CN112143932A - Copper-based palladium coating bonding lead and manufacturing method thereof - Google Patents
Copper-based palladium coating bonding lead and manufacturing method thereof Download PDFInfo
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 210
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 105
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 79
- 239000010949 copper Substances 0.000 title claims abstract description 79
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000011248 coating agent Substances 0.000 title claims abstract description 27
- 238000000576 coating method Methods 0.000 title claims abstract description 27
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 98
- 238000005491 wire drawing Methods 0.000 claims abstract description 63
- 239000000956 alloy Substances 0.000 claims abstract description 52
- 238000000137 annealing Methods 0.000 claims abstract description 52
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 31
- 238000007747 plating Methods 0.000 claims abstract description 23
- 238000007670 refining Methods 0.000 claims abstract description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 56
- 229910052709 silver Inorganic materials 0.000 claims description 56
- 239000004332 silver Substances 0.000 claims description 56
- 238000010438 heat treatment Methods 0.000 claims description 53
- 238000004140 cleaning Methods 0.000 claims description 46
- 239000002245 particle Substances 0.000 claims description 30
- 238000001816 cooling Methods 0.000 claims description 22
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 20
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 20
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 20
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052791 calcium Inorganic materials 0.000 claims description 20
- 239000011575 calcium Substances 0.000 claims description 20
- 229910052744 lithium Inorganic materials 0.000 claims description 20
- 229910052727 yttrium Inorganic materials 0.000 claims description 20
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 20
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 239000000243 solution Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 239000008367 deionised water Substances 0.000 claims description 16
- 229910021641 deionized water Inorganic materials 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052786 argon Inorganic materials 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 238000004321 preservation Methods 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 8
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 6
- 238000009749 continuous casting Methods 0.000 claims description 6
- 230000003247 decreasing effect Effects 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 239000004615 ingredient Substances 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 6
- 239000001530 fumaric acid Substances 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 4
- 241001391944 Commicarpus scandens Species 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 229910052728 basic metal Inorganic materials 0.000 description 2
- 150000003818 basic metals Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000002121 nanofiber Substances 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
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- Electrochemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
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- General Chemical & Material Sciences (AREA)
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Abstract
The invention relates to the technical field of metal bonding wires, in particular to a copper-based palladium coating bonding lead and a manufacturing method thereof, which comprises the following steps: a main material pretreatment process; step two: manufacturing an alloy billet; step three: refining and processing; step four: drawing treatment; step five: annealing treatment; step six: drawing wire manufacturing; step seven: and (5) pretreatment operation of the plated part, comprising the seventh step: plating palladium on the surface; step eight: carrying out secondary annealing treatment; step nine: fine adjustment of wire drawing treatment; the mechanical strength of the copper alloy bonding lead is improved, the wire diameter of the copper alloy bonding lead is further reduced, and the operation precision is further ensured.
Description
Technical Field
The invention relates to the technical field of metal bonding wires, in particular to a copper-based palladium coating bonding wire and a manufacturing method thereof.
Background
The diameter of the copper alloy fine wire is generally less than 1mm, especially the diameter of the ultra-fine wire is less than 0.05mm, and the copper alloy fine wire is widely applied to industries such as electric wires, cables, power electronics and the like. In the fields of chip packaging, special cables and the like, the ultra-thin monofilaments are beneficial to reducing the chip packaging volume or improving the fatigue resistance of the cables after twisting. The pure copper thin wire is easy to soften at high temperature, and the high temperature resistance and the strength of the wire can be effectively improved by adopting the copper alloy material. In industrial production, a large number of mobile electric devices such as a robot wrist arm exist, wherein a cable has to have good fatigue resistance and strength, otherwise, the cable is easy to break to cause production accidents. Therefore, the improvement of the characteristics of the copper alloy wire rod is of great significance in production practice.
Chinese patent (No. CN 105895186B) discloses a copper alloy thin wire monofilament, a copper alloy thin wire, and a method and an apparatus for manufacturing the same, so that the provided copper alloy thin wire monofilament has a nanofiber crystal structure, and the obtained copper alloy thin wire has good strength and fatigue resistance, but the technical method has high overall process manufacturing, and high wire body forming operation cost, and does not meet the requirements of the current metal manufacturing industry.
Disclosure of Invention
The invention aims to provide a copper-based palladium coating bonding wire and a manufacturing method thereof, which aim to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a copper-based palladium coating bonding lead comprises a copper alloy substrate and a palladium transition layer, and is characterized in that the copper alloy bonding lead takes a copper alloy as a substrate, the surface of the substrate is plated with a palladium layer, and the copper alloy consists of the following components in percentage by mass: 1.5 to 3 percent of silver, 0.003 to 0.03 percent of lithium, 0.0002 to 0.002 percent of calcium, 0.0002 to 0.001 percent of aluminum, 0.0005 to 0.005 percent of yttrium, 0.0001 to 0.001 percent of the total amount of inevitable other impurity elements and the balance of copper; the palladium layer adopts palladium metal with the purity of more than 99.9999 percent as a material.
The thickness of the palladium layer is 0.3-0.6 μm.
