CN112240802B - Method and system for monitoring a processing temperature during processing of a workpiece - Google Patents
Method and system for monitoring a processing temperature during processing of a workpiece Download PDFInfo
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- CN112240802B CN112240802B CN201910649514.2A CN201910649514A CN112240802B CN 112240802 B CN112240802 B CN 112240802B CN 201910649514 A CN201910649514 A CN 201910649514A CN 112240802 B CN112240802 B CN 112240802B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/80—Calibration
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Abstract
The invention relates to a method for monitoring a processing temperature during processing of a workpiece, comprising the following steps: determining at least one measurement area on a surface of the workpiece; blackening the at least one measurement zone, thereby rendering the at least one measurement zone black; measuring a temperature value of the at least one measurement region by means of a non-contact temperature measuring device operating on the basis of thermal radiation; and adjusting the processing temperature based on the temperature value. According to the invention, a laser is used to emit a laser beam into the at least one measuring region when the blackening process is carried out. The invention also relates to a system for monitoring the processing temperature during processing of a workpiece.
Description
Technical Field
The invention relates to a method for monitoring a processing temperature during processing of a workpiece. The invention also relates to a system for monitoring the processing temperature during processing of a workpiece.
Background
During workpiece processing, certain process steps require very stringent temperature requirements. In this case, it is not only necessary to be able to measure the temperature value accurately, but also the temperature measuring means cannot significantly influence the temperature value or the temperature distribution to be measured.
Disclosure of Invention
The object of the present invention is to provide a method for monitoring the processing temperature when processing a workpiece and a system for monitoring the processing temperature when processing a workpiece. The method and system according to the invention in particular allow an accurate measurement of the target temperature without affecting the target temperature to be measured.
To achieve this object, the invention provides a method for monitoring a processing temperature when processing a workpiece, the method comprising the steps of:
determining at least one measurement area on a surface of the workpiece;
blackening the at least one measurement zone, thereby rendering the at least one measurement zone black;
measuring a temperature value of the at least one measurement region by means of a non-contact temperature measuring device operating on the basis of thermal radiation;
Adjusting the processing temperature based on the temperature value,
Wherein a laser is used to emit a laser beam towards the at least one measurement area when the blackening process is performed.
The technical scheme according to the invention is based on the following basic concept: in the case of workpiece processing temperature monitoring by means of a non-contact temperature measuring device operating on the basis of thermal radiation (for example, a temperature measuring device based on infrared radiation), the surface of the processed workpiece can be blackened, for example, with a matt black paint, so that a relatively simple and accurate temperature measurement and, if necessary, a calibration of the temperature measuring device can be achieved on the basis of a defined emissivity (for example, 0.95) of the blackened area. However, the present invention recognizes that if the surface of the workpiece is entirely blackened or extensively blackened while the temperature measurement is being taken, it is likely that the temperature to be measured will be significantly affected, e.g., large area blackened will result in a change (e.g., an increase) in the temperature of the non-blackened area. Therefore, according to the present invention, the entire surface of the workpiece is not blackened or blackened in a large area, but only a partial region of the surface of the workpiece is determined or selected as a measurement region and the measurement region is made black by the blackening treatment. In this case, for example, for one side of the workpiece, the area of the measuring region does not exceed 50% of the area of the side, preferably does not exceed 30% of the area of the side, more preferably does not exceed 15% of the area of the side. Therefore, especially in the case of using a noncontact temperature measuring device operating based on heat radiation, the temperature measurement according to the present invention does not significantly affect the target temperature to be measured and can simply and accurately measure the target temperature.
In a preferred embodiment of the invention, the number, position, shape and size of the at least one measuring region are determined taking into account the process requirements and the geometry of the workpiece. The at least one measurement area is preferably one or more black spots of the surface of the workpiece. Here, in the case where there are a plurality of measurement regions, the shape and size of each measurement region may be the same as or different from each other.
