CN112201593B - Wafer cleaning equipment - Google Patents
Wafer cleaning equipment Download PDFInfo
- Publication number
- CN112201593B CN112201593B CN202011012114.XA CN202011012114A CN112201593B CN 112201593 B CN112201593 B CN 112201593B CN 202011012114 A CN202011012114 A CN 202011012114A CN 112201593 B CN112201593 B CN 112201593B
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- cleaning
- liquid
- wafer
- cavity
- spraying
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- 238000004140 cleaning Methods 0.000 title claims abstract description 187
- 239000007788 liquid Substances 0.000 claims abstract description 190
- 238000000034 method Methods 0.000 claims abstract description 118
- 230000008569 process Effects 0.000 claims abstract description 117
- 230000007246 mechanism Effects 0.000 claims abstract description 69
- 238000005507 spraying Methods 0.000 claims abstract description 66
- 238000011084 recovery Methods 0.000 claims abstract description 58
- 239000007921 spray Substances 0.000 claims abstract description 50
- 239000003814 drug Substances 0.000 claims description 104
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 66
- 239000007789 gas Substances 0.000 claims description 23
- 239000000126 substance Substances 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 76
- 229910021642 ultra pure water Inorganic materials 0.000 description 44
- 239000012498 ultrapure water Substances 0.000 description 44
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 31
- 229910052757 nitrogen Inorganic materials 0.000 description 14
- 238000010586 diagram Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000000889 atomisation Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 229940079593 drug Drugs 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000004484 Briquette Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/025—Prevention of fouling with liquids by means of devices for containing or collecting said liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses wafer cleaning equipment, which comprises: including process chamber, a plurality of spraying mechanism, wherein, the process chamber includes: a plurality of cleaning areas are distributed along the circumferential direction of the annular top cover; the plurality of cleaning medium recovery tanks are arranged in the cavity from top to bottom and are coaxial with the cavity for recovering different cleaning mediums; the chuck is arranged on the driving mechanism, and the driving mechanism is used for driving the chuck to rotate and driving the chuck to move to the cleaning medium recovery groove corresponding to the current cleaning medium so as to recover the cleaning medium thrown out by rotation; the spraying mechanisms are in one-to-one correspondence with the cleaning areas, and each spraying mechanism is used for spraying a cleaning medium; in the wafer cleaning process, the chuck lifts the wafer to the cleaning medium recovery groove at the corresponding position, and sprays the corresponding cleaning medium, so that different cleaning mediums are recovered and discharged in a layered manner, splashing liquid is prevented from adhering to the inner wall of the cavity and dripping on the surface of the wafer in the process, and the wafer cleaning process is ensured.
Description
Technical Field
The present invention relates to semiconductor cleaning apparatuses, and more particularly, to a wafer cleaning apparatus.
Background
Along with the transition of the main flow process band of the wafer from 65nm to 28nm, 14nm and 7nm or even smaller, the types of pollutants required to be cleaned on the surface of the wafer are correspondingly changed, so that the cleaning process flow also adopts ammonia water, hydrogen peroxide, hydrofluoric acid, nitric acid and the like to clean the pollutants on the surface of the wafer after dilution and proportioning according to different proportions.
The wafer cleaning device mainly aims at providing a cleaning container for cleaning the wafer, and the whole process of cleaning the wafer is carried out in a process chamber of the cleaning device. And each spraying mechanism sprays acid-base liquid medicine with different dilution ratios to the surface of the wafer respectively, and the ultrapure water is sprayed to the surface of the wafer for cleaning. The wafer is processed in the cleaning chamber in the whole process, and the chuck clamps the wafer to rotate at a high speed.
The prior art cleaning process system has the following defects:
1. Various acid-base chemical liquids or pure water are sprayed on the surface of the wafer rotating at high speed, and the acid-base chemical liquids or pure water are easy to be attached to the inner wall of the process chamber after being thrown away from the edge of the wafer. The adhering liquid medicine or pure water drops on the surface of the wafer in the next process step, and the whole cleaning process effect of the wafer is affected.
2. The ultrapure water and the nitrogen gas are fixed on the same spray arm, so that the drops dripped by the ultrapure water nozzle are easily atomized when the nitrogen gas is sprayed, and the atomized drops are easily attached to the surface of the wafer, thereby influencing the cleaning effect.
Therefore, although the existing cleaning process chamber can effectively meet the requirement that different acid-base liquid medicines, ultrapure water and the like are sprayed on the surface of a wafer respectively according to corresponding flow rates, the acid-base liquid medicines or the ultrapure water are easy to adhere to the inner wall of the process chamber in the actual process, and the adhering liquid is easy to drop on the surface of the wafer, so that the next process flow is influenced.
Disclosure of Invention
The invention aims to provide wafer cleaning equipment which can carry out cleaning processes on different cleaning media in a layering manner and can effectively avoid the influence of liquid attached to the inner wall of a process chamber on the whole process flow.
