CN112312649A

CN112312649A - Hole stacking structure, heat dissipation structure and manufacturing method of printed circuit board

Info

Publication number: CN112312649A
Application number: CN201910708183.5A
Authority: CN
Inventors: 郑峰
Original assignee: ZTE Corp
Current assignee: ZTE Corp
Priority date: 2019-08-01
Filing date: 2019-08-01
Publication date: 2021-02-02
Also published as: WO2021017980A1

Abstract

A hole stacking structure of a printed circuit board, a heat dissipation structure and a manufacturing method are provided, wherein the hole stacking structure comprises a mechanical through hole and at least one laser through hole which are arranged on the printed circuit board, and the mechanical through hole and the laser through hole are arranged in a stacking mode and both comprise filled metal materials. The multiple stacked hole structures are distributed on the printed circuit board in an array form and can be used for radiating heat of a heating device. And filling a metal material in the mechanical hole when the mechanical via hole is manufactured, and filling the metal material in the laser hole when the laser via hole laminated with the mechanical via hole is manufactured. The problem that the processing degree of difficulty is big and manufacturing cost is high has been overcome to this application, can also increase the heat dissipation simultaneously, slow down the thermal shock, increases the through-current capacity of via hole.

Description

Hole stacking structure, heat dissipation structure and manufacturing method of printed circuit board

Technical Field

The present disclosure relates to printed circuit boards, and particularly to a stacked via structure, a heat dissipation structure and a method for manufacturing the same.

Background

With the explosive growth of data traffic, the release amount of each country in the 5G market is larger and larger, and the demand of optical modules is also larger and larger. The stability of the product of the optical module must be ensured to meet the communication of normal services. The optical module is limited by the packaging size, the single board wiring and layout density is high, and meanwhile, the telecom optical module needs to at least meet the service life of 15 years, and the requirement is very strict on the process manufacturing requirement.

In the process of laying out and wiring optical modules, the inventor finds that the prior art has at least the following problems: various power supply modules, a DSP (digital signal processor), a clock chip, a crystal oscillator, a driver and a capacitor need to be integrated in an optical module, a conventional fan-out punching mode is difficult to complete, holes are often required to be punched on a disc, a POFV (plate Over filed Via) process is adopted, and a risk point exists; secondly, along with the increase of the plate thickness, thermal shock is obvious, and flaws produced in the early stage easily cause the tearing of copper plating and alloy copper of a mechanical hole, so that a link is broken, normal transmission of signals is influenced, and the yield is greatly reduced.

In order to realize the layer change of the wiring, the current common mode is to use a combination mode of a mechanical hole and a laser via hole and stagger the mechanical hole and the laser via hole, so that the flatness of the bottom surface of the laser via hole can be ensured as much as possible, and the influence of thermal shock is reduced. However, since the pin pitch of the BGA (ball grid array) pad region of the optical module is small (about 0.5 mm) and the arrangement is compact, such offset punching may cause that the nearby pads may not be grounded nearby, which affects the return path of the signal, thereby deteriorating the electromagnetic environment. Meanwhile, the method also brings great trouble to the layout and wiring of the PCB (printed circuit board).

Along with the increasing functions and processing speed of products, the power consumption of integrated chips in the products is higher, the requirements of the internal chips on heat dissipation are higher and higher, and the heat dissipation needs to be matched with copper blocks embedded in a printed circuit board for heat dissipation. In the product demand of needing to bury the copper billet, this has increased the processing degree of difficulty of printed circuit board, increases the veneer cost, because former all is the key device in the 5G system, and the delivery volume is huge moreover for the product is very sensitive to the cost, and the cost of each part is reduced to various measures of urgent need.

Disclosure of Invention

The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

The embodiment of the invention provides a hole stacking structure of a printed circuit board, which comprises a mechanical through hole and at least one laser through hole, wherein the mechanical through hole and the laser through hole are arranged on the printed circuit board in a stacking mode and are electrically connected with each other, the mechanical through hole comprises a metal material filled in the mechanical hole, and the laser through hole comprises a metal material filled in the laser hole.

