CN112135436A - A double-sided synchronous soldering method for a printed circuit board and a printed circuit board assembly - Google Patents
A double-sided synchronous soldering method for a printed circuit board and a printed circuit board assembly Download PDFInfo
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- 238000005476 soldering Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 40
- 230000001360 synchronised effect Effects 0.000 title claims abstract description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 38
- 238000003466 welding Methods 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 8
- 230000004907 flux Effects 0.000 claims description 7
- 238000011179 visual inspection Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 10
- 230000009977 dual effect Effects 0.000 description 8
- 210000000078 claw Anatomy 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
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Abstract
本发明公开了一种印刷电路板的双面同步焊接方法和印刷电路板总成，方法包括：向焊接插件的双排引脚中的每一引脚内侧均设置锡片；将焊接插件在使双排引脚分别接触印刷电路板的双面的对应导电接触位置的状态下同步焊接到印刷电路板；对焊接插件和印刷电路板进一步执行回流焊。本发明能够自动化同时焊接双排引脚，提高品质，解放人工，简化工艺。
The invention discloses a double-sided synchronous welding method of a printed circuit board and a printed circuit board assembly. The method includes: disposing a tin sheet on the inner side of each pin of the double-row pins of a welding plug-in; The double-row pins are synchronously soldered to the printed circuit board in a state in which the pins respectively contact the corresponding conductive contact positions on both sides of the printed circuit board; reflow soldering is further performed on the soldering insert and the printed circuit board. The invention can automatically weld double-row pins at the same time, improve quality, liberate labor, and simplify the process.
Description
技术领域technical field
本发明涉及印刷电路板领域，更具体地，特别是指一种印刷电路板的双面同步焊接方法和印刷电路板总成。The present invention relates to the field of printed circuit boards, and more particularly, to a double-sided synchronous welding method for printed circuit boards and a printed circuit board assembly.
背景技术Background technique
目前在表面贴装技术领域中，焊接的技术难度越来越复杂，焊接的品质要求也越来越高，对于焊接复杂的连接器来说，如果找不到很好的焊接方法，就会产生较多的不良，这种连接器在维修上更是不容易维修，很容易造成维修不当，导致电路板报废。At present, in the field of surface mount technology, the technical difficulty of welding is becoming more and more complicated, and the quality requirements of welding are also getting higher and higher. More defects, this kind of connector is not easy to maintain in maintenance, it is easy to cause improper maintenance, resulting in scrapped circuit boards.
尤其是对于双排引脚的跨骑式连接器，需要PCB(印刷电路板)两面同时焊接。目前大部分工厂都没有一个较好的焊接方法，基本都是采用手焊的方式。手焊不仅在成本上带来大量的人力、物力，而且手焊的品质难以保证，后期产生不良会比较多，同步也会带来其他的问题，比如手焊掉锡、时间过长熔断线路等等诸多的问题。具体来说，手焊PCB需要印刷锡膏：要先在第一面印刷锡膏，过回流焊接之后，反转第二面再次印刷锡膏，然后焊接插件，并过第二次回流焊接。整个流程过程复杂，管控点非常多，稍有不慎就会发生不良影响。Especially for straddle-type connectors with double-row pins, both sides of the PCB (printed circuit board) need to be soldered at the same time. At present, most factories do not have a better welding method, and basically use hand welding. Hand soldering not only brings a lot of manpower and material resources in terms of cost, but also the quality of hand soldering is difficult to guarantee. There will be more defects in the later stage, and synchronization will also bring other problems, such as hand soldering off tin, too long time to fuse lines, etc. and many other issues. Specifically, solder paste needs to be printed on the hand-soldered PCB: first, print the solder paste on the first side, after reflow soldering, reverse the second side and print the solder paste again, then solder the plug-in, and pass the second reflow soldering. The whole process is complicated, and there are many control points. A little carelessness will cause adverse effects.
针对现有技术中PCB两面同时焊接双排引脚无法自动化、品质差、良率低的问题，目前尚无有效的解决方案。Aiming at the problems in the prior art that the double-row pins cannot be welded simultaneously on both sides of the PCB, the quality is poor, and the yield rate is low, and there is currently no effective solution.
发明内容SUMMARY OF THE INVENTION
有鉴于此，本发明实施例的目的在于提出一种印刷电路板的双面同步焊接方法和印刷电路板总成，能够自动化同时焊接双排引脚，提高品质，解放人工，缩减工艺。In view of this, the purpose of the embodiments of the present invention is to provide a double-sided synchronous welding method and a printed circuit board assembly of a printed circuit board, which can automatically weld two rows of pins at the same time, improve quality, liberate labor, and reduce processes.