In a preferred embodiment of the invention, the parameters of the laser, such as the emission power of the laser, the emission angle and the distance from the measuring area, etc., are set in dependence on the material of the workpiece surface. The blackening treatment may be performed here, for example, using a CO 2 laser, a semiconductor laser, a YAG laser, a fiber laser, or any other type of suitable laser.
In a preferred embodiment of the invention, a thermal infrared imager is used as the non-contact temperature measuring device, which thermal infrared imager is able to provide thermal imaging of the at least one measuring region. In the case of a plurality of measuring regions, temperature information of these measuring regions can be provided simultaneously in thermal imaging by means of a thermal infrared imager
In a preferred embodiment of the invention, one or more infrared thermometers are used as an alternative or in addition to the non-contact temperature measuring device, wherein the size of the individual temperature measuring region of the at least one temperature measuring region is preferably greater than the size of the smallest spot of the infrared thermometers. In this case, the infrared thermometer is aligned to the temperature measuring region to be measured by means of a collimator of the infrared thermometer, for example a laser collimator. For example, in the case where there is only one measurement region, it is preferable that a single infrared thermometer may be used to measure the temperature value of the measurement region. For example, in the case where there are a plurality of measurement regions, each of the plurality of measurement regions may be measured sequentially in a pre-selected determined order and/or time interval using a single infrared thermometer, or each of the plurality of measurement regions may be measured simultaneously using a plurality of infrared thermometers, respectively.
In principle, any other type of non-contact temperature measuring device based on thermal radiation can be used as the non-contact temperature measuring device.
In a preferred embodiment of the invention, the calibration of the non-contact temperature measuring device is performed before the temperature measurement is performed using the non-contact temperature measuring device.
In a preferred embodiment of the invention, the workpiece is a workpiece made of metal, wherein the workpiece is preferably a motor housing made of metal, wherein the metal is in particular cast iron or stainless steel or an aluminum alloy or copper.
In a preferred embodiment of the invention, data information is stored about at least one measuring region of a specific workpiece machining process and its temperature value.
The present invention also provides a system for monitoring a processing temperature while processing a workpiece, the system comprising:
blackening processing means for blackening at least one measurement area on a surface of the workpiece so as to make the at least one measurement area appear black;
a non-contact temperature measuring device which operates on the basis of thermal radiation and is used for measuring a temperature value of the at least one measuring region;
a temperature adjusting device for adjusting the processing temperature based on the temperature value,
Wherein the blackening treatment device is a laser capable of emitting a laser beam towards the at least one measurement zone when the blackening treatment is performed.
In a preferred embodiment of the invention, the setting of the parameters of the laser, which parameters relate for example to the laser's emission power, the emission angle and the distance from the measuring region, etc., depends on the material of the workpiece surface.
In a preferred embodiment of the invention, the blackening treatment means may be a CO 2 laser, a semiconductor laser, a YAG laser, a fiber laser or any other type of suitable laser.
In a preferred embodiment of the invention, the non-contact temperature measuring device is configured as or comprises a thermal infrared imager. The thermal infrared imager is capable of providing at least thermal imaging of the at least one measurement region. In particular, in the case of a plurality of measurement regions, the thermal infrared imager can simultaneously provide temperature information of these measurement regions in the thermal imaging.
In a preferred embodiment of the invention, the non-contact temperature measuring device is alternatively or additionally configured as or comprises at least one infrared thermometer. The size of the smallest spot of the infrared thermometer is preferably smaller than the size of the individual one of the at least one temperature measuring region.
The infrared thermometer preferably has a sight, by means of which the infrared thermometer can be aligned precisely to the temperature measuring region. The sight may be, for example, a laser sight.
For example, in the case where there is only one measurement region, a single infrared thermometer is preferably provided to measure the temperature value of the measurement region. In the case where there are a plurality of measurement areas, a single infrared thermometer may be provided to sequentially measure each of the plurality of measurement areas in a pre-selected determined order and time interval, or a plurality of infrared thermometers may be provided to simultaneously measure each of the plurality of measurement areas, respectively.
