CN112310236A - A kind of encapsulation film material and encapsulation method of photovoltaic module - Google Patents
A kind of encapsulation film material and encapsulation method of photovoltaic module Download PDFInfo
- Publication number
- CN112310236A CN112310236A CN202010969617.XA CN202010969617A CN112310236A CN 112310236 A CN112310236 A CN 112310236A CN 202010969617 A CN202010969617 A CN 202010969617A CN 112310236 A CN112310236 A CN 112310236A
- Authority
- CN
- China
- Prior art keywords
- encapsulating
- encapsulation
- packaging
- width
- film material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/804—Materials of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Abstract
本发明提供了一种封装胶膜材料和光伏组件的封装方法。本发明提供的封装胶膜材料包括封装材料2和包围在封装材料2周围的封装材料1，其中封装材料2与封装材料1的边缘相融合。本发明提供的封装胶膜材料的制备方法减少了产线设备初始成本投入、减少产品良品率问题，减少了封装工艺难度，通过材料组合降低了封装材料成本，进一步降低了产品成本。
The invention provides an encapsulation adhesive film material and an encapsulation method for a photovoltaic module. The encapsulation adhesive film material provided by the present invention includes an encapsulation material 2 and an encapsulation material 1 surrounding the encapsulation material 2 , wherein the encapsulation material 2 is fused with the edge of the encapsulation material 1 . The preparation method of the packaging adhesive film material provided by the invention reduces the initial cost input of production line equipment, reduces the problem of product yield, reduces the difficulty of packaging process, reduces packaging material cost through material combination, and further reduces product cost.
Description
Technical Field
The invention relates to a packaging adhesive film material and a packaging method of a photovoltaic module.
Background
A photovoltaic device or solar cell is a device that directly converts light energy into electrical energy using the photovoltaic effect. Thus, conventional photovoltaic systems include an array of photovoltaic modules, each comprising one or more photovoltaic devices, which are integrated together and encapsulated to protect them from mechanical damage and from extreme weather.
In existing thin-film photovoltaic modules, solar cells are sandwiched between back sheet glass (or insulating polymer material back sheet) and front sheet glass (or transparent polymer material insulating front sheet) using an adhesive sealant material such as polyethylene-vinyl acetate (EVA) or polyvinyl butyral (PVB) or polyolefin based POE, with an edge sealing material (e.g., polyisobutylene, silicone and epoxy/acrylic, etc.) deposited around the perimeter to prevent moisture ingress; in addition, there is a packaging method using a packaging material having a low moisture vapor transmission rate, which is more expensive than a packaging material generally used in the market, without using an edge sealant.
In the prior art, no packaging material with low cost and low water-gas permeability exists, and the edge sealing material or the packaging material with higher cost is used at present, so that although the packaging requirements of the second generation thin film photovoltaic module with low water-gas permeability are met, the edge sealing material can increase the initial cost input of production line equipment, increase the product yield and increase the packaging process difficulty; the photovoltaic product is packaged by the packaging material with higher use cost, the product cost is higher, and the photovoltaic product has no competitive advantage in the photovoltaic market.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a new packaging process method, which not only does not increase new equipment and packaging process, but also reduces the cost of packaging materials and further reduces the cost of products.
The first aspect of the present invention provides a packaging adhesive film material, which comprises a packaging material 2 and a packaging material 1 surrounding the packaging material 2, wherein the packaging material 2 is fused with the edge of the packaging material 1.
According to some embodiments of the invention, the water vapor transmission rate of the encapsulating material 1 is lower than the water vapor transmission rate of the encapsulating material 2.
According to some embodiments of the invention, the packaging material 1 has a water vapor transmission rate of 0.1g/cm or less3.d。
According to some embodiments of the invention, the encapsulating material 2 has a water vapor transmission rate > 1g/cm3.d。
According to some embodiments of the invention, the encapsulating material 1 is chosen from materials having a water vapor transmission rate of 0.1g/cm or less3D a thermoplastic polymer.
