CN112247366A

CN112247366A - Automatic IC laser lettering equipment

Info

Publication number: CN112247366A
Application number: CN202011208662.XA
Authority: CN
Inventors: 龚成万; 肖磊; 李世威; 张善基; 李斌; 赵建涛
Original assignee: Guangdong Laser Intelligent Equipment Co ltd
Current assignee: Guangdong Laser Intelligent Equipment Co ltd
Priority date: 2020-11-03
Filing date: 2020-11-03
Publication date: 2021-01-22

Abstract

The invention relates to the technical field of laser processing, in particular to automatic IC laser lettering equipment which comprises a machine table, a laser, a feeding mechanism, a rotating mechanism, a clamping mechanism, a light path component and a discharging mechanism, wherein the feeding mechanism is fixedly arranged on the top surface of the machine table, the side surface of the machine table is an inclined surface, the rotating mechanism, the clamping mechanism and the discharging mechanism are sequentially and fixedly arranged along the inclined surface of the machine table, the light path component is fixedly arranged on the inclined surface of the machine table and positioned above the clamping mechanism, and the laser is arranged in the machine table and corresponds to the light path component. The feeding mechanism transmits a material pipe loaded with an IC product to be processed to the rotating mechanism, the rotating mechanism pours the IC product in the material pipe onto the clamping mechanism for the optical path component to perform laser lettering, and then the discharging mechanism loads the processed IC product into the material pipe, so that the whole laser lettering process is performed automatically, the product quality problem caused by manual operation errors can be effectively avoided, meanwhile, the production efficiency can be improved, and the production cost is reduced.

Description

Automatic IC laser lettering equipment

Technical Field

The invention relates to the technical field of laser processing, in particular to automatic IC laser lettering equipment.

Background

With the progress and development of society and science and technology, people have higher and higher requirements on the processing quality, the quality and the like of products, the labor cost is gradually increased, the sustainable development of the green ecological environment is more and more emphasized by the nation, the processing cost required by enterprise production is higher and higher, and the higher requirement is undoubtedly put forward on the production efficiency.

At present, in the IC laser lettering industry, manual laser lettering, manual feeding and a manual operation system are adopted for laser processing, and an empty material pipe and a processed IC material pipe are manually recycled. Not only needs great labor cost, but also is easily restricted by the operation level of technicians, and the product quality problem caused by manual operation errors can occur.

Therefore, there is a need in the industry for a solution to the above-mentioned problems.

Disclosure of Invention

The invention aims to provide an automatic IC laser lettering device aiming at the defects of the prior art. The object of the present invention can be achieved by the following technical means.

The utility model provides an automatic IC laser equipment of carving characters, includes board, laser instrument, feed mechanism, rotary mechanism, fixture, light path subassembly and unloading mechanism, feed mechanism is fixed to be set up on the board top surface, a side of board is the inclined plane, rotary mechanism fixture reaches unloading mechanism along the inclined plane of board is fixed the setting in proper order, the light path subassembly is fixed on the inclined plane of board and be located the fixture top, the laser instrument sets up the board inside and with the light path subassembly corresponds the setting.

Preferably, the feeding mechanism comprises a feeding material rack, a feeding transmission assembly, a feeding push plate, an empty material pipe receiving bin and a first photoelectric sensor, the feeding material rack spans across the head end of the feeding transmission assembly, the empty material pipe receiving bin is connected with the tail end of the feeding transmission assembly, the first photoelectric sensor is fixed on the feeding material rack, and the feeding push plate is fixed on the feeding transmission assembly and driven by the feeding transmission assembly to move.

Preferably, the feeding transmission assembly comprises a feeding bottom plate, a feeding linear guide rail, a transmission servo motor, a rotating shaft, a first transmission wheel piece and two second transmission wheel pieces are arranged on the feeding bottom plate, the two second transmission wheel pieces are respectively and fixedly installed at two ends of the rotating shaft, a second transmission belt is installed on the second transmission wheel pieces, the first transmission wheel piece is fixedly installed in the middle of the rotating shaft, a first transmission belt is installed on the first transmission wheel piece, and the transmission servo motor is in transmission connection with the first transmission belt.