The application also discloses a manufacturing method of the copper-based palladium coating bonding lead, which comprises the following steps:
the method comprises the following steps: a main material pretreatment process; selecting required copper ingots and silver particles, cleaning the copper ingots and the silver particles by using a sodium hydroxide aqueous solution with the mass concentration of 5-8%, cleaning the copper ingots and the silver particles by using deionized water, and drying the copper ingots and the silver particles to finish the copper ingots and silver ingots and pretreatment to obtain a pretreatment blank A;
step two: manufacturing an alloy billet; putting the copper ingot in the pretreated blank A into a vacuum casting furnace, and adding the ingredients according to the mass percentage of 1.5-3% of silver, 0.003-0.03% of lithium, 0.0002-0.002% of calcium, 0.0002-0.001% of aluminum and 0.0005-0.005% of yttrium, wherein the silver is silver particles in the pretreated blank A, and the lithium, the calcium, the aluminum and the yttrium are all metal powder, heating to 500-600 ℃ at the speed of 50 ℃/min, preserving heat for 30min, heating to 1100-1200 ℃ at the speed of 50 ℃/min, and preserving heat for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet B;
step three: refining and processing; putting the alloy billet B into a vacuum pull-down continuous casting furnace, heating to 1100-1200 ℃ at the speed of 50 ℃/min, continuously heating until the alloy billet B is completely melted, refining for 30min, and pulling down by adopting a directional solidification technical method to obtain an alloy billet rod C;
step four: drawing treatment; the alloy billet bar C was subjected to a drawing process with a working section having a circumferential angle of 190. The cam curves are identical. The phase angles of the two cams at the installation positions on the main shaft are different by 180 degrees, when the main shaft rotates for a circle, the front and rear drawing trolleys finish one forward and return action, so that the material deformation is 70-90 percent, and the metal wire drawing blank D is obtained;
step five: annealing treatment; annealing the metal wire drawing blank D after drawing, and exposing the whole material to an annealing box for about 5-6 hours; then slowly cooling, wherein the annealing temperature range is 300-600 ℃, and obtaining a secondary metal wire drawing blank E;
step six: drawing wire manufacturing; heating to 400-450 ℃ at the speed of 30-40 ℃/min, preserving heat for 5-6 hours, drawing into a copper alloy wire with the diameter of 2-3 mm, carrying out heating treatment again, carrying out heat preservation operation after heating, carrying out wire drawing operation again, keeping the temperature control value of each heating treatment unchanged, increasing the heating speed by 5-10 ℃/min each time, and decreasing the heat preservation time by 20-30 min each time; finally, a copper alloy stay wire F with the thickness of 0.05-0.07 mm is manufactured;
step seven: performing pretreatment operation on a plated part, namely performing smoothness treatment on the surface of a copper alloy stay wire F through polishing operation, and performing three times of cleaning operation on the obtained copper alloy stay wire F to remove impurities on the surface of the copper alloy stay wire F to obtain a stay wire G of the part to be plated;
step seven: performing surface palladium plating operation, namely performing surface palladium plating on the stay wire G of the piece to be plated by adopting online electroplating equipment, wherein the thickness of a palladium layer is 0.3-0.6 mu m, the purity of palladium in the palladium layer is more than 99.9999%, the take-up speed of online palladium plating is 6-10 m/min, and the current density is 8-10A/dm 2 to obtain a preformed product H;
step eight: carrying out secondary annealing treatment; the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment. Specifically, the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment, wherein the annealing temperature range is 300-600 ℃, and a secondary preform I is obtained after the treatment and cooling;
step nine: fine adjustment of wire drawing treatment; and performing wire drawing treatment on the secondary preform I again, so as to calibrate and finely adjust the size of the copper-based palladium coating alloy wire drawing, and then obtaining a finished product of the copper-based palladium coating bonding wire.
As a further scheme of the invention: the third step and the fourth step are required to be operated in a vacuum environment, and the vacuum degree is higher than 5 multiplied by 10-2And after Pa, filling high-purity argon.
As a further scheme of the invention: and the cooling speed after processing in the fifth step and the eighth step is not higher than 80 ℃/min.
As a further scheme of the invention: and seventhly, cleaning the stay wire G of the part to be plated for three times, wherein the stay wire G is cleaned by adopting a composite acid washing solution for the first time, an ethanol solution for the second time and deionized water for the third time, and the cleaning time is not less than 2min each time.
As a further scheme of the invention: the composite pickling solution comprises the following components in percentage by mass: 25-30% of acetic acid, 8-10% of fumaric acid, 0.6-1.5% of citric acid, 0.05-0.1% of hydrochloric acid, 0.05-0.1% of isopropanol and the balance of deionized water.
Compared with the prior art, the invention has the beneficial effects that:
in terms of material selection, the copper alloy is used as a base material, the copper is used as a basic metal alloy main body, the silver is used as an auxiliary material, so that the mechanical property of the copper alloy bonding wire can be improved, crystal grains are refined, a small amount of lithium, calcium, aluminum and yttrium are added for configuration, the tensile strength and the oxidation resistance of the copper alloy bonding wire can be improved, the mechanical strength of the copper alloy bonding wire is improved, the wire diameter of the copper alloy bonding wire is further reduced, and the problems that the traditional bonding wire is high in price, easy to oxidize on the surface, poor in bonding property and easy to break due to drawing are effectively solved.
In terms of the manufacturing process, the ductility of the wire drawing is improved by annealing after the wire drawing is performed, and during wire drawing manufacturing, the operation effect of the wire drawing is improved by a layer-by-layer progressive method in a reciprocating temperature rise processing-wire drawing ductility mode, so that the wire drawing effect is improved.
