CN112254371A - Thermal control device for multi-stage gradient thermoelectric refrigeration chip - Google Patents
Thermal control device for multi-stage gradient thermoelectric refrigeration chip Download PDFInfo
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- CN112254371A CN112254371A CN202011044813.2A CN202011044813A CN112254371A CN 112254371 A CN112254371 A CN 112254371A CN 202011044813 A CN202011044813 A CN 202011044813A CN 112254371 A CN112254371 A CN 112254371A
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- 238000005516 engineering process Methods 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims description 41
- 239000007788 liquid Substances 0.000 claims description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 9
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- 229910021389 graphene Inorganic materials 0.000 claims description 9
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- 239000002826 coolant Substances 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
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- 238000010521 absorption reaction Methods 0.000 claims description 3
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- 239000011810 insulating material Substances 0.000 claims description 3
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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Abstract
The invention discloses a thermal control device of a multistage gradient thermoelectric refrigerating sheet, and aims to provide a thermal control device with accurate temperature control and high heat dissipation efficiency. The method comprises the following steps: the invention is realized by the following technical scheme: based on the thermoelectric refrigeration technology, the thermoelectric refrigeration piece is contacted with at least two heating source chips which are embedded in a filling heat insulation material layer and distributed at intervals in a linear array through a cold end of the thermoelectric refrigeration piece connected with the bottom, and a printed board is tightly attached to gaps filled with a heat insulation material below the heating source chips, so that the printed board is contacted with the heating source chips through the linear array at intervals, heat enters the hot end of the thermoelectric refrigeration piece which is raised by the thermal control of the thermoelectric refrigeration piece in the multistage serial connection with the refrigeration pieces, heat is conducted to a plurality of horizontal directions and dissipated along the plane transmission directions of two sides of a heat transfer module of the heat transfer module, and the heat of heat dissipation ribs on the two sides is converged and guided to the. The invention improves the reliability of the module-level electronic equipment and has very high heat dissipation efficiency.
Description
Technical Field
The invention relates to a thermoelectric cooling thermal control device for module-level electronic equipment, in particular to a thermal control device adopting a multistage gradient thermoelectric cooling semiconductor chip.
Background
Electronic device modularization is an effective way to improve the versatility, reliability and maintainability of electronic devices and to reduce costs. At present, ASAAC standard modules and VITA standard modules are widely used in the fields of aviation, aerospace and industry. However, with the expansion of the application field of electronic devices, the module has larger heat productivity, higher integration level of the electronic devices, and more stringent requirements on the temperature environment adaptability of the module. In particular, the volume and weight of the refrigerating plate are small, the refrigerating plates in unit form are arranged differently according to the size and the refrigerating requirement, and the size of the refrigerating plate can reach a square shape of 5mm multiplied by 2mm or a ring shape with the diameter of 4mm at the minimum. The thermal resistances on the heat transmission path are sequentially the internal thermal resistance e of the device; thermal contact resistance between the surface of the device and the cold surface of the refrigerator ed, thermal contact resistance between the hot surface of the refrigerator and the bottom surface of the radiator and thermal resistance between the bottom of the radiator and the environment. The heat quantity to be dissipated by the device through the transmission path is P, which is the refrigerating capacity of the refrigerator in stable operation. In electronic equipment cooling, it is often desirable that the refrigeration system be compact and quiet. Thermoelectric refrigeration pieces can cover most chip-level electronic equipment at present, and can be cooled to be lower than the ambient temperature, and accurate temperature control is realized. I.e., to enable the module-level electronic device to operate in a higher ambient temperature than it is permitted to operate. For example, for an FPGA device with a permissible shell temperature of generally 100 ℃, after a single-stage refrigeration piece is integrated, when the shell temperature of the PFGA is controlled at 95 ℃, if the refrigeration piece can realize 50 ℃ temperature difference refrigeration, the integrated FPGA can work in an environment of less than 95 ℃ and 50 ℃, which is equivalent to improving the temperature environment adaptability of the FPGA by 50 ℃.
With the continuous reduction of the volume and the continuous improvement of the speed and the performance of electronic components, the energy consumption and the heat flux density of the chip are also increased more and more. Excessive temperatures subject components to excessive thermal expansion stresses, resulting in structural failure, and statistically more than 55% of electronic device failures are associated with overheating of the electronic device. As the temperature increases, the failure rate of the electronic components increases exponentially, reducing the reliability of the electronic equipment to varying degrees.
