CN112117567A - Conductive connection structure - Google Patents

Abstract

The present invention provides a conductive connection structure, comprising at least two conductive layers, wherein at least one of the conductive layers is provided with holes penetrating both sides of the conductive layer, and an inner layer is provided between any two adjacent conductive layers. The adhesive film layer, the surface of the conductive layer facing the inner adhesive film layer is an undulating surface with convex parts and concave parts, and any two adjacent layers of the conductive layers are connected by the convex parts. Compared with the prior art, the conductive connection structure has the advantages of simple fabrication process, low production cost, high firmness, and good electrical conductivity.

Description

Conductive connection structure

technical field

The invention relates to the technical field of electronic component packaging, in particular to a conductive connection structure.

Background technique

With the development of electronic products in the direction of miniaturization and high integration, the packaging technology of electronic components and the manufacturing technology of printed circuit boards have more and more stringent requirements on interconnect materials, and traditional interconnect materials have been unable to meet the environmental requirements. and technical needs.

Conductive adhesive is an adhesive with certain conductive properties after curing or drying. As an emerging electronic material, it has become an ideal substitute for traditional Sn-Pb solder and is more competitive. However, during use, it was found that the conductive adhesive not only has the problem of poor conduction effect, but also has the problem of unstable connection performance.

In order to solve the above problems, the industry proposes a flexible connector, which includes a first conductive layer, an insulating layer and a second conductive layer that are stacked in sequence, and the first conductive layer and the second conductive layer pass through the conductive layer disposed on the insulating layer. Through the first conductive layer, the conductive hole, and the second conductive layer, the electronic component and the circuit board are electrically connected. However, the preparation process of this flexible connector is complicated, and it takes a lot of time and labor costs. By laser drilling or punching, connection holes are formed on the flexible copper clad laminate to connect the copper foils on both sides, and then the connection holes need to be metallized to form conductive holes.

Therefore, it is necessary to design an interconnection structure with good conduction effect, stable connection performance, simple fabrication process and low cost.

SUMMARY OF THE INVENTION

In order to solve the above technical problems, the present invention provides a conductive connection structure, which is used for the installation and connection of circuit boards, and has the advantages of simple manufacturing process, low production cost, high firmness, and good electrical conductivity.

Based on this, the present invention provides a conductive connection structure, comprising at least two conductive layers, and at least one of the conductive layers is provided with holes penetrating both sides of the conductive layer, and any adjacent two conductive layers are provided with holes between them. An inner adhesive film layer is arranged between, and the surface of the conductive layer facing the inner adhesive film layer is an undulating surface with convex parts and concave parts;

Any two adjacent layers of the conductive layers are respectively denoted as the first conductive layer and the second conductive layer, and at least one of the protrusions of the first conductive layer extends into the space between the two conductive layers. The inner adhesive film layer is connected to the undulating surface of the second conductive layer, and at least one of the protrusions of the second conductive layer extends into the inner adhesive film between the two conductive layers layer and connected to the undulating surface of the first conductive layer.

As a preferred solution, the shapes of the convex portions are the same or different, and the dimensions of the concave portions are the same or different.

As a preferred solution, the material of the inner adhesive film layer is thermosetting adhesive or thermoplastic adhesive.

As a preferred solution, the conductive layer located at the outermost side of the conductive connection structure is recorded as the outer conductive layer, and the surface of the outer conductive layer facing away from the inner adhesive film layer is also the undulating surface.

As a preferred solution, a side of the outer conductive layer facing away from the inner adhesive film layer is further provided with an outer adhesive film layer, and the convex portion of the outer conductive layer facing away from the inner adhesive film layer is hidden in the into the outer adhesive film layer or extending into the outer adhesive film layer and exposed.

As a preferred solution, the convex portion of the outer conductive layer facing away from the inner adhesive film layer is hidden in the outer adhesive film layer, and the thickness of the outer adhesive film layer is less than the average height of the convex portion itself value.

As a preferred solution, the material of the outer adhesive film layer is pressure-sensitive adhesive, heat-curing adhesive or thermoplastic adhesive.

As a preferred solution, the self-height of the convex portion ranges from 0.2 to 30 μm.

As a preferred solution, the conductive layer is provided with two or more of the holes, and the shapes of the holes are the same or different, and the sizes of the holes are the same or different.

As a preferred solution, a convex portion is further provided on the undulating surface, and the convex portion is distributed on the convex portion and/or the concave portion.