Before the palladium plating operation, the surface smoothing operation and the cleaning operation are carried out on the stay wire of the part to be plated, the operation risk that the palladium plating surface is not flat is reduced, and the size of the stay wire is calibrated and finely adjusted again before the finished product is finished, so that the operation precision is further ensured.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application. Also, the drawings and the description are not intended to limit the scope of the present concepts in any way, but rather to illustrate the concepts of the present disclosure to those skilled in the art by reference to specific embodiments.
FIG. 1 is a flow chart of the operation of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, examples of which are shown in the drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements, unless otherwise indicated.
It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
a copper-based palladium coating bonding lead comprises a copper alloy substrate and a palladium transition layer, and is characterized in that the copper alloy bonding lead takes a copper alloy as a substrate, the surface of the substrate is plated with a palladium layer, and the copper alloy consists of the following components in percentage by mass: 2.25% of silver, 0.015% of lithium, 0.0012% of calcium, 0.008% of aluminum, 0.003% of yttrium and the balance of copper; the palladium layer adopts palladium metal with the purity of more than 99.9999 percent as a material. The thickness of the palladium layer in this example was 0.45. mu.m.
Referring to fig. 1, a method for manufacturing a copper-based palladium-coated bonding wire includes the following steps:
the method comprises the following steps: a main material pretreatment process; selecting required copper ingots and silver particles, cleaning the copper ingots and the silver particles by using a sodium hydroxide aqueous solution with the mass concentration of 5-8%, cleaning the copper ingots and the silver particles by using deionized water, and drying the copper ingots and the silver particles to finish the copper ingots and silver ingots and pretreatment to obtain a pretreatment blank A;
step two: manufacturing an alloy billet; putting the copper ingot in the pretreated blank A into a vacuum casting furnace, adding the ingredients according to the mass percentage of 2.25% of silver, 0.015% of lithium, 0.0012% of calcium, 0.008% of aluminum and 0.003% of yttrium, wherein the silver is silver particles in the pretreated blank A, the lithium, the calcium, the aluminum and the yttrium are all metal powder, operating in a vacuum environment, and waiting for the vacuum degree to be higher than 5 multiplied by 10-2After Pa, filling high-purity argon; heating to 550 deg.C at a speed of 50 deg.C/min, maintaining for 30min, heating to 1150 deg.C at a speed of 50 deg.C/min, and maintaining for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet B;
step three: refining and processing; putting the alloy billet B into a vacuum down-draw continuous casting furnace, operating in a vacuum environment until the vacuum degree is higher than 5 multiplied by 10-2After Pa, filling high-purity argon;raising the temperature to 1150 ℃ at the speed of 50 ℃/min, continuously heating until the alloy billet is completely melted, refining for 30min, and pulling down by adopting a directional solidification technical method to obtain an alloy billet rod C;
step four: drawing treatment; the alloy billet bar C was subjected to a drawing process with a working section having a circumferential angle of 190. The cam curves are identical. The phase angles of the two cams at the installation positions on the main shaft are different by 180 degrees, when the main shaft rotates for a circle, the front and rear drawing trolleys finish one forward and return action, so that the material deformation is 70-90 percent, and the metal wire drawing blank D is obtained;
step five: annealing treatment; annealing the metal wire drawing blank D after drawing, and exposing the whole material to an annealing box for about 5-6 hours; then slowly cooling at the cooling speed of not higher than 80 ℃/min and the annealing temperature range of 300-600 ℃ to obtain a secondary metal wire drawing blank E;
step six: drawing wire manufacturing; heating to 400-450 ℃ at the speed of 30-40 ℃/min, preserving heat for 5-6 hours, drawing into a copper alloy wire with the diameter of 2-3 mm, carrying out heating treatment again, carrying out heat preservation operation after heating, carrying out wire drawing operation again, keeping the temperature control value of each heating treatment unchanged, increasing the heating speed by 8 ℃/min each time, and decreasing the heat preservation time by 25min each time; finally, a copper alloy stay wire F with the thickness of 0.05-0.07 mm is manufactured;
step seven: performing pretreatment operation on a plated part, namely performing smoothness treatment on the surface of a copper alloy stay wire F through polishing operation, performing three times of cleaning operation on the obtained copper alloy stay wire F to remove impurities on the surface of the copper alloy stay wire F, cleaning the copper alloy stay wire F by adopting a composite acid washing solution for the first time, cleaning the copper alloy stay wire F by adopting an ethanol solution for the second time, and cleaning the copper alloy stay wire F by adopting deionized water for the third time, wherein the cleaning time is not less than 2min each time, so that a stay wire G of the part to be plated is obtained;
step seven: performing surface palladium plating operation, namely performing surface palladium plating on the pull wire G of the piece to be plated by adopting online electroplating equipment, wherein the thickness of a palladium layer is 0.45 mu m, the purity of palladium in the palladium layer is more than 99.9999%, the take-up speed of online palladium plating is 6-10 m/min, and the current density is 9.2A/dm2 to obtain a preformed product H;
step eight: carrying out secondary annealing treatment; the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment. Specifically, the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment, wherein the annealing temperature range is 300-600 ℃, a secondary preform I is obtained after the treatment and cooling, and the cooling speed is not higher than 80 ℃/min;
step nine: fine adjustment of wire drawing treatment; and performing wire drawing treatment on the secondary preform I again, so as to calibrate and finely adjust the size of the copper-based palladium coating alloy wire drawing, and then obtaining a finished product of the copper-based palladium coating bonding wire.
