CN112212978B

CN112212978B - A high temperature temperature field camera based on a color camera chip

Info

Publication number: CN112212978B
Application number: CN202011009298.4A
Authority: CN
Inventors: 李昌立
Original assignee: Fitzk Optoelectronics Changchun Co ltd
Current assignee: Fitzk Optoelectronics Changchun Co ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2024-12-03
Anticipated expiration: 2040-09-23
Also published as: CN112212978A

Abstract

The invention discloses a high-temperature field camera based on a color camera chip, which comprises an optical lens, a temperature field camera and a computer with display software, wherein the optical lens is connected with the temperature field camera, the temperature field camera is electrically connected with the computer with the display software, the temperature field camera comprises a band-pass filter, a color camera chip, a circuit and a temperature image processing unit, the band-pass filter is connected with the color camera chip, light radiation emitted by a high-temperature target to be detected is focused by the optical lens, out-of-band noise is filtered by the band-pass filter, the light radiation is imaged on the color camera chip, the color camera chip converts light signals into electric signals according to R, G, B primary colors, and the electric signals are processed by the circuit and the temperature image processing unit and then transmitted to the computer to give out temperature field distribution of the high-temperature target to be detected. The test result of the invention is little influenced by factors such as the state of the target to be tested, the surface roughness, the surface chemical characteristics and the like, and can accurately realize the test of the temperature field distribution of the target with the height of Wen Daice.

Description

High-temperature field camera based on color camera chip

Technical Field

The invention belongs to the technical field of temperature testing, and particularly relates to a high-temperature field camera based on a color camera chip.

Background

In the fields of metal smelting, ceramic firing and the like, the method is used for efficiently and accurately measuring and monitoring the temperature of the surface of a product in the production process, is one of important links for ensuring the quality of the product, is required to accurately test the temperature of a vane running at high speed in order to ensure the stability of the performance of the engine and improve the service life of the engine in the field of engines, is required to accurately test the temperature of a vane running at high speed in the field of aeroengines, is required to accurately test the temperature characteristic of an aeroplane entering the atmosphere in the field of scientific research in the process of researching an ultra-high-speed target wind tunnel, is required to accurately test and control the temperature characteristic of a new technology, is required to be tested in the process of researching and developing a new material and the like, and is not required to be subjected to the distribution of a high-temperature field, and is required to accurately reflect the temperature field characteristic of a target to be tested in real time.

The temperature field testing equipment in the current market mainly comprises two types, namely a thermal imager based on radiation temperature measurement and a temperature indicating paint (temperature sensitive paint). The thermal imager works in a far infrared (8-14 μm) wave band, and works in visible red light and near infrared (0.6-1.1 μm), and the thermal imager in the two wave bands adopts a single wave band, considers that the emissivity of the material is constant and does not change along with the change of temperature and state, and in the test, an approximation value needs to be manually input, so that the influence on the test result is not great for the material with definite emissivity and under the condition that the temperature test precision is not too high, but the influence on the test result is not negligible for the high temperature condition, particularly the solid-liquid state transition, the surface roughness change, the presence or absence of an oxide layer and the like.

The temperature indicating paint is a functional paint which is coated on the surface of an object to be measured, the color of the paint changes along with the change of temperature, and the temperature of the surface of the object and the distribution of the temperature indicating paint are judged through the change of the color. The temperature measurement mode belongs to non-invasive type, does not need to test a lead wire, cannot damage a test piece, cannot interfere a target temperature field, can be used for measuring in a severe environment, cannot damage the structure and working state of the tested piece, cannot influence the starting and heat transfer characteristics of the tested piece, has uniqueness on the wall surface temperature of a higher-speed rotating structure and a complex component and displaying large-area distribution, and is convenient to use and low in cost. Its advantages are narrow temp range, low resolution precision and easy consumption.

Therefore, how to provide a high temperature field camera based on a color camera chip is a problem that needs to be solved by those skilled in the art.