In order to achieve the above object, the present invention provides a wafer cleaning apparatus comprising a process chamber, a plurality of shower mechanisms, wherein,
The process chamber comprises:
The cleaning device comprises a cavity, a cleaning device and a cleaning device, wherein the cavity is a cylinder, an annular top cover is arranged at the top end of the cavity, and a plurality of cleaning areas are distributed along the circumferential direction of the annular top cover;
The cleaning medium recovery tanks are arranged in the cavity from top to bottom and are coaxial with the cavity for recovering different cleaning mediums;
The chuck assembly comprises a chuck and a driving mechanism, wherein the chuck is arranged on the driving mechanism and used for bearing a wafer, the lifting chuck mechanism is used for driving the chuck to rotate and driving the chuck to move to a cleaning medium recovery groove corresponding to the current cleaning medium when the spraying mechanism sprays the cleaning medium into the cavity, so that the cleaning medium thrown out by rotation is recovered;
The spraying mechanisms are in one-to-one correspondence with the cleaning areas, each spraying mechanism is used for spraying one cleaning medium, and the spraying mechanisms spray a plurality of cleaning mediums into the cavity through the cleaning areas.
Preferably, the device further comprises an emergency liquid draining device, wherein the emergency liquid draining device is arranged on the annular top cover and is used for introducing a preset cleaning medium into the cavity.
Preferably, the cleaning solution recovery groove is of an annular groove structure, and a recovery liquid drain pipe is arranged at the bottom of the annular groove structure.
Preferably, the plurality of cleaning medium recovery tanks include a water tank and a chemical tank, and the water tank is located above the chemical tank.
Preferably, the plurality of cleaning areas include a liquid medicine area, a water area and a gas area, the spraying mechanism for spraying the liquid medicine, the spraying mechanism for spraying water and the spraying mechanism for spraying gas spray the liquid medicine, water and gas into the cavity through the liquid medicine area, the water area and the gas area respectively.
Preferably, the process chamber further comprises an upper air guide ring and a lower air guide ring, the upper air guide ring and the lower air guide ring are provided with ring structures with upward-tilting type necking, the upper air guide ring is arranged at the upper part of the water tank, and the lower air guide ring is arranged at the upper part of the liquid medicine tank;
The lower annular eaves of the upper air guide ring and the lower air guide ring are respectively provided with an annular groove, and the upper air guide ring is connected with the outer side wall of the water tank in a matched manner through the annular grooves; the lower air guide ring is connected with the outer side wall of the liquid medicine groove in a matched mode through the annular groove.
Preferably, a plurality of protrusions are uniformly distributed on the tops of the outer side walls of the water tank and the liquid medicine tank.
Preferably urgent flowing back device includes shower, fixed block, base, first briquetting and second briquetting, the base passes through the fixed block with annular top cap is connected, first briquetting and second briquetting set up on the base, the lateral wall of first briquetting and the lateral wall of second briquetting are equipped with the arc recess respectively, two the arc recess forms the centre gripping hole relatively for the centre gripping the shower, the liquid outlet end orientation of shower in the cavity.
Preferably, the outer peripheral wall of the cavity is provided with a liquid receiving groove, and each area for introducing liquid cleaning medium is correspondingly provided with a liquid receiving groove for receiving the dropped liquid cleaning medium when the spraying mechanism is empty; the bottom of the liquid receiving groove is provided with a liquid receiving and draining pipe.
Preferably, a bottom groove is arranged at the bottom of the cavity, a process liquid discharge pipe and a liquid medicine recovery pipe are arranged in the bottom groove, the recovery liquid discharge pipe at the bottom of the liquid medicine groove is coaxially arranged with the liquid medicine recovery pipe, a plurality of recovery liquid discharge pipes are symmetrically arranged at the bottom of the water groove, and the plurality of recovery liquid discharge pipes are arranged corresponding to the bottom groove.
The invention has the beneficial effects that: the plurality of cleaning medium recovery tanks are arranged at different height positions in the cavity from top to bottom, in the wafer cleaning process, the chuck component lifts the wafer to the cleaning medium recovery tanks at different positions, and different cleaning mediums are sprayed so as to recover and discharge the different cleaning mediums in a layered manner, so that the problem that splashing liquid is adhered to the inner wall of the cavity in the process and drops on the surface of the wafer to affect the next process is avoided, and meanwhile, when the wafer cleaning process uses a plurality of cleaning mediums, the cleaning medium recovery tanks in the process cavity can be correspondingly increased, and the wafer cleaning process has a modularization function. Different cleaning mediums are introduced into the spray mechanism in a partitioning manner, so that the risk of atomization between different cleaning liquids is avoided.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent by describing in more detail exemplary embodiments thereof with reference to the attached drawings. Wherein like reference numerals generally refer to like elements throughout the exemplary embodiments.
Fig. 1 shows a schematic diagram of a prior art cleaning process system.
Fig. 2 shows a schematic internal structure of a prior art cleaning process system.
Fig. 3 is an external structural view showing a cleaning process chamber in the prior art.
Fig. 4 shows a schematic view of an exploded structure of a process chamber in one embodiment of the invention.