Example two:
a copper-based palladium coating bonding lead comprises a copper alloy substrate and a palladium transition layer, and is characterized in that the copper alloy bonding lead takes a copper alloy as a substrate, the surface of the substrate is plated with a palladium layer, and the copper alloy consists of the following components in percentage by mass: 1.5% of silver, 0.003% of lithium, 0.0002% of calcium, 0.0002% of aluminum, 0.0005% of yttrium and the balance of copper; the palladium layer adopts palladium metal with the purity of more than 99.9999 percent as a material. This example envisages a palladium layer thickness of 0.3 μm.
Referring to fig. 1, a method for manufacturing a copper-based palladium-coated bonding wire includes the following steps:
the method comprises the following steps: a main material pretreatment process; selecting required copper ingots and silver particles, cleaning the copper ingots and the silver particles by using a sodium hydroxide aqueous solution with the mass concentration of 5-8%, cleaning the copper ingots and the silver particles by using deionized water, and drying the copper ingots and the silver particles to finish the copper ingots and silver ingots and pretreatment to obtain a pretreatment blank A;
step two: manufacturing an alloy billet; putting the copper ingot in the pretreated billet A into a vacuum casting furnace, adding the ingredients according to the mass percentage of 1.5 percent of silver, 0.003 percent of lithium, 0.0002 percent of calcium, 0.0002 percent of aluminum and 0.0005 percent of yttrium, wherein the silver is silver particles in the pretreated billet A, the lithium, the calcium, the aluminum and the yttrium are all metal powder, operating in a vacuum environment, and waiting for the vacuum degree to be higher than 5 multiplied by 10-2After Pa, filling high-purity argon; heating to 500 deg.C at a speed of 50 deg.C/min, maintaining for 30min, heating to 1100 deg.C at a speed of 50 deg.C/min, and maintaining for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet B;
step three: refining and processing; putting the alloy billet B into a vacuum down-draw continuous casting furnace, operating in a vacuum environment until the vacuum degree is higher than 5 multiplied by 10-2After Pa, filling high-purity argon; heating to 1100 deg.C at a speed of 50 deg.C/min, continuously heating to completely melt, refining for 30min, and pulling down by directional solidification to obtain alloy billet C;
step four: drawing treatment; the alloy billet bar C was subjected to a drawing process with a working section having a circumferential angle of 190. The cam curves are identical. The phase angles of the two cams at the installation positions on the main shaft are different by 180 degrees, when the main shaft rotates for a circle, the front and rear drawing trolleys finish one forward and return action, so that the material deformation is 70-90 percent, and the metal wire drawing blank D is obtained;
step five: annealing treatment; annealing the metal wire drawing blank D after drawing, and exposing the whole material to an annealing box for about 5 hours; then slowly cooling at the cooling speed of not higher than 80 ℃/min and the annealing temperature range of 400 ℃ to obtain a secondary metal wire drawing blank E;
step six: drawing wire manufacturing; heating to 400 ℃ at the speed of 30 ℃/min, preserving heat for 5 hours, drawing into a copper alloy wire with the diameter of 2-3 mm, heating again, preserving heat after heating, drawing again, keeping the temperature control value of each heating process unchanged, increasing the heating speed by 5 ℃/min each time, and decreasing the heat preservation time by 20min each time; finally, a copper alloy stay wire F with the thickness of 0.05-0.07 mm is manufactured;
step seven: performing pretreatment operation on a plated part, namely performing smoothness treatment on the surface of a copper alloy stay wire F through polishing operation, performing three times of cleaning operation on the obtained copper alloy stay wire F to remove impurities on the surface of the copper alloy stay wire F, cleaning the copper alloy stay wire F by adopting a composite acid washing solution for the first time, cleaning the copper alloy stay wire F by adopting an ethanol solution for the second time, and cleaning the copper alloy stay wire F by adopting deionized water for the third time, wherein the cleaning time is not less than 2min each time, so that a stay wire G of the part to be plated is obtained;
step seven: performing surface palladium plating operation, namely performing surface palladium plating on the pull wire G of the piece to be plated by adopting online electroplating equipment, wherein the thickness of a palladium layer is 0.3 mu m, the purity of palladium in the palladium layer is more than 99.9999%, the take-up speed of online palladium plating is 6-10 m/min, and the current density is 8.25A/dm2 to obtain a preformed product H;
step eight: carrying out secondary annealing treatment; the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment. Specifically, the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment, wherein the annealing temperature range is 400 ℃, a secondary preform I is obtained after the treatment and cooling, and the cooling speed is not higher than 80 ℃/min;
step nine: fine adjustment of wire drawing treatment; and performing wire drawing treatment on the secondary preform I again, so as to calibrate and finely adjust the size of the copper-based palladium coating alloy wire drawing, and then obtaining a finished product of the copper-based palladium coating bonding wire.
Example three:
a copper-based palladium coating bonding lead comprises a copper alloy substrate and a palladium transition layer, and is characterized in that the copper alloy bonding lead takes a copper alloy as a substrate, the surface of the substrate is plated with a palladium layer, and the copper alloy consists of the following components in percentage by mass: 2% of silver, 0.005% of lithium, 0.0003% of calcium, 0.0003% of aluminum, 0.0006% of yttrium and the balance of copper; the palladium layer adopts palladium metal with the purity of more than 99.9999 percent as a material. This example envisages a palladium layer thickness of 0.4 μm.