基于上述目的，本发明实施例的第一方面提供了一种印刷电路板的双面同步焊接方法，包括执行以下步骤：Based on the above purpose, a first aspect of the embodiments of the present invention provides a double-sided synchronous soldering method for a printed circuit board, including the following steps:
向焊接插件的双排引脚中的每一引脚内侧均设置锡片；A tin sheet is arranged on the inner side of each pin of the double-row pins of the soldering plug-in;
将焊接插件在使双排引脚分别接触印刷电路板的双面的对应导电接触位置的状态下同步焊接到印刷电路板；The soldering inserts are synchronously soldered to the printed circuit board in a state where the double-row pins respectively contact the corresponding conductive contact positions on both sides of the printed circuit board;
对焊接插件和印刷电路板进一步执行回流焊。Further reflow is performed on solder inserts and printed circuit boards.
在一些实施方式中，焊接插件为具有双排引脚的跨骑式连接器，跨骑式连接器横跨印刷电路板的边缘以使双排引脚分别接触印刷电路板的双面。In some embodiments, the solder insert is a straddle-type connector with dual rows of pins that span the edge of the printed circuit board so that the dual rows of pins contact both sides of the printed circuit board, respectively.
在一些实施方式中，向焊接插件的双排引脚中的每一引脚内侧均设置锡片包括：向每一引脚内侧附接锡片并使得引脚与锡片紧密接合。In some embodiments, disposing a tin sheet inside each pin of the double row of pins of the solder insert includes attaching a tin sheet to the inside of each pin and tightly engaging the pin with the tin sheet.
在一些实施方式中，锡片中还包括助焊剂。In some embodiments, flux is also included in the tin sheet.
在一些实施方式中，方法还包括：在执行回流焊之后，通过外观检查来确认双面同步焊接的效果。In some embodiments, the method further includes: after performing the reflow soldering, confirming the effect of the double-sided simultaneous soldering through a visual inspection.
基于上述目的，本发明实施例的第二方面提供了一种印刷电路板总成，包括：Based on the above purpose, a second aspect of the embodiments of the present invention provides a printed circuit board assembly, including:
印刷电路板，在双面均设置有导电接触位置；A printed circuit board with conductive contact positions on both sides;
具有双排引脚的焊接插件，设置为使双排引脚分别接触印刷电路板的双面的对应导电接触位置；A soldering insert with double-row pins is arranged to make the double-row pins respectively contact corresponding conductive contact positions on both sides of the printed circuit board;
锡片，设置在焊接插件的双排引脚中的每一引脚内侧，并通过上述的双面同步焊接方法而融化形成锡合金层以使引脚和导电接触位置导通。The tin sheet is arranged inside each pin of the double-row pins of the soldering plug-in, and is melted by the above-mentioned double-sided synchronous soldering method to form a tin alloy layer to make the pin and the conductive contact position conductive.
在一些实施方式中，焊接插件为具有双排引脚的跨骑式连接器，跨骑式连接器横跨印刷电路板的边缘以使双排引脚分别接触印刷电路板的双面。In some embodiments, the solder insert is a straddle-type connector with dual rows of pins that span the edge of the printed circuit board so that the dual rows of pins contact both sides of the printed circuit board, respectively.
在一些实施方式中，锡片被附接到焊接插件的双排引脚中的每一引脚内侧，使得引脚与锡片紧密接合。In some embodiments, a tin sheet is attached to the inside of each pin of the double row of pins of the solder insert such that the pins are in tight engagement with the tin sheet.
在一些实施方式中，锡片中还包括助焊剂。In some embodiments, flux is also included in the tin sheet.
在一些实施方式中，锡片融化形成的锡合金层配置为通过接受外观检查来确认双面同步焊接的效果。In some embodiments, the tin alloy layer formed by the melting of the tin sheet is configured to be subjected to visual inspection to confirm the effect of double-sided simultaneous welding.
