CN112151429A - Substrate transfer equipment, semiconductor process machine, and substrate transfer method - Google Patents

Abstract

A substrate conveying device, a semiconductor process machine and a substrate conveying method. The substrate conveying device includes a conveying device and a positioning device. The conveying device is used to convey the substrate to the positioning device for positioning. The positioning device is used to calculate the position to be measured of the substrate. If the position to be measured is the same as the first default position, the positioning device provides a default conveying coordinate to the conveying device. If the position to be measured is different from the first default position, the positioning device provides a corrected conveying coordinate to the conveying device. The corrected conveying coordinate includes the preset conveying coordinate and a coordinate correction value. The first default position is a default center coordinate, and the position to be measured is a center coordinate detection value of the substrate.

Description

Substrate transfer equipment, semiconductor process machine, and substrate transfer method

【Technical field】

The present disclosure relates to the technical field of substrate transfer equipment, and in particular, to a substrate transfer device with a positioning function, a semiconductor process machine, and a substrate transfer method.

【Background technique】

In order to speed up the process, semiconductor processing machines use methods such as robotic arms to transfer wafers. For example, a robotic arm removes wafers from a cassette in the unloading area and sends them to a carrier or turntable in the process chamber. Misalignment of wafers on the turntable can cause instability and affect process yield when the turntable rotates.

Referring to FIG. 1 , the cassette 2 on which the wafer 1 is placed is not tightly fitted with the wafer 1 . The position of the wafer 1 placed in the cassette 2 will be slightly different, so that when the subsequent robotic arm holds the wafer 1 and places it on the stage or turntable, the center of the wafer 1 cannot be aligned with the rotation axis of the turntable.

The conventional technology uses mechanical positioning or laser optical positioning, which has complicated steps and wastes a lot of process time. There is another method of using image positioning, but it cannot be applied to transparent wafer materials or opaque wafer materials. Wafers with warpage cannot be positioned accurately.

In some image positioning technologies, the imaging unit is arranged in the process cavity. However, because other equipment usually needs to be configured in the process chamber to process the substrate in the process chamber, it is not easy to configure the optical axis of the imaging unit to overlap the symmetry axis of the substrate. The image acquired by the imaging unit will therefore be distorted, increasing the difficulty and time of positioning. In addition, reactive gases or substances are often applied in the process chamber, which easily contaminates the lens of the imaging unit, so that the semiconductor machine must be frequently shut down for maintenance.

[Content of the invention]

In order to solve the above-mentioned technical problems, an object of the present disclosure is to provide a substrate transfer device, a semiconductor process machine, and a substrate transfer method, which can effectively solve the complex positioning method in the prior art and the inability to locate warped wafers The problem.

In order to achieve the above object, the present disclosure provides a substrate transfer apparatus, which is suitable for transferring the substrates from a loading area to a carrier. The substrate transfer apparatus includes a transfer device and a positioning device. The conveying device is used for supporting the substrate and conveying the substrate to the carrier. The positioning device is arranged between the loading area and the carrier, and is used for positioning the position to be tested of the substrate. The transfer device is used for transferring the substrate to the positioning device for positioning before transferring the substrate to the carrier. The positioning device is used for calculating the position to be measured of the substrate. If the position to be tested is the same as the first default position, the positioning device provides a default transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to the second position on the stage Default location. If the position to be tested is different from the first default position, the positioning device provides corrected transfer coordinates to the transfer device, so that the substrate can be transferred by the transfer device to any position on the stage. the second default location. The modified transmission coordinates include the preset transmission coordinates and a coordinate correction value. The first default position is a default circle center coordinate, the position to be measured is a circle center coordinate detection value of the substrate, and the coordinate correction value is a difference between the circle center coordinate detection value and the preset circle center coordinate.

In the embodiment of the present disclosure, the positioning device includes an image capturing unit and a backlight unit disposed opposite to the image capturing unit. The optical axis of the backlight unit overlaps with the optical axis of the image capturing unit. The conveying device is used for conveying the substrate between the backlight unit and the image capturing unit, so that the substrate is located in the image capturing range of the image capturing unit.

