CN112234047B - Layered electromagnetic shielding packaging structure and manufacturing method thereof - Google Patents
Layered electromagnetic shielding packaging structure and manufacturing method thereof Download PDFInfo
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- CN112234047B CN112234047B CN202011462008.1A CN202011462008A CN112234047B CN 112234047 B CN112234047 B CN 112234047B CN 202011462008 A CN202011462008 A CN 202011462008A CN 112234047 B CN112234047 B CN 112234047B
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
The application provides a layered electromagnetic shielding packaging structure and a manufacturing method of the packaging structure, and relates to the technical field of packaging. In the layered electromagnetic shielding packaging structure, a shielding device comprises a bottom shielding layer, a middle layer and a top shielding layer which are arranged in a stacked mode, a first grounding point and a second grounding point are arranged on a module substrate, the bottom shielding layer is electrically connected with the first grounding point, and the top shielding layer is electrically connected with the second grounding point; the module substrate is provided with a first packaging body for plastic packaging of the shielding device and the chips, the outer surface of the first packaging body is provided with a metal layer, and the bottom shielding layer and the top shielding layer are respectively and electrically connected with the metal layer. Through setting up the layering shielding region, can realize packaging structure top and bottom anti-electromagnetic interference's purpose, packaging structure's middle part plays the effect that weakens electromagnetic shield performance to the anti-interference demand of different kinds of electronic product is adapted.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a layered electromagnetic shielding packaging structure and a manufacturing method of the packaging structure.
Background
With the rapid development of the semiconductor industry, a System in a Package (SIP) module structure is widely used in the semiconductor industry. In addition, as electronic products are widely used for high frequency signals in the communication field, anti-electromagnetic interference design is required for the electronic products.
At present, a partitioned electromagnetic shielding structure is arranged in an electronic product to prevent electromagnetic interference phenomena generated by various chips and components. The electromagnetic shielding structure usually adopts a packaging structure in which a groove is dug and filled with a conductive material, and the conductive material is used for realizing grounding of a metal layer outside the packaging body, so that the electromagnetic shielding effect is achieved. The packaging process is complicated in the mode, the shielding performance of the whole packaging structure is consistent, and the individualized shielding requirements of certain electronic products are difficult to meet.
Disclosure of Invention
The invention aims to provide a layered electromagnetic shielding packaging structure and a packaging structure manufacturing method, which can simplify the process flow, improve the packaging quality, and simultaneously realize the characteristics that the bottom and the top of the packaging structure have better electromagnetic shielding effect and the electromagnetic shielding performance in the middle of the packaging structure is weakened so as to meet the electromagnetic shielding requirements of different types of electronic products.
Embodiments of the invention may be implemented as follows:
in a first aspect, the present invention provides a layered electromagnetic shielding package structure, including a module substrate, a shielding device, and a plurality of chips, wherein the plurality of chips are disposed on the module substrate at intervals, and the shielding device is disposed between at least two adjacent chips;
the shielding device comprises a bottom shielding layer, an intermediate layer and a top shielding layer which are arranged in a stacked mode, a first grounding point and a second grounding point are arranged on the module substrate, the bottom shielding layer is electrically connected with the first grounding point, and the top shielding layer is electrically connected with the second grounding point;
the module substrate is provided with a first packaging body for plastic packaging of the shielding device and the plurality of chips, a metal layer is arranged on the outer surface of the first packaging body, and the bottom shielding layer and the top shielding layer are electrically connected with the metal layer respectively.
In an optional embodiment, the bottom shielding layer and the top shielding layer respectively include a first substrate, a first pad is disposed on a front surface of the first substrate, a second pad is disposed on a reverse surface of the first substrate, and the first pad is electrically connected to the second pad;
one of the first pad and the second pad of the bottom shielding layer is electrically connected to the first ground point, and the other is electrically connected to the metal layer; one of the first pad and the second pad of the top shielding layer is electrically connected to the second ground point, and the other is electrically connected to the metal layer.
In an optional embodiment, a metal pillar is connected to the first pad, and the metal pillar is electrically connected to the first ground point or the second ground point; and the first substrate is provided with a second packaging body for plastically packaging the metal column.
In an alternative embodiment, the molding compound of the second package body is provided with conductive particles.
In an alternative embodiment, the middle layer is a barrier, and one side of the barrier is connected with the bottom shielding layer, and the other side of the barrier is connected with the top shielding layer.
In an optional embodiment, the blocking block is provided with a through hole.
In an alternative embodiment, the barrier includes a second substrate and a third package disposed on the second substrate, one of the second substrate and the third package being connected to the bottom shield and the other being connected to the top shield.
