CN112113153A - A lamp with a conductive, thermally conductive and heat-dissipating substrate - Google Patents

Abstract

The invention relates to a lamp with a conductive, heat-conducting and heat-dissipating substrate, which includes an integral substrate and a lamp bulb. The lamp bulb has a sealed cavity, the integral base is arranged in the sealed cavity, and several bases are connected to form the integral through an insulating connecting body. A base plate, each of which includes a light source fixing part and a heat conduction and heat dissipation part, several of the light source fixing parts and several of the heat conduction and heat dissipation parts are connected together to form the base plate, the light source fixing part is provided with an LED light source, and the heat conduction and heat dissipation part is Abutting on the inner surface of the glass bulb wall, the lamp bulb includes the glass bulb wall and the glass bulb inner wall, and the sealed cavity is formed by surrounding the inner surface of the glass bulb wall and the outer surface of the glass bulb inner wall to form the LED light source. When electrified to emit light, the light is radiated through the glass bulb wall, and the heat generated by the operation of the substrate passes through the heat conduction and heat dissipation part and is emitted through the glass bulb wall to dissipate heat for the lamp.

Description

A lamp with a conductive, thermally conductive and heat-dissipating substrate

technical field

The invention relates to a lamp, in particular to a lamp which is provided with an LED light source and has the functions of electrical conduction, heat conduction and heat dissipation.

Background technique

As we all know, with the further withdrawal of incandescent lamps from the market, the demand for LED filament lamps at home and abroad is increasing. Since LED filament lamps have the large-angle light-emitting form of traditional incandescent lamps that the public is accustomed to and familiar with, it is a "retro style". The complex application group is very popular, so that the LED filament lamp that looks like an incandescent lamp has found its "depression" of application. Also because the manufacturing process of LED filament lamps is similar to that of incandescent lamps, it is undoubtedly a very simple thing in production for lighting manufacturers who have been engaged in the production and manufacture of incandescent lamps to switch to LED filament lamps to enter this application field. With LED filament lamps from theory to practical lighting products, from decorative applications to functional lighting applications, the demand will expand day by day.

However, in terms of technical structure, because the filament of the filament lamp is in a closed environment, and the substrate area of the LED filament is too small, under the requirements of small light decay and long life, it is difficult to achieve the ideal design requirements for heat dissipation in practical applications. The power has never been improved. At present, the maximum power can only hover between 6 and 8 watts. Another disadvantage of the current LED filament lamp is that due to the need to increase the heat dissipation area and the long filament length, it is difficult to achieve full structure. In addition, due to the large luminous surface, the light intensity emitted cannot reach the effect of traditional incandescent lamps, and LED filament lamps make it impossible to replace incandescent lamps in many occasions.

At present, the shortcomings of LED filament lamps are: 1. The transparent substrates such as sapphire and glass that emit light on both sides are long in length, and the light mainly faces in the surrounding direction, and the lamp is relatively dark. 2. The flexible aluminum substrate emits light from one side - the main light is also towards the surrounding, and the light above and below is weak.

There is a problem with the current double-sided and single-sided LED filament lamps, that is, the limited substrate itself cannot achieve the purpose of heat dissipation, and the substrate is made of sapphire, glass, aluminum and FPC, etc. The infrared rays radiated by these materials are heated. The wavelength is above 8 μm, which belongs to the mid-far infrared radiation; the glass of the glass bulb of the filament lamp is ordinary soda lime glass; the vibration frequency (eigen frequency) of the material is determined by the mechanical constant and atomic weight, and the glass forms oxides such as Na ₂ O·CaO·6SiO ₂ or Na ₂ SiO ₃ , CaSiO ₃ , SiO ₂ and other atomic weights are small, the force constant is large, so the eigenfrequency is large, and cannot pass through the mid- and far-infrared, but only through the near-infrared. It can transmit near-infrared short-wave, visible light and ultraviolet light with a wavelength below 2.5μm. Therefore, the heat of the ordinary filament lamp filament cannot be directly transmitted out of the glass shell, but can only pass through the gas and glass with low thermal conductivity. , and this is the main disadvantage of the traditional technology.

