CN112340432B - Processing system - Google Patents
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- CN112340432B CN112340432B CN202010783345.4A CN202010783345A CN112340432B CN 112340432 B CN112340432 B CN 112340432B CN 202010783345 A CN202010783345 A CN 202010783345A CN 112340432 B CN112340432 B CN 112340432B
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- 230000007246 mechanism Effects 0.000 claims abstract description 103
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 6
- 230000007480 spreading Effects 0.000 abstract description 7
- 239000003960 organic solvent Substances 0.000 description 28
- 239000004065 semiconductor Substances 0.000 description 17
- 230000005540 biological transmission Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/025—Arms extensible telescopic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
A processing system is provided, which can prevent the scattered object from spreading outside the processing device even if the object carried on the processing object is scattered from the processing object when the processing object is conveyed by a conveying robot. In the processing system, the hand moving mechanism moves the hand on which the processing object is placed between a first position where the hand is disposed inside the processing apparatus and a second position where the hand is disposed outside the processing apparatus. The receiving member for receiving the object dropped from the object to be processed is disposed at least below the object to be processed placed on the hand disposed at the second position. In the processing system, when the hand with the processing object placed thereon moves between the first position and the second position, the receiving member moving mechanism for moving a part of the receiving member in the reciprocating direction of the hand moves the part of the receiving member toward the inside of the processing device and arranges the part of the receiving member in the inside of the processing device.
Description
Technical Field
The present invention relates to a processing system including a processing apparatus that performs a predetermined process on a processing target such as a semiconductor wafer, and a transfer robot that transfers the processing target to the processing apparatus.
Background
Conventionally, an industrial robot for transporting a semiconductor wafer is known (for example, see patent document 1). The industrial robot described in patent document 1 includes a hand on which a semiconductor wafer is placed, an arm to which the hand is rotatably connected, and a main body to which the base end side of the arm is rotatably connected. The industrial robot is incorporated into a semiconductor manufacturing system and used to carry out a predetermined process of a semiconductor wafer from a processing apparatus and a predetermined process of the semiconductor wafer into the processing apparatus.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2017-119326
Disclosure of Invention
Technical problem to be solved by the invention
Among processing apparatuses incorporated in a semiconductor manufacturing system, there is a processing apparatus that processes a semiconductor wafer using a flammable organic solvent. In this case, an industrial robot incorporated into a semiconductor manufacturing system may create a situation in which it is necessary to carry a semiconductor wafer having an upper surface carrying a flammable organic solvent. When a semiconductor wafer having a flammable organic solvent carried on the upper surface thereof is carried by an industrial robot, various problems may occur if the flammable organic solvent carried on the upper surface of the semiconductor wafer is scattered from the semiconductor wafer and diffused outside the processing apparatus.
Therefore, an object of the present invention is to provide a processing system including a processing apparatus for performing a predetermined process on a processing target object and a transfer robot for transferring the processing target object to the processing apparatus, wherein when the transfer robot transfers the processing target object, even if an object carried on the processing target object is scattered from the processing target object, the scattered object can be prevented from spreading outside the processing apparatus.
Technical scheme for solving technical problem
In order to solve the above-described problems, a processing system according to the present invention includes a processing apparatus that performs a predetermined process on a processing object, and a transfer robot that performs at least one of carrying out the processing object from the processing apparatus and carrying in the processing object to the processing apparatus, wherein the processing apparatus is provided with an opening for carrying the processing object between an inside of the processing apparatus and an outside of the processing apparatus, the transfer robot includes a hand on which the processing object is placed, a hand moving mechanism that linearly moves the hand in a constant direction, a receiving member that is disposed at a position lower than the hand and receives an object dropped from the processing object, and a receiving member moving mechanism that moves at least a part of the receiving member in a reciprocating direction of the hand, the hand moving mechanism moves the hand between a first position and a second position, the hand that enters the processing apparatus through the opening is disposed inside the processing apparatus at the first position, the hand is disposed outside the processing apparatus at the second position, the receiving member is disposed at least below the object to be processed placed on the hand disposed at the second position, and the receiving member moving mechanism moves at least a part of the receiving member between a third position at which a part of the receiving member that enters the processing apparatus through the opening is disposed inside the processing apparatus and a fourth position at which the receiving member is disposed outside the processing apparatus and moves at least a part of the receiving member to the third position at least when the hand with the object to be processed placed thereon is moved between the first position and the second position.
In the processing system of the present invention, the receiving member, which is disposed below the hand and receives the object dropped from the processing object, is disposed at least below the processing object placed on the hand disposed at the second position (i.e., below the processing object disposed outside the processing apparatus). Therefore, in the present invention, even if the object placed on the object to be processed is dropped from the object to be processed when the transfer robot transfers the object to be processed placed on the hand outside the processing apparatus, the dropped object can be suppressed from spreading (scattering) by the receiving member.
In the present invention, the receiving member moving mechanism moves at least a part of the receiving member to a third position at which a part of the receiving member entering the processing apparatus through the opening is disposed inside the processing apparatus, at least when the hand on which the processing object is placed is moved between the first position and the second position. Therefore, in the present invention, even if the object placed on the object to be processed is dropped from the object to be processed when the transfer robot carries the object to be processed placed on the hand out of the processing apparatus or when the transfer robot carries the object to be processed placed on the hand into the processing apparatus, the spread of the dropped object can be suppressed by the receiving member.
