CN112289729B - Adsorption device and die bonding machine for die bonding - Google Patents
Adsorption device and die bonding machine for die bonding Download PDFInfo
- Publication number
- CN112289729B CN112289729B CN201910669625.XA CN201910669625A CN112289729B CN 112289729 B CN112289729 B CN 112289729B CN 201910669625 A CN201910669625 A CN 201910669625A CN 112289729 B CN112289729 B CN 112289729B
- Authority
- CN
- China
- Prior art keywords
- area
- connecting sub
- notch
- adsorption
- elastic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明公开了一种固晶用的吸附装置及固晶机，该吸附装置包括：吸附区，贴覆有弹性材料，弹性材料上设置有至少两个微孔，每个微孔的孔径大于或等于0.01毫米；非吸附区，设置有至少一个贯通孔，非吸附区包括连接子区，连接子区与吸附区的弹性材料直接连接，用于支撑弹性材料，连接子区的材料是刚性材料；其中，吸附区和非吸附区共同形成空腔，贯通孔与空腔连通，贯通孔用于连接外界的真空装置，吸附装置在外界的真空装置的真空作用下能够通过吸附区的弹性材料上的至少两个微孔一次性吸取两个以上的晶片。通过这种方式，本发明能够高效率固晶，成本低廉，且不会压伤晶片或者漏吸晶片。
The present invention discloses an adsorption device and a crystal bonding machine for crystal bonding, the adsorption device comprises: an adsorption area, which is covered with an elastic material, and the elastic material is provided with at least two micropores, and the aperture of each micropore is greater than or equal to 0.01 mm; a non-adsorption area, which is provided with at least one through hole, and the non-adsorption area includes a connecting sub-area, and the connecting sub-area is directly connected to the elastic material of the adsorption area, and is used to support the elastic material, and the material of the connecting sub-area is a rigid material; wherein the adsorption area and the non-adsorption area jointly form a cavity, and the through hole is connected to the cavity, and the through hole is used to connect to an external vacuum device, and the adsorption device can absorb more than two wafers at a time through at least two micropores on the elastic material of the adsorption area under the vacuum action of the external vacuum device. In this way, the present invention can efficiently bond the crystal, with low cost, and will not crush the wafer or leak the wafer.
Description
Technical Field
The invention relates to the technical field of die bonding, in particular to an adsorption device for die bonding and a die bonder.
Background
Die bonding is also known as Die Bond or Die attach, i.e., a process in which a Die is bonded to a designated area of a support by a glue (typically a conductive or insulating glue for LEDs) to form a thermal or electrical path that provides conditions for subsequent wire bonding.
In the conventional die bonding process, after a mechanical ejector pin is used to eject a wafer, the wafer is sucked by a vacuum suction nozzle and placed on a substrate. With the development of the LED packaging industry, the product size is smaller and smaller, and with the product size smaller and smaller, the used bracket and wafer are smaller and smaller. The chip of the mini is below 0.1mm in size, die bonding is carried out by adopting the traditional process, the efficiency is low, the suction nozzle holes with the size of 0.05mm are processed by using rigid materials, the suction nozzles are formed in high-density arrangement, the cost is high, and once the rigid materials need to absorb a plurality of wafers at one time, the thickness of the wafers is inconsistent, the wafers are easily pressed, the pressure injury is caused, the suction nozzles with thin wafers cannot absorb, and the suction leakage phenomenon exists.
Disclosure of Invention
The invention mainly solves the technical problem of providing the adsorption device and the die bonder for die bonding, which can efficiently bond dies, have low cost and can not crush wafers or leak and suck wafers.