Preferably, the outer diameter of the first conveyor wheel member is not equal to the outer diameter of the second conveyor wheel member.

Preferably, the rotating mechanism includes a motor mounting plate, a rotating servo motor, a rotating plate, a rotating clamp and a first cylinder, the rotating servo motor is fixed on the motor mounting plate, the rotating plate is fixed on a rotating shaft of the rotating servo motor, the rotating clamp and the first cylinder are fixed on the rotating plate, and the first cylinder is located beside the rotating clamp.

Preferably, the rotary clamping piece comprises a jaw clamp, a connecting plate, a second cylinder and a third cylinder, the second cylinder is fixed on the rotary plate, the connecting plate is fixed on a pushing shaft of the second cylinder, the third cylinder is fixed on the connecting plate, one clamping piece of the jaw clamp is fixed on the connecting plate, and the other clamping piece is fixed on the pushing shaft of the third cylinder.

Preferably, the fixture includes a clamping bottom plate, a clamping base and two guide strips, the guide strips are fixed on the clamping bottom plate, the clamping base is fixed between the two guide strips, a second electric sensor is arranged on the guide strip located on the front side, a fifth electric sensor is arranged on the guide strip located on the rear side, a third photoelectric sensor and a fourth photoelectric sensor are sequentially arranged on the clamping base, a fourth cylinder and a fifth cylinder are sequentially arranged at the bottom of the clamping base, a sixth cylinder is arranged at the bottom of the guide strip located on the rear side, the fourth cylinder corresponds to the third photoelectric sensor in position, the fifth cylinder corresponds to the fourth photoelectric sensor in position, and the sixth cylinder corresponds to the fifth photoelectric sensor in position.

Preferably, the optical path component includes a light beam shaping component, a galvanometer, a focusing lens, an optical path rotating component and an upright post, the optical path rotating component is connected with the upright post in a sliding manner, the light beam shaping component is fixed on a rotating shaft of the optical path rotating component, the galvanometer is installed at an output end of the light beam shaping component, and the focusing lens is installed on the galvanometer.

Preferably, unloading mechanism includes unloading material frame, full material pipe receipts feed bin, ninth cylinder, seventh cylinder, eighth cylinder, unloading linear guide, unloading push pedal and unloading baffle, unloading linear guide transversely sets up on the board, unloading material frame vertically spanes unloading linear guide sets up, the unloading push pedal is fixed the promotion of seventh cylinder epaxially and with unloading linear guide sliding connection, the ninth cylinder sets up the front side of unloading material frame, the eighth cylinder sets up the rear side of unloading material frame, the unloading baffle sets up the side of unloading material frame, full material pipe receipts feed bin with the unloading baffle corresponds the setting.

Preferably, be equipped with industrial computer, display and failure warning lamp on the board, the display is fixed on the side of board, the failure warning lamp is fixed on the top surface of board, the industrial computer sets up the inside of board, the industrial computer with the laser instrument the display reaches failure warning lamp electric connection.

Compared with the prior art, the invention has the beneficial effects that:

the invention has developed an automatic IC laser carving apparatus, the feed mechanism transfers the feed pipe loading IC products to be processed to the rotary mechanism, the rotary mechanism pours the IC products in the feed pipe on the fixture for the light path assembly to carve characters with laser, the blanking mechanism loads the processed IC products in the feed pipe subsequently, the whole laser carving process is carried on in full automation, does not need the manual handling, can already avoid the product quality problem produced because of the manual operation error effectively, can raise production efficiency at the same time, lowering production cost.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser lettering device in an embodiment of the invention.

Fig. 2 is a schematic diagram of an internal structure of a machine in an embodiment of the invention.

