CN112279215A - Micro-nano manufacturing device - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims description 98
- 230000033001 locomotion Effects 0.000 claims description 150
- 239000000758 substrate Substances 0.000 claims description 85
- 239000000523 sample Substances 0.000 claims description 35
- 239000002245 particle Substances 0.000 claims description 27
- 239000002105 nanoparticle Substances 0.000 claims description 18
- 230000005540 biological transmission Effects 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 16
- 239000007924 injection Substances 0.000 claims description 16
- 238000006073 displacement reaction Methods 0.000 claims description 9
- 239000012212 insulator Substances 0.000 claims description 3
- 239000002082 metal nanoparticle Substances 0.000 claims description 3
- 239000002096 quantum dot Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
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- 239000002086 nanomaterial Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 3
- 238000007385 chemical modification Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002079 cooperative effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000002073 fluorescence micrograph Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000004654 kelvin probe force microscopy Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- B81—MICROSTRUCTURAL TECHNOLOGY
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- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
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- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0004—Apparatus specially adapted for the manufacture or treatment of nanostructural devices or systems or methods for manufacturing the same
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- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0009—Forming specific nanostructures
- B82B3/0014—Array or network of similar nanostructural elements
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- B82—NANOTECHNOLOGY
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- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0009—Forming specific nanostructures
- B82B3/0019—Forming specific nanostructures without movable or flexible elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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Abstract
The invention relates to the technical field of nanometer, and discloses a micro-nano manufacturing device. Pattern information of a pattern to be formed is provided using a template providing module. And fixing the substrate on a moving table unit of a moving module, and driving the substrate to move according to the pattern information through the moving module. And positioning a manufacturing module on the substrate to a position where the pattern to be formed is required to be formed, and writing electric charges to form the pattern to be formed. The particle introducing module introduces nanoparticles in the area where the pattern is to be formed to form the structure to be formed. The micro-nano manufacturing device provided by the invention can finish electrostatic nano-printing manufacturing of micro-nano structures from nano level to centimeter level and above, solves the problem that a scanning probe technology cannot manufacture large-scale and cross-scale structures, and ensures the accuracy of local details in the nano scale while realizing structure writing in the centimeter or larger range.
Description
Technical Field
The invention relates to the technical field of nanometer, in particular to a micro-nano manufacturing device.
Background
In the existing micro-nano manufacturing technology, the direct writing technology draws wide attention due to the advantages of simple manufacturing process, capability of changing patterns at any time, high flexibility and the like. The principle of the scanning probe technology in the direct writing technology is to modify the surface of a sample by using a sharp scanning probe, and because a scanning probe microscope has nanoscale control precision, a nano structure can be easily manufactured by applying heat, force, electricity and the like on the probe. Most of scanning probes are simple in operation technology, can be carried out in an atmospheric environment, and can be subjected to micro-nano manufacturing by slightly modifying the existing scanning probe microscope. However, since the scanning probe microscope is driven by using the piezoelectric actuator, the movement range of the scanning probe microscope is often limited to be within 100 micrometers, so that the operation range of the scanning probe microscope applied to direct writing processing is limited to be in a sub-millimeter scale, and the application range of the scanning probe microscope in the field of micro-nano manufacturing is greatly limited. Therefore, how to increase the processing range of the scanning probe direct writing technology, processing patterns or devices with various dimensions by using the scanning probe becomes a problem to be solved at present.
Disclosure of Invention
In view of the above, it is necessary to provide a micro-nano manufacturing apparatus for solving the problem of how to increase the processing range of the scanning probe direct writing technology and process patterns or devices of various dimensions by using the scanning probe.
A micro-nano manufacturing device comprises a template providing module, a pattern forming module and a micro-nano manufacturing module, wherein the template providing module is used for providing pattern information of a pattern to be formed; the manufacturing module is connected with the template providing module and used for positioning on the substrate according to the pattern information and writing electric charges to form a pattern to be formed; the motion module is connected with the template providing module and is used for controlling the substrate to move according to the pattern information; the motion module comprises a motion table unit for fixing the substrate; and the particle introducing module is used for introducing the nano particles into the area where the pattern is to be formed so as to form the structure to be formed.
