使得可控制温度均匀性。The substrate support 404 is heated by heating lamps embedded in the substrate support 404. The substrate support 404 may also be electrified, for example using a biasing element, to provide electrostatic fixation of the substrate 401 on the substrate support 404. A rotation drive (not shown) may be coupled to the substrate support 404 to provide rotational motion during processing, between processing cycles, or both. In embodiments where the substrate 401 is rotated during processing, the substrate 401 may be probed at selected intervals to monitor the temperature of different locations on the substrate 401 so that temperature uniformity may be controlled.
每一信号产生器407-1至407-6耦接至个别的电磁辐射来源405。信号产生器407-1至407-6的每一者产生时变信号且应用所述时变信号至个别的电磁辐射来源405。电磁辐射来源405-1至405-6发射电磁辐射L1至L6朝向基板401。多个电磁辐射来源405-1至405-6可为用于提供热能至基板401的热来源。Each signal generator 407-1 to 407-6 is coupled to a respective electromagnetic radiation source 405. Each of the signal generators 407-1 to 407-6 generates a time-varying signal and applies the time-varying signal to a respective electromagnetic radiation source 405. The electromagnetic radiation sources 405-1 to 405-6 emit electromagnetic radiation L1 to L6 toward the substrate 401. The plurality of electromagnetic radiation sources 405-1 to 405-6 may be heat sources for providing thermal energy to the substrate 401.
每一检测器406-1至406-6设置相邻于个别的电磁辐射来源405-1至405-6,以检测在基板401处部分反射且由高温计408所接收的对应至电磁辐射L1至L6的电磁辐射L1a至L6a。将每一电磁辐射检测器406-1至406-6的一部分放置于至个别的电磁辐射来源405-1至405-6的发射元件的视线中。电磁辐射检测器406-1至406-6包含支持电路以个别采样率对辐射束L1a至L6a采样。Each detector 406-1 to 406-6 is disposed adjacent to a respective electromagnetic radiation source 405-1 to 405-6 to detect electromagnetic radiation L1a to L6a corresponding to electromagnetic radiation L1 to L6 that is partially reflected at substrate 401 and received by pyrometer 408. A portion of each electromagnetic radiation detector 406-1 to 406-6 is placed in a line of sight to a transmitting element of the respective electromagnetic radiation source 405-1 to 405-6. Electromagnetic radiation detectors 406-1 to 406-6 include support circuitry to sample radiation beams L1a to L6a at respective sampling rates .
处理腔室400可包含任何数量的来源405,每一来源405具有对应的信号产生器407及电磁辐射检测器406。The processing chamber 400 may include any number of sources 405 , each source 405 having a corresponding signal generator 407 and electromagnetic radiation detector 406 .
高温计408检测自基板401传播朝向高温计408的电磁辐射。由高温计408所检测的辐射包含自基板404所发射的辐射T1及反射的辐射R1至R6。The pyrometer 408 detects electromagnetic radiation propagating from the substrate 401 toward the pyrometer 408. The radiation detected by the pyrometer 408 includes radiation T1 emitted from the substrate 404 and reflected radiation R1 - R6 .