In order to solve the technical problems, the technical scheme includes that the adsorption device for die bonding comprises an adsorption area, an adsorption through area and a non-adsorption area, wherein an elastic material is adhered to the adsorption area, at least two micropores are formed in the elastic material, the pore diameter of each micropore is larger than or equal to 0.01 millimeter, the non-adsorption area is provided with at least one through hole, the non-adsorption area comprises a connection sub area, the connection sub area is directly connected with the elastic material of the adsorption area and is used for supporting the elastic material, the material of the connection sub area is a rigid material, the adsorption area and the non-adsorption area jointly form a cavity, the through holes are communicated with the cavity, the through holes are used for connecting an external vacuum device, and the adsorption device can absorb more than two wafers at one time through the at least two micropores in the elastic material of the adsorption area under the vacuum action of the external vacuum device.
Wherein the through hole is arranged in the connection subarea.
Wherein the non-adsorption zone further comprises a non-linker zone.
Wherein two opposite said connection sub-areas and one said non-connection sub-area at the bottom together form a square notch, said elastic material being applied over said notch.
The non-adsorption area is integrally formed into the notch, the notch is made of rigid materials, and the through hole is formed in the bottom of the notch.
The connecting sub-areas are L-shaped, the two connecting sub-areas are inverted L-shaped and are oppositely arranged to form a first notch and a second notch which are opposite, the opening of the first notch is smaller than that of the second notch, the through hole is arranged on the long side of one connecting sub-area, the elastic material is in a linear shape and covers and seals the first notch in a manner of completely covering the short side of the connecting sub-area, the non-connecting sub-area is in a linear shape and covers and seals the second notch in a manner of completely covering the end of the long side of the connecting sub-area, the material of the non-connecting sub-area is sealing material, and the length of the elastic material is equal to that of the sealing material.
The device comprises a connecting subarea, a through hole, an adsorption area, an elastic upper cover, an elastic lower cover and a through hole, wherein the connecting subarea is of an integrally formed L shape, the two connecting subareas are of inverted L-shaped and are oppositely arranged to form a first notch and a second notch which are opposite, the opening of the first notch is smaller than that of the second notch, the through hole is arranged on the long side of one connecting subarea, the non-connecting subarea is of a linear shape and covers the second notch in a mode of completely covering the bottom end part of the long side of the connecting subarea, the elastic upper cover and the elastic lower cover are made of elastic materials, the elastic lower cover is sleeved outside the long side of the two connecting subareas and outside the non-connecting subarea, the elastic upper cover and the elastic lower cover are sealed, the elastic upper cover is provided with the adsorption area at the position corresponding to the first notch, and the elastic lower cover is provided with the through hole at the position corresponding to the through hole of one connecting subarea.
The heat-shrinkable sleeve upper cover is sleeved and sealed outside short-side sides of the two connection sub-areas, outside part of long-side sides of the short-side sides and outside part of the non-connection sub-areas, the heat-shrinkable sleeve upper cover is sleeved and sealed outside part of long-side sides of the two connection sub-areas, outside part of long-side sides of the short-side sides, top ends of the long-side sides and the second notch of the two connection sub-areas, the heat-shrinkable sleeve upper cover is provided with the adsorption area at positions corresponding to the second notch, and the heat-shrinkable sleeve lower cover is provided with the two through holes at corresponding positions.
The elastic material comprises a thin plastic material, a rubber material and a silica gel material, wherein the thin plastic material comprises polyethylene terephthalate, polypropylene and polyvinyl chloride.
In order to solve the technical problems, the invention adopts another technical scheme that a die bonder is provided, and the die bonder comprises the adsorption device as set forth in any one of the above.