Referring to fig. 1, a method for manufacturing a copper-based palladium-coated bonding wire includes the following steps:
the method comprises the following steps: a main material pretreatment process; selecting required copper ingots and silver particles, cleaning the copper ingots and the silver particles by using a sodium hydroxide aqueous solution with the mass concentration of 5-8%, cleaning the copper ingots and the silver particles by using deionized water, and drying the copper ingots and the silver particles to finish the copper ingots and silver ingots and pretreatment to obtain a pretreatment blank A;
step two: manufacturing an alloy billet; putting the copper ingot in the pretreated blank A into a vacuum casting furnace, adding the ingredients according to the mass percentage of 2% of silver, 0.005% of lithium, 0.0003% of calcium, 0.0003% of aluminum and 0.0006% of yttrium, wherein the silver is silver particles in the pretreated blank A, the lithium, the calcium, the aluminum and the yttrium are all metal powder, operating in a vacuum environment, and waiting for the vacuum degree to be higher than 5 multiplied by 10-2After Pa, filling high-purity argon; heating to 500 deg.C at a rate of 50 deg.C/min, maintaining the temperature for 30min, and heating againHeating to 1150 deg.C at a speed of 50 deg.C/min, and maintaining for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet B;
step three: refining and processing; putting the alloy billet B into a vacuum down-draw continuous casting furnace, operating in a vacuum environment until the vacuum degree is higher than 5 multiplied by 10-2After Pa, filling high-purity argon; raising the temperature to 1150 ℃ at the speed of 50 ℃/min, continuously heating until the alloy billet is completely melted, refining for 30min, and pulling down by adopting a directional solidification technical method to obtain an alloy billet rod C;
step four: drawing treatment; the alloy billet bar C was subjected to a drawing process with a working section having a circumferential angle of 190. The cam curves are identical. The phase angles of the two cams at the installation positions on the main shaft are different by 180 degrees, when the main shaft rotates for a circle, the front and rear drawing trolleys finish one forward and return action, so that the material deformation is 70-90 percent, and the metal wire drawing blank D is obtained;
step five: annealing treatment; annealing the metal wire drawing blank D after drawing, and exposing the whole material to an annealing box for about 5 hours; then slowly cooling at the cooling speed of not higher than 80 ℃/min and the annealing temperature range of 400 ℃ to obtain a secondary metal wire drawing blank E;
step six: drawing wire manufacturing; heating to 450 ℃ at the speed of 30 ℃/min, preserving heat for 5 hours, drawing into a copper alloy wire with the diameter of 2-3 mm, heating again, preserving heat after heating, drawing again, keeping the temperature control value of each heating process unchanged, increasing the heating speed by 5 ℃/min each time, and decreasing the heat preservation time by 20min each time; finally, a copper alloy stay wire F with the thickness of 0.05-0.07 mm is manufactured;
step seven: performing pretreatment operation on a plated part, namely performing smoothness treatment on the surface of a copper alloy stay wire F through polishing operation, performing three times of cleaning operation on the obtained copper alloy stay wire F to remove impurities on the surface of the copper alloy stay wire F, cleaning the copper alloy stay wire F by adopting a composite acid washing solution for the first time, cleaning the copper alloy stay wire F by adopting an ethanol solution for the second time, and cleaning the copper alloy stay wire F by adopting deionized water for the third time, wherein the cleaning time is not less than 2min each time, so that a stay wire G of the part to be plated is obtained;
and during cleaning, carrying out three times of cleaning operation, wherein the first time is cleaned by adopting a composite acid washing solution, the second time is cleaned by adopting an ethanol solution, and the third time is cleaned by adopting deionized water, and the cleaning time is not less than 2min each time. The composite acid washing solution is prepared from 25% of acetic acid, 8% of fumaric acid, 0.6% of citric acid, 0.05% of hydrochloric acid, 0.05% of isopropanol and the balance of deionized water.
Step seven: performing surface palladium plating operation, namely performing surface palladium plating on the pull wire G of the piece to be plated by adopting online electroplating equipment, wherein the thickness of a palladium layer is 0.3 mu m, the purity of palladium in the palladium layer is more than 99.9999%, the take-up speed of online palladium plating is 6-10 m/min, and the current density is 8.75A/dm2 to obtain a preformed product H;
step eight: carrying out secondary annealing treatment; the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment. Specifically, the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment, wherein the annealing temperature range is 400 ℃, a secondary preform I is obtained after the treatment and cooling, and the cooling speed is not higher than 80 ℃/min;
step nine: fine adjustment of wire drawing treatment; and performing wire drawing treatment on the secondary preform I again, so as to calibrate and finely adjust the size of the copper-based palladium coating alloy wire drawing, and then obtaining a finished product of the copper-based palladium coating bonding wire.
Example four:
a copper-based palladium coating bonding lead comprises a copper alloy substrate and a palladium transition layer, and is characterized in that the copper alloy bonding lead takes a copper alloy as a substrate, the surface of the substrate is plated with a palladium layer, and the copper alloy consists of the following components in percentage by mass: 3% of silver, 0.03% of lithium, 0.002% of calcium, 0.001% of aluminum, 0.005% of yttrium and the balance of copper; the palladium layer adopts palladium metal with the purity of more than 99.9999 percent as a material. This example envisages a palladium layer thickness of 0.6 μm.