SUMMARY OF THE INVENTION

The technical scheme adopted in the present invention is: a lamp with a conductive, thermally conductive and heat-dissipating substrate, which is characterized by comprising an integral substrate and a lamp bulb, the lamp bulb has a sealed cavity, the integral substrate is arranged in the sealed cavity, and a plurality of The substrates are connected to form the integral substrate through insulating connectors, each of the substrates includes a light source fixing part and a heat-conducting heat-dissipating part, and several of the light-source fixing parts and several of the heat-conducting and heat-dissipating parts are connected together to form the substrate. An LED light source is provided, and the heat-conducting and heat-dissipating part is attached to the inner surface of the glass bulb wall. The lamp bulb includes the glass bulb wall and the glass bulb inner wall. By means of the inner surface of the glass bulb wall and the outer surface of the glass bulb inner wall Surrounding the sealed cavity, the LED light source is energized to emit light, and the light is radiated through the glass bulb wall.

The beneficial effect of the present invention is that several of the light source fixing parts and several of the heat-conducting and heat-dissipating parts of the present invention are connected together to form the substrate. The light source fixing part is provided with an LED light source. The LED light source can be LED lamp beads, LED light-emitting chips or other light sources. The base plate is arranged in the bulb of the lamp, and the heat-conducting and heat-dissipating part is abutted on the inner surface of the glass bulb wall. The LED light source is energized to emit light, and the light is radiated through the glass bulb wall. At this moment, the heat generated by the operation of the substrate mainly passes through the heat conduction and heat dissipation part in the form of thermal radiation and is emitted through the glass bulb wall to dissipate heat for the lamp. effect. In practice, the intensity of thermal radiation is inversely proportional to the square of the distance. In the present invention, the heat-conducting and heat-dissipating portion is directly abutted on the inner surface of the glass bulb wall to reduce the distance between the substrate and the glass bulb wall. to the shortest, thereby improving the radiation heat dissipation efficiency, thereby improving the heat dissipation efficiency of the overall luminaire. When the present invention is working, most of the heat generated by the LED light source is directly conducted to the heat-conducting and heat-dissipating part, and then the heat-conducting heat-dissipating part mainly dissipates the heat through the glass bulb wall in the form of heat radiation. go out.

Description of drawings

FIG. 1 is a front view of the substrate of the present invention.

FIG. 2 is a schematic diagram of the structure of the substrate of the present invention.

FIG. 3 is a schematic diagram of the substrate of the present invention disposed in a light bulb.

FIG. 4 is a schematic view of the light bulb of the present invention.

FIG. 5 is a schematic diagram of the overall substrate of the present invention.

FIG. 6 is a schematic view of the front fixing film of the present invention.

FIG. 7 is a schematic view of the backside fixing film of the present invention.

FIG. 8 is a schematic diagram of a lamp of the present invention.

FIG. 9 is a schematic diagram of the thermally conductive column of the present invention.

FIG. 10 is a schematic diagram of the magnetic field of the light bar formed by the spiral current of the present invention.

FIG. 11 is a schematic diagram of a fan provided in the bulb of the present invention.

FIG. 12 is a schematic diagram of the lamp of the present invention being fabricated into a bulb shape.

FIG. 13 is a front view of another embodiment of the substrate of the present invention.

FIG. 14 is a cross-sectional view of another embodiment of the substrate of the present invention.

FIG. 15 is a front view of another embodiment of the substrate of the present invention.

FIG. 16 is a cross-sectional view of yet another embodiment of the substrate of the present invention.

17 is a cross-sectional view of an embodiment of the present invention as a street light source.

Detailed ways

As shown in FIGS. 1-7 , a substrate 500 with the functions of electrical conduction, heat conduction and heat dissipation includes a light source fixing part 510 and a heat conduction and heat dissipation part 520 .

Several of the light source fixing parts 510 and several of the heat-conducting and heat-dissipating parts 520 are connected together to form the substrate 500 .

In the specific implementation, the light source fixing portion 510 and the heat-conducting heat-dissipating portion 520 are arranged at intervals, that is, one heat-conducting heat-dissipating portion 520 is connected between the two light-source fixing portions 510, and at the same time, two heat-conducting and heat-dissipating portions 520 are connected to each other. One of the light source fixing parts 510 is connected therebetween.

The light source fixing portion 510 is provided with an LED light source 530 .

The LED light source 530 can be an LED lamp bead, an LED light-emitting chip or other light sources.

The base plate 500 is disposed in the bulb of the lamp, and the heat-conducting and heat-dissipating portion 520 abuts against the inner surface 610 of the glass bulb wall 600 .