Most of the traditional ASAAC standard modules, VITA standard modules, VPX modules and the like conduct and dissipate heat, that is, the printed board 3 with the heat-generating source chip 2 is fixed in the module structural member 1 by installing the heat-dissipating ribs 4 on the module structural member 1, and the heat is dissipated by conduction as shown in fig. 5. The heat of the heating source chip 2 is transmitted to the rack through the module structural member 1 and the heat dissipation ribs 4 are arranged on the module structural member 1 along the heat transmission direction 5 of the heat dissipation channel, the rack finally takes away the heat, and the heat transmission depends on the temperature difference. Because the chip 2 with the highest temperature is used in the heat transfer of the traditional standard module, the heat dissipation ribs are arranged in the order of the chip 2 to the module structural member 1 to 4. When the heat consumption of the chip 2 is higher, the temperature difference between the chip 2 and the installation heat dissipation rib 4 is larger, the temperature of a cold source provided by the rack is generally constant, the heat consumption of the module is increased, the application range of the traditional module is narrower and narrower, a mode of through liquid cooling is required to be adopted under many conditions, a liquid cooling runner is increased through liquid cooling, the structure of the module structural member 1 is complex, and the risk of module failure caused by liquid leakage and the like is increased sharply. In order to meet the requirement of temperature environment adaptability of modular electronic equipment in the aerospace field, most of modular electronic equipment is realized by technologies such as through liquid cooling and chip derating. Thermoelectric refrigeration pieces can cover most chip-level electronic equipment at present, and can be cooled to be lower than the ambient temperature, and accurate temperature control is realized. I.e., to enable the module-level electronic device to operate in a higher ambient temperature than it is permitted to operate. Thermoelectric refrigeration can solve the cooling problem of some high-power devices and electronic equipment in severe environment. Compared with other cooling modes, the thermoelectric refrigeration has no moving part, the size and the weight are very small, the temperature can be reduced to be lower than the ambient temperature, the same device can meet the requirements of temperature rise and temperature reduction, the temperature can be accurately controlled, the reliability is high (more than 200000 h), the electronic silence and the gravity have no influence, and the thermoelectric refrigeration can work in the high-temperature environment of 150-200 ℃. In particular, the volume and weight of the refrigeration plate are small, and the refrigeration plates can be arranged in different unit forms according to the size and the refrigeration requirement. The current domestic refrigeration piece comprises a four-unit PN structure, the minimum size of the four-unit PN structure can reach 5mm multiplied by 2mm square or 4mm diameter ring, and the size form can basically cover most chip-level electronic equipment.
The temperature can be lowered below ambient temperature, i.e. the module level electronics can be operated at a higher ambient temperature than it is allowed to. For a device such as an FPGA, the allowable shell temperature is generally 100 ℃, after a single-stage refrigeration piece is adopted for integration, when the shell temperature of the PFGA is controlled at 95 ℃, if the refrigeration piece can realize 50 ℃ temperature difference refrigeration, the integrated FPGA can work in an environment of less than 95 ℃ and 50 ℃, which is equivalent to improving the temperature environment adaptability of the FPGA by 50 ℃.
Disclosure of Invention
The invention aims to provide the thermoelectric cooling and heat control device for the module-level electronic equipment, which has the advantages of compact structure, small heat transfer resistance and heat leakage loss, accurate temperature control and high heat dissipation efficiency and aims at overcoming the defects in the prior art.
The above object of the present invention can be achieved by the following technical solutions: a multi-stage gradient thermoelectric refrigeration chip thermal control device comprises: the module structure 1 that covers at the inboard both ends of heat transfer module 7, the thermoelectric refrigeration piece 11 of embedding in filling the heat insulating material layer 10 sunken groove, upwards the interval range upon range of in proper order on thermoelectric refrigeration piece 11 and with the horizontal perpendicular multistage temperature gradient thermoelectric refrigeration piece that links to each other of both ends module structure 1, its characterized in that: based on the thermoelectric refrigeration technology, the thermoelectric refrigeration piece 11 is contacted with at least two heating source chips 2 which are embedded in the filling heat insulation material layer 10 and distributed at a linear array interval through a thermoelectric refrigeration piece cold end 8 connected with the bottom, the printed board 3 is tightly attached to a gap filled with a heat insulation material 10 below the heating source chips 2, so that the printed board 3 is formed to be contacted with the heating source chips 2 through the linear array interval, heat enters the thermoelectric refrigeration piece 11 and is subjected to heat control to raise the thermoelectric refrigeration piece hot end 9, heat is conducted to a plurality of horizontal directions, the heat is dissipated along the plane transmission directions 5 at two sides of the heat transfer module 7 of the heat transfer module, and the heat is converged and guided into the thermoelectric refrigeration thermal control device in which the heat of the heat dissipation ribs 4 at two sides is dissipated to the.