The embodiment of the invention also provides a heat dissipation structure of the printed circuit board, which comprises the stacked hole structure, wherein a plurality of stacked hole structures are distributed on the printed circuit board in an array form and are used for dissipating heat of a heating device.

The embodiment of the invention also provides a method for manufacturing the laminated hole of the printed circuit board, which comprises the following steps:

fabricating a mechanical via, comprising: machining a mechanical hole in a foundation plate, filling a metal material into the mechanical hole, and then performing surface treatment on the foundation plate;

making and mechanical via laminated laser via includes: and pressing an additional plate on the foundation plate, processing a penetrating laser hole at the position of the additional plate corresponding to the mechanical via hole, filling a metal material in the laser hole, and performing surface treatment on the additional plate.

The embodiment of the invention also provides a manufacturing method of the printed circuit board heat dissipation structure, which comprises the following steps: according to the hole stacking manufacturing method provided by the embodiment of the invention, the hole stacking structures are manufactured on the printed circuit board and used for radiating heat of the heating device.

Other aspects will be apparent upon reading and understanding the attached drawings and detailed description.

Drawings

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.

FIG. 1 is a schematic cross-sectional view of a stacked via structure with a laser via formed at one end of a mechanical via, in accordance with an embodiment of the present invention;

FIG. 2 is a schematic diagram of a method for fabricating a stacked via according to an embodiment of the present invention, in which a mechanical via is formed in a base plate;

FIG. 3 is a schematic diagram of a method for forming a via stack according to an embodiment of the present invention;

FIG. 4 is a schematic view illustrating a base plate and an additional plate being pressed together according to the method for fabricating a laminated hole of the present invention;

FIG. 5 is a schematic diagram of the method for forming stacked via holes in an additional plate according to an embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of a stacked via structure according to another embodiment of the present invention, with laser vias formed at both ends of the mechanical via;

FIG. 7 is a schematic cross-sectional view of a stacked via structure according to another embodiment of the present invention, with a dual-layer laser via formed at one end of the mechanical via;

FIG. 8 is a schematic cross-sectional view of a stacked via structure according to another embodiment of the present invention, with dual-layer laser vias formed at both ends of the mechanical via;

FIG. 9 is a schematic top view of a heat dissipation structure with a plurality of stacked hole structures arranged in an array according to another embodiment of the present invention;

FIG. 10 is a flow chart of a method for forming a hole stack of a printed circuit board according to an embodiment of the present invention;

FIG. 11 is a flow chart of a method for fabricating a heat sink structure of a printed circuit board according to an embodiment of the present invention;

reference numerals: 1-additional plate, 2-base plate, 3-mechanical hole, 4-laser via hole, 5-metal material, 6-metal layer on base plate surface, 7-additional plate surface metal layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.

The embodiment of the invention provides a stacked hole structure of a printed circuit board, or provides a printed circuit board comprising at least one stacked hole structure. The hole stacking structure comprises a mechanical via hole and at least one laser via hole which are arranged on the printed circuit board, the mechanical via hole and the laser via hole are stacked and electrically connected with each other, the mechanical via hole comprises a metal material filled in the mechanical hole, and the laser via hole comprises a metal material filled in the laser hole. The mechanical via hole is arranged on a foundation plate, each laser via hole is arranged on an additional plate, and each additional plate is pressed on the foundation plate or another additional plate. In one example, one end of the mechanical via is laminated with one or more of the laser vias; in yet another example, one or more of the laser vias are stacked on both ends of the mechanical via. In an example, the mechanical via includes a metal layer on an inner wall of the mechanical hole, and the metal material of the end of the mechanical via facing the laser via is in direct contact with the metal material of the end of the laser via facing the mechanical via.

The laser via hole and the mechanical hole can be ensured to be aligned by filling copper in the mechanical hole in the stacked hole structure, and when the stacked hole structure is used as a ground via hole, each ground via hole of a device can be ensured to be grounded through the own via hole, so that the backflow area is reduced.

The laminated mechanical holes and laser via holes in the hole-stacking structure are filled with metal materials, so that the through-current capacity of the via holes can be increased, the voltage drop of the via holes is reduced, and stable power supply voltage is provided for power chips.