The LED light source 530 is energized to emit light, and the light is radiated through the glass bulb wall 600. At this moment, the heat generated by the operation of the substrate 500 mainly passes through the heat conduction and heat dissipation portion 520 in the form of thermal radiation and is emitted through the glass bulb wall 600. In order to achieve the role of heat dissipation for lamps.

In practice, the intensity of thermal radiation is inversely proportional to the square of the distance. In the present invention, the heat-conducting and heat-dissipating portion 520 is directly abutted on the inner surface 610 of the glass bulb wall 600 so that the substrate 500 and the glass bulb wall 600 can be connected. The distance between them is reduced to the shortest, thereby improving the radiation heat dissipation efficiency, thereby improving the heat dissipation efficiency of the overall luminaire.

When the present invention is in operation, most of the heat generated by the LED light source 530 is directly conducted to the heat-conducting and heat-dissipating part 520 when the LED light source 530 is energized to emit light, and then the heat-conducting and heat-dissipating part 520 mainly transmits the heat through the glass in the form of thermal radiation. The bulb wall 600 radiates out.

In specific implementation, the above-mentioned heat dissipation requirements can also be achieved by directly disposing an LED front-mounted chip on the substrate 500 .

The light source fixing part 510 has a fixed top surface 511, the LED light source 530 is arranged on the fixed top surface 511, the fixed top surface 511 is a reflective surface, and part of the light emitted by the LED light source 530 directly passes through the glass bulb wall 600 , part of the light is reflected by the inner surface 610 of the glass bulb wall 600 and finally reflected by the reflective surface and then irradiated through the glass bulb wall 600 .

The heat conduction and heat dissipation part 520 has a contact top surface 521, a plurality of contact ribs 522 are protruded on the contact top surface 521, and a plurality of the contact ribs 522 are in contact with the inner surface 610 of the glass bulb wall 600, so as to realize the heat conduction and heat dissipation The portion 520 abuts on the inner surface 610 and performs the function of dissipating heat.

At the same time, when the base plate 500 is integrally bent and placed in the light bulb, the contact ribs 522 also have the function of ensuring the bending effect.

As shown in FIG. 4 , in a specific implementation, the glass bulb wall 600 is straight tubular, the inner surface 610 is tubular, and several of the heat-conducting and heat-dissipating portions 520 are attached to the tubular inner surface 610 at the same time.

As shown in FIG. 2 , in a specific implementation, a near-infrared radiation layer 13 is provided on the contact top surface 521 of the heat-conducting and heat-dissipating portion 520 .

It is worth noting that at this time, the top of the contact rib 522 is not provided with the near-infrared radiation layer 13, because the radiation material layer itself has a certain thermal resistance, which will affect the contact between the contact rib 522 and the inner surface 610. affect thermal conductivity.

As shown in FIG. 2 , in a specific implementation, a radiation reflection layer 540 is provided on the bottom surface of the substrate 500 .

The radiation reflection layer 540 may be a silver-plated layer or other reflection layers. Silver is a low-emissivity layer and will not lower the effective front radiation temperature.

Part of the heat radiation generated by the substrate 500 is directly radiated through the glass bulb wall 600 , and the other part is reflected by the radiation reflection layer 540 and then radiated through the glass bulb wall 600 .

In practice, the intensity of thermal radiation is proportional to the fourth power of temperature: (273°+X) ⁴ , where X is the temperature.

Setting the radiation reflection layer 540 can make most of the thermal radiation generated by the substrate 500 radiate outward from the top of the substrate 500. At this time, the temperature of the top of the substrate 500 is much higher than the temperature below the bottom surface, so at this moment the top of the substrate 500 faces The higher the external emissivity, the stronger the cycle, so that the heat radiation generated by the substrate 500 can be radiated directly through the glass bulb wall 600 efficiently.

In a specific implementation, the radiation reflection layer 540 is disposed on the bottom surface of the heat conduction and heat dissipation part 520 and the light source fixing part 510 .

As shown in FIG. 5 , it is another structural form of the substrate 500 of the present invention. The direction of the arrow is the overall bending direction, and the whole is placed in the glass bulb wall 600 after bending.

In a specific implementation, a plurality of the substrates 500 are connected to form an integral substrate through the insulating connecting body 700 .