In a preferred embodiment of the invention, the system according to the invention for monitoring the processing temperature when processing a workpiece further comprises a control unit. The control unit is capable of controlling the operation of the system according to the invention or the implementation of the method according to the invention.
In a preferred embodiment of the invention, the system according to the invention for monitoring the processing temperature when processing a workpiece may further comprise an input-output unit. The operator can at least perform at least one of the following operations through the input-output unit: determining or selecting at least one measuring region on the surface of the workpiece, setting parameters of the blackening treatment unit and/or of the non-contact temperature measuring device, starting and/or stopping the blackening treatment of the blackening treatment device, starting and/or stopping the measurement of the non-contact temperature measuring device, determining or selecting an adjustment mode and/or an adjustment value of the processing temperature. The operator can also obtain at least one of the following information through the input-output unit: thermal imaging of at least one measurement region of the workpiece during processing, a temperature value of at least one measurement region of the workpiece during processing, alarm information when the processing temperature is abnormal, operation prompt information when the processing temperature is abnormal, and the like.
The input/output unit is in particular designed as a touch screen.
In a preferred embodiment of the invention, the system according to the invention for monitoring the processing temperature when processing a workpiece may further comprise a guiding unit. The guide unit is configured to guide the blackening treatment device and/or the non-contact temperature measurement device to at least one measurement zone on the workpiece. The guiding action of the guiding unit is realized in particular under the control of the control unit.
In a preferred embodiment of the invention, the system according to the invention for monitoring the processing temperature when processing a workpiece may further comprise a storage unit. In the memory unit, data information about at least one measuring region of a specific workpiece machining process and its temperature value can be stored.
The method or system according to the invention for monitoring the processing temperature during processing of a workpiece is particularly suitable for monitoring the temperature during the shrink process for manufacturing the motor housing.
The method or system according to the invention for monitoring the processing temperature during processing of a workpiece has the following advantages in particular:
1. The method or the system can minimally influence the workpiece to be processed and the target temperature to be measured;
2. the target temperature can be measured in a simple and defined manner by means of a contactless temperature measuring device operating on the basis of thermal radiation;
3. the blackening treatment of the workpiece surface, for example by means of a laser, enables the region to be measured to be accurately and flexibly black;
4. the method or system according to the invention is particularly suitable for standardized processing flows.
Drawings
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Those skilled in the art will appreciate that these preferred embodiments are merely exemplary and are not meant to limit the invention in any way.
Fig. 1 shows a schematic flow chart of a method according to the invention for monitoring a processing temperature during processing of a workpiece.
Fig. 2 shows a schematic block diagram of a system according to the invention for monitoring the processing temperature when processing a workpiece.
Detailed Description
Fig. 1 shows a schematic flow chart of a method according to the invention for monitoring a processing temperature during processing of a workpiece. The workpiece is made of metal, for example cast iron, stainless steel, aluminum or copper. The workpiece may also be made of a non-metal.
In a first method step 101, at least one measurement region on the workpiece surface is determined. The at least one measurement region is the target region for temperature measurement.
The at least one measuring region is determined for a specific machining process, in particular taking into account the process requirements and the geometry of the workpiece. For example, the number, position, shape and size of the at least one measuring region can be determined. The at least one measurement area is preferably one or more black spots of the surface of the workpiece.
For example, for one side of the workpiece, the area of the measurement region(s) does not exceed 50%, preferably 30% of the area of the side.
For example, in the case where there are a plurality of measurement regions, the shape and size of each measurement region may be the same as or different from each other.
In a second method step 102, the at least one measurement region determined in the first method step 101 is blackened, so that the at least one measurement region is black.
In this case, a laser can be used to emit a laser beam into the at least one measuring region during the blackening process. Under the influence of the laser beam, the substance of the at least one measuring region changes, for example, the metallographic structure or the nonmetallic chemical composition or oxidizes, so that the at least one measuring region assumes a black color. For this purpose, the blackening treatment may be performed using, for example, a CO 2 laser, a semiconductor laser, a YAG laser, a fiber laser, or any other type of suitable laser. For example, the parameters of the laser may be set in dependence on the material of the at least one measurement region.