Referring to fig. 1, a method for manufacturing a copper-based palladium-coated bonding wire includes the following steps:
the method comprises the following steps: a main material pretreatment process; selecting required copper ingots and silver particles, cleaning the copper ingots and the silver particles by using a sodium hydroxide aqueous solution with the mass concentration of 5-8%, cleaning the copper ingots and the silver particles by using deionized water, and drying the copper ingots and the silver particles to finish the copper ingots and silver ingots and pretreatment to obtain a pretreatment blank A;
step two: manufacturing an alloy billet; putting the copper ingot in the pretreated blank A into a vacuum casting furnace, adding the ingredients according to the mass percentage of 3% of silver, 0.03% of lithium, 0.002% of calcium, 0.001% of aluminum and 0.005% of yttrium, wherein the silver is silver particles in the pretreated blank A, the lithium, the calcium, the aluminum and the yttrium are all metal powder, operating in a vacuum environment, and waiting for the vacuum degree to be higher than 5 multiplied by 10- 2After Pa, filling high-purity argon; heating to 600 deg.C at a speed of 50 deg.C/min, maintaining for 30min, heating to 1200 deg.C at a speed of 50 deg.C/min, and maintaining for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet B;
step three: refining and processing; putting the alloy billet B into a vacuum down-draw continuous casting furnace, operating in a vacuum environment until the vacuum degree is higher than 5 multiplied by 10-2After Pa, filling high-purity argon; heating to 1200 ℃ at the speed of 50 ℃/min, continuously heating until the alloy billet is completely melted, refining for 30min, and pulling down by adopting a directional solidification technical method to obtain an alloy billet bar C;
step four: drawing treatment; the alloy billet bar C was subjected to a drawing process with a working section having a circumferential angle of 190. The cam curves are identical. The phase angles of the two cams at the installation positions on the main shaft are different by 180 degrees, when the main shaft rotates for a circle, the front and rear drawing trolleys finish one forward and return action, so that the material deformation is 70-90 percent, and the metal wire drawing blank D is obtained;
step five: annealing treatment; annealing the metal wire drawing blank D after drawing, and exposing the whole material to an annealing box for about 6 hours; then slowly cooling at the cooling speed of not higher than 80 ℃/min and the annealing temperature range of 300-600 ℃ to obtain a secondary metal wire drawing blank E;
step six: drawing wire manufacturing; heating to 450 ℃ at the speed of 40 ℃/min, preserving heat for 5-6 hours, drawing into a copper alloy wire with the diameter of 2-3 mm, heating again, preserving heat after heating, drawing again, keeping the temperature control value of each heating process unchanged, increasing the heating speed by 10 ℃/min each time, and decreasing the heat preservation time by 30min each time; finally, a copper alloy stay wire F with the thickness of 0.05-0.07 mm is manufactured;
step seven: performing pretreatment operation on a plated part, namely performing smoothness treatment on the surface of a copper alloy stay wire F through polishing operation, performing three times of cleaning operation on the obtained copper alloy stay wire F to remove impurities on the surface of the copper alloy stay wire F, cleaning the copper alloy stay wire F by adopting a composite acid washing solution for the first time, cleaning the copper alloy stay wire F by adopting an ethanol solution for the second time, and cleaning the copper alloy stay wire F by adopting deionized water for the third time, wherein the cleaning time is not less than 2min each time, so that a stay wire G of the part to be plated is obtained;
step seven: performing surface palladium plating operation, namely performing surface palladium plating on the pull wire G of the piece to be plated by adopting online electroplating equipment, wherein the thickness of a palladium layer is 0.6 mu m, the purity of palladium in the palladium layer is more than 99.9999%, the take-up speed of online palladium plating is 6-10 m/min, and the current density is 10A/dm2 to obtain a preformed product H;
step eight: carrying out secondary annealing treatment; the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment. Specifically, the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment, wherein the annealing temperature range is 300-600 ℃, a secondary preform I is obtained after the treatment and cooling, and the cooling speed is not higher than 80 ℃/min;
step nine: fine adjustment of wire drawing treatment; and performing wire drawing treatment on the secondary preform I again, so as to calibrate and finely adjust the size of the copper-based palladium coating alloy wire drawing, and then obtaining a finished product of the copper-based palladium coating bonding wire.
The working principle of the invention is as follows:
in terms of material selection, the copper alloy is used as a base material, the copper is used as a basic metal alloy main body, the silver is used as an auxiliary material, so that the mechanical property of the copper alloy bonding wire can be improved, crystal grains are refined, a small amount of lithium, calcium, aluminum and yttrium are added for configuration, the tensile strength and the oxidation resistance of the copper alloy bonding wire can be improved, the mechanical strength of the copper alloy bonding wire is improved, the wire diameter of the copper alloy bonding wire is further reduced, and the problems that the traditional bonding wire is high in price, easy to oxidize on the surface, poor in bonding property and easy to break due to drawing are effectively solved.
In terms of the manufacturing process, the ductility of the wire drawing is improved by annealing after the wire drawing is performed, and during wire drawing manufacturing, the operation effect is improved by a layer-by-layer progressive method through a reciprocating type heating treatment-wire drawing ductility mode, so that the wire drawing effect is improved.
This application still before the palladium plating operation, the design is treated earlier and is plated a stay wire and carry out smooth operation in surface and cleaning operation, reduces the operation risk of plating palladium surface unevenness, before the finished product is accomplished, carries out the size of acting as go-between once more and calibrates the fine setting to further guarantee the operation precision.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A copper-based palladium coating bonding lead comprises a copper alloy substrate and a palladium transition layer, and is characterized in that the copper alloy bonding lead takes a copper alloy as a substrate, the surface of the substrate is plated with a palladium layer, and the copper alloy consists of the following components in percentage by mass: 1.5 to 3 percent of silver, 0.003 to 0.03 percent of lithium, 0.0002 to 0.002 percent of calcium, 0.0002 to 0.001 percent of aluminum, 0.0005 to 0.005 percent of yttrium, 0.0001 to 0.001 percent of the total amount of inevitable other impurity elements and the balance of copper; the palladium layer adopts palladium metal with the purity of more than 99.9999 percent as a material.