According to the micro-nano manufacturing device, the template providing module is used for providing pattern information of a pattern to be formed. And fixing the substrate on a moving table unit of a moving module, and driving the substrate to move according to the pattern information through the moving module. The manufacturing module is positioned on the substrate to a position where the pattern to be formed is required to be formed, and charges are written to form the pattern to be formed. After the pattern to be formed is formed, the nanoparticles are introduced into the area where the pattern is located by using the particle introduction module so as to form the structure to be formed. According to the micro-nano manufacturing device provided by the invention, when the electric charge is written to form the pattern, the electric charge direct writing capability of the manufacturing module is utilized, and the operation precision of the manufacturing module is ensured to be the positioning of nano-scale precision; when the large-scale movement is needed, the movement module is utilized to drive the substrate fixed on the movement module to carry out large-scale movement, so that the control capability in the large-scale manufacturing process is ensured. The micro-nano manufacturing device provided by the invention can be used for completing the electrostatic nano printing manufacturing of micro-nano structures ranging from nano-scale to centimeter-scale and above, solves the problem that the scanning probe technology can not manufacture large-scale and cross-scale structures, and ensures the accuracy of local details in the nano-scale while realizing the structure writing in the centimeter or larger range.
In one embodiment, the manufacturing module comprises a charge injection unit connected with a direct-writing voltage and used for writing charges on the substrate to form the pattern to be formed; and the piezoelectric positioning unit is respectively connected with the template providing unit and the charge injection unit and is used for driving the charge injection unit to perform mobile positioning on the substrate according to the pattern information.
In one embodiment, the charge injection unit includes a conductive nanoprobe.
In one embodiment, the conductive nanoprobes are arranged in a charge writing area opposite to the substrate; before the electric charges are written into the conductive nano probe, the distance between the conductive nano probe and the substrate in the vertical direction is maintained within a preset distance range through the feedback control of the piezoelectric positioning unit, and the position of the conductive nano probe in the direction except the vertical direction is fixed.
In one embodiment, the template providing module further comprises a substrate.
In one embodiment, the motion module further comprises a rotary motion unit for providing rotary motion to power the motion stage unit; the transmission unit is respectively connected with the motion platform unit and the rotary motion unit and is used for converting the rotary motion of the rotary motion unit into linear motion; the rotary motion unit is connected with the transmission unit through the connecting unit, and the motion platform unit is connected with the transmission unit through the connecting unit.
In one embodiment, the micro-nano manufacturing apparatus further includes an electrical control module, which is respectively connected to the manufacturing module, the motion module, and the particle introduction module, and is configured to control electrical inputs of the manufacturing module, the motion module, and the particle introduction module, output a motion control command to control motion of the motion module, and output a write control command to control a charge write operation of the manufacturing module.
In one embodiment, the electrical control module comprises a power supply unit connected to the manufacturing module, the motion module and the particle introduction module, respectively, for providing a voltage to the manufacturing module, the motion module and the particle introduction module; the manufacturing module, the moving module and the particle introducing module are respectively connected with the power supply unit through the switch unit and used for controlling the electrical input of the manufacturing module, the moving module and the particle introducing module; the motion control unit is connected with the motion module and used for outputting a motion control instruction according to the motion control instruction; the motion unit is also used for adjusting the rotation angle and displacement of the motion operation according to the motion control instruction; the writing control unit is connected with the manufacturing unit and used for outputting a writing control instruction; the manufacturing unit is also to adjust a write operation on the substrate according to the write control instructions.
In one embodiment, the nanoparticle is any one of an atom, a molecule, an ion, a cluster, a semiconductor quantum dot, a metal nanoparticle, an insulator nanoparticle, and a superparamagnetic nanoparticle.
In one embodiment, the pattern information includes pattern shape, pattern size, and pattern position information.