The emissivity of the blackened measuring field is preferably greater than 0.9, particularly preferably greater than 0.95.
In a third method step 103, the temperature value of the at least one measuring region is measured by means of a contactless temperature measuring device operating on the basis of thermal radiation.
As the non-contact temperature measuring device, a thermal infrared imager can be used, which can at least provide thermal imaging of the at least one measuring region. In the case of a plurality of measurement regions, temperature information of these measurement regions can be provided simultaneously in thermal imaging by means of a thermal infrared imager. Thermal imaging of the measurement region can also be provided continuously by means of a thermal infrared imager during the processing of the workpiece, in particular during the process steps in which temperature monitoring is required.
Alternatively or additionally, an infrared thermometer may be used as the non-contact temperature measuring device. In this case, the infrared thermometer is aligned to the temperature measuring region to be measured by means of a collimator of the infrared thermometer, for example a laser collimator. For example, in the case where there is only one measurement region, it is preferable that a single infrared thermometer may be used to measure the temperature value of the measurement region. For example, in the case where there are a plurality of measurement regions, each of the plurality of measurement regions may be measured sequentially in a pre-selected determined order and/or time interval using a single infrared thermometer, or each of the plurality of measurement regions may be measured simultaneously using a plurality of infrared thermometers, respectively. Furthermore, the infrared thermometer is selected or arranged such that the size of the smallest spot of the infrared thermometer is smaller than the size of the individual temperature measuring region of the at least one temperature measuring region.
Preferably, the calibration of the non-contact temperature measuring device is performed before the temperature measurement is performed using the non-contact temperature measuring device.
In a fourth method step 104, the processing temperature is adjusted based on the temperature value measured in the third method step 103. The overall processing temperature or the local processing temperature can be adjusted here. Preferably, the temperature profile of the working space or the workpiece to be worked can be adjusted.
Optionally, data information about at least one measured area of a particular workpiece machining process and its temperature value may be stored. For example, the processing may be traced back through analysis of stored data information, particularly for possible reasons when desired processing results are not obtained.
Fig. 2 shows a schematic block diagram of a system according to the invention for monitoring the processing temperature during processing of a workpiece. The system is particularly useful for implementing the above-described method according to the invention.
The system 2 for monitoring the processing temperature when processing a workpiece according to the invention comprises at least a blackening treatment device 201, a non-contact temperature measuring device 202 and a temperature regulating device 203.
The blackening treatment apparatus 201 is configured to perform blackening treatment on at least one measurement area on a surface of a workpiece so that the at least one measurement area is rendered black. The blackening treatment device 201 is here a laser which is capable of emitting a laser beam towards the at least one measuring area and, for example, of causing a metallic metallographic structure change or a nonmetallic chemical composition change or oxidation of the substance of the at least one measuring area under the influence of the laser beam, so that the at least one measuring area assumes a black color. For example, the blackening treatment apparatus 201 may be a CO 2 laser, a semiconductor laser, a YAG laser, a fiber laser or any other type of suitable laser. For example, the parameters of the blackening treatment apparatus 201, in particular of the laser, can be set in dependence on the material of the at least one measurement zone.
The non-contact temperature measuring device 202 is in particular a temperature measuring device operating on the basis of thermal radiation and is used to measure the temperature value of the at least one measuring region.
The non-contact temperature measuring device 202 may be embodied as a thermal infrared imager or may comprise a thermal infrared imager. The thermal infrared imager is capable of providing at least thermal imaging of the at least one measurement region. In particular, in the case of a plurality of measurement regions, the thermal infrared imager can simultaneously provide temperature information of these measurement regions in the thermal imaging. Thermal infrared imagers are also capable of continuously providing thermal imaging of the measurement area during workpiece processing, particularly during process steps requiring temperature monitoring.