As a preferred solution, the protruding portion is a regular or irregular three-dimensional geometric shape.

As a preferred solution, the shape of the protruding portion is a sharp angle, an inverted cone, a particle, a branch, a column or a block.

As a preferred solution, the material of the raised portion is one or a combination of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.

As a preferred solution, the self-height of the protruding portion ranges from 0.2 to 15 μm.

As a preferred solution, there are two or more protrusions located on the same undulating surface, the shapes of the protrusions are the same or different, and the sizes of the protrusions are the same or different.

Implementing the embodiment of the present invention has the following beneficial effects:

On the one hand, compared with traditional welding and bonding, the conductive connection structure provided by the embodiment of the present invention can be clamped between two circuit boards or between a circuit board and a grounding metal plate, and the outermost two layers can be electrically conductive The layers are respectively connected with two circuit boards or a circuit board and a grounding metal plate, so as to realize the circuit conduction between the two circuit boards or between the circuit board and the grounding metal plate, which can not only realize the repeated disassembly of the circuit board It is convenient to maintain the circuit board, reduce the manufacturing cost of electronic products, and can also ensure the installation reliability of the circuit board while realizing the electrical connection.

On the other hand, compared with the existing flexible connector, the conductive connection structure provided by the present invention does not require metallization of holes during manufacture, and only needs to extrude two conductive layers toward each other, so that it is more convenient and quick to manufacture. The cost is also lower; and, since the electrical connection between the two conductive layers is achieved through the protrusions extending into the inner adhesive film layer, the conductive connection structure provided by the present invention has better conductive effect and is more efficient. stable connection performance; and because the inner adhesive film layer has a certain elasticity and anti-deformation ability, it can play a buffering role, so the conductive connection structure provided by the present invention is not easily deformed during repeated disassembly and assembly, ensuring that the two circuits are Reliability of electrical connections between boards or between circuit boards and grounded metal plates. In addition, since the conductive layer is provided with holes, when the conductive connection structure is pressed between two circuit boards or between the circuit board and the grounded metal plate, the glue of the inner film layer will flow into the holes of the conductive layer, and the phase The two adjacent conductive layers are tightly connected together. At the same time, the holes are conducive to the discharge of volatiles in the inner adhesive film layer at high temperature, thereby avoiding the bubble delamination caused by the inner adhesive film layer. The problem of peeling occurs, thereby improving the peeling strength between the conductive layers, and effectively ensuring that the conductive layers of each layer can be firmly connected together.

Description of drawings

1 is a schematic cross-sectional view of a conductive connection structure according to an embodiment of the present invention;

2 is a schematic cross-sectional view of a conductive connection structure using three-layer conductive layers according to an embodiment of the present invention;

3 is a schematic cross-sectional view of a conductive connection structure provided with an outer adhesive film layer according to an embodiment of the present invention;

4 is a schematic cross-sectional view of a conductive connection structure provided with a raised portion according to an embodiment of the present invention;

5 is a schematic cross-sectional view of a conductive connection structure using a double-layer conductive layer according to an embodiment of the present invention.

Description of reference numbers:

1. Conductive layer; 1a, first conductive layer; 1b, second conductive layer; 101, outer conductive layer; 102, inner conductive layer; 11, hole; 11a, first hole; 11b, second hole; 12, convex part 12a, the first convex part; 12b, the second convex part; 12c, the third convex part; 12d, the fourth convex part; 13, the concave part; 13a, the first concave part; 13b, the second concave part; 13d, the fourth concave part; 14, the convex part; 14a, the first convex part; 14b, the second convex part; 14c, the third convex part; 14d, the fourth convex part; 2, the inner film layer; 3, the outer adhesive film layer; 3a, the first outer adhesive film layer; 3b, the second outer adhesive film layer.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

As shown in FIG. 1 , an embodiment of the present invention provides a conductive connection structure, which mainly includes at least two layers of conductive layers 1 , and at least one layer of conductive layers 1 is provided with holes 11 penetrating both sides of the conductive layer. There is an inner adhesive film layer 2 between the conductive layers 1, and the surface of the conductive layer 1 facing the inner adhesive film layer 2 is an undulating surface with a convex portion 12 and a concave portion 13; any adjacent two conductive layers 1 are respectively recorded as The first conductive layer 1a and the second conductive layer 1b, at least one convex portion 12 of the first conductive layer 1a protrudes into the inner adhesive film layer 2 between the two conductive layers 1 and is connected to the undulating surface of the second conductive layer 1b , Similarly, at least one convex portion 12 of the second conductive layer 1b extends into the inner adhesive film layer 2 between the two conductive layers 1 and is connected to the undulating surface of the first conductive layer 1a, that is, the first conductive layer 1a. Between the layer 1a and the second conductive layer 1b, the convex part 12 and the convex part 12 may be connected, the convex part 12 and the concave part 13 may be connected, or one convex part 12 and the other convex part 12 and the concave part 13 may be connected. connected at the transition.