The adsorption device has the advantages that the adsorption device is different from the prior art, the elastic material is elastic, the elastic material deforms under stress, the size of the original shape can be quickly restored after external force is removed, when the micropores on the elastic material absorb a plurality of wafers, even if the thicknesses of the wafers are inconsistent, the vacuum acting force can be increased for the wafers with thin thickness, so that the suction leakage phenomenon can be prevented, meanwhile, when the vacuum acting force is increased, the elastic material deforms when being stressed due to the elasticity, the wafers with thick thickness cannot be crushed due to compression, the micropores on the elastic material can absorb a plurality of wafers, the die fixing efficiency can be improved through the mode, the elastic material is a cheap and easily obtained material, and in addition, compared with the process of the micropores on the rigid material, the process of the micropores on the elastic material is easier.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
FIG. 1 is a schematic diagram of an adsorption apparatus for die bonding according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an adsorption apparatus for die bonding according to another embodiment of the present invention;
FIG. 3 is a schematic view of an adsorption apparatus for die bonding according to another embodiment of the present invention;
FIG. 4 is a schematic view of an adsorption apparatus for die bonding according to another embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1 to 4, fig. 1 to 4 are schematic structural views of four embodiments of an adsorption apparatus for die bonding according to the present invention, which includes an adsorption zone 1 and a non-adsorption zone 2.
The adsorption zone 1 is adhered with an elastic material 11, at least two micropores 12 are arranged on the elastic material 11, the pore diameter of each micropore 12 is larger than or equal to 0.01 millimeter, the non-adsorption zone 2 is provided with at least one through hole 21, the non-adsorption zone 2 comprises a connection sub-zone 22, the connection sub-zone 22 is directly connected with the elastic material 11 of the adsorption zone 1 and is used for supporting the elastic material 11, and the material of the connection sub-zone 22 is a rigid material 221.
Wherein, the adsorption zone 1 and the non-adsorption zone 2 together form a cavity 3, the through hole 21 is communicated with the cavity 3, the through hole 21 is used for connecting an external vacuum device, and the adsorption device can absorb more than two wafers at one time through at least two micropores 12 on the elastic material 11 of the adsorption zone 1 under the vacuum action of the external vacuum device.
The elastic material 11 is elastic, and deforms when subjected to a force, and returns to the original shape after the external force is removed. When the micro holes 12 on the elastic material 11 absorb a plurality of wafers, even if the thicknesses of the wafers are not uniform, the vacuum acting force can be increased for the wafers with thin thickness, so that the suction leakage phenomenon can be prevented, and meanwhile, when the vacuum acting force is increased, the elastic material 11 is elastic, and can deform when stressed, so that the wafers with thick thickness cannot be crushed due to compression. Since the micro holes 12 on the elastic material 11 can suck up a plurality of wafers, the die bonding efficiency can be improved in this way.
The elastic material 11 includes, but is not limited to, a thin plastic material including, but not limited to, polyethylene terephthalate (PET, polyethylene Terephthalate), polypropylene (PP), polyvinyl chloride (PVC, polyvinyl Chloride), a rubber material, a silicone material, and the like. The elastic materials 11 are all inexpensive and readily available materials, and the processing of the micro-holes 12 in the elastic materials 11 is also easier than the processing of micro-holes in rigid materials. The micro-holes 12 are formed in the elastic material 11 by, for example, laser drilling, needle drilling, or the like.
The elastic material 11 is elastic, generally has low hardness, is relatively soft, and requires a rigid material having a certain rigidity to support the elastic material 11. Thus, the non-absorbent region 2 comprises a connection sub-region 22, the connection sub-region 22 being directly connected to the elastic material 11 of the absorbent region 1 for supporting the elastic material 11, the material of the connection sub-region 22 being a rigid material 221. The rigid material 221 may be a metallic material or a nonmetallic material.
The elastic material 11 of the suction area 1 and the connection sub-area 22 are directly connected, for example, by bonding a metal material and an elastic material with an organic material if the rigid material 221 is a metal material, or by infrared welding, heating pipe welding, ultrasonic welding, laser welding, etc. if the rigid material 221 is a non-metal material.