Alternatively or additionally, the non-contact temperature measurement device 202 may be configured as or include at least one infrared thermometer. The infrared thermometer preferably has a sight, by means of which the infrared thermometer can be aligned precisely to the temperature measuring region. The sight may be, for example, a laser sight. The size of the smallest spot of the infrared thermometer is preferably smaller than the size of the individual one of the at least one temperature measuring region. For example, in the case where there is only one measurement region, a single infrared thermometer is preferably provided to measure the temperature value of the measurement region. In the case where there are a plurality of measurement areas, a single infrared thermometer may be provided to sequentially measure each of the plurality of measurement areas in a pre-selected determined order and time interval, or a plurality of infrared thermometers may be provided to simultaneously measure each of the plurality of measurement areas, respectively.
The temperature adjustment device 203 adjusts the processing temperature based on the temperature value measured by the non-contact temperature measurement device 203. The overall processing temperature or the local processing temperature can be adjusted, in particular the processing space or the temperature distribution of the workpiece to be processed, depending on the particular application.
Optionally, the system 2 for monitoring the processing temperature when processing a workpiece according to the invention may further comprise a control unit 204. The control unit 204 is capable of controlling the operation of the system according to the invention or the implementation of the method according to the invention. Specifically, the control unit 204 can control the blackening treatment apparatus 201 to perform blackening treatment on at least one measurement area selected or determined by an operator, control the noncontact temperature measurement apparatus 202 to measure a temperature value of the at least one measurement area, and control the temperature adjustment apparatus 203 to perform adjustment of a processing temperature, for example.
Optionally, the system 2 for monitoring the processing temperature while processing a workpiece according to the invention may further comprise an input output unit 205. On the one hand, the operator can perform at least one of the following operations through the input-output unit 205: determining or selecting at least one measuring area on the surface of the workpiece, setting parameters of the blackening treatment unit 201 and/or of the non-contact temperature measuring device 202, starting and/or stopping the blackening treatment of the blackening treatment device 201, starting and/or stopping the measurement of the non-contact temperature measuring device 202, determining or selecting an adjustment mode and/or an adjustment value of the processing temperature. On the other hand, the operator can obtain at least one of the following information through the input-output unit 205: thermal imaging of at least one measurement region of the workpiece during processing, a temperature value of at least one measurement region of the workpiece during processing, alarm information when the processing temperature is abnormal, operation prompt information when the processing temperature is abnormal, and the like. The input/output unit 205 may comprise, as a man-machine interface, for example, a display unit and/or a keyboard and/or a mouse, etc. The input/output unit 205 may be configured as a touch screen, in particular.
Optionally, the system 2 for monitoring the processing temperature while processing a workpiece according to the invention may further comprise a guiding unit 206. The guide unit 206 is particularly configured to guide the blackening treatment device 201 and/or the contactless temperature measuring device 202 into alignment with at least one measuring area on the workpiece. The guiding action of the guiding unit 206 is in particular effected under the control of the control unit 204.
Optionally, the system 2 for monitoring the processing temperature while processing a workpiece according to the invention may further comprise a storage unit 207. In the memory unit 207, data information about at least one measurement region of a specific workpiece machining process and its temperature value can be stored. For example, the stored data information can be processed by analysis to trace back the processing process, in particular to analyze possible causes when the desired processing result is not obtained.
The individual components of the system 2 according to the invention for monitoring the processing temperature during processing of workpieces, which are described above, can be connected to one another by means of a wired connection and/or a wireless connection.
It will be apparent to those skilled in the art that various changes or modifications may be made to the above preferred embodiment without departing from the spirit of the invention, and such changes or modifications do not depart from the scope of the invention.
Claims (16)
1. A method for monitoring a processing temperature while processing a workpiece, the method comprising the steps of:
determining at least one measurement area on a surface of the workpiece;
blackening the at least one measurement zone, thereby rendering the at least one measurement zone black;
measuring a temperature value of the at least one measurement region by means of a non-contact temperature measuring device operating on the basis of thermal radiation;
Adjusting the processing temperature based on the temperature value,
It is characterized in that the method comprises the steps of,
A laser is used to emit a laser beam towards the at least one measurement area when the blackening process is performed,
Wherein a partial region of the surface of the workpiece is selected as the at least one measurement region.
