CN112271011A - Packaging method and system of X-ray zone plate - Google Patents
Packaging method and system of X-ray zone plate Download PDFInfo
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- CN112271011A CN112271011A CN202011146882.4A CN202011146882A CN112271011A CN 112271011 A CN112271011 A CN 112271011A CN 202011146882 A CN202011146882 A CN 202011146882A CN 112271011 A CN112271011 A CN 112271011A
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- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
- G21K1/062—Devices having a multilayer structure
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Abstract
本发明涉及一种X射线波带片的封装方法及系统。封装方法包括：获取待封装的X射线波带片的高度；根据所述高度对镀有X射线波带片的多层膜结构的细丝进行切割和抛光；采用微操作臂将切割和抛光后的波带片移动到氮化硅薄膜窗口上；利用FEB/FIB沉积技术将所述切割和抛光后的波带片固定在所述氮化硅薄膜窗口上。本发明使封装后波带片紧贴并牢固固定在氮化硅薄膜上，可以确保成像过程中波带片与入射X射线的垂直性，有利于提高X射线成像的质量。
The invention relates to a packaging method and system for an X-ray zone plate. The packaging method includes: obtaining the height of the X-ray zone plate to be packaged; cutting and polishing the filament of the multi-layer film structure coated with the X-ray zone plate according to the height; The zone plate is moved to the silicon nitride film window; the cut and polished zone plate is fixed on the silicon nitride film window by using FEB/FIB deposition technology. In the invention, the encapsulated zone plate is closely attached and firmly fixed on the silicon nitride film, which can ensure the verticality of the zone plate and the incident X-ray during the imaging process, and is beneficial to improve the quality of X-ray imaging.
Description
Technical Field
The invention relates to the field of zone plate packaging, in particular to a packaging method and a system of an X-ray zone plate.
Background
The X-ray wavelength is between 0.01nm and 10nm, and the structure with smaller internal dimension of the object can be seen by utilizing the microscopic technology of the X-ray wave band. The microscopic technology of the X-ray wave band has higher resolution, can be used for nondestructive detection and three-dimensional microscopic imaging of substances, and has the potential of carrying out nano resolution imaging on thick samples. The zone plate is a core element of an X-ray microscopic imaging technology, the resolution of the zone plate is basically equivalent to the width of the outermost ring of the zone plate, and therefore, the width of the outermost ring of the zone plate needs to be reduced to realize the high-resolution detection and imaging of X-rays. Meanwhile, in order to improve the diffraction efficiency of the hard X-ray with shorter wavelength, the height of the zone plate needs to be increased, so that the phase difference between two adjacent zones is pi, and the preparation of the zone plate with high resolution and large aspect ratio is the development direction of the hard X-ray diffraction efficiency.
At present, researchers mainly use electron beam exposure and X-ray lithography to prepare X-ray zone plates, and the reported zone plates have the highest resolution of 12nm and the aspect ratio of 2.5: 1, the diffraction efficiency is only 0.6%, the manufacturing process is not only complex and expensive, but also difficult to prepare the X-ray zone plate simultaneously having the nanoscale outermost ring width and the ultra-large height-width ratio, and the application of the zone plate in the field of hard X-rays is limited.
The multi-layer film method is suitable for preparing the X-ray zone plate with a large height-width ratio, namely, two materials are alternately deposited on a rotating filament by a sputtering method, then the two materials are cut into thin sheets, and the thin sheets are polished and thinned to the required thickness. The X-ray zone plate prepared by the process is a circular thin plate with the diameter of several micrometers to several hundred micrometers and the thickness of sub-10 micrometers, and is easily damaged or lost in the operation process, so that the X-ray zone plate is very necessary to be packaged into a part with the size of more than millimeter, which can be observed macroscopically and is convenient to move and operate. The packaging of the current zone plate prepared by a multilayer film method is mainly completed by a method of transferring and fixing the zone plate on a special metal carrier net, and the method has the main difficulty that the zone plate is difficult to be vertically fixed on the special metal carrier net, so that the vertical between the zone plate and incident X-rays in the imaging process is difficult to be ensured, and high-quality X-ray images are difficult to obtain.
Disclosure of Invention
The invention aims to provide a packaging method and a system of an X-ray zone plate, which enable the packaged zone plate to be clung to and firmly fixed on a silicon nitride film, can ensure the verticality of the zone plate and incident X-rays in the imaging process and is beneficial to improving the imaging quality of the X-rays.
In order to achieve the purpose, the invention provides the following scheme:
a method of packaging an X-ray zone plate, comprising:
acquiring the height of an X-ray zone plate to be packaged;
cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate according to the height;
moving the cut and polished zone plate to a silicon nitride film window by adopting a micro-operation arm;
fixing the cut and polished zone plate on the silicon nitride thin film window by using FEB/FIB deposition technology.