Compared with the prior art, the invention has the following beneficial effects:
the structure is compact. The invention adopts the module structural members 1 which cover the two ends of the inner side of the heat transfer module 7, the thermoelectric refrigerating sheets 11 which are embedded in the sunken grooves of the filled heat insulation material layer 10, and the multistage temperature gradient thermoelectric refrigerating sheets which are sequentially stacked on the thermoelectric refrigerating sheets 11 upwards at intervals and are transversely and vertically connected with the module structural members 1 at the two ends are integrated together, thereby having convenient power supply and wiring, no moving part and simple and compact structure. At least one thermoelectric refrigerating sheet 11 can be integrated in the module structural member according to actual needs, and a heat insulation material layer 10 is filled between the module structural member 1 and the printed board 3, so that the installation rib heat dissipation surfaces 4 on the left side and the right side of the module, which are mainly diffused by heat in the heat transmission direction 5, are ensured, and finally, the heat is transmitted to the rack by the installation rib heat dissipation surfaces 4. The thermoelectric refrigeration sheets can be connected in series in a multi-stage manner, and the module-level electronic equipment can be applied to a scene that the ambient temperature is far higher than the allowable temperature of the module-level electronic equipment. If three-stage gradient refrigeration is adopted, under an ideal state, each stage of gradient can realize refrigeration temperature difference capable of covering 40 ℃ of a main heat source, and the three stages can realize refrigeration temperature difference of 120 ℃, and if the allowable temperature of electronic equipment in the module-stage electronic equipment is 100 ℃, the module can operate in an environment of < 100 ℃ plus 120 ℃ after the three-stage gradient refrigeration is adopted.
The heat transfer resistance and the heat leakage loss are small. Based on the thermoelectric refrigeration technology, a thermoelectric refrigeration sheet 11 is in contact with at least two heating source chips 2 which are embedded in a filling heat insulation material layer 10 and distributed at intervals in a linear array through a thermoelectric refrigeration sheet cold end 8 connected with the bottom, a printed board 3 is tightly attached to a gap filled with a heat insulation material 10 below the heating source chips 2, no insulating layer is arranged between stages, the additional heat transfer resistance and heat leakage loss between stages are greatly reduced, the heat of a heat transfer module 7 with higher condensation efficiency can be transferred to a plurality of horizontal directions, the contact area between the heat transfer module 7 and a heat source and a heat dissipation medium is larger, and the surface temperature can be more uniform. The VC soaking plate can be directly contacted with a heating source without a substrate, so that the thermal resistance can be further reduced, and perfect heat dissipation isothermality in the horizontal direction under the chip is realized. Therefore, the refrigeration performance of the multistage refrigeration element and the thermopile can be effectively improved. The heat transfer resistance and the heat leakage loss are reduced. The thermoelectric refrigerating device and the module structural member are integrated into a whole, a micro closed environment is formed inside the module, and a temperature environment suitable for electronic equipment to work can be realized inside the module.
The temperature control is accurate, and the heat dissipation efficiency is high. The invention adopts a thermoelectric refrigeration heat control device which can transfer heat to a plurality of horizontal directions by heat entering a thermoelectric refrigeration piece 11 and thermally controlling and rising the thermoelectric refrigeration piece hot end 9 by a multistage series refrigeration piece, and the heat is dissipated along the plane transmission directions 5 at two sides of a vapor chamber carbon fiber VC plate box body of a heat transfer module 7 and is converged and guided into heat dissipation ribs 4 at two sides to dissipate the heat to the environment. The thermoelectric refrigerating device is arranged at the corresponding structural position of the chip pair, so that the accurate temperature control of the chip can be realized, the high-efficiency heat conduction characteristic is realized, and the temperature environment adaptability of the module is improved. The principle of the air-conditioning refrigeration system is adopted, when the thermoelectric refrigeration piece 6 is electrified for refrigeration, the temperature of the hot end 9 of the thermoelectric refrigeration piece is higher than that of the cold end 8 of the thermoelectric refrigeration piece (generally 40-50 ℃ temperature difference), the heat density of heat which can be transferred from the hot end 9 of the thermoelectric refrigeration piece to the heat dissipation rib 4 is higher by means of the carbon fiber soaking plate VC heat pipe of the heat transfer module 7 or the multilayer composite graphene heat dissipation film due to the large temperature difference, the heat dissipation performance can be greatly improved by the temperature sequence in the whole device, and the temperature of the hot end 9 of the thermoelectric refrigeration piece is higher than that of the high-heat-conducting material of the heat transfer module 7 is higher than that of the heat dissipation rib 4 is higher than that of the chip 2 and that. Finally, the heating source chip 2 and the printed board 3 are in a lower temperature, the reliability of the module-level electronic equipment is improved, and the heat dissipation efficiency is very high.