Fig. 5 shows a schematic diagram of the structure of the top cover in one embodiment of the present invention.
FIG. 6 shows a schematic structural view of an upper wind-guiding ring in an embodiment of the present invention.
FIG. 7 illustrates a cross-sectional view of an upper wind-guiding ring in one embodiment of the invention.
Fig. 8 shows a schematic structure of a sink in an embodiment of the present invention.
FIG. 9 shows a cross-sectional view of a sink in one embodiment of the invention.
FIG. 10 illustrates a schematic diagram of the lower wind-guiding ring in an embodiment of the present invention.
FIG. 11 illustrates a cross-sectional view of a lower wind-guiding ring in one embodiment of the invention.
Fig. 12 is a schematic diagram showing the structure of a liquid medicine tank in one embodiment of the present invention.
FIG. 13 shows a cross-sectional view of a liquid medicine tank in one embodiment of the present invention.
Fig. 14 shows a schematic structural view of an emergency drain in an embodiment of the present invention.
Figure 15 shows a schematic external structure of a process chamber in one embodiment of the invention.
Fig. 16 is a schematic view showing an internal structure of a wafer cleaning apparatus in an embodiment of the present invention.
Fig. 17 shows a front view of a spray mechanism in one embodiment of the invention.
Fig. 18 shows a top view of a spray mechanism in one embodiment of the invention.
Reference numerals illustrate:
1. An upper wind guide ring; 2. a water tank; 3. a lower wind guiding ring; 4. a liquid medicine tank; 5. an ultrapure water receiving tank; 6. an emergency liquid discharge device; 7. a cavity; 8. a liquid medicine receiving tank; 9. a screw; 10. a nitrogen zone; 11. a liquid medicine area; 12. a fixed block; 13. partition boards; 14. an annular top cover; 15. a water zone; 16. a first annular groove; 17. a water tank drain pipe; 18. a protrusion; 19. an annular groove; 20. a liquid medicine recovery drain pipe; 23. an air outlet; 24. a bottom groove; 25. a process drain pipe; 26. receiving a liquid discharge pipe; 27. a liquid medicine recovery tube; 28. a first briquette; 29. a second briquetting; 30. a screw; 31. a base; 32. a liquid medicine spray arm; 33. a nitrogen spray arm; 34. an ultrapure water spray arm; 35. a chuck; 36. a process chamber; 101. a spray arm; 102. a process chamber; 103. an aluminum plate fixing frame; 104. a process chamber; 105. a wafer; 106. a chuck; 107. a main rotation mechanism; 108. a belt; 109. a nitrogen pipe; 110. an ultrapure water pipe; 111. a left liquid discharge cup; 112. a right drain cup; 113. a liquid medicine drain port; 114. ; 115. an ultrapure water drain port; 116. and an exhaust pipe.
Detailed Description
Preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present invention are illustrated in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
According to an embodiment of the invention, a wafer cleaning apparatus includes: including process chamber, a plurality of spraying mechanism, wherein, the process chamber includes:
The cavity is a cylinder, an annular top cover is arranged at the top end of the cavity, and a plurality of cleaning areas are distributed along the circumferential direction of the annular top cover; the cleaning medium recovery tanks are arranged in the cavity from top to bottom and are coaxial with the cavity for recovering different cleaning mediums; the chuck assembly comprises a chuck and a driving mechanism, wherein the chuck is arranged on the driving mechanism and used for bearing a wafer, the driving mechanism is used for driving the chuck to rotate and is also used for driving the chuck to move to a cleaning medium recovery groove corresponding to the current cleaning medium when the spraying mechanism sprays the cleaning medium into the cavity, so that the cleaning medium thrown out by rotation is recovered; the plurality of spraying mechanisms are in one-to-one correspondence with the plurality of cleaning areas, each spraying mechanism is used for spraying one cleaning medium, and the plurality of spraying mechanisms respectively spray a plurality of cleaning mediums into the cavity through the plurality of cleaning areas.
In the whole process flow, the driving mechanism can drive the chuck to move up and down along the cavity and rotate around the axis of the chuck. The plurality of cleaning medium recovery tanks are arranged at different height positions from top to bottom in the cavity, when the wafer is lifted to the cleaning medium recovery tanks at different positions through the driving mechanism of the chuck assembly, the spraying mechanism correspondingly sprays corresponding cleaning mediums, the chuck drives the wafer to move to the cleaning medium recovery tank corresponding to the wafer to rotate, so that the different cleaning mediums thrown out by the rotation of the recovered wafer are recovered and discharged in a layered manner, splashing liquid in the process is prevented from adhering to the inner wall of the cavity and dripping on the surface of the wafer in the next cleaning process, and meanwhile, when the wafer cleaning process uses various cleaning mediums, the cleaning medium recovery tanks in the process cavity can be correspondingly increased, and the wafer cleaning device has a modularized function.
