CN112242471A

CN112242471A - Circuit board module manufactured by LED (light-emitting diode) surface-mounted lamp beads packaged by lens glue only and manufacturing method thereof

Info

Publication number: CN112242471A
Application number: CN201910669120.3A
Authority: CN
Inventors: 王定锋; 徐文红; 冉崇友; 李小龙; 琚生涛; 冷求章
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-07-16
Filing date: 2019-07-16
Publication date: 2021-01-19

Abstract

The invention relates to a circuit board module made of LED chip lamp beads only encapsulated by lens glue and a manufacturing method thereof. Specifically, the cup-shaped brackets containing a plurality of LED chip lamps in a row are produced, and the LED chips are fixed in place. The crystal welding wire is on the positive and negative poles of the bottom of the bracket cup. In each mold cup that contains multiple cup-shaped lens molds in a row, inject lens glue, and immerse the bracket cup with the welded LED chip down. In the glue in the mold cup, the outer wall of the cup is also dipped in glue, heated to cure the glue into a lens, the lens is firmly bonded to the LED bracket, and then the continuous rows of LEDs with lenses are pulled out of the mold cup, and then cut into single pieces. LED SMD lamp beads with lenses, and then solder the LED SMD lamp beads with lenses to the circuit board to make a circuit board module made of only the LED SMD lamp beads encapsulated by lens glue. The manufacturing method of the present invention is simple , Only the LED SMD lamp beads encapsulated by the lens glue are made at the same time, with very high efficiency and low cost.

Description

Circuit board module manufactured by LED (light-emitting diode) surface-mounted lamp beads packaged by lens glue only and manufacturing method thereof

Technical Field

The invention relates to the field of LED application, in particular to a circuit board module manufactured by LED surface mounted lamp beads packaged by lens glue and a manufacturing method thereof.

Background

The traditional circuit board module with the lens patch lamp has the following manufacturing methods of the lamp bead with the lens patch lamp, one method is to use a mold top mold to manufacture a mold top rubber mold top on the lamp bead on a mold top machine to form the lens, and the method has high cost.

The other method is to manufacture the lenses and then glue the lenses to the lamp beads one by using glue, so that the efficiency is low and the cost is high.

In order to overcome the defects of the defects, the LED surface mounted lamp bead only packaged by the lens glue on the circuit board module adopts the surface mounted lamp support to fix the crystal, weld the wire and well weld the chip, the support cup is reversely buckled and extends into the lens glue of the lens mold cup, and the LED surface mounted lamp bead with the lens is manufactured by taking out the support cup from the mold cup after solidification.

Disclosure of Invention

The invention relates to a circuit board module manufactured by LED (light-emitting diode) surface mounted lamp beads packaged by lens glue and a manufacturing method thereof, in particular to a circuit board module manufactured by LED surface mounted lamp beads packaged by lens glue and a manufacturing method thereof, which comprises the following steps: manufacturing a row of cup-shaped supports containing a plurality of LED patch lamps, placing LED chip die bonding wires on a positive electrode and a negative electrode of the bottom of each support cup, pouring lens glue into each mold cup containing a plurality of cup-shaped lens molds in the manufactured row, dipping the cup mouths of the supports welded with the LED chips into the glue in the mold cups, dipping the outer walls of the cups with the glue, heating to solidify the glue into lenses, firmly combining the lenses on the LED supports, then pulling out the rows of LEDs with the lenses from the mold cups, cutting the LEDs into single LED patch lamp beads with the lenses, and welding the LED patch lamp beads with the lenses on a circuit board to manufacture the circuit board module only made of the LED patch lamp beads packaged by the lenses.

The invention provides a method for manufacturing a circuit board module only by using an LED (light-emitting diode) surface-mounted lamp bead packaged by lens glue, which specifically comprises the following steps: manufacturing a row of cup-shaped supports containing a plurality of LED patch lamps, wherein each support cup independently forms a bulge, fixing crystal bonding wires of LED chips on a positive electrode and a negative electrode of the bottom of the support cup, or welding flip chips on positive and negative electrodes of the bottom of the support cup, designing and manufacturing a row of lens molds containing a plurality of cups according to an optical lens design method, demoulding the mold cups, then injecting lens resin glue into each mold cup, downwards soaking the support cup mouth with the welded LED chips into the glue in the mold cup, soaking a part or all of the outer wall of the cup into the glue, corresponding to each support cup, soaking each LED cup mouth and the inside and the outside of the cup into the glue, combining the lens glue and the LED chips to fill the cup, or keeping a certain distance between the lens glue and the LED chips and leaving a cavity, and heating to enable the lens glue to be solidified into a lens, lens firmly combine on the LED support, then will be even the LED of taking lens of arranging dials out from the mould cup, and the subdividing becomes single paster lamp pearl of taking lens, and on will taking LED paster lamp pearl welding of lens to the circuit board again, the circuit board module of LED paster lamp pearl preparation that only lens glued the encapsulation was makeed into.