In a second aspect, the present invention provides a method for manufacturing a package structure, including:
manufacturing a shielding device, wherein the shielding device comprises a bottom shielding layer, an intermediate layer and a top shielding layer;
providing a module substrate, wherein a first grounding point and a second grounding point are arranged on the module substrate;
mounting a plurality of chips on the module substrate at intervals, and mounting the shielding device between at least two adjacent chips, wherein the bottom shielding layer is mounted on the module substrate, the middle layer is stacked on one side of the bottom shielding layer far away from the module substrate, and the top shielding layer is stacked on one side of the middle layer far away from the bottom shielding layer; the bottom shielding layer is electrically connected with the first grounding point, and the top shielding layer is electrically connected with the second grounding point;
forming a first packaging body on one side of the module substrate to plastically package the shielding device and the plurality of chips; and a metal layer is arranged on the outer surface of the first packaging body, and the bottom shielding layer and the top shielding layer are respectively and electrically connected with the metal layer.
In an alternative embodiment, the step of fabricating a shielding device comprises:
the steps of manufacturing the bottom shielding layer and the top shielding layer respectively comprise:
providing a first substrate, arranging a first bonding pad on the front surface of the first substrate, arranging a second bonding pad on the back surface of the first substrate, and electrically connecting the first bonding pad and the second bonding pad;
arranging a metal column on the first bonding pad, wherein the metal column is used for being electrically connected with the first grounding point or the second grounding point;
arranging a second packaging body on one side of the first substrate, which is far away from the second bonding pad, so as to plastically package the metal column, wherein the metal column is exposed out of the second packaging body;
the step of fabricating the intermediate layer comprises:
providing a second substrate, and arranging a third packaging body on the second substrate, wherein one of the second substrate and the third packaging body is connected with the bottom shielding layer, and the other one of the second substrate and the third packaging body is connected with the top shielding layer.
In an alternative embodiment, the step of fabricating the intermediate layer further comprises:
and a through hole is formed in the third packaging body.
The layered electromagnetic shielding packaging structure and the manufacturing method thereof provided by the embodiment of the invention have the beneficial effects that:
in the electromagnetic shielding packaging structure, the shielding device comprises a bottom shielding layer, a middle layer and a top shielding layer which are arranged in a stacked mode, a first grounding point and a second grounding point are arranged on the module substrate, the bottom shielding layer is electrically connected with the first grounding point, the top shielding layer is electrically connected with the second grounding point, and the bottom shielding layer and the top shielding layer are respectively electrically connected with an outer metal layer of the packaging structure to achieve the effect of resisting electromagnetic interference. Because the shielding device is provided with the middle layer which is not connected with the ground, the whole packaging structure has better electromagnetic shielding effect at the top and the bottom, and weaker electromagnetic shielding effect at the middle part, and can meet the electromagnetic shielding requirements of different electronic products.
According to the manufacturing method of the packaging structure, the shielding device is arranged on the module substrate in a surface mounting mode by manufacturing the independent shielding device, the complex flow of filling the conductive material by digging grooves in the traditional process can be avoided by adopting the surface mounting mode, the equipment cost is reduced, and the packaging cost is reduced. And the defects of different groove depths, uneven filling and the like caused by groove digging are avoided, and the packaging quality is favorably improved. In addition, the shielding device adopts a layered design, the anti-electromagnetic interference capability of the top and the bottom is strong, the middle part can play a role in weakening electromagnetic shielding, and the shielding device is suitable for shielding requirements of different electronic products.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic cross-sectional view of a layered electromagnetic shielding package structure according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a bottom shielding layer of a layered electromagnetic shielding package structure according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of an intermediate layer of a layered electromagnetic shielding package structure according to a first embodiment of the present invention;
fig. 4 is a schematic plan view of a layered electromagnetic shielding package structure according to a first embodiment of the present invention;
FIG. 5 is a schematic view illustrating a process of forming a bottom shielding layer in a method for fabricating a package structure according to a second embodiment of the present invention;
FIG. 6 is a schematic view illustrating a process of forming an intermediate layer in a method for forming a package structure according to a second embodiment of the present invention;
fig. 7 is a process diagram of a manufacturing method of a package structure according to a second embodiment of the invention.
Icon: 100-layered electromagnetic shielding packaging structure; 110-a module substrate; 111-a first ground point; 114-ground pad; 115-connection pads; 116-solder balls; 121-a first chip; 123-a second chip; 125-a third chip; 130-shielding means; 140-bottom shielding layer; 141-a first substrate; 142-a first pad; 143-second bonding pad; 144-metal posts; 145-a second package; 150-an intermediate layer; 151-a second substrate; 153-third package; 160-top shielding layer; 170-first package; 180-metal layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
The shielding structure in the prior art mostly adopts the mode of grooving and filling conductive material to realize the ground shield, and in this kind of technology, because shielding structure probably is the odd-shaped structure, the grooving shape also is the odd-shaped structure, leads to the depth of grooving to differ very easily, causes conductive material to fill inequality, thereby brings the welding bad scheduling problem. In addition, the pad of the bottom substrate is easily damaged by the grooving process.