2. The copper-based palladium coated bonding wire according to claim 1, wherein the palladium layer has a thickness of 0.3 to 0.6 μm.
3. A manufacturing method of a copper-based palladium coating bonding wire is characterized by comprising the following steps:
the method comprises the following steps: a main material pretreatment process; selecting required copper ingots and silver particles, cleaning the copper ingots and the silver particles by using a sodium hydroxide aqueous solution with the mass concentration of 5-8%, cleaning the copper ingots and the silver particles by using deionized water, and drying the copper ingots and the silver particles to finish the copper ingots and silver ingots and pretreatment to obtain a pretreatment blank A;
step two: manufacturing an alloy billet; putting the copper ingot in the pretreated blank A into a vacuum casting furnace, and adding the ingredients according to the mass percentage of 1.5-3% of silver, 0.003-0.03% of lithium, 0.0002-0.002% of calcium, 0.0002-0.001% of aluminum and 0.0005-0.005% of yttrium, wherein the silver is silver particles in the pretreated blank A, and the lithium, the calcium, the aluminum and the yttrium are all metal powder, heating to 500-600 ℃ at the speed of 50 ℃/min, preserving heat for 30min, heating to 1100-1200 ℃ at the speed of 50 ℃/min, and preserving heat for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet B;
step three: refining and processing; putting the alloy billet B into a vacuum pull-down continuous casting furnace, heating to 1100-1200 ℃ at the speed of 50 ℃/min, continuously heating until the alloy billet B is completely melted, refining for 30min, and pulling down by adopting a directional solidification technical method to obtain an alloy billet rod C;
step four: drawing treatment; drawing the alloy billet bar C, wherein the circumferential angle of the working section of the alloy billet bar C is 190 degrees; the curves of the two cams are the same; the phase angles of the two cams at the installation positions on the main shaft are different by 180 degrees, when the main shaft rotates for a circle, the front and rear drawing trolleys finish one forward and return action, so that the material deformation is 70-90 percent, and the metal wire drawing blank D is obtained;
step five: annealing treatment; annealing the metal wire drawing blank D after drawing, and exposing the whole material to an annealing box for about 5-6 hours; then slowly cooling, wherein the annealing temperature range is 300-600 ℃, and obtaining a secondary metal wire drawing blank E;
step six: drawing wire manufacturing; heating to 400-450 ℃ at the speed of 30-40 ℃/min, preserving heat for 5-6 hours, drawing into a copper alloy wire with the diameter of 2-3 mm, carrying out heating treatment again, carrying out heat preservation operation after heating, carrying out wire drawing operation again, keeping the temperature control value of each heating treatment unchanged, increasing the heating speed by 5-10 ℃/min each time, and decreasing the heat preservation time by 20-30 min each time; finally, a copper alloy stay wire F with the thickness of 0.05-0.07 mm is manufactured;
step seven: performing pretreatment operation on a plated part, namely performing smoothness treatment on the surface of a copper alloy stay wire F through polishing operation, and performing three times of cleaning operation on the obtained copper alloy stay wire F to remove impurities on the surface of the copper alloy stay wire F to obtain a stay wire G of the part to be plated;
step seven: performing surface palladium plating operation, namely performing surface palladium plating on the stay wire G of the piece to be plated by adopting online electroplating equipment, wherein the thickness of a palladium layer is 0.3-0.6 mu m, the purity of palladium in the palladium layer is more than 99.9999%, the take-up speed of online palladium plating is 6-10 m/min, and the current density is 8-10A/dm 2 to obtain a preformed product H;
step eight: carrying out secondary annealing treatment; the secondary annealing treatment is carried out on the oxygen-free copper alloy rod after the wire drawing treatment; specifically, the method is used for carrying out secondary annealing treatment on the oxygen-free copper alloy rod after the wire drawing treatment, wherein the annealing temperature range is 300-600 ℃, and a secondary preform I is obtained after the treatment and cooling;
step nine: fine adjustment of wire drawing treatment; and performing wire drawing treatment on the secondary preform I again, so as to calibrate and finely adjust the size of the copper-based palladium coating alloy wire drawing, and then obtaining a finished product of the copper-based palladium coating bonding wire.
4. The method for making the copper-based palladium-coated bonding wire according to claim 3, wherein the third step and the fourth step are both required to be operated in a vacuum environment until the degree of vacuum is higher than 5 x 10-2And after Pa, filling high-purity argon.
5. The method for manufacturing the copper-based palladium-coated bonding wire according to claim 3, wherein the cooling rate after the processing in the fifth step and the eighth step is not higher than 80 ℃/min.
6. The method for manufacturing the copper-based palladium coating bonding lead according to claim 3, wherein the piece to be plated is subjected to three cleaning operations of the pull wire G in the seventh step, wherein the first cleaning operation is performed by using a composite acid washing solution, the second cleaning operation is performed by using an ethanol solution, and the third cleaning operation is performed by using deionized water, wherein the cleaning time is not less than 2min each time.
