CN112118681A - Manufacturing method of circuit board - Google Patents
Manufacturing method of circuit board Download PDFInfo
- Publication number
- CN112118681A CN112118681A CN201910540832.5A CN201910540832A CN112118681A CN 112118681 A CN112118681 A CN 112118681A CN 201910540832 A CN201910540832 A CN 201910540832A CN 112118681 A CN112118681 A CN 112118681A
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- substrate
- circuit board
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- conductive
- circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a manufacturing method of a circuit board, and relates to the technical field of electronic circuits. The manufacturing method of the circuit board provided by the invention comprises the following steps: step S1, forming a first conductive circuit on a first surface of a first substrate with flexibility in a direct printing mode; step S2, forming a second substrate on the second surface of the first substrate, wherein the second substrate is used for improving the hardness of the circuit board. The technical scheme of the invention can simplify the manufacturing process of the circuit board and improve the structural stability of the circuit board.
Description
Technical Field
The invention relates to the technical field of electronic circuits, in particular to a manufacturing method of a circuit board.
Background
In the traditional PCB manufacturing process, large-scale high-precision equipment is required to be used for manufacturing the PCB, such as cutting, copper deposition, etching, resistance welding, surface treatment and the like. The PCB output can be realized only by complicated procedures, huge previous equipment investment and huge manpower resources in the realization process. In order to solve the above technical problems, in the prior art, a circuit board may be manufactured by forming a liquid metal line on a substrate in a manner of directly printing a liquid metal with a low melting point, but the manufactured circuit board is easy to bend and deform, so that the circuit fails due to reasons including peeling of the liquid metal line, disconnection of a component at a welding position with the liquid metal line, and the like, and the structural stability of the circuit board is poor.
Disclosure of Invention
The invention provides a manufacturing method of a circuit board, which can simplify the manufacturing process of the circuit board and improve the structural stability of the circuit board.
In a first aspect, the present invention provides a circuit board, which adopts the following technical scheme:
the circuit board includes:
a first substrate having flexibility;
the first conductive circuit is positioned on the first surface of the first substrate and is formed in a direct printing mode;
the second substrate is positioned on the second surface of the first substrate and used for improving the hardness of the circuit board.
Optionally, the hardness of the second substrate is greater than the hardness of the first substrate.
Optionally, the second substrate is a molded substrate, and the first substrate and the second substrate are bonded to each other.
Further, the first substrate and the second substrate are bonded with each other through a UV adhesive, an epoxy resin adhesive, a silica gel, a double-sided adhesive film or a hot-melt adhesive film.
Optionally, the second substrate is formed by solidifying fluid materials uniformly distributed on the second surface of the first substrate.
Optionally, the second substrate is a transparent substrate.
Optionally, the circuit board further includes at least one component and a plurality of first through holes, the first through holes penetrate through the first substrate and the second substrate, the component is located on a face, away from the first substrate, of the second substrate, and pins of the component penetrate through the first through holes, extend to the first face of the first substrate, and are connected with the first conductive traces.
Further, the diameter d1 of the first through hole and the diameter d2 of the pin of the component satisfy that: d1-d2 is not less than 0.1mm and not more than 0.5 mm.
Optionally, the circuit board further includes a flexible third substrate, the third substrate is located on a surface of the second substrate far away from the first substrate, a second conductive trace is disposed on a surface of the third substrate far away from the second substrate, and the second conductive trace is formed by a direct printing method.
Further, the circuit board further comprises at least one second through hole, and the second through hole penetrates through the first substrate, the second substrate and the third substrate; an electric connecting piece is embedded in the second through hole, a first end of the electric connecting piece is connected with the first conductive circuit, and a second end of the electric connecting piece is connected with the second conductive circuit.
In a second aspect, the present invention provides a method for manufacturing a circuit board, which adopts the following technical scheme:
the manufacturing method of the circuit board comprises the following steps:
step S1, forming a first conductive circuit on a first surface of a first substrate with flexibility in a direct printing mode;
step S2, forming a second substrate on the second surface of the first substrate, wherein the second substrate is used for improving the hardness of the circuit board.
Optionally, the second substrate is a molding substrate; the step S2 includes: providing a second substrate; and adhering the second substrate to the second surface of the first substrate.
Further, the adhering the second substrate to the second surface of the first substrate includes: uniformly distributing colloid on the second substrate; contacting the second surface of the first substrate with the colloid; the gel is allowed to solidify.
Optionally, the step S2 includes:
uniformly distributing a curable fluid material on the second side of the first substrate;
solidifying the fluid material to form the second substrate.
Optionally, the manufacturing method of the circuit board further includes: the following step after the step S2:
providing at least one component;
forming at least one first via hole penetrating the first substrate and the second substrate;
and placing the component on one surface of the second substrate far away from the first substrate, and enabling the pin of the component to penetrate through the first through hole, extend to the first surface of the first substrate and be connected with the first conductive circuit.
Optionally, the manufacturing method of the circuit board further includes: the following step after the step S2:
step S3, forming a second conductive trace on the first surface of the flexible third substrate by direct printing;
and step S4, bonding the second surface of the third substrate to the surface of the second substrate away from the first substrate.
Optionally, the second substrate is a molding substrate; the step S4 includes: and the second surface of the third substrate and the surface of the second substrate far away from the first substrate are bonded with each other through a colloid.
Optionally, the second substrate is formed by solidifying fluid materials uniformly distributed on the second surface of the first substrate; the step S4 includes:
placing a second side of the third substrate on the fluid material forming the second substrate when the fluid material is not fully cured and has a viscosity;
and solidifying the fluid material to form the second substrate, wherein one surface of the second substrate, which is far away from the first substrate, is bonded with the second surface of the third substrate.
Further, the manufacturing method of the circuit board further comprises the following steps: the following step after the step S4:
step S5 of forming a second via hole penetrating the first substrate, the second substrate, and the third substrate;
and step S6, embedding an electric connecting piece into the second through hole, wherein a first end of the electric connecting piece is connected with the first conductive circuit, and a second end of the electric connecting piece is connected with the second conductive circuit.
Furthermore, the electric connecting piece is a hollow copper pipe; in step S6, after the electrical connector is inserted into the second through hole, the electrical connector is pressed to connect the edge of the first end of the hollow copper tube with the first conductive trace, and the edge of the second end of the hollow copper tube with the second conductive trace.
The invention provides a circuit board and a manufacturing method thereof, wherein the manufacturing method of the circuit board comprises the following steps: step S1, forming a first conductive circuit on a first surface of a first substrate with flexibility in a direct printing mode; and step S2, forming a second substrate on the second surface of the first substrate, wherein the second substrate is used for improving the hardness of the circuit board. Because first conducting wire is formed on the first face of first base plate through the mode of direct printing, consequently can simplify the manufacture process of circuit board, in addition, the setting up of second base plate makes the hardness of circuit board great, is difficult for taking place bending deformation, consequently can effectively avoid the circuit failure caused by this reason, helps promoting the structural stability of circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a first schematic cross-sectional view of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a circuit board according to an embodiment of the invention;
fig. 3 is a schematic cross-sectional view three of the circuit board according to the embodiment of the invention;
fig. 4 is a schematic cross-sectional view of a circuit board according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of a circuit board according to an embodiment of the present invention;
fig. 6 is a first flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention;
fig. 7 is a second flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention;
fig. 8 is a third flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention;
fig. 9 is a fourth flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
The inventor finds that the reason that the circuit board manufactured by directly printing liquid metal in the prior art is easy to bend and deform is that the conventional liquid metal printer is only suitable for a substrate with a certain thickness range and special materials, and the substrate is soft and easy to bend and deform, so that the circuit fails. Based on this, an embodiment of the present invention provides a circuit board, specifically, as shown in fig. 1 and fig. 2, fig. 1 is a first schematic cross-sectional view of the circuit board provided in the embodiment of the present invention, and fig. 2 is a second schematic cross-sectional view of the circuit board provided in the embodiment of the present invention, where the circuit board includes:
a first substrate 1 having flexibility;
the first conductive circuit 2 is positioned on the first surface of the first substrate 1, and the first conductive circuit 2 is formed by a direct printing mode;
and a second substrate 3, wherein the second substrate 3 is positioned on the second surface of the first substrate 1, and the second substrate 3 is used for improving the hardness of the circuit board.
The above "the first conductor line 2 is formed by direct printing" includes printing the first conductor line 2 on the first substrate 1 using an existing liquid metal printer.
Because first conducting wire 2 is formed on the first face of first base plate 1 through the mode of direct printing, can simplify the manufacture process of circuit board, and the setting up of second base plate 3 makes the hardness of circuit board great, is difficult for taking place bending deformation, can also effectively avoid the circuit failure that causes by this reason, helps promoting the structural stability of circuit board.
The first conductive traces 2 may be formed by directly printing conductive materials having fluidity, such as liquid metal, conductive silver paste, conductive copper paste, and conductive aluminum paste. The circuit board can be made to be suitable for existing electronic circuit printers (such as liquid metal printers) without additional modification to the electronic circuit printers.
In the following, the embodiment of the invention takes the material of the first conductive trace as the liquid metal as an example, and details of each specific structure of the circuit board are described.
The first substrate 1 selected by the embodiment of the invention can be any substrate capable of being adhered with liquid metal and compatible with the existing liquid metal printer, such as a PET substrate and a PVC substrate, and the thickness range of the first substrate 1 can be 0.1mm to 0.5mm, preferably 0.2mm, 0.25mm and 0.3 mm.
The liquid metal selected in the embodiment of the invention is a simple metal, an alloy or a mixture of the simple metal and the alloy, or a conductive fluid substance taking any one of the simple metal and the alloy as a main component, wherein the melting point of the simple metal and the alloy is below 300 ℃. The liquid metal may include one or more of gallium, indium, tin, zinc, bismuth, lead, cadmium, mercury, silver, copper, sodium, potassium, magnesium, aluminum, iron, nickel, cobalt, manganese, titanium, vanadium, boron, carbon, silicon, and the like. Specific selection ranges for the liquid metal include: mercury simple substance, gallium simple substance, indium simple substance, tin simple substance, gallium indium alloy, gallium indium tin alloy, gallium zinc alloy, gallium indium zinc alloy, gallium tin zinc alloy, gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin zinc alloy, tin lead alloy, tin copper alloy, tin zinc copper alloy, tin silver copper alloy, bismuth lead tin alloy. Preferably, the liquid metal is a liquid metal with a melting point lower than room temperature, such as gallium indium eutectic alloy, or a liquid metal with a melting point slightly higher than room temperature, such as gallium indium tin eutectic alloy, so that the process of forming the first conductive traces 2 by direct printing is simple and the requirements on the liquid metal printer are low.
For the hardness of the second substrate 3, the second substrate 3 in the embodiment of the present invention may be any substrate capable of increasing the hardness of the circuit board, and the hardness may be smaller than the first substrate 1, equal to the first substrate 1, or larger than the first substrate 1, and specifically may be determined according to the target strength of the circuit board in a specific application scenario. In addition, when the circuit board needs to be punched later, the hardness of the second substrate 3 needs to be selected in consideration of the difficulty of punching.
For example, the target strength of the circuit board may be simply characterized by one or more of the following:
a. horizontally placing the circuit board, wherein the circuit board has natural curvature when horizontally placed;
b. after a certain amount of force is applied, bending angle ranges, such as 15 degrees and 30 degrees smaller than the horizontal plane, are adopted (the specific bending angle ranges can be determined according to the surface element device density, the component packaging size and the bending point of the circuit board);
c. whether or not it will crack after being bent by a certain amount of force.
If the application scenario of the circuit board needs to consider the temperature, the above processes need to be performed in the temperature environment.
When the hardness of the selected second substrate 3 is greater than that of the first substrate 1, and after the second substrate 3 is used, the hardness of the circuit board is greatly improved, and the structural stability is good.
Regarding the thickness of the second substrate 3, the thickness of the second substrate 3 may be selected according to a target thickness of the circuit board, a target hardness of the second substrate 3, and the like. For example, when there is no special requirement for the thickness of the circuit board, the second substrate 3 with a larger material hardness and a smaller thickness may be selected, or the second substrate 3 with a smaller material hardness and a larger thickness may be selected; when the target thickness of the circuit board is small, the second substrate 3 having a large material hardness and a small thickness may be selected.
For the conductive property of the second substrate 3, if no component needs to be inserted on the circuit board, the second substrate 3 may be made of a conductive material or an insulating material; if the circuit board needs to be plugged with components, the second substrate 3 should be made of an insulating material to prevent short circuit of the circuit board.
Preferably, the second substrate 3 is made of an insulating material, so that the application range of the circuit board including the second substrate 3 is wider. Exemplarily, the second substrate 3 is an acrylic board, a PC board, a PP board, a glass fiber board, a nylon board. The thickness of the second substrate 3 may be 0.5mm to 3mm for the various types described above to have a suitable hardness. Specifically, which kind of the second substrate 3 is selected can be determined according to the actual use scene of the circuit board, for example, a glass fiber board can be selected for a high temperature resistant scene, a nylon board and a PP board can be selected for a scene with high requirements on rigidity, and a PC board or an acrylic board can be selected for a scene with high requirements on transparency.
When the second substrate 3 is a transparent substrate in the embodiment of the present invention, the circuit condition (whether short circuit, open circuit, etc.) and the welding condition can be observed through the second substrate 3, which is helpful for rapidly and accurately completing operations such as manufacturing a jointed board and a double-layer circuit board.
Alternatively, as shown in fig. 1, the second substrate 3 is a molded substrate; the first substrate 1 and the second substrate 3 are bonded to each other. Further, the first substrate 1 and the second substrate 3 are bonded to each other by UV glue, epoxy glue, silica gel, double-sided adhesive film, or hot-melt adhesive film. When the double-sided adhesive film is selected to bond the first substrate 1 and the second substrate 3, the operation is simple. When it is necessary to bond the first substrate 1 and the second substrate 3 at a certain temperature, the temperature should be lower than the melting point of the liquid metal in the conductive line to avoid melting of the conductive line.
Alternatively, as shown in fig. 2, the second substrate 3 is formed by solidifying the fluid materials uniformly distributed on the second surface of the first substrate 1. The fluid material can be resin glue, light-cured glue and the like with higher hardness after curing.
The circuit board in the embodiment of the present invention may further include at least one component 4, so that the circuit board has various target functions. The components 4 may be switches, light emitting diodes, resistors, capacitors, inductors, sensors, chips, etc. The component 4 may be fixed on the circuit board in an attaching manner, specifically, attached on the first surface of the first substrate 1, and connected to the first conductive trace 2. The component 4 may also be fixed on the circuit board by means of plugging, specifically, as shown in fig. 3, fig. 3 is a third schematic cross-sectional view of the circuit board provided in the embodiment of the present invention, the circuit board further includes a plurality of first through holes 5, the first through holes (occupied by pins 5 of the component 4 in fig. 3) penetrate through the first substrate 1 and the second substrate 3, the component 4 is located on a side of the second substrate 3 away from the first substrate 1, and the pins 5 of the component 4 extend through the first through holes to the first side of the first substrate 1 and are connected to the first conductive traces 2 (only the connection between the two is shown in fig. 3, and the positional relationship is not limited, and the pins 5 of the component 4 located on the first side of the first substrate 1 may be lapped on the first conductive traces 2, or may be partially or completely immersed in the first conductive traces 2).
Further, the diameter d1 of the first through hole and the diameter d2 of the pin 5 of the component 4 satisfy: d1-d2 are not less than 0.1mm and not more than 0.5mm, so that the component 4 can be conveniently plugged.
In addition, as shown in fig. 4, fig. 4 is a cross-sectional view of a circuit board according to a fourth embodiment of the present invention, the circuit board according to the fourth embodiment of the present invention further includes a third substrate 6 having flexibility, the third substrate 6 is located on a surface of the second substrate 3 away from the first substrate 1, a second conductive trace 7 is disposed on a surface of the third substrate 6 away from the second substrate 3, and the second conductive trace 7 is formed by direct printing. The circuit board with the structure is a double-sided circuit board, the manufacturing method is simple, and the structural strength is high.
For specific contents of the third substrate 6 and the second conductive trace 7, reference may be made to the related description of the first substrate 1 and the first conductive trace 2, and details are not repeated here.
Further, when the first conductive traces 2 and the second conductive traces 7 need to be connected to each other, as shown in fig. 5, fig. 5 is a fourth schematic cross-sectional view of the circuit board according to the embodiment of the present invention, the circuit board further includes at least one second through hole (occupied by the electrical connection member 8 in fig. 5), and the second through hole penetrates through the first substrate 1, the second substrate 3, and the third substrate 6; an electric connecting piece 8 is embedded in the second through hole, a first end of the electric connecting piece 8 is connected with the first conductive circuit line 2, and a second end of the electric connecting piece 8 is connected with the second conductive circuit line 7. The electrical connector 8 may be a hollow copper tube, a conductive adhesive, a filled liquid metal or other conductive fluid, or formed by electroplating, chemical plating, or the like.