The mechanical holes and the laser via holes in the hole stacking structure are stacked, so that the wiring space can be enlarged, the fan-out of the device is more convenient, and the yield of products is increased.

In the hole stacking structure of the embodiment, one mechanical hole can be stacked with a plurality of laser via holes on a plurality of additional plates, and the plurality of laser via holes stacked by the same mechanical via hole are in one-to-one correspondence and are electrically connected, so that the interconnection difficulty of any layer is reduced.

The embodiment of the invention also provides a heat dissipation structure of the printed circuit board, or provides the printed circuit board comprising the heat dissipation structure. The heat dissipation structure comprises a plurality of stacked hole structures according to any embodiment of the invention, and the stacked hole structures are distributed on the printed circuit board in an array form and used for dissipating heat of the heating device. The array shape is not restricted, and the array can be square or round and the like in special-shaped arrangement.

In an example, at least part of the stacked hole structures is located in the lower area of the heat generating device, at least part of pins of the heat generating device are electrically connected with the laser via holes in the corresponding stacked hole structures, and the part of pins comprise at least one of a ground pin and a power pin. The number of the stacked hole structures is determined according to pins of the device, and if the number of the pins of the device is large, a plurality of the stacked hole structures can be arranged. In order to increase the heat dissipation, the heat dissipation can be expanded properly, that is, besides the stacked hole structure is arranged in the lower area of the heat generating device, some stacked hole structures can also be arranged on the periphery of the lower area.

In one example, the distance between centers of two adjacent hole stacks in a plurality of hole stacks distributed in an array is 0.45mm to 1.27 mm. The diameter of the via hole can be set as desired.

The heat dissipation structure of the printed circuit board in the embodiment has the stacked hole structure distributed in an array, so that the heat dissipation of devices can be increased, and the process step of burying the copper block in the PCB by the traditional heat dissipation structure is saved.

The embodiment of the present invention further provides a method for manufacturing a hole stack of a printed circuit board, as shown in fig. 10, the method includes:

step 110, fabricating a mechanical via, comprising: machining a mechanical hole in a foundation plate, filling a metal material into the mechanical hole, and then performing surface treatment on the foundation plate;

step 120, fabricating a laser via stacked with the mechanical via, comprising: and pressing an additional plate on the foundation plate, processing a penetrating laser hole at the position of the additional plate corresponding to the mechanical via hole, filling a metal material in the laser hole, and performing surface treatment on the additional plate.

In one example, after the machining of the mechanical hole in the base plate and before the filling of the metal material into the mechanical hole, the method further includes: and manufacturing a metal layer on the inner wall of the mechanical hole.

In one example, the base plate is surface treated, comprising: carrying out grinding treatment on the metal layer on the surface of the base plate and the surface of the metal material filled in the mechanical hole; performing surface treatment on the additional plate, comprising: and carrying out grinding treatment on the metal layer on the surface of the additional plate and the surface of the metal material filled in the laser hole.

In one example, a layer of laser via is formed on each side of the mechanical via. Namely, the laser via holes which are laminated with the mechanical via holes are manufactured by respectively pressing two additional plates on two surfaces of the foundation plate and manufacturing the laser via holes which are laminated with the mechanical via holes on the two additional plates. In another example, a layer of laser vias is fabricated on one side of the mechanical vias. Namely, the laser via hole laminated with the mechanical via hole is manufactured by pressing an additional plate on one surface of the base plate and manufacturing the laser via hole laminated with the mechanical via hole on the additional plate.

In one example, more laser vias are stacked on top of the laser vias that are made. Specifically, after the laser via hole laminated with the mechanical via hole is manufactured on at least one additional board, the method further performs one or more of the following processes: and pressing a new additional plate and an additional plate which is already finished with the laser through hole, processing a through laser hole at the position of the new additional plate corresponding to the mechanical through hole, filling a metal material in the laser hole, and performing surface treatment on the new additional plate.

The manufacturing method of the hole stacking structure of the embodiment can reduce the manufacturing difficulty, improve the yield and reduce the manufacturing cost, and the manufactured hole stacking structure has the effect of the hole stacking structure of the embodiment of the invention.