Based on the above structure, the conductive connection structure provided by the embodiment of the present invention has the following beneficial effects:

On the one hand, compared with traditional welding and bonding, the conductive connection structure provided by the embodiment of the present invention can be clamped between two circuit boards or between a circuit board and a grounding metal plate, and the outermost two layers can be electrically conductive Layer 1 is respectively connected with two circuit boards or a circuit board and a grounded metal plate, so as to realize the circuit conduction between the two circuit boards or between the circuit board and the grounded metal plate, which can not only realize the repeated circuit board The disassembly and assembly facilitates the maintenance of the circuit board, reduces the manufacturing cost of electronic products, and can also ensure the installation reliability of the circuit board while realizing electrical connection.

On the other hand, compared with the existing flexible connectors, the conductive connection structure provided by the present invention does not require hole metallization during fabrication, and only needs to extrude the two conductive layers 1 toward each other, so that the fabrication is more convenient and quicker , the cost is also lower; and since the electrical connection between the two conductive layers 1 is achieved by extending into the convex portion 12 of the inner adhesive film layer 2, the conductive connection structure provided by the present invention has better Moreover, since the inner film layer 2 has certain elasticity and anti-deformation ability, it can play a buffering role, so that the conductive connection structure provided by the present invention is not easily deformed during repeated disassembly and assembly. The reliability of the electrical connection between the two circuit boards or between the circuit board and the grounding metal plate is guaranteed. In addition, since the conductive layer 1 is provided with the hole 11, when the conductive connection structure is pressed between two circuit boards or between the circuit board and the grounded metal plate, the glue of the inner adhesive film layer 2 will flow into the hole of the conductive layer 1 11, the two adjacent conductive layers 1 are tightly connected together, and at the same time, the hole 11 is conducive to the discharge of volatiles in the inner adhesive film layer 2 at high temperature, thereby avoiding the inner adhesive film layer 2. The delamination of the bubbles leads to the problem of peeling between the conductive layers 1, thereby improving the peeling strength between the conductive layers 1, and effectively ensuring that the conductive layers 1 of each layer can be firmly connected together.

Optionally, as shown in FIG. 1 , the shape of each convex portion 12 is the same or different, and the size of each concave portion 13 is the same or different, that is to say, the radian, height, shape, etc. of each convex portion 12 are different, The curvature, depth, shape, etc. of each recess 13 are different. In the present embodiment, the range of the height H of the convex portion 12 is preferably 0.2 to 30 μm. In addition, the undulating surface formed by the convex portion 12 and the concave portion 13 may be a regular, periodic corrugated pattern, or an irregular, disordered corrugated pattern. Of course, only one of them is listed here, and other similar The situation of the shape is also within the protection scope of the present application, and will not be listed one by one here.

Optionally, as shown in FIG. 1 and FIG. 2, the outermost conductive layer 1 of the conductive connection structure is denoted as the outer conductive layer 101, then the outer conductive layer 101 is generally provided with two layers; the remaining conductive layers 1 are denoted as the outer conductive layer 101. is the inner conductive layer 102, then all the inner conductive layers 102 are located between the two outer conductive layers 101; in order to further improve the conductive effect of the conductive connection structure, the back of the two or any one of the outer conductive layers 101 The surface of the inner adhesive film layer 2 is also an undulating surface. Based on this, when the conductive connection structure provided by the embodiment of the present invention is clamped between the circuit board and the grounding metal plate, the outer conductive layer 101 faces away from the inner adhesive film layer 2. The convex portion 12 can ensure that the conductive layer 1 forms a more effective electrical connection with the ground layer or the ground metal plate of the circuit board, so that the conductive connection structure provided by the embodiment of the present invention can effectively export the electrostatic charge accumulated on the circuit board, Avoid the accumulation of static charges on the circuit board to form interference sources and affect the transmission of signals.