在操作中,处理腔室400以相似于上述相关于图1的方式估计基板401的温度。此处,处理腔室400包含六(6)个电磁辐射来源405-1至405-6及检测器406-1至406-6,但可使用任何数量的来源及检测器。在这样的实施方式中,高温计408自基板401反射的任何数量的电磁辐射来源及发射的电磁辐射T1返还辐射强度I_SP,如下:In operation, the processing chamber 400 estimates the temperature of the substrate 401 in a manner similar to that described above with respect to FIG. 1. Here, the processing chamber 400 includes six (6) electromagnetic radiation sources 405-1 through 405-6 and detectors 406-1 through 406-6, but any number of sources and detectors may be used. In such an embodiment, the pyrometer 408 returns a radiation intensity I_SP from any number of electromagnetic radiation sources and emitted electromagnetic radiation T1 reflected from the substrate 401 as follows:
基于反射率ρ的定义(可如上述连接图2A至3C来决定),等式6可重写成:Based on the definition of reflectivity ρ (which can be determined as described above in connection with FIGS. 2A to 3C ), Equation 6 can be rewritten as:
每一电磁辐射L1、L2、L3、…Ln具有与对应的电磁辐射L1a、L2a、L3a、…Lna(由电磁辐射检测器406采样)实质相同的强度。因此,等式7可重写成:Each electromagnetic radiation L1 , L2 , L3 , ... Ln has substantially the same intensity as the corresponding electromagnetic radiation L1a , L2a , L3a , ... Lna (sampled by the electromagnetic radiation detector 406). Therefore, Equation 7 can be rewritten as:
接着,基于决定的反射率ρ及由检测器406所检测的入射电磁辐射I_Lia,通过从高温计408返还的总辐射的强度I_SP减去反射的辐射的强度来计算发射的电磁辐射的强度I_T1。接着,通过应用普朗克定律至发射的电磁辐射T1的强度I_T1来估计基板401的温度,如相关联于图1所述。Next, based on the determined reflectivity ρ and the incident electromagnetic radiation I_L ia detected by the detector 406 , the intensity of the reflected radiation is subtracted from the intensity of the total radiation returned by the pyrometer 408 . The intensity I_T 1 of the emitted electromagnetic radiation is calculated. Next, the temperature of the substrate 401 is estimated by applying Planck's law to the intensity I_T 1 of the emitted electromagnetic radiation T 1 , as described in connection with FIG. 1 .
图4中展示电磁辐射来源、检测器、及高温计安装于基板401下方。然而,这些部件可设置于处理腔室400中任何便利位置处,例如基板401上方的位置。4 shows the electromagnetic radiation source, detector, and pyrometer mounted below the substrate 401. However, these components may be disposed at any convenient location in the processing chamber 400, such as above the substrate 401.
处理腔室400可为化学气相沉积(CVD)腔室,例如等离子体增强CVD腔室、高密度等离子体CVD腔室、低压CVD腔室、减压CVD腔室、或大气压力CVD腔室。在其他实施方式中,处理腔室400也可为PVD腔室、蚀刻腔室(热或等离子体)、外延腔室、退火腔室、或温度监测可能有用的任何其他处理腔室。处理腔室400的范例可包含CVD腔室例如商业上可由加利福尼亚州圣克拉拉的应用材料公司(Applied Materials Inc.,Santa Clara,California)取得的PECVD腔室、PRODUCERTM腔室、及PRECISION />腔室。The processing chamber 400 may be a chemical vapor deposition (CVD) chamber, such as a plasma enhanced CVD chamber, a high density plasma CVD chamber, a low pressure CVD chamber, a reduced pressure CVD chamber, or an atmospheric pressure CVD chamber. In other embodiments, the processing chamber 400 may also be a PVD chamber, an etch chamber (thermal or plasma), an epitaxy chamber, an annealing chamber, or any other processing chamber where temperature monitoring may be useful. Examples of the processing chamber 400 may include a CVD chamber such as the VIZO-1000 commercially available from Applied Materials Inc., Santa Clara, California. PECVD chamber, PRODUCER TM chamber, and PRECISION /> Chamber.
控制器420可实质相同于图1的控制器。控制器420可耦接至高温计408及其相关电路以监测高温计408所接收的数据并处理该数据以估计基板401的温度。Controller 420 may be substantially the same as the controller of FIG1 . Controller 420 may be coupled to pyrometer 408 and its associated circuitry to monitor data received by pyrometer 408 and process the data to estimate the temperature of substrate 401 .
在一个或多个实施方式中,处理腔室400可包含多个高温计408以检测基板401的多个位置处的温度。通过使用来自多个高温计408的温度指示,可检测基板401的温度非均匀性,且可改良基板401的温度均匀性。In one or more embodiments, the processing chamber 400 may include a plurality of pyrometers 408 to detect the temperature at multiple locations of the substrate 401. By using temperature indications from the plurality of pyrometers 408, temperature non-uniformity of the substrate 401 may be detected and temperature uniformity of the substrate 401 may be improved.