According to a preferred embodiment of the invention, the encapsulating material 1 is selected from one or more of EVB ionomer and SGP plasma polymer.
According to some embodiments of the invention, the encapsulating material 2 is selected from materials having a water vapor transmission rate > 1g/cm3D a thermoplastic polymer.
According to a preferred embodiment of the present invention, the encapsulating material 2 is selected from one or more of the polyolefin elastomers POE and polyvinyl butyral PVB.
The second aspect of the present invention provides a method for preparing the packaging adhesive film material according to the first aspect, which comprises the following steps:
s1: providing a packaging material 1 having a packaging material 2 and a long strip shape;
s2: placing the packaging material 1 around a packaging material 2 for overlapping;
s3: and fusing the packaging material 1 and the packaging material 2 by heating to form the packaging adhesive film material.
According to some embodiments of the present invention, the width of the joint of the potting material 1 and the potting material 2 is 0-10 mm.
According to some embodiments of the present invention, the packaging material 2 may be cut into a desired size from any shape without limitation. Typically, the packaging material 2 is a web with a certain width and a length of 100-200m, so that the web is cut into a desired shape.
According to some embodiments of the invention, the overlapping comprises joining or partially overlapping at S2.
According to some embodiments of the invention, the heating temperature is 100-300 ℃ in S3.
According to a preferred embodiment of the present invention, the heating temperature is 150-200 ℃ in S3.
According to some embodiments of the invention, in S3, the heating is performed for a time period of 1S to 20S.
According to a preferred embodiment of the present invention, in S3, the heating time is 5S to 10S.
According to the invention, the type, heating temperature and time of the packaging material can influence the fusion effect, and the packaging adhesive film material with better effect can be obtained at the heating temperature and time within a specific range.
The third aspect of the invention provides a use of the encapsulating adhesive film material according to the first aspect or the encapsulating adhesive film material prepared by the method according to the second aspect in encapsulating a photovoltaic module.
A fourth aspect of the invention provides a photovoltaic module comprising a photovoltaic device, a front sheet, a back sheet and the encapsulant film material according to the first aspect or the encapsulant film material prepared according to the method of the second aspect.
According to some embodiments of the invention, the size of the encapsulant 2 is smaller than the photovoltaic device size minus the insulation width.
According to some embodiments of the invention, the width of the encapsulant 1 is greater than the insulating width of the photovoltaic device.
According to some embodiments of the invention, the width of the encapsulating material 1 is 5-30 mm.
According to some embodiments of the invention, the encapsulant 2 is rectangular, wherein the length and width of the encapsulant 2 are 5-30mm less than the length and width of the photovoltaic module, respectively.
According to some embodiments of the invention, the size of the encapsulant film material is larger than the size of the photovoltaic device.
A fifth aspect of the invention provides a method of encapsulating a photovoltaic module according to the fourth aspect, comprising the steps of:
A. placing the packaging adhesive film material of the first aspect or the packaging adhesive film material prepared by the method of the second aspect between a photovoltaic device and a front plate and/or a back plate to form a laminate;
B. and carrying out lamination treatment on the laminated member to obtain the photovoltaic module.
According to some embodiments of the invention, the temperature of the lamination process is 120-.
According to some embodiments of the invention, the time of the lamination process is 3-30 min.
According to some embodiments of the invention, the pressure of the lamination process is 10 to 100 kPa.
According to some embodiments of the invention, the conditions of the lamination process comprise: the temperature is 120-180 ℃; vacuumizing for 3-8min, and pressurizing for 5-15 min; the pressurizing mode is staged pressurizing, and preferably, the pressure of the first stage is 10-30KPa, the pressure of the second stage is 30-60KPa, and the pressure of the third stage is 60-100 KPa.
In the present invention, the term "insulation width" refers to the width of the cell/film layer edge and the package plate edge, which is designed to withstand a certain high voltage and has a leakage current within a safe range.