Optionally, as shown in FIG. 3 , the side of the outer conductive layer 101 facing away from the inner adhesive film layer 2 is further provided with an outer adhesive film layer 3 . In other words, it is hidden in the outer adhesive film layer 3 or extends into the outer adhesive film layer 3 and exposed. In this embodiment, the convex portion 12 of the outer conductive layer 101 facing away from the inner adhesive film layer 2 is hidden in the outer adhesive film layer. 3, and the thickness of the outer adhesive film layer 3 is smaller than the average value of the height of the convex portion 12 itself. Based on this, like the inner adhesive film layer 2, the outer adhesive film layer 3 also has a certain elasticity and anti-deformation ability, which can play a buffering role, so that when the conductive connection structure is clamped between two circuit boards or a circuit Between the board and the grounding metal plate, thanks to the elastic force of the outer adhesive film layer 3 and the inner adhesive film layer 2, the convex portion 12 of the outer conductive layer 101 facing away from the inner adhesive film layer 2 and the circuit board or the grounding metal plate are connected. will form a more reliable electrical connection.

Optionally, the shape of the hole 11 can be a circle, a triangle, a rectangle, an ellipse or a random polygon, etc., and one conductive layer is provided with two or more holes 11, and the shape of each hole 11 is Same or different, the size of each hole 11 is the same or different, that is to say, the shape of two or more holes 11 can be one or more of circle, triangle, rectangle, ellipse, polygon, and Two or more holes 11 of the same shape may have different sizes. In addition, for the holes 11 of the same conductive layer, they may be arranged according to certain rules, such as equidistant arrangement, increasing arrangement, decreasing arrangement, etc., or they may be arranged randomly. For the holes 11 of any two adjacent conductive layers, they can be completely staggered, completely aligned, or partially staggered or partially aligned. Best exhaust.

Optionally, as shown in FIG. 4 , in order to further improve the reliability of the electrical connection between the two adjacent conductive layers 1 and the electrical conductivity of the conductive connection structure, the undulating surface of the conductive layer 1 is also provided with a raised portion. 14. The convex portion 14 is distributed both in the convex portion 12 and in the concave portion 13, and if the outer conductive layer 101 is also provided with an outer adhesive film layer 3 on the side facing away from the inner adhesive film layer 2, the outer conductive layer As for the protrusions 14 on the undulating surface of the outer adhesive film layer 3 of 101 , they are hidden in the outer adhesive film layer 3 or protrude into the outer adhesive film layer 3 and be exposed. Based on this, the raised portion 14 can increase the contact area of the two adjacent conductive layers 1 and the contact area between the conductive layer 1 and the ground layer of the circuit board or the ground metal plate, and at the same time increase the distance between the two adjacent conductive layers 1 The friction force between the conductive layer 1 and the ground layer of the circuit board or the ground metal plate, so as to achieve the purpose of improving the reliability of the electrical connection and the electrical conductivity. It should be pointed out that when the convex parts 14 are only distributed on the convex part 12 or the concave part 13, it can also produce the above technical effect.

Specifically, as shown in FIG. 4 , the protrusions 14 are regular or irregular three-dimensional geometric shapes, such as sharp corners, inverted cones, granular shapes, dendritic shapes, column shapes, block shapes, etc., and are located on the same undulating surface There are two or more raised parts 14 on the upper part, the shape of each raised part 14 can be the same or different, and the size of each raised part 14 can also be the same or different, that is to say, two or two The shape of the more than one protrusions 14 can be one or more of sharp angle, inverted cone, granular, dendritic, columnar, and block shape, and two or more protrusions with the same shape The dimensions of the portion 14 may vary. In the present embodiment, the range of the height h of the protruding portion 14 is preferably 0.2 to 15 μm. In addition, two or more protrusions 14 are distributed continuously or discontinuously. When the shape of the two or more protrusions 14 is angular and continuously distributed, regular and periodic shapes can be formed. The dentate three-dimensional pattern, or an irregular and disordered dentate three-dimensional pattern, of course, only one of them is listed here, and the combination of other shapes in the above is also within the protection scope of the present application, I won't list them all here.