Fig. 3 is a schematic structural diagram of a feeding mechanism in the embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a rotating mechanism in an embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a clamping mechanism according to an embodiment of the invention.

Fig. 6 is a schematic structural diagram of an optical path component in an embodiment of the present invention.

Fig. 7 is a schematic structural diagram of the clamping mechanism and the blanking mechanism in the embodiment of the invention.

Fig. 8 is a partially enlarged view of a portion a in fig. 7.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to specific embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

An automatic IC laser lettering device is shown in figures 1 and 2 and comprises a machine table 1, a laser 7, a feeding mechanism 2, a rotating mechanism 3, a clamping mechanism 4, a light path component 5 and a blanking mechanism 6. The machine table 1 can be formed by welding a square tube, a cold-rolled steel plate and the like, and plays a role in supporting and sealing the whole equipment. The feeding mechanism 2 transfers a material pipe loaded with an IC product to be processed to the rotating mechanism 3, the rotating mechanism 3 pours the IC product in the material pipe out to the clamping mechanism 4, and the clamping mechanism 4 clamps the IC product to perform laser lettering processing. The laser 7 is used for emitting laser required by lettering of IC products, and the optical path component 5 shapes the laser emitted by the laser 7. The feeding mechanism 2 is fixedly arranged on the top surface of the machine table 1, one side surface of the machine table 1 is an inclined surface, the rotating mechanism 3, the clamping mechanism 4 and the discharging mechanism 6 are sequentially and fixedly arranged along the inclined surface of the machine table 1, so that a material pipe for loading IC products can pour out the IC products more easily at the inclined surface, the light path component 5 is fixed on the inclined surface of the machine table 1 and positioned above the clamping mechanism 4, the laser 7 is arranged inside the machine table 1 and correspondingly arranged with the light path component 5, and the light path component 5 corresponds to the clamping mechanism 4, so that the shaped laser can be emitted to the IC products clamped by the clamping mechanism 4 to be engraved.

Specifically, a material pipe which is provided with an IC product to be processed is placed on a feeding mechanism 2, the feeding mechanism 2 transmits the material pipe which is provided with the IC product to be processed to a rotating mechanism 3, the rotating mechanism 3 inclines the material pipe along the inclined plane of a machine table 1 so as to pour the IC product onto a clamping mechanism 4, meanwhile, a laser 7 emits laser required for lettering of the IC product, the laser is shaped into a form which is beneficial to lettering of the IC product after passing through a light path component 5, the light path component 5 emits the shaped laser to the position of the IC product on the clamping mechanism 4 for lettering, and after the lettering is finished, a discharging mechanism 6 loads the processed IC product into the material pipe. The whole laser lettering process is carried out in a full-automatic mode, manual processing is not needed, the product quality problem caused by manual operation errors can be effectively avoided, meanwhile, the production efficiency can be improved, and the production cost is reduced.

In the automatic IC laser engraving apparatus provided in this embodiment, as shown in fig. 3, the feeding mechanism 2 includes a feeding rack 21, a feeding transmission assembly 22, a feeding push plate 23, an empty pipe receiving bin 24, and a first photoelectric sensor 25. A material pipe for loading the IC products to be processed is arranged on the material loading rack 21. The feeding material rack 21 is arranged across the head end of the feeding transmission assembly 22, the empty material pipe receiving bin 24 is connected with the tail end of the feeding transmission assembly 22, an IC material pipe loaded with an IC product to be processed is firstly transmitted to a position corresponding to the rotating mechanism 3 under the action of the feeding transmission assembly 22, the rotating mechanism 3 drives the material pipe loaded with the IC product to be processed to rotate, the material pipe is inclined along the inclined plane of the machine table 1, the IC product is poured out, and after the IC product in the IC material pipe is completely poured out, the empty IC material pipe is transmitted to the empty material pipe receiving bin 24 to be collected. The first photoelectric sensor 25 is fixed on the feeding material rack 21, the first photoelectric sensor 25 is used for detecting whether the IC material pipe is sufficient, and if the IC material pipe cannot be detected, a signal is sent, namely, the IC material pipe to be processed needs to be added. The feeding push plate 23 is fixed on the feeding transmission assembly 22 and moves along with the feeding transmission assembly 22, and the feeding push plate 23 pushes out the IC material pipe on the feeding material rack 21.

