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CN112261798A - Novel soft and hard combined board combination mode - Google Patents

Novel soft and hard combined board combination mode Download PDF

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Publication number
CN112261798A
CN112261798A CN202011176497.4A CN202011176497A CN112261798A CN 112261798 A CN112261798 A CN 112261798A CN 202011176497 A CN202011176497 A CN 202011176497A CN 112261798 A CN112261798 A CN 112261798A
Authority
CN
China
Prior art keywords
board
hard
soft
hard board
combination mode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011176497.4A
Other languages
Chinese (zh)
Inventor
柯可木
高水平
高宝平
范刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Xinmeidi Electronic Co ltd
Original Assignee
Jiangsu Xinmeidi Electronic Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Xinmeidi Electronic Co ltd filed Critical Jiangsu Xinmeidi Electronic Co ltd
Priority to CN202011176497.4A priority Critical patent/CN112261798A/en
Publication of CN112261798A publication Critical patent/CN112261798A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • H05K3/4015Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a novel soft and hard combined board combination mode which comprises a soft board, wherein a first hard board is arranged on the soft board, a second hard board is arranged on the first hard board, and the first hard board and the second hard board are fixed through PP glue. This novel soft or hard combination board compound mode, the ageing is than higher, practices thrift the cost of labor to in the manufacture process, it has liquid medicine infiltration liquid medicine from the gap of packing to avoid sinking when copper facing technology, influences the product quality, thereby improves the product yield.

Description

Novel soft and hard combined board combination mode
Technical Field
The invention relates to the technical field of electronic circuit boards, in particular to a novel soft and hard combined board combination mode.
Background
The electronic circuit board originally originated in the united states, and the product integration level is high, and the electronic circuit board is characterized in that: soft, resistant buckling, function integrated level are high, because too soft, be unfavorable for SMT welding, so some products that require to be high will use soft or hard combination board to replace, realize SMT welding and the problem of soft buckling, generally are applied to medical treatment, space flight and aviation and communication field.
The timeliness of filling and the yield of products are low in the manufacturing process of the traditional rigid-flexible printed circuit board, and the filling process does not exist in the process, so that the existing soft-rigid printed circuit board needs to be improved aiming at the problems.
Disclosure of Invention
The invention aims to provide a novel soft and hard combined board combination mode to solve the problems of timeliness of filling in the manufacturing process of the traditional soft and hard combined board, low yield of products and no filling process in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a novel soft or hard combination board combination mode, includes the soft board, be provided with first hard board on the soft board, and be provided with the second hard board on the first hard board.
Preferably, the first hard board and the second hard board are fixed by PP glue.
Compared with the prior art, the invention has the beneficial effects that: this novel soft or hard combination board compound mode, the ageing is than higher, practices thrift the cost of labor to in the manufacture process, it has liquid medicine infiltration liquid medicine from the gap of packing to avoid sinking when copper facing technology, influences the product quality, thereby improves the product yield.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram of a conventional rigid-flex board.
In the figure: 1. a soft board; 2. a first hard sheet; 3. PP glue; 4. a second hard sheet; 5. cutting the line.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a novel soft and hard combination board compound mode, includes that soft board 1, first hard board 2, PP glue 3, second hard board 4 and cutting line 5, be provided with first hard board 2 on the soft board 1, and be provided with second hard board 4 on the first hard board 2, first hard board 2 and second hard board 4 glue 3 mutually fixedly through PP, decompose the hard board into first hard board 2 and second hard board 4, get rid of thick first hard board 2 the copper-clad board in soft board 1 district, then glue 3 through PP with thin second hard board 4 and combine together, combine with soft board 1 again at last, after waiting to combine to accomplish, the die-cut or laser cutting's of rethread mould mode, cutting line department cuts in figure 1, gets rid of the waste material of thin second hard board 4.
The production process comprises the following steps: when the novel rigid-flexible board is produced, firstly, the flexible board 1 and the first rigid board 2 are in press fit and combined, then, chemical copper deposition and electrolytic copper plating (a liquid medicine deposition and electroplating mode) are carried out, then, a circuit is made, then, the rigid board is cut (at the cutting line), and finally, the forming is carried out, so that the whole work is completed, and the content which is not described in detail in the specification belongs to the prior art which is known by a person skilled in the art.
The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description of the invention only, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the scope of the invention.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes, modifications, equivalents, improvements and the like can be made therein without departing from the spirit and scope of the invention.

Claims (2)

1. The utility model provides a novel soft or hard combination board combination mode, includes soft board (1), first hard board (2), PP glues (3), second hard board (4), line of cut (5), its characterized in that: the soft board (1) is provided with a first hard board (2), and the first hard board (2) is provided with a second hard board (4).
2. The novel combination mode of the rigid-flex board as claimed in claim 1, wherein: the first hard board (2) and the second hard board (4) are fixed through PP glue (3).
CN202011176497.4A 2020-10-29 2020-10-29 Novel soft and hard combined board combination mode Pending CN112261798A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011176497.4A CN112261798A (en) 2020-10-29 2020-10-29 Novel soft and hard combined board combination mode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011176497.4A CN112261798A (en) 2020-10-29 2020-10-29 Novel soft and hard combined board combination mode

Publications (1)

Publication Number Publication Date
CN112261798A true CN112261798A (en) 2021-01-22

Family

ID=74261169

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011176497.4A Pending CN112261798A (en) 2020-10-29 2020-10-29 Novel soft and hard combined board combination mode

Country Status (1)

Country Link
CN (1) CN112261798A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010010303A1 (en) * 1997-02-14 2001-08-02 A. Roland Caron Multilayer combined rigid/flex printed circuit board containing flexible soldermask
CN204466045U (en) * 2015-04-15 2015-07-08 深圳市爱升精密电路科技有限公司 A Rigid-Flexible Board with Asymmetrical Structure
CN205657911U (en) * 2016-05-12 2016-10-19 深圳市仁创艺电子有限公司 It combines printing board to fly tail formula soft or hard

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010010303A1 (en) * 1997-02-14 2001-08-02 A. Roland Caron Multilayer combined rigid/flex printed circuit board containing flexible soldermask
CN204466045U (en) * 2015-04-15 2015-07-08 深圳市爱升精密电路科技有限公司 A Rigid-Flexible Board with Asymmetrical Structure
CN205657911U (en) * 2016-05-12 2016-10-19 深圳市仁创艺电子有限公司 It combines printing board to fly tail formula soft or hard

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Legal Events

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SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20210122