In order to allow the micro-holes 12 in the elastic material 11 to pick up the wafer, it is necessary to ensure that the suction zone 1 and the non-suction zone 2 together form a cavity 3 which can be nearly in a vacuum state. In order to bring the cavity 3 close to the vacuum state, it is necessary to introduce a vacuum device from the outside, and therefore, the outside vacuum device is connected through at least one through hole 21 provided in the non-adsorbing region 2. The adsorption device can absorb more than two wafers at one time through at least two micropores 12 on the elastic material 11 of the adsorption zone 1 under the vacuum action of the external vacuum device.
In the embodiment of the invention, the adsorption area 1 and the non-adsorption area 2 of the adsorption device jointly form the cavity 3, the through hole 21 is communicated with the cavity 3, the through hole 21 is used for being connected with an external vacuum device, the adsorption area 1 is pasted with the elastic material 11, the elastic material 11 is provided with at least two micropores 12, and the adsorption device can absorb more than two wafers at one time through the at least two micropores 12 on the elastic material 11 of the adsorption area 1 under the vacuum action of the external vacuum device. The adsorption device can absorb more than two wafers at one time, so that the die bonding efficiency can be improved, when the micropores 12 on the elastic material 11 absorb a plurality of wafers, even if the thicknesses of the wafers are inconsistent, the vacuum acting force can be increased for the wafers with small thickness, so that the suction leakage phenomenon can be prevented, meanwhile, when the vacuum acting force is increased, the elastic material 11 is elastic, the elastic material 11 deforms when stressed, the wafers with large thickness cannot be crushed due to compression, in addition, the elastic material 11 is a cheap and easily obtained material, and the micropores 12 are processed on the elastic material 11 more easily compared with the rigid material, so that the cost is low.
Wherein the non-adsorption zone 2 further comprises a non-connecting sub-zone 23. In other embodiments, the non-adsorption zone 2 may also not include the non-connection sub-zone 23, for example, the connection sub-zone 22 is directly connected together, specifically, the connection sub-zone 22 has a semicircular cross section (in which the cavity 3 has a hemispherical shape), a straight line (in which two straight line connection sub-zones 22 are directly connected, in which the cavity 3 has a triangular shape), and so on.
Referring to fig. 2 and 3, the through-hole 21 may be provided in the connection sub-region 22. Referring to fig. 1 and 4, the through-hole 21 may also be provided in the non-connection sub-region 23. The number of the through holes 21 may be one or two or more. The arrangement positions and the number of the through holes 21 are determined according to practical applications, and are not limited herein.
Referring to fig. 1 to 4, in one embodiment, two opposing connection sub-areas 22 and a bottom non-connection sub-area 23 together form a square-shaped slot, over which the elastic material 11 is applied, i.e. the cavity 3 is square-shaped.
Specifically, referring to fig. 1, in an embodiment, the non-adsorption zone 2 is integrally formed as a notch, the material of the notch is a rigid material 221, that is, the connection sub-zone 22 and the non-connection sub-zone 23 are integrally formed, the material of the connection sub-zone 22 and the non-connection sub-zone 23 is a rigid material 221, and the through hole 21 is disposed at the bottom of the notch, that is, the through hole 21 is disposed at the non-connection sub-zone 23.
Referring to fig. 2, in another embodiment, the connection sub-areas 22 are integrally formed in an L shape, the two connection sub-areas 22 are oppositely arranged in an inverted L shape to form a first notch 31 and a second notch 32 which are opposite, the opening of the first notch 31 is smaller than the opening of the second notch 32, the through hole 21 is arranged on the long side of one of the connection sub-areas 22, the elastic material 11 is in a straight line shape, which covers and seals the first notch 31 in a manner of completely covering the short side of the connection sub-area 22, the non-connection sub-area 23 is in a straight line shape, which covers and seals the second notch 32 in a manner of completely covering the end of the long side of the connection sub-area 22, the material of the non-connection sub-area 23 is a sealing material 231, and the length of the elastic material 11 is equal to the length of the sealing material 231.
In the present embodiment, the elastic material 11 covers the first notch 31 and also completely covers the short side of the sealing connection sub-area 22, and the processing manner of the direct connection of the elastic material 11 and the rigid material is described above.