As described above, in the present invention, even if the object carried on the processing object is spilled from the processing object when the transfer robot transfers the processing object outside the processing apparatus, and even if the object carried on the processing object is spilled from the processing object when the transfer robot carries the processing object out of the processing apparatus or when the transfer robot carries the processing object into the processing apparatus, the spreading of the spilled object can be suppressed by the receiving member. Therefore, in the present invention, even if an object carried on the object to be processed is dropped from the object to be processed when the transfer robot transfers the object to be processed, the dropped object can be suppressed from spreading outside the processing apparatus.
In the present invention, it is preferable that, when a moving direction in which the hand moves from the first position to the second position is defined as a first direction and a direction orthogonal to the reciprocating direction and the vertical direction of the hand is defined as a second direction, the transfer robot includes cover members that cover the hand placed at the second position from both sides in the vertical direction, both sides in the second direction, and the first direction side, and a bottom portion of the cover member is a receiving member. According to this configuration, even when a highly volatile object is carried on the object to be processed and the object carried on the object to be processed evaporates, the cover member covering the hand disposed at the second position from both sides in the vertical direction, both sides in the second direction, and the first direction can suppress the evaporation from spreading outside the processing apparatus.
In the present invention, it is preferable that the cover member includes a fixed cover and a movable cover movable relative to the fixed cover, and the receiving member moving mechanism moves the movable cover to the third position and places a part of the movable cover inside the processing apparatus at least when the hand on which the processing object is placed moves between the first position and the second position. According to this configuration, the movable lid can be moved even if the driving force of the receiving member moving mechanism is small as compared with the case where the receiving member moving mechanism moves the entire lid member. Therefore, the structure of the receiving member moving mechanism can be simplified, and the receiving member moving mechanism can be miniaturized.
In the present invention, it is preferable that the transfer robot includes a suction mechanism that sucks air from inside the cover member. According to this configuration, even when the highly volatile object is carried on the object to be processed and the object carried on the object to be processed evaporates inside the cover member, the evaporated object can be sucked and discharged to the predetermined position outside the cover member together with the air. Therefore, even if a highly volatile object is carried on the object to be processed, the evaporation material can be effectively suppressed from diffusing outside the processing apparatus. Further, according to this configuration, the dropping object scattered from the processing object onto the receiving member (i.e., the bottom of the lid member) can be sucked and discharged to a predetermined position outside the lid member together with the air. Therefore, even if an object carried on the object to be processed is scattered from the object to be processed, the scattering of the scattered object outside the processing apparatus can be effectively suppressed.
In the present invention, the cover member is formed of, for example, metal. In the present invention, the receiving member moving mechanism includes, for example, an air cylinder.
In the present invention, for example, the hand moving mechanism includes a multi-joint arm to which the hand is connected at a distal end side so as to be rotatable, and an arm driving mechanism which extends and retracts the multi-joint arm, the first position is a position of the hand when the multi-joint arm is extended to a predetermined position, and the second position is a position of the hand when the multi-joint arm is retracted to the predetermined position.
In addition, in the present invention, for example, a transfer robot includes: an arm support member that is connected to the base end side of the multi-joint arm so that the base end side of the multi-joint arm can rotate; a holder that holds the arm support member so that the arm support member can be raised and lowered; a lifting mechanism for lifting the arm support member relative to the holder; and a rotating mechanism which rotates the holder in the vertical direction as the axial direction of rotation, and rotates the holder when the hand is at the second position.
Effects of the invention
As described above, in the present invention, in the processing system including the processing apparatus that performs the predetermined processing on the processing target object and the transfer robot that performs the transfer of the processing target object to the processing apparatus, even if the object loaded on the processing target object is dropped from the processing target object when the transfer robot transfers the processing target object, the dropped object can be suppressed from spreading outside the processing apparatus.
Drawings
Fig. 1 is a plan view for explaining the structure of a processing system according to an embodiment of the present invention.
Fig. 2 is a side view for explaining the structure of the processing system shown in fig. 1.
Fig. 3 is a perspective view of the transfer robot shown in fig. 1.
Fig. 4 is a block diagram for explaining the configuration of the transfer robot shown in fig. 3.
Fig. 5 is a view showing the hand, the arm support member, the cover member, and the like from the direction E-E in fig. 2.
Fig. 6(a) and 6(B) are diagrams for explaining the operation of the transfer robot shown in fig. 3.
Description of the reference numerals
1 … processing system; 2 … wafer (semiconductor wafer, object to be processed); 3 … processing means; 3a … opening part; 4 … robot (transfer robot); 6 … hands; 6A … first position; 6B … second position; 7 … arm (multijoint arm, part of hand movement mechanism); 9 … arm support members; 10 … cage; 12 … arm drive mechanism (part of hand movement mechanism); 13 … lifting mechanism; 14 … rotating mechanism; 15 … a cover member; 15a … bottom (receiving part); 16 … fixing the cover; 17 … a movable lid; 17a … third position; 17B … fourth position; 18 … cover moving mechanism (receiving member moving mechanism); 19. 20 … suction mechanism; a 30 … cylinder; x … direction of hand reciprocation; a first direction X2 …; y … second direction.