As shown in FIG. 3 , the integral substrate is disposed in the bulb of the lamp, and the heat-conducting and heat-dissipating portion 520 of each substrate 500 constituting the integral substrate abuts against the inner surface 610 of the glass bulb wall 600 .

As shown in FIG. 3 , each of the substrates 500 is provided with a resilient portion 550 . When the substrate 500 is bent, the resilient portion 550 can exert an elastic force on the substrate 500 , so that the heat-conducting and heat-dissipating portion 520 of the substrate 500 is bent. It is tightly attached to the inner surface 610 of the glass bulb wall 600 .

When the glass bulb wall 600 has a straight tubular shape and the inner surface 610 has a tubular shape, the elastic pressing portion 550 is disposed at the rear end of the base plate 500 ,

When the base plate 500 is bent into a ring shape, the elastic pressing part 550 presses the front end of the base plate 500 so that the heat conduction and heat dissipation part 520 of the base plate 500 tightly abuts on the inner surface 610 of the tubular shape.

In a specific implementation, the insulating connecting body 700 includes a front fixing film 710 and a back fixing film 720 .

Wherein, the front fixing film 710 is attached to the front surface of the integral substrate, and the back fixing film 720 is attached to the back surface of the integral substrate.

As shown in FIG. 6 , the front fixing film 710 is provided with a light source window 711 and an infrared radiation window 712 .

As shown in FIG. 7 , the backside fixing film 720 is provided with a reflection window 721 and a backside radiation window 722 of the lamp bead.

The fixed top surface 511 of the light source fixing portion 510 and the LED light source 530 are located in the light source window 711 .

The contact top surface 521 of the heat conduction and heat dissipation portion 520 and the near-infrared radiation layer 13 thereon are located in the infrared radiation window 712 .

The radiation reflection layer 540 on the bottom surface of the substrate 500 is located in the reflection window 721 .

The bottom surface of the light source fixing portion 510 is located in the radiation window 722 on the back side of the lamp bead.

In a specific implementation, the front fixing film 710 is a white fixing film to enhance the light reflection effect of the LED light source 530 .

In the specific implementation, the light bulb of the lamp is filled with heat-dissipating gas, such as helium gas, argon gas, and the like.

The heat of the integral substrate is mainly radiated through its light-emitting front surface, and the heat generated by its rear surface is conducted out through the heat dissipation gas.

As shown in Figures 1-12, the following is another embodiment of the technical solution of the present invention.

As shown in FIG. 8 , a lamp with a conductive, thermally conductive and heat-dissipating substrate includes an integral substrate and a lamp bulb. The lamp bulb has a sealed cavity 100 , the integral substrate is arranged in the sealed cavity 100 , and several substrates 500 are insulated by insulating The connecting body 700 is connected to form the integral substrate.

As shown in FIGS. 1-7 , each of the substrates 500 includes a light source fixing portion 510 and a heat conduction and heat dissipation portion 520 .

Several of the light source fixing parts 510 and several of the heat-conducting and heat-dissipating parts 520 are connected together to form the substrate 500 .

In the specific implementation, the light source fixing portion 510 and the heat-conducting heat-dissipating portion 520 are arranged at intervals, that is, one heat-conducting heat-dissipating portion 520 is connected between the two light-source fixing portions 510, and at the same time, two heat-conducting and heat-dissipating portions 520 are connected to each other. One of the light source fixing parts 510 is connected therebetween.

The light source fixing portion 510 is provided with an LED light source 530 .

The LED light source 530 can be an LED lamp bead, an LED light-emitting chip or other light sources.

The heat-conducting and heat-dissipating portion 520 abuts against the inner surface 610 of the glass bulb wall 600 .

As shown in FIG. 8 , the lamp bulb includes the glass bulb wall 600 and the glass bulb inner wall 800 , and the sealed cavity 100 is formed by surrounding the inner surface 610 of the glass bulb wall 600 and the outer surface of the glass bulb inner wall 800 .

The LED light source 530 is energized to emit light, and the light is radiated through the glass bulb wall 600. At this moment, the heat generated by the operation of the substrate 500 mainly passes through the heat conduction and heat dissipation portion 520 in the form of thermal radiation and is emitted through the glass bulb wall 600. In order to achieve the role of heat dissipation for lamps.

