CN112235932A - Circuit board, preparation method thereof and semiconductor package - Google Patents
Circuit board, preparation method thereof and semiconductor package Download PDFInfo
- Publication number
- CN112235932A CN112235932A CN201910581901.7A CN201910581901A CN112235932A CN 112235932 A CN112235932 A CN 112235932A CN 201910581901 A CN201910581901 A CN 201910581901A CN 112235932 A CN112235932 A CN 112235932A
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- China
- Prior art keywords
- circuit board
- hole
- main body
- board main
- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application discloses a circuit board and a preparation method thereof, and a semiconductor package, wherein the circuit board comprises: the circuit board main body comprises a first surface and a second surface which are oppositely arranged, the circuit board main body is provided with a through hole, the through hole comprises a first through hole communicated with the first surface and a second through hole communicated with the second surface, the first through hole is communicated with the second through hole, and the cross section of the first through hole in the extending direction is in a step shape so as to form at least one bearing surface in the first through hole; the first bonding pad is arranged on the bearing surface; the heat dissipation device comprises a third surface and a fourth surface which are oppositely arranged, the heat dissipation device is arranged in the second through hole, the third surface is positioned at the junction of the first through hole and the second through hole, and at least part of the third surface is exposed to the first through hole and used for mounting the electronic element. The circuit board provided by the application can reduce the wiring difficulty and reduce the signal loss.
Description
Technical Field
The present disclosure relates to the field of circuit board technologies, and in particular, to a circuit board, a manufacturing method thereof, and a semiconductor package.
Background
The circuit board is also called a printed circuit board, and is a support body of electronic components and a carrier for electrical connection.
At present, electronic equipment is developed towards integration and diversification, and accordingly connecting wires between a circuit board and electronic elements are more and more dense, so that the connecting difficulty between the circuit board and the electronic elements is increased.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a circuit board, a manufacturing method thereof and a semiconductor packaging body, which can reduce wiring difficulty and reduce signal loss.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a circuit board including: the circuit board comprises a circuit board main body and a circuit board clamping device, wherein the circuit board main body comprises a first surface and a second surface which are oppositely arranged, the circuit board main body is provided with a through hole, the through hole comprises a first through hole communicated with the first surface and a second through hole communicated with the second surface, the first through hole is communicated with the second through hole, and the cross section of the first through hole in the extending direction is stepped so as to form at least one bearing surface in the first through hole; the first bonding pad is arranged on the bearing surface; the heat dissipation device comprises a third surface and a fourth surface which are oppositely arranged, the heat dissipation device is arranged in the second through hole, the third surface is positioned at the junction of the first through hole and the second through hole, and at least part of the third surface is exposed to the first through hole and used for mounting the electronic element.
In order to solve the above technical problem, another technical solution adopted by the present application is: a semiconductor package is provided, which comprises the circuit board and an electronic element mounted on the third surface of the heat sink.
In order to solve the above technical problem, the present application adopts another technical solution: provided is a method for manufacturing a circuit board, including: providing a first sub circuit board main body, and forming a first through hole on the first sub circuit board main body, wherein the first sub circuit board main body comprises a first surface and a second surface which are oppositely arranged; placing a heat dissipation device in the first through hole, wherein the heat dissipation device comprises a third surface and a fourth surface which are oppositely arranged; laminating the first sub circuit board main body; forming a second sub circuit board main body on the first surface of the first sub circuit board main body so that the second sub circuit board main body covers the heat sink; laminating the first sub circuit board main body and the second sub circuit board main body; and forming a second through hole on the second sub circuit board main body to expose at least part of the third surface of the heat dissipation device, wherein the cross section of the second through hole in the extension direction is stepped to form at least one bearing surface in the second through hole, and at least one bearing surface is provided with a first pad.