Detailed Description
Embodiments of the present invention are described below with reference to the drawings.
(schematic configuration of processing System)
Fig. 1 is a plan view for explaining the structure of a processing system 1 according to an embodiment of the present invention. FIG. 2 is a side view for explaining the structure of the processing system 1 shown in FIG. 1
The processing system 1 of the present embodiment constitutes a part of a semiconductor manufacturing system for manufacturing semiconductors. The processing system 1 includes a processing apparatus 3 that performs a predetermined process on a semiconductor wafer 2 (hereinafter referred to as "wafer 2") as a processing object, and a transfer robot 4 (hereinafter referred to as "robot 4") that performs at least one of unloading the wafer 2 from the processing apparatus 3 and loading the wafer 2 into the processing apparatus 3. The wafer 2 is formed into a disk shape.
Various devices for processing the wafer 2 are disposed inside the processing apparatus 3. The processing apparatus 3 is provided with an opening 3a (see fig. 2) for conveying the wafer 2 between the inside of the processing apparatus 3 and the outside of the processing apparatus 3. That is, an opening 3a for carrying in and out the wafer 2 between the inside of the processing apparatus 3 and the outside of the processing apparatus 3 is formed in the housing of the processing apparatus 3. The opening 3a is formed in a horizontally elongated rectangular shape. In the present embodiment, a flammable organic solvent (chemical liquid) is used in at least one of the processing step of the wafer 2 in the processing apparatus 3 and the step preceding the processing step of the wafer 2 in the processing apparatus 3. Therefore, the flammable organic solvent is carried on at least one of the upper surface of the wafer 2 carried out of the processing apparatus 3 and the upper surface of the wafer 2 carried into the processing apparatus 3.
The robot 4 is a horizontal articulated robot. The robot 4 includes a hand 6 on which the wafer 2 is placed, an articulated arm 7 (hereinafter referred to as "arm 7") which is connected to the hand 6 at a distal end side so that the hand 6 can rotate, and a main body portion 8 which connects a proximal end side of the arm 7. Next, the structure of the robot 4 and the schematic operation of the robot 4 will be described.
(Structure and schematic operation of transfer robot)
Fig. 3 is a perspective view of the robot 4 shown in fig. 1. Fig. 4 is a block diagram for explaining the configuration of the robot 4 shown in fig. 3. Fig. 5 is a view showing the hand 6, the arm support member 9, the cover member 15, and the like from the direction E-E of fig. 2. Fig. 6(a) and 6(B) are diagrams for explaining the operation of the robot 4 shown in fig. 3.
As described above, the robot 4 includes the hand 6, the arm 7, and the body 8. The main body portion 8 includes an arm support member 9 that connects the base end side of the arm 7 so that the base end side of the arm 7 can rotate, a holder 10 that holds the arm support member 9 so that the arm support member 9 can be raised and lowered, and a base member 11 that constitutes the lower end portion of the robot 4. The robot 4 further includes an arm drive mechanism 12 for extending and contracting the arm 7, an elevating mechanism 13 for elevating and lowering the arm support member 9 relative to the holder 10, and a rotating mechanism 14 for rotating the holder 10 in an axial direction in which the holder rotates in the vertical direction relative to the base member 11.
The robot 4 includes a cover member 15 for covering the hand 6 and the arm 7. The lid member 15 includes a fixed lid 16 and a movable lid 17 that is movable relative to the fixed lid 16. The lid member 15 of the present embodiment is composed of a fixed lid 16 and a movable lid 17. The fixed cover 16 and the movable cover 17 are formed of metal. That is, the cover member 15 is formed of metal. The robot 4 further includes a cover moving mechanism 18 (see fig. 2) for moving the movable cover 17, and suction mechanisms 19 and 20 (see fig. 5) for sucking air from the inside of the cover member 15.
The arm 7 is constituted by a first arm portion 22 and a second arm portion 23. The base end side of the first arm portion 22 is rotatably connected to the main body portion 8. The base end side of the second arm portion 23 is rotatably connected to the tip end side of the first arm portion 22. The hand 6 is composed of a wafer mounting part 24 on which the wafer 2 is mounted and a hand base part 25 connected to the arm 7. The wafer mounting portion 24 is formed in a fork shape. The base end of the wafer mounting portion 24 is fixed to the tip end of the hand base portion 25. The base end side of the hand base portion 25 is rotatably connected to the tip end side of the second arm portion 23. The hand 6, the second arm 23, and the first arm 22 are arranged in this order from the upper side.
The arm support member 9 is formed in a hollow block shape. The base end side of the first arm portion 22 is rotatably connected to the upper surface of the arm support member 9. The holder 10 includes two column portions 26 disposed with the arm 7 interposed therebetween. The column portion 26 is formed in a columnar shape having a longitudinal direction in the vertical direction. The retainer 10 further includes a frame lower portion 27 to which the lower end portion of the pillar portion 26 is fixed and which constitutes the lower end portion of the retainer 10. The base member 11 is formed in a flat plate shape. The lower end portion of the holder 10 is rotatably connected to the upper surface of the base member 11.
