CN112340064A - Unidirectional thermal conduction space radiator device independent of external source driving - Google Patents
Unidirectional thermal conduction space radiator device independent of external source driving Download PDFInfo
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- CN112340064A CN112340064A CN202011208586.2A CN202011208586A CN112340064A CN 112340064 A CN112340064 A CN 112340064A CN 202011208586 A CN202011208586 A CN 202011208586A CN 112340064 A CN112340064 A CN 112340064A
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- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 57
- 235000014676 Phragmites communis Nutrition 0.000 claims abstract description 46
- 244000273256 Phragmites communis Species 0.000 claims abstract description 9
- 230000009471 action Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000005855 radiation Effects 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002918 waste heat Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/10—Artificial satellites; Systems of such satellites; Interplanetary vehicles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/503—Radiator panels
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- Engineering & Computer Science (AREA)
- Remote Sensing (AREA)
- Aviation & Aerospace Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Environmental Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Biodiversity & Conservation Biology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Astronomy & Astrophysics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a unidirectional thermal conduction space spoke cooler independent of external source drive, which comprises a radiator, a heat conducting plate, a plurality of shape memory alloy reeds and a return spring, wherein the radiator is arranged on the heat conducting plate, and the shape memory alloy reeds are arranged on the periphery of the bottom of the radiator in a mounting manner; the reset spring is arranged in the center of the bottom of the radiator, and two ends of the reset spring are respectively fixed with the center of the bottom of the radiator and the heat conducting plate; the shape memory alloy reed deforms according to the memory temperature, so that the radiator is separated from or contacted with the heat conducting plate. The radiator cooler provided by the invention has extremely low requirement on platform installation, has a wide application prospect, and can perfectly realize one-way thermal conduction.
Description
Technical Field
The invention relates to a heat management technology, a space mechanism design technology and a shape memory alloy application technology of a satellite payload system, in particular to a one-way thermal conduction space radiator which is not driven by an external source.
Background
The redundant heat generated by various devices inside the satellite flying in space is finally radiated into the deep space by radiation. With the progress of technology, the integration degree of various electronic devices inside the satellite is higher and higher, and the heat consumption of a single device is higher and higher, so the requirement on the thermal management capability of the satellite is higher and higher, and more radiation coolers (radiators) are installed and applied to the satellite at the present stage.
The radiator working in space environment radiates the heat inside the satellite to the universe when the radiator is not irradiated by the sunlight. When the solar energy satellite is irradiated by sunlight, the radiation capability of the solar energy satellite to the universe is greatly reduced, even the temperature of the radiator is obviously increased due to long-time irradiation, and the solar energy satellite does not radiate heat outwards and can reversely flow the heat irradiated by the sun into the satellite. Therefore, the radiator cooler with the unidirectional thermal conduction capability has great engineering significance. Because the heat is conducted in a single direction, the heat can only be transmitted from the inside of the satellite to the outside, and cannot be transmitted from the outside to the inside. Considering the physical characteristics of heat transmission, the unidirectional conduction of heat can be realized only by adopting a mechanism. That is, when the external temperature is lower than the internal temperature, the thermal path is communicated, and when the external temperature is higher than the internal temperature, the thermal path is cut off through the movement of the mechanism, so that the one-way conduction of the thermal path is realized macroscopically.
There are now few patents on the mechanism of the spatial radiator, the only patents that can be examined being space vehicles with deployable radiators; patent publication No.: CN1610628A describes a rotatable radiator on a satellite, which mainly functions to make the radiator avoid the direct sunlight by rotating, thereby increasing the radiation efficiency. The patent relates to a simple heat transfer device for single-machine heat dissipation of a spacecraft; patent publication No.: CN102079386A, a heat transfer device for stand-alone heat dissipation of a spacecraft; patent publication No.: CN102092483A describes a design of a non-movable radiator. The patent is based on a space heat pipe radiator of a loop heat pipe; patent publication No.: CN105523198A, a space heat pipe radiator; patent publication No.: CN109606745A describes a design method of the radiator itself. The patent relates to an expandable tower-shaped satellite antenna framework structure; patent publication No.: CN103441322A describes a spatial antenna deployment mechanism using a memory alloy design. A patent shape memory alloy actuator; patent publication No.: CN208763827U describes a driving mechanism for designing PCB board using memory alloy. A patent shape memory alloy displacement superposition driving mechanism; patent publication No.: CN 101666299A
Described is a displacement superposition motion mechanism designed using memory alloy wires. In summary, there is no single thermally conductive space radiator or the like that does not rely on external source drive.