The embodiment of the invention also provides a method for manufacturing the laminated hole of the printed circuit board heat dissipation structure, which comprises the following steps:

step 210, manufacturing a plurality of stacked hole structures according to any embodiment of the present invention on a printed circuit board according to the stacked hole manufacturing method according to any embodiment of the present invention, where the plurality of stacked hole structures are distributed in an array form on the printed circuit board for dissipating heat of a heat generating device.

In one example, the distance between centers of two adjacent hole stacks in a plurality of hole stacks distributed in an array is 0.45mm to 1.27 mm.

In this embodiment, the manufactured stacked hole structures are at least partially located in a lower region of the heat generating device, and after the manufacturing of the stacked hole structures, the method may further include:

and 220, electrically connecting at least partial pins of the heat generating device with the corresponding stacked hole structure, wherein the partial pins comprise at least one of a grounding pin and a power supply pin.

The manufacturing method of the heat dissipation structure of the embodiment saves the manufacturing process of embedding copper in the printed circuit board, can reduce the manufacturing difficulty, improve the yield and reduce the manufacturing cost. The manufactured array type stacked hole structure has good heat dissipation effect.

An exemplary embodiment of the present invention provides a stacked via structure of a printed circuit board. A laser via is stacked at one end of the mechanical via.

As shown in fig. 1, the stacked via structure includes a mechanical via 3 and a laser via 4 disposed on a printed circuit board, wherein the mechanical via 3 and the laser via 4 are stacked and electrically connected to each other, the mechanical via 3 includes a metal material 31 filled in a mechanical via 30, and the laser via 4 includes a metal material 41 filled in a laser via 40. In the example shown in fig. 1, the metal material 31 filled in the mechanical hole 30 and the metal material 41 filled in the laser hole 40 are both metal copper, but in other examples, the metal material filled in the mechanical hole and the metal material filled in the laser hole may be different.

Mechanical via hole 3 sets up on foundatin plate 2, and foundatin plate 2 can be the veneer that the pressfitting formed for the first time, and this veneer also can be the multiply wood. The laser via holes 4 are arranged on the additional plate 1, the additional plate 1 is pressed on the upper surface of the base plate 2, and the additional plate 1 can be a single-layer plate but is not limited to the single-layer plate. In the example shown in fig. 1, the mechanical via 3 further comprises a metal layer 32 on the inner wall of the mechanical hole 30. In another example, the mechanical vias 3 may also include pads at the inner and outer layers of the base board 2.

As shown, the upper surface of the metal material 31 filled in the mechanical via 30 and the lower surface of the metal material 41 filled in the laser via 40 are in contact, so that the end of the mechanical via 3 facing 4 is in direct contact with the end of the laser via 4 facing the mechanical via 3, ensuring electrical communication. In another example, the metal material 31 filled in the mechanical hole 30 and the metal material 41 filled in the laser hole 40 may also be used to electrically communicate the mechanical via 3 and the laser via 4 through the metal layer 21 (e.g., copper foil) on the upper surface of the base board 2. The upper surface of the additional plate 1 may also be provided with a metal layer 11. In the present example, the laser via 4 and the mechanical via 3 are through holes that penetrate the additional board 1 and the base board 2, respectively, but in another example, the mechanical via 3 may also be a blind hole.

An exemplary embodiment of the present invention provides a method for manufacturing a via stack of a printed circuit board, which can manufacture the via stack structure shown in fig. 1, and the method for manufacturing the via stack includes the following steps:

firstly, manufacturing a mechanical hole 30 on a foundation plate 2 formed by pressing;

as shown in fig. 2, a drill is used to make mechanical holes 30 for interconnecting any internal layers, and also for leading internal signals out to the surface layer of the base plate 2.

Removing impurities and burrs inside the mechanical hole 30 to ensure that the hole wall is smooth;

step three, manufacturing a metal layer 32 on the inner wall of the mechanical hole 30, then plating thick copper, and filling the mechanical via hole 3 with copper 31, as shown in fig. 3;

in this step, palladium metal may be used to form a metal layer 32 on the inner wall of the mechanical hole 30. When copper is filled, the metal slurry can be directly poured without electroplating.