The beneficial effect of this application is: the circuit board in the application sets the first through hole to be a ladder shape along the cross section of the extending direction of the first through hole so as to form at least one bearing surface in the first through hole, and sets the first pad on the bearing surface, meanwhile, the heat dissipation device is set in the second through hole, the first through hole is communicated with the second through hole, the third surface of the heat dissipation device is positioned at the junction of the first through hole and the second through hole, and the electronic element can be mounted on the third surface of the heat dissipation device, so that the electronic element can be connected with the first pad through the connecting wire.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic cross-sectional view of a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic view of the circuit board of FIG. 1 in an application scenario with electronic components mounted thereon;
FIG. 3 is a cross-sectional view of one embodiment of a semiconductor package of the present application;
FIG. 4 is a schematic flow chart diagram illustrating one embodiment of a method for manufacturing a circuit board according to the present application;
FIG. 5 is a schematic flow chart of a structure corresponding to the manufacturing method of FIG. 4.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic cross-sectional structure diagram of an embodiment of a circuit board of the present application, and fig. 2 is a schematic diagram of the circuit board of fig. 1 when an electronic component is mounted in an application scenario. The circuit board 100 includes a circuit board body 110, a first pad 120, and a heat sink 130.
The circuit board body 110 includes a first surface 111 and a second surface 112 disposed opposite to each other. The circuit board main body 110 is provided with a through hole 140, the through hole 140 includes a first through hole 141 and a second through hole 142 which are communicated, the first through hole 141 is communicated with the first surface 111 of the circuit board main body 110, and the second through hole 142 is communicated with the second surface 112 of the circuit board main body 110. The cross-sectional shape of the first through-hole 141 along the extending direction thereof is stepped to form at least one bearing surface 1411 in the first through-hole 141. The number of the carrying surfaces 1411 may be one, 2 or more, and it is understood that when the number of the carrying surfaces 1411 is one, only one sidewall of the first through hole 141 is stepped, wherein the number of the carrying surfaces 1411 is not limited herein.
The heat sink 130 includes a third surface 131 and a fourth surface 132 disposed opposite to each other. The heat dissipation device 130 is disposed at the second through hole 142, the third surface 131 is located at a junction of the first through hole 141 and the second through hole 142, and at least a portion of the third surface 131 is exposed to the first through hole 141 for mounting the electronic component 150. The third surface 131 of the heat sink 130 may simultaneously mount a plurality of electronic components 150, and the electronic components 150 may be any devices such as diodes, transistors, or chips that can be mounted on the circuit board 100. Alternatively, the electronic component 150 may be directly mounted on the third surface 131 of the heat dissipation device 130, or may be disposed on the third surface 131 of the heat dissipation device 130 through another intermediate layer, which is not limited herein. For convenience of description, the electronic component 150 is directly disposed on the third surface 131 of the heat sink 130.
The first pads 120 are disposed on the carrying surface 1411, and the first pads 120 are connected to the electronic device 150 through the connection wires 160.
In the prior art, generally, an electronic component is disposed on a surface of a circuit board, and the electronic component is connected to a pad also disposed on the surface of the circuit board through a connection line, but in the present embodiment, the electronic component 150 is disposed on the third surface 131 of the heat sink 130 located in the through hole 140, the first through hole 141 is disposed in a step shape along a cross-sectional shape of the extension direction, and the first pad 120 is disposed on the carrying surface 1411 located in the first through hole 141, so that a length of the connection line 160 connecting the first pad 120 and the electronic component 150 can be reduced, and further, signal loss can be reduced, and difficulty in designing the connection line 160 can be reduced.
The first pad 120 may be entirely exposed to the first through hole 141 (as shown in fig. 1), or only partially exposed to the first through hole 141 (as shown in fig. 2), and when the first pad 120 is partially exposed to the first through hole 141, another portion of the first pad 120 extends into the circuit board body 110, so that the first pad 120 can be accurately positioned. In an application scenario, in the process of processing the circuit board body 110, the first pad 120 is formed while patterning the inner conductor layer, and then the first circuit board body 110 is grooved to form the through hole 140 and expose the first pad 120 (at this time, the first pad 120 may be fully exposed, or partially exposed).
In this embodiment, the circuit board 100 further includes a ground line (not shown) connected to the first pad 120, and the ground line is used to ground the electronic component 150. Meanwhile, in the present embodiment, the circuit board 100 further includes a second pad 170 and a signal line (not shown).
The second pad 170 is disposed on the first surface 111 of the circuit board body 110, and a signal line is connected to the electronic component 150 and the second pad 170, and the signal line is used for transmitting signals and current, wherein the electronic component 150 is also connected to the second pad 170 through the connection line 160.
