CN112165788B - Manufacturing method of waterproof PCB - Google Patents
Manufacturing method of waterproof PCB Download PDFInfo
- Publication number
- CN112165788B CN112165788B CN202011040729.3A CN202011040729A CN112165788B CN 112165788 B CN112165788 B CN 112165788B CN 202011040729 A CN202011040729 A CN 202011040729A CN 112165788 B CN112165788 B CN 112165788B
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- layer
- waterproof
- circuit board
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 5
- 239000010931 gold Substances 0.000 claims abstract description 5
- 238000005259 measurement Methods 0.000 claims abstract description 5
- 238000011179 visual inspection Methods 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims description 12
- 230000001680 brushing effect Effects 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 238000005553 drilling Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a manufacturing method of a waterproof PCB, which comprises the following steps: after the semi-finished circuit board, the voltage-combined insulating waterproof layer and the positioning holes are drilled secondarily, the first conductive layer of the circuit board is coated with solder resist ink, finally the surface is plated with gold and molded, and then the waterproof circuit board can be manufactured after electrical measurement and visual inspection. The method has the advantages of simple manufacturing process and small overall space occupation rate of the product, and meets the requirement of miniaturization of electronic products.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a manufacturing method of a waterproof type PCB.
Background
The circuit board is widely applied to the fields of automobiles, electronics, communication and the like, and when the circuit board is in water, the circuit board is short-circuited, so that the circuit board is damaged, and inconvenience is brought to life. Therefore, there is a need to develop a waterproof PCB that prevents moisture from entering the board during use. The conventional waterproof circuit board is provided with a protective shell on the outer layer of the circuit board, and the circuit board is entirely coated inside. The conventional waterproof circuit board is provided with a protective shell on the outer layer of the circuit board, so that the space occupation ratio is large, and the miniaturization application of electronic products is not facilitated.
Disclosure of Invention
In order to solve the problems, the invention provides a manufacturing method of a waterproof PCB, wherein a welding surface is pressed by adopting non-flowing resin and a circuit board to be used as a waterproof insulating layer, and the waterproof PCB has the characteristics of small space occupation ratio and excellent waterproof performance.
The main content of the invention comprises:
a manufacturing method of a waterproof PCB board comprises the following steps:
s1, blanking, pressing, drilling, copper plating and etching to manufacture an outer layer pattern, so as to obtain a semi-finished circuit board; the semi-finished circuit board comprises a first conductive layer, a plurality of middle conductive layers and a second conductive layer which are sequentially laminated from top to bottom;
s2, an insulating waterproof layer is arranged outside the surface, far away from the middle conductive layer, of the second conductive layer, and the insulating waterproof layer and the semi-finished circuit board are pressed in a voltage combination mode;
s3, secondarily drilling positioning holes, and coating a welding-preventing ink layer on the surface, far away from the middle conductive layer, of the first conductive layer;
s4, carrying out surface gold plating treatment, forming, electric measurement and visual inspection to obtain a finished product.
Preferably, S2 comprises the steps of:
s21, sequentially laminating an insulating waterproof layer, a centrifugal film, a buffer pad and a lower copper foil layer on the surface of the second conductive layer far away from the middle conductive layer;
s22, sequentially laminating a centrifugal film, a buffer pad and an upper copper foil layer on the surface of the first conductive layer far away from the middle conductive layer;
s23, pressing by adopting an Adara pressing machine.
Preferably, the middle conductive layer comprises a third conductive layer and a fourth conductive layer, the heating rate of lamination in S23 is 2.5-3.5 ℃/min, and the lamination pressure is 21-28kg/cm 2 The thickness is controlled to be 50-90um.
Preferably, the insulating waterproof layer is a non-flowing prepreg comprising resin and glass fiber cloth.
Preferably, step S2 is preceded by a browning treatment step.
Preferably, step S2 further includes a microetching step to remove the brown oxide layer of the first conductive layer.
Preferably, step S3 is preceded by a brushing step.
Preferably, the brushing treatment step comprises the steps of placing the first conductive layer downwards, closing the upper brush, and brushing at a speed of 3m/min and a current of 1.0A so as to remove the glue overflow on the surface of the first conductive layer.
The invention has the beneficial effects that: the invention provides a manufacturing method of a waterproof PCB, which utilizes the water resistance and heat resistance characteristics of a non-flowing prepreg to press a welding surface of a circuit board and the non-flowing prepreg to prepare the waterproof PCB, has simple manufacturing process and small overall space occupation rate of a product, and meets the requirement of miniaturization of electronic products.
Detailed Description
The technical scheme protected by the invention will be specifically described below.
The invention provides a manufacturing method of a waterproof PCB, which comprises the steps of pressing to obtain a semi-finished circuit board, carrying out brown treatment and voltage-on insulation waterproof layer on the semi-finished circuit board, carrying out microetching and brushing treatment, and carrying out secondary drilling of positioning holes, coating a first conductive layer of the circuit board with solder resist ink, finally carrying out surface gold plating and forming, and carrying out electrical measurement and visual inspection to finish the manufacturing of the waterproof circuit board.
The following will take the manufacturing of four-layer waterproof circuit board as an example, and describe the technical scheme of the invention in detail:
s1, manufacturing an outer layer pattern according to a conventional manufacturing method of a circuit board, namely sequentially blanking, pressing, drilling, copper plating and etching to obtain a four-layer circuit board, wherein the four-layer circuit board sequentially comprises a first conductive layer, a third conductive layer, a fourth conductive layer and a second conductive layer from top to bottom, namely the first conductive layer and the second conductive layer are positioned at the uppermost layer and the bottommost layer; the conductive layers are bonded through dielectric layers such as prepregs, PP and other dielectrics; the step is to obtain a semi-finished circuit board; for circuit boards of other specifications, the semi-finished circuit board comprises a first conductive layer, a plurality of middle conductive layers and a second conductive layer which are sequentially laminated from top to bottom.
Before the voltage-combined insulating waterproof layer is carried out, the semi-finished circuit board is firstly subjected to brown-out treatment.
S2, an insulating waterproof layer is arranged outside the surface, far away from the middle conductive layer, of the second conductive layer, and the insulating waterproof layer and the semi-finished circuit board are pressed in a voltage combination mode; the insulating waterproof layer is a non-flowing prepreg, is preferably 1080 of a model of table light, has a glue content of 65%, and has excellent water resistance and heat resistance.
Specifically, S2 includes the steps of:
s21, sequentially laminating an insulating waterproof layer, a centrifugal film, a buffer pad and a lower copper foil layer on the surface of the second conductive layer far away from the middle conductive layer;
s22, sequentially laminating a centrifugal film, a buffer pad and an upper copper foil layer on the surface of the first conductive layer far away from the middle conductive layer;
s23, adopting an Adara laminating machine to perform lamination, wherein the heating rate of lamination is 2.5-3.5 ℃/min, and the lamination pressure is 21-28kg/cm 2 Controlling the thickness to be 50-90um; preferably, the temperature rising rate is 2.6 ℃/min; the pressing pressure is 21kg/cm 2 。
The centrifugal film is used for protecting the circuit on the board surface and preventing the circuit from being scratched in the pressing process, and the buffer pad is used for ensuring the uniform distribution of pressing pressure in the pressing process.
S3, before the beginning of coating the anti-welding ink, the first conductive layer can be subjected to microetching treatment to remove a brown layer on the surface of the first conductive layer, and brushing treatment is carried out to be more favorable for coating the anti-welding ink, specifically, the brushing treatment step comprises the steps of placing the first conductive layer downwards, closing an upper brush, and brushing at a speed of 3m/min and a current of 1.0A so as to remove the glue overflow on the surface of the first conductive layer; and then, secondarily drilling positioning holes on the circuit board, and coating a solder resist ink layer on the surface of the first conductive layer far away from the middle conductive layer.
S4, carrying out surface gold plating treatment, forming, electric measurement and visual inspection to obtain a finished product.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related arts are included in the scope of the present invention.
Claims (6)
1. The manufacturing method of the waterproof PCB is characterized by comprising the following steps of:
s1, blanking, pressing, drilling, copper plating and etching to manufacture an outer layer pattern, so as to obtain a semi-finished circuit board; the semi-finished circuit board comprises a first conductive layer, a plurality of middle conductive layers and a second conductive layer which are sequentially laminated from top to bottom;
s2, an insulating waterproof layer is arranged outside the surface, far away from the middle conductive layer, of the second conductive layer, and the insulating waterproof layer and the semi-finished circuit board are pressed in a voltage combination mode;
s3, secondarily drilling positioning holes, and coating a welding-preventing ink layer on the surface, far away from the middle conductive layer, of the first conductive layer;
s4, carrying out surface gold plating treatment, forming, electric measurement and visual inspection to obtain a finished product;
s2 comprises the following steps:
s21, sequentially laminating an insulating waterproof layer, a release film, a cushion pad and a lower copper foil layer on the surface of the second conductive layer far away from the middle conductive layer;
s22, sequentially laminating a release film, a cushion pad and an upper copper foil layer on the surface of the first conductive layer far away from the middle conductive layer;
s23, pressing by adopting an Adara pressing machine;
the insulating waterproof layer is a non-flowing prepreg containing resin and glass fiber cloth.
2. The method for manufacturing a waterproof PCB according to claim 1, wherein the middle conductive layer includes a third conductive layer and a fourth conductive layer, the temperature rise rate of the lamination in S23 is 2.5-3.5 ℃/min, and the lamination pressure is 21-28kg/cm 2 The thickness is controlled to be 50-90um.
3. The method for manufacturing a waterproof PCB according to claim 1 or 2, further comprising a browning step before step S2.
4. The method of claim 3, further comprising a microetching step after the step S2 to remove the brown oxide layer of the first conductive layer.
5. The method for manufacturing a waterproof PCB according to claim 3, further comprising a brushing step before step S3.
6. The method of claim 5, wherein the brushing step includes placing the first conductive layer downward, closing the upper brush, brushing at a speed of 3m/min and a current of 1.0A to remove the flash on the surface of the first conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011040729.3A CN112165788B (en) | 2020-09-28 | 2020-09-28 | Manufacturing method of waterproof PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011040729.3A CN112165788B (en) | 2020-09-28 | 2020-09-28 | Manufacturing method of waterproof PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112165788A CN112165788A (en) | 2021-01-01 |
| CN112165788B true CN112165788B (en) | 2024-02-06 |
Family
ID=73861402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011040729.3A Active CN112165788B (en) | 2020-09-28 | 2020-09-28 | Manufacturing method of waterproof PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112165788B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473750B (en) * | 2021-06-30 | 2022-11-15 | 天津普林电路股份有限公司 | Lamination processing method of windowing laminated plate for aviation |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000071386A (en) * | 1998-08-26 | 2000-03-07 | Matsushita Electric Works Ltd | Production of laminated sheet |
| JP2000286546A (en) * | 1999-03-31 | 2000-10-13 | Matsushita Electric Works Ltd | Production of printed wiring board |
| JP2006196718A (en) * | 2005-01-14 | 2006-07-27 | Kureha Corp | Moisture-resistant coverlay film, and flexible printed wiring board using same coverlay film |
| JP2007308681A (en) * | 2006-04-18 | 2007-11-29 | Hitachi Chem Co Ltd | Photo-curable resin composition, photo-curable moisture-proof insulating coating for mounting circuit board, electronic component and method for producing the same |
| JP2010287862A (en) * | 2009-06-15 | 2010-12-24 | C Uyemura & Co Ltd | Method of manufacturing printed circuit board |
| JP2011155234A (en) * | 2009-12-28 | 2011-08-11 | Sumitomo Bakelite Co Ltd | Flexible circuit board with waterproof member, and method of manufacturing the same |
| JP2013030548A (en) * | 2011-07-27 | 2013-02-07 | Fujikura Ltd | Flexible printed wiring board and manufacturing method of the same |
| CN103392385A (en) * | 2012-02-13 | 2013-11-13 | Cedal装置有限责任公司 | Improvements in the manufacturing of stacks of multiplayer plastic laminates for printed circuits |
| CN103582325A (en) * | 2012-07-31 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN110461099A (en) * | 2019-09-02 | 2019-11-15 | 昆山纬亚智能科技有限公司 | A kind of processing method of flexible circuit board |
-
2020
- 2020-09-28 CN CN202011040729.3A patent/CN112165788B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000071386A (en) * | 1998-08-26 | 2000-03-07 | Matsushita Electric Works Ltd | Production of laminated sheet |
| JP2000286546A (en) * | 1999-03-31 | 2000-10-13 | Matsushita Electric Works Ltd | Production of printed wiring board |
| JP2006196718A (en) * | 2005-01-14 | 2006-07-27 | Kureha Corp | Moisture-resistant coverlay film, and flexible printed wiring board using same coverlay film |
| JP2007308681A (en) * | 2006-04-18 | 2007-11-29 | Hitachi Chem Co Ltd | Photo-curable resin composition, photo-curable moisture-proof insulating coating for mounting circuit board, electronic component and method for producing the same |
| JP2010287862A (en) * | 2009-06-15 | 2010-12-24 | C Uyemura & Co Ltd | Method of manufacturing printed circuit board |
| JP2011155234A (en) * | 2009-12-28 | 2011-08-11 | Sumitomo Bakelite Co Ltd | Flexible circuit board with waterproof member, and method of manufacturing the same |
| JP2013030548A (en) * | 2011-07-27 | 2013-02-07 | Fujikura Ltd | Flexible printed wiring board and manufacturing method of the same |
| CN103392385A (en) * | 2012-02-13 | 2013-11-13 | Cedal装置有限责任公司 | Improvements in the manufacturing of stacks of multiplayer plastic laminates for printed circuits |
| CN103582325A (en) * | 2012-07-31 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN110461099A (en) * | 2019-09-02 | 2019-11-15 | 昆山纬亚智能科技有限公司 | A kind of processing method of flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112165788A (en) | 2021-01-01 |
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