In order to overcome the defects of the prior art, the application provides a layered electromagnetic shielding packaging structure 100 and a manufacturing method of the packaging structure, which can improve the defects of the traditional packaging process, simplify the packaging process, improve the packaging quality, and simultaneously realize the integral layered electromagnetic shielding of the packaging structure, namely, the packaging structure has better electromagnetic shielding performance at the bottom and the top, and the middle part can play a role in weakening the electromagnetic shielding performance, so that the shielding requirements of more different types of electronic products can be met.
First embodiment
Referring to fig. 1, the present embodiment provides a layered electromagnetic shielding package structure 100, which includes a module substrate 110, a shielding device 130, and a plurality of chips, wherein the plurality of chips are disposed on the module substrate 110 at intervals, and the shielding device 130 is disposed between at least two adjacent chips. In this embodiment, the plurality of chips includes a second chip 123 and a third chip 125, the shielding device 130 includes a bottom shielding layer 140, an intermediate layer 150 and a top shielding layer 160 stacked in a layer, a first grounding point 111 and a second grounding point (not shown) are disposed on the module substrate 110, the bottom shielding layer 140 is electrically connected to the first grounding point 111, and the top shielding layer 160 is electrically connected to the second grounding point. The module substrate 110 is provided with a first package 170 for plastic packaging of the shielding device 130 and the plurality of chips, the outer surface of the first package 170 is provided with a metal layer 180, and the bottom shielding layer 140 and the top shielding layer 160 are electrically connected to the metal layer 180 respectively. The shielding device 130 is disposed on the module substrate 110 in a mounting manner, so as to avoid grooving and glue filling on the first package body 170, which is more convenient for mounting, and the shielding device 130 can be mounted according to any shape, including but not limited to a square shape, a diamond shape, a circular shape, an oval shape, or any other regular or irregular shape, according to actual shielding requirements.
Referring to fig. 1 and 2, the bottom shielding layer 140 and the top shielding layer 160 respectively include a first substrate 141, a first pad 142 is disposed on a front surface of the first substrate 141, a second pad 143 is disposed on a back surface of the first substrate 141, and the first pad 142 is electrically connected to the second pad 143. Alternatively, the first pad 142 and the second pad 143 communicate through a line inside the first substrate 141. The first pad 142 of the bottom shielding layer 140 is electrically connected to the first ground point 111, the first pad 142 of the top shielding layer 160 is electrically connected to the second ground point, and the bottom shielding layer 140 and the second pad 143 of the top shielding layer 160 are electrically connected to the metal layer 180, respectively. Optionally, the first grounding point 111 on the module substrate 110 is disposed at the bottom of the module substrate 110, and external grounding is achieved through the bottom solder ball 116, and the first pad 142 of the bottom shielding layer 140 is electrically connected to the first grounding point 111 in a manner including, but not limited to, gold wire connection, soldering, internal circuit connection or conductive pillar connection of the module substrate 110, and the like. Similarly, the second grounding point may be led out from the module substrate 110 to the side of the first package body 170 through a gold wire, a conductive pillar, a conductive adhesive, etc. so as to be connected to the first pad 142 of the top shielding layer 160.
Further, the first pad 142 is connected to a metal pillar 144, and the metal pillar 144 is electrically connected to the first ground point 111 or the second ground point. It is understood that the metal pillar 144 of the bottom shielding layer 140 is connected to the first ground point 111, the metal pillar 144 of the top shielding layer 160 is connected to the second ground point, and the connection manner of the metal pillar 144 and the first bonding pad 142 includes, but is not limited to, gold wire connection, soldering, etc., or the metal pillar 144 is formed on the first bonding pad 142 by electroplating, which is not limited in this respect. The first substrate 141 is provided with a second encapsulant 145 for encapsulating the metal posts 144. In this embodiment, the second package 145 completely covers the surface of the second substrate 151 on which the first pads 142 are disposed, and the second package 145 may be formed by pressure injection molding or the like. Optionally, conductive particles are disposed in a molding compound of the second package body 145, the molding compound is epoxy-based resin (epoxy-based resin) or silicon-based resin (silicone-based resin), and the conductive particles include, but are not limited to, at least one or any multiple of copper, tin, bismuth, silver, and graphene. By adding the conductive particles into the molding compound, the electromagnetic interference shielding effect and the heat dissipation efficiency of the shielding device 130 can be improved. Of course, in other alternative embodiments, the molding compound used by the second package 145 may also be an insulating molding compound, i.e., no conductive particles are added.