In order to avoid the atomization phenomenon of ultrapure water and nitrogen, the annular top cover at the top of the cavity is partitioned, so that the observation and the later adjustment of the spraying angle of the spraying mechanism are facilitated, and the mutual noninterference of each spraying arm when empty is ensured.
As one example, the chuck carries wafers from bottom to top to complete each cleaning process, and when raised to the top of the chamber, the wafer is sprayed with a cleaning gas to complete the entire cleaning process.
As one example, the spray mechanism includes a plurality of spray arms for spraying a cleaning medium of different cleaning processes, the cleaning medium including a cleaning liquid and a cleaning gas.
As an example, the liquid inlet area and the air inlet area of different cleaning media on the annular top cover are arranged at intervals, and the circumferential angle position of the subarea is determined according to the maximum angle of swing of the spray arm.
As a preferred scheme, the device also comprises an emergency liquid discharge device, wherein the emergency liquid discharge device is arranged on the annular top cover and is used for introducing a preset cleaning medium into the cavity.
As an example, the emergency liquid draining device is arranged on the annular top cover and is located beside the air inlet area, and the preset cleaning medium is ultrapure water and is used for spraying to the wafer when the process chamber is down, so that the process of the previous step is finished in time, the liquid medicine of the cleaning medium is prevented from being attached to the surface of the wafer for a long time, and over-corrosion is avoided.
As the preferable scheme, the cleaning liquid recovery groove is of an annular groove structure, a recovery liquid drain pipe is arranged at the bottom of the annular groove structure, the annular groove structure is favorable for recovering the cleaning medium thrown out by the high-speed rotation of the wafer in the process, and the cleaning medium in the annular groove is discharged through the recovery liquid drain pipe.
Preferably, the plurality of cleaning medium recovery tanks include a water tank and a chemical tank, and the water tank is located above the chemical tank.
As an example, when the wafer is subjected to the chemical solution process, the chuck is lifted to the chemical solution tank and rotated at a high speed, so that the chemical solution thrown out from the edge of the wafer flows into the annular groove structure of the chemical solution tank. When the wafer is subjected to the ultrapure water process, the clamping disc is lifted to the water tank and rotates at a high speed, so that ultrapure water thrown out from the edge of the wafer flows into the annular groove structure of the water tank. After the wafer is corroded by liquid medicine and cleaned by pure water, the clamping disc is lifted to the top position of the cavity, and nitrogen is sprayed to sweep the wafer, so that the whole cleaning process is completed.
As a preferred scheme, the plurality of cleaning areas comprise a liquid medicine area, a water area and a gas area, a spraying mechanism for spraying liquid medicine, a spraying mechanism for spraying water and a spraying mechanism for spraying gas are used for spraying liquid medicine, water (ultrapure water can be used) and gas (nitrogen can be used) into the cavity through the liquid medicine area, the water area and the gas area respectively, and the liquid medicine, the ultrapure water and the nitrogen can be sequentially introduced into the cavity through the liquid medicine area, the water area and the gas area by the spraying mechanisms.
As an example, weld the partition baffle on annular top cap, carry out the subregion and divide annular top cap into liquid medicine district, water district, gas district respectively to avoid current ultrapure water and the too close risk that produces the atomizing of spray arm of nitrogen gas.
As a preferred scheme, the process chamber further comprises an upper air guide ring and a lower air guide ring, wherein the upper air guide ring and the lower air guide ring are provided with ring structures with upward-tilting necking, the upper air guide ring is arranged at the upper part of the water tank, and the lower air guide ring is arranged at the upper part of the liquid medicine tank;
The lower annular eaves of the upper air guide ring and the lower air guide ring are respectively provided with an annular groove, and the upper air guide ring is connected with the outer side wall of the water tank in a matched manner through the annular grooves; the lower air guide ring is connected with the outer side wall of the liquid medicine groove in a matching way through the annular groove.
The upper air guide ring is arranged at the upper part of the water tank, and the ring-shaped structure of the upward-bending type necking is beneficial to flowing the ultrapure water thrown out by the ultrapure water process into the water tank along the lower surface of the upward-bending type necking, so that the ultrapure water is recovered to the greatest extent, and the ultrapure water on the surface of the wafer is effectively prevented from being thrown out to the outside of the process chamber.
The lower air guide ring is positioned at the upper part of the liquid medicine tank, and the upward-bending type necking ring structure is beneficial to flowing the liquid medicine thrown out by the liquid medicine cleaning process into the liquid medicine along the lower surface of the upward-bending type necking, so that the liquid medicine is recovered to the greatest extent, and the liquid medicine on the surface of the wafer is effectively prevented from being thrown out of the process chamber.
As a preferable scheme, a plurality of bulges are uniformly distributed at the tops of the outer side walls of the water tank and the liquid medicine tank.
As an example, a plurality of protrusions are uniformly distributed along the peripheral top edges of the water tank and the chemical tank. When the upper air guide ring is connected with the outer side wall of the water tank in a matched mode, gaps are reserved between the water tank and the upper air guide ring through the protrusions, and gas circulation in the ultrapure water process is guaranteed. Similarly, when the lower air guide ring is connected with the outer side wall of the liquid medicine groove in a matched manner, the bulges can enable a gap to be reserved between the liquid medicine groove and the lower air guide ring, so that the liquid medicine cleaning process is ensured to have gas circulation, and gas volatilized from acid-base liquid medicine in the process is timely extracted from the process chamber.