Drawings
Fig. 1 is a schematic structural diagram of a micro-nano manufacturing device according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a manufacturing module according to one embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a motion module according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an electrical control module according to an embodiment of the present invention;
FIG. 5 is a diagram illustrating a positional relationship between a conductive nanoprobe and a conductive substrate according to an embodiment of the present invention;
FIG. 6 is a schematic design diagram of a structure to be fabricated according to one embodiment of the present invention;
FIG. 7 is a cross-scale structure diagram under a fluorescence microscope according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "left," "right," "upper," "lower," "front," "rear," "circumferential," and the like are based on the orientation or positional relationship shown in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The technical field of direct writing of nano electrostatic patterns is mainly realized by a scanning probe technology at present, but as a scanning probe microscope needs to use a piezoelectric actuator, the stroke of the scanning probe microscope can only reach 100 micrometers, so that the direct writing processing realization range of the scanning probe microscope is limited to a submillimeter scale, and the application of the scanning probe microscope in the field of micro-nano manufacturing is greatly limited. The processing range of the micro-nano manufacturing device provided by the invention can be from nano level to centimeter level and above, electrostatic nano printing manufacturing of a cross-scale micro-nano structure is completed, the problem that a scanning probe technology cannot manufacture large-scale and cross-scale structures is solved, and the processing precision of local details can be ensured to be in the nano scale while structure writing in the centimeter or larger range is realized.
Fig. 1 is a schematic structural diagram of a micro-nano manufacturing apparatus according to an embodiment of the present invention, in an embodiment, the micro-nano manufacturing apparatus includes a template providing module 100, a manufacturing module 200, a motion module 300, and a particle introducing module 400. The template providing module 100 is used for providing pattern information of a pattern to be formed. The manufacturing module 200 is connected to the template providing module 100, and is configured to position on the substrate according to the pattern information and write charges to form the pattern to be formed. The motion module 300, connected to the template providing module 100, for manipulating the substrate to move according to the pattern information; the motion module 300 includes a motion stage unit 310, and the motion stage unit 310 is used to fix the substrate. The particle introducing module 400 is connected to the moving module 300, and is configured to introduce nanoparticles into the region where the pattern is to be formed, so as to form the structure to be formed.
The micro-nano manufacturing apparatus provides pattern information of a pattern to be formed using the template providing module 100. Wherein, the pattern to be formed can be a pattern with any single scale in the nanometer scale and the above scales. Further, the pattern to be formed may also be a high-precision detail figure of micrometer/nanometer level plus a large-scale structure figure of millimeter or above. Still further, the pattern to be formed may also be a cross-scale pattern having both micro/nano-scale precision details and a working range of millimeters or more. A substrate is fixed on the motion stage unit 310 of the motion module 300, and the motion module 300 moves according to the pattern information, thereby driving the substrate to move to a corresponding position. The manufacturing module 200 is positioned on the substrate to a position where the pattern to be formed is required to be formed according to the pattern information, and writes charges to form the pattern to be formed. After the to-be-patterned is formed, the particle introduction module 400 introduces nanoparticles into the to-be-patterned region to form the to-be-patterned structure.
When electric charges are written in to form a pattern, the micro-nano manufacturing device provided by the invention utilizes the electric charge direct writing capability of the manufacturing module 200 with nano-scale precision to ensure that the operation precision of pattern detail positioning is nano-scale precision; when a large-scale movement is required, the movement module 300 is used to drive the substrate fixed thereon to perform a large-scale movement, so that the control of the large-scale manufacturing can be realized. The micro-nano manufacturing device provided by the invention can be used for completing the electrostatic nano printing manufacturing of micro-nano structures ranging from nano-scale to centimeter-scale and above, solves the problem that the scanning probe technology can not manufacture large-scale and cross-scale structures, and ensures the accuracy of local details in the nano-scale while realizing the structure writing in the centimeter or larger range.
In one embodiment, the template providing module 100 further comprises a substrate. The template providing module 100 forms a substrate having low surface energy by coating a thin electret layer having low surface energy on a conductive substrate. After the manufacturing module 200 is positioned on the substrate with low surface energy to the position where the pattern to be formed is required to be formed according to the pattern information, electric charges are written on the substrate to form the pattern to be formed with high surface energy.