Step four, the surface of the base plate 2 is ground to ensure the surface to be smooth, and if necessary, copper can be plated on the ground surface;

the step comprises the treatment of the upper surface and the lower surface of the base plate 2, and the mechanical via hole 3 is manufactured after the treatment is finished. Carry out the processing of grinding to foundatin plate 2 surface, can polish the up end of the copper 31 of the metal level 21 on foundatin plate 2 surface and the intussuseption of mechanical hole 3, be convenient for pressfitting and electricity are connected. The metal layer 21 on the surface of the base plate 2 may be a copper foil, for example.

Placing the additional plate 1 on the upper surface of the base plate 2, and performing secondary pressing, as shown in fig. 4;

and step six, performing laser drilling on the position, corresponding to the mechanical via hole 30, of the additional plate 1, wherein the drilled laser holes 41 correspond to the mechanical via holes 3 one by one, and filling metal materials 41 such as copper in the laser holes 40 to ensure good contact between the laser via holes 4 and the mechanical via holes 3.

Fig. 5 shows, but is not limited to, a tapered laser hole 4 with a large top and a small bottom.

And step seven, carrying out grinding treatment on the surface of the additional plate 1.

This step allows to grind down the metal layer 11 on the surface of the additional plate 1 and the metal material 41 filled in the laser holes 40, if necessary, to plate copper on the ground surface.

According to the steps, the stacked hole structure shown in fig. 1 can be manufactured, or a printed circuit board with the stacked hole structure shown in fig. 1 can be manufactured.

The manufacturing process of the embodiment effectively reduces the processing complexity of the printed circuit board, reduces the cost of the single board and improves the yield.

An exemplary embodiment of the present invention also provides a stacked via structure of a printed circuit board, compared to the embodiment shown in fig. 1. In this embodiment, a laser via is stacked at both ends of the mechanical via.

As shown in fig. 6, the mechanical via hole 3 is a through hole, an additional plate 1 is also pressed on the lower surface of the base plate 2, a laser via hole 4 is also formed on the additional plate 1 at a position corresponding to the mechanical via hole 3, and the laser via hole 4 also includes metal copper 41 filled in the laser via hole. Therefore, the upper and lower ends of each mechanical via hole 3 shown in fig. 6 are provided with a laser via hole 4, and the mechanical via hole and the metal material filled in the two laser via holes are communicated up and down to realize mutual electrical connection, thereby forming a three-layer stacked hole structure.

In the process of manufacturing the hole stacking structure, after the hole stacking structure shown in fig. 1 is manufactured, a new additional plate is pressed on the lower surface of the base plate, laser holes are processed on the positions of the new additional plate corresponding to the mechanical through holes, metal materials are filled in the laser holes, and then surface grinding treatment is carried out on the new additional plate. The process of making laser vias on the new add-on board may be the same as the process of making laser vias on the first add-on board.

An exemplary embodiment of the present invention also provides a stacked via structure of a printed circuit board, compared to the embodiment shown in fig. 1. The present embodiment stacks two laser vias at one end of the mechanical via.

As shown in fig. 7, the upper surface of the base plate 2 is provided with a plurality of layers of additional plates 1, laser via holes are formed in positions of the additional plates 1 corresponding to the mechanical via holes, and for each mechanical via hole, two laser via holes are stacked at one end of the mechanical via hole. A three-layer stacked pore structure is formed.

In the process of manufacturing the hole stacking structure, after the hole stacking structure shown in fig. 1 is manufactured, a new additional plate is pressed on the upper surface of the original additional plate, a laser hole is processed at a position of the new additional plate corresponding to the mechanical via hole (the axis of the laser hole is overlapped with the axis of the mechanical hole), a metal material is filled in the laser hole, and then surface grinding treatment is performed on the new additional plate. The process of making laser vias on the new add-on board may be the same as the process of making laser vias on the first add-on board.

An exemplary embodiment of the present invention also provides a stacked via structure of a printed circuit board, compared to the embodiment shown in fig. 1. The present embodiment has two laser vias stacked on both ends of the mechanical via.