Further, in order to improve efficiency better, the material tube loaded with the IC products is conveyed to the rotating mechanism 3, and the empty material tube is conveyed to the empty material tube receiving bin 24, and then conveyed by different conveyor belts, so that the two can work simultaneously and do not interfere with each other. Specifically, as shown in fig. 3, the feeding transmission assembly 22 includes a feeding base plate 221, a feeding linear guide 222, a transmission servo motor 223, a rotating shaft 224, a first transmission pulley 225, and two second transmission pulley 226 are disposed on the feeding base plate 221, the two second transmission pulley 226 are fixedly mounted at two ends of the rotating shaft 224, a second transmission belt is mounted on the second transmission pulley 226, the first transmission pulley 225 is fixedly mounted in the middle of the rotating shaft 224, a first transmission belt is mounted on the first transmission pulley 225, and the transmission servo motor 223 is in transmission connection with the first transmission belt to drive the rotating shaft 224 to rotate. The feeding push plate 23 is fixed on the first conveyor belt and moves along with the first conveyor belt, so that the IC material pipes on the feeding material rack 21 are pushed out to the rotating mechanism 3 by the feeding push plate 23, and empty material pipes conveyed by the rotating mechanism 3 are placed on the second conveyor belt for conveying. Preferably, the outer diameter of the first conveyor wheel piece 225 is not equal to the outer diameter of the second conveyor wheel piece 226, so that the displacement difference generated by the outer diameter difference of the two conveyor wheels is fully utilized, and the empty tube can be recycled while the IC product is clamped on the clamping mechanism 4.

As shown in fig. 4, the rotating mechanism 3 includes a motor mounting plate 32, a rotating servo motor 31, a rotating plate 33, a rotating clamp, and a first cylinder 38, the rotating servo motor 31 is fixed on the motor mounting plate 32, the rotating plate 33 is fixed on a rotating shaft of the rotating servo motor 31, the rotating clamp and the first cylinder 38 are fixed on the rotating plate 33, and the first cylinder 38 is located beside the rotating clamp. The rotary servo motor 31 increases the power of rotation to rotate the rotary plate 33, thereby rotating the components fixed to the rotary plate 33. The first cylinder 38 is aligned with the IC tube and vibrated to shake out IC products that may be stuck inside the tube.

Further, as shown in fig. 4, the rotating clamp includes a jaw clamp 35, a connecting plate 37, a second cylinder 34 and a third cylinder 36, the second cylinder 34 is fixed on the rotating plate 33, the connecting plate 37 is fixed on a pushing shaft of the second cylinder 34, the third cylinder 36 is fixed on the connecting plate 37, one clamping piece of the jaw clamp 35 is fixed on the connecting plate 37, the other clamping piece is fixed on the pushing shaft of the third cylinder 36, and the opening size of the jaw clamp 35 can be adjusted by the third cylinder 36 to clamp or release the material tube. The second cylinder 34 drives the connecting plate 37 to move, and then drives the jaw clamp 35 on the connecting plate 37 to move together, so that the material pipe is inserted into the jaw clamp 35 and guided to the clamping mechanism 4, or the material pipe is pulled out of the jaw clamp 35 after the IC product is poured out and rotates back, so that the empty material pipe is put back on the feeding mechanism 2 and is transferred to the empty material pipe collecting bin 24.