According to the invention, the invention also provides a circuit board module only packaged by lens glue and manufactured by the LED surface mounted lamp beads, which comprises: an LED patch support; an LED chip; a resin adhesive lens; a circuit board; the LED chip die bonding wire is arranged on a positive electrode metal electrode and a negative electrode metal electrode of an inner bottom of a cup of an LED chip mounting support, or is welded on the positive electrode metal and the negative electrode metal of the inner bottom of the cup of the support by a flip chip and is conducted with the electrodes, positive electrode welding pins and negative electrode welding pins of the outer bottom of the LED chip mounting support are conducted with a chip in the cup, the chip is sealed by lens resin glue on the LED chip, an inner cavity in the cup is filled with the lens resin glue, or a distance is kept between the lens resin glue and the chip, a cavity is arranged in the cup, the lens is a cured resin glue lens and is firmly combined on the LED chip mounting support and is firmly connected with part of the outer wall or all the outer wall of the cup in an adhering mode, the sectional area of the lens and the cup opening is larger than the area of the length and the width of the cup opening of the support, the lens wraps the cup opening of the support, LED paster lamp pearl sets up on the circuit board, forms the circuit board module of the LED paster lamp pearl preparation of only lens glue encapsulation.

According to a preferred embodiment of the present invention, the circuit board module manufactured by using the LED chip lamp bead packaged by the lens glue is characterized in that the resin glue of the resin glue lens is epoxy resin glue or organic silicon resin glue.

According to a preferred embodiment of the invention, the circuit board module manufactured by the LED patch lamp bead packaged by the lens adhesive only is characterized in that the resin adhesive lens is formed by curing liquid resin adhesive on the support cup, and is combined with the LED support in a sealing and high waterproof manner, so that the LED has strong waterproof capability and capability of preventing harmful gas in air from corroding.

According to a preferred embodiment of the invention, the circuit board module manufactured by the LED patch lamp bead packaged by the lens glue is characterized in that the circuit board is a single-sided circuit board, or a double-sided circuit board, or a multilayer circuit board.

According to a preferred embodiment of the present invention, the circuit board module manufactured by using the LED chip lamp bead packaged by the lens glue is characterized in that the circuit board is a flexible circuit board or a rigid circuit board.

The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention will be apparent from the description and drawings, and from the claims.

Drawings

The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings in which:

fig. 1 is a schematic cross-sectional view of a single LED patch mount.

Fig. 2 is a schematic cross-sectional view of the LED chip with wire bonded by die bonding in the LED chip mount.

Fig. 3 is a schematic cross-sectional view of a lens mold.

Fig. 4 is a schematic cross-sectional view of a lens mold after injecting lens resin glue into the mold cup.

FIG. 5 is a schematic cross-sectional view of a die cup with a bonding wire LED chip immersed in glue.

Fig. 6 is a schematic cross-sectional view of a resin adhesive lens, wherein the resin adhesive of the resin adhesive lens is arranged on an LED chip to seal the chip, and the lens resin adhesive fills the inner cavity of the cup and is only used for sealing the LED patch lamp bead.

Fig. 7 is a schematic cross-sectional view of a resin adhesive lens, wherein a distance is formed between the resin adhesive of the lens and a chip, and a cavity is formed in a cup and is only used for encapsulating an LED patch lamp bead by the resin adhesive.

Fig. 8 is another resin adhesive lens, the resin adhesive of the resin adhesive lens on the LED chip seals the chip, and the resin adhesive of the lens fills the inner cavity of the cup and is only the cross-sectional view of the LED patch lamp bead sealed by the lens adhesive.

Fig. 9 is a schematic cross-sectional view of another resin adhesive lens, in which a distance is formed between the lens resin adhesive and the chip, and a cavity is formed in the cup and only the LED chip bead packaged by the lens adhesive is provided.

FIG. 10 is a schematic cross-sectional view of the lens and cup opening at the cup opening, with the area of the length times the width being greater than the area of the length times the width of the cup opening of the holder, with the lens enveloping the cup opening of the holder.

Fig. 11 is a schematic cross-sectional view of a circuit board module manufactured by using LED patch beads packaged by lens glue.

Detailed Description

The present invention will be described in detail below by taking preferred embodiments as examples.

However, it will be appreciated by those skilled in the art that the following descriptions are only illustrative and descriptive of some preferred embodiments and that other similar or equivalent embodiments may also be used to practice the invention.