In an embodiment of the present disclosure, the first default position is located in the image capturing range between the backlight unit and the image capturing unit.

In an embodiment of the present disclosure, the positioning device detects whether the substrate is located at the first default position only when the conveying device reaches the default device position, and the default device position is between the backlight unit and the backlight unit. between the imaging units.

In an embodiment of the present disclosure, the position to be measured is an average value of a plurality of detection values of the center coordinates of the substrate.

In an embodiment of the present disclosure, the positioning device includes an arithmetic unit for calculating the detection value of the center coordinates of the substrate. The detected value of the coordinates of the center of the circle is calculated and obtained by the computing device by one of a graph comparison method, a circular arc calculation method or a circle-adapted caliper method.

In an embodiment of the present disclosure, the positioning device is used to operate the imaging unit to acquire a complete image of the substrate.

The present disclosure also provides a semiconductor process tool, including a reaction chamber, a loading area, and a substrate transfer device. The reaction chamber is used for semiconductor process. A stage is set in the reaction chamber. The loading area is used for placing at least the substrate. The substrate transfer apparatus includes a transfer device and a positioning device. The conveying device is used for supporting the substrate and conveying the substrate from the unloading area to the carrier. The positioning device is arranged between the loading area and the carrier, and is used for positioning the position to be tested of the substrate. The transfer device is used for transferring the substrate to the positioning device for positioning before transferring the substrate to the carrier. The positioning device is used for calculating the position to be measured of the substrate. If the position to be tested is the same as the first default position, the positioning device provides default transfer coordinates to the transfer device, so that the substrate can be transferred by the transfer device to the second default position on the stage Location. If the position to be tested is different from the first default position, the positioning device provides corrected transfer coordinates to the transfer device, so that the substrate can be transferred by the transfer device to any position on the stage. the second default location. The modified transmission coordinates include the preset transmission coordinates and a coordinate correction value. The first default position is a default circle center coordinate, the position to be measured is a circle center coordinate detection value of the substrate, and the coordinate correction value is a difference between the circle center coordinate detection value and the preset circle center coordinate.

In the semiconductor process tool of one embodiment of the present disclosure, the positioning device includes an imaging unit and a backlight unit disposed opposite to the imaging unit. The optical axis of the backlight unit overlaps with the optical axis of the image capturing unit. The conveying device is used for conveying the substrate between the backlight unit and the image capturing unit, so that the substrate is located in the image capturing range of the image capturing unit.

The present disclosure also provides a method for transferring substrates, which is suitable for transferring the substrates from a loading area to a carrier, wherein the method for transferring substrates includes: providing a transfer device; and providing a positioning device, which is arranged in the loading area and between the carriers; the transfer device supports the substrate and transfers the substrate to the positioning device; the positioning device detects the position of the substrate to be tested; the positioning device determines the position to be tested Whether the location is the same as the first default location, if the location to be tested is the same as the first default location, the positioning device provides default transmission coordinates to the transmission device; the transmission device transmits the location according to the default transmission coordinates the substrate to the second default position on the stage; if the position to be tested is different from the first default position, the positioning device provides corrected transmission coordinates to the transmission device; and the transmission device according to The modified transfer coordinates transfer the substrate to the second default position on the stage. The corrected transmission coordinates include the preset transmission coordinates and a coordinate correction value, the first default position is the default circle center coordinate, the to-be-measured position is the detection value of the circle center coordinate of the substrate, and the coordinate correction value is the difference between the detected value of the circle center coordinates and the preset circle center coordinates.

Since the substrate transfer apparatus and the semiconductor process tool of the embodiments of the present disclosure detect and obtain the detection value of the coordinates of the center of the substrate through the imaging unit and the backlight unit of the positioning device, and correct the transfer coordinates of the transfer device, the wafer can be quickly and accurately provided. The circular positioning, which is not affected by wafer warpage, effectively avoids the problems in the prior art.