7. The method for manufacturing the copper-based palladium coating bonding wire according to claim 6, wherein the composite pickling solution comprises the following components in percentage by mass: 25-30% of acetic acid, 8-10% of fumaric acid, 0.6-1.5% of citric acid, 0.05-0.1% of hydrochloric acid, 0.05-0.1% of isopropanol and the balance of deionized water.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115011835A (en) * | 2022-06-13 | 2022-09-06 | 上杭县紫金佳博电子新材料科技有限公司 | A silver-plated bonding copper wire and its preparation method and application |
| CN117230415A (en) * | 2023-01-17 | 2023-12-15 | 合肥中晶新材料有限公司 | Bonding copper-palladium alloy wire for semiconductor packaging and manufacturing method and application thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63250357A (en) * | 1987-04-08 | 1988-10-18 | Nitto Chem Ind Co Ltd | Method for producing chlorobenzonitrile |
| CN1774389A (en) * | 2003-04-17 | 2006-05-17 | 景垣实业株式会社 | Nanostructured metal-carbon composite and method for making same |
| KR20070066968A (en) * | 2005-12-22 | 2007-06-27 | 가부시키가이샤 고베 세이코쇼 | Copper alloy with excellent stress relaxation resistance |
| CN101171349A (en) * | 2005-06-08 | 2008-04-30 | 株式会社神户制钢所 | Copper alloy, copper alloy sheet and method for producing same |
| CN101979689A (en) * | 2010-11-16 | 2011-02-23 | 蔡元华 | Bonding copper wire and preparation method thereof |
| US20140376352A1 (en) * | 2013-06-24 | 2014-12-25 | Seagate Technology Llc | Materials for near field transducers, near field tranducers containing same, and methods of forming |
| CN104797662A (en) * | 2012-07-13 | 2015-07-22 | 哈佛学院 | Smooth surfaces based on metal-containing compounds |
| CN108137417A (en) * | 2015-09-29 | 2018-06-08 | 宾夕法尼亚州立大学研究基金会 | Cold sintered ceramics and composites |
| CN108231600A (en) * | 2017-12-30 | 2018-06-29 | 安徽晋源铜业有限公司 | A kind of processing method of encapsulation linking copper wire |
| CN109266874A (en) * | 2018-09-19 | 2019-01-25 | 河南大仑电子科技有限公司 | One Albatra metal bonding wire and preparation method thereof |
| CN110718525A (en) * | 2019-10-22 | 2020-01-21 | 烟台一诺电子材料有限公司 | Insulating corrosion-resistant inorganic amorphous coating bonding wire and preparation method thereof |
| CN111057971A (en) * | 2019-12-23 | 2020-04-24 | 深圳金斯达应用材料有限公司 | Micro-alloy high-precision copper alloy electronic material and preparation method thereof |
-
2020
- 2020-09-10 CN CN202010948723.XA patent/CN112143932A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63250357A (en) * | 1987-04-08 | 1988-10-18 | Nitto Chem Ind Co Ltd | Method for producing chlorobenzonitrile |
| CN1774389A (en) * | 2003-04-17 | 2006-05-17 | 景垣实业株式会社 | Nanostructured metal-carbon composite and method for making same |
| CN101171349A (en) * | 2005-06-08 | 2008-04-30 | 株式会社神户制钢所 | Copper alloy, copper alloy sheet and method for producing same |
| KR20070066968A (en) * | 2005-12-22 | 2007-06-27 | 가부시키가이샤 고베 세이코쇼 | Copper alloy with excellent stress relaxation resistance |
| CN101979689A (en) * | 2010-11-16 | 2011-02-23 | 蔡元华 | Bonding copper wire and preparation method thereof |
| CN104797662A (en) * | 2012-07-13 | 2015-07-22 | 哈佛学院 | Smooth surfaces based on metal-containing compounds |
| US20140376352A1 (en) * | 2013-06-24 | 2014-12-25 | Seagate Technology Llc | Materials for near field transducers, near field tranducers containing same, and methods of forming |
| CN108137417A (en) * | 2015-09-29 | 2018-06-08 | 宾夕法尼亚州立大学研究基金会 | Cold sintered ceramics and composites |
| CN108231600A (en) * | 2017-12-30 | 2018-06-29 | 安徽晋源铜业有限公司 | A kind of processing method of encapsulation linking copper wire |
| CN109266874A (en) * | 2018-09-19 | 2019-01-25 | 河南大仑电子科技有限公司 | One Albatra metal bonding wire and preparation method thereof |
| CN110718525A (en) * | 2019-10-22 | 2020-01-21 | 烟台一诺电子材料有限公司 | Insulating corrosion-resistant inorganic amorphous coating bonding wire and preparation method thereof |
| CN111057971A (en) * | 2019-12-23 | 2020-04-24 | 深圳金斯达应用材料有限公司 | Micro-alloy high-precision copper alloy electronic material and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115011835A (en) * | 2022-06-13 | 2022-09-06 | 上杭县紫金佳博电子新材料科技有限公司 | A silver-plated bonding copper wire and its preparation method and application |
| CN117230415A (en) * | 2023-01-17 | 2023-12-15 | 合肥中晶新材料有限公司 | Bonding copper-palladium alloy wire for semiconductor packaging and manufacturing method and application thereof |
| CN117230415B (en) * | 2023-01-17 | 2024-03-19 | 合肥中晶新材料有限公司 | Bonding copper-palladium alloy wire for semiconductor packaging and manufacturing method and application thereof |
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