In practice, the intensity of thermal radiation is inversely proportional to the square of the distance. In the present invention, the heat-conducting and heat-dissipating portion 520 is directly abutted on the inner surface 610 of the glass bulb wall 600 so that the substrate 500 and the glass bulb wall 600 can be connected. The distance between them is reduced to the shortest, thereby improving the radiation heat dissipation efficiency, thereby improving the heat dissipation efficiency of the overall lamp. When the present invention is working, most of the heat generated by the LED light source 530 is directly conducted to the heat conduction and heat dissipation part when it is energized and illuminated. 520, and then the heat is mainly dissipated through the glass bulb wall 600 in the form of thermal radiation by the heat-conducting and heat-dissipating portion 520.

The light source fixing part 510 has a fixed top surface 511, the LED light source 530 is arranged on the fixed top surface 511, the fixed top surface 511 is a reflective surface, and part of the light emitted by the LED light source 530 directly passes through the glass bulb wall 600 , part of the light is reflected by the inner surface 610 of the glass bulb wall 600 and finally reflected by the reflective surface and then irradiated through the glass bulb wall 600 .

The heat conduction and heat dissipation part 520 has a contact top surface 521, a plurality of contact ribs 522 are protruded on the contact top surface 521, and a plurality of the contact ribs 522 are in contact with the inner surface 610 of the glass bulb wall 600, so as to realize the heat conduction and heat dissipation The portion 520 abuts on the inner surface 610 and performs the function of dissipating heat.

At the same time, when the base plate 500 is integrally bent and placed in the light bulb, the contact ribs 522 also have the function of ensuring the bending effect.

During specific implementation, the near-infrared radiation layer 13 is disposed on the contact top surface 521 of the heat-conducting and heat-dissipating portion 520 .

The near-infrared radiation layer 13 is also disposed on the bottom surface of the substrate 500 .

It is worth noting that at this time, the top of the contact rib 522 is not provided with the near-infrared radiation layer 13, because the radiation material layer itself has a certain thermal resistance, which will affect the contact between the contact rib 522 and the inner surface 610. affect thermal conductivity.

In a specific implementation, each of the substrates 500 is provided with a resilient portion 550 . When the substrate 500 is bent, the resilient portion 550 can apply an elastic force to the substrate 500 , so that the heat-conducting and heat-dissipating portion 520 of the substrate 500 is bent. It is tightly attached to the inner surface 610 of the glass bulb wall 600 .

When the glass bulb wall 600 is in a straight tube shape and the inner surface 610 is in a tube shape, the resilient portion 550 is disposed at the rear end of the base plate 500 , and when the base plate 500 is bent into a ring shape, the resilient portion 550 presses the base plate 500 , so that the heat-conducting and heat-dissipating portion 520 of the substrate 500 is tightly abutted on the inner surface 610 of the tubular shape.

In a specific implementation, the insulating connector 700 includes a front fixing film 710 and a back fixing film 720, wherein the front fixing film 710 is attached to the front of the overall substrate, and the back fixing film 720 is attached to the front of the overall substrate. back.

The front fixing film 710 is provided with a light source window 711 and an infrared radiation window 712 , and the rear fixing film 720 is provided with a lamp bead back radiation window 722 .

The fixed top surface 511 of the light source fixing portion 510 and the LED light source 530 are located in the light source window 711 .

The near-infrared radiation layer 13 on the contact top surface 521 of the heat-conducting and heat-dissipating portion 520 is located in the infrared radiation window 712 .

The near-infrared radiation layer 13 on the bottom surface of the substrate 500 is located in the radiation window 722 on the back side of the lamp bead.

In a specific implementation, the front fixing film 710 is a white fixing film to enhance the light reflection effect of the LED light source 530 .

During specific implementation, the sealed cavity 100 is filled with heat-dissipating gas, such as helium gas, argon gas, and the like.

In specific implementation, the near-infrared radiation layer 13 can be made of various materials, for example, a mixed material composed of 60% nickel oxide, 30% cobalt oxide, and 10% iron oxide by weight.

When working, the LED light source 530 is energized to emit light, and the heat generated by its operation is conducted into the near-infrared radiation layer 13, and the near-infrared radiation layer 13 radiates the heat in the form of near-infrared short waves to reach the substrate 500. Heat dissipation is performed to reduce the working temperature of the substrate 500 .

The lamp further includes a heat-inducing column 20 corresponding to the near-infrared radiation layer 13 on the bottom surface of the substrate 500 .