Optionally, the material of the conductive layer 1 is preferably copper, and the material of the raised portion 14 is preferably a combination of one or more of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold, and silver, that is, The raised portion 14 can be a single component, that is, one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver, or can be made of copper, nickel, tin, lead, chromium, molybdenum, zinc, A material of gold and silver is used as the main body, and then one or more of the methods of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to form one or more of the metals other than the main body on the main body. The surface of the main body, thereby forming the raised portion 14 of the composite material. In this embodiment, the protruding portion 14 is preferably made of copper, and one or more metals of nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver are formed on the surface of the copper composite material. This is because The protrusions 14 only made of copper are easily oxidized or worn, and nickel, tin, gold, and silver formed on the copper surface can improve the corrosion resistance and wear resistance of the protrusions 14, thereby prolonging the conductive connection structure. service life.

Optionally, in order to prevent the two adjacent conductive layers 1 from being separated, the material of the inner adhesive film layer 2 is preferably a heat-curable adhesive or thermoplastic adhesive with good stability, such as thermoplastic polyimide, modified thermoplastic polyimide. Amine, acrylic, modified acrylic, epoxy resin, modified epoxy resin, etc. Different from the inner film layer 2, according to the actual application of the conductive connection structure, the material of the outer film layer 3 can be selected from pressure-sensitive adhesives that can be repeatedly peeled off, such as acrylic, silicone and polyurethane pressure-sensitive adhesives. , you can also choose heat-curable adhesive or thermoplastic adhesive with good stability, and when the outer adhesive film layer 3 and the inner adhesive film layer 2 are both selected from heat-curable adhesive or thermoplastic adhesive, the two may be different.

In order to make the features and beneficial effects of the conductive connection structure provided by the embodiments of the present invention more easily understood, the conductive connection structure using the double-layer conductive layer 1 will be further described in detail below with reference to FIG. 5 .

As shown in FIG. 5 , the conductive connection structure includes a first conductive layer 1a, an inner adhesive film layer 2 and a second conductive layer 1b that are stacked in sequence. Obviously, the first conductive layer 1a and the second conductive layer 1b are the conductive layers. The outer conductive layer 101 of the connection structure has no inner conductive layer 102 in the conductive connection structure. The first conductive layer 1a is provided with first holes 11a penetrating both sides thereof, and the second conductive layer 1 is provided with second holes 11b penetrating both sides thereof, and the first holes 11a and the second holes 11b are completely staggered. The surface of the first conductive layer 1a facing the inner adhesive film layer 2 is an undulating surface, which includes a first convex portion 12a and a first concave portion 13a, and the surface of the second conductive layer 1b facing the inner adhesive film layer 2 is also an undulating surface, which includes The second convex portion 12b and the second concave portion 13b, and the first convex portion 12a protrudes into the inner adhesive film layer 2 and is connected with the second concave portion 13b, and the second convex portion 12b protrudes into the inner adhesive film layer 2 and is connected with the first The recesses 13a are connected. Thereby, an electrical connection is established between the first conductive layer 1a and the second conductive layer 1b.

Further, as shown in FIG. 5 , the surface of the first conductive layer 1a facing away from the inner adhesive film layer 2 is also an undulating surface, which includes a third convex portion 12c and a third concave portion 13c, and the first conductive layer 1a faces away from One side of the inner adhesive film layer 2 is also provided with a first outer adhesive film layer 3a, and the third convex portion 12c is hidden in the first outer adhesive film layer 3a; similarly, the second conductive layer 1b faces away from the inner adhesive film layer 2 The surface of the conductive layer 1b is also an undulating surface, which includes a fourth convex portion 12d and a fourth concave portion 13d, and the side of the second conductive layer 1b facing away from the inner adhesive film layer 2 is also provided with a second outer adhesive film layer 3b, the fourth The convex portion 12d is hidden in the second outer adhesive film layer 3b.

Still further, as shown in FIG. 5 , the undulating surface of the first conductive layer 1a facing the inner adhesive film layer 2 is provided with first protrusions 14a. The first protrusions 14a are not only distributed on the first protrusions 12a, but also Distributed on the first concave portion 13a; similarly, the undulating surface of the second conductive layer 1b facing the inner adhesive film layer 2 is provided with a second convex portion 14b. The second convex portion 14b is not only distributed on the second convex portion 12b, but also distributed in the second recess 13b.

Furthermore, as shown in FIG. 5 , the undulating surface of the first conductive layer 1a facing away from the inner adhesive film layer 2 is provided with a third raised portion 14c, and the third raised portion 14c is distributed on the third raised portion 12c, Also distributed in the third concave portion 13c, and the third convex portion 14c is hidden in the first outer adhesive film layer 3a; similarly, the undulating surface of the second conductive layer 1b facing away from the inner adhesive film layer 2 is provided with a fourth The protruding portion 14d and the fourth protruding portion 14d are distributed both in the fourth protruding portion 12d and in the fourth concave portion 13d, and the fourth protruding portion 14d is hidden in the second outer adhesive film layer 3b.