Fabrication of stents

The whole roll of copper sheet material is punched out into a whole roll of LED support prototype circuit, such as a positive electrode metal 1.1 and a negative electrode metal 1.2 for packaging LED chips, on an iridescent 45T high-speed punching machine by using a designed die.

And then carrying out selective silver plating treatment on the surfaces of the anode metal 1.1 and the cathode metal 1.2 in the whole roll of the LED support prototype circuit by using an Aumet plating wire.

And (2) performing injection molding on a designed and used injection mold on a solar-energy essence injection molding machine, wrapping and fixing the support metal by using temperature-resistant insulating resin 2 formed by injection molding, forming a cup 2.1, and exposing the anode metal 1.1 and the cathode metal 1.2 for packaging the LED chip at the bottom of the cup.

And punching the injection-molded support by using a designed and manufactured punching and bending die on a high-speed punching machine of an iridescent 25T, punching and removing metal at certain positions again to manufacture the LED patch support with a plurality of single LED patch supports connected into a whole, wherein FIG. 1 is a schematic cross-sectional view of the single LED patch support in the connected LED patch support.

Die bonding wire

On a light-emitting DB382 die bonder, die bonding an LED chip 3 on a negative electrode metal 1.2 at the bottom of a cup 2.1, baking and curing, and then connecting a bonding wire of the LED chip 3 on a positive electrode metal 1.1 and a negative electrode welding point 1.2 by a metal bonding wire 4 through an ASM-AB350 bonding machine to complete the manufacture of die bonding wires (as shown in FIG. 2).

Manufacturing method of LED lamp bead with lens

According to the design method of the optical lens, a plurality of cup-shaped lens molds 7 (shown in figure 3) which are arranged in series and matched with the resin adhesive lens shown as a mark 5.1 in figures 6 and 7 are designed and manufactured, a layer of mold release agent is sprayed on the mold cups 7.1, then lens resin glue 5.1 (shown in figure 4) is injected into each mold cup 7.1, the cup openings of the chip connecting support of the die-bonding wire are downwards immersed into the glue 5.1 in the mold cups (shown in figure 5), each support cup corresponds to one mold cup, the inner cup and the outer cup of each LED cup opening are immersed into the glue 5.1, one part of the outer wall of each cup is immersed with the glue, the resin glue 5.1 of the resin adhesive lens seals the LED chip 3, the inner cavity in the lens is filled with the resin glue 5.1 (shown in figure 6), or a distance is reserved between the resin glue 5.1 of the lens and the LED chip 3, a cavity 6 is arranged in each cup (shown in figure 7), and the lens is heated and cured into the lens, the lens is firmly combined at the position of the LED cup mouth, then the LED with the lens in a row is pulled out from the mold cup and is cut into single LED patch lamp beads only packaged by lens glue (as shown in figures 6 and 7), the sectional area of the lens and the cup mouth 2.1 at the position of the cup mouth 2.1 is larger than the area of the length 8.1a multiplied by the width 8.1b of the support cup mouth 2.1 multiplied by the width 8.2b, and the lens wraps the support cup mouth (as shown in figure 10).

Or, according to the design method of the optical lens, a plurality of cup-shaped lens molds which are arranged in series and matched with the resin adhesive lens shown by the mark 5.2 in the figures 8 and 9 are designed and manufactured, a layer of mold release agent is sprayed on the mold cups, then lens resin glue 5.2 is injected into each mold cup, the cup mouth 2.1 of the wafer connecting support for fixing the crystal bonding wire and the chip is downwards immersed into the glue 5.2 in the mold cup, each support cup corresponds to one mold cup, so that the inner cup and the outer cup of each LED cup mouth 2.1 are immersed into the glue 5.1, one part of the outer wall of each cup is immersed into the glue, the resin adhesive 5.2 of the resin adhesive lens seals the LED chip 3, the inner cup cavity is filled with the lens resin adhesive 5.2 (shown in figure 8), or, a distance is reserved between the lens resin adhesive 5.1 and the LED chip 3, a cavity 6 is arranged in each cup (shown in figure 9), the lens is heated to be solidified into the lens, and the lens is firmly combined at the opening of the LED cup, then the LED with the lens in the row is pulled out from the mold cup and cut into single LED patch lamp beads (as shown in figures 8 and 9) only packaged by the lens glue, the area of the length 8.1a multiplied by the width 8.1b of the lens is larger than the area of the length 8.2a multiplied by the width 8.2b of the support cup mouth 2.1 at the position of the cup mouth 2.1 of the lens and the cross section of the cup mouth 2.1, and the lens covers the support cup mouth (as shown in figure 10).