On the basis of not adding new equipment, new materials and a new packaging process, the invention reduces the initial cost input of production line equipment, reduces the problem of product yield, reduces the difficulty of the packaging process, reduces the cost of packaging materials through material combination, and further reduces the product cost.
Drawings
Fig. 1 is a schematic view of a packaging adhesive film material according to embodiment 1 of the present invention.
Detailed Description
According to the invention, by adopting a packaging material 1 (such as EVB ionic polymer, SGP ionic polymer and the like) with low water vapor transmission rate but higher cost and a packaging material 2 (polyolefin POE, ethylene, vinyl acetate EVA and the like) with higher water vapor transmission rate but lower cost, the material 2 is cut into a certain size through the thermoplastic characteristics of the two materials, and the size is smaller than the size of the insulation width removed by the photovoltaic device; cutting the material 1 into strips with a certain width, wherein the width is larger than the insulation width required by the photovoltaic device; the cut material 1 is placed on the periphery of the material 2 and is abutted or overlapped, the material 1 and the material 2 are fused through a heating device to form a packaging adhesive film sheet with the size larger than that of a single or a plurality of photovoltaic devices, the packaging adhesive film sheet is placed between the photovoltaic devices and other front plates and back plates, and the photovoltaic assembly is formed through lamination. The invention not only reduces the using amount of the packaging material 1 and the packaging cost, but also meets the packaging air tightness requirement of the film assembly.
Based on the foregoing summary, in a first aspect, the present invention provides an adhesive packaging film material, which includes a packaging material 2 and a packaging material 1 surrounding the packaging material 2, wherein the packaging material 2 is fused with the edge of the packaging material 1.
According to some embodiments of the invention, the water vapor transmission rate of the encapsulating material 1 is lower than the water vapor transmission rate of the encapsulating material 2.
According to some embodiments of the invention, the packaging material 1 has a water vapor transmission rate of 0.1g/cm or less3.d。
According to some embodiments of the invention, the encapsulating material 2 has a water vapor transmission rate > 1g/cm3.d。
According to some embodiments of the invention, the encapsulating material 1 is chosen from materials having a water vapor transmission rate of 0.1g/cm or less3D a thermoplastic polymer.
According to a preferred embodiment of the invention, the encapsulating material 1 is selected from one or more of EVB ionomer and SGP plasma polymer.
According to some embodiments of the invention, the encapsulating material 2 is selected from materials having a water vapor transmission rate > 1g/cm3D a thermoplastic polymer.
According to a preferred embodiment of the present invention, the encapsulating material 2 is selected from one or more of the polyolefin elastomers POE and polyvinyl butyral PVB.
In a second aspect, the present invention provides a method for preparing the packaging adhesive film material according to the first aspect, which comprises the following steps:
s1: providing a packaging material 1 having a packaging material 2 and a long strip shape;
s2: placing the packaging material 1 around a packaging material 2 for overlapping;
s3: and fusing the packaging material 1 and the packaging material 2 by heating to form the packaging adhesive film material.
According to some embodiments of the present invention, the width of the joint of the potting material 1 and the potting material 2 is 0-10 mm.
According to some embodiments of the present invention, the packaging material 2 may be cut into a desired size from any shape without limitation. Typically, the packaging material 2 is a web with a certain width and a length of 100-200m, so that the web is cut into a desired shape.
According to some embodiments of the invention, the overlapping comprises joining or partially overlapping at S2.
According to some embodiments of the invention, the heating temperature is 100-300 ℃ in S3.
According to a preferred embodiment of the present invention, the heating temperature is 150-200 ℃ in S3.
According to some embodiments of the invention, in S3, the heating is performed for a time period of 1S to 20S.
According to a preferred embodiment of the present invention, in S3, the heating time is 5S to 10S.
According to the invention, the type, heating temperature and time of the packaging material can influence the fusion effect, and the packaging adhesive film material with better effect can be obtained at the heating temperature and time within a specific range.