As the preferred scheme, urgent drain includes shower, fixed block, base, first briquetting and second briquetting, and the base passes through the fixed block to be connected with annular top cap, and first briquetting and second briquetting set up on the base, and the lateral wall of first briquetting and the lateral wall of second briquetting are equipped with the arc recess respectively, and two arc recesses form the centre gripping hole relatively for the centre gripping shower, the drain end of shower is towards in the cavity.
As one example, the fixed block is welded near the nitrogen area to facilitate viewing and later adjustment of the emergency drain angle.
As a preferred scheme, the peripheral wall of the cavity is provided with a liquid receiving groove, and each area for introducing liquid cleaning medium is correspondingly provided with a liquid receiving groove for receiving the dropped liquid cleaning medium when the spraying mechanism is empty; the bottom of the liquid receiving groove is provided with a receiving liquid drain pipe.
As the preferable scheme, the bottom of cavity is equipped with the kerve, is equipped with technology fluid-discharge tube and liquid medicine recovery tube in the kerve, and the recovery fluid-discharge tube of liquid medicine tank bottom is coaxial with the liquid medicine recovery tube and sets up, and the basin bottom symmetry is provided with a plurality of recovery fluid-discharge tubes, and these a plurality of recovery fluid-discharge tubes correspond to the kerve setting.
As an example, the outer peripheral wall of the cavity is welded with an ultra-water bearing tank and a liquid medicine bearing tank, the bottoms of the ultra-water bearing tank and the liquid medicine bearing tank are respectively provided with a liquid receiving and draining pipe, the bottom of the cavity is welded with a bottom tank, and the bottom tank is welded with a process draining pipe, a liquid medicine recycling pipe and the like. The ultrapure water receiving groove mainly receives ultrapure water dripped by the nozzle when the spray arm is empty after the ultrapure water cleaning process is finished, and the ultrapure water is discharged from the receiving liquid discharge pipe. Preferably, the liquid receiving and draining pipe of the ultrapure water receiving groove can be communicated with the bottom groove at the bottom of the cavity. The liquid medicine receiving tank mainly receives the liquid medicine dropped by the spray arm nozzle after the liquid medicine cleaning process is finished, and the liquid medicine is discharged through the receiving liquid discharge pipe and can be recycled. The liquid medicine recovery pipe mainly recovers liquid medicine thrown out by the wafer during the liquid medicine cleaning process for later-stage reciprocating utilization.
Fig. 1 shows a schematic diagram of a prior art cleaning process system, and fig. 2 shows a schematic diagram of an internal structure of a prior art cleaning process system. As shown in fig. 1 and 2, the current cleaning process system mainly comprises an aluminum plate fixing frame 103, a process cavity 102, a spray arm 101, a chuck 106, a main rotating mechanism 107 and a rotating motor assembly 117. The aluminum plate fixing frame 103 mainly plays a role in bearing and fixing the process cavity 102 and the spray arm 101, and all the components are screwed and fixed on corresponding hole sites of the aluminum plate fixing frame 103.
The process chamber 104 primarily functions to provide a cleaning vessel for wafer cleaning, which is performed within the process chamber 104 throughout the wafer cleaning process. The spray arms 101 swing at different angular speeds, and each spray arm 101 sprays acid-base chemical liquid and ultrapure water with different dilution ratios onto the surface of the wafer 105 to perform a cleaning process. The main rotation mechanism 107 is concentrically fitted with the process chamber 102, the chuck 106 is fitted over the main rotation mechanism 107, and the rotary motor assembly 117 is coupled to the main rotation mechanism 107 by a belt 108. The whole process is carried out in a cleaning chamber, a chuck 106 clamps the wafer 105, and a rotating motor assembly 117 is connected with the chuck 106 which drives the upper part 107 of the main rotating mechanism to rotate at a high speed through a belt 108 under the state of keeping the process required rotating speed.
Fig. 3 is a view showing an external structure of a cleaning process chamber, and as shown in fig. 3, a liquid medicine pipe 118, an ultrapure water pipe 110 and a nitrogen pipe 109 are arranged at the upper part of the process chamber, and the process chamber is assembled by a left liquid discharge cup 111, a right liquid discharge cup 112, and liquid discharge joints of a liquid medicine liquid discharge port 113, an ultrapure water liquid discharge port 114 and a process chamber liquid discharge hole 115 after being welded with a process chamber substrate. Wherein the left liquid discharge cup 111 and the right liquid discharge cup 112 mainly collect the liquid medicine or the ultrapure water which is dropped by the spray arm nozzle in the idle state of the spray arm. The collected liquid is discharged outside the process chamber through the left liquid discharge cup 111 and the right liquid discharge cup 112. The process chamber drain port 115 is mainly used for draining the liquid medicine or ultrapure water used in the process through the process chamber drain port 115 in time, so as to ensure that the cleaning liquid in the process chamber is drained in time. The exhaust pipe 116 mainly extracts the gas volatilized from the acid-base liquid medicine in the process to the process chamber in time.