Optionally, the obtaining the height of the X-ray zone plate to be encapsulated specifically includes:
by using
Determining the height of an X-ray zone plate to be packaged;
wherein k is 2 pi/λ; beta is a1、β2Is the absorption term of both materials, δ1、δ2T is the zone plate height for the phase terms of the two materials.
Optionally, the cutting and polishing the filament coated with the multilayer film structure of the X-ray zone plate according to the height specifically includes:
and cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate by using a focused ion beam according to the height.
Optionally, the thickness of the silicon nitride film window is 100nm or 200 nm.
An X-ray zone plate packaging system, comprising:
the height acquisition module is used for acquiring the height of the X-ray zone plate to be packaged;
a cutting and polishing module for cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate according to the height;
a moving module for moving the cut and polished zone plate onto the silicon nitride film window by using a micro-operation arm;
an encapsulation module to fix the cut and polished zone plate on the silicon nitride thin film window using FEB/FIB deposition techniques.
Optionally, the height obtaining module specifically includes:
height determination unit for utilizing
Determining the height of an X-ray zone plate to be packaged;
wherein k is 2 pi/λ; beta is a1、β2Is the absorption term of both materials, δ1、δ2T is the zone plate height for the phase terms of the two materials.
Optionally, the cutting and polishing module specifically includes:
and the cutting and polishing unit is used for cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate by using a focused ion beam according to the height.
Optionally, the thickness of the silicon nitride film window is 100nm or 200 nm.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
the invention provides a packaging method and a system of an X-ray zone plate, which are characterized in that a filament plated with a multi-layer film structure of the X-ray zone plate is cut and polished into a sheet with required height; and then moving the zone plate to a selected silicon nitride film window with the thickness of 100nm or 200nm by using a micro-operation arm, and fixing the zone plate on the silicon nitride film window by using an FEB/FIB deposition technology to complete the packaging. The cross section of the zone plate is ensured to be tightly attached and firmly fixed on the silicon nitride film, so that the operation of the zone plate is facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a schematic flow chart of a packaging method for an X-ray zone plate according to the present invention;
fig. 2 is a schematic structural diagram of a packaging system of an X-ray zone plate provided in the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a packaging method and a system of an X-ray zone plate, which enable the packaged zone plate to be clung to and firmly fixed on a silicon nitride film, can ensure the verticality of the zone plate and incident X-rays in the imaging process and is beneficial to improving the imaging quality of the X-rays.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Fig. 1 is a schematic flow chart of a method for packaging an X-ray zone plate provided by the present invention, and as shown in fig. 1, the method for packaging an X-ray zone plate provided by the present invention includes:
s101, acquiring the height of the X-ray zone plate to be packaged.
S101 specifically comprises the following steps:
by using
The height of the X-ray zone plate to be encapsulated is determined.
Wherein k is 2 pi/λ; beta is a1、β2Is the absorption term of both materials, δ1、δ2T is the zone plate height for the phase terms of the two materials.
And S102, cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate according to the height.
S102 specifically comprises the following steps:
and cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate by using a focused ion beam according to the height. When the ion beam cutting and polishing device works, the ion beam is focused on the surface of a cut or polished sample, an etched area is set, and the sample can be cut or polished after a certain time.
The focused ion beam technology is a method for nano-processing and manufacturing materials by using high-intensity focused ion beams. When the sample is bombarded by the high-energy focused ion beam, the kinetic energy of the high-energy focused ion beam is transferred to atomic molecules in the sample to generate a sputtering effect, so that the effect of continuously etching, namely cutting and polishing the sample is achieved. When the ion beam cutting device works, the ion beam is focused on the surface of a cut sample, an etched area is set, and the sample can be cut or polished after a certain time.
And S103, moving the cut and polished zone plate to the silicon nitride film window by using a micro-operation arm.
And S104, fixing the cut and polished zone plate on the silicon nitride film window by using FEB (focused electron beam)/FIB (focused ion beam) deposition technology. The thickness of the silicon nitride film window is 100nm or 200 nm. The window size is 1mm by 1mm, 2mm by 2mm, etc.
The FEB/FIB deposition technology is to focus EB (electron beam)/IB (ion beam) on a point or an area to be deposited, then introduce gas of a material to be deposited to a focus point, and realize the induced deposition of the material by utilizing the ionization effect of the FEB/FIB.