It is understood that the height of the shielding device 130 can be achieved by controlling the height of the second package body 145, wherein the height of the metal pillar 144 is such that the end of the metal pillar 144 away from the first pad 142 is exposed to the surface of the second package body 145, so that the metal pillar 144 is connected to the first ground point 111 or the second ground point.
It should be noted that the structures of the bottom shielding layer 140 and the top shielding layer 160 are not limited to the above-mentioned cases. In other alternative embodiments, the bottom shielding layer 140 and the top shielding layer 160 may be made of metal blocks, and the metal blocks are respectively connected to the grounding point on the module substrate 110 and the metal layer 180 outside the first package 170 to achieve the electromagnetic shielding effect. Alternatively, the metal posts 144 on the first substrate 141 are eliminated, and the molding compound of the second package 145 is a conductive adhesive, and the conductive adhesive is respectively connected to the grounding point on the module substrate 110 and the metal layer 180 outside the first package 170, so as to achieve the electromagnetic shielding effect.
Alternatively, the middle layer 150 may be a barrier, and one side of the barrier is connected to the bottom shield 140 and the other side is connected to the top shield 160. The stop block can be used for realizing electric connection without realizing electric connection, namely, the sticking is carried out without front and back surfaces, any surface can be selected for sticking, and the sticking process is flexible. The blocking piece may be made of an insulating material, such as plastic, resin, wood block, etc., and is not particularly limited thereto. The blocking block can play a role in structural support and isolation, and the electromagnetic shielding performance is weakened. Furthermore, the blocking block is provided with a through hole, namely the blocking block adopts a hollow or hollowed-out structure, so that the electromagnetic shielding performance can be further weakened. Of course, in other alternative embodiments, the blocking block may also be a solid structure, or other rubber materials may be used as the blocking block, and the like, which is not limited herein.
Referring to fig. 3, in the embodiment, the middle layer 150 includes a second substrate 151 and a third package 153 disposed on the second substrate 151, one of the second substrate 151 and the third package 153 is connected to the bottom shielding layer 140, and the other is connected to the top shielding layer 160. Optionally, the second substrate 151 is connected to the top shielding layer 160, the third package body 153 is connected to the bottom shielding layer 140, and a cavity structure such as a slot or a hole is formed on the third package body 153. It should be noted that the third package body 153 may be formed by pressure injection molding, and the molding compound used for the third package body 153 includes, but is not limited to, epoxy-based resin or silicon-based resin, and conductive particles may be optionally added to the epoxy-based resin or the silicon-based resin or not.
The chip mounted on the module substrate 110 may be mounted in a normal manner or a flip manner. The first package 170 is used to protect the chip on the front surface of the module substrate 110 and the shielding device 130, and optionally, the first package 170 is formed by pressure injection molding in one step to cover the front surface of the module substrate 110. The first package body 170 is made of a molding compound including, but not limited to, epoxy resin or silicon-based resin, and a high thermal conductive material, such as aluminum oxide or nano aluminum oxide, is added to the molding compound to achieve high thermal conductivity of the first package body 170.
It should be understood that the second pads 143 of the top shield layer 160 are exposed at the surface of the first package body 170, or the metal posts 144 of the top shield layer 160 are exposed at the surface of the first package body 170, and the metal layer 180 is disposed at the outer side (the upper surface and four sides) of the first package body 170, so that the top exposed second pads 143 or the metal posts 144 are electrically connected with the metal layer 180. The second pad 143 of the bottom shielding layer 140 may be led out to a side surface (any one of four side surfaces) of the first package body 170 by an internal line or a lead wire manner so as to be connected to the metal layer 180, thereby achieving an electromagnetic shielding effect.
Referring to fig. 4, the module substrate 110 is respectively provided with a first chip 121, a second chip 123 and a third chip 125, wherein the first chip 121 is a switch chip and is not required to be provided with an anti-interference partition. The second chip 123 is a high frequency chip and needs to be isolated by separate partitions, and the third chip 125 is a low frequency chip and can be selectively isolated by partitions. According to the actual shielding requirement, the shielding device 130 is attached to the outside of the second chip 123, the shielding device 130 is in a closed shape, the second chip 123 is enclosed inside, and electromagnetic interference of the second chip 123 to other electronic devices is prevented, the closed shape can be a circle, an ellipse, a square, a diamond, a triangle, a pentagon, a hexagon, an octagon or other special-shaped shapes, and the like, the shielding devices 130 can be continuously attached or attached at intervals to be in the required shape, or the shielding devices 130 can be cut into the required shape when the shielding device 130 is manufactured. The third chip 125 may be mounted with the shielding device 130 in an open loop shape, such as a straight segment, an arc segment, a semi-circle or other curved segments for isolation, because the shielding requirement is relatively low. Of course, the isolation structure of the third chip 125 may be formed by mounting a plurality of shielding devices 130 continuously or at intervals, or may be formed by cutting the shielding devices 130 with a desired shape at one time, which is not limited herein.