本发明具有以下有益技术效果：本发明实施例提供的印刷电路板的双面同步焊接方法和印刷电路板总成，通过向焊接插件的双排引脚中的每一引脚内侧均设置锡片；将焊接插件在使双排引脚分别接触印刷电路板的双面的对应导电接触位置的状态下同步焊接到印刷电路板；对焊接插件和印刷电路板进一步执行回流焊的技术方案，能够自动化同时焊接双排引脚，提高品质，解放人工，缩减工艺。The present invention has the following beneficial technical effects: the double-sided synchronous welding method and the printed circuit board assembly of the printed circuit board provided by the embodiment of the present invention, by arranging a tin sheet on the inner side of each pin of the double-row pins of the welding plug-in ; Solder the soldering inserts to the printed circuit board synchronously in a state where the double-row pins are in contact with the corresponding conductive contact positions on both sides of the printed circuit board; the technical scheme of further performing reflow soldering on the soldering inserts and the printed circuit board can be automated At the same time, double-row pins are welded to improve quality, liberate labor, and reduce process.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.
图1为本发明提供的印刷电路板的双面同步焊接方法的流程示意图；1 is a schematic flowchart of a double-sided synchronous welding method for a printed circuit board provided by the present invention;
图2为本发明提供的印刷电路板的双面同步焊接方法的焊接前的结构示意图；2 is a schematic structural diagram before welding of the double-sided synchronous welding method of the printed circuit board provided by the present invention;
图3为本发明提供的印刷电路板的双面同步焊接方法的焊接后的结构示意图。FIG. 3 is a schematic structural diagram after welding of the double-sided synchronous welding method of the printed circuit board provided by the present invention.
具体实施方式Detailed ways
为使本发明的目的、技术方案和优点更加清楚明白，以下结合具体实施例，并参照附图，对本发明实施例进一步详细说明。In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention will be further described in detail below with reference to the specific embodiments and the accompanying drawings.
需要说明的是，本发明实施例中所有使用“第一”和“第二”的表述均是为了区分两个相同名称非相同的实体或者非相同的参量，可见“第一”“第二”仅为了表述的方便，不应理解为对本发明实施例的限定，后续实施例对此不再一一说明。It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are for the purpose of distinguishing two entities with the same name but not the same or non-identical parameters. It can be seen that "first" and "second" It is only for the convenience of expression and should not be construed as a limitation to the embodiments of the present invention, and subsequent embodiments will not describe them one by one.
基于上述目的，本发明实施例的第一个方面，提出了一种自动化同时焊接双排引脚，提高品质，解放人工，缩减工艺的印刷电路板的双面同步焊接方法的一个实施例。图1示出的是本发明提供的印刷电路板的双面同步焊接方法的流程示意图。Based on the above purpose, the first aspect of the embodiments of the present invention proposes an embodiment of a double-sided synchronous welding method for a printed circuit board that automatically welds double-row pins at the same time, improves quality, liberates labor, and reduces processes. FIG. 1 shows a schematic flowchart of the double-sided synchronous soldering method of the printed circuit board provided by the present invention.
所述的印刷电路板的双面同步焊接方法，如图1所示，包括执行以下步骤：The double-sided synchronous soldering method of the printed circuit board, as shown in Figure 1, includes the following steps:
步骤S101：向焊接插件的双排引脚中的每一引脚内侧均设置锡片；Step S101: disposing a tin sheet on the inner side of each pin of the double-row pins of the soldering plug-in;
步骤S103：将焊接插件在使双排引脚分别接触印刷电路板的双面的对应导电接触位置的状态下同步焊接到印刷电路板；Step S103: synchronously soldering the soldering insert to the printed circuit board in a state in which the double-row pins respectively contact the corresponding conductive contact positions on both sides of the printed circuit board;
步骤S105：对焊接插件和印刷电路板进一步执行回流焊。Step S105: further perform reflow soldering on the soldering insert and the printed circuit board.
在一些实施方式中，焊接插件为具有双排引脚的跨骑式连接器，跨骑式连接器横跨印刷电路板的边缘以使双排引脚分别接触印刷电路板的双面。In some embodiments, the solder insert is a straddle-type connector with dual rows of pins that span the edge of the printed circuit board so that the dual rows of pins contact both sides of the printed circuit board, respectively.
在一些实施方式中，向焊接插件的双排引脚中的每一引脚内侧均设置锡片包括：向每一引脚内侧附接锡片并使得引脚与锡片紧密接合。In some embodiments, disposing a tin sheet inside each pin of the double row of pins of the solder insert includes attaching a tin sheet to the inside of each pin and tightly engaging the pin with the tin sheet.
在一些实施方式中，锡片中还包括助焊剂。In some embodiments, flux is also included in the tin sheet.