Disclosure of Invention
To the problem that exists among the prior art, provide a non-traditional drive motor drive, need not satellite platform supplied energy and control signal, can be according to radials cold ware self state, independently driven, have the space radials cold ware of thermal one-way conduction. The radiator has extremely low requirement on satellite installation of the satellite platform and can be randomly installed at a place where the satellite platform needs.
The technical scheme adopted by the invention is as follows: a unidirectional heat conduction space spoke cooler not depending on external source drive comprises a radiator, a heat conducting plate, a plurality of shape memory alloy reeds and a return spring, wherein the radiator is arranged on the heat conducting plate, and the shape memory alloy reeds are arranged on the periphery of the bottom of the radiator in a mounting manner; the reset spring is arranged in the center of the bottom of the radiator, and two ends of the reset spring are respectively fixed with the center of the bottom of the radiator and the heat conducting plate; the shape memory alloy reed deforms according to the memory temperature, so that the radiator is separated from or contacted with the heat conducting plate.
Further, when the temperature of the shape memory alloy reed is increased to the memory temperature, the shape memory alloy reed is deformed from a plane shape to an arch shape; when the temperature of the shape memory alloy reed is lower than the memory temperature, the shape memory alloy reed is restored to the plane shape from the arch shape.
Further, the specific working process of the space radiator is as follows:
when the radiant cooler is in direct sunlight, the temperature of the radiator rises to cause the temperature of the shape memory alloy reed to rise synchronously, when the temperature rises to the memory temperature, the shape memory alloy reed is deformed into an arch shape from a plane shape, and the radiator is pushed away from the heat conducting plate to separate the radiator and the heat conducting plate;
when the radiator is in a shadow environment, the temperature of the radiator is reduced, the temperature of the shape memory alloy reed is synchronously reduced, when the temperature is lower than the memory temperature, the shape memory alloy reed is arched and deformed into a plane shape, and the radiator restores to be in contact with the heat conducting plate under the action of the return spring.
Furthermore, a plurality of grooves are formed in the bottom of the radiator and used for mounting the shape memory alloy reeds.
Further, the height of the shape memory alloy reed in the arched state is more than or equal to 0.4mm than that in the planar state.
Further, the heat radiator is a concentric circular heat radiator.
Further, the shape memory alloy reed memory temperature is 70 ℃.
Compared with the prior art, the beneficial effects of adopting the technical scheme are as follows:
drawings
Fig. 1 is an external view of the space radiator of the present invention.
Fig. 2 is an exploded view of the space radiator of the present invention.
Fig. 3 is a schematic view illustrating an operating state of the space radiator of the present invention.
Fig. 4 is a schematic diagram of the open circuit working state of the space radiator of the present invention.
Reference numerals: 1-radiator, 2-heat conducting plate, 3-shape memory alloy reed, 4-reset spring.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
The technical problem to be solved by the invention is as follows: the space radiator with one-way heat conduction has the function of one-way heat conduction, namely heat can be transmitted outwards from the inside of a satellite platform and radiated to the universe. The space radiator conducting in the single direction does not depend on a traditional motor driving mechanism, does not need a satellite platform to supply energy and control signals, and can automatically judge and move according to the internal and external environments of the radiator. The specific scheme is as follows:
as shown in fig. 1 and 2, a unidirectional thermal conduction space radiator which is not driven by an external source comprises a radiator, a heat conducting plate, a plurality of shape memory alloy reeds and a return spring, wherein the radiator is arranged on the heat conducting plate, and the shape memory alloy reeds are arranged on the periphery of the bottom of the radiator in a mounting manner; the reset spring is arranged in the center of the bottom of the radiator, and two ends of the reset spring are respectively fixed with the center of the bottom of the radiator and the heat conducting plate; the shape memory alloy reed deforms according to the memory temperature, so that the radiator is separated from or contacted with the heat conducting plate.
In a preferred embodiment, when the temperature of the shape memory alloy reed is increased to the memory temperature, the shape memory alloy reed is deformed from a plane shape to an arch shape; when the temperature of the shape memory alloy reed is lower than the memory temperature, the shape memory alloy reed is restored to the plane shape from the arch shape.
The working process of the radiator cooler is as follows:
when the radiator is not directly irradiated by sunlight in the space, or the external environment such as the short-time irradiation or oblique irradiation of the sunlight is favorable for heat dissipation, the radiator is in a thermal conduction working state, as shown in fig. 2. The radiator (1) is tightly pulled and attached to the heat conducting plate (2) under the action of the internal return spring (4). Because the thermal environment of the external space is better, the shape memory alloy reed (3) on the radiator is in the initial position and does not deform. The whole radiator is thermally conductive, and heat (Q) is radiated to the universe from the heat conducting plate through the radiator.