At present, although the cleaning equipment can effectively meet the requirement that different acid-base liquid medicines, ultrapure water and the like are sprayed on the surface of a wafer respectively according to corresponding flow rates, the acid-base liquid medicines or the ultrapure water are easy to adhere to the inner wall of a process chamber in the actual process, and the adhering liquid is easy to drop on the surface of the wafer, so that the next process flow is influenced. Therefore, the wafer cleaning equipment provided by the embodiment of the invention can carry out the cleaning process on different cleaning media in a layered manner, and can effectively avoid the influence of the liquid attached to the inner wall of the process chamber on the whole process flow. In view of the above, the embodiment of the invention provides wafer cleaning equipment.
Fig. 4 shows an exploded structure of a process chamber in one embodiment of the present invention, fig. 5 shows a structure of a top cover in one embodiment of the present invention, fig. 6 shows a structure of an upper air guide ring in one embodiment of the present invention, fig. 7 shows a cross-sectional view of an upper air guide ring in one embodiment of the present invention, fig. 8 shows a structure of a water tank in one embodiment of the present invention, fig. 9 shows a cross-sectional view of a water tank in one embodiment of the present invention, fig. 10 shows a structure of a lower air guide ring in one embodiment of the present invention, fig. 11 shows a cross-sectional view of a lower air guide ring in one embodiment of the present invention, fig. 12 shows a structure of a liquid medicine tank in one embodiment of the present invention, fig. 13 shows a cross-sectional view of a liquid medicine tank in one embodiment of the present invention, fig. 14 shows a structure of an emergency liquid discharging device in one embodiment of the present invention, fig. 15 shows a structure of a water tank in one embodiment of the present invention, fig. 9 shows a cross-sectional view of a water tank in one embodiment of the present invention, fig. 10 shows a cross-sectional view of a lower air guide ring in one embodiment of the present invention, fig. 11 shows a liquid medicine tank in one embodiment of the present invention, fig. 11 shows a main-tub in one embodiment of the present invention, fig. 17 shows a wafer cleaning mechanism in one embodiment of the present invention shows a wafer in one embodiment of the present invention, fig. 18 shows a main structure.
As shown in fig. 4 to 18, the wafer cleaning apparatus of the present embodiment includes a process chamber 36 and a plurality of shower mechanisms, wherein the process chamber 36 includes:
The cavity 7 is a cylinder, an annular top cover 14 is arranged at the top end of the cavity 7, and a plurality of cleaning areas are distributed along the circumferential direction of the annular top cover 14;
The cleaning medium recovery tanks are arranged in the cavity 7 from top to bottom and are coaxial with the cavity 7 for recovering different cleaning mediums;
The chuck assembly comprises a chuck 35 and a driving mechanism, wherein the chuck 35 is arranged on the driving mechanism and is used for bearing a wafer, the driving mechanism is used for driving the chuck to rotate and is also used for driving the chuck 35 to move to a cleaning medium recovery groove corresponding to the current cleaning medium when the spraying mechanism sprays the cleaning medium into the cavity 7, so that the cleaning medium thrown out by rotation is recovered;
The plurality of spraying mechanisms are in one-to-one correspondence with the plurality of cleaning areas, each spraying mechanism is used for spraying one cleaning medium, and the plurality of spraying mechanisms respectively spray a plurality of cleaning mediums into the cavity 7 through the plurality of cleaning areas.
When the spraying mechanism sprays different cleaning solutions to the wafer in turn, the wafer moves to the cleaning medium recovery groove corresponding to the wafer to rotate, so that different cleaning mediums thrown out by the wafer in rotation are recovered. An annular top cover 14 is screwed on the upper part of the cavity by a screw 9. The emergency drain 6 is mounted on the upper part of the annular top cover 14 by screws for spraying ultrapure water to the wafer when the process chamber is down.
The cleaning liquid recovery groove is an annular groove structure 19, and a recovery liquid drain pipe is arranged at the bottom of the annular groove structure 19. The plurality of cleaning medium recovery tanks comprise a water tank 2 and a liquid medicine tank 4, and the water tank 2 is positioned above the liquid medicine tank 4. The partition plate is welded on the annular top cover and is divided into a liquid medicine area 11, a water area 15 and a gas area 10 respectively, a spraying mechanism for spraying liquid medicine, a spraying mechanism for spraying water and a spraying mechanism for spraying gas are used for spraying liquid medicine, ultrapure water and nitrogen into the cavity 7 respectively through the liquid medicine area 11, the water area 15 and the gas area, so that the risk of atomization caused by too close spray arms of the existing ultrapure water and nitrogen is avoided. As shown in fig. 17 to 18, the spray mechanism comprises a liquid medicine spray arm 32, a nitrogen spray arm 33 and an ultrapure water spray arm 34, and the liquid outlets of the spray arms are respectively in one-to-one correspondence with the positions of the liquid medicine area 11, the nitrogen area 10 and the water area 15.