In this embodiment, the first pads 120 are disposed on the carrying surface 1411, and the second pads 170 are disposed on the first surface 111 of the circuit board main body 110, so that the electronic component 150 can be selectively connected to the first pads 120 or the second pads 170, and when the electronic component 150 is simultaneously connected to the first pads 120 and the second pads 170, the connection lines 160 can be layered, thereby increasing the distance between two adjacent connection lines 160, and reducing the difficulty of electrically connecting the electronic component 150 to the circuit board main body 110.
Of course, in other embodiments, the first pads 120 disposed on the carrying surface 1411 may be connected to signal lines, the second pads 170 disposed on the first surface 111 of the circuit board body 110 may be connected to ground lines, or the first pads 120 and the second pads 170 may be connected to the same signal lines or ground lines at the same time, which is not limited herein.
It should be noted that, when the first pad 120 is connected to a ground line, the shortest transmission distance between the electronic component 150 and the ground can be ensured, and a good grounding effect of the electronic component 150 can be ensured.
In this embodiment, the number of the supporting surfaces 1411 is two, and the supporting surfaces include a first supporting surface 1412 and a second supporting surface 1413, the first supporting surface 1412 and the second supporting surface 1413 are located on the same plane, the first supporting surface 1412 and the second supporting surface 1413 are both disposed parallel to the third surface 131 of the heat dissipation device 130, and the first surface 111 of the circuit board main body 110 is also disposed parallel to the third surface 131 of the heat dissipation device 130. In an application scenario, the vertical distance between the first surface 111 and the third surface 131 is the same as the thickness of the electronic component 150, or the difference between the two is less than a predetermined threshold value, so that the electronic component 150 is substantially flush with the first surface 111 of the circuit board body 110 when the electronic component 150 is mounted on the third surface 131. In another application scenario, the vertical distance between the first supporting surface 1412 and the third surface 131 is smaller than the thickness of the electronic element 150, and the vertical distance between the first surface 111 and the third surface 131 is larger than the thickness of the electronic element 150, so that when the electronic element 150 is mounted on the third surface 131, the surface of the electronic element 150 on the side away from the third surface 131 is located between the first surface 111 and the first supporting surface 1412 (as shown in fig. 2), so as to reduce the sum of the lengths of the connecting lines 160 connected to the electronic element 150, and at this time, when the lengths of the connecting lines 160 connecting the electronic element 150 and the first pads 120 are equal to the length of the connecting lines 160 connecting the electronic element 150 and the second pads 170, the sum of the lengths of the connecting lines 160 connected to the electronic element 150 can be ensured to be minimum.
In the present embodiment, as shown in fig. 1 and 2, the edge of the third surface 131 of the heat sink 130 is shielded by the circuit board main body 110, so as to ensure that the flat portion of the third surface 131 is exposed in the first through hole 141, thereby avoiding the problem of uneven placement of the electronic component 150.
The heat dissipation device 130 is a conductive block with good heat dissipation performance, such as a copper block, and the heat dissipation device 130 receives heat generated by the electronic component 150 and guides the received heat out through the fourth surface 132, and specifically, the heat dissipation device 130 may be formed in a copper-embedded manner, a through hole filling manner, or a high-density interconnection manner. Meanwhile, the area of the third surface 131 of the heat sink 130 is the same as or different from the area of the fourth surface 132, which is not limited herein. It should be noted that, when the area of the third surface 131 is smaller than the area of the fourth surface 132, the heat dissipation device 130 has a larger heat dissipation area and superior heat dissipation performance, and can increase the heat dissipation speed of the entire circuit board 100. Alternatively, when the area of the third surface 131 is smaller than that of the fourth surface 132, as shown in fig. 2, the cross-section of the heat sink 130 along the extending direction of the through hole 140 is T-shaped. Of course, in other embodiments, the cross section of the heat sink 130 along the extending direction of the through hole 140 may also be trapezoidal, square (as shown in fig. 1) or other shapes.
In order to ensure the connection firmness between the circuit board main body 110 and the heat dissipation device 130, an adhesive layer (not shown) is further disposed between the circuit board main body 110 and the heat dissipation device 130, wherein the adhesive layer may be a semi-cured material layer, and in the processing process, when the semi-cured material layer overflows due to heating, the semi-cured material layer can be removed by a mechanical glue removal or laser glue removal manner.
Referring to fig. 3, fig. 3 is a schematic cross-sectional view of a semiconductor package according to an embodiment of the present invention. The semiconductor package 200 includes: a circuit board 210 and an electronic component 220.