Drawings
FIG. 1 is a schematic longitudinal sectional view of a thermal control device of a multi-stage gradient thermoelectric cooling plate of the present invention;
FIG. 2 is a schematic diagram of a longitudinal cross-sectional configuration of the first embodiment single-stage gradient thermoelectric cooling thermal control apparatus of FIG. 1;
FIG. 3 is a schematic diagram showing a longitudinal section of a thermoelectric cooling and heating control device in a two-stage gradient discrete heating control manner according to the second embodiment of FIG. 1;
FIG. 4 is a schematic diagram showing a configuration of a thermoelectric cooling and heating device in a centralized heating control manner in a longitudinal section in the third embodiment of FIG. 1;
fig. 5 is a schematic longitudinal sectional view of a conventional conduction heat dissipation type heat transfer module.
In the figure: 1 is thermoelectric refrigeration module, 2 is the heating source chip, 3 is the printing board, 4 is installation heat dissipation rib, 5 is the heat transmission direction, 6 thermoelectric refrigeration pieces, 7 heat transfer modules, 8 is thermoelectric refrigeration piece cold junctions, 9 is thermoelectric refrigeration piece hot junction, 10 is thermal insulation material, 11 is first order thermoelectric refrigeration piece, 12 is second order thermoelectric refrigeration piece, 13 is third order thermoelectric refrigeration piece, 14 fourth order thermoelectric refrigeration pieces.
Detailed Description
See fig. 1. In a preferred embodiment described below, a multi-stage gradient thermoelectric cooling plate thermal control device comprises: the module structural members 1 are covered at two ends of the inner side of the heat transfer module 7, the thermoelectric refrigerating sheets 11 are embedded in the sunken grooves of the filled heat insulation material layers 10, and the multistage temperature gradient thermoelectric refrigerating sheets are sequentially stacked on the thermoelectric refrigerating sheets 11 upwards at intervals and are transversely and vertically connected with the module structural members 1 at two ends. Based on the thermoelectric refrigeration technology, the thermoelectric refrigeration piece 11 is contacted with at least two heating source chips 2 which are embedded in the filling heat insulation material layer 10 and distributed at intervals in the linear array through a thermoelectric refrigeration piece cold end 8 connected with the bottom, the printed board 3 is tightly attached to a gap filled with a heat insulation material 10 below the heating source chips 2, so that the printed board 3 is formed to be contacted with the heating source chips 2 through the linear array, heat enters the thermoelectric refrigeration piece 11 and is subjected to heat control to raise the thermoelectric refrigeration piece hot end 9, heat is conducted to a plurality of horizontal directions, the heat is dissipated along the plane transmission directions 5 at two sides of the heat transfer module 7 of the heat transfer module, and the heat is converged and guided into the heat dissipation ribs 4 at two sides to conduct the linear heat, and is dissipated to the thermoelectric refrigeration heat control device in the environment.
The cold end 8 of the thermoelectric refrigerating chip is tightly attached to the heating source chip 2. The multistage tandem refrigeration piece thermal control includes: the first-stage thermoelectric refrigerating sheet 11 closely attached to the cold end 8 of the thermoelectric refrigerating sheet is sequentially and upwards closely attached to the second-stage refrigerating sheet 12, the third-stage refrigerating sheet 13 and the fourth-stage refrigerating sheet 14 closely attached to the hot end 9 of the thermoelectric refrigerating sheet, so that a multi-stage cascade structure of the multistage temperature gradient thermoelectric refrigerating sheets, which are serially connected in a multistage mode, stacked between the cold end 8 of the thermoelectric refrigerating sheet and the hot end 9 of the thermoelectric refrigerating sheet is formed.
The heat transfer module 7 adopts carbon fiber and liquid cooling soaking plate VC, the coefficient of heat conductivity heat pipe, solidifiable heat conduction gel, the multilayer heat radiation structure that high heat conduction aluminum alloy frame and multilayer composite graphene heat dissipation membrane constitute jointly, multilayer heat radiation structure is sandwich structure, both ends are upper surface and lower surface about the outside, it is condensation layer and heat-conducting layer that upper surface and lower surface hug closely, the intermediate position then is the vaporization layer, the heat is transmitted to the vaporization layer through the heat-conducting layer that the lower surface hugs closely, the coolant liquid of the carbon fiber VC vaporization layer of samming board evaporates fast after the heat absorption, meet the cold and begin to condense into the coolant liquid again after the condensation layer, the pipeline through capillary structure flows back again and gets back to the initial position, provide outstanding radiating effect in cycles. The heat pipe and the carbon fiber VC heat transfer module 7 of the soaking plate are in hollow sealing, heat pipes and the carbon fiber VC are mixed, heat dissipation matching graphene heat dissipation films and copper foil heat dissipation fins are used as auxiliary materials, condensate is filled in the heat dissipation films, and the flat flaky heat conduction pipes which are full of capillary structures are combined into heat dissipation units in a seamless mode through heat conduction gel elements.