As shown in fig. 5 and 7, the clamping mechanism 4 includes a clamping base plate 41, a clamping base 43, and two guide bars 42, and the guide bars 42 are fixed on the clamping base plate 41, so that an IC product poured out from a material pipe moves along the direction of the guide bars 42, and then moves to a predetermined position for laser engraving. The centre gripping base 43 is fixed two be equipped with second electric sensor 44 on the gib block 42 that is located the front side between the gib block 42, be equipped with fifth electric sensor 47 on the gib block 42 that is located the rear side, be equipped with third photoelectric sensor 45 and fourth photoelectric sensor 46 on the centre gripping base 43 in proper order, the bottom of centre gripping base 43 is equipped with fourth cylinder 48 and fifth cylinder 49 in proper order, the bottom that is located the gib block 42 of rear side is equipped with sixth cylinder 40, and sixth cylinder 40 is used for intercepting the processed IC product that the landing got off, makes the IC product get into unloading mechanism 6 smoothly. The fourth cylinder 48 is disposed corresponding to the third photosensor 45, the fifth cylinder 49 is disposed corresponding to the fourth photosensor 46, and the sixth cylinder 40 is disposed corresponding to the fifth photosensor 47.

Specifically, as shown in fig. 5 and 7, the second photoelectric sensor 44 is used for detecting whether an IC product is fed into the laser engraving machine, and if not, sending a signal to the feeding structure 2 and the rotating mechanism 3 for feeding. The laser engraving position corresponds to the position between the fourth cylinder 48 and the fifth cylinder 49, and since the laser engraving speed is high, a plurality of IC products to be processed may be placed in groups at the position between the fourth cylinder 48 and the fifth cylinder 49 in order to reduce the waiting time. Taking a group of 10 IC products as an example, when the position of the fourth photoelectric sensor 46 does not detect any IC product, it indicates that the IC product has been processed and is sent out, at this time, the IC product to be processed is sent in along the guide bar 42, and at the same time, the fifth air cylinder 49 is ejected upward from the bottom of the clamping base 43, so as to prevent the IC product from directly sliding out without being processed. When the third photoelectric sensor 45 detects that there are IC products, it is described that there are 10 IC products at the position between the fourth cylinder 48 and the fifth cylinder 49, at this time, the fourth cylinder 48 is ejected upward from the bottom of the

clamping base

43, 10 IC products are positioned between the fourth cylinder 48 and the fifth cylinder 49 for laser lettering, and after the lettering is completed, the fifth cylinder 49 retracts. The 10 IC products are fixed together, the 10 IC products are processed in sequence, the IC products slide out together after the complete processing, and a plurality of IC products can be positioned at one time for laser lettering processing.

In the automatic IC laser lettering device provided in this embodiment, as shown in fig. 6, the optical path component 5 includes a light beam shaping component 51, a galvanometer 52, a focusing lens 53, an optical path rotating component 55 and a column 54, the optical path rotating component 55 is slidably connected to the column 54, the light beam shaping component 51 is fixed on a rotating shaft of the optical path rotating component 55, the galvanometer 52 is installed at an output end of the light beam shaping component 51, and the focusing lens 53 is installed on the galvanometer 52. Specifically, the laser beam emitted from the laser 7 is shaped into a laser beam with a small divergence angle by the beam shaping member 51, and the spot diameter becomes large, and becomes a parallel laser beam or a laser beam with a small divergence angle, which is favorable for laser transmission. The galvanometer 52 changes the transmission direction of the laser light path, so that the laser is focused at the focusing lens 53, and the focusing focus forms a track to be processed on the surface of the IC product according to the requirement to carry out laser lettering processing. The light path rotating member 55 adjusts the light path offset angle, so that the focusing lens 53 is parallel to the working plane; the upright column 54 adjusts the light path to move up and down, so as to achieve the purpose of focusing the product.