When the radiant cooler is in direct sunlight, the temperature of the radiator rises to cause the temperature of the shape memory alloy reed to rise synchronously, when the temperature rises to the memory temperature, the shape memory alloy reed is deformed into an arch shape from a plane shape, and the radiator is pushed away from the heat conducting plate to separate the radiator and the heat conducting plate; specifically, the method comprises the following steps:
when the radiator is under direct sunlight irradiation in the space, or external environments such as long-term sunlight irradiation are unfavorable for heat dissipation, the temperature of the radiator is continuously increased, and if measures are not taken, heat outside the space flows backwards into the satellite platform, so that electronic equipment of the platform is greatly damaged. Therefore, the heat path of the radiator needs to be cut off in this case, and the external heat flow is not "reversed".
The radiator "open circuit" state is schematically shown in fig. 3. The temperature of the radiator (1) is increased rapidly due to the direct solar radiation, and the temperature of the shape memory alloy reed (3) attached to the radiator is increased synchronously. When the temperature of the shape memory alloy reed (3) rises to the memory temperature, the reed returns to the memory shape to form an arch state, and the radiator (1) is pushed away to be separated from the heat conducting plate (2) without contact. Thus, the heat path of the radiator is cut off, and the external heat flow cannot flow backwards into the platform. The waste heat Q inside the satellite is conducted to other radiating surfaces through a heat pipe arranged on the heat conducting plate (2) for radiating.
When the radiant cooler is in a back-shadow environment, the temperature of the radiator is reduced, the temperature of the shape memory alloy reed is synchronously reduced, when the temperature is lower than the memory temperature, the shape memory alloy reed is arched and deformed into a plane shape, and the radiator is restored to be in contact with the heat conducting plate under the action of the return spring; specifically, the method comprises the following steps:
when the position of the radiant cooler is restored to a shady environment from direct solar radiation, the temperature of the radiator (1) is reduced, the temperature of the shape memory alloy reed (3) is reduced, when the temperature is lower than the memory temperature, the shape memory alloy reed (3) is restored to a plane from an arch shape, the radiator is restored to be in contact with the heat conducting plate (2) under the action of the return spring (4), the whole radiant cooler is restored to the working state shown in figure 2, the heat paths of the radiant coolers are communicated, and waste heat Q in the platform is continuously radiated to the universe through the radiant cooler.
In a preferred embodiment, the bottom of the heat sink is provided with a plurality of grooves for mounting the shape memory alloy spring.
In a preferred embodiment, the height of the shape memory alloy spring plate in the arched state is greater than or equal to 0.4mm than that in the flat state.
In a preferred embodiment, the heat sink is a concentric circular heat sink.
In a preferred embodiment, the shape memory alloy reed memory temperature is 70 degrees celsius.
When the external thermal environment is good, the radiation cooler radiates the waste heat Q in the platform to the universe, and when the external thermal environment is severe, the radiation cooler cuts off the self thermal path, so that the heat in the universe cannot flow backwards into the platform. From the macroscopical, the radiator accomplishes the function of one-way thermal conduction. And the radiator has extremely low requirements on platform installation, and has wide application prospect.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed. Those skilled in the art to which the invention pertains will appreciate that insubstantial changes or modifications can be made without departing from the spirit of the invention as defined by the appended claims.
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
Claims (7)
1. A space spoke cooler which is not driven by an external source and is conducted in a unidirectional way is characterized by comprising a radiator, a heat conducting plate, a plurality of shape memory alloy reeds and a return spring, wherein the radiator is arranged on the heat conducting plate, and the shape memory alloy reeds are arranged on the periphery of the bottom of the radiator in a mounting way; the reset spring is arranged in the center of the bottom of the radiator, and two ends of the reset spring are respectively fixed with the center of the bottom of the radiator and the heat conducting plate; the shape memory alloy reed deforms according to the memory temperature, so that the radiator is separated from or contacted with the heat conducting plate.
2. A thermally conducted space radiator according to claim 1, wherein the shape memory alloy spring is deformed from a flat shape to an arched shape when the temperature of the shape memory alloy spring is raised to a memory temperature; when the temperature of the shape memory alloy reed is lower than the memory temperature, the shape memory alloy reed is restored to the plane shape from the arch shape.