In one embodiment, when the particle introduction module 400 drops a solution composed of nanoparticles on a region of the substrate where a pattern to be formed having a high surface is located, the substrate is rotated at a predetermined rotation speed with a central axis of the substrate as a rotation axis, and the structure to be formed is formed. The central axis of the substrate is an axis perpendicular to the plane of the substrate and passing through the center point of the substrate.
Fig. 2 is a schematic structural diagram of a manufacturing module according to an embodiment of the present invention, in which the manufacturing module 200 includes a charge injection unit 210 and a piezoelectric positioning unit 220. The charge injection unit 210 is connected to a direct-write voltage, and is configured to write charges on the substrate to form the pattern to be formed. The piezoelectric positioning unit is respectively connected to the template providing module 100 and the charge injection unit 210, and is configured to drive the charge injection unit to perform mobile positioning on the substrate according to the pattern information.
The piezoelectric positioning unit 220 is a device capable of providing nanoscale movement and positioning accuracy and submillimeter-scale movement range, and can manipulate the conductive nanoprobe 211 to perform small-range high-accuracy movement. The piezoelectric positioning unit 220 moves according to the nano/micron pattern in the pattern information, so as to drive the charge injection unit 210 connected thereto to move on the substrate, and the piezoelectric positioning unit 220 can control the motion of the charge injection unit 210 in each direction. After the positioning to the target position, the piezoelectric positioning unit 220 writes charges on the substrate with low surface energy according to the pattern to be formed, so that the substrate generates chemical modification in the region where the charges are written, and a high surface energy pattern with nanometer/micrometer scale and nanometer precision is formed. Alternatively, the charge injection unit 210 may write charges on the substrate with low surface energy by applying an electron beam or applying an ion beam, so that the substrate is chemically modified in the region where the charges are written.
In one embodiment, the charge injection unit 210 includes a conductive nanoprobe 211. The conductive nanoprobe 211 has the capability of injecting charges on the substrate with low surface energy after being applied with a voltage for direct writing. The conductive nanoprobe 211 is driven by the piezoelectric positioning unit 220 to move according to the pattern information, and charges are injected into the pattern forming region on the substrate. In addition, when a continuous pattern is formed, a continuous voltage is provided by the direct-write voltage applied to the conductive nanoprobe 211; when discrete patterns are formed, when the conductive nanoprobe 211 moves to a region corresponding to each pattern forming point, a high-voltage pulse provided by a direct-writing voltage applied to the conductive nanoprobe 211 is respectively applied, and when the piezoelectric positioning unit 220 drives the conductive nanoprobe 211 to realize the moving and positioning functions, no voltage is applied thereto.
In one embodiment, the conductive nanoprobe 211 may be an atomic force microscope probe.
Fig. 3 is a diagram illustrating a positional relationship between a conductive nanoprobe and a substrate according to an embodiment of the present invention, wherein the conductive nanoprobe 211 is disposed opposite to a charge writing region of the substrate according to an embodiment of the present invention. Before the electric charges are written into the conductive nanoprobe 211, the distance between the conductive nanoprobe 211 and the substrate in the vertical direction is maintained within a preset distance range by using the feedback control of the piezoelectric positioning unit 220, and the position of the conductive nanoprobe in the direction other than the vertical direction is fixed. The conductive nanoprobe 211 in the manufacturing module 200 is placed right above the substrate, and the distance between the conductive nanoprobe 211 and the substrate in the vertical direction is adjusted by the piezoelectric positioning unit 220 to keep a small distance therebetween, the distance is generally controlled within a range of 10 nm to 100 nm, and a specific placement diagram between the conductive nanoprobe 211 and the substrate is shown in fig. 3. After the conductive nanoprobe 211 is kept closer to the substrate, a direct-write voltage may be applied to the conductive nanoprobe 211 to inject charges on the substrate.