The heat generated when the heating source chip 2 operates is conducted to the thermoelectric refrigerating sheet 11, the heat is rapidly transferred to the multistage temperature gradient thermoelectric refrigerating overlapping structure and the module structural members 1 at two ends of the multistage temperature gradient thermoelectric refrigerating overlapping structure, under the vacuum ultra-low pressure environment, liquid is filled in a vacuum cavity of a vapor chamber VC of the heat transfer module 7, the vapor chamber VC is vacuumized and sintered, condensate liquid in a hollow inner cavity at an evaporation end of a capillary structural layer of an inner wall is heated and rapidly evaporated, the heat is rapidly absorbed and converted into vapor, the hot vapor is diffused to a condensation end of a low-pressure area from a high-pressure area, the inner wall with lower vapor contact temperature is rapidly condensed into liquid and releases heat energy, the condensed cooling liquid flows back to an evaporation source at the bottom of the vapor chamber through a capillary pipeline of a copper micro-structure to flow back, the returned cooling liquid is heated by an evaporator and is re-gasified again and absorbs heat through a copper mesh capillary pipeline to dissipate, the circulating system takes away a large amount of heat energy by using the latent heat of the water vapor.
The filling heat insulation material layer 10 is made of heat insulation materials, all parts except the contact surface of the chip 2 and the module structural member 1 are wrapped, and only the contact surface of the heat source chip 2 and the thermoelectric refrigeration module 1 can generate heat transfer.
In the embodiment shown in fig. 2, for a single heat source chip 2 embedded in a filled heat insulation material layer 10, a thermoelectric refrigerating sheet 6 integrated with a module structural member 1 is arranged above a cold end 8 of the thermoelectric refrigerating sheet, the thermoelectric refrigerating sheet 6 is tightly attached between the cold end 8 of the thermoelectric refrigerating sheet and a hot end of the thermoelectric refrigerating sheet, the heat source chip 2 is tightly attached between the cold end 8 of the thermoelectric refrigerating sheet and a printed board 3, a hot end 9 of the thermoelectric refrigerating sheet is embedded in the inner wall of a box body of a soaking plate VC of the module structural member 1 and the heat transfer module 7, heat is transferred from the heat source chip 2 to the thermoelectric refrigerating sheet 6 through the cold end 8 of the thermoelectric refrigerating sheet and is transferred to the heat transfer module 7 in the module structural member 1, and then is transferred to a rack through heat dissipation ribs 4 installed at two sides of the heat transfer module 7.
In one embodiment shown in fig. 3, in order to realize thermal control of a plurality of discretely distributed heat-generating source chips 2, correspondingly, a plurality of thermoelectric cooling fins 6 are integrated with a module structural member 1, and are embedded in the module structural member 1 at intervals along the longitudinal direction of a heat transfer module 7, the plurality of thermoelectric cooling fins 6 discretely distributed in the module structural member 1 are tightly attached between a hot end 9 of the thermoelectric cooling fin and a cold end 8 of the thermoelectric cooling fin, the discretely distributed heat-generating source chips 2 are tightly attached between the lower end face of the cold end 8 of the thermoelectric cooling fin and a printed board 2 embedded in a filled thermal insulation material 10, the heat transfer module 7, a heat pipe or a graphene sheet 7 are tightly attached, heat is transferred from the discretely distributed heat-generating source chips 2 to the cold end 8 of the thermoelectric cooling fin, and then transferred from the thermoelectric cooling fins 6 to the module structural member 1, and the heat passes through the heat transfer module 7, and then the heat dissipation ribs 4 arranged on two sides of the heat transfer module 7 are transferred to the frame. The discrete thermal control mode can control the temperature of a plurality of chips and realize accurate temperature control of each heating source chip 2 in the module-level electronic equipment.
In another embodiment shown in fig. 4, in order to realize thermal control of a plurality of discretely distributed heat source chips 2 and simplify the structure, the thermoelectric cooling plate 6 is configured as a longitudinal thermoelectric cooling plate chip capable of covering the plurality of discretely distributed heat source chips 2, the longitudinal thermoelectric cooling plate chip is integrated in the module structural member 1 along the longitudinal direction of the heat transfer module 7 and is tightly attached between the hot end 9 of the thermoelectric cooling plate and the cold end 8 of the thermoelectric cooling plate, the discretely distributed heat source chips 2 are tightly attached between the lower end face of the cold end 8 of the thermoelectric cooling plate and the printed board 2 embedded in the filled thermal insulation material 10, the heat transfer module 7, the heat pipe or the graphene sheet 7 are tightly attached, heat is transferred from the discretely distributed heat source chips 2 to the cold end 8 of the thermoelectric cooling plate and then transferred to the module structural member 1 through the longitudinal thermoelectric cooling plate chip, the heat is transmitted to the frame through the heat transmission module 7 and the heat dissipation ribs 4 arranged on the two sides of the heat transmission module 7. In the centralized thermal control mode, the temperature control of the heating source chip 2 of the electronic equipment 2 in the module is realized by only adopting one thermoelectric refrigerating sheet 6 with larger area. The discrete thermal control mode can control the temperature of a plurality of chips, and can realize accurate temperature control of each heating source chip 2 in the module-level electronic equipment. Compare in dispersion formula thermal control mode compact structure, a thermoelectric refrigeration board can make thermoelectric refrigeration module realize the unity shape, and the power supply wiring is convenient.