3. The space radiator driven by no external source and conducting unidirectionally heat according to claim 2, wherein the space radiator specifically works in the following way:
when the radiant cooler is in direct sunlight, the temperature of the radiator rises to cause the temperature of the shape memory alloy reed to rise synchronously, when the temperature rises to the memory temperature, the shape memory alloy reed is deformed into an arch shape from a plane shape, and the radiator is pushed away from the heat conducting plate to separate the radiator and the heat conducting plate;
when the radiator is in a shadow environment, the temperature of the radiator is reduced, the temperature of the shape memory alloy reed is synchronously reduced, when the temperature is lower than the memory temperature, the shape memory alloy reed is arched and deformed into a plane shape, and the radiator restores to be in contact with the heat conducting plate under the action of the return spring.
4. A thermally conducted space radiator according to claim 1, wherein the bottom of the radiator is formed with a plurality of grooves for receiving the shape memory alloy spring.
5. A one-way thermally conductive space radiator according to claim 1, wherein the height of said shape memory alloy spring plate in the arched state is 0.4mm or more than that in the flat state.
6. A thermally unidirectional space radiator that does not rely on an external source for driving as recited in claim 1 wherein said heat sink is a concentric circular heat sink.
7. The thermally unidirectional space radiator of claim 3, wherein said shape memory alloy reed has a memory temperature of 70 degrees Celsius.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011208586.2A CN112340064A (en) | 2020-11-03 | 2020-11-03 | Unidirectional thermal conduction space radiator device independent of external source driving |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011208586.2A CN112340064A (en) | 2020-11-03 | 2020-11-03 | Unidirectional thermal conduction space radiator device independent of external source driving |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999004429A1 (en) * | 1997-07-17 | 1999-01-28 | Ford Motor Company | Shape memory alloy heat sink |
| US20080257525A1 (en) * | 2007-04-20 | 2008-10-23 | Japan Aerospace Exploration Agency | Thermal control apparatus |
| CN102439674A (en) * | 2009-05-20 | 2012-05-02 | 通用汽车环球科技运作有限责任公司 | Active material circuit protector |
| CN103261786A (en) * | 2010-12-15 | 2013-08-21 | 皇家飞利浦电子股份有限公司 | An illumination apparatus and a method of assembling the illumination apparatus |
| CN104246407A (en) * | 2012-01-13 | 2014-12-24 | 阿斯特里姆有限公司 | Cooling device suitable for regulating temperature of heat source of satellite, and method for producing associated cooling device and satellite |
| CN108323111A (en) * | 2018-02-09 | 2018-07-24 | 苏州天脉导热科技股份有限公司 | Unidirectional heat radiation module |
| CN109696271A (en) * | 2017-10-23 | 2019-04-30 | 南京开天眼无人机科技有限公司 | A kind of pressure sensor equipped with memorial alloy |
| CN209399835U (en) * | 2018-12-25 | 2019-09-17 | 中国科学院理化技术研究所 | Thermal switch |
| US20190315500A1 (en) * | 2018-04-17 | 2019-10-17 | Raytheon Company | Thermally-enhanced and deployable structures |
| CN111326999A (en) * | 2020-04-08 | 2020-06-23 | 昆山圣星通讯器材有限公司 | High temperature resistant prevents freezing formula MPP pipe |
-
2020
- 2020-11-03 CN CN202011208586.2A patent/CN112340064A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999004429A1 (en) * | 1997-07-17 | 1999-01-28 | Ford Motor Company | Shape memory alloy heat sink |
| US20080257525A1 (en) * | 2007-04-20 | 2008-10-23 | Japan Aerospace Exploration Agency | Thermal control apparatus |
| CN102439674A (en) * | 2009-05-20 | 2012-05-02 | 通用汽车环球科技运作有限责任公司 | Active material circuit protector |
| CN103261786A (en) * | 2010-12-15 | 2013-08-21 | 皇家飞利浦电子股份有限公司 | An illumination apparatus and a method of assembling the illumination apparatus |
| CN104246407A (en) * | 2012-01-13 | 2014-12-24 | 阿斯特里姆有限公司 | Cooling device suitable for regulating temperature of heat source of satellite, and method for producing associated cooling device and satellite |
| CN109696271A (en) * | 2017-10-23 | 2019-04-30 | 南京开天眼无人机科技有限公司 | A kind of pressure sensor equipped with memorial alloy |
| CN108323111A (en) * | 2018-02-09 | 2018-07-24 | 苏州天脉导热科技股份有限公司 | Unidirectional heat radiation module |
| US20190315500A1 (en) * | 2018-04-17 | 2019-10-17 | Raytheon Company | Thermally-enhanced and deployable structures |
| CN209399835U (en) * | 2018-12-25 | 2019-09-17 | 中国科学院理化技术研究所 | Thermal switch |
| CN111326999A (en) * | 2020-04-08 | 2020-06-23 | 昆山圣星通讯器材有限公司 | High temperature resistant prevents freezing formula MPP pipe |
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