Disclosure of Invention

In view of the above, the invention provides a high-temperature field camera based on a color camera chip, which is slightly influenced by factors such as the state, surface roughness, surface chemical characteristics and the like of a target to be detected, can accurately realize the test of the temperature field distribution of the target with the height Wen Daice, and accurately reflects the temperature field characteristics of the target to be detected in real time.

In order to achieve the above purpose, the present invention adopts the following technical scheme:

a high-temperature field camera based on a color camera chip comprises an optical lens, a temperature field camera and a computer with display software;

the temperature field camera is electrically connected with the computer containing the display software through a data line;

the temperature field camera comprises a band-pass filter, a color camera chip, a circuit and a temperature image processing unit, wherein the band-pass filter is mechanically connected with the color camera chip or is bonded by adopting optical cement;

The method comprises the steps of focusing optical radiation emitted by a target to be detected at high temperature through the optical lens, filtering out-of-band noise through the band-pass filter, imaging the optical radiation onto the color camera chip, converting optical signals of corresponding wave bands into electric signals by the color camera chip according to R, G, B three primary colors, amplifying and AD (analog-to-digital) converting the electric signals by the circuit and the temperature image processing unit, transmitting the electric signals to a computer containing display software through the data line after operation, and giving out temperature field distribution of the target to be detected at high temperature through the display software.

Preferably, the temperature of the target to be measured meets the following temperature measurement principle based on a colorimetric method

Wherein lambda _R、λ_G、λ_B is the center wavelength of the color separation filter of the three primary colors of the camera chip R, G, B, delta lambda _R、Δλ_G、Δλ_B is the spectral bandwidth taking lambda _R、λ_G、λ_B as the center wavelength, T _R-G is the target thermodynamic temperature represented by R and G, T _B-G is the target thermodynamic temperature represented by B and G, C ₂ is the Planckian second radiation constant, A _R、A_G and A _B are the gray scale and signal intensity conversion coefficients of the three primary colors of R, G, B respectively and are constants, H (lambda _R)、H(λ_G)、H(λ_B) is the spectral gray scale corresponding to the three primary colors of R, G, B respectively, epsilon (lambda _R,T)、ε(λ_G,T)、ε(λ_B, T) is the spectral emissivity of the center wavelength in the spectral band of the three primary colors of R, G, B respectively, and I (lambda _R)、I(λ_G)、I(λ_B) is the intensity distribution function taking lambda _R、λ_G、λ_B as the center wavelength respectively;

In the range of the visible light range, Is constant and is provided with

Wherein, I _R、I_G、I_B is intensity information corresponding to three primary color pixels of the camera chip R, G, B;

The radiation temperature of the surface of the object to be measured is

Preferably, the optical lens has functions of focal length adjustment and aperture adjustment.

Preferably, the band width of the band-pass filter is 0.4 μm to 0.8 μm.

Preferably, the color camera chip is a silicon-based CCD or CMOS color camera chip.

Preferably, the circuit and the temperature image processing unit perform temperature analysis of the corresponding point of the target to be detected by adopting the following steps:

The method comprises the steps that firstly, a central processing unit of a circuit and a temperature image processing unit (230) collect R, G, B three primary color pixel intensity information I _R、I_G、I_B;

Judging the value of I _R、I_G、I_B, if I _R、I_G is far more than 0, calculating the temperature of the corresponding point of the target to be detected according to a formula (3), if I _R is close to or equal to 0 and I _B、I_G is more than 0, calculating the temperature of the corresponding point of the target to be detected according to a formula (4), and in a formula (6) or a formula (7), if I _G is equal to 0 or two values of I _R、I_G、I_B are 0, the temperature of the target is lower than a judging threshold value and can not be judged, and displaying the lowest judging temperature;

And thirdly, transmitting the temperature information of each point analyzed in the second step to the computer (300) containing display software through a data line, constructing a temperature field of the target to be detected with high temperature through the display software, and giving out temperature field distribution information.

The invention has the beneficial effects that:

The invention is little influenced by factors such as the state of the target to be measured, the surface roughness, the surface chemical characteristics and the like, can work in environments with lower visibility such as a kiln, hot rolling and the like, can accurately realize the test of the temperature field distribution of the target with the height Wen Daice, meets the requirements of kiln, smelting, wind tunnel test and the like, and accurately reflects the temperature field characteristics of the target to be measured in real time.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view of the structure of the present invention.