在一些实施方式中，方法还包括：在执行回流焊之后，通过外观检查来确认双面同步焊接的效果。In some embodiments, the method further includes: after performing the reflow soldering, confirming the effect of the double-sided simultaneous soldering through a visual inspection.
为更清晰的说明本发明的具体实施过程，下面以具体实施例来进一步阐述本发明的具体实施方式。In order to illustrate the specific implementation process of the present invention more clearly, the specific embodiments of the present invention are further described below with specific examples.
图2所示出的是跨骑式连接器在焊接前的结构示意图。参考右侧的侧视图可以明白，平面板是PCB，多个爪是跨骑式连接器的引脚(pin脚)，平面板中的白色条带是暴露出的导电金属部分，多个爪和白色条带被设置为一一对应。爪和白色条带之间设置的纹理部分即为本发明所述的锡片，锡片紧紧与引脚粘接接合。另外锡片里配有助焊剂以有效助力焊接，不需要锡膏印刷就可以在焊接后形成如图3所示的导电锡合金层，其中导电锡合金层同样示为纹理部分。这使得本发明实施例节省了锡膏印刷的工艺流程，提高了生产效率。FIG. 2 shows a schematic view of the structure of the straddle-type connector before welding. Referring to the side view on the right, it can be understood that the flat board is the PCB, the claws are the pins of the straddle connector, the white strips in the flat board are the exposed conductive metal parts, the claws and The white strips are set in a one-to-one correspondence. The textured part arranged between the claws and the white strip is the tin sheet of the present invention, and the tin sheet is tightly bonded to the pins. In addition, the tin sheet is equipped with flux to effectively assist soldering, and a conductive tin alloy layer as shown in Figure 3 can be formed after soldering without solder paste printing, wherein the conductive tin alloy layer is also shown as a textured part. This enables the embodiments of the present invention to save the process flow of solder paste printing and improve production efficiency.
从上述实施例可以看出，本发明实施例提供的印刷电路板的双面同步焊接方法，通过向焊接插件的双排引脚中的每一引脚内侧均设置锡片；将焊接插件在使用双排引脚分别接触印刷电路板的双面的对应导电接触位置的状态下同步焊接到印刷电路板；对焊接插件和印刷电路板进一步执行回流焊的技术方案，能够自动化同时焊接双排引脚，提高品质，解放人工，缩减工艺。It can be seen from the above-mentioned embodiments that the double-sided synchronous welding method of the printed circuit board provided by the embodiment of the present invention provides a tin sheet on the inner side of each pin of the double-row pins of the welding plug-in; The double-row pins are synchronously soldered to the printed circuit board in the state that the corresponding conductive contact positions on both sides of the printed circuit board are respectively contacted; the technical scheme of further reflow soldering on the soldering plug-in and the printed circuit board can automatically solder the double-row pins at the same time. , improve quality, liberate labor, and reduce process.
基于上述目的，本发明实施例的第二个方面，提出了一种自动化同时焊接双排引脚，提高品质，解放人工，缩减工艺的印刷电路板总成的一个实施例。所述的印刷电路板总成包括：Based on the above purpose, the second aspect of the embodiments of the present invention proposes an embodiment of a printed circuit board assembly that automatically welds two rows of pins at the same time, improves quality, liberates labor, and reduces processes. The printed circuit board assembly includes:
印刷电路板，在双面均设置有导电接触位置；A printed circuit board with conductive contact positions on both sides;
具有双排引脚的焊接插件，设置为使双排引脚分别接触印刷电路板的双面的对应导电接触位置；A soldering insert with double-row pins is arranged to make the double-row pins respectively contact corresponding conductive contact positions on both sides of the printed circuit board;
锡片，设置在焊接插件的双排引脚中的每一引脚内侧，并通过上述的双面同步焊接方法而融化形成锡合金层以使引脚和导电接触位置导通。The tin sheet is arranged inside each pin of the double-row pins of the soldering plug-in, and is melted by the above-mentioned double-sided synchronous soldering method to form a tin alloy layer to make the pin and the conductive contact position conductive.
在一些实施方式中，焊接插件为具有双排引脚的跨骑式连接器，跨骑式连接器横跨印刷电路板的边缘以使双排引脚分别接触印刷电路板的双面。In some embodiments, the solder insert is a straddle-type connector with dual rows of pins that span the edge of the printed circuit board so that the dual rows of pins contact both sides of the printed circuit board, respectively.