And after the encapsulation is finished, the section of the zone plate is tightly attached and fixed on the silicon nitride film window. The section of the zone plate is tightly attached to the smooth and flat silicon nitride film, and the tight attachment of the section of the zone plate and the two smooth planes of the silicon nitride film ensures that the section of the zone plate is strictly parallel to the plane of the silicon nitride film, namely the surface of the silicon substrate. The encapsulated zone plate can easily and accurately mount the zone plate in an X-ray imaging system and ensure that incident X-rays impinge perpendicularly on the zone plate.
The packaged wave band plate is tightly attached and firmly fixed on the silicon nitride film, so that the verticality of the wave band plate and incident X-rays in the application process of the wave band plate is conveniently adjusted, and the quality of X-ray imaging is favorably improved.
The size of the packaged zone plate is in the magnitude of several millimeters, the zone plate can be completely moved and installed by means of macroscopic means, the installation efficiency and the installation accuracy can be effectively improved, and particularly the perpendicularity of the zone plate and incident X rays is ensured.
Fig. 2 is a schematic structural diagram of a packaging system of an X-ray zone plate provided by the present invention, and as shown in fig. 2, the packaging system of an X-ray zone plate provided by the present invention includes:
a height obtaining module 201, configured to obtain a height of the X-ray zone plate to be packaged.
And the cutting and polishing module 202 is used for cutting and polishing the filament of the multilayer film structure coated with the X-ray zone plate according to the height.
And a moving module 203 for moving the cut and polished zone plate onto the silicon nitride thin film window using a micro-manipulator.
An encapsulation module 204 for fixing the cut and polished zone plate on the silicon nitride thin film window using FEB/FIB deposition techniques.
The height obtaining module 201 specifically includes:
height determination unit for utilizing
The height of the X-ray zone plate to be encapsulated is determined.
Wherein k is 2 pi/λ; beta is a1、β2Is the absorption term of both materials, δ1、δ2T is the zone plate height for the phase terms of the two materials.
The cutting and polishing module 202 specifically includes:
and the cutting and polishing unit is used for cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate by using a focused ion beam according to the height.
The thickness of the silicon nitride film window is 100nm or 200 nm.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the system disclosed by the embodiment, the description is relatively simple because the system corresponds to the method disclosed by the embodiment, and the relevant points can be referred to the method part for description.
The principles and embodiments of the present invention have been described herein using specific examples, which are provided only to help understand the method and the core concept of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (8)
1. A method of packaging an X-ray zone plate, comprising:
acquiring the height of an X-ray zone plate to be packaged;
cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate according to the height;
moving the cut and polished zone plate to a silicon nitride film window by adopting a micro-operation arm;
fixing the cut and polished zone plate on the silicon nitride thin film window by using FEB/FIB deposition technology.
2. The method according to claim 1, wherein the obtaining the height of the X-ray zone plate to be encapsulated specifically comprises:
by using
Determining the height of an X-ray zone plate to be packaged;
wherein k is 2 pi/λ; beta is a1、β2Is the absorption term of both materials, δ1、δ2T is the zone plate height for the phase terms of the two materials.
3. The method for packaging an X-ray zone plate according to claim 1, wherein the cutting and polishing of the filament of the multilayer film structure coated with the X-ray zone plate according to the height specifically comprises:
and cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate by using a focused ion beam according to the height.
4. The method of claim 1, wherein the thickness of the silicon nitride thin film window is 100nm or 200 nm.
5. An X-ray zone plate packaging system, comprising:
the height acquisition module is used for acquiring the height of the X-ray zone plate to be packaged;
a cutting and polishing module for cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate according to the height;
a moving module for moving the cut and polished zone plate onto the silicon nitride film window by using a micro-operation arm;
an encapsulation module to fix the cut and polished zone plate on the silicon nitride thin film window using FEB/FIB deposition techniques.
6. The packaging system of claim 5, wherein the height acquisition module specifically comprises:
height determination unit for utilizing
Determining the height of an X-ray zone plate to be packaged;
wherein k is 2 pi/λ; beta is a1、β2Is the absorption term of both materials, δ1、δ2T is the zone plate height for the phase terms of the two materials.
7. The packaging system of claim 5, wherein the cutting and polishing module comprises:
and the cutting and polishing unit is used for cutting and polishing the filament of the multilayer film structure plated with the X-ray zone plate by using a focused ion beam according to the height.
8. An X-ray zone plate packaging system according to claim 5, wherein the thickness of the silicon nitride thin film window is 100nm or 200 nm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011146882.4A CN112271011A (en) | 2020-10-23 | 2020-10-23 | Packaging method and system of X-ray zone plate |
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| CN202011146882.4A CN112271011A (en) | 2020-10-23 | 2020-10-23 | Packaging method and system of X-ray zone plate |
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2020
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