According to the layered electromagnetic shielding packaging structure 100 provided by the embodiment of the invention, the shielding device 130 is layered on the module substrate 110, and the bottom shielding layer 140, the middle layer 150 and the top shielding layer 160 are sequentially stacked upwards, so that the layered electromagnetic shielding packaging structure is simple in mounting mode operation, does not damage the module substrate 110, is reliable in circuit connection, and can be flexibly set in mounting shapes including but not limited to various regular shapes or special shapes. The height of the shielding device 130 is easy to control, the packaging structure has a layered electromagnetic shielding function, the top and the bottom of the packaging structure have stronger anti-electromagnetic interference capability, the middle of the packaging structure has an effect of weakening the electromagnetic shielding performance, and the packaging structure can be applied to occasions with low requirements on the electromagnetic shielding performance.
Second embodiment
The embodiment of the invention provides a manufacturing method of a packaging structure, which mainly comprises the following steps:
s100: a shielding device 130 is fabricated. Wherein the shielding device 130 comprises a bottom shielding layer 140, an intermediate layer 150 and a top shielding layer 160.
Referring to fig. 5, with reference to fig. 1, S110: the steps of fabricating the bottom shield 140 and the top shield 160 respectively include:
a first substrate 141 is provided, a first pad 142 is disposed on the front surface of the first substrate 141, a second pad 143 is disposed on the back surface of the first substrate 141, and the first pad 142 and the second pad 143 are electrically connected through a circuit inside the first substrate 141. A metal pillar 144 is disposed on the first pad 142, and the metal pillar 144 is electrically connected to the first ground point 111 or the second ground point. The metal pillar 144 may be electrically connected to the first pad 142 by soldering, or the metal pillar 144 may be formed by plating metal on the first pad 142. It is understood that if the metal pillar 144 and the first bonding pad 142 are disposed at a distance, the metal pillar 144 and the first bonding pad 142 can be electrically connected by wire bonding. In this embodiment, the metal pillar 144 is directly disposed on the first bonding pad 142, so that the volume of the shielding device 130 can be reduced.
After the metal posts 144 are disposed, the second package 145 is disposed on a side of the first substrate 141 away from the second pads 143, so as to mold the metal posts 144, and the metal posts 144 are exposed out of the second package 145. The second package 145 is formed by injection molding or other filling methods. The second package 145 is made of epoxy-based resin (epoxy-based resin) or silicon-based resin (silicon-based resin), and conductive particles including but not limited to at least one or more of copper, tin, bismuth, silver, and graphene are added to the epoxy-based resin or the silicon-based resin. By adding the conductive particles into the molding compound, the electromagnetic interference shielding effect and the heat dissipation efficiency of the shielding device 130 can be improved. It is easily understood that the height of the shielding device 130 can be controlled by the height of the second package 145, and the overall mounting height is easy to control. After the second package 145 is formed, the second package 145 is polished to expose the metal pillar 144 from the surface of the second package 145. Alternatively, in the process of forming the second package 145 by pressure injection molding, the metal pillar 144 is protected by a mold, so that the formed second package 145 does not cover the metal pillar 144, that is, the metal pillar 144 is naturally exposed from the second package 145 after injection molding, and the grinding step can be omitted.
Finally, the shielding device 130 is cut into a desired shape, including but not limited to a circle, an ellipse, a square, a diamond, a triangle, a pentagon, a hexagon, an octagon, or other irregular shape, etc., by cutting the second package 145 and the first substrate 141.