And testing and screening by using a Xuan Shuo XSFG2013-15050 light splitting machine, screening out good products, directly scrapping defective products, and packaging the screened good products in a braid by using a Xuan Shuo braider braid.

Manufacture of circuit board module

Adopt traditional SMT paster technology, on tin cream printing machine, with the steel mesh with tin cream printing on the component pad of circuit board 9, correspond the paster lamp 1.3 of taking the perspective again and paste the pad of having printed the tin cream on, through reflow soldering welding, weld the paster lamp 1.3 of taking the perspective on circuit board 9, make into the circuit board module (as shown in fig. 11) that only lens glued the LED paster lamp pearl of encapsulation was made.

According to the LED surface mount lamp bead packaged by the lens glue on the circuit board module, after the LED chip is well welded by adopting the surface mount lamp support for die bonding, the support cup is reversely buckled and extends into the lens glue of the lens mold cup, and after the support cup is cured, the support cup is taken out of the mold cup, so that the surface mount lamp bead with the lens is manufactured.

The circuit board module manufactured by the LED surface mounted lamp bead packaged by the lens glue is described in detail with reference to the attached drawings. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.

Claims

1. A manufacturing method of a circuit board module made of LED chip lamp beads only encapsulated by lens glue, specifically: making a row of cup-shaped brackets containing a plurality of LED SMD lamps, and each bracket cup is formed independently Protrude, attach the LED chip bonding wire to the positive and negative electrodes at the bottom of the bracket cup, or use flip-chip welding to the positive and negative electrodes at the bottom of the bracket cup. It contains multiple cup-shaped lens molds, and the mold cups are released from the film. Then, lens resin glue is injected into each mold cup, and the bracket cup with the welded LED chip is immersed in the glue in the mold cup. Part or all of the outer wall of the cup is also dipped in glue, each bracket cup corresponds to a mold cup, so that each LED cup mouth and the inside and outside of the cup are immersed in the glue, the lens glue and the LED chip are combined to fill the cup, or the lens glue and Keep a distance between the LED chips and there is still a cavity in the cup. The lens glue is cured by heating to form a lens, and the lens is firmly bonded to the LED bracket. Then the continuous rows of LEDs with lenses are pulled out of the mold cup, and then cut. A single SMD lamp bead with a lens is formed, and then the LED SMD lamp bead with a lens is welded to the circuit board to make a circuit board module made of only the LED SMD lamp bead encapsulated by the lens glue.

2. A circuit board module made of only LED chip lamp beads encapsulated by lens glue, comprising:

LED patch bracket;

LED chip;

resin glue lens;

circuit board;

It is characterized in that the LED chip bonding wire is on the positive and negative metal electrodes of the inner bottom of the LED chip bracket cup, or is welded on the positive and negative metal electrodes of the inner bottom of the bracket cup with a flip chip, and is connected to the electrodes. , The positive and negative welding feet of the outer bottom of the LED chip bracket are connected to the chip in the cup. There is lens resin glue on the LED chip to seal the chip, and the lens resin glue fills the inner cavity of the cup, or the lens resin glue There is a distance from the chip, there is a cavity in the cup, the lens is a cured resin glue lens, and is firmly bonded to the LED patch bracket, and forms a firm adhesive connection with part or all of the outer wall of the cup, At the mouth of the cup, the cross-sectional area of the lens and the mouth of the cup, the area of the length times the width is greater than the area of the length times the width of the cup mouth of the bracket, the lens wraps the mouth of the bracket, forming the LED SMD lamp beads only encapsulated by the lens glue, The LED SMD lamp beads are arranged on the circuit board to form a circuit board module made of only the LED SMD lamp beads encapsulated by the lens glue.

3. The circuit board module of claim 1 or 2 only made of LED patch lamp beads encapsulated by lens glue, characterized in that the resin glue of the resin glue lens is epoxy glue, Or silicone resin glue.

4. The circuit board module of claim 1 or 2 made of only LED chip lamp beads encapsulated by lens glue, wherein the resin glue lens is cured by liquid resin glue on the bracket cup The formed lens and the LED bracket form a combination of sealing and high waterproofness, so that the LED has a strong waterproof ability and the ability to prevent harmful gases in the air from being eroded.

5. A circuit board module made of only LED chip lamp beads encapsulated by lens glue according to claim 1 or 2, wherein the circuit board is a single-sided circuit board or a double-sided circuit board, or a multi-layer circuit board.

6 . The circuit board module made of only LED chip lamp beads encapsulated by lens glue according to claim 1 or 2 , wherein the circuit board is a flexible circuit board or a rigid circuit board. 7 .