The electronic component 220 is mounted on the third surface 2111 of the heat sink 211 in the circuit board 210. The structure of the circuit board 210 is the same as the circuit board 100 in the above embodiment, and the structure of the connection between the electronic element 220 and the circuit board 210 is the same as the structure of the connection between the circuit board 100 and the electronic element 150 in the above embodiment, for details, see the above embodiment.
Optionally, in this embodiment, the semiconductor package 200 may further include an encapsulation layer (not shown) for covering the electronic element 220 to encapsulate the electronic element 220. The material of the packaging layer can be epoxy resin, silica gel and other materials.
Referring to fig. 4, fig. 4 is a schematic flow chart of an embodiment of a method for manufacturing a circuit board according to the present application. With reference to fig. 5, the preparation method includes:
s310: a first sub circuit board body 410 is provided, and a first through hole 420 is formed on the first sub circuit board body 410, and the first sub circuit board body 410 includes a first surface 411 and a second surface 412 which are oppositely arranged.
The first sub circuit board body 410 may be a single-layer circuit body or a multi-layer circuit body, and when the first sub circuit board body 410 is a multi-layer circuit body, a circuit pattern is disposed inside the first sub circuit board body 410. Meanwhile, the first through hole 420 can be formed by mechanical drilling and/or laser drilling, so that the accurate positioning of the first through hole 420 is ensured.
S320: the heat sink 430 is disposed in the first through hole 420, and the heat sink 430 includes a third surface 431 and a fourth surface 432 opposite to each other.
Wherein the thickness of the heat sink 430 is slightly less than that of the first sub circuit board body 410.
S330: the first sub circuit board body 410 is laminated.
The first sub circuit board body 410 is laminated to fixedly connect the first sub circuit board body 410 with the heat sink 430.
During the lamination process, if some glue overflows from the periphery of the heat dissipation device 430, the overflow glue is removed by adopting a mechanical glue removal or laser glue removal mode.
S340: the second sub circuit board main body 440 is formed on the first surface 411 of the first sub circuit board main body 410 such that the second sub circuit board main body 440 covers the heat sink 430.
Wherein the second sub circuit board main body 440 is stacked with the first sub circuit board main body 410. Similar to the first sub circuit board main body 410, the second sub circuit board main body 440 is a single-layer board circuit main body or a multi-layer board circuit main body, and when the second sub circuit board main body 440 is a multi-layer board circuit main body, a circuit pattern is provided inside the second sub circuit board main body 440.
Optionally, before step S340, the heat dissipation device 430 may be electrically connected to one or more conductive layers (not shown) in the first sub circuit board body 410 by electroplating or the like, so as to ensure a subsequent heat dissipation effect. And after the plating, a wiring pattern may be further formed on the second surface 412 of the first sub circuit board body 410.
S350: the first sub circuit board body 410 and the second sub circuit board body 440 are laminated.
The first sub circuit board body 410 and the second sub circuit board body 440 are laminated together to fixedly connect the first sub circuit board body 410 and the second sub circuit board body 440.
S360: a second through hole 450 is formed on the second sub circuit board main body 440 to expose at least a portion of the third surface 431 of the heat sink 430, wherein a cross-sectional shape of the second through hole 450 in an extending direction thereof is stepped to form at least one supporting surface 451 in the second through hole 450, and the first pad 460 is disposed on the at least one supporting surface 451.
Wherein the second through hole 450 may be formed by mechanical drilling and/or laser drilling to ensure accurate positioning of the second through hole 450. Optionally, before step S360, a circuit pattern may be formed on a surface of the second sub circuit board 440 on a side away from the first sub circuit board 410.
The structure of the circuit board manufactured by the present embodiment is the same as that of the circuit board 100 in the previous embodiment, and reference to the above embodiment for details is omitted here for brevity.