The present invention is not limited to the above-described embodiments, and it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and such modifications and improvements are also considered to be within the scope of the present invention. Those not described in detail in this specification are within the skill of the art.
Claims (10)
1. A multi-stage gradient thermoelectric refrigeration chip thermal control device comprises: the module structure spare (1) that covers at heat transfer module (7) inboard both ends, thermoelectric refrigeration piece (11) of embedding in filling thermal insulation material layer (10) sunken groove, upwards interval range upon range of in proper order on thermoelectric refrigeration piece (11) and with the horizontal multistage temperature gradient thermoelectric refrigeration piece that links to each other perpendicularly of both ends module structure spare (1), its characterized in that: based on the thermoelectric refrigeration technology, thermoelectric refrigeration pieces (11) are in contact with at least two heating source chips (2) which are embedded in a filling heat insulation material layer (10) and distributed at a linear array interval through thermoelectric refrigeration piece cold ends (8) connected at the bottom, a printed board (3) is tightly attached to gaps of the heating source chips (2) filled with heat insulation materials (10), so that the printed board (3) is in contact with the heating source chips (2) through the linear array interval, heat enters the thermoelectric refrigeration pieces (11) and is raised to thermoelectric refrigeration piece hot ends (9) through the heat control of the multistage series refrigeration pieces, heat is conducted to a plurality of horizontal directions, the heat is dissipated along the plane transmission directions (5) at two sides of a heat transfer module (7) of the heat transfer module, and the heat is converged and guided into a thermoelectric refrigeration heat control device in which the heat of the heat dissipation ribs (4) at two sides is.
2. The thermal control device of a multi-stage gradient thermoelectric cooling plate of claim 1, wherein: the multistage tandem refrigeration piece thermal control includes: the first-stage thermoelectric refrigerating piece (11) closely attached to the cold end (8) of the thermoelectric refrigerating piece is sequentially and upwards closely attached to the second-stage refrigerating piece (12), the third-stage refrigerating piece (13) and the fourth-stage refrigerating piece (14) closely attached to the hot end (9) of the thermoelectric refrigerating piece, so that a multi-stage cascade structure of the thermoelectric refrigerating pieces, which are connected in series in a multistage mode, and stacked between the cold end (8) of the thermoelectric refrigerating piece and the hot end (9) of the thermoelectric refrigerating piece is formed.
3. The thermal control device of a multi-stage gradient thermoelectric cooling plate of claim 1, wherein: the heat transfer module (7) adopts a multilayer heat dissipation structure which is formed by carbon fibers, a liquid cooling vapor chamber VC, a heat conduction coefficient heat pipe, curable heat conduction gel, a high heat conduction aluminum alloy frame and a multilayer composite graphene heat dissipation film.
4. The thermal control device of a multi-stage gradient thermoelectric cooling plate of claim 3, wherein: multilayer heat radiation structure is sandwich structure, both ends are upper surface and lower surface about the outside, what upper surface and lower surface hug closely is condensation layer and heat-conducting layer, the intermediate position then is the vaporization layer, the heat is transmitted the vaporization layer through the heat-conducting layer that the lower surface hugs closely, the coolant liquid of the fine VC vaporization layer of samming board is rapid evaporation after the heat absorption, meet the cold behind the condensation layer and begin to condense into the coolant liquid again, the pipeline backward flow through capillary structure gets back to the initial position again, it provides outstanding radiating effect to go round and begin again.
5. The thermal control device of a multi-stage gradient thermoelectric cooling plate of claim 4, wherein: the heat pipe and the carbon fiber VC heat transfer module (7) of the soaking plate are in hollow sealing, the heat pipe and the carbon fiber VC are mixed, heat dissipation matching graphene heat dissipation films and copper foil heat dissipation fins are assisted, condensate is filled in the heat pipe, the heat pipe is a flat sheet-shaped heat conduction pipe with a capillary structure, heat conduction gel elements are combined seamlessly to form a heat dissipation unit, heat is rapidly transferred to the module structural member 1 in a phase change heat conduction mode, heat dissipation ribs (4) are installed on the left side and the right side of the heat transfer module 7, the heat is guided into the rack, and better temperature rise control is achieved.