在其他实施方式中,多个基板可设置于基板支撑404上以在处理腔室400中同时处理,且可提供多个高温计使一个或多个高温计对应至每一基板。In other embodiments, multiple substrates may be disposed on the substrate support 404 for simultaneous processing in the processing chamber 400, and multiple pyrometers may be provided with one or more pyrometers corresponding to each substrate.
图5为根据本公开内容的各方面用于估计基板温度的示范方法的流程图500。FIG. 5 is a flow chart 500 of an exemplary method for estimating substrate temperature according to aspects of the present disclosure.
在操作502中,使用信号产生器以产生时变功率的脉冲信号至电磁辐射来源。信号产生器可产生具有不同周期性、脉冲形状(例如,正弦脉冲或三角形脉冲)、脉冲图案和/或振幅的多种波形。可使用多于一个电磁辐射来源,每一电磁辐射来源包含个别的信号产生器。In operation 502, a signal generator is used to generate a pulse signal of time-varying power to an electromagnetic radiation source. The signal generator can generate a variety of waveforms with different periodicities, pulse shapes (e.g., sinusoidal pulses or triangular pulses), pulse patterns, and/or amplitudes. More than one electromagnetic radiation source can be used, each electromagnetic radiation source including a separate signal generator.
在操作504中,电磁辐射来源根据来自信号产生器的信号发射电磁辐射朝向基板。在使用多个电磁辐射来源的情况中,每一来源根据来自对应的信号产生器的信号来发射。In operation 504, the electromagnetic radiation source emits electromagnetic radiation toward the substrate in accordance with the signal from the signal generator. Where multiple electromagnetic radiation sources are used, each source emits in accordance with a signal from a corresponding signal generator.
在操作506中,检测器检测电磁辐射,包含由电磁辐射来源所发射的辐射。在一个或多个实施方式中,每一检测器的探针头设置于至对应的电磁辐射来源的发射元件的视线中。发射的电磁辐射在所有角度处具有实质恒定的强度。在一个或多个实施方式中,检测器的探针头可对齐至电磁辐射来源的发射圆锥的圆锥表面。在使用多个电磁辐射来源的情况中,每一来源具有对应的检测器。In operation 506, the detector detects electromagnetic radiation, including radiation emitted by an electromagnetic radiation source. In one or more embodiments, the probe head of each detector is disposed in a line of sight to an emission element of a corresponding electromagnetic radiation source. The emitted electromagnetic radiation has a substantially constant intensity at all angles. In one or more embodiments, the probe head of the detector may be aligned to a conical surface of an emission cone of an electromagnetic radiation source. In the case of using multiple electromagnetic radiation sources, each source has a corresponding detector.
在操作508中,高温计检测自基板发射和/或反射的电磁辐射的强度。在高温计处所接收的电磁辐射包含自基板所发射的热电磁辐射,及自基板所反射的电磁辐射。In operation 508, the pyrometer detects the intensity of electromagnetic radiation emitted and/or reflected from the substrate. The electromagnetic radiation received at the pyrometer includes thermal electromagnetic radiation emitted from the substrate, and electromagnetic radiation reflected from the substrate.
在操作510中,控制器通过从高温计所接收的电磁辐射的总强度减去采样的电磁辐射强度的加总来决定发射的电磁辐射(图1中的T1)的强度,以获得发射的强度。控制器进一步通过应用普朗克定律至决定的发射的电磁辐射强度来估计基板的温度T,如上述。In operation 510, the controller determines the intensity of the emitted electromagnetic radiation ( T1 in FIG. 1) by subtracting the sum of the sampled electromagnetic radiation intensities from the total intensity of the electromagnetic radiation received by the pyrometer to obtain the emitted intensity. The controller further estimates the temperature T of the substrate by applying Planck's law to the determined emitted electromagnetic radiation intensity, as described above.