In the present embodiment, the non-connection sub-area 23 covers the end portion of the long side of the seal-connection sub-area 22, while covering the seal-second notch 32. The non-connection sub-area 23 and the connection sub-area 22 are directly connected, for example, if the rigid material and the sealing material 231 are both metal materials, a weldable material is plated on the surface of the metal materials, welding can be performed by using preset metal welding tabs and metal solders, or resistance welding, laser welding, etc., and if the rigid material and the sealing material are both non-metal materials, infrared welding, heating pipe welding, ultrasonic welding, laser welding, organic material bonding, etc. can be performed.
Referring to fig. 3, in a further embodiment, the connection sub-areas 22 are integrally formed in an L shape, the two connection sub-areas 22 are oppositely arranged in an inverted L shape to form a first notch 31 and a second notch 32 which are opposite, the opening of the first notch 31 is smaller than the opening of the second notch 32, the through hole 21 is arranged on the long side of one of the connection sub-areas 22, the non-connection sub-areas 23 are in a straight line shape and cover the second notch 32 in a manner of completely covering the bottom end part of the long side of the connection sub-area 22, the device further comprises an elastomer upper cover 41 and an elastomer lower cover 42, the materials of the elastomer upper cover 41 and the elastomer lower cover 42 are elastic materials, the elastomer lower cover 42 is sleeved outside the long side of the two connection sub-areas 22 and outside the non-connection sub-area 23, the elastomer upper cover 41 covers and seals on the elastomer lower cover 42, the elastomer upper cover 41 is provided with an adsorption area 1 at a position corresponding to the first notch 31, and the elastomer lower cover 42 is provided with a first corresponding through hole 43 at a position corresponding to the through hole 21 of one of the connection sub-areas 22.
In the present embodiment, the elastic body upper cover 41 and the elastic body lower cover 42 may be sealed by using a processing method such as infrared welding, heating pipe welding, ultrasonic welding, laser welding, etc.
Referring to fig. 4, in a further embodiment, the connection sub-areas 22 are integrally formed in an L shape, the two connection sub-areas 22 are oppositely arranged in the L shape to form a first notch 31 and a second notch 32 which are opposite, the opening of the first notch 31 is smaller than the opening of the second notch 32, the non-connection sub-area 23 is in a straight line shape and is arranged in the middle of the first notch 31 and is respectively spaced from the two connection sub-areas 22 to form two through holes 21, the device further comprises a heat-shrinkable sleeve upper cover 51 and a heat-shrinkable sleeve lower cover 52, the heat-shrinkable sleeve lower cover 52 is sleeved and sealed on the short side of the two connection sub-areas 22, a part of the long side close to the short side and the outside of the non-connection sub-area 23, the heat-shrinkable sleeve upper cover 51 is sleeved and sealed on the top end of the part of the long side of the two connection sub-areas 22, which is far from the long side, and the second notch 32, the heat-shrinkable sleeve upper cover 51 is provided with an adsorption area 1 at a position corresponding to the second notch 32, and the heat-shrinkable sleeve lower cover 52 is respectively provided with two second corresponding through holes 53 at a position corresponding to the two through holes 21.
Specifically, the heat shrink lower cover 52 is fitted over and sealed to the outside of the short side of the two connection sub-areas 22, the outside of a part of the long side immediately adjacent to the short side, and the outside of the non-connection sub-area 23, and the heat shrink upper cover 51 is fitted over and sealed to the outside of a part of the long side of the two connection sub-areas 22 distant from the short side, the tip of the long side, and the second notch 32.
Wherein, the connection subarea 22 and the non-connection subarea 23 are both made of rigid materials, and when the heat-shrinkable sleeve is manufactured, the upper cover and the lower cover are sealed by adopting an organic material bonding mode to be made into the heat-shrinkable sleeve, and the heat-shrinkable sleeve is heated to cover the rigid materials.