In addition, an embodiment of the present invention further provides a method for manufacturing a circuit board, specifically, as shown in fig. 1, fig. 2 and fig. 6, fig. 6 is a first flowchart of the method for manufacturing a circuit board according to the embodiment of the present invention, where the method for manufacturing a circuit board includes:
step S1, forming a first conductive trace 2 on a first surface of a first substrate 1 having flexibility by a direct printing method;
step S2, forming a second substrate 3 on the second surface of the first substrate 1, the second substrate being used for increasing the hardness of the circuit board.
Between the step S1 and the step S2, the second surface of the first substrate 1 may be wiped with wet wiping cloth (after the wiping cloth is dipped with wiping solution such as alcohol or board washing water, the wiping cloth is wrung out), so as to remove impurities such as oil stains and handprints on the surface, and after the wiping is completely done, the second surface is naturally dried or air-dried, so as to increase the firmness of the adhesion.
Because the first conductive circuit 2 is formed on the first surface of the first substrate 1 by a direct printing mode, the plate manufacturing processes such as cutting, copper deposition, etching, resistance welding, surface treatment and the like in the existing PCB manufacturing process can be omitted, the plate manufacturing period is shortened, the manufacturing cost of the circuit board is reduced, professional automation equipment is not needed, professional technicians are not needed, the circuit board can be manufactured, and the personalized circuit board can be manufactured.
In addition, in the manufacturing process of the PCB, the visibility is poor, the repairability is poor, and if an error occurs in the manufacturing process, cost consumption such as scrapping of materials, manual waste and the like can be directly caused. And the visibility of the process of printing first conducting wire 2 is good, in addition, based on the fluid properties of liquid metal, conductive silver paste, conductive copper paste, conductive aluminum paste and the like, first conducting wire 2 is repaired easily by hand painting, brush coating, fixed point printing and other modes, so that the repairability of the circuit board is good, and the fault-tolerant rate is high.
Specifically, the step S2 can be implemented in various ways for different forms of the material used to form the second substrate 3:
in one example, the second substrate 3 is a molded substrate; step S2 includes: providing a second substrate 3; the second substrate 3 is bonded to the second surface of the first substrate 1. When the second base plate 3 is the shaping base plate, before pasting, can use wet wiping cloth (dip in on the wiping cloth and get alcohol or wash board water lamp wiping solution) to wipe the face of pasting of second base plate 3, get rid of impurity such as surperficial greasy dirt, hand line, clean back dry naturally or air-dry can to increase the fastness of bonding.
Further, bonding the second substrate 3 to the second surface of the first substrate 1 includes: the second substrate 3 is uniformly distributed with colloid; contacting the second surface of the first substrate 1 with the colloid; the gel is cured.
Specifically, the uniformly coating the colloid on the second substrate 3 includes: and (3) coating the colloid on the second substrate 3 by using a method of drawing a circle line and supplementing a transverse line, and then, fully distributing the colloid on the whole bonding surface to realize self-leveling or filling and leveling after lamination. The colloid can be UV glue, epoxy resin glue, silica gel and the like, and can realize good interlayer filling effect and quick curing effect. The colloid may be selected according to the material of the first substrate 1 and the second substrate 3, so that the adhesive strength between the first substrate 1 and the second substrate 3 is high. The colloid can also be double-sided adhesive film or hot melt adhesive film, which can show viscosity when heated to a certain temperature.
When the second surface of the first substrate 1 contacts the colloid, the colloid can be gradually pressed from the middle to the outer ring on the circuit board, so that the colloid is tightly connected with the second substrate 3. If air bubbles exist in the glue body after the pressing, the air bubbles in the glue body can be removed by utilizing the vacuum-pumping box.
The specific way of curing the colloid needs to be selected according to the properties of the colloid, for example, the UV adhesive can be cured by sunlight and a lamp containing ultraviolet light, the curing time is 5 s-60 s, the epoxy resin and silica gel colloids can be cured by heating and curing, the curing time is 4 h-6 h at the heating temperature of 30-65 ℃, and the curing can be realized by reducing the temperature of the double-sided adhesive film and the hot melt adhesive film.