S120: the step of fabricating the intermediate layer 150 includes:
referring to fig. 6 in combination with fig. 1, a second substrate 151 is provided, a third package body 153 is disposed on the second substrate 151, the third package body 153 covers a side surface of the second substrate 151, one of the second substrate 151 and the third package body 153 is connected to the bottom shielding layer 140, and the other is connected to the top shielding layer 160. Alternatively, the second substrate 151 is connected to the top shield layer 160, and the third package body 153 is connected to the bottom shield layer 140. Since the intermediate layer 150 may not be used for electrical connection, the mounting of the intermediate layer 150 is non-directional. Further, a through hole is formed in the third package body 153, so that the third package body 153 forms a hollow structure or a hollow structure to further weaken the electromagnetic shielding performance, and is suitable for occasions with low electromagnetic shielding requirements. Optionally, the molding compound used for the third package body 153 includes, but is not limited to, epoxy-based resin or silicon-based resin, and conductive particles may be optionally added or not added to the epoxy-based resin or the silicon-based resin. The third package body 153 and the second substrate 151 are finally cut into a desired shape, including but not limited to a circle, an oval, a square, a diamond, a triangle, a pentagon, a hexagon, an octagon, or other irregular shape.
In other alternative embodiments, the intermediate layer 150 may also directly adopt a block structure made of resin or plastic, and the packaging process is omitted, and the block structure may be a solid, hollow or hollow structure, and may be directly cut into a desired shape.
Referring to fig. 7, S200: a module substrate 110 is provided, and a first grounding point 111 and a second grounding point are disposed on the module substrate 110. It should be noted that the first grounding point 111 and the second grounding point may be directly connected, or respectively connected to a grounding line on the module substrate 110, or the first grounding point 111 and the second grounding point are respectively provided with a solder ball 116 through a grounding pad 114 at the bottom of the module substrate 110, and the external grounding is realized through the solder ball 116, which is not limited herein.
S210: a plurality of chips are mounted on the module substrate 110 at intervals, and the shielding device 130 is mounted between at least two adjacent chips, wherein the bottom shielding layer 140 is mounted on the module substrate 110, and the metal posts 144 of the bottom shielding layer 140 are electrically connected to the first grounding points 111 on the module substrate 110. The middle layer 150 is stacked on the bottom shielding layer 140 at a side away from the module substrate 110, and the mounting of the middle layer 150 is non-directional. The top shielding layer 160 is stacked on the side of the middle layer 150 away from the bottom shielding layer 140; and the metal pillar 144 side of the top shielding layer 160 faces upward, i.e. the first substrate 141 of the top shielding layer 160 is attached to the middle layer 150. It should be noted that the chip may be disposed in a forward mounting manner or a reverse mounting manner, and the mounting method of the chip and the shielding device 130 includes, but is not limited to, Surface Mount Technology (SMT) or surface mount bonding technology, and is not limited to this. The mounting order of the chip and the shielding device 130 may not be distinguished, and in this embodiment, in order to improve the mounting efficiency, the chip and the shielding device 130 may be mounted at the same time. The front and back sides of the bottom shielding layer 140, the middle layer 150 and the top shielding layer 160 do not need to be separated during mounting, for example, when the bottom shielding layer 140 is mounted, the metal pillar 144 faces upward, i.e., faces away from one side of the module substrate 110, at this time, the first bonding pad 142 is electrically connected to the metal layer 180 through the metal pillar 144 and the leading-out terminal connected to the metal pillar 144, and the second bonding pad 143 is connected to the first grounding point 111 on the module substrate 110. Alternatively, the metal pillar 144 of the bottom shielding layer 140 is mounted downward, the first pad 142 is connected to the first ground point 111 on the module substrate 110 through the metal pillar 144, and the second pad 143 is connected to the metal layer 180 through the lead terminal. Similarly, the metal studs 144 of the top shielding layer 160 can be selectively mounted upwards or downwards, and are not limited in particular.
S220: after the mounting of the chip and the shielding device 130 is completed, a first package 170 is formed on one side of the module substrate 110 to plastically package the shielding device 130 and the plurality of chips. The first package body 170 may be formed by pressure injection molding, the molding compound used by the first package body 170 includes, but is not limited to, epoxy resin or silicon-based resin, and a high thermal conductive material, such as aluminum oxide thermal conductive powder or nano aluminum oxide, is added in the molding compound, so as to achieve the high thermal conductive performance of the first package body 170 and improve the heat dissipation performance of the package body. Optionally, after the first package body 170 is molded, the first package body 170 needs to be polished to expose the metal pillar 144 of the top shielding layer 160 out of the first package body 170. Alternatively, a suitable pressure mold is selected in the pressure injection molding process to protect the metal pillars 144 of the top shielding layer 160, so that the metal pillars 144 are naturally exposed after the first package body 170 is molded, thereby omitting the grinding step. In this embodiment, the first package body 170 is different from the second package body 145 and the third package body 153 in plastic package materials, that is, different materials are used for plastic package, which not only satisfies the electromagnetic shielding function of the shielding device 130, but also satisfies the heat dissipation performance of the package structure, and is beneficial to improving the overall quality of the package structure.
S230: the module substrate 110 is mounted with solder balls on a side thereof away from the first package 170, i.e., the solder balls 116 are disposed on the back side of the module substrate 110. It is easily understood that the back surface of the module substrate 110 is provided with the ground pads 114 and the connection pads 115, and the ground pads 114 and the connection pads 115 are each provided with the solder balls 116. The ground pad 114 is connected to the first ground point 111 and the second ground point on the module substrate 110, and the ground pad 114 is grounded by disposing the solder ball 116. The connection pads 115 are used for connection with other circuit boards by disposing solder balls 116.
S240: after the ball mounting process, the first package 170 and the module substrate 110 are cut. Cutting the single product into single products by using a cutting machine.
S250: a metal layer 180 is disposed on an outer surface of the first package body 170, and the bottom shielding layer 140 and the top shielding layer 160 are electrically connected to the metal layer 180, respectively. The metal layers 180 are formed on the outer surface, i.e., the upper surface and four side surfaces, of the first package body 170 by using a sputtering process for the cut single product, and the metal posts 144 of the top shielding layer 160 are directly electrically connected with the metal layers 180 due to the fact that the upper surface of the first package body 170 is exposed. The second pad 143 of the bottom shield layer 140 may be drawn out to any one of the four sides of the first package body 170 through a lead wire or an internal circuit of the first substrate 141, etc. to be electrically connected to the metal layer 180 sputtered on the four sides. It is understood that, when the shielding device 130 is mounted, a terminal connected to the second pad 143 of the bottom shielding layer 140 may be reserved, and after the cutting, the terminal is cut and exposed to a side surface of the first package body 170 so as to be electrically connected to the sputtered metal layer 180. Of course, the metal layer 180 may be formed by electroplating or attaching a metal film, and is not limited in this respect.
It should be noted that, the sequence of the above process steps can be flexibly adjusted according to actual situations, and is not specifically limited herein. The contents of the other parts not mentioned in this embodiment are similar to those described in the first embodiment, and are not described again here.
In summary, the embodiments of the present invention provide a method for manufacturing a layered electromagnetic shielding structure and a packaging structure, which has the following advantages:
according to the layered electromagnetic shielding packaging structure 100 and the manufacturing method thereof, the independent shielding device 130 is adopted, the height of the shielding device 130 is easy to control, the height of the shielding device 130 can be controlled through the height of the metal column 144, the height of the second packaging body 145 and the height of the third packaging body 153, sputtering of the subsequent metal layer 180 is more uniform, and the electromagnetic shielding effect is improved. The shielding device 130 is arranged on the module substrate 110 in a mounting mode, so that tedious processes such as grooving, filling and the like are avoided, the process is simplified, the packaging efficiency is improved, meanwhile, the damage of grooving to the module substrate 110 is avoided, the packaging quality is improved, devices such as grooving and the like are also reduced, and the cost is reduced. And the mounting process can set the shielding device 130 into any shape, the process is flexible, and the electromagnetic shielding requirements of different types of chips can be met. The shielding device 130 is arranged in a stacked mode, the bottom shielding layer 140 and the top shielding layer 160 are the same in structure, the mounting process is not structurally divided and can be replaced with each other, the middle layer 150 is not used for electric connection, and mounting is non-directional, namely the whole shielding device 130 is flexible in mounting, and double-sided mounting can be achieved. After the packaging structure is layered and stacked, the top and the bottom of the whole packaging structure are high in electromagnetic shielding performance, the middle of the whole packaging structure is low in electromagnetic shielding performance, and shielding requirements of different occasions can be met. In addition, in the whole manufacturing method of the packaging structure, the defects of chip failure and the like caused by glue overflow in the traditional process can be effectively prevented. In this embodiment, the first package body 170 is different from the second package body 145 and the third package body 153 in the molding compound, and the combination of the molding compounds can satisfy the electromagnetic shielding function of the shielding device 130, and the heat dissipation performance of the package structure, which is beneficial to improving the overall quality of the package structure.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A layered electromagnetic shielding packaging structure is characterized by comprising a module substrate, a shielding device and a plurality of chips, wherein the plurality of chips are arranged on the module substrate at intervals, and the shielding device is arranged between at least two adjacent chips;
the shielding device comprises a bottom shielding layer, an intermediate layer and a top shielding layer which are arranged in a stacked mode, a first grounding point and a second grounding point are arranged on the module substrate, the bottom shielding layer is electrically connected with the first grounding point, and the top shielding layer is electrically connected with the second grounding point; the intermediate layer is made of an insulating material;
the module substrate is provided with a first packaging body for plastic packaging of the shielding device and the plurality of chips, a metal layer is arranged on the outer surface of the first packaging body, and the bottom shielding layer and the top shielding layer are electrically connected with the metal layer respectively.
2. The layered electromagnetic shielding package structure of claim 1, wherein the bottom shielding layer and the top shielding layer each comprise a first substrate, a front surface of the first substrate is provided with a first pad, a back surface of the first substrate is provided with a second pad, and the first pad and the second pad are electrically connected;
one of the first pad and the second pad of the bottom shielding layer is electrically connected to the first ground point, and the other is electrically connected to the metal layer; one of the first pad and the second pad of the top shielding layer is electrically connected to the second ground point, and the other is electrically connected to the metal layer.
3. The layered electromagnetic shielding package structure of claim 2, wherein the first pad is connected to a metal pillar, the metal pillar being electrically connected to the first ground point or the second ground point; and the first substrate is provided with a second packaging body for plastically packaging the metal column.
4. The layered electromagnetically shielded package structure as claimed in claim 3, wherein the molding compound of the second package body has conductive particles disposed therein.
5. The layered electromagnetic shielding package structure of claim 1, wherein the middle layer is a barrier, and one side of the barrier is connected to the bottom shielding layer and the other side of the barrier is connected to the top shielding layer.
6. The layered electromagnetically shielded package structure of claim 5, wherein the barrier has a through hole.
7. The layered electromagnetically shielded package structure of claim 5, wherein the barrier comprises a second substrate and a third package disposed on the second substrate, one of the second substrate and the third package being coupled to the bottom shield and the other being coupled to the top shield.
8. A method for manufacturing a package structure includes:
manufacturing a shielding device, wherein the shielding device comprises a bottom shielding layer, an intermediate layer and a top shielding layer;
providing a module substrate, wherein a first grounding point and a second grounding point are arranged on the module substrate;
mounting a plurality of chips on the module substrate at intervals, and mounting the shielding device between at least two adjacent chips, wherein the bottom shielding layer is mounted on the module substrate, the middle layer is stacked on one side of the bottom shielding layer far away from the module substrate, and the top shielding layer is stacked on one side of the middle layer far away from the bottom shielding layer; the bottom shielding layer is electrically connected with the first grounding point, and the top shielding layer is electrically connected with the second grounding point; the intermediate layer is made of an insulating material;
forming a first packaging body on one side of the module substrate to plastically package the shielding device and the plurality of chips; and a metal layer is arranged on the outer surface of the first packaging body, and the bottom shielding layer and the top shielding layer are respectively and electrically connected with the metal layer.
9. The method for manufacturing a package structure according to claim 8, wherein the step of manufacturing a shielding device comprises:
the steps of manufacturing the bottom shielding layer and the top shielding layer respectively comprise:
providing a first substrate, arranging a first bonding pad on the front surface of the first substrate, arranging a second bonding pad on the back surface of the first substrate, and electrically connecting the first bonding pad and the second bonding pad;
arranging a metal column on the first bonding pad, wherein the metal column is used for being electrically connected with the first grounding point or the second grounding point;
arranging a second packaging body on one side of the first substrate, which is far away from the second bonding pad, so as to plastically package the metal column, wherein the metal column is exposed out of the second packaging body;
the step of fabricating the intermediate layer comprises:
providing a second substrate, and arranging a third packaging body on the second substrate, wherein one of the second substrate and the third packaging body is connected with the bottom shielding layer, and the other one of the second substrate and the third packaging body is connected with the top shielding layer.
10. The method for manufacturing a package structure according to claim 9, wherein the step of manufacturing the intermediate layer further comprises:
and a through hole is formed in the third packaging body.
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| CN114051373B (en) * | 2021-11-12 | 2025-07-15 | Oppo广东移动通信有限公司 | Adapters and electronic equipment components |
| CN115064521A (en) * | 2022-06-02 | 2022-09-16 | 江苏卓胜微电子股份有限公司 | Radio frequency module packaging structure, manufacturing method and radio frequency equipment |
| CN115549633B (en) * | 2022-10-27 | 2023-07-28 | 泓林微电子（昆山）有限公司 | Substrate integrated inductance shielding structure, acoustic wave filter device formed by same and application of acoustic wave filter device |
| CN115763440B (en) * | 2022-11-08 | 2025-06-10 | 北京唯捷创芯精测科技有限责任公司 | A cavity-type electromagnetic shielding structure, preparation method and electronic equipment |
| CN117133724B (en) * | 2023-03-20 | 2024-10-01 | 荣耀终端有限公司 | Packaged chip structure, processing method thereof and electronic equipment |
| CN118763006B (en) * | 2024-09-09 | 2024-12-20 | 甬矽电子(宁波)股份有限公司 | Electromagnetic shielding structure manufacturing method and packaging structure |
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