The embodiment of the invention also provides a die bonder, which comprises the adsorption device. For detailed description of the related contents, please refer to the above-mentioned adsorption device portion, and detailed description thereof is omitted.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910669625.XA CN112289729B (en) | 2019-07-24 | 2019-07-24 | Adsorption device and die bonding machine for die bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910669625.XA CN112289729B (en) | 2019-07-24 | 2019-07-24 | Adsorption device and die bonding machine for die bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112289729A CN112289729A (en) | 2021-01-29 |
| CN112289729B true CN112289729B (en) | 2025-03-11 |
Family
ID=74418715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910669625.XA Active CN112289729B (en) | 2019-07-24 | 2019-07-24 | Adsorption device and die bonding machine for die bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112289729B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11245163A (en) * | 1998-03-03 | 1999-09-14 | Fujikoshi Mach Corp | Method and device for adhering wafer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217276A (en) * | 2001-01-17 | 2002-08-02 | Ushio Inc | Stage equipment |
| JP2013187393A (en) * | 2012-03-08 | 2013-09-19 | Tokyo Electron Ltd | Bonding device and bonding method |
| JP5918003B2 (en) * | 2012-04-27 | 2016-05-18 | Ｔｏｗａ株式会社 | Vacuum suction sheet for singulation device and method for manufacturing fixing jig using the same |
| KR101640743B1 (en) * | 2014-10-14 | 2016-07-19 | 안성룡 | A flexible vacuum chuck |
| JP6685245B2 (en) * | 2017-02-08 | 2020-04-22 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
-
2019
- 2019-07-24 CN CN201910669625.XA patent/CN112289729B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11245163A (en) * | 1998-03-03 | 1999-09-14 | Fujikoshi Mach Corp | Method and device for adhering wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112289729A (en) | 2021-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5652940B2 (en) | Semiconductor chip attaching apparatus and semiconductor chip attaching method | |
| JP6967411B2 (en) | Semiconductor manufacturing equipment, semiconductor equipment manufacturing methods and collets | |
| CN101859755A (en) | A kind of power MOSFET packaging body and packaging method thereof | |
| JP6612723B2 (en) | Board device | |
| JP2018160653A5 (en) | ||
| KR20100006154A (en) | Collet for transferring a semiconductor chip and apparatus including the same | |
| JP2009180620A (en) | Device and method for testing bond strength of ic chip | |
| CN112289729B (en) | Adsorption device and die bonding machine for die bonding | |
| JP3757193B2 (en) | Semiconductor chip bonding method and apparatus | |
| US7772025B2 (en) | Electronic device and method of manufacturing the same | |
| KR960039248A (en) | Method of manufacturing probe card | |
| JP7412219B2 (en) | Die bonding equipment, semiconductor device manufacturing method, and peeling equipment | |
| KR100495644B1 (en) | Method for manufacturing semiconductor devices | |
| KR20190018294A (en) | Laminating device and method for fabricating semiconductor package using the same | |
| JP2005150311A (en) | Chip mounting method and apparatus thereof | |
| US10121696B2 (en) | Electronic device package and manufacturing method thereof | |
| JP3092585B2 (en) | Semiconductor chip suction tool and semiconductor device manufacturing method using the tool | |
| CN101003191A (en) | Composite sheet | |
| KR940027134A (en) | Manufacturing method of semiconductor integrated circuit device | |
| CN222471225U (en) | Bonding wire heating base and WB bonding machine | |
| JP5187299B2 (en) | Manufacturing method of semiconductor device | |
| TWI768349B (en) | Chip transfering system and chip tansfering module | |
| US10756045B2 (en) | Connecting device and circuit chip connecting method using connecting device | |
| TWI581382B (en) | Electronic device package and manufacturing method thereof | |
| JP2011054725A (en) | Semiconductor device and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |