CN112261798A - Novel soft and hard combined board combination mode - Google Patents
Novel soft and hard combined board combination mode Download PDFInfo
- Publication number
- CN112261798A CN112261798A CN202011176497.4A CN202011176497A CN112261798A CN 112261798 A CN112261798 A CN 112261798A CN 202011176497 A CN202011176497 A CN 202011176497A CN 112261798 A CN112261798 A CN 112261798A
- Authority
- CN
- China
- Prior art keywords
- board
- hard
- soft
- hard board
- combination mode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 claims abstract description 8
- 239000003814 drug Substances 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000032683 aging Effects 0.000 abstract description 2
- 230000008595 infiltration Effects 0.000 abstract description 2
- 238000001764 infiltration Methods 0.000 abstract description 2
- 238000012856 packing Methods 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a novel soft and hard combined board combination mode which comprises a soft board, wherein a first hard board is arranged on the soft board, a second hard board is arranged on the first hard board, and the first hard board and the second hard board are fixed through PP glue. This novel soft or hard combination board compound mode, the ageing is than higher, practices thrift the cost of labor to in the manufacture process, it has liquid medicine infiltration liquid medicine from the gap of packing to avoid sinking when copper facing technology, influences the product quality, thereby improves the product yield.
Description
Technical Field
The invention relates to the technical field of electronic circuit boards, in particular to a novel soft and hard combined board combination mode.
Background
The electronic circuit board originally originated in the united states, and the product integration level is high, and the electronic circuit board is characterized in that: soft, resistant buckling, function integrated level are high, because too soft, be unfavorable for SMT welding, so some products that require to be high will use soft or hard combination board to replace, realize SMT welding and the problem of soft buckling, generally are applied to medical treatment, space flight and aviation and communication field.
The timeliness of filling and the yield of products are low in the manufacturing process of the traditional rigid-flexible printed circuit board, and the filling process does not exist in the process, so that the existing soft-rigid printed circuit board needs to be improved aiming at the problems.
Disclosure of Invention
The invention aims to provide a novel soft and hard combined board combination mode to solve the problems of timeliness of filling in the manufacturing process of the traditional soft and hard combined board, low yield of products and no filling process in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a novel soft or hard combination board combination mode, includes the soft board, be provided with first hard board on the soft board, and be provided with the second hard board on the first hard board.
Preferably, the first hard board and the second hard board are fixed by PP glue.
Compared with the prior art, the invention has the beneficial effects that: this novel soft or hard combination board compound mode, the ageing is than higher, practices thrift the cost of labor to in the manufacture process, it has liquid medicine infiltration liquid medicine from the gap of packing to avoid sinking when copper facing technology, influences the product quality, thereby improves the product yield.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram of a conventional rigid-flex board.
In the figure: 1. a soft board; 2. a first hard sheet; 3. PP glue; 4. a second hard sheet; 5. cutting the line.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a novel soft and hard combination board compound mode, includes that soft board 1, first hard board 2, PP glue 3, second hard board 4 and cutting line 5, be provided with first hard board 2 on the soft board 1, and be provided with second hard board 4 on the first hard board 2, first hard board 2 and second hard board 4 glue 3 mutually fixedly through PP, decompose the hard board into first hard board 2 and second hard board 4, get rid of thick first hard board 2 the copper-clad board in soft board 1 district, then glue 3 through PP with thin second hard board 4 and combine together, combine with soft board 1 again at last, after waiting to combine to accomplish, the die-cut or laser cutting's of rethread mould mode, cutting line department cuts in figure 1, gets rid of the waste material of thin second hard board 4.
The production process comprises the following steps: when the novel rigid-flexible board is produced, firstly, the flexible board 1 and the first rigid board 2 are in press fit and combined, then, chemical copper deposition and electrolytic copper plating (a liquid medicine deposition and electroplating mode) are carried out, then, a circuit is made, then, the rigid board is cut (at the cutting line), and finally, the forming is carried out, so that the whole work is completed, and the content which is not described in detail in the specification belongs to the prior art which is known by a person skilled in the art.
The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description of the invention only, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the scope of the invention.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes, modifications, equivalents, improvements and the like can be made therein without departing from the spirit and scope of the invention.
Claims (2)
1. The utility model provides a novel soft or hard combination board combination mode, includes soft board (1), first hard board (2), PP glues (3), second hard board (4), line of cut (5), its characterized in that: the soft board (1) is provided with a first hard board (2), and the first hard board (2) is provided with a second hard board (4).
2. The novel combination mode of the rigid-flex board as claimed in claim 1, wherein: the first hard board (2) and the second hard board (4) are fixed through PP glue (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011176497.4A CN112261798A (en) | 2020-10-29 | 2020-10-29 | Novel soft and hard combined board combination mode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011176497.4A CN112261798A (en) | 2020-10-29 | 2020-10-29 | Novel soft and hard combined board combination mode |
Publications (1)
Publication Number | Publication Date |
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CN112261798A true CN112261798A (en) | 2021-01-22 |
Family
ID=74261169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011176497.4A Pending CN112261798A (en) | 2020-10-29 | 2020-10-29 | Novel soft and hard combined board combination mode |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112261798A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010010303A1 (en) * | 1997-02-14 | 2001-08-02 | A. Roland Caron | Multilayer combined rigid/flex printed circuit board containing flexible soldermask |
CN204466045U (en) * | 2015-04-15 | 2015-07-08 | 深圳市爱升精密电路科技有限公司 | A Rigid-Flexible Board with Asymmetrical Structure |
CN205657911U (en) * | 2016-05-12 | 2016-10-19 | 深圳市仁创艺电子有限公司 | It combines printing board to fly tail formula soft or hard |
-
2020
- 2020-10-29 CN CN202011176497.4A patent/CN112261798A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010010303A1 (en) * | 1997-02-14 | 2001-08-02 | A. Roland Caron | Multilayer combined rigid/flex printed circuit board containing flexible soldermask |
CN204466045U (en) * | 2015-04-15 | 2015-07-08 | 深圳市爱升精密电路科技有限公司 | A Rigid-Flexible Board with Asymmetrical Structure |
CN205657911U (en) * | 2016-05-12 | 2016-10-19 | 深圳市仁创艺电子有限公司 | It combines printing board to fly tail formula soft or hard |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210122 |