The heating column 20 is used for absorbing near-infrared short waves emitted by the near-infrared radiation layer 13 .

When working, the near-infrared radiation layer 13 radiates heat in the form of near-infrared short waves. At this moment, the heat-inducing column 20 absorbs the near-infrared short-wave. At the same time, the heat-inducing column 20 radiates the heat outward, In order to achieve the role of heat dissipation for the lamp.

An infrared absorption layer 21 is disposed on the outer surface of the heat guide 20 . The infrared absorption layer 21 corresponds to the near-infrared radiation layer 13 on the bottom surface of the substrate 500 . The infrared absorption layer 21 is used to absorb the near-infrared radiation layer. 13 near-infrared shortwaves.

In the specific implementation, the absorption rate of the infrared absorption layer 21 is controlled to be greater than 90%, and the emissivity is less than 20%. The infrared absorption layer 21 can be made of a mixture of various materials, for example, by weight percentage of nickel oxide 60% , 30% cobalt oxide, 10% iron oxide powder mixed.

An aerogel layer 22 is also disposed on the outer surface of the heat-inducing column 20 , and the aerogel layer 22 is disposed between the outer surface of the heat-inducing column 20 and the infrared absorption layer 21 .

When working, the infrared absorption layer 21 absorbs the near-infrared short wave emitted by the near-infrared radiation layer 13. At this moment, the aerogel layer 22 makes the heat radiate outward through the inner surface of the other side of the heat-inducing column 20. .

The aerogel made of the aerogel layer 22 (SiO_2 aerogel has extremely low thermal conductivity due to its fine nanoporous structure, and pure aerogel is almost transparent to near-infrared wavelengths below 8 μm). The heat generated by the infrared passing through is absorbed by the black body material with the intrinsic band greater than 8um, and the wavelength radiated after heating is greater than 8um, which is blocked by the aerogel, plus the extreme poor thermal conductivity of the aerogel is 0.013W/m.k , the heat can only be radiated out of the lamp from the inner surface of the heat-inducing column 20 .

During specific implementation, the air around the heat-inducing column 20 flows, so as to improve the heat dissipation efficiency of the heat-inducing column 20 and improve the heat dissipation effect of the lamp.

In specific implementation, the glass bulb wall 600 and the glass bulb inner wall 800 are made of quartz or infrared glass.

Quartz or infrared glass allows the near-infrared, mid-infrared and infrared reflected from the substrate 500 to pass through, and the transmitted near-infrared is absorbed by the heat-inducing column 20 .

In specific implementation, the glass bulb inner wall 800 is a glass inner sleeve, and the glass bulb wall 600 is a glass outer sleeve.

The sealed cavity 100 is formed by surrounding the outer surface of the glass inner sleeve with the inner surface of the glass outer sleeve.

A ventilation and heat dissipation cavity 150 is formed around the inner surface of the glass inner sleeve, and the heat-inducing column 20 is arranged in the ventilation and heat dissipation cavity 150 .

The ventilation and heat dissipation cavity 150 includes an air inlet 151 and an air outlet 152 .

The air inlet 151 and the air outlet 152 are located at two ends of the lamp, respectively.

Wherein, the air inlet 151 is located at the lamp socket, and the air outlet 152 is located at the front end of the lamp.

In a specific implementation, the overall substrate ring is arranged around the heat-inducing column 20 .

Both the integral substrate and the heat-extracting column 20 are tubular.

The overall substrate is electrified and emits light, the current flowing in the overall substrate forms a spiral current 15 along the spiral direction of the overall substrate, and a light bar magnetic field 16 is formed by the spiral current 15 , and the light bar magnetic field 16 is located in the ventilation and heat dissipation cavity 150 Among them, the heat-extracting column 20 is in the light bar magnetic field 16 , and the heat dissipation efficiency of the heat-extracting column 20 is improved by means of the light bar magnetic field 16 .

It is specifically described as various optical phenomena caused by the interaction between light (infrared) and matter in a magnetized state, including Faraday's magneto-optical effect, Cotton-Muton effect and Kerr magneto-optical effect. These effects all originate from the magnetization of matter.

It reflects the connection between light and the magnetism of matter. When light propagates in a medium, if a strong magnetic field is added parallel to the propagation direction of the light, the direction of light vibration will be deflected. The deflection direction depends on the properties of the medium and the direction of the magnetic field. This phenomenon is called the magneto-optical effect. The energy level of the electromagnetic wave can be reduced, the heat given by the substrate required for infrared radiation is reduced, and the radiation intensity is enhanced at the same temperature.