In order to make the above-mentioned content of the present disclosure more obvious and easy to understand, the preferred embodiments are exemplified below, and are described in detail as follows in conjunction with the accompanying drawings:

【Description of drawings】

FIG. 1 shows a schematic structural diagram of a cassette for placing wafers in the prior art;

FIG. 2 is a schematic structural diagram of a semiconductor processing tool according to an embodiment of the present disclosure;

3 shows a schematic diagram of a first default position and a second default position according to an embodiment of the present disclosure;

FIG. 4 shows a schematic structural diagram of an image capturing unit and a backlight unit according to an embodiment of the present disclosure;

5 is a schematic diagram showing a default device location according to an embodiment of the present disclosure;

FIG. 6 shows a schematic diagram of an image obtained by an image capturing unit according to an embodiment of the present disclosure; and

FIG. 7 shows a schematic flowchart of a substrate transfer method according to an embodiment of the present disclosure.

【Detailed ways】

In order to make the above-mentioned and other objects, features, and advantages of the present disclosure more clearly understood, the preferred embodiments of the present disclosure will be exemplified below, and will be described in detail in conjunction with the accompanying drawings. Furthermore, the directional terms mentioned in the present disclosure, such as upper, lower, top, bottom, front, rear, left, right, inner, outer, lateral, peripheral, central, horizontal, lateral, vertical, longitudinal, axial , radial, uppermost or lowermost, etc., only refer to the directions of the attached drawings. Accordingly, the directional terms used are used to describe and understand the present disclosure, rather than to limit the present disclosure.

In the figures, structurally similar elements are denoted by the same reference numerals.

Referring to FIG. 2 and FIG. 3 , the present disclosure provides a substrate transfer apparatus 100 suitable for transferring the substrate 10 from a lower cargo area 200 to a carrier 30 . The substrate transfer apparatus 100 includes a transfer device 110 and a positioning device 120 . The transfer device 110 is used for supporting the substrate 10 and transferring the substrate 10 to the carrier 30 . The positioning device 120 is disposed between the loading area 200 and the stage 30 for positioning a position M_P of the substrate 10 to be measured. The transfer device 110 is used for transferring the substrate 10 to the positioning device 120 for positioning before transferring the substrate 10 to the carrier 30 . The positioning device 120 is used to calculate the position to be measured M_P of the substrate 10 . If the position to be measured M_P is the same as a first default position P_P1 , the positioning device 120 provides a default transfer coordinate P_C to the transfer device 110 so that the substrate 10 can be transferred to the transfer device 110 A second default position P_P2 on the stage 30 . If the position to be measured M_P is different from the first default position P_P1 , the positioning device 120 provides a corrected transfer coordinate A_C to the transfer device 110 , so that the substrate 10 can be transferred by the transfer device 110 to the second default position P_P2 on the stage 30 . The corrected transmission coordinate A_C includes the preset transmission coordinate P_C and a coordinate correction value. The first default position P_P1 is a default circle center coordinate P_CC, the position to be measured M_P is a circle center coordinate detection value M_CC of the substrate 10 , and the coordinate correction value is the circle center coordinate detection value M_CC and the The difference between the preset circle center coordinates P_CC.

Specifically, the substrate transfer apparatus 100 should be calibrated first, so that if the position to be measured M_P is the same as the first default position P_P1 , the transfer device 110 can transfer the substrate at the default transfer coordinate P_C 10 is sent to the second default position P_P2 of the stage 30 . FIG. 3 shows an example in which the position to be measured M_P is different from the first default position P_P1 . In FIGS. 2 and 3 , the black dots at the first default position P_P1 or the second default position P_P2 are for illustration only, and do not mean that the black dots or marks for alignment must be drawn in the substrate transfer apparatus 100 .

Specifically, FIG. 3 shows a transparent substrate 10, so the conveying device 110 below can be seen through the substrate. The transmission device 110 is, for example, a robotic arm, and the present invention is not limited thereto. Figure 6 shows an opaque or less transparent substrate 10'.

Specifically, since the substrate 10 is mostly circular and has symmetry, the coordinates of the center of the circle are used as the positioning reference, so that the positioning of the substrate can be achieved quickly and accurately. It is also applicable to substrates with warped or alignment gaps.