本公开内容的实施方式进一步相关于以下段落的任何一者或多者:Embodiments of the present disclosure may further relate to any one or more of the following paragraphs:
1.一种用于估计温度的设备,包括:多个电磁辐射来源,放置该多个电磁辐射来源以发射电磁辐射朝向反射平面;多个电磁辐射检测器,放置每一电磁辐射检测器以对由该多个电磁辐射来源的对应电磁辐射来源所发射的电磁辐射采样;高温计,放置该高温计以接收源自该多个电磁辐射来源且自该反射平面反射的电磁辐射;和处理器,该处理器经配置以基于由该高温计及由所述电磁辐射检测器所接收的电磁辐射来估计温度。1. An apparatus for estimating temperature, comprising: a plurality of electromagnetic radiation sources, the plurality of electromagnetic radiation sources being positioned to emit electromagnetic radiation toward a reflecting plane; a plurality of electromagnetic radiation detectors, each electromagnetic radiation detector being positioned to sample electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources; a pyrometer, the pyrometer being positioned to receive electromagnetic radiation originating from the plurality of electromagnetic radiation sources and reflected from the reflecting plane; and a processor, the processor being configured to estimate temperature based on electromagnetic radiation received by the pyrometer and by the electromagnetic radiation detector.
2.一种用于估计温度的设备,包括:多个电磁辐射来源,放置该多个电磁辐射来源以发射电磁辐射朝向反射平面,其中每一电磁辐射来源经配置以发射圆锥发射电磁辐射;多个电磁辐射检测器,放置每一电磁辐射检测器以对由该多个电磁辐射来源的对应电磁辐射来源所发射的电磁辐射采样;高温计,放置该高温计以接收源自该多个电磁辐射来源且自该反射平面反射的电磁辐射;和处理器,该处理器经配置以基于由该高温计及由所述电磁辐射检测器所接收的电磁辐射来估计温度。2. A device for estimating temperature, comprising: a plurality of electromagnetic radiation sources, the plurality of electromagnetic radiation sources are positioned to emit electromagnetic radiation toward a reflecting plane, wherein each electromagnetic radiation source is configured to emit a cone of electromagnetic radiation; a plurality of electromagnetic radiation detectors, each electromagnetic radiation detector is positioned to sample electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources; a pyrometer, the pyrometer is positioned to receive electromagnetic radiation originating from the plurality of electromagnetic radiation sources and reflected from the reflecting plane; and a processor, the processor is configured to estimate temperature based on electromagnetic radiation received by the pyrometer and by the electromagnetic radiation detector.
3.一种用于估计温度的方法,该方法包括以下步骤:由多个电磁辐射来源的每一者发射电磁辐射朝向一基板;由多个电磁辐射检测器的每一者对由该多个电磁辐射来源的对应电磁辐射来源所发射的电磁辐射采样;由高温计接收自该基板所反射的电磁辐射及由该基板所发射的电磁辐射;和使用处理器以基于该基板所发射的电磁辐射来估计该基板的温度。3. A method for estimating temperature, the method comprising the following steps: each of a plurality of electromagnetic radiation sources emits electromagnetic radiation toward a substrate; each of a plurality of electromagnetic radiation detectors samples the electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources; a pyrometer receives electromagnetic radiation reflected from the substrate and electromagnetic radiation emitted by the substrate; and using a processor to estimate the temperature of the substrate based on the electromagnetic radiation emitted by the substrate.
4.如段落1至3的任一者所述的设备或方法,其中每一电磁辐射检测器包含探针头,该探针头设置于至该对应电磁辐射来源的发射元件的视线中。4. An apparatus or method as described in any of paragraphs 1 to 3, wherein each electromagnetic radiation detector includes a probe head disposed in a line of sight to the emitting element of the corresponding electromagnetic radiation source.
5.如段落4所述的设备或方法,其中每一电磁辐射来源经配置以发射圆锥发射电磁辐射朝向该反射平面,且处于第一角度的该发射圆锥中的电磁辐射的一部分自该反射平面反射且接着由该高温计接收。5. An apparatus or method as described in paragraph 4, wherein each electromagnetic radiation source is configured to emit electromagnetic radiation in an emission cone toward the reflective plane, and a portion of the electromagnetic radiation in the emission cone at a first angle is reflected from the reflective plane and then received by the pyrometer.