Fig. 2 is a block diagram of the structure of the present invention.

FIG. 3 is a flow chart of a method for analyzing the temperature of a corresponding point of a target to be measured by the circuit and the temperature image processing unit according to the present invention.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Referring to FIGS. 1-2, the present invention provides a high temperature field camera based on a color camera chip, comprising an optical lens 100, a temperature field camera 200 and a computer 300 with display software;

The temperature field camera 200 is electrically connected with a computer 300 containing display software through a data line;

The temperature field camera 200 comprises a bandpass filter 210, a color camera chip 220, a circuit and a temperature image processing unit 230, wherein the bandpass filter 210 is mechanically connected with the color camera chip 220 or is bonded by adopting optical adhesive;

The optical radiation emitted by the object to be detected is focused by the optical lens 100, out-of-band noise is filtered by the band-pass filter 210 and imaged on the color camera chip 220, the color camera chip 220 converts optical signals of corresponding wave bands into electric signals according to R, G, B three primary colors, the electric signals are amplified and AD converted by the circuit and temperature image processing unit 230, and the electric signals are transmitted to the computer 300 containing display software through the data line after operation, and the temperature field distribution of the object to be detected is given out through the display software.

Based on the temperature measurement principle of colorimetric method, the temperature of the target to be measured meets the following conditions

Wherein lambda _R、λ_G、λ_B is the center wavelength of the trichromatic color separation filter of the camera chip R, G, B, the unit is m, delta lambda _R、Δλ_G、Δλ_B is the spectral bandwidth taking lambda _R、λ_G、λ_B as the center wavelength, T _R-G is the target thermodynamic temperature represented by R and G, T _B-G is the target thermodynamic temperature represented by B and G, the unit is K, C ₂ is the Planck second radiation constant,The unit is m.K, A _R、A_G and A _B are respectively the gray scale and signal intensity conversion coefficient of R, G, B three primary colors and are constants, H (lambda _R)、H(λ_G)、H(λ_B) is respectively the spectrum gray scale corresponding to R, G, B three primary colors, epsilon (lambda _R,T)、ε(λ_G,T)、ε(λ_B, T) is respectively the spectrum emissivity of the central wavelength in the spectrum section of R, G, B three primary colors, and I (lambda _R)、I(λ_G)、I(λ_B) is respectively the intensity distribution function of lambda _R、λ_G、λ_B as the central wavelength;

In the range of the visible light range, Is constant and is provided with

The radiation temperature of the surface of the object to be measured is

In another embodiment, the optical lens 100 has functions of focal length adjustment and aperture adjustment.

In another embodiment, the bandwidth of the bandpass filter 210 is 0.4 μm to 0.8 μm.

In another embodiment, the color camera chip 220 is a silicon-based CCD or CMOS color camera chip.

Referring to fig. 3, the circuit and temperature image processing unit 230 performs temperature analysis of the corresponding point of the target to be measured by:

The method comprises the steps that firstly, a central processing unit of a circuit and temperature image processing unit 230 collects R, G, B three primary color pixel intensity information I _R、I_G、I_B;

And thirdly, transmitting the temperature information of each point analyzed in the second step to a computer 300 containing display software through a data line, constructing a temperature field of the object to be detected at high temperature through the display software, and giving out temperature field distribution information.

The invention discloses a self-adaptive emissivity high-temperature field camera, which can overcome the influence of solid-liquid state, surface roughness, surface chemical characteristics, emissivity and the like on the surface of a target to be tested on the target temperature field test, can accurately realize the test of the temperature field distribution of a high Wen Daice target, meets the requirements of kiln, smelting, wind tunnel test and the like, and accurately reflects the temperature field characteristics of the target to be tested in real time.