在一些实施方式中，锡片被附接到焊接插件的双排引脚中的每一引脚内侧，使得引脚与锡片紧密接合。In some embodiments, a tin sheet is attached to the inside of each pin of the double row of pins of the solder insert such that the pins are in tight engagement with the tin sheet.
在一些实施方式中，锡片中还包括助焊剂。In some embodiments, flux is also included in the tin sheet.
在一些实施方式中，锡片融化形成的锡合金层配置为通过接受外观检查来确认双面同步焊接的效果。In some embodiments, the tin alloy layer formed by the melting of the tin sheet is configured to be subjected to visual inspection to confirm the effect of double-sided simultaneous welding.
从上述实施例可以看出，本发明实施例提供的印刷电路板总成，通过向焊接插件的双排引脚中的每一引脚内侧均设置锡片；将焊接插件在使双排引脚分别接触印刷电路板的双面的对应导电接触位置的状态下同步焊接到印刷电路板；对焊接插件和印刷电路板进一步执行回流焊的技术方案，能够自动化同时焊接双排引脚，提高品质，解放人工，缩减工艺。It can be seen from the above embodiments that, in the printed circuit board assembly provided by the embodiment of the present invention, a tin sheet is arranged on the inner side of each pin of the double-row pins of the soldering insert; Simultaneously soldering to the printed circuit board in a state where the corresponding conductive contact positions on both sides of the printed circuit board are respectively contacted; the technical solution of further reflow soldering on the soldering plug-in and the printed circuit board can automatically solder double-row pins at the same time, improving the quality, Liberate labor and reduce craftsmanship.
需要特别指出的是，上述印刷电路板总成的实施例采用了所述印刷电路板的双面同步焊接方法的实施例来具体说明各模块的工作过程，本领域技术人员能够很容易想到，将这些模块应用到所述印刷电路板的双面同步焊接方法的其他实施例中。当然，由于所述印刷电路板的双面同步焊接方法实施例中的各个步骤均可以相互交叉、替换、增加、删减，因此，这些合理的排列组合变换之于所述印刷电路板总成也应当属于本发明的保护范围，并且不应将本发明的保护范围局限在所述实施例之上。It should be specially pointed out that the above-mentioned embodiment of the printed circuit board assembly adopts the embodiment of the double-sided synchronous welding method of the printed circuit board to specifically describe the working process of each module. Those skilled in the art can easily imagine that the These modules are applied to other embodiments of the double-sided simultaneous soldering method of the printed circuit board. Of course, since each step in the embodiment of the double-sided synchronous soldering method for the printed circuit board can be intersected, replaced, added, and deleted, these reasonable permutation and combination transformations also affect the printed circuit board assembly. It should belong to the protection scope of the present invention, and should not limit the protection scope of the present invention to the above-described embodiments.
以上是本发明公开的示例性实施例，但是应当注意，在不背离权利要求限定的本发明实施例公开的范围的前提下，可以进行多种改变和修改。根据这里描述的公开实施例的方法权利要求的功能、步骤和/或动作不需以任何特定顺序执行。此外，尽管本发明实施例公开的元素可以以个体形式描述或要求，但除非明确限制为单数，也可以理解为多个。The above are exemplary embodiments of the present disclosure, but it should be noted that various changes and modifications may be made without departing from the scope of the disclosure of the embodiments of the present invention as defined in the claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements disclosed in the embodiments of the present invention may be described or claimed in the singular, unless explicitly limited to the singular, the plural may also be construed.
所属领域的普通技术人员应当理解：以上任何实施例的讨论仅为示例性的，并非旨在暗示本发明实施例公开的范围(包括权利要求)被限于这些例子；在本发明实施例的思路下，以上实施例或者不同实施例中的技术特征之间也可以进行组合，并存在如上所述的本发明实施例的不同方面的许多其它变化，为了简明它们没有在细节中提供。因此，凡在本发明实施例的精神和原则之内，所做的任何省略、修改、等同替换、改进等，均应包含在本发明实施例的保护范围之内。Those of ordinary skill in the art should understand that the discussion of any of the above embodiments is only exemplary, and is not intended to imply that the scope (including the claims) disclosed by the embodiments of the present invention is limited to these examples; under the idea of the embodiments of the present invention , the technical features of the above embodiments or different embodiments can also be combined, and there are many other variations of the different aspects of the embodiments of the present invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omission, modification, equivalent replacement, improvement, etc. made within the spirit and principle of the embodiments of the present invention should be included within the protection scope of the embodiments of the present invention.
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