6.如段落5所述的设备或方法,其中每一电磁辐射检测器的探针头被弯曲以对齐该发射圆锥的圆锥表面,且经配置以对处于第二角度的该发射圆锥中的电磁辐射采样。6. An apparatus or method as described in paragraph 5, wherein the probe head of each electromagnetic radiation detector is curved to align with the conical surface of the emission cone and is configured to sample electromagnetic radiation in the emission cone at a second angle.
7.如段落6所述的设备或方法,其中处于该第一角度的该发射圆锥中的电磁辐射的一个部分具有与处于该第二角度的该发射圆锥中的电磁辐射的另一部分实质相同的强度。7. An apparatus or method as described in paragraph 6, wherein a portion of the electromagnetic radiation in the emission cone at the first angle has substantially the same intensity as another portion of the electromagnetic radiation in the emission cone at the second angle.
8.如段落1至7的任一者所述的设备或方法,其中该处理器经配置以接收由该高温计所接收的电磁辐射的强度及由所述电磁辐射检测器所采样的电磁辐射的强度,由所述电磁辐射检测器所采样的电磁辐射的该强度来决定来自该反射平面的反射的辐射的强度,及从该高温计所接收的电磁辐射减去反射的辐射的该强度来估计该温度。8. An apparatus or method as described in any of paragraphs 1 to 7, wherein the processor is configured to receive the intensity of electromagnetic radiation received by the pyrometer and the intensity of electromagnetic radiation sampled by the electromagnetic radiation detector, determine the intensity of radiation reflected from the reflecting plane by the intensity of the electromagnetic radiation sampled by the electromagnetic radiation detector, and estimate the temperature by subtracting the intensity of the reflected radiation from the electromagnetic radiation received by the pyrometer.
9.如段落8所述的设备或方法,其中通过在该反射平面应用已知反射率至由所述电磁辐射检测器所采样的电磁辐射的该强度来决定来自该反射平面的反射的辐射的该强度。9. An apparatus or method as described in paragraph 8, wherein the intensity of reflected radiation from the reflective plane is determined by applying a known reflectivity at the reflective plane to the intensity of electromagnetic radiation sampled by the electromagnetic radiation detector.
10.如段落9所述的设备或方法,其中该反射率通过以下操作来决定:通过从由该电磁辐射检测器所采样的电磁辐射的最大强度减去由该电磁辐射检测器所采样的电磁辐射的最小强度来计算第一数量;通过从由该高温计所检测的电磁辐射的最大强度减去由该高温计所检测的电磁辐射的最小强度来计算第二数量;和计算该第一数量对该第二数量的比率。10. An apparatus or method as described in paragraph 9, wherein the reflectivity is determined by: calculating a first quantity by subtracting a minimum intensity of the electromagnetic radiation sampled by the electromagnetic radiation detector from a maximum intensity of the electromagnetic radiation sampled by the electromagnetic radiation detector; calculating a second quantity by subtracting a minimum intensity of the electromagnetic radiation detected by the pyrometer from a maximum intensity of the electromagnetic radiation detected by the pyrometer; and calculating a ratio of the first quantity to the second quantity.
11.如段落1至10的任一者所述的设备或方法,其中通过应用普朗克定律至由该高温计所接收的电磁辐射的强度与自该反射平面所反射的电磁辐射的强度之间的差异来估计该温度。11. An apparatus or method as described in any of paragraphs 1 to 10, wherein the temperature is estimated by applying Planck's law to the difference between the intensity of electromagnetic radiation received by the pyrometer and the intensity of electromagnetic radiation reflected from the reflecting plane.
12.如段落11所述的设备或方法,其中每一电磁辐射检测器包含探针头,该探针头设置于至该对应电磁辐射来源的发射元件的视线中。12. The apparatus or method of paragraph 11, wherein each electromagnetic radiation detector comprises a probe head disposed in a line of sight to the emitting element of the corresponding electromagnetic radiation source.