Fig. 4 is a schematic structural diagram of a motion module according to an embodiment of the present invention, in which the motion module 300 can be used for positioning in a large range, the positioning accuracy can reach micron level, and the positioning range can reach centimeter level and above. The motion module 300 further includes a rotational motion unit 320, a transmission unit 330, and a connection unit 340. The rotation motion unit 320 is used for providing rotation motion to power the motion stage unit 310. The transmission unit 330 is respectively connected to the motion stage unit 310 and the rotational motion unit 320, and is configured to convert the rotational motion of the rotational motion unit 320 into a linear motion. The connection unit 340, the rotation motion unit 320 are connected to the transmission unit 330 through the connection unit 340, and the motion stage unit 310 is connected to the transmission unit 330 through the connection unit 340.
Alternatively, the moving table unit 310 in the moving module 300 may be a linear displacement table with any number of axes, and may also be a sliding table or a sliding block with any number of axes.
Alternatively, the rotary motion unit 320 in the motion module 300 may be any motor.
Alternatively, the transmission unit 330 in the motion module 300 may be any one of a micrometer and a ball screw.
Optionally, the connection unit 340 in the motion module 300 may be a coupling or a combination of a coupling and a flexible shaft.
The moving table unit 310 is configured to fix the substrate and drive the substrate to realize a large-scale movement according to the pattern to be formed. The motion precision of the motion table unit 310 can reach the micron level, and the motion range is in the order of centimeters and above. The rotational movement unit 320 may be used to provide rotational movement of any angle to power the motion stage unit 310. The transmission unit 330 converts the rotational motion provided by the rotational motion unit 320 into a linear motion, and drives the motion stage unit 310 to perform a linear motion. The connection unit 340 is used to connect the rotation motion unit 320 and the transmission unit 330, and connect the transmission unit 330 and the motion stage unit 310, respectively. The motion module 300 operates the substrate fixed on the motion stage unit 310 to move in a micrometer-scale precision and a centimeter-scale and above motion range under the cooperative action of the motion stage unit 310, the rotational motion unit 320, the transmission unit 330 and the connection unit 340.
Since the substrate is fixed on the moving stage unit 310 of the moving module 300, a distance between the conductive nanoprobe 211 and the substrate in a vertical direction is maintained within 10 nm to 100 nm. The motion module 300 moves the motion stage unit 310 in directions other than the vertical direction according to a preset pattern, so as to drive the substrate to move, and further, can control the relative motion between the conductive nanoprobe 211 and the substrate, so as to inject charges on the substrate to form a large-range high surface energy pattern region.
Fig. 5 is a schematic structural diagram of a micro-nano manufacturing apparatus according to another embodiment of the present invention, in one embodiment, the micro-nano manufacturing apparatus further includes an electrical control module 500. The electrical control module 500 is connected to the manufacturing module 200, the motion module 300, and the particle introduction module 400, respectively, and is configured to control electrical inputs of the manufacturing module 200, the motion module 300, and the particle introduction module 400, output a motion control command to control motion of the motion module 300, and output a write control command to control a charge write operation of the manufacturing module 200.
In one embodiment, the electrical control module 500 includes a power supply unit 510, a switch unit 520, a motion control unit 530, and a write control unit 540. The power supply unit 510 is connected to the manufacturing module 200, the moving module 300, and the particle introduction module 400, respectively, and is configured to supply a voltage to the manufacturing module 200, the moving module 300, and the particle introduction module 400. The switching unit 520, the manufacturing module 200, the moving module 300, and the particle introduction module 400 are respectively connected to the power supply unit 510 through the switching unit 520, for controlling electrical inputs of the manufacturing module 200, the moving module 300, and the particle introduction module 400. When the micro-nano manufacturing device provided by the invention needs to be used for manufacturing, the electrical control module 500 controls the electrical input of the power supply unit 510 to the manufacturing module 200, the motion module 300 and the particle introduction module 400 by controlling the on and off of the switch unit 520.
The electric control module 500 outputs a motion control command to the motion module 300 according to the position information of the pattern to be formed through the motion control unit 530 connected to the motion module 300, and the motion unit may adjust the rotation angle of the rotation motion unit 320 and the displacement of the motion stage unit 310 according to the motion control command.