The lifting mechanism 13 includes a motor, a power transmission mechanism for transmitting power of the motor to the arm support member 9, and a guide mechanism for guiding the arm support member 9 in the vertical direction. The power transmission mechanism includes, for example, a ball screw disposed inside the column portion 26. Alternatively, the power transmission mechanism includes a belt and a pulley disposed inside the column portion 26. The guide mechanism includes a guide rail disposed along the column portion 26 and a guide block engaged with the guide rail. The turning mechanism 14 includes a motor and a power transmission mechanism for transmitting power of the motor to the frame lower portion 27. The power transmission mechanism of the turning mechanism 14 includes, for example, a belt and a pulley disposed inside the frame lower portion 27.
The arm drive mechanism 12 includes a motor and a power transmission mechanism for transmitting power of the motor to the arm 7. The power transmission mechanism of the arm drive mechanism 12 includes a belt, a pulley, and the like disposed inside the arm 7. The arm drive mechanism 12 extends and contracts the arm 7 to linearly move the hand 6 in a state of being directed in a constant direction. Specifically, the arm drive mechanism 12 extends and contracts the arm 7 to linearly move the connecting portion of the hand 6 and the arm 7 in a state where the hand 6 is directed in a constant direction. For example, the arm drive mechanism 12 extends and contracts the arm 7 so that the hand 6 linearly moves in the left-right direction in fig. 1 with the tip of the hand 6 facing the left side in fig. 1.
The arm drive mechanism 12 extends and contracts the arm 7 to move the hand 6 between a first position 6A at which the hand 6 entering the processing apparatus 3 through the opening 3a of the processing apparatus 3 is disposed inside the processing apparatus 3 (see fig. 6B) and a second position 6B at which the hand 6 is disposed outside the processing apparatus 3 (see fig. 1 and 6A). In the present embodiment, the arm 7 and the arm driving mechanism 12 constitute a hand moving mechanism that linearly moves the hand 6 in a state of being directed in a constant direction, and the hand moving mechanism moves the hand 6 between the first position 6A and the second position 6B.
The first position 6A is a position of the hand 6 when the arm 7 is extended to a prescribed position. In the present embodiment, when the hand 6 is at the first position 6A, the hand over of the wafer 2 is performed between the hand 6 and the processing apparatus 3. The second position 6B is a position of the hand 6 when the arm 7 is retracted to a prescribed position. In the present embodiment, when the hand 6 is at the second position 6B, the turning radius of the robot 4 turned in the vertical direction as the axial direction of the turning by the turning mechanism 14 becomes minimum. When the hand 6 is in the second position 6B, the rotating mechanism 14 rotates the holder 10. That is, when the hand 6 is in the second position 6B, the turning mechanism 14 turns the robot 4.
In the following description, for convenience of explanation, the reciprocating direction of the hand 6 (X direction in fig. 1 and the like) is referred to as a front-rear direction, and the Y direction in fig. 1 and the like orthogonal to the front-rear direction and the up-down direction is referred to as a left-right direction. Further, of the front-back directions, the moving direction of the hand 6 moving from the second position 6B toward the first position 6A (the X1 direction in fig. 1 and the like) is defined as a "front" direction, and of the front-back directions, the moving direction of the hand 6 moving from the first position 6A toward the second position 6B (the X2 direction in fig. 1 and the like) is defined as a "rear" direction. In the present embodiment, the rear direction (X2 direction) is the first direction, and the left-right direction (Y direction) is the second direction.
The fixing cover 16 is formed in a substantially rectangular parallelepiped box shape with an open front surface. The fixed cover 16 is fixed to the upper surface of the arm support member 9. As described above, the fixing cover 16 is formed of metal. Specifically, the fixed cover 16 is formed of a stainless steel plate. The fixed cover 16 is constituted by a bottom plate 16a constituting a bottom surface of the fixed cover 16, a top plate 16b constituting an upper surface of the fixed cover 16, two side plates 16c constituting left and right side surfaces of the fixed cover 16, and a rear plate 16d constituting a rear surface of the fixed cover 16. The bottom plate 16a and the top plate 16b are formed in a flat plate shape perpendicular to the vertical direction, and the side plate 16c is formed in a flat plate shape perpendicular to the horizontal direction.
The movable lid 17 is formed in a substantially rectangular parallelepiped box shape with a part of the front surface and the rear surface opened. As described above, the movable cover 17 is formed of metal. Specifically, the movable lid 17 is formed of a stainless steel plate. The movable lid 17 includes a bottom plate 17a constituting a bottom surface of the movable lid 17, a flat top plate 17b constituting an upper surface of the movable lid 17, and two flat side plates 17c constituting right and left side surfaces of the movable lid 17. The top plate 17b is formed in a flat plate shape perpendicular to the vertical direction, and the side plate 17c is formed in a flat plate shape perpendicular to the horizontal direction.