Based on the above structure, when the conductive connection structure is clamped between two circuit boards or between the circuit board and the grounded metal plate, the static charge on the circuit board on the same side as the first conductive layer 1a passes through the third protrusion in sequence 14c, the first conductive layer 1a, the first raised portion 14a, the second raised portion 14b, the second conductive layer 1b and the fourth raised portion 14d are conducted to the circuit board or ground metal on the same side as the second conductive layer 1b plate to achieve electrostatic charge transfer.

In summary, the present invention provides a conductive connection structure, comprising at least two conductive layers 1, an inner adhesive film layer 2 is provided between any two adjacent conductive layers 1, and at least one conductive layer 1 is provided with Through the holes 11 on both sides of the conductive layer 1 , the surface of the conductive layer 1 facing the inner adhesive film layer 2 is an undulating surface with convex parts 12 and concave parts 13 , and any adjacent two conductive layers 1 are connected by the convex parts 12 . Compared with the prior art, the conductive connection structure has the advantages of simple fabrication process, low production cost, high firmness, and good electrical conductivity.

It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but these information should not be limited to these terms, which are only used to distinguish the same type of information from each other. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present invention.

The above are the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also considered as It is the protection scope of the present invention.

Claims (15)

1. A conductive connection structure is characterized by comprising at least two conductive layers, wherein at least one conductive layer is provided with holes penetrating through the surfaces of two sides of the conductive layer, an inner glue film layer is arranged between any two adjacent conductive layers, and the surface of the conductive layer facing the inner glue film layer is a relief surface with convex parts and concave parts;

and respectively marking any two adjacent conductive layers as a first conductive layer and a second conductive layer, wherein at least one convex part of the first conductive layer extends into the inner glue film layer between the two conductive layers and is connected with the relief surface of the second conductive layer, and at least one convex part of the second conductive layer extends into the inner glue film layer between the two conductive layers and is connected with the relief surface of the first conductive layer.

2. The conductive connection structure according to claim 1, wherein the shape of each of the convex portions is the same or different, and the size of each of the concave portions is the same or different.

3. The conductive connection structure of claim 1, wherein the inner adhesive film layer is made of thermosetting adhesive or thermoplastic adhesive.

4. The conductive connection structure according to claim 1, wherein the conductive layer located at the outermost side of the conductive connection structure is referred to as an outer conductive layer, and a surface of the outer conductive layer facing away from the inner adhesive film layer is also the relief surface.

5. The structure of claim 4, wherein an outer adhesive film layer is further disposed on a side of the outer conductive layer opposite to the inner adhesive film layer, and the convex portion of the outer conductive layer opposite to the inner adhesive film layer is hidden in the outer adhesive film layer or extends into the outer adhesive film layer and is exposed.

6. The structure of claim 5, wherein the convex portion of the outer conductive layer facing away from the inner adhesive film layer is hidden in the outer adhesive film layer, and the thickness of the outer adhesive film layer is smaller than the average height of the convex portion.

7. The structure of claim 5, wherein the outer adhesive layer is made of a pressure-sensitive adhesive, a heat-curable adhesive, or a thermoplastic adhesive.

8. The conductive connection structure according to claim 1, wherein the height of the convex portion itself is in the range of 0.2 to 30 μm.

9. The conductive connection structure according to claim 1, wherein the conductive layer is provided with two or more holes, and the shape of each of the holes is the same or different, and the size of each of the holes is the same or different.

10. The conductive connection structure according to claim 1, wherein the relief surface is further provided with a convex portion, and the convex portion is distributed on the convex portion and/or the concave portion.

11. The conductive connection structure according to claim 10, wherein the convex portion has a regular or irregular solid geometry.

12. The conductive connection structure according to claim 11, wherein the shape of the convex portion is a pointed shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape, or a block shape.

13. The conductive connection structure of claim 10, wherein the material of the bump is one or more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.

14. The conductive connection structure according to claim 10, wherein the height of the bump itself is in the range of 0.2 to 15 μm.

15. The conductive connection structure according to claim 10, wherein the protrusions on the same undulating surface are provided in two or more numbers, the shapes of the protrusions are the same or different, and the sizes of the protrusions are the same or different.

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