2. The method of claim 1, wherein the parameters of the laser are set according to the material of the workpiece surface.
3. Method according to claim 1 or 2, characterized in that a thermal infrared imager is used as the non-contact temperature measuring device, which thermal infrared imager is capable of providing thermal imaging of the at least one measuring region.
4. Method according to claim 1 or 2, characterized in that one or more infrared thermometers are used as the non-contact temperature measuring device, wherein the size of the individual temperature measuring region of the at least one temperature measuring region is larger than the size of the smallest spot of the infrared thermometers.
5. A method according to claim 1 or 2, characterized in that the workpiece is a workpiece made of metal.
6. The method according to claim 1 or 2, characterized in that for one side of the workpiece the area of the at least one measuring area does not exceed 50% of the area of the side.
7. The method according to claim 1 or 2, characterized in that the at least one measurement area that appears black is one or more black spots of the surface of the workpiece.
8. The method of claim 5, wherein the workpiece is a motor housing made of metal.
9. The method of claim 5, wherein the metal is cast iron or stainless steel or an aluminum alloy or copper.
10. A system for monitoring a processing temperature while processing a workpiece, the system comprising:
blackening processing means for blackening at least one measurement area on a surface of the workpiece so as to make the at least one measurement area appear black;
a non-contact temperature measuring device which operates on the basis of thermal radiation and is used for measuring a temperature value of the at least one measuring region;
a temperature adjusting device for adjusting the processing temperature based on the temperature value,
It is characterized in that the method comprises the steps of,
The blackening treatment means is a laser capable of emitting a laser beam towards the at least one measurement zone when the blackening treatment is performed,
Wherein a partial region of the surface of the workpiece is selected as the at least one measurement region.
11. The system of claim 10, wherein the setting of the parameters of the laser is dependent on the material of the workpiece surface.
12. The system of claim 10 or 11, wherein the non-contact temperature measurement device is configured as or comprises a thermal infrared imager capable of providing thermal imaging of the at least one measurement region.
13. The system of claim 10 or 11, wherein the non-contact temperature measurement device is configured as or comprises an infrared thermometer, wherein a size of a single temperature measurement region of the at least one temperature measurement region is greater than a size of a minimum spot of the infrared thermometer.
14. The system of claim 10 or 11, wherein for one side of the workpiece, the area of the at least one measurement area is no more than 50% of the area of the side.
15. The system of claim 10 or 11, wherein the at least one measurement area that appears black is one or more black spots of the surface of the workpiece.
16. Use of the method according to any one of claims 1 to 9 or the system according to any one of claims 10 to 15 for monitoring temperature in a shrink process for manufacturing a motor housing.
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| CN102242334A (en) * | 2011-07-06 | 2011-11-16 | 中国科学院上海技术物理研究所 | Processing method of local laser blackening for coating metalwork |
| CN103551438A (en) * | 2013-09-28 | 2014-02-05 | 哈尔滨工业大学（威海） | High-strength plate laser heating processing method for thermal forming |
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| US9855637B2 (en) * | 2014-04-10 | 2018-01-02 | Apple Inc. | Thermographic characterization for surface finishing process development |
| DE102016211782A1 (en) * | 2016-06-29 | 2018-01-04 | Trumpf Laser- Und Systemtechnik Gmbh | Method for monitoring a thermal processing of a workpiece and monitoring device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102242334A (en) * | 2011-07-06 | 2011-11-16 | 中国科学院上海技术物理研究所 | Processing method of local laser blackening for coating metalwork |
| CN103551438A (en) * | 2013-09-28 | 2014-02-05 | 哈尔滨工业大学（威海） | High-strength plate laser heating processing method for thermal forming |
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