The automatic IC laser lettering equipment provided in this embodiment, as shown in fig. 7 and 8, the blanking mechanism 6 includes a blanking material frame 61, a full material pipe receiving bin 62, a ninth cylinder 63, a seventh cylinder 64, an eighth cylinder 65, a blanking linear guide 66, a blanking push plate 68 and a blanking baffle 67, the blanking linear guide 66 is transversely disposed on the machine platform 1, the blanking material frame 61 longitudinally crosses the blanking linear guide 66, the blanking push plate 68 is fixed on a pushing shaft of the seventh cylinder 64 and slidably connected with the blanking linear guide 66, the ninth cylinder 63 is disposed at the front side of the blanking material frame 61, that is, at a side close to the clamping mechanism 4. The eighth cylinder 65 is arranged at the rear side of the blanking material rack 61, i.e. at the side remote from the clamping mechanism 4. Unloading baffle 67 sets up the side of unloading material frame 61, full charge pipe receipts feed bin 62 with unloading baffle 67 corresponds the setting.

Specifically, the empty material pipes for loading the processed IC products are arranged in the blanking material rack 61 in an array, the eighth cylinder 65 located at the rear side of the blanking material rack 61 extends out and pushes the pipe orifice of the lowermost empty material pipe to move upward along the inclined plane of the machine table 1, and then the output position of the processed IC products is aligned, so that the processed IC products can smoothly slide into the material pipe at the lowermost part of the blanking material rack 61. When the fifth photoelectric sensor 47 detects that an IC product is present, it indicates that the material tube at the bottom of the discharging material rack 61 is filled with a processed IC product, at this time, the ninth cylinder 63 is ejected upward to prevent the processed IC product from being output continuously, meanwhile, the eighth cylinder 65 retracts, the material tube filled with the processed IC product slides away from the output position of the processed IC product, the seventh cylinder 64 drives the discharging push plate 68 to push the material tube filled with the IC product at the bottom of the discharging material rack 61 and leave the discharging material rack 61 until the material tube filled with the IC product touches the discharging baffle 67 and slides along the discharging baffle 67 to the full material tube receiving bin 62 for collection, and thus, the above-mentioned motion is repeated to automatically load the processed IC product and recycle the processed IC product to the full material tube receiving bin 62.

The utility model provides an automatic IC laser equipment of carving characters that provides in this embodiment, as shown in fig. 2, be equipped with industrial computer 8, display 9 and trouble alarm lamp 10 on the board 1, display 9 is fixed on the side of board 1, trouble alarm lamp 10 is fixed on the top surface of board 1, industrial computer 8 sets up the inside of board 1, industrial computer 8 with laser instrument 7 display 9 reaches trouble alarm lamp 10 electric connection, and then convenient control.

The present invention has been further described with reference to specific embodiments, but it should be understood that the detailed description should not be construed as limiting the spirit and scope of the present invention, and various modifications made to the above-described embodiments by those of ordinary skill in the art after reading this specification are within the scope of the present invention.

Claims

1. an automatic IC laser lettering equipment, is characterized in that, comprises machine, laser, feeding mechanism, rotating mechanism, clamping mechanism, optical path assembly and unloading mechanism, and described feeding mechanism is fixedly arranged on described machine On the top surface, one side of the machine table is an inclined surface, the rotating mechanism, the clamping mechanism and the blanking mechanism are sequentially fixed and arranged along the inclined surface of the machine table, and the optical path component is fixed on the The inclined surface of the machine table is located above the clamping mechanism, and the laser is arranged inside the machine table and corresponding to the optical path assembly.

2. An automatic IC laser engraving device according to claim 1, wherein the feeding mechanism comprises a feeding material rack, a feeding transmission assembly, a feeding push plate, an empty feeding tube receiving bin and a A photoelectric sensor, the feeding material rack is arranged across the head end of the feeding transmission assembly, the empty material pipe receiving bin is connected to the tail end of the feeding transmission assembly, the first photoelectric sensor It is fixed on the feeding material rack, and the feeding push plate is fixed on the feeding transmission assembly and moves under the driving of the feeding transmission assembly.