The bottom plate 17a includes bottom plate portions 17d and 17e constituting a distal end side portion of the bottom plate 17a, and a bottom plate portion 17f which is a portion of the bottom plate 17a other than the bottom plate portions 17d and 17 e. The bottom plates 17d to 17f are formed in a flat plate shape orthogonal to the vertical direction. The bottom plate 17d is disposed further forward than the bottom plate 17 e. The bottom plate 17e is disposed above the bottom plate 17f, and the bottom plate 17d is disposed above the bottom plate 17 e. The bottom plate 17f is disposed above the bottom plate 16 a.
The bottom plate 17a includes a step portion 17g connecting the rear end of the bottom plate portion 17d and the front end of the bottom plate portion 17e, and a step portion 17h connecting the rear end of the bottom plate portion 17e and the front end of the bottom plate portion 17 f. The bottom plate 17a of the present embodiment is composed of bottom plate portions 17d to 17f and step portions 17g and 17 h. The step portions 17g and 17h are formed in a flat plate shape orthogonal to the front-rear direction, and the bottom plate 17a is formed in a step shape. A space between the bottom plate 17d and the top plate 17b is opened on the front surface of the movable lid 17.
A rear end side portion of the movable cover 17 is accommodated in the fixed cover 16. The movable lid 17 is disposed at a front end of the fixed lid 16 in a portion where the bottom plate portions 17d and 17e are formed. The movable cover 17 is movable in the front-rear direction with respect to the fixed cover 16. Further, the movable cover 17 is disposed on the upper surface side of the arm support member 9 so as to be movable in the front-rear direction with respect to the arm support member 9.
The bottom plate 17d is disposed below the hand 6. That is, the bottom plates 16a and 17a are disposed below the hand 6. In the present embodiment, the bottom plate 16a and the bottom plate 17a constitute the bottom part 15a of the cover member 15. Further, the bottom portion 15a of the present embodiment is a receiving member arranged below the hand 6 and configured to receive an object dropped from the wafer 2. In the following description, the portion of the movable lid 17 where the bottom plate portion 17d is formed is referred to as a "distal end portion 17 j".
The hand 6 disposed at the second position 6B is disposed in the cover member 15. Bottom portions 15a (i.e., bottom plates 16a, 17a) are disposed below the hand 6 disposed at the second position 6B, and the entire hand 6 disposed at the second position 6B is covered from below by the bottom portion 15 a. The bottom portion 15a is disposed below the wafer 2 placed on the hand 6 disposed at the second position 6B, and the entire wafer 2 placed on the hand 6 disposed at the second position 6B is covered from below by the bottom portion 15 a.
The entire hand 6 disposed at the second position 6B is covered from above by the top plates 16B, 17B, from both sides in the left-right direction by the side plates 16c, 17c, and from behind by the rear plate 16 d. That is, the cover member 15 covers the hand 6 disposed at the second position 6B from both sides in the vertical direction, both sides in the horizontal direction, and the rear side. Specifically, the cover member 15 covers the entire hand 6 disposed at the second position 6B from both sides in the vertical direction, both sides in the horizontal direction, and the rear side. The cover member 15 covers the entire wafer 2 placed on the hand 6 disposed at the second position 6B from both sides in the vertical direction, both sides in the horizontal direction, and the rear side. The cover member 15 covers the entire arm 7 from both sides in the vertical direction, both sides in the horizontal direction, and the rear side.
The suction mechanisms 19, 20 are, for example, vacuum pumps. The suction mechanism 19 is connected to the cover member 15 via a pipe 32, and the suction mechanism 20 is connected to the cover member 15 via a pipe 33. The suction mechanism 19 functions to suck and discharge the organic solvent evaporated (volatilized) inside the cover member 15 to a predetermined position outside the cover member 15 together with air. An end of the pipe 32 is connected to an upper end portion of the cover member 15, for example.
The suction mechanism 20 functions to suck and discharge the liquid organic solvent scattered from the wafer 2 inside the lid member 15 to a predetermined position outside the lid member 15 together with air. An end of the pipe 33 is connected to the bottom portion 15a of the cover member 15, for example. Further, a drain pipe (groove) for guiding the liquid organic solvent scattered from the wafer 2 to the pipe 33 is formed on the upper surface of the bottom portion 15 a.
The cover moving mechanism 18 moves the movable cover 17 in the front-rear direction. That is, the cover moving mechanism 18 moves the movable cover 17 in the reciprocating direction of the hand 6. The cap moving mechanism 18 includes a cylinder 30 (see fig. 2) as a driving source. The air cylinder 30 is disposed inside the arm support member 9. Further, the main body of the cylinder 30 is fixed to the arm support member 9. The piston rod of the cylinder 30 is attached to the bottom plate 17a of the movable cover 17 via a predetermined member. The cover moving mechanism 18 of the present embodiment is a receiving member moving mechanism that moves a bottom plate 17a constituting a part of a bottom portion 15a as a receiving member in the front-rear direction.
The lid moving mechanism 18 moves the movable lid 17 between a third position 17A and a fourth position 17B, in which the third position 17A partially covers the tip portion 17j of the movable lid 17 and enters the inside of the processing apparatus 3 through the opening 3a (see fig. 2, 6a, and 6B), and in which the fourth position 17B partially covers the tip portion 17j of the movable lid 17 and is disposed outside the processing apparatus 3 (see fig. 1). That is, the lid moving mechanism 18 moves the movable lid 17 between a third position 17A where a part of the bottom portion 15a entering the processing apparatus 3 through the opening 3a is disposed inside the processing apparatus 3 and a fourth position 17B where the bottom portion 15a is disposed outside the processing apparatus 3.
Further, at least when the hand 6 with the wafer 2 placed thereon moves between the first position 6A and the second position 6B, the cover moving mechanism 18 moves the movable cover 17 to the third position 17A, and places a part of the tip portion 17j inside the processing apparatus 3. That is, at least when the hand 6 with the wafer 2 placed thereon moves between the first position 6A and the second position 6B, the cover moving mechanism 18 moves a part of the bottom portion 15a as the receiving member to the third position 17A.
In the present embodiment, the movable lid 17 is moved to the third position 17A and a part of the tip portion 17j is disposed inside the processing apparatus 3, regardless of whether the hand 6 in the state where the wafer 2 is placed is moved between the first position 6A and the second position 6B or the hand 6 in the state where the wafer 2 is not placed is moved between the first position 6A and the second position 6B. However, the movable lid 17 may be moved to the third position 17A and a part of the distal end portion 17j may be disposed inside the processing apparatus 3 only when the hand 6 with the wafer 2 placed thereon is moved between the first position 6A and the second position 6B. In this case, when the hand 6 in a state where the wafer 2 is not placed moves between the first position 6A and the second position 6B, the movable cover 17 is disposed at the fourth position 17B.
Further, even in a state where the movable cover 17 is disposed at the third position 17A, the rear end side portion of the movable cover 17 is accommodated in the fixed cover 16. In addition, regardless of whether the movable lid 17 is disposed at the third position 17A or the fourth position 17B, the entire hand 6 disposed at the second position 6B is covered with the lid member 15 from both sides in the vertical direction, both sides in the left-right direction, and the rear side. In the present embodiment, the rear end portion of the hand 6 disposed at the first position 6A is disposed inside the movable lid 17, and the movable lid 17 is disposed at the third position 17A (see fig. 6B).
For example, when the robot 4 carries the processed wafer 2 processed by the processing apparatus 3 out of the processing apparatus 3, the movable lid 17 disposed at the fourth position 17B is moved to the third position 17A (see fig. 6A), and then the hand 6 disposed at the second position 6B is moved to the first position 6A, and the wafer 2 is received from the processing apparatus 3 (see fig. 6B). Further, after the hand 6 that has received the wafer 2 is moved from the first position 6A to the second position 6B, the movable lid 17 disposed at the third position 17A is moved to the fourth position 17B.
Then, after the arm support member 9 is moved up and down or the holder 10 is rotated, the wafer 2 is carried into a processing apparatus for a subsequent process. In the processing apparatus for performing the subsequent process, an opening similar to the opening 3a is formed, and after the movable lid 17 disposed at the fourth position 17B is moved to the third position 17A, the hand 6 disposed at the second position 6B is moved to the first position 6A, and the wafer 2 is transferred to the processing apparatus for performing the subsequent process. Further, after the hand 6 to which the wafer 2 is transferred is moved from the first position 6A to the second position 6B, the movable cover 17 disposed at the third position 17A is moved to the fourth position 17B.
For example, when the robot 4 carries the wafer 2 before processing into the processing apparatus 3, the movable lid 17 disposed at the fourth position 17B is moved to the third position 17A, and then the hand 6 disposed at the second position 6B is moved to the first position 6A, and the wafer 2 is transferred to the processing apparatus 3. Further, after the hand 6 to which the wafer 2 is transferred is moved from the first position 6A to the second position 6B, the movable cover 17 disposed at the third position 17A is moved to the fourth position 17B.
In the processing apparatus that performs the previous process, an opening similar to the opening 3a is also formed, and after the movable lid 17 disposed at the fourth position 17B is moved to the third position 17A, the hand 6 disposed at the second position 6B is moved to the first position 6A, and the wafer 2 is received from the processing apparatus that performs the previous process. Further, after the hand 6 that has received the wafer 2 is moved from the first position 6A to the second position 6B, the movable lid 17 disposed at the third position 17A is moved to the fourth position 17B. Then, the wafer 2 is carried into the processing apparatus 3 after the arm support member 9 is moved up and down or the holder 10 is rotated.
(main effect of the present embodiment)
As described above, in the present embodiment, the bottom portion 15a, which is disposed lower than the hand 6 and receives the object dropped from the wafer 2, is disposed on the lower side of the wafer 2 placed on the hand 6 disposed at the second position 6B (i.e., on the lower side of the wafer 2 outside the processing apparatus 3). Therefore, in the present embodiment, even if the organic solvent carried on the wafer 2 is scattered from the wafer 2 when the robot 4 carries the wafer 2 carried on the hand 6 outside the processing apparatus 3, the scattered organic solvent can be suppressed from being diffused by the bottom portion 15 a.
In the present embodiment, when the hand 6 with the wafer 2 placed thereon is moved between the first position 6A and the second position 6B, the cover moving mechanism 18 moves a part of the distal end portion 17j of the movable cover 17 from the opening 3a into the processing apparatus 3 and arranges the movable cover inside the processing apparatus 3. That is, in the present embodiment, when the hand 6 with the wafer 2 placed thereon is moved between the first position 6A and the second position 6B, the cover moving mechanism 18 moves the tip portion of the bottom surface portion 17d from the opening 3a into the processing apparatus 3 and arranges the tip portion inside the processing apparatus 3. Therefore, in the present embodiment, even if the organic solvent carried on the wafer 2 spills from the wafer 2 when the robot 4 carries the wafer 2 carried on the hand 6 out of the processing apparatus 3 and when the robot 4 carries the wafer 2 carried on the hand 6 into the processing apparatus 3, the bottom portion 15a can suppress the scattering of the spilled organic solvent.
As described above, in the present embodiment, even if the organic solvent carried on the wafer 2 is scattered from the wafer 2 when the robot 4 carries the wafer 2 outside the processing apparatus 3, or even if the organic solvent carried on the wafer 2 is scattered from the wafer 2 when the robot 4 carries the wafer 2 out of the processing apparatus 3 or when the robot 4 carries the wafer 2 into the processing apparatus 3, the scattered organic solvent can be suppressed by the bottom portion 15 a. In the present embodiment, since the hand 6 disposed at the second position 6B is covered with the cover member 15 from both sides in the vertical direction, both sides in the horizontal direction, and the rear side, the cover member 15 can suppress the evaporated organic solvent from diffusing to the outside of the processing apparatus 3. Thus, in the present embodiment, when the robot 4 carries the wafer 2, the organic solvent can be suppressed from diffusing outside the processing apparatus 3.
In particular, in the present embodiment, the suction mechanism 20 functions to suck the liquid organic solvent scattered from the wafer 2 inside the cover member 15 and discharge the liquid organic solvent to a predetermined position outside the cover member 15, and therefore, the organic solvent scattered from the wafer 2 can be effectively suppressed from being diffused outside the processing apparatus 3. In addition, in the present embodiment, the suction mechanism 19 plays a role of sucking the organic solvent evaporated inside the cover member 15 and discharging it to a predetermined position outside the cover member 15, and therefore, the evaporated organic solvent can be effectively suppressed from diffusing outside the processing apparatus 3.
(other embodiments)
The above embodiment is an example of a preferred embodiment of the present invention, but is not limited thereto, and various modifications can be made without changing the gist of the present invention.
In the above embodiment, when the robot 4 carries the processed wafer 2 processed by the processing apparatus 3 out of the processing apparatus 3, the movable lid 17 may be moved from the fourth position 17B to the third position 17A while moving the hand 6 from the second position 6B to the first position 6A. Further, the movable lid 17 may be moved from the third position 17A to the fourth position 17B while moving the hand 6 from the first position 6A to the second position 6B. Even in this case, the bottom portion 15a is always disposed on the lower side of the wafer 2 placed on the hand 6 moving toward the second position 6B.
In the above embodiment, when the robot 4 carries the wafer 2 before processing into the processing apparatus 3, the hand 6 may be moved from the second position 6B to the first position 6A, and the movable lid 17 may be moved from the fourth position 17B to the third position 17A. Even in this case, the bottom portion 15a is always disposed on the lower side of the wafer 2 placed on the hand 6 moving toward the first position 6A. Further, the movable lid 17 may be moved from the third position 17A to the fourth position 17B while moving the hand 6 from the first position 6A to the second position 6B.
In the above embodiment, the fixed cover 16 and the movable cover 17 may also be integrated. In this case, the robot 4 includes a cover moving mechanism that moves the cover member 15 integrally formed by the fixed cover 16 and the movable cover 17 in the front-rear direction. That is, in this case, the robot 4 includes a cover moving mechanism as a receiving member moving mechanism, and the receiving member moving mechanism moves the entire bottom portion 15a as a receiving member in the front-rear direction. In this case, the cover moving mechanism may move the cover member 15 in the front-rear direction with respect to the arm support member 9, or may move the cover member 15 in the front-rear direction with respect to the holder 10 together with the arm support member 9.
However, in the case where the fixed lid 16 and the movable lid 17 are separately formed and the lid moving mechanism 18 moves only the movable lid 17 as in the above-described embodiment, the movable lid 17 can be moved even if the driving force of the lid moving mechanism 18 is small as compared with the case where the entire lid member 15 is moved. Thus, in the above embodiment, the structure of the cover moving mechanism 18 can be simplified, and the cover moving mechanism 18 can be miniaturized.
In the above embodiment, the robot 4 is provided with the suction mechanism 19 for discharging the organic solvent evaporated in the lid member 15 to a predetermined position outside the lid member 15 and the suction mechanism 20 for discharging the liquid organic solvent scattered from the wafer 2 in the lid member 15 to a predetermined position outside the lid member 15, respectively, but the robot 4 may be provided with a common suction mechanism for discharging the organic solvent evaporated in the lid member 15 and the liquid organic solvent scattered from the wafer 2 in the lid member 15 to a predetermined position outside the lid member 15.