13.如段落12所述的设备或方法,其中每一电磁辐射来源以发射圆锥发射电磁辐射朝向该基板,且处于第一角度的该发射圆锥中的电磁辐射的一部分自该反射平面反射且接着由该高温计接收。13. An apparatus or method as described in paragraph 12, wherein each electromagnetic radiation source emits electromagnetic radiation in an emission cone toward the substrate, and a portion of the electromagnetic radiation in the emission cone at a first angle is reflected from the reflecting plane and then received by the pyrometer.
14.如段落13所述的设备或方法,其中每一电磁辐射检测器的探针头被弯曲以对齐该发射圆锥的圆锥表面,且经配置以对处于第二角度的该发射圆锥中的电磁辐射采样。14. An apparatus or method as described in paragraph 13, wherein the probe head of each electromagnetic radiation detector is curved to align with the conical surface of the emission cone and is configured to sample electromagnetic radiation in the emission cone at a second angle.
15.如段落14所述的设备或方法,其中处于该第一角度的该发射圆锥中的电磁辐射具有与处于该第二角度的该发射圆锥中的电磁辐射实质相同的强度。15. An apparatus or method as described in paragraph 14, wherein the electromagnetic radiation in the emission cone at the first angle has substantially the same intensity as the electromagnetic radiation in the emission cone at the second angle.
16.如段落15所述的设备或方法,进一步包括以下步骤:通过从该高温计所接收的电磁辐射减去自该基板所反射的电磁辐射来决定该基板所发射的电磁辐射。16. The apparatus or method of paragraph 15, further comprising the step of determining electromagnetic radiation emitted by the substrate by subtracting electromagnetic radiation reflected from the substrate from electromagnetic radiation received by the pyrometer.
17.如段落16所述的设备或方法,进一步包括以下步骤:通过将由每一电磁辐射来源所采样的电磁辐射的强度乘以该基板的已知反射率、加总结果、及从该高温计所接收的电磁辐射的强度减去该加总来计算该基板所发射的电磁辐射的强度。17. The apparatus or method of paragraph 16, further comprising the following step: calculating the intensity of the electromagnetic radiation emitted by the substrate by multiplying the intensity of the electromagnetic radiation sampled by each electromagnetic radiation source by the known reflectivity of the substrate, summing the results, and subtracting the sum from the intensity of the electromagnetic radiation received by the pyrometer.
18.如段落17所述的设备或方法,其中该基板的该反射率为反射的电磁辐射的强度对入射电磁辐射的强度的比率。18. The apparatus or method of paragraph 17, wherein the reflectivity of the substrate is the ratio of the intensity of reflected electromagnetic radiation to the intensity of incident electromagnetic radiation.
19.如段落17所述的设备或方法,其中通过将由电磁辐射来源所发射的电磁辐射的最大强度减掉最小强度除以由该电磁辐射来源所发射且自该反射平面所反射的电磁辐射的最大强度减掉最小强度来计算该基板的该反射率。19. An apparatus or method as described in paragraph 17, wherein the reflectivity of the substrate is calculated by dividing the maximum intensity minus the minimum intensity of the electromagnetic radiation emitted by the electromagnetic radiation source by the maximum intensity minus the minimum intensity of the electromagnetic radiation emitted by the electromagnetic radiation source and reflected from the reflecting plane.
20.如段落1至19的任一者所述的设备或方法,进一步包括以下步骤:通过应用普朗克定律至由该基板所发射的电磁辐射来估计该基板的温度。20. The apparatus or method of any of paragraphs 1 to 19, further comprising the step of estimating the temperature of the substrate by applying Planck's law to the electromagnetic radiation emitted by the substrate.