It should be noted that, when the conductive circuit is made of liquid metal, the temperature of the environment where the circuit board is located should be lower than the melting point of the liquid metal in the conductive circuit during the whole bonding process, so as to avoid melting of the conductive circuit.
In yet another example, the material used to form the second substrate 3 is a curable fluid material; step S2 includes: uniformly distributing the curable fluid material on the second surface of the first substrate 1, wherein the curable fluid material can be in various modes such as spin coating, spray coating, brush coating and the like; the fluid material is cured to form the second substrate 3, and the specific curing manner may be selected according to the property of the fluid material, if the fluid material is a photo-curing adhesive, the fluid material should be cured by ultraviolet irradiation, and if the fluid material is a resin adhesive, the fluid material should be cured by heating.
Optionally, as shown in fig. 3 and 7, fig. 7 is a second flowchart of a manufacturing method of a circuit board according to an embodiment of the present invention, where the manufacturing method of the circuit board further includes: the following steps after step S2:
step S21, providing at least one component 4;
step S22 of forming at least one first through hole penetrating the first substrate 1 and the second substrate 3;
step S23, placing the component 4 on a surface of the second substrate 3 away from the first substrate 1, and extending the pins 5 of the component 4 to the first surface of the first substrate 1 through the first through holes and connecting with the first conductive traces 2.
When the first through hole is manufactured, punching can be carried out by using punching technologies such as laser, a drilling machine and the like; the punching diameter can be determined according to the diameter of the pins 5 of the component 4, and the diameter of the first through hole is preferably 0.1-0.5 mm larger than the diameter of the pins 5 of the component 4, so that the component 4 can be conveniently inserted. In the case where the pad of the first conductive path 2 is broken during punching, soldering and repair can be performed using a soldering iron and a low-temperature wire.
Optionally, as shown in fig. 4 and 8, fig. 8 is a third flowchart of a manufacturing method of a circuit board according to an embodiment of the present invention, where the manufacturing method of the circuit board further includes: the following steps after step S2:
step S3, forming a second conductive trace 7 on the first surface of the flexible third substrate 6 by direct printing;
step S4 is to bond the second surface of the third substrate 6 and the surface of the second substrate 3 away from the first substrate 1 to each other.
The related content of the third substrate 6 can refer to the specific content of the first substrate 1 described above, and is not described herein again. At this time, both sides of the circuit board are provided with circuits, and the circuit board is a double-layer circuit board.
Similarly, step S4 can be implemented in a variety of ways for different morphologies of the material used to form the second substrate 3:
in one example, the second substrate 3 is a molded substrate; step S4 includes: the second surface of the third substrate 6 and the surface of the second substrate 3 away from the first substrate 1 are bonded to each other by the adhesive. The specific implementation manner of this step may refer to the specific contents of bonding the first substrate 1 and the second substrate 3, and will not be described herein again.
In yet another example, the second substrate 3 is formed by solidifying fluid materials uniformly distributed on the second surface of the first substrate 1; step S4 includes:
placing the second side of the third substrate 6 on the fluid material forming the second substrate 3 when the fluid material is not completely cured and has viscosity; and solidifying the fluid material to form the second substrate 3, wherein one surface of the second substrate 3, which is far away from the first substrate 1, and a second surface of the third substrate 6 are bonded with each other.
Further, as shown in fig. 5 and 9, fig. 9 is a fourth flowchart of a manufacturing method of a circuit board according to an embodiment of the present invention, where the manufacturing method of the circuit board according to the embodiment of the present invention further includes: the following steps after step S4:
step S5 of forming a second through hole penetrating the first substrate 1, the second substrate 3, and the third substrate 6;
specifically, the second via holes should correspond to the pad positions of the first conductive traces 2 and the second conductive traces 7, and the punching manner may refer to the punching manner in the previous process of making the first via holes.
Step S6, embedding the electrical connector 8 into the second through hole, wherein a first end of the electrical connector 8 is connected to the first conductive trace 2, and a second end of the electrical connector 8 is connected to the second conductive trace 7.