Referring to FIG. 4 , in one embodiment of the present disclosure, the positioning device 120 includes an imaging unit 121 and a backlight unit 122 disposed opposite to the imaging unit 121 . An optical axis O_A of the backlight unit 122 overlaps with an optical axis O_A' of the imaging unit 121. The conveying device 110 is used for conveying the substrate 10 between the backlight unit 122 and the imaging unit 121 , so that the substrate 10 is located in an imaging range C_F of the imaging unit 121 .

Specifically, an optical axis O_A of the backlight unit 122 overlaps with an optical axis O_A' of the image capturing unit 121, and the optical axis O_A is perpendicular to the supporting plane of the transmission device 110, so that the image captured by the image capturing unit 121 does not Distortion is generated, the difficulty of identification and calculation is reduced, and the process time is shortened.

In one embodiment of the present disclosure, the first default position P_P1 is located in the image capturing range C_F between the backlight unit 122 and the image capturing unit 121 .

5, in one embodiment of the present disclosure, when the transfer device 110 reaches a default device position P_DP, the positioning device 120 detects whether the substrate 10 is located at the first default position P_P1, and The default device position P_DP is located between the backlight unit 122 and the imaging unit 121 .

Specifically, the transmission device 110 should be calibrated first, so that the transmission device 110 can accurately reach the default device position P_DP. When the transfer device 110 reaches a default device position P_DP, the positioning device 120 is triggered to detect the position of the substrate 10 .

In one embodiment of the present disclosure, the to-be-measured position M_P is an average value of a plurality of the center coordinate detection values M_CC of the substrate 10 .

Specifically, although only a small segment of the arc can be used to calculate the position of the center of the circle, for a substrate with warped conditions, there will be a large error in calculating the center of the circle with only a small segment of the arc. Therefore, the present disclosure takes a larger range of Circle image, calculate and average the coordinates of multiple circle centers to obtain better alignment results.

Referring to FIG. 2 , in one embodiment of the present disclosure, the positioning device 120 includes an arithmetic unit 130 for calculating the detection value M_CC of the center coordinate of the substrate 10 . The detected value of the coordinates of the center of the circle is calculated by the computing device by one of a pattern matching method (Pattern Match), a circular arc calculation method (Curve Fit) or a circle fitting caliper method (CircleFit Caliper).

Specifically, the pattern comparison method requires a complete image of the substrate and is suitable for opaque or less transparent substrates. The pattern comparison method cuts the substrate image into small areas, and calculates the position of the center of gravity of the pattern formed by all the small areas, which is the center of the substrate. The arc calculation method is suitable for transparent or opaque substrates. In the arc calculation method, the circumference of the substrate is appropriately divided into several small sections, and the mid-perpendicular line of each arc is calculated. Arc segments can partially overlap. The intersection of the two perpendicular lines is the center of the circle. The present disclosure calculates a plurality of circle center positions and then averages them, and sets upper and lower limits to eliminate the circle centers whose coordinate values are excessively deviated before calculating the average circle center position. The circular-fit caliper method is suitable for transparent, opaque, or warped substrates. The circle fitting caliper method uses software calipers to fit on the circumference of the substrate image to construct the best fitting circle (VirtualCircle) to obtain the coordinates of the center of the circle. In the present disclosure, a software caliper is adapted to a plurality of arc segments to obtain the coordinates of a plurality of circle centers, and then average values are obtained to reduce errors.

In one embodiment of the present disclosure, the positioning device is used to operate the imaging unit to acquire a complete image of the substrate.