In a third aspect, the present invention provides a use of the encapsulating adhesive film material according to the first aspect or the encapsulating adhesive film material prepared by the method according to the second aspect in encapsulating a photovoltaic module.
In a fourth aspect, the present invention provides a photovoltaic module comprising a photovoltaic device, a front sheet, a back sheet and an encapsulant film material according to the first aspect or the encapsulant film material prepared according to the method of the second aspect.
According to some embodiments of the invention, the size of the encapsulant 2 is smaller than the photovoltaic device size minus the insulation width.
According to some embodiments of the invention, the width of the encapsulant 1 is greater than the insulating width of the photovoltaic device.
According to some embodiments of the invention, the width of the encapsulating material 1 is 5-30 mm.
According to some embodiments of the invention, the encapsulant 2 is rectangular, wherein the length and width of the encapsulant 2 are 5-30mm less than the length and width of the photovoltaic module, respectively.
According to some embodiments of the invention, the size of the encapsulant film material is larger than the size of the photovoltaic device.
In a fifth aspect, the present invention provides a method of encapsulating a photovoltaic module according to the fourth aspect, comprising the steps of:
A. placing the packaging adhesive film material of the first aspect or the packaging adhesive film material prepared by the method of the second aspect between a photovoltaic device and a front plate and/or a back plate to form a laminate;
B. and carrying out lamination treatment on the laminated member to obtain the photovoltaic module.
According to some embodiments of the invention, the temperature of the lamination process is 120-.
According to some embodiments of the invention, the time of the lamination process is 3-30 min.
According to some embodiments of the invention, the pressure of the lamination process is 10 to 100 kPa.
According to some embodiments of the invention, the conditions of the lamination process comprise: the temperature is 120-180 ℃; vacuumizing for 3-8min, and pressurizing for 5-15 min; the pressurizing mode is staged pressurizing, and preferably, the pressure of the first stage is 10-30KPa, the pressure of the second stage is 30-60KPa, and the pressure of the third stage is 60-100 KPa.
According to some specific embodiments of the present invention, the present invention provides a method for encapsulating a photovoltaic module, specifically, as shown in fig. 1, cutting an encapsulating material 1 into strips with a width of 5-30mm, combining the size of the encapsulating material 2 with a size of cutting a length and a width which are less than the length and the width of the photovoltaic module by 5-30mm, placing the encapsulating material 2 on a platform with a surface covered with teflon, placing the encapsulating material 1 on the periphery of the encapsulating material 2, overlapping the two materials with a width of 0-10mm, heating to about 160 ℃, covering the surface of the device with the teflon, contacting and pressing the overlapping part of the encapsulating material 1 and the encapsulating material 2 by a heating device for a certain time, adhering and melting the encapsulating material 1 and the encapsulating material 2 into a whole, placing the combined encapsulating material between the photovoltaic device and a front plate or (and) a back plate, and putting the photovoltaic module into a laminating machine, and forming the photovoltaic module through a certain laminating process.
The present invention will be more fully understood by those skilled in the art by describing the present invention in detail with reference to the following examples, which should not be construed as limiting the scope of the present invention in any way.
The starting materials or components used in the present invention may be commercially or conventionally prepared unless otherwise specified.
Example 1
Cutting an encapsulating material 1(EVB ionic polymer) into strips with the width of 15mm, cutting the size of an encapsulating material 2(POE polyolefin elastomer) into the size with the length smaller than the length of a photovoltaic device by 12mm and the width smaller than the width of the photovoltaic device by 10mm, placing the encapsulating material 2 on a platform with the surface covered with polytetrafluoroethylene, placing the encapsulating material 1 on the periphery of the encapsulating material 2, overlapping the two materials together, wherein the overlapping width of the length is 5mm and the overlapping width of the width is 3mm, heating the device to 160 ℃ to ensure that the surface of the device is covered with the polytetrafluoroethylene, contacting and pressing the overlapping part of the encapsulating material 1 and the encapsulating material 2 by a heating device for 1-20s, melting and adhering the encapsulating material 1 and the encapsulating material 2 into a whole, placing the combined encapsulating material between the photovoltaic device and a front plate or (or) a back plate, placing the combined material into a laminating machine, laminating the combined material by a certain laminating, vacuumizing for 3min, pressurizing for 10min, and pressurizing for three sections of 20KPa/60KPa/100KPa) to form the photovoltaic module.