As shown in fig. 8, the mechanical via hole 3 is a through hole, two layers of additional plates 1 are respectively press-fitted on the upper and lower surfaces of the base plate 2, a laser via hole is formed in a position of each additional plate 1 corresponding to the mechanical via hole, and two laser via holes are stacked at two ends of the mechanical via hole. A five-layer stacked pore structure is formed. .

In the process of manufacturing the stacked hole structure, after the three-layer stacked hole structure shown in fig. 7 is manufactured, two additional plates are sequentially pressed on the lower surface of the base plate, and a laser via hole is manufactured at a position of each additional plate corresponding to the mechanical via hole. Or after the three-layer hole-stacking structure shown in fig. 6 is manufactured, pressing one additional plate on the upper and lower surfaces of the base plate in sequence, and manufacturing laser via holes at positions of each additional plate corresponding to the mechanical via holes, thereby obtaining the five-layer hole-stacking structure shown in fig. 8.

An exemplary embodiment of the present invention further provides a heat dissipation structure of a printed circuit board, as shown in fig. 9, including a plurality of stacked via structures 200 fabricated on the printed circuit board 100, where the stacked via structures 200 may be the stacked via structures according to any of the above embodiments of the present invention, such as the stacked via structures of fig. 1, 6, 7, or 8. A plurality of the stacked hole structures 200 are distributed in an array for dissipating heat from the heat generating element. In the example shown in fig. 9, the 36 stacked hole structures are arranged in 6 rows and 6 columns, and are square as a whole, and the pitches in the longitudinal direction and the transverse direction are equal. In other examples, there may be other numbers of stacked hole configurations arranged in other shapes such as rectangular, diamond, circular, etc. The plurality of hole stacking structures 200 are at least partially located in the lower region of the heating element 300 mounted on the PCB, and at least part of pins of the heating element 300 are electrically connected with the laser via holes in the corresponding hole stacking structures. The partial pins include at least one of a ground pin and a power pin.

The embodiment adopts the heat dissipation structure with the internal dense mechanical through holes filled with copper, does not need to bury copper in the printed circuit board, can reduce the manufacturing difficulty, improves the yield and reduces the manufacturing cost. But also has good heat dissipation effect.

An exemplary embodiment of the present invention further provides a method for manufacturing a heat dissipation structure of a printed circuit board, which is used for manufacturing the heat dissipation structure shown in fig. 9, and the method for manufacturing the heat dissipation structure includes:

step one, manufacturing a mechanical hole 30 on the base plate 2 formed by pressing, as shown in fig. 2;

step four, repeating the operation from the step one to the step three, drilling high-density mechanical holes 30 in the area where the high-power-consumption device is located, and enabling the mechanical holes 30 to be distributed in an array manner, as shown in fig. 9;

one mechanical via may be fabricated after another mechanical via is fabricated. It is also possible to drill all the required mechanical holes first and then to make the metal layer and fill the metal material for these mechanical holes at the same time.

Step five, carrying out grinding treatment on the surface of the base plate 2 to ensure the surface to be flat, and plating copper on the ground surface if necessary;

sixthly, placing the additional plate 1 on the upper surface of the base plate 2, and performing secondary pressing, as shown in fig. 4;

step seven, performing laser drilling on the position, corresponding to the mechanical via hole 30, of the additional plate 1, wherein the drilled laser holes 41 correspond to the mechanical via holes 3 one by one, and filling copper into the drilled laser holes 4 to ensure good contact between the laser via holes 4 and the mechanical via holes 3;

likewise, one laser via may be fabricated after another laser via is fabricated. It is also possible to drill all the required laser holes first and then fill these laser holes with metal material at the same time.

And step eight, carrying out grinding treatment on the surface of the additional plate 1 to ensure the surface to be flat, and plating copper on the ground surface if necessary.

After the above steps are completed, the heat dissipation structure shown in fig. 9 can be manufactured. The heat dissipation structure includes a stacked hole structure as shown in fig. 1 distributed in an array. If other types of stacked hole structures such as the stacked hole structure shown in fig. 6, 7, or 8 are required, the stacked hole structure distributed in an array form may be manufactured by using the method for manufacturing the stacked hole structure shown in fig. 6, 7, or 8, and thus, the details are not repeated.