The electric control module 500 outputs a write control command to the manufacturing module 200 by using the write control unit 540 connected to the manufacturing module 200. The manufacturing module controls the voltage output of the direct-write voltage according to the write control command, and adjusts the write operation on the substrate by changing the magnitude and duration of the voltage applied to the conductive nanoprobe 211. For example, when a continuous pattern is formed, a continuous voltage is supplied to the conductive nanoprobe 211; when discrete patterns are formed, when the conductive nanoprobe 211 moves to a region corresponding to each pattern forming point, a high voltage pulse is applied to the conductive nanoprobe 211, and when the piezoelectric positioning unit 220 drives the conductive nanoprobe 211 to realize the moving and positioning functions, no voltage is applied thereto.
In one embodiment, the nanoparticle is any one of an atom, a molecule, an ion, a cluster, a semiconductor quantum dot, a metal nanoparticle, an insulator nanoparticle, and a superparamagnetic nanoparticle.
In one embodiment, the micro-nano manufacturing device can also be used for splicing different structures. After the pattern to be formed or the structure to be formed is successfully written on the substrate having low surface energy, the pattern information of the next pattern to be formed may be provided again by the template providing module 100. The piezoelectric positioning unit 220 controls the conductive nanoprobe 211 to move to a region to be written with electric charge according to new pattern information, and writes electric charge on the substrate with low surface energy, so that the substrate realizes chemical modification in the region to be written with electric charge, and forms a second pattern with high surface energy, thereby realizing splicing of different patterns.
Specifically, the surface potential of the region can be measured in situ after writing charges by using a kelvin Probe technology (KPFM, Kalvin Probe Force Microscope), so that the formed pattern is measured, and after the position information of the formed pattern and the preset position information of the second pattern are obtained, the relative displacement of the formed pattern and the second pattern in each direction can be calculated. The conductive nanoprobe 211 can be accurately moved to any position on the formed pattern by the piezoelectric positioning unit 220, and then the piezoelectric positioning unit 220 or the motion module 300 is manipulated to move by a corresponding length to move the conductive nanoprobe 211 to the region to be written of the second pattern. At this time, according to the provided new pattern information, the previous micro-nano manufacturing steps are repeated, the direct writing voltage is applied to the conductive nano probe 211, and the conductive nano probe moves according to the preset path of the second pattern template, so that a second pattern is obtained on the substrate. After the trans-scale pattern is formed, nanoparticles are introduced into the high surface energy pattern region on the substrate by the particle introduction module 400, and the nanoparticles are precisely adsorbed to the pattern region by the high surface energy to form the trans-scale pattern structure.
In one embodiment, the pattern information includes pattern shape, pattern size, and pattern position information. Wherein the pattern position information includes at least two of position coordinates, center coordinates, and pattern dimensions.
In one embodiment, the unit of the operation accuracy of the manufacturing module 200 and the motion module 300 is in the nanometer/micrometer scale, and the unit of the motion range of the manufacturing module 200 and the motion module 300 is in the centimeter or larger scale. Alternatively, both the piezoelectric positioning unit 220 and the motion module 300 may be used for positioning. The piezoelectric positioning unit 220 is used for performing high-precision positioning in a small range, wherein the positioning precision is in a nanometer level, and the positioning range is in a micrometer level; the latter motion module 300 is used for positioning with a precision of the order of micrometers over a wide range, which depends on the total range of travel of the motion stage unit 310 used, typically on the order of centimeters or more. The piezoelectric positioning unit 220 is used for controlling the movement of the conductive nanoprobe 211, and the motion module 300 is used for controlling the substrate to move.