Example 2
Cutting an encapsulating material 1(EVB ionic polymer) into a strip shape with the width of 20mm, cutting the size of an encapsulating material 2(POE polyolefin elastomer) into the size with the length of 20mm less than the length of a photovoltaic device and the width of 20mm less than the width of the photovoltaic device, placing the encapsulating material 2 on a platform with the surface covered with polytetrafluoroethylene, placing the encapsulating material 1 on the periphery of the encapsulating material 2 to be in contact, overlapping the two materials together, wherein the length overlapping width is 0mm, the width overlapping width is 0mm, heating the device to 170 ℃ to ensure that the surface of the device is covered with the polytetrafluoroethylene, contacting and pressing the overlapping part of the encapsulating material 1 and the encapsulating material 2 through a heating device for 1-20s, melting and adhering the encapsulating material 1 and the encapsulating material 2 into a whole, placing the combined encapsulating material between the photovoltaic device and a front plate or (and) a back plate, placing the combined material into a laminating machine, laminating at a specific laminating temperature of, vacuumizing for 3min, pressurizing for 10min, and pressurizing for three sections of 20KPa/60KPa/100KPa) to form the photovoltaic module.
It should be noted that the above-mentioned embodiments are only for explaining the present invention, and do not set any limit to the present invention. The invention has been described with reference to an exemplary embodiment, but the words which have been used herein are words of description and illustration, rather than words of limitation. The invention can be modified, as prescribed, within the scope of the appended claims, and changes can be made thereto without departing from the spirit and scope of the invention. Although the invention has been described herein with reference to particular means, materials and embodiments, the invention is not intended to be limited to the particulars disclosed herein, but rather extends to all other methods and applications having the same functionality.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010969617.XA CN112310236A (en) | 2020-09-15 | 2020-09-15 | A kind of encapsulation film material and encapsulation method of photovoltaic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010969617.XA CN112310236A (en) | 2020-09-15 | 2020-09-15 | A kind of encapsulation film material and encapsulation method of photovoltaic module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112310236A true CN112310236A (en) | 2021-02-02 |
Family
ID=74483718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010969617.XA Pending CN112310236A (en) | 2020-09-15 | 2020-09-15 | A kind of encapsulation film material and encapsulation method of photovoltaic module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112310236A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112986154A (en) * | 2021-02-03 | 2021-06-18 | 重庆神华薄膜太阳能科技有限公司 | Float glass tin surface detection device and detection method |
| CN113270512A (en) * | 2021-05-17 | 2021-08-17 | 浙江合特光电有限公司 | Flexible high-light-transmission solar composite front plate |
| EP4339255A1 (en) * | 2022-09-16 | 2024-03-20 | Zhejiang Jinko Solar Co., Ltd. | Splicing adhesive film, method for manufacturing splicing adhesive film, and photovoltaic module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756579A (en) * | 2014-01-09 | 2014-04-30 | 常州斯威克光伏新材料有限公司 | EVA (Ethylene Vinyl-Acetate) packaging glue film with high gas-water barrier property and preparation method thereof |
| CN104377259A (en) * | 2013-12-27 | 2015-02-25 | 比亚迪股份有限公司 | Photovoltaic cell assembly with two glass layers |
| CN107400471A (en) * | 2017-08-11 | 2017-11-28 | 杭州福斯特应用材料股份有限公司 | A kind of sandwich construction photovoltaic component encapsulating glued membrane and preparation method thereof |
| JP2019525458A (en) * | 2016-06-28 | 2019-09-05 | コーロン インダストリーズ インク | Solar module backsheet and manufacturing method thereof |
| CN210640261U (en) * | 2019-07-24 | 2020-05-29 | 苏州阿特斯阳光电力科技有限公司 | A kind of encapsulating film for photovoltaic module and photovoltaic module containing the same |
-
2020
- 2020-09-15 CN CN202010969617.XA patent/CN112310236A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377259A (en) * | 2013-12-27 | 2015-02-25 | 比亚迪股份有限公司 | Photovoltaic cell assembly with two glass layers |
| CN103756579A (en) * | 2014-01-09 | 2014-04-30 | 常州斯威克光伏新材料有限公司 | EVA (Ethylene Vinyl-Acetate) packaging glue film with high gas-water barrier property and preparation method thereof |
| JP2019525458A (en) * | 2016-06-28 | 2019-09-05 | コーロン インダストリーズ インク | Solar module backsheet and manufacturing method thereof |
| CN107400471A (en) * | 2017-08-11 | 2017-11-28 | 杭州福斯特应用材料股份有限公司 | A kind of sandwich construction photovoltaic component encapsulating glued membrane and preparation method thereof |
| CN210640261U (en) * | 2019-07-24 | 2020-05-29 | 苏州阿特斯阳光电力科技有限公司 | A kind of encapsulating film for photovoltaic module and photovoltaic module containing the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112986154A (en) * | 2021-02-03 | 2021-06-18 | 重庆神华薄膜太阳能科技有限公司 | Float glass tin surface detection device and detection method |
| CN113270512A (en) * | 2021-05-17 | 2021-08-17 | 浙江合特光电有限公司 | Flexible high-light-transmission solar composite front plate |
| EP4339255A1 (en) * | 2022-09-16 | 2024-03-20 | Zhejiang Jinko Solar Co., Ltd. | Splicing adhesive film, method for manufacturing splicing adhesive film, and photovoltaic module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112310236A (en) | A kind of encapsulation film material and encapsulation method of photovoltaic module | |
| JP4401649B2 (en) | Manufacturing method of solar cell module | |
| US4249958A (en) | Panel comprising at least one photo-voltaic cell and method of manufacturing same | |
| EP3857613B1 (en) | A method of producing a solar panel curved in two directions | |
| JP5452773B2 (en) | Solar cell module and manufacturing method thereof | |
| US20120103397A1 (en) | Photovoltaic module and method for the production thereof | |
| CN103155157B (en) | There is the solar energy module of connecting element | |
| TWI786104B (en) | Photovoltaic module, photovoltaic encapsulant and method of producing a photovoltaic module | |
| US11616154B2 (en) | Planarization of photovoltaics | |
| CN103042806A (en) | Manufacturing method of double-glass photovoltaic component | |
| KR20120042876A (en) | Solar cell module, solar cell panel, solar cell module manufacturing method, and solar cell panel manufacturing method | |
| CN105555689B (en) | The connection method of conductive adhesive tape and conductive adhesive tape and solar module and its manufacturing method | |
| JP2009277891A (en) | Thin film solar cell module | |
| JP4086353B2 (en) | LAMINATE MANUFACTURING METHOD AND SOLAR CELL MODULE MANUFACTURING METHOD | |
| JP3838684B2 (en) | Method for manufacturing flexible solar cell | |
| WO2012117891A1 (en) | Output wire for solar cell modules, solar cell module, and method for manufacturing same | |
| JP2007242677A (en) | Solar battery module, method of manufacturing the same and solar battery system | |
| WO2012102320A1 (en) | Solar cell module and method for manufacturing solar cell module | |
| JP2011210747A (en) | Solar cell module and method of manufacturing the same | |
| JP3856224B2 (en) | Manufacturing method of solar cell module | |
| JP4512650B2 (en) | Manufacturing method of solar cell module | |
| CN111509071A (en) | Solar cell module and preparation method thereof | |
| JPH0556028B2 (en) | ||
| JPH11254526A (en) | Laminating apparatus and method | |
| JPH09312408A (en) | Manufacture of solar battery module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210202 |