Referring to FIG. 2 and FIG. 3 , the present disclosure further provides a semiconductor process tool 1000 including a reaction chamber 300 , a lower cargo area 200 and a substrate transfer apparatus 100 . The reaction chamber 300 is used for semiconductor process. A stage 30 is arranged in the reaction chamber 300 . The loading area 200 is used for placing at least one substrate 10 . The substrate transfer apparatus 100 includes a transfer device 110 and a positioning device 120 . The transfer device 110 is used for supporting the substrate 10 and transferring the substrate 10 from the loading area 200 to the carrier 30 . The positioning device 120 is disposed between the loading area 200 and the stage 30 for positioning a position M_P of the substrate 10 to be measured. The transfer device 110 is used for transferring the substrate 10 to the positioning device 120 for positioning before transferring the substrate 10 to the carrier 30 . The positioning device 120 is used to calculate the position to be measured M_P of the substrate 10 . If the position to be measured M_P is the same as a first default position P_P1 , the positioning device 120 provides a default transfer coordinate P_C to the transfer device 110 so that the substrate 10 can be transferred to the transfer device 110 A second default position P_P2 on the stage 30 . If the position to be measured M_P is different from the first default position P_P1 , the positioning device 120 provides a corrected transfer coordinate A_C to the transfer device 110 , so that the substrate 10 can be transferred by the transfer device 110 to the second default position P_P2 on the stage 30 . The corrected transmission coordinate A_C includes the preset transmission coordinate P_C and a coordinate correction value. The first default position P_P1 is a default circle center coordinate P_CC, the position to be measured M_P is a circle center coordinate detection value M_CC of the substrate 10 , and the coordinate correction value is the circle center coordinate detection value M_CC and the The difference between the preset circle center coordinates P_CC.

Specifically, the substrate transfer apparatus 100 should be calibrated first, so that if the position to be measured M_P is the same as the first default position P_P1 , the transfer device 110 can transfer the substrate at the default transfer coordinate P_C 10 is sent to the second default position P_P2 of the stage 30 . FIG. 3 shows an example in which the position to be measured M_P is different from the first default position P_P1 . In FIGS. 2 and 3 , the black dots at the first default position P_P1 or the second default position P_P2 are for illustration only, and do not mean that the black dots or marks for alignment must be drawn in the substrate transfer apparatus 100 .

Specifically, FIG. 3 shows a transparent substrate 10, so the conveying device 110 below can be seen through the substrate. The transmission device 110 is, for example, a robotic arm, and the present invention is not limited thereto. Figure 6 shows an opaque or less transparent substrate 10'.

Specifically, since the substrate 10 is mostly circular and has symmetry, the coordinates of the center of the circle are used as the positioning reference, so that the positioning of the substrate can be achieved quickly and accurately. It is also applicable to substrates with warped or alignment gaps.

Specifically, the numbers and configurations of the loading area 200, the reaction chamber 300, etc. of the semiconductor process tool 1000 shown in FIG. 2 are for illustration only, and the present disclosure is not limited thereto.

Specifically, the stage 30 is, for example, a spin chuck. The substrate 10 is, for example, a wafer. The unloading area 200 may be provided with a wafer cassette to carry a plurality of wafers.

Referring to FIG. 4 , in the semiconductor process tool 1000 according to one embodiment of the present disclosure, the positioning device 120 includes an imaging unit 121 and a backlight unit 122 disposed opposite to the imaging unit 121 . An optical axis O_A of the backlight unit 122 overlaps with an optical axis O_A' of the imaging unit 121. The conveying device 110 is used for conveying the substrate 10 between the backlight unit 122 and the imaging unit 121 , so that the substrate 10 is located in an imaging range C_F of the imaging unit 121 .

Specifically, an optical axis O_A of the backlight unit 122 overlaps with an optical axis O_A' of the image capturing unit 121, and the optical axis O_A is perpendicular to the supporting plane of the transmission device 110, so that the image captured by the image capturing unit 121 does not Distortion is generated, the difficulty of identification and calculation is reduced, and the process time is shortened. Specifically, an optical axis O_A' of the image capturing unit 121 approximately overlaps with the symmetry axis of the substrate 10 to obtain an image with a low degree of distortion.

Referring to FIG. 7 , the present disclosure further provides a substrate transfer method suitable for transferring the substrate 10 from the lower cargo area 200 to a carrier 30 , wherein the substrate transfer method includes: step S10 : providing a transfer device 110 ; Step S20: provide a positioning device 120, disposed between the loading area 200 and the carrier 30; Step S30: the transfer device 110 supports the substrate 10 and transfers the substrate 10 to the Step S40: the positioning device 120 detects a position to be measured M_P of the substrate 10; Step S50: the positioning device 120 determines whether the position to be measured M_P is the same as a first default position P_P1, If the to-be-measured position M_P is the same as a first default position P_P1 , step S60 is executed: the positioning device 120 provides a default transmission coordinate P_C to the transmission device 110 ; Step S70 : the transmission device 110 follows the default Transfer the coordinates P_C to transfer the substrate 10 to a second default position P_P2 on the stage 30 ; if the position to be measured M_P is different from the first default position P_P1 , step S80 is executed: the positioning device 120 Provide a modified transfer coordinate A_C to the transfer device 110 ; and step S90 : the transfer device 110 transfers the substrate 10 to the second default position P_P2 on the stage 30 according to the modified transfer coordinate A_C. The corrected transfer coordinate A_C includes the preset transfer coordinate P_C and a coordinate correction value, the first default position P_P1 is a default center coordinate P_CC, and the to-be-measured position M_P is a center coordinate of the substrate 10 The detection value M_CC, and the coordinate correction value is the difference between the circle center coordinate detection value M_CC and the preset circle center coordinate P_CC.

Compared with the prior art, the substrate transfer apparatus, the semiconductor process machine, and the substrate transfer method of the present disclosure detect and obtain the detection value of the coordinates of the center of the substrate by the imaging unit and the backlight unit of the positioning device, and correct the transfer coordinates of the transfer device, so that The wafer positioning can be provided quickly and accurately, and is not affected by the warpage of the wafer, thus effectively avoiding the problems in the prior art.

While the disclosure has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on a reading and understanding of this specification and the accompanying drawings. The present disclosure includes all such modifications and variations and is limited only by the scope of the appended claims. In particular with respect to the various functions performed by the above-described components, the terms used to describe such components are intended to correspond to any component that performs the specified function of the component (eg, which is functionally equivalent) (eg, which is functionally equivalent) (unless otherwise indicated) , even if it is not structurally equivalent to the disclosed structure that performs the functions of the exemplary implementations of the specification shown herein. Furthermore, although a particular feature of this specification has been disclosed with respect to only one of several implementations, such feature may be combined with one or more of the other implementations as may be desired and advantageous for a given or particular application Other feature combinations. Also, to the extent that the terms "including," "having," "containing," or variations thereof, are used in the detailed description or the claims, such terms are intended to include in a manner similar to the term "comprising."

The above are only the preferred embodiments of the present disclosure. It should be pointed out that for those skilled in the art, on the premise of not departing from the principles of the present disclosure, several improvements and modifications can also be made, and these improvements and modifications should also be regarded as the present disclosure. protected range.

Claims (10)

1. A substrate transfer apparatus adapted to transfer the substrate from a reject area onto a carrier, the substrate transfer apparatus comprising:

the conveying device is used for supporting the substrate and conveying the substrate to the carrying platform; and

a positioning device arranged between the unloading area and the carrier for positioning the position to be measured of the substrate, wherein

The conveying device is used for conveying the substrate to the positioning device for positioning before conveying the substrate to the carrying platform;

the positioning device is used for calculating the position to be measured of the substrate;

if the position to be detected is the same as the first default position, the positioning device provides default transmission coordinates to the transmission device so that the substrate can be transmitted to a second default position on the carrying platform by the transmission device; and

if the position to be detected is different from the first default position, the positioning device provides a corrected transmission coordinate to the transmission device so that the substrate can be transmitted to the second default position on the carrying platform by the transmission device, wherein the corrected transmission coordinate comprises the preset transmission coordinate and a coordinate correction value, the first default position is a default circle center coordinate, the position to be detected is a circle center coordinate detection value of the substrate, and the coordinate correction value is a difference value between the circle center coordinate detection value and the preset circle center coordinate.

2. The substrate transport apparatus of claim 1,

the positioning device comprises an image capturing unit and a backlight unit arranged opposite to the image capturing unit;

the optical axis of the backlight unit is overlapped with the optical axis of the image capturing unit; and

the conveying device is used for conveying the substrate to a position between the backlight unit and the image capturing unit so as to enable the substrate to be located in an image capturing range of the image capturing unit.

3. The substrate transport apparatus of claim 2, wherein the first default position is located in the image capture range between the backlight unit and the image capture unit.

4. The substrate transport apparatus of claim 2, wherein the positioning device detects whether the substrate is at the first default position only when the transport device reaches a default device position, the default device position being between the backlight unit and the image capture unit.

5. The substrate transport apparatus according to claim 1, wherein the position to be measured is an average value of a plurality of detected values of the center coordinates of the substrate.

6. The substrate transport apparatus of claim 1, wherein the positioning device comprises an arithmetic unit for calculating the center coordinate detection value of the substrate, wherein the center coordinate detection value is calculated by the arithmetic device by one of a graph comparison method, an arc calculation method or a circle-fit caliper method.

7. The substrate transport apparatus according to claim 1, wherein the positioning device is configured to operate the image capturing unit to obtain a complete image of the substrate.

8. A semiconductor processing machine is characterized by comprising

The semiconductor manufacturing device comprises a reaction chamber, a first substrate and a second substrate, wherein the reaction chamber is used for carrying out semiconductor manufacturing processes, and a carrying platform is arranged in the reaction chamber;

a lower cargo area for placing at least one substrate; and

a substrate transfer apparatus comprising:

the conveying device is used for supporting the substrate and conveying the substrate from the unloading area to the carrying platform; and

a positioning device arranged between the unloading area and the carrier for positioning the position to be measured of the substrate, wherein

The conveying device is used for conveying the substrate to the positioning device for positioning before conveying the substrate to the carrying platform;

the positioning device is used for calculating the position to be measured of the substrate;

if the position to be detected is the same as the first default position, the positioning device provides default transmission coordinates to the transmission device so that the substrate can be transmitted to a second default position on the carrying platform by the transmission device; and

if the position to be detected is different from the first default position, the positioning device provides a corrected transmission coordinate to the transmission device so that the substrate can be transmitted to the second default position on the carrying platform by the transmission device, wherein the corrected transmission coordinate comprises the preset transmission coordinate and a coordinate correction value, the first default position is a default circle center coordinate, the position to be detected is a circle center coordinate detection value of the substrate, and the coordinate correction value is a difference value between the circle center coordinate detection value and the preset circle center coordinate.

9. The semiconductor processing apparatus of claim 8, wherein the substrate is a wafer,

the positioning device comprises an image capturing unit and a backlight unit arranged opposite to the image capturing unit;

the optical axis of the backlight unit is overlapped with the optical axis of the image capturing unit; and

the conveying device is used for conveying the substrate to a position between the backlight unit and the image capturing unit so as to enable the substrate to be located in an image capturing range of the image capturing unit.

10. A substrate transfer method adapted to transfer a substrate from a delivery area to a carrier, the substrate transfer method comprising:

providing a conveying device;

providing a positioning device arranged between the goods-unloading area and the carrying platform;

the conveying device is used for supporting the substrate and conveying the substrate to the positioning device;

the positioning device detects the position to be detected of the substrate;

the positioning device judges whether the position to be detected is the same as a first default position or not, and if the position to be detected is the same as the first default position, the positioning device provides default transmission coordinates to the transmission device;

the conveying device conveys the substrate to a second default position on the carrying platform according to the default conveying coordinate;

if the position to be detected is different from the first default position, the positioning device provides a correction transmission coordinate to the transmission device; and

the conveying device conveys the substrate to the second default position on the carrying platform according to the corrected conveying coordinate, wherein the corrected conveying coordinate comprises the preset conveying coordinate and a coordinate correction value, the first default position is a default circle center coordinate, the position to be detected is a circle center coordinate detection value of the substrate, and the coordinate correction value is a difference value of the circle center coordinate detection value and the preset circle center coordinate.

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