In this embodiment, the micro-nano manufacturing apparatus provided by the present invention is used to manufacture a lattice having a range of millimeter level and a period of micron level on the upper surface of the substrate with low surface energy, and a micron-level triangular pattern composed of points with nano-scale intervals is spliced at the right vertex angle of the lattice to describe an implementation step of manufacturing a cross-scale pattern. The cross-scale pattern had a lattice period of 21 microns and a size of 55 x 5, with the dot missing at the right apex to place the micron-sized triangles. The distance between two points of the micron-sized triangular pattern is 500 nanometers, and the side length is 10 micrometers. The specific design pattern is shown in fig. 6, and fig. 6 is a schematic design diagram of a structure to be manufactured according to an embodiment of the present invention.
First, the template providing module 100 prepares a substrate having a low surface energy by coating a layer of electret material having a low surface energy on a conductive substrate. The substrate is placed on the moving stage unit 310 in the moving module 300 and grounded. The conductive nanoprobe 211 in the manufacturing unit 200 is placed right above the substrate, and the distance between the conductive nanoprobe 211 and the substrate is adjusted by the piezoelectric positioning unit 220 to keep a very close distance, and the distance is generally controlled to be in the range of 10 nm to 100 nm.
In the present embodiment, the motion module 300 can provide motion with micron and above precision. The motion stage unit 310 in the motion module 300 is selected from an XY-axis linear displacement stage. The transmission unit 330 uses a micrometer, the total stroke of the micrometer is 10 mm, and the distance of movement of the micrometer in every 360 degrees of rotation is 0.5 mm. The rotary motion unit 320 adopts a two-phase four-wire stepping motor; the connecting unit 340 is a combination of a coupler and a flexible shaft. The stepping motor is connected with a micrometer through a flexible shaft and a coupler, and the micrometer is screwed on the XY axial linear displacement table.
A direct-write voltage is applied to the conductive nanoprobe 211 to make the conductive nanoprobe 211 have the capability of injecting charges on the substrate. According to the millimeter-scale array pattern provided by the template providing module 100, the stepping motor is driven to rotate by a corresponding angle according to a preset path of the pattern, so that the XY axis linear displacement table moves by corresponding displacement in each direction, and the millimeter-scale precision pattern with high surface energy can be obtained on the substrate with low surface energy after the step is completed.
The voltage applied to the conductive nanoprobe 211 is turned off, and the motion module 300 is moved to move the conductive nanoprobe 211 to an area where a high-precision pattern is to be written. The written pattern is measured by scanning the conductive nanoprobe 211 in situ over a 50 x 50 micron range using kelvin probe technology to obtain a surface potential map in this region. After confirming that the writing result is correct, the piezoelectric positioning unit 220 is moved according to the surface potential diagram obtained by scanning, and the conductive nanoprobe 211 is accurately moved to the second pattern area to be written. In this embodiment, this region is the millimeter array right vertex.
The piezoelectric positioning unit 220 is used for accurately positioning the initial point of the pattern to be written, then a direct writing voltage is applied to the conductive nanoprobe 211, and the piezoelectric positioning unit 220 is used for driving the conductive nanoprobe 211 to accurately move according to the pattern design information of the high-precision micron-scale triangle, so that the triangle pattern region with the high surface energy and the nanometer-scale interval and the micron-scale range on the substrate with the low surface energy is obtained.
The result of the written pattern was measured by scanning the area of the written pattern by kelvin probe technique to obtain a surface potential map of the area. It should be noted that, in this embodiment, there is no order difference between the micrometer-scale triangular pattern and the millimeter-scale dot matrix pattern in the manufacturing process, and the cross-scale pattern can be manufactured as long as the conductive nanoprobe 211 can be correctly aligned to the region to be engraved on the substrate.
Finally, a CsPbBr3 nanoparticle solution with a concentration of 0.1mg/ml was dropped onto the area where the pattern had been written on the substrate, and the substrate was rotated at a preset speed, thereby forming a pattern across the scale. In the present embodiment, the rotation speed is 1000 rpm. The pattern produced can be observed with a fluorescence microscope. Fig. 7 is a structure of the cross-scale pattern under a 4-fold lens of a fluorescence microscope, which includes a micrometer/nanometer high-precision pattern and a millimeter-scale array, and the lower half of fig. 7 is a fluorescence microscope image of an area near the high-precision pattern under the 40-fold lens.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
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