As shown in fig. 6, 7, 10 and 11, the process chamber further comprises an upper air guide ring 1 and a lower air guide ring 3, the upper air guide ring 1 and the lower air guide ring 3 are provided with an upward-tilting type necking annular structure, the upper air guide ring 1 is arranged at the upper part of the water tank 2, and the lower air guide ring 3 is arranged at the upper part of the liquid medicine tank 4; the lower annular eaves of the upper air guide ring 1 and the lower air guide ring 3 are respectively provided with an annular groove 16, and the upper air guide ring 1 is connected with the outer side wall of the water tank 2 in a matched manner through the annular grooves 16; the lower air guide ring 3 is connected with the outer side wall of the liquid medicine groove 4 in a matching way through the annular groove 16.
A plurality of bulges 18 are uniformly distributed on the top of the outer side walls of the water tank 2 and the liquid medicine tank 4. The emergency liquid draining device 6 comprises a spray pipe, a fixed block 12, a base 31, a first pressing block 28 and a second pressing block 29, wherein the base 31 is connected with the annular top cover 14 through the fixed block 12, the first pressing block 28 and the second pressing block 29 are arranged on the base 31, arc grooves are respectively formed in the side wall of the first pressing block 28 and the side wall of the second pressing block 29, clamping holes are formed in the two arc grooves oppositely, the side wall of the first pressing block 28 and the second pressing block 29 are fixed through screws 30 and used for clamping the spray pipe, and the liquid outlet end of the spray pipe faces into the cavity 7.
The peripheral wall of the cavity 7 is provided with a liquid receiving groove, and each area for introducing liquid cleaning medium is correspondingly provided with a liquid receiving groove for receiving the dropped liquid cleaning medium when the spraying mechanism is empty; the bottom of the liquid receiving groove is provided with a receiving liquid drain pipe.
The bottom of the cavity 7 is provided with a bottom groove 24, a process liquid discharge pipe 25 and a liquid medicine recovery pipe are arranged in the bottom groove 24, the liquid medicine recovery liquid discharge pipe 20 at the bottom of the liquid medicine groove 4 and the liquid medicine recovery pipe are coaxially arranged, a plurality of recovery liquid discharge pipes are symmetrically arranged at the bottom of the water groove 2, and the plurality of recovery liquid discharge pipes are arranged corresponding to the bottom groove 24.
As shown in fig. 8 and 9, recovery drain pipes 17 are symmetrically welded to both sides of the water tank to shorten the drain time. As shown in fig. 12 and 13, a liquid medicine recovery drain pipe 20 is provided at the bottom of the liquid medicine tank to ensure rapid discharge of the liquid medicine.
As shown in fig. 15, the ultrapure water carrying tank 5 and the chemical carrying tank 8 are welded to the outer peripheral wall of the chamber 7, and the bottom tank 24 is welded to the bottom of the chamber 7. Wherein the ultrapure water receiving tank 5 mainly receives ultrapure water dropped from the nozzle when the spray arm is empty after the ultrapure water cleaning process is completed, and discharges the ultrapure water from the receiving liquid discharge pipe. The liquid medicine receiving tank 8 mainly receives the liquid medicine dropped by the spray arm nozzle after the liquid medicine cleaning process is completed, and the liquid medicine is discharged through the receiving liquid discharge pipe 26. The liquid medicine recovery pipe 27 mainly recovers the liquid medicine thrown out from the wafer by the liquid medicine process position for later-stage reciprocating use.
During normal processing, the chuck 35 drives the wafer up and down along the chamber 7. When the liquid medicine cleaning process is carried out, the chuck 35 is lifted to the liquid medicine tank 4, the chuck 35 rotates at a high speed, and the liquid medicine thrown out from the edge of the wafer flows into the annular groove structure of the liquid medicine tank 4. When the ultrapure water cleaning process is performed, the chuck 35 is lifted to the water tank 2, the chuck 35 rotates at a high speed, and ultrapure water thrown out from the edge of the wafer flows into the annular groove structure of the water tank 2. After the wafer is corroded by the liquid medicine and cleaned by pure water, the chuck 35 is lifted to the top of the cavity 7, and the wafer is purged by nitrogen, so that the whole cleaning process is completed. The different cleaning processes of the wafer are carried out at different height positions of the cavity, and the acid-base liquid medicine cleaning process and the pure water cleaning process are separated up and down and are not mutually interfered. The annular top cover 14 is partitioned, and the spray arms are not interfered when empty, so that the atomization phenomenon is avoided.
The foregoing description of embodiments of the invention has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described.