6. The thermal control device of a multi-stage gradient thermoelectric cooling plate of claim 1, wherein: the heat generated when the heating source chip (2) operates is conducted to the thermoelectric refrigerating sheet (11), the heat is rapidly transferred to the multistage temperature gradient thermoelectric refrigerating overlapping structure and the module structural members (1) at two ends of the multistage temperature gradient thermoelectric refrigerating overlapping structure, liquid is filled in a vacuum cavity of a soaking plate VC of the heat transfer module (7) in a vacuum ultralow pressure environment, vacuum sintering is performed, condensate liquid in a hollow inner cavity at an evaporation end of a capillary structural layer of an inner wall is heated and rapidly evaporated, the heat is rapidly absorbed and converted into steam, the hot steam is diffused to a condensation end of a low-pressure area in a high-pressure area, the steam is rapidly condensed into liquid and releases heat energy in contact with the inner wall, the condensed cooling liquid flows back to an evaporation source at the bottom of the soaking plate through a capillary pipeline of a copper micro-structure to flow back, the returned cooling liquid is heated by an evaporator and is re-gasified again, the heat absorption and the heat conduction are carried out through a copper mesh, the circulating system takes away a large amount of heat energy by using the latent heat of the water vapor.
7. The thermal control device of a multi-stage gradient thermoelectric cooling plate of claim 1, wherein: the filling heat insulation material layer (10) is made of heat insulation materials, all parts except the contact surface of the chip (2) and the module structural member (1) are wrapped, and only the contact surface of the heat source chip (2) and the thermoelectric refrigeration module (1) can generate heat for transferring.
8. The thermal control device of a multi-stage gradient thermoelectric cooling plate of claim 1, wherein: aiming at a single heating source chip (2) embedded in a filling heat insulation material layer (10), a thermoelectric refrigerating sheet (6) integrated with a module structural member (1) is arranged above a cold end (8) of the thermoelectric refrigerating sheet, the thermoelectric refrigerating sheet (6) is tightly attached between the cold end (8) of the thermoelectric refrigerating sheet and a hot end of the thermoelectric refrigerating sheet, the heating source chip (2) is tightly attached between the cold end (8) of the thermoelectric refrigerating sheet and a printed board (3), a hot end (9) of the thermoelectric refrigerating sheet is embedded in the module structural member (1) and is tightly attached to the inner wall of a heat soaking plate VC box body of a heat transfer module (7), heat is transferred from the heating source chip (2) to the thermoelectric refrigerating sheet (6) through the cold end (8) of the thermoelectric refrigerating sheet in the module structural member (1) for heat dissipation and transfer to the heat transfer module (7), and then heat dissipation ribs (4) arranged on two sides of the heat transfer module (7), to the frame.
9. The thermal control device of a multi-stage gradient thermoelectric cooling plate of claim 1, wherein: in order to realize the thermal control of a plurality of discretely distributed heating source chips (2), correspondingly, a plurality of thermoelectric refrigerating sheets (6) and a module structural member (1) are integrated together, the thermoelectric refrigerating sheets are embedded in the module structural member (1) at intervals along the longitudinal direction of a heat transfer module (7), a plurality of thermoelectric refrigerating sheets (6) are discretely distributed in the module structural member (1) and are tightly attached between a hot end (9) of the thermoelectric refrigerating sheet and a cold end (8) of the thermoelectric refrigerating sheet, the discretely distributed heating source chips (2) are tightly attached between the lower end surface of the cold end (8) of the thermoelectric refrigerating sheet and a printed board (2) embedded in a filled heat insulating material (10), the heat transfer module (7) and a heat pipe or a graphene sheet (7) are tightly attached, heat is transferred from the discretely distributed heating source chips (2) to the cold end (8) of the thermoelectric refrigerating sheet and then is transferred to the module structural member (1) through the thermoelectric refrigerating sheet (6), the heat is transmitted to the rack through the heat transmission module (7) and the heat dissipation ribs (4) arranged on the two sides of the heat transmission module (7).