The manner of embedding the electrical connector 8 into the second through hole may be various, for example, conductive adhesive, liquid metal or other conductive fluid is filled into the second through hole, and the electrical connector 8 is formed after curing; or forming an electric connector 8 in the second through hole by electroplating, chemical plating and other modes; or, the electrical connector 8 is a hollow copper tube and is directly embedded into the second through hole, at this time, in step S6, after the electrical connector 8 is embedded into the second through hole, the electrical connector is pressed, so that the edge of the first end of the hollow copper tube is connected with the first conductive circuit 2, and the edge of the second end of the hollow copper tube is connected with the second conductive circuit 7. If the one-time pressing is not in place, the pressing can be repeated or reliable welding can be carried out by using a constant-temperature soldering iron and a low-temperature welding wire, so that the reliability of the circuit is improved.
It should be noted that, for the double-layer circuit board shown in fig. 5, the first through hole for plugging the pin 5 of the component 4 may also be formed according to actual needs, and it can be known that the first through hole necessarily penetrates through the first substrate 1, the second substrate 3, and the third substrate 6 at the same time.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for manufacturing a circuit board is characterized by comprising the following steps:
step S1, forming a first conductive circuit on a first surface of a first substrate with flexibility in a direct printing mode;
step S2, forming a second substrate on the second surface of the first substrate, wherein the second substrate is used for improving the hardness of the circuit board.
2. The method for manufacturing a circuit board according to claim 1, wherein the step S2 includes: providing a molded second substrate; and adhering the second substrate to the second surface of the first substrate.
3. The method of claim 2, wherein the adhering the second substrate to the second surface of the first substrate comprises: uniformly distributing colloid on the second substrate; contacting the second surface of the first substrate with the colloid; the gel is allowed to solidify.
4. The method for manufacturing a circuit board according to claim 1, wherein the step S2 includes: uniformly distributing a curable fluid material on the second side of the first substrate; solidifying the fluid material to form the second substrate.
5. The method for manufacturing a circuit board according to any one of claims 1 to 4, further comprising: the following step after the step S2:
providing at least one component;
forming at least one first via hole penetrating the first substrate and the second substrate;
and placing the component on one surface of the second substrate far away from the first substrate, and enabling the pin of the component to penetrate through the first through hole, extend to the first surface of the first substrate and be connected with the first conductive circuit.
6. The method for manufacturing a circuit board according to any one of claims 1 to 4, further comprising: the following step after the step S2:
step S3, forming a second conductive trace on the first surface of the flexible third substrate by direct printing;
and step S4, bonding the second surface of the third substrate to the surface of the second substrate away from the first substrate.
7. The method for manufacturing a circuit board according to claim 6, wherein the second substrate is a molded substrate; the step S4 includes: and the second surface of the third substrate and the surface of the second substrate far away from the first substrate are bonded with each other through a colloid.
8. The method of claim 6, wherein the second substrate is formed by solidifying the fluid material uniformly distributed on the second surface of the first substrate; the step S4 includes:
placing a second side of the third substrate on the fluid material forming the second substrate when the fluid material is not fully cured and has a viscosity;
and solidifying the fluid material to form the second substrate, wherein one surface of the second substrate, which is far away from the first substrate, is bonded with the second surface of the third substrate.
9. The method for manufacturing a circuit board according to claim 6, further comprising: the following step after the step S4:
step S5 of forming a second via hole penetrating the first substrate, the second substrate, and the third substrate;
and step S6, embedding an electric connecting piece into the second through hole, wherein a first end of the electric connecting piece is connected with the first conductive circuit, and a second end of the electric connecting piece is connected with the second conductive circuit.
10. The method of claim 9, wherein the electrical connector is a hollow copper tube; in step S6, after the electrical connector is inserted into the second through hole, the electrical connector is pressed to connect the edge of the first end of the hollow copper tube with the first conductive trace, and the edge of the second end of the hollow copper tube with the second conductive trace.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910540832.5A CN112118681A (en) | 2019-06-20 | 2019-06-20 | Manufacturing method of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910540832.5A CN112118681A (en) | 2019-06-20 | 2019-06-20 | Manufacturing method of circuit board |
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| CN112118681A true CN112118681A (en) | 2020-12-22 |
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| CN202998654U (en) * | 2012-12-28 | 2013-06-12 | 大连吉星电子有限公司 | Flexible circuit single sided board with PET film being attached to base material |
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