Claims (10)
1. The wafer cleaning equipment is characterized by comprising a process chamber and a plurality of spraying mechanisms, wherein,
The process chamber comprises:
The cleaning device comprises a cavity (7), wherein the cavity (7) is a cylinder, an annular top cover (14) is arranged at the top end of the cavity (7), and a plurality of cleaning areas are distributed along the circumferential direction of the annular top cover (14);
The cleaning medium recovery tanks are arranged in the cavity (7) from top to bottom and are coaxial with the cavity (7) and are used for recovering different cleaning mediums;
The chuck assembly comprises a chuck and a driving mechanism, wherein the chuck is arranged on the driving mechanism and is used for bearing a wafer, the driving mechanism is used for driving the chuck to rotate and is also used for driving the chuck to move to a cleaning medium recovery groove corresponding to the current cleaning medium when the spraying mechanism sprays the cleaning medium into the cavity (7), so that the cleaning medium thrown out by rotation is recovered;
The spraying mechanisms are in one-to-one correspondence with the cleaning areas, each spraying mechanism is used for spraying one cleaning medium, and the spraying mechanisms spray a plurality of cleaning mediums into the cavity (7) through the cleaning areas.
2. Wafer cleaning apparatus according to claim 1, further comprising an emergency drain (6), said emergency drain (6) being arranged on said annular top cover (14) for introducing a predetermined cleaning medium into said chamber (7).
3. The wafer cleaning apparatus according to claim 1, wherein the cleaning medium recovery tank is an annular groove structure (19), and a recovery drain pipe is provided at a bottom of the annular groove structure (19).
4. A wafer cleaning apparatus according to claim 3, characterized in that a plurality of the cleaning medium recovery tanks comprises a water tank (2) and a chemical tank (4), the water tank (2) being located above the chemical tank (4).
5. Wafer cleaning apparatus according to claim 1, characterized in that the plurality of cleaning zones comprises a liquid chemical zone (11), a water zone (15) and a gas zone (10), the spraying means for spraying liquid chemical, the spraying means for spraying water and the spraying means for spraying gas spraying liquid chemical, water and gas into the cavity (7) through the liquid chemical zone, the water zone and the gas zone (10), respectively.
6. The wafer cleaning apparatus according to claim 4, wherein the process chamber further comprises an upper air guide ring (1) and a lower air guide ring (3), the upper air guide ring (1) and the lower air guide ring (3) are provided with an upward-leaning type necking ring structure, the upper air guide ring (1) is arranged at the upper part of the water tank (2), and the lower air guide ring (3) is arranged at the upper part of the liquid medicine tank (4);
the lower annular eaves of the upper air guide ring (1) and the lower air guide ring (3) are respectively provided with an annular groove (16), and the upper air guide ring (1) is connected with the outer side wall of the water tank (2) in a matched manner through the annular grooves (16); the lower air guide ring (3) is connected with the outer side wall of the liquid medicine groove (4) in a matching way through the annular groove (16).
7. The wafer cleaning apparatus according to claim 6, wherein a plurality of protrusions (18) are uniformly distributed on the tops of the outer side walls of the water tank (2) and the chemical tank (4).
8. Wafer cleaning equipment according to claim 2, characterized in that the emergency liquid draining device (6) comprises a spray pipe, a fixed block (12), a base (31), a first pressing block (28) and a second pressing block (29), the base (31) is connected with the annular top cover (14) through the fixed block (12), the first pressing block (28) and the second pressing block (29) are arranged on the base (31), the side wall of the first pressing block (28) and the side wall of the second pressing block (29) are respectively provided with an arc-shaped groove, two arc-shaped grooves are oppositely provided with clamping holes for clamping the spray pipe, and the liquid outlet end of the spray pipe faces into the cavity (7).
9. Wafer cleaning apparatus according to claim 1, characterized in that the peripheral wall of the chamber (7) is provided with liquid-receiving grooves, each of which is provided with a corresponding liquid-receiving groove at the area for the passage of liquid cleaning medium, for receiving dripping liquid cleaning medium when the spray mechanism is empty; the bottom of the liquid receiving groove is provided with a liquid receiving and draining pipe.
10. Wafer cleaning equipment according to claim 4, characterized in that the bottom of the cavity (7) is provided with a bottom tank (24), a process drain pipe (25) and a liquid medicine recovery pipe are arranged in the bottom tank (24), the recovery drain pipe at the bottom of the liquid medicine tank (4) is arranged coaxially with the liquid medicine recovery pipe, a plurality of recovery drain pipes are symmetrically arranged at the bottom of the water tank (2), and the plurality of recovery drain pipes are arranged corresponding to the bottom tank (24).
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| CN113035743B (en) * | 2021-02-25 | 2022-01-25 | 无锡亚电智能装备有限公司 | Wafer cleaning method for gradually lifting wafer |
| CN113539937B (en) * | 2021-07-09 | 2023-03-03 | 江西龙芯微科技有限公司 | Wafer bearing device |
| CN114453321A (en) * | 2022-02-25 | 2022-05-10 | 上海普达特半导体设备有限公司 | Single wafer type wafer cleaning device |
| CN114632751B (en) * | 2022-03-17 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Cleaning system |
| CN116581056B (en) * | 2023-04-13 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and cleaning chamber thereof |
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