In the above embodiment, the bottom portion 15a covers the entire hand 6 disposed at the second position 6B from below, but if the bottom portion 15a covers the entire wafer 2 placed on the hand 6 disposed at the second position 6B from below, the entire hand 6 disposed at the second position 6B may not be covered from below. In the above embodiment, the cap moving mechanism 18 may be provided with a drive source other than the cylinder 30. For example, the lid moving mechanism 18 may include a motor as a driving source.
In the above embodiment, the robot 4 may be provided with a hand moving mechanism that slides the hand 6 in the front-rear direction, instead of the arm 7 and the arm driving mechanism 12. In this case, the hand moving mechanism includes, for example, a motor, a ball screw, a guide rail, a guide block, and the like. Alternatively, the hand movement mechanism includes, for example, a motor, a belt, a pulley, a guide rail, a guide block, and the like.
In the above embodiment, an object other than the organic solvent may be placed on the upper surface of the wafer 2 carried out of the processing apparatus 3 or the upper surface of the wafer 2 carried into the processing apparatus 3. In the case where the object to be mounted on the upper surface of the wafer 2 is a nonvolatile object or a low-volatility object, the robot 4 may include, for example, a receiving member composed of the bottom plate 16a and the bottom plate 17a or a receiving member composed of the bottom plate 17a, instead of the cover member 15. When the robot 4 includes the receiving member formed of the bottom plate 17a, the receiving member is moved in the front-rear direction together with the hand 6 outside the processing apparatus 3 so that the receiving member is always disposed below the wafer 2 placed on the hand 6. In the above embodiment, the processing apparatus 3 may be used to process objects other than the wafer 2. For example, the glass substrate may be processed by the processing device 3.
Claims (8)
1. A processing system, characterized in that,
the disclosed device is provided with: a processing device that performs a predetermined process on a processing target object; and a transfer robot that performs at least one of carrying out the object to be processed from the processing apparatus and carrying in the object to be processed to the processing apparatus,
the processing apparatus is provided with an opening for conveying the processing object between the inside of the processing apparatus and the outside of the processing apparatus,
the transfer robot includes: a hand on which the treatment object is placed; a hand moving mechanism that linearly moves the hand in a state of being directed in a constant direction; a receiving member disposed below the hand and configured to receive an object dropped from the processing object; and a receiving member moving mechanism that moves at least a part of the receiving member in a reciprocating direction of the hand,
the hand moving mechanism moves the hand between a first position where the hand entering the treatment apparatus through the opening is disposed inside the treatment apparatus and a second position where the hand is disposed outside the treatment apparatus,
the receiving member is disposed at least below the object to be processed placed on the hand disposed at the second position,
the receiving member moving mechanism moves at least a part of the receiving member between a third position in which a part of the receiving member entering the processing apparatus through the opening is disposed inside the processing apparatus and a fourth position in which the receiving member is disposed outside the processing apparatus, and moves at least a part of the receiving member to the third position when the hand on which the processing object is placed is moved between the first position and the second position.
2. The processing system of claim 1,
when a moving direction in which the hand moves from the first position toward the second position is set as a first direction and a direction orthogonal to a reciprocating direction and a vertical direction of the hand is set as a second direction,
the transfer robot includes cover members that cover the hand placed at the second position from both sides in the vertical direction, both sides in the second direction, and the first direction side,
the bottom of the cover member is the receiving member.
3. The processing system of claim 2,
the cover member includes a fixed cover and a movable cover movable relative to the fixed cover,
the receiving member moving mechanism moves the movable cover to the third position and disposes a part of the movable cover inside the processing apparatus at least when the hand on which the processing object is placed moves between the first position and the second position.
4. The processing system according to claim 2 or 3,
the transfer robot includes a suction mechanism for sucking air from inside the cover member.
5. The processing system according to claim 2 or 3,
the cover member is formed of metal.
6. The processing system of claim 1,
the receiving member moving mechanism includes an air cylinder.
7. The processing system of claim 1,
the hand movement mechanism includes: a multi-joint arm connected to the hand at a leading end side in such a manner that the hand can rotate; and an arm driving mechanism that extends and retracts the multi-joint arm,
the first position is a position of the hand when the multi-jointed arm is extended to a prescribed position,
the second position is a position of the hand when the multi-jointed arm is retracted to a prescribed position.
8. The processing system of claim 7,
the transfer robot includes: an arm support member that is connected to a base end side of the multi-joint arm so that the base end side of the multi-joint arm can rotate; a holder that holds the arm support member so that the arm support member can be raised and lowered; a lifting mechanism that lifts and lowers the arm support member relative to the holder; and a rotating mechanism for rotating the holder in an axial direction in which the holder rotates in the vertical direction,
when the hand is in the second position, the rotating mechanism rotates the holder.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2019145018A JP7313229B2 (en) | 2019-08-07 | 2019-08-07 | processing system |
| JP2019-145018 | 2019-08-07 |
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| CN112340432A CN112340432A (en) | 2021-02-09 |
| CN112340432B true CN112340432B (en) | 2022-07-01 |
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| JP2958311B1 (en) * | 1998-08-28 | 1999-10-06 | アプライド マテリアルズ インコーポレイテッド | Wafer transfer robot |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2021027210A (en) | 2021-02-22 |
| CN112340432A (en) | 2021-02-09 |
| JP7313229B2 (en) | 2023-07-24 |
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