As shown in FIG. 11 , in a specific implementation, a fan 155 is provided in the ventilation and heat dissipation cavity 150 to improve the heat dissipation efficiency.

During specific implementation, the heat-inducing column 20 may be tubular, conical, or the like. As shown in FIG. 12 , the lamp of the present invention can also be made into a bulb shape.

As shown in Figures 13-16, it is another embodiment of the present invention.

A substrate with heat conduction and heat dissipation function includes a light source area 910 and a heat conduction and heat dissipation area 920 .

Several of the light source regions 910 are arranged on the substrate.

In a specific implementation, the heat conduction and heat dissipation area 920 is located between two adjacent light source areas 910 . The light source area 910 may be disposed on the surface of the substrate, and the light source area 910 may also be disposed in the substrate.

The light source area 910 is provided with an LED light-emitting body 930 .

The base plate is set in the bulb of the lamp, and the heat conduction and heat dissipation area 920 is abutted on the inner surface of the glass bulb wall.

The LED illuminator 930 is energized to emit light, and the light is radiated through the glass bulb wall. At this moment, the heat generated by the operation of the substrate mainly passes through the heat conduction and heat dissipation area 920 in the form of thermal radiation and is emitted through the glass bulb wall to achieve The role of heat dissipation for lamps.

As shown in FIGS. 13-14 , the LED light-emitting body 930 is a front-mounted LED light-emitting chip. In practice, several front-mounted LED light-emitting chips can be simultaneously arranged in the light source area 910 .

During specific implementation, a strengthening platform 911 may be provided under the light source area 910 .

As shown in FIGS. 15-16 , the LED light-emitting body 930 is an LED light bar, and the light source area 910 is a through groove.

The LED light bar is connected on the substrate, and the LED light source on the LED light bar is located in the through groove.

At this moment, the whole substrate can be designed as a temperature uniformity plate, such as a thick copper plate, or a plate body provided with a temperature uniformity material layer.

Other structures of the substrate in the embodiment shown in FIGS. 13-16 are the same as those in FIGS. 1-12 , and will not be repeated here.

It is also worth emphasizing that the direct replacement of traditional high-pressure sodium lamps and metal halide light sources with LED standard light sources has always been the goal pursued by LED developers. Based on the high power and large heat generation, the volume is limited and the heat dissipation surface is not enough. It has been impossible to achieve. Especially street lamps, because the lamp shells of traditional high-pressure sodium lamps and ceramic metal halide lamps have been incorporated into the urban road landscape, to replace the traditional LED street lamps, the entire lamp head must be replaced. First, the replacement cost is high, and second It is due to the influence of the heat dissipation design, and the shape cannot be arbitrarily designed.

Now the general practice is to set the filament strip in the central area of the glass and then pass it from helium to the glass. Due to the extremely low conductivity of helium (0.2W/c.m), the temperature difference between the chip and the glass is relatively large (about 40 degrees Celsius). ), when the temperature of the glass is 60 degrees, the temperature of the chip has reached or exceeded 100 degrees. In order to reduce this temperature difference, the design idea of the present invention can make the substrate of the light source as close to the glass wall as possible, preferably by high thermal conductivity. Dielectric filled, which transfers heat directly to the glass. Glass is a high radiation material, and the emissivity coefficient is as high as 0.94. According to Boltzmann's radiation law, the radiation intensity is proportional to the 4th power of the black body temperature. When it is close to the glass, the temperature of the glass is also close to 100 degrees, and the thermal radiation is nearly doubled, that is, the power can be nearly doubled under the same chip temperature. The specific design ideas are as follows.

As shown in FIG. 17 , the street light bulb shown in FIG. 17 is fabricated by using the substrate shown in FIGS. 13-16 , and the whole bulb can be in the shape of a circle, an ellipse, a flat plate, or the like.

The outer surface of the glass bulb wall 600 can be roughened, and the heat conduction and heat dissipation area 920 is abutted on the inner surface 610 of the glass bulb wall 600 .

A reflective layer may be provided on the surface of the light source region 910 to reflect the light of the LED light-emitting body 930 .

In addition, the near-infrared radiation layer 13 may be provided on the backside of the light source region 910 .

