CN112306200B - Computer chip cooling device - Google Patents
Computer chip cooling device Download PDFInfo
- Publication number
- CN112306200B CN112306200B CN201911419510.1A CN201911419510A CN112306200B CN 112306200 B CN112306200 B CN 112306200B CN 201911419510 A CN201911419510 A CN 201911419510A CN 112306200 B CN112306200 B CN 112306200B
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- heat
- fan
- computer chip
- control circuit
- pipe array
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computing Systems (AREA)
- Quality & Reliability (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of electronic chip heat dissipation, and provides a computer chip heat dissipation device, which aims at the technical problems of larger volume, liquid leakage and the like in the existing air cooling heat dissipation technology, and comprises: the invention relates to a fan control circuit interface, a fan control circuit, a fan group, a heat input interface, a heat pipe array, a radiating fin and a single-slot card type air outlet.
Description
Technical Field
The present invention relates to a heat dissipation device for a computer chip, and more particularly, to a single-slot card type air-cooled heat dissipation device for dissipating heat from a computer chip through a radial fan set and a heat pipe array.
Background
Modern computer chips integrate up to billions of transistors in hundreds of square millimeters of area, with dominant frequencies up to 5GHz and thermal design power consumption up to hundreds of watts. If the heat generated by the computer chip during operation cannot be rapidly dissipated, the computer chip can be reduced in frequency or burnt out due to overheating.
Active heat dissipation techniques for computer chip heat dissipation in recent years include air-cooled heat dissipation and water-cooled heat dissipation. The water cooling heat dissipation adopts a water pump to enable liquid in the pipeline to circularly flow, and the cooling row is blown through by a fan to dissipate heat. Although water cooling naturally has the capability of bearing high heat load, after long-term use, the water cooling pipeline is easy to leak liquid to cause short circuit, so that the reliability is low. Air-cooled heat dissipation does not present this risk. The air-cooled heat dissipation device generally absorbs heat of a computer chip by a heat dissipation plate, and air flow generated by a fan flows through the heat dissipation plate to take away the heat so as to cool the computer chip. In order to bear high heat load, large tower type cooling fins are often adopted for air cooling, and the large tower type cooling fins comprise up to hundreds of metal cooling fins. Such high volume air cooled heat sinks tend to be difficult to install and can block memory slots or motherboard mounting holes in microcomputer applications. The air flow produced by the axial flow fan of the air cooling heat dissipation device passes through the large tower type cooling fins, and then the heated hot air can fully fill the computer case, so that the temperature inside the computer case is increased, and the heat dissipation effect is affected. The air cooling heat dissipation device can be matched with a front fan and a back fan or an upper fan and a lower fan of the computer case to form an air duct so as to rapidly discharge hot air. Many computer cabinets are not capable of creating a wind tunnel.
Therefore, the invention provides a computer chip heat dissipation device, which dissipates heat of a computer chip by adopting a radial fan group and a heat pipe array. Compared with the air-cooled heat dissipation device in the current market, the air-cooled heat dissipation device has the advantages of being strong in compatibility, compact in size, free of blocking of memory slots or main board mounting holes, convenient to install, free of forming an air duct and the like.
Disclosure of Invention
The invention aims to provide a computer chip heat dissipation device which dissipates heat of a computer chip by adopting a radial flow fan group and a heat pipe array. Compared with the air-cooled heat dissipation device in the current market, the air-cooled heat dissipation device has the advantages of being strong in compatibility, compact in size, free of blocking of memory slots or main board mounting holes, convenient to install, free of forming an air duct and the like.
The heat pipe array is connected with the input end of the heat pipe array, the output end of the heat pipe array is connected with the other input end of the heat pipe array, the output end of the heat pipe array is connected with the input end of the heat pipe array, the fan control circuit receives temperature information of a processor provided by a temperature sensor in a computer chip through the fan control circuit interface, the heat pipe array is connected with the computer chip through the heat input interface, heat is received and conducted to the heat radiating fin, airflow of the fan array penetrates through the heat radiating fin, and the heated airflow is directly discharged out of the computer case through the single-slot card type air outlet for heat radiation.
The fan control circuit interface is used for establishing electrical connection between the temperature sensor in the computer chip and the fan control circuit of the computer chip heat dissipation device, and providing the processor temperature information provided by the temperature sensor in the computer chip to the fan control circuit of the computer chip heat dissipation device;
The fan control circuit is a digital pulse width modulation control chip and is used for controlling the rotating speed of a fan group of the computer chip heat dissipation device according to the temperature information of the processor provided by the temperature sensor in the computer chip, and the working principle is not repeated because various digital pulse width modulation control chips exist in the market;
The fan group is formed by connecting a single radial fan or a plurality of radial fans in parallel, and the single radial fan or the plurality of radial fans connected in parallel absorb air in the computer case to form air flow to blow through the radiating fins for radiating;
the heat input interface is used for connecting a computer chip and a heat pipe array of a computer chip heat dissipation device, is a block metal or a soaking plate, and the surface contacted with the computer chip is coated with high-heat-conductivity heat-conducting silicone grease or liquid metal, and is tightly contacted with the heat pipe array by adopting a welding technology so as to establish high-efficiency heat connection;
the heat pipe array is used for efficiently conducting heat introduced from the heat input interface to the radiating fin;
The radiating fins are tightly connected with the heat pipe array by adopting a fin penetrating process or a reflow soldering process;
The single-slot card type air outlet is positioned at the opening of the first expansion card slot closest to the computer processor and is used for directly discharging the hot air passing through the radiating fins out of the computer case, and the material of the single-slot card type air outlet can be high polymer or metal.
The working principle of the invention is that when in use, the computer chip is closely connected with the electronic chip air-cooling heat dissipation device, including electric connection and thermal connection. The temperature sensor in the computer chip is connected with the fan control circuit of the computer chip heat dissipation device through the fan control circuit interface of the computer chip heat dissipation device, the fan control circuit is used for controlling the rotating speed of a fan group of the computer chip heat dissipation device according to the temperature information of a processor provided by the temperature sensor in the computer chip, the computer chip is connected with a heat pipe array of the computer chip heat dissipation device through a heat input interface of the computer chip heat dissipation device, the heat pipe array is used for efficiently conducting heat imported from the heat input interface to a heat dissipation plate, the fan group is used for conducting heat conducted to the heat dissipation plate by the heat pipe array to conduct forced convection heat dissipation, and a single-slot card type air outlet is used for directly discharging hot air penetrating through the heat dissipation plate out of a computer case, so that the heat dissipation capacity of the computer chip is greatly enhanced, and the working temperature of the computer chip is effectively reduced.
Due to the adoption of the technical scheme, the invention has the following advantages:
1. the novel air-cooled radiator is strong in compatibility, compact in size, free of blocking of the memory slot or the main board mounting hole, convenient to install and free of forming an air duct;
2. The heat dissipation capacity of the computer chip is enhanced, and the computing performance of the computer chip is indirectly improved.
Drawings
FIG. 1 is a block diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of the operation of the present invention;
fig. 3 is a schematic structural view of the present invention.
Detailed Description
The invention will be further described with reference to the accompanying drawings and examples, which comprise a fan control circuit interface 1, a fan control circuit 2, a fan group 3, a heat input interface 4, a heat pipe array 5, a heat sink 6 and a single-slot card type air outlet 7, wherein the output end of the fan control circuit interface 1 is connected with the input end of the fan control circuit 2, the output end of the fan control circuit 2 is connected with the input end of the fan group 3, the output end of the fan group 3 is connected with one input end of the heat sink 6, the output end of the heat input interface 4 is connected with the input end of the heat pipe array 5, the output end of the heat pipe array 5 is connected with the other input end of the heat sink 6, the output end of the heat sink 6 is connected with the input end of the single-slot card type air outlet 7, the fan control circuit 2 receives the temperature information of a processor provided by a temperature sensor in a computer chip through the fan control circuit interface 1, the heat pipe array 5 is connected with the computer chip through the heat input interface 4, receives the heat and is conducted to the heat of the fan group 3, the air flow of the fan group 3 passes through the heat sink 6, and the heat is discharged from the single-slot card type air outlet 7 to the computer directly through the heat sink.
The fan control circuit interface 1 is used for establishing electrical connection between a temperature sensor in a computer chip and the fan control circuit 2 of the computer chip heat dissipation device, and providing processor temperature information provided by the temperature sensor in the computer chip to the fan control circuit 2 of the computer chip heat dissipation device;
The fan control circuit 2 is a digital pulse width modulation control chip, and is used for controlling the rotating speed of the fan group 3 of the computer chip heat dissipation device according to the temperature information of the processor provided by the temperature sensor in the computer chip, and the working principle is not repeated because various digital pulse width modulation control chips exist in the market;
The fan group 3 is formed by connecting a single radial fan or a plurality of radial fans in parallel, and the single radial fan or the plurality of radial fans connected in parallel absorb air in the computer case to form air flow to blow through the radiating fins 6 for radiating;
The heat input interface 4 is used for connecting the computer chip and the heat pipe array 5, is a block metal or a soaking plate, and is coated with high-heat-conductivity heat-conducting silicone grease or liquid metal on the surface contacted with the computer chip, and is tightly contacted with the heat pipe array 5 by adopting a welding technology so as to establish high-efficiency heat connection;
the heat pipe array 5 is used for efficiently conducting heat introduced from the heat input interface 4 to the radiating fins 6;
The radiating fins 6 are tightly connected with the heat pipe array 5 by adopting a fin penetrating process or a reflow soldering process. The material is metal or carbon fiber;
the single-slot card type air outlet 7 is used for directly discharging the hot air passing through the cooling fin 6 out of the computer case, and the material of the single-slot card type air outlet can be high polymer or metal.
The working principle of the invention is that the computer chip is closely connected with the computer chip heat dissipation device during use, including electrical connection and thermal connection. The temperature sensor in the computer chip is connected with the fan control circuit 2 of the computer chip heat dissipation device through the fan control circuit interface 1 of the computer chip heat dissipation device, the fan control circuit 2 controls the rotating speed of the fan group 3 of the computer chip heat dissipation device according to the temperature information of the processor provided by the temperature sensor in the computer chip, the computer chip is connected with the heat pipe array 5 of the computer chip heat dissipation device through the heat input interface 4 of the computer chip heat dissipation device, the heat pipe array 5 is used for efficiently conducting the heat led in from the heat input interface 4 to the heat dissipation fins 6, the fan group 3 is used for conducting the heat conducted to the heat dissipation fins 6 by the heat pipe array 5 to conduct forced convection heat dissipation, and the single-slot card type air outlet 7 is used for directly discharging the hot air passing through the heat dissipation fins 6 out of the computer case, so that the heat dissipation capacity of the computer chip is greatly enhanced, and the working temperature of the computer chip is effectively reduced.
As shown in fig. 3, the single-slot card type air outlet 7 occupies the position of the computer motherboard closest to the first expansion card slot of the processor, so that the hot air is exhausted out of the chassis. According to statistics, taking the most high market-occupancy mainboard manufacturers, huashuo, jijia, microsatellite, huaqing, yitai and Qihao as examples, in ATX mainboards facing the personal DIY market (referring to Intel-based Z390, Z370, H370, B365, B360, H310 chip sets and AMD X570, X470, X370, B350 and A320 chip sets), the first expansion card slot closest to a processor is a PCI Express X1 slot or NVME M.2 solid state disk mounting position, and the proportion of the first expansion card slot not being a PCI Express X16 display card slot is more than 70%, and in mainboards facing the high-end personal DIY market (referring to Intel-based X299 chip sets and AMD X399 chip sets), only Huaqing provides a mainboard product of which the first expansion card slot closest to the processor is a PCI Express X1 slot or NVM.2 solid state disk mounting position not being a PCI Express X16 display card slot. The length of the heat pipe array 5 in the invention is within 14cm, which is basically similar to the length of the heat pipe of the middle-high end air-cooled radiator in the current market.
The heat pipe array 5 is a normal temperature heat pipe, and the working temperature is 0-250 ℃.
The heat pipe array 5 is made of copper, copper alloy, aluminum or aluminum alloy.
The fan group 3 is a single radial fan or a plurality of radial fans connected in parallel, and the thickness of the fans is 5-100 mm.
The included angle between the exhaust direction of the fan set 3 and the rotation axis of the fan is 60-120 degrees.
The material of the heat input interface 4 is copper, copper alloy, aluminum or aluminum alloy.
The heat input interface 4 of the present invention is coated on both sides with high thermal conductivity heat conductive silicone grease or liquid metal.
The heat input interface 4 is a block metal or a vapor chamber.
The heat input interface 4 and the computer chip are fixed by adopting a metal fixture.
The radiating fins 6 and the heat pipe array 5 are tightly connected by adopting a fin penetrating process or a reflow soldering process.
The material of the single-slot card type air outlet 7 is high polymer or metal.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911419510.1A CN112306200B (en) | 2019-12-31 | 2019-12-31 | Computer chip cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911419510.1A CN112306200B (en) | 2019-12-31 | 2019-12-31 | Computer chip cooling device |
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| Publication Number | Publication Date |
|---|---|
| CN112306200A CN112306200A (en) | 2021-02-02 |
| CN112306200B true CN112306200B (en) | 2025-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911419510.1A Active CN112306200B (en) | 2019-12-31 | 2019-12-31 | Computer chip cooling device |
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| CN (1) | CN112306200B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114003111A (en) * | 2021-10-26 | 2022-02-01 | 紫光股份有限公司 | Heat dissipation equipment for computer chip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210721349U (en) * | 2019-12-31 | 2020-06-09 | 苏州溢博伦光电仪器有限公司 | Computer chip heat abstractor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100727664B1 (en) * | 2003-11-28 | 2007-06-13 | 엘지전자 주식회사 | Heat shield for portable computers |
| CN103365386A (en) * | 2013-07-12 | 2013-10-23 | 凝辉(天津)科技有限责任公司 | Heat-dissipating docking station of notebook computer |
| CN103399623A (en) * | 2013-07-12 | 2013-11-20 | 凝辉(天津)科技有限责任公司 | Laptop drive bay radiation extended device |
| CN103336565A (en) * | 2013-07-12 | 2013-10-02 | 凝辉(天津)科技有限责任公司 | Notebook computer battery bin heat dissipating expanding device |
| CN103336564A (en) * | 2013-07-12 | 2013-10-02 | 凝辉(天津)科技有限责任公司 | Tablet personal computer heat dissipation docking station |
| CN203689297U (en) * | 2013-07-12 | 2014-07-02 | 天津恒基晟达科技有限公司 | Cooling dock station of PPC (Panel Personal Computer) |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210721349U (en) * | 2019-12-31 | 2020-06-09 | 苏州溢博伦光电仪器有限公司 | Computer chip heat abstractor |
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| CN112306200A (en) | 2021-02-02 |
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Effective date of registration: 20241218 Address after: 361000 room 4101, No. 131, xinjingdongli, Haicang District, Xiamen City, Fujian Province Applicant after: Xiamen Trustworthy Technology Co.,Ltd. Country or region after: China Address before: Room 301, building m2, micro system Park, No.2, Peiyuan Road, science and Technology City, Suzhou high tech Zone, Jiangsu Province, 215011 Applicant before: Suzhou yibolun Photoelectric Instrument Co.,Ltd. Country or region before: China |
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