10. The thermal control device of a multi-stage gradient thermoelectric cooling plate of claim 1, wherein: in order to realize the thermal control of a plurality of discretely distributed heating source chips (2) and simplify the structure, a thermoelectric refrigerating sheet (6) is set as a longitudinal thermoelectric refrigerating sheet chip capable of covering the plurality of discretely distributed heating source chips (2), the longitudinal thermoelectric refrigerating sheet chip is integrated in a module structural member (1) along the longitudinal direction of a heat transfer module (7) and is tightly attached between a thermoelectric refrigerating sheet hot end (9) and a thermoelectric refrigerating sheet cold end (8) module, the discretely distributed heating source chips (2) are tightly attached between the lower end surface of the thermoelectric refrigerating sheet cold end (8) and a printed board (2) embedded in a filled heat insulating material (10), the heat transfer module (7) and a heat pipe or a graphene sheet (7) are tightly attached, heat is transferred from the discretely distributed heating source chips (2) to the thermoelectric refrigerating sheet cold end (8) and is transferred to the module structural member (1) through the longitudinal thermoelectric refrigerating sheet chip, the heat is transmitted to the rack through the heat transmission module (7) and the heat dissipation ribs (4) arranged on the two sides of the heat transmission module (7).
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113346793A (en) * | 2021-06-02 | 2021-09-03 | 北京理工大学 | Multistage refrigerating system for recycling circuit waste heat |
| CN113873854A (en) * | 2021-10-18 | 2021-12-31 | 西安微电子技术研究所 | Graphene composite heat dissipation cold plate, preparation method and 6U plugboard module |
| CN113923930A (en) * | 2021-05-31 | 2022-01-11 | 荣耀终端有限公司 | Electronic component and electronic device |
| CN113985989A (en) * | 2021-10-20 | 2022-01-28 | 紫光股份有限公司 | Heat dissipation equipment |
| CN114602288A (en) * | 2021-12-27 | 2022-06-10 | 南方科技大学 | Gas adsorption separation system |
| CN115299992A (en) * | 2022-04-07 | 2022-11-08 | 重庆大学 | Semiconductor and gas compression overlapping refrigeration minimally invasive scalpel |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106025055A (en) * | 2015-03-31 | 2016-10-12 | Lg伊诺特有限公司 | Thermoelectric converter and dehumidifier using the same |
| CN106440601A (en) * | 2015-08-11 | 2017-02-22 | 卡孚特能源技术（深圳）有限公司 | Freezing type multistage semiconductor refrigeration refrigerator |
| CN108650862A (en) * | 2018-07-13 | 2018-10-12 | 北京华悦龙驰科技有限公司 | A kind of rapid cooling method and device based on semiconductor refrigerating technology |
| CN108780344A (en) * | 2016-03-30 | 2018-11-09 | 高通股份有限公司 | For active cooling equipment in the face of mobile electronic device |
| EP3539775A1 (en) * | 2016-11-09 | 2019-09-18 | Tongtai Machine & Tool Co., Ltd. | Heating and refrigerating device |
| CN210247355U (en) * | 2019-06-24 | 2020-04-03 | 维沃移动通信有限公司 | Folding terminal device |
-
2020
- 2020-09-28 CN CN202011044813.2A patent/CN112254371A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106025055A (en) * | 2015-03-31 | 2016-10-12 | Lg伊诺特有限公司 | Thermoelectric converter and dehumidifier using the same |
| CN106440601A (en) * | 2015-08-11 | 2017-02-22 | 卡孚特能源技术（深圳）有限公司 | Freezing type multistage semiconductor refrigeration refrigerator |
| CN108780344A (en) * | 2016-03-30 | 2018-11-09 | 高通股份有限公司 | For active cooling equipment in the face of mobile electronic device |
| EP3539775A1 (en) * | 2016-11-09 | 2019-09-18 | Tongtai Machine & Tool Co., Ltd. | Heating and refrigerating device |
| CN108650862A (en) * | 2018-07-13 | 2018-10-12 | 北京华悦龙驰科技有限公司 | A kind of rapid cooling method and device based on semiconductor refrigerating technology |
| CN210247355U (en) * | 2019-06-24 | 2020-04-03 | 维沃移动通信有限公司 | Folding terminal device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113923930A (en) * | 2021-05-31 | 2022-01-11 | 荣耀终端有限公司 | Electronic component and electronic device |
| CN113923930B (en) * | 2021-05-31 | 2022-08-16 | 荣耀终端有限公司 | Electronic component and electronic device |
| CN113346793A (en) * | 2021-06-02 | 2021-09-03 | 北京理工大学 | Multistage refrigerating system for recycling circuit waste heat |
| CN113873854A (en) * | 2021-10-18 | 2021-12-31 | 西安微电子技术研究所 | Graphene composite heat dissipation cold plate, preparation method and 6U plugboard module |
| CN113985989A (en) * | 2021-10-20 | 2022-01-28 | 紫光股份有限公司 | Heat dissipation equipment |
| CN114602288A (en) * | 2021-12-27 | 2022-06-10 | 南方科技大学 | Gas adsorption separation system |
| CN115299992A (en) * | 2022-04-07 | 2022-11-08 | 重庆大学 | Semiconductor and gas compression overlapping refrigeration minimally invasive scalpel |
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