The invention has the advantages and characteristics of high sensitivity, large temperature measuring range, long service life, safety and the like, and is suitable for testing the high temperature field of various kilns such as ceramics, glass and the like, the high temperature field of a high-temperature wind tunnel and the high temperature field of a severe environment with low visibility.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high temperature temperature field camera based on a color camera chip, characterized in that it comprises: an optical lens (100), a temperature field camera (200) and a computer (300) containing display software;

The optical lens (100) is threadedly connected to the temperature field camera (200); the temperature field camera (200) is electrically connected to the computer (300) containing display software via a data line;

The temperature field camera (200) comprises a bandpass filter (210), a color camera chip (220), a circuit and a temperature image processing unit (230), wherein the bandpass filter (210) and the color camera chip (220) are mechanically connected or bonded using optical adhesive;

The optical radiation emitted by the high-temperature target to be measured is focused by the optical lens (100), out-of-band noise is filtered out by the bandpass filter (210), and imaged onto the color camera chip (220). The color camera chip (220) converts the optical signal of the corresponding band into an electrical signal according to the three primary colors of R, G, and B. The electrical signal is amplified and A/D converted by the circuit and the temperature image processing unit (230), and after calculation, the signal is transmitted to the computer (300) containing display software via the data line. The display software provides the temperature field distribution of the high-temperature target to be measured;

Based on the temperature measurement principle of colorimetry, the temperature of the target to be measured meets

Wherein, λ _R , λ _G , λ _B are the central wavelengths of the three primary colors R, G, B of the camera chip; Δλ _R , Δλ _G , Δλ _B are the spectral bandwidths with λ _R , λ _G , λ _B as the central wavelengths, respectively; T _RG is the target thermodynamic temperature characterized by R and G; _TBG is the target thermodynamic temperature characterized by B and G; C ₂ is Planck's second radiation constant; _AR , _AG and _AB are the grayscale and signal intensity conversion coefficients of the three primary colors R, G, B, respectively, and are constants; H(λ _R ), H(λ _G ), H(λ _B ) are the spectral grayscales corresponding to the three primary colors R, G, B, respectively; ε(λ _R ,T), ε(λ _G ,T), ε(λ _B ,T) are the spectral emissivities of the central wavelengths in the three primary color spectrum segments of R, G, B, respectively; I(λ _R ), I(λ _G ), I(λ _B ) are the intensity distribution functions with λ _R , λ _G , λ _B as the central wavelengths, respectively;

In the visible light range, is a constant, and

Where _IR , _IG , and _IB are the intensity information corresponding to the three primary color pixels of R, G, and B of the camera chip;

So the radiation temperature of the target surface to be measured is

The circuit and the temperature image processing unit (230) perform temperature analysis of corresponding points of the target to be measured by taking the following steps:

Step 1: The central processor of the circuit and the temperature image processing unit (230) collects the R, G, B three-primary color pixel intensity information _IR , _IG , _IB ;

Step 2: Determine the values of _IR , _IG , and _IB . If _IR and _IG are both much greater than 0, calculate the temperature of the corresponding point of the high-temperature target to be measured according to formula (6); if _IR is close to or equal to 0, and _IB and _IG are both greater than 0, calculate the temperature of the corresponding point of the high-temperature target to be measured according to formula (7); in formula (6) or formula (7), if _IG is equal to 0, or two of the values of _IR , _IG , and _IB are 0, the temperature of the target is lower than the judgable threshold and the temperature cannot be judged, and the lowest judgable temperature is displayed;

Step 3: The temperature information of each point analyzed in step 2 is transmitted to the computer (300) containing display software through a data line, and the temperature field of the high-temperature target to be measured is constructed through the display software to provide temperature field distribution information.

2. A high temperature temperature field camera based on a color camera chip according to claim 1, characterized in that the optical lens (100) has the functions of focal length adjustment and aperture adjustment.

3. A high-temperature temperature field camera based on a color camera chip according to claim 1, characterized in that the bandwidth of the bandpass filter (210) is 0.4 μm to 0.8 μm.

4. The high temperature field camera based on a color camera chip according to claim 1, characterized in that the color camera chip (220) is a silicon-based CCD or CMOS color camera chip.