In summary, different from the prior art, the circuit board of the present application sets the first through hole to have a step-like cross-sectional shape along the extending direction thereof to form at least one carrying surface in the first through hole, and sets the first pad on the carrying surface, while the heat dissipation device is set in the second through hole, the first through hole is communicated with the second through hole, the third surface of the heat dissipation device is located at the junction of the first through hole and the second through hole, and the electronic component can be mounted on the third surface of the heat dissipation device, so that the electronic component can be connected with the first pad through the connection line.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (11)
1. A circuit board, comprising:
the circuit board comprises a circuit board main body and a circuit board clamping device, wherein the circuit board main body comprises a first surface and a second surface which are oppositely arranged, the circuit board main body is provided with a through hole, the through hole comprises a first through hole communicated with the first surface and a second through hole communicated with the second surface, the first through hole is communicated with the second through hole, and the cross section of the first through hole in the extending direction is stepped so as to form at least one bearing surface in the first through hole;
the first bonding pad is arranged on the bearing surface;
the heat dissipation device comprises a third surface and a fourth surface which are oppositely arranged, the heat dissipation device is arranged in the second through hole, the third surface is positioned at the junction of the first through hole and the second through hole, and at least part of the third surface is exposed to the first through hole and used for mounting the electronic element.
2. The circuit board of claim 1,
the first pad is partially exposed to the first via hole and partially extends into the circuit board body, or the first pad is entirely exposed to the first via hole.
3. The circuit board of claim 1, further comprising:
and the grounding wire is connected with the first bonding pad.
4. The circuit board of claim 1, further comprising:
a second pad disposed on the first surface of the circuit board main body;
and a signal line connected to the second pad.
5. The circuit board of claim 1,
the first surface of the circuit board main body and the third surface of the heat sink are arranged in parallel;
the at least one bearing surface comprises a first bearing surface and a second bearing surface, the first bearing surface and the second bearing surface are positioned on the same plane, and the first bearing surface and the second bearing surface are arranged in parallel with the third surface of the heat dissipation device;
the vertical distance between the first bearing surface and the third surface of the heat sink is smaller than the thickness of the electronic element, and the vertical distance between the first surface of the circuit board main body and the third surface of the heat sink is larger than the thickness of the electronic element.
6. The circuit board of claim 1,
the edge of the third surface of the heat sink is shielded by the circuit board main body.
7. The circuit board of claim 1,
the area of the fourth surface of the heat sink is greater than the area of the third surface of the heat sink.
8. The circuit board of claim 7,
the section of the heat dissipation device along the extension direction of the second through hole is T-shaped.
9. The circuit board of claim 1, further comprising:
and the bonding layer is arranged between the circuit board main body and the heat dissipation device and is used for fixedly connecting the circuit board main body and the heat dissipation device.
10. A semiconductor package comprising the circuit board according to any one of claims 1 to 9 and an electronic component mounted on the third surface of the heat sink.
11. A method of making a circuit board, the method comprising:
providing a first sub circuit board main body, and forming a first through hole on the first sub circuit board main body, wherein the first sub circuit board main body comprises a first surface and a second surface which are oppositely arranged;
placing a heat dissipation device in the first through hole, wherein the heat dissipation device comprises a third surface and a fourth surface which are oppositely arranged;
laminating the first sub circuit board main body;
forming a second sub circuit board main body on the first surface of the first sub circuit board main body so that the second sub circuit board main body covers the heat sink;
laminating the first sub circuit board main body and the second sub circuit board main body;
and forming a second through hole on the second sub circuit board main body to expose at least part of the third surface of the heat dissipation device, wherein the cross section of the second through hole in the extension direction is stepped to form at least one bearing surface in the second through hole, and at least one bearing surface is provided with a first pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910581901.7A CN112235932A (en) | 2019-06-30 | 2019-06-30 | Circuit board, preparation method thereof and semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910581901.7A CN112235932A (en) | 2019-06-30 | 2019-06-30 | Circuit board, preparation method thereof and semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112235932A true CN112235932A (en) | 2021-01-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910581901.7A Pending CN112235932A (en) | 2019-06-30 | 2019-06-30 | Circuit board, preparation method thereof and semiconductor package |
Country Status (1)
| Country | Link |
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| CN (1) | CN112235932A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI851081B (en) * | 2022-06-08 | 2024-08-01 | 達發科技股份有限公司 | Semiconductor package and method for fabricating semiconductor package |
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| US5583378A (en) * | 1994-05-16 | 1996-12-10 | Amkor Electronics, Inc. | Ball grid array integrated circuit package with thermal conductor |
| JPH1165076A (en) * | 1997-08-21 | 1999-03-05 | Fuji Photo Film Co Ltd | Photosensitive material processing device |
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| TWI851081B (en) * | 2022-06-08 | 2024-08-01 | 達發科技股份有限公司 | Semiconductor package and method for fabricating semiconductor package |
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