提供前述说明以致能任何本领域普通技术人员以实现此处所述的多种实施方式。对所述实施方式的多种修改对本领域普通技术人员而言为显而易见的,且此处所定义的通则可应用至其他实施方式。例如,可在所讨论的功能性及元件排列上进行改变,而不偏离本公开内容的范围。多种范例可省略、替代、或增加合适的多种程序或部件。相关于一些范例的所述特征也可在一些其他范例中组合。例如,使用此处提出的任何数量的方面可实作设备或可实现方法。此外,本公开内容的范围意图涵盖使用其他结构、功能性、或除了此处提出的本公开内容的多种方面或其他的结构及功能性来实现的该设备或方法。应理解可由权利要求的一个或多个要素来体现此处所公开的本公开内容的任何方面。The foregoing description is provided to enable any person of ordinary skill in the art to implement the various embodiments described herein. Various modifications to the embodiments described will be apparent to those of ordinary skill in the art, and the general principles defined herein may be applied to other embodiments. For example, changes may be made to the functionality and arrangement of components discussed without departing from the scope of the present disclosure. Various examples may omit, replace, or add suitable various procedures or components. The features associated with some examples may also be combined in some other examples. For example, a device may be implemented or a method may be implemented using any number of aspects proposed herein. In addition, the scope of the present disclosure is intended to cover the device or method implemented using other structures, functionality, or in addition to the various aspects of the present disclosure proposed herein or other structures and functionality. It should be understood that any aspect of the present disclosure disclosed herein may be embodied by one or more elements of the claims.
如此处所使用,用词“示范”意指“作为范例、例子、或图标”。不必将此处被描述为“示范”的任何方面诠释为较其他方面更佳或更具优势。As used herein, the word “exemplary” means “serving as an example, instance, or illustration.” Any aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects.
如此处所使用,用语“决定”拥有广泛的动作。例如,“决定”可包含计算、运算、处理、获得、调查、查找(例如,在表、数据库、或其他数据结构中查找)、探明等。“决定”也可包含接收(例如,接收信息)、访问(例如,访问存储器中的数据)等。“决定”也可包含解析、选择、抉择、建立等。As used herein, the term "determine" has a wide range of actions. For example, "determine" may include calculating, computing, processing, obtaining, investigating, searching (e.g., searching in a table, database, or other data structure), ascertaining, etc. "Determine" may also include receiving (e.g., receiving information), accessing (e.g., accessing data in a memory), etc. "Determine" may also include resolving, selecting, deciding, establishing, etc.
此处所公开的方法包含一个或多个操作或动作以用于实现所述方法。方法操作和/或动作可彼此互换,而不偏离权利要求或本公开内容的范围。换句话说,除非规定特定顺序的操作或动作,可修改特定操作和/或动作的顺序和/或使用,而不偏离权利要求的范围。The methods disclosed herein include one or more operations or actions for implementing the methods. Method operations and/or actions may be interchangeable with each other without departing from the scope of the claims or the disclosure. In other words, unless a specific order of operations or actions is specified, the order and/or use of specific operations and/or actions may be modified without departing from the scope of the claims.
以下权利要求不意图限制此处所展示的实施方式,而是合意于与权利要求的语言一致的全部范围。在权利要求内,参考单数的元件不意图意指“一个且仅有一个”(除非特别陈述),而是指“一个或多个”。除非特别陈述,用语“一些”参考为一个或多个。对本公开内容通篇所述的多种方面的元件的所有结构及功能性等效物(对本领域普通技术人员为已知或即将成为已知)明确地通过参考并入于此且意图由权利要求来拥有。此外,此处所公开的内容并非意图致力于公众,无论本公开内容是否在权利要求中明确地陈述。The following claims are not intended to limit the embodiments shown herein, but are intended to be consistent with the full scope of the language of the claims. Within the claims, reference to an element in the singular is not intended to mean "one and only one" (unless otherwise stated), but rather "one or more". Unless otherwise stated, the term "some" refers to one or more. All structural and functional equivalents of the elements of the various aspects described throughout this disclosure (known or to become known to those of ordinary skill in the art) are expressly incorporated herein by reference and are intended to be owned by the claims. In addition, the content disclosed herein is not intended to be committed to the public, regardless of whether the disclosure is explicitly stated in the claims.
前述涉及本公开内容的实施方式,可修改本公开内容的其他及进一步的实施方式而不偏离其基本范围,且该范围由随后的权利要求书所决定。While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be modified without departing from the basic scope thereof, and such scope is determined by the claims which follow.
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