The manufacturing method of the hole stacking structure can reduce the manufacturing difficulty, improve the yield and reduce the manufacturing cost. The mechanical holes and the laser via holes are arranged in a stacked mode, so that the wiring space can be enlarged, and the fan-out of the device is more convenient. By utilizing copper filling in the mechanical hole, the laser via hole and the mechanical hole can be aligned, each ground via hole of the device can be grounded through the via hole, and the backflow area is reduced. The stacked hole structure of the printed circuit board can increase the heat dissipation of the device and save the copper block design in the device. The stacked mechanical holes and the laser via holes are filled with metal materials, so that the through-current capacity of the via holes can be increased, the voltage drop of the via holes is further reduced, and stable power supply voltage is provided for the power chips. The multilayer additional plates are overlapped, and the laser through holes correspond to one another, so that the interconnection difficulty of any layer can be reduced.

In the description of the present application, the terms "mounted," "connected," "fixed," and the like are used in a broad sense, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The utility model provides a printed circuit board's fold hole structure, its characterized in that includes a mechanical via hole and an at least laser via hole that set up on the printed circuit board, mechanical via hole with the laser via hole is range upon range of to be set up and electric connection each other, mechanical via hole includes the metal material of intussuseption in the mechanical hole, the laser via hole includes the metal material of intussuseption in the laser hole.

2. The stacked via structure of claim 1, wherein:

the mechanical through holes are arranged on a foundation plate, each laser through hole is arranged on an additional plate, and each additional plate is pressed on the foundation plate or the other additional plate;

one end of the mechanical via hole is laminated with one or more laser via holes; or one or more laser through holes are stacked at two ends of the mechanical through hole.

3. A stacked pore structure according to claim 1 or 2, wherein:

the mechanical via hole further comprises a metal layer on the inner wall of the mechanical hole, and the metal material of one end of the mechanical via hole faces the metal material of one end of the mechanical via hole and is in direct contact with the metal material of one end of the laser via hole.

4. A heat dissipation structure of a printed circuit board, comprising a plurality of stacked hole structures as claimed in any one of claims 1 to 3, distributed in an array on the printed circuit board for dissipating heat from heat generating devices.

5. The heat dissipation structure of claim 4, wherein at least some of the stacked via structures are located under a heat generating device, at least some pins of the heat generating device are electrically connected to the laser vias in the corresponding stacked via structures, and the some pins include at least one of a ground pin and a power pin.

6. The heat dissipating structure of claim 4 or 5,

and in the plurality of stacked hole structures distributed in an array form, the center distance between two adjacent stacked hole structures is 0.45-1.27 mm.

7. A method for manufacturing a laminated hole of a printed circuit board comprises the following steps:

8. A stack hole manufacturing method according to claim 7 or 8, characterized in that:

the laser via holes laminated with the mechanical via holes are manufactured by respectively pressing two additional plates on two surfaces of the base plate and respectively manufacturing the laser via holes laminated with the mechanical via holes on the two additional plates; or

And manufacturing the laser via hole stacked with the mechanical via hole by pressing an additional plate on one surface of the base plate and manufacturing the laser via hole stacked with the mechanical via hole on the additional plate.

9. The stack hole manufacturing method according to claim 8, wherein:

after the laser via hole laminated with the mechanical via hole is manufactured on at least one additional board, the method also carries out the following treatment one or more times: and pressing a new additional plate and an additional plate which is already finished with the laser through hole, processing a through laser hole at the position of the new additional plate corresponding to the mechanical through hole, filling a metal material in the laser hole, and performing surface treatment on the new additional plate.

10. A manufacturing method of a printed circuit board heat dissipation structure comprises the following steps:

manufacturing a plurality of stacked hole structures on the printed circuit board according to the manufacturing method of any one of claims 7 to 9, wherein the plurality of stacked hole structures are distributed on the printed circuit board in an array manner and are at least partially positioned below the heat generating device for dissipating heat of the heat generating device;

and electrically connecting at least partial pins of the heat generating device with the corresponding stacked hole structure, wherein the partial pins comprise at least one of a grounding pin and a power supply pin.