An infrared absorption layer 21 may be provided on the back of the heat conduction and heat dissipation area 920 .

The near-infrared radiation layer 13 can dissipate heat in the manner described above in this application.

In practice, part of the heat radiated by the radiation layer 13 is reflected, part is absorbed and dissipated by the top absorbing coating, and another part of the heat is conducted to the glass bulb wall and dissipated through the filled helium gas.

Claims (10)

1. A lamp with an electric, heat and radiation substrate is characterized in that: comprises an integral substrate and a lamp bulb, wherein the lamp bulb is provided with a sealed cavity, the integral substrate is arranged in the sealed cavity, a plurality of substrates are connected into the integral substrate through an insulating connector,

each substrate comprises a light source fixing part and a heat conduction and dissipation part, a plurality of light source fixing parts and a plurality of heat conduction and dissipation parts are connected together to form the substrate,

the light source fixing part is provided with an LED light source, the heat conduction and dissipation part is attached to the inner surface of the wall of the glass bulb,

the lamp bulb comprises the glass bulb wall and a glass bulb inner wall, the inner surface of the glass bulb wall and the outer surface of the glass bulb inner wall are used for surrounding to form the sealed cavity,

the LED light source is electrified to emit light, light rays irradiate out through the glass bulb wall, and heat generated by the work of the substrate is dissipated out through the heat conduction heat dissipation part and the glass bulb wall to dissipate heat of the lamp.

2. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 1, wherein: the light source fixing part is provided with a fixing top surface, the LED light source is arranged on the fixing top surface, the fixing top surface is a reflecting surface, part of light rays emitted by the LED light source directly irradiate out through the glass bulb wall, part of light rays are reflected by the inner surface of the glass bulb wall and finally irradiate out through the glass bulb wall after being reflected by the reflecting surface,

the heat-conducting heat-dissipating part is provided with a contact top surface, a plurality of contact ribs are convexly arranged on the contact top surface, and the contact ribs are contacted with the inner surface of the glass bulb wall.

3. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 1 or 2, wherein: the near-infrared radiation layer is disposed on the bottom surface of the substrate.

4. A lamp as claimed in claim 3, wherein: the insulating connector comprises a front fixing film and a back fixing film, wherein the front fixing film is adhered on the front surface of the integrated substrate, the back fixing film is adhered on the back surface of the integrated substrate,

the front fixing film is provided with a light source window, the back fixing film is provided with a lamp bead back radiation window, the fixing top surface of the light source fixing part and the LED light source are positioned in the light source window, and the near infrared radiation layer on the bottom surface of the substrate is positioned in the lamp bead back radiation window.

5. A lamp as claimed in claim 3, wherein: the lamp also comprises a heat-leading column which corresponds to the near-infrared radiation layer on the bottom surface of the substrate,

the heat-inducing column is used for absorbing the near infrared short wave emitted by the near infrared radiation layer,

when the near-infrared radiation layer works, heat is radiated outwards in the form of near-infrared short waves, at the moment, the heat-inducing columns absorb the near-infrared short waves, and meanwhile, the heat is radiated outwards by the heat-inducing columns.

6. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 5, wherein: an infrared absorption layer is arranged on the outer surface of the heat-leading column, an aerogel layer is further arranged on the outer surface of the heat-leading column, and the aerogel layer is arranged between the outer surface of the heat-leading column and the infrared absorption layer.

7. A lamp as claimed in claim 3, wherein: a ventilation and heat dissipation cavity is formed by surrounding the inner wall of the glass bulb and comprises an air inlet and an air outlet.

8. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 5, wherein: the integral substrate is arranged around the heat-conducting column in a surrounding mode, the integral substrate is electrified to emit light, current flowing in the integral substrate forms a spiral current along the spiral direction of the integral substrate, the spiral current forms a lamp strip magnetic field, the lamp strip magnetic field is located in the ventilation and heat dissipation cavity, the heat-conducting column is located in the lamp strip magnetic field, and the heat-dissipating efficiency of the heat-conducting column is improved by means of the lamp strip magnetic field.

9. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 7, wherein: the ventilation and heat dissipation cavity is internally provided with a fan.

10. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 1 or 2, wherein: each substrate is provided with a spring part, and when the substrate is bent, the spring parts can apply elastic acting force to the substrate, so that the heat-conducting and radiating part of the substrate is tightly attached to the inner surface of the glass bulb wall.

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