3. An automatic IC laser engraving device according to claim 2, characterized in that, the feeding transmission assembly comprises a feeding base plate, and the feeding base plate is provided with a feeding linear guide rail, a transmission servo motor, a rotating shaft, A first conveyor pulley member and two second conveyor pulley members, the two second conveyor pulley members are respectively fixedly installed on both ends of the rotating shaft, the second conveyor pulley member is provided with a second conveyor belt, the The first conveyor pulley member is fixedly installed in the middle of the rotating shaft, a first conveyor belt is mounted on the first conveyor pulley member, and the drive servo motor is drive-connected to the first conveyor belt.

4 . The automatic IC laser engraving device according to claim 3 , wherein the outer diameter of the first conveyor pulley is not equal to the outer diameter of the second conveyor pulley. 5 .

5. An automatic IC laser engraving device according to claim 1, wherein the rotating mechanism comprises a motor mounting plate, a rotating servo motor, a rotating plate, a rotating clamp and a first air cylinder, and the rotating servo motor It is fixed on the motor mounting plate, the rotating plate is fixed on the rotating shaft of the rotating servo motor, the rotating clamp and the first air cylinder are fixed on the rotating plate, and the first air cylinder is located on the rotating plate. the side of the rotating clamp.

6 . An automatic IC laser engraving device according to claim 5 , wherein the rotating clamp comprises a jaw clamp, a connecting plate, a second air cylinder and a third air cylinder, and the second air cylinder is fixed on the On the rotating plate, the connecting plate is fixed on the push shaft of the second cylinder, the third cylinder is fixed on the connecting plate, and a clip of the jaw clip is fixed on the connecting plate , the other clip is fixed on the push shaft of the third cylinder.

7 . The automatic IC laser engraving device according to claim 1 , wherein the clamping mechanism comprises a clamping bottom plate, a clamping base and two guide bars, and the guide bars are fixed on the clamping base. 8 . On the bottom plate, the clamping base is fixed between the two guide bars, the guide bar on the front side is provided with a second electrical sensor, and the guide bar on the rear side is provided with a fifth electrical sensor, the clip A third photoelectric sensor and a fourth photoelectric sensor are arranged on the holding base in sequence, a fourth air cylinder and a fifth air cylinder are arranged at the bottom of the clamping base in sequence, and a sixth air cylinder is arranged at the bottom of the guide strip on the rear side, The fourth air cylinder is disposed corresponding to the position of the third photoelectric sensor, the fifth air cylinder is disposed corresponding to the position of the fourth photoelectric sensor, and the sixth air cylinder is disposed corresponding to the position of the fifth photoelectric sensor.

8. A kind of automatic IC laser engraving equipment according to claim 1, is characterized in that, described optical path assembly comprises beam shaping part, galvanometer, focusing lens, optical path rotating part and column, and described optical path rotating part and described The column is slidably connected, the beam shaping component is fixed on the rotating shaft of the optical path rotating member, the galvanometer is mounted on the output end of the beam shaping component, and the focusing lens is mounted on the galvanometer.

9 . An automatic IC laser engraving device according to claim 1 , wherein the blanking mechanism comprises a blanking material rack, a full material pipe receiving bin, a ninth air cylinder, a seventh air cylinder, and an eighth air cylinder. 10 . , Unloading linear guide, unloading push plate and unloading baffle, the unloading linear guide is horizontally arranged on the machine table, the unloading material rack is longitudinally arranged across the unloading linear guide, the unloading linear guide The blanking push plate is fixed on the push shaft of the seventh cylinder and is slidably connected with the blanking linear guide rail. The ninth cylinder is arranged on the front side of the blanking material rack, and the eighth cylinder is arranged at the On the rear side of the unloading material rack, the unloading baffle is arranged on the side of the unloading material rack, and the full material pipe receiving bin is correspondingly arranged with the unloading baffle.

10. A kind of automatic IC laser engraving equipment according to claim 1, is characterized in that, described machine is provided with industrial computer, display and fault warning light, and described display is fixed on the side of described machine, The fault alarm light is fixed on the top surface of the machine, the industrial computer is arranged inside the machine, and the industrial computer is electrically connected with the laser, the display and the fault alarm light .