CN112105159B - Electroplating edge planing device for super-long special high-density printed circuit board - Google Patents
Electroplating edge planing device for super-long special high-density printed circuit board Download PDFInfo
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- CN112105159B CN112105159B CN202011042150.0A CN202011042150A CN112105159B CN 112105159 B CN112105159 B CN 112105159B CN 202011042150 A CN202011042150 A CN 202011042150A CN 112105159 B CN112105159 B CN 112105159B
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- printed circuit
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- 238000009713 electroplating Methods 0.000 title claims abstract description 55
- 238000005498 polishing Methods 0.000 claims abstract description 38
- 238000001035 drying Methods 0.000 claims description 21
- 239000000725 suspension Substances 0.000 claims description 16
- 238000005406 washing Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000005868 electrolysis reaction Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 2
- 239000003792 electrolyte Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating edge planing device for an ultra-long special high-density printed circuit board, and relates to the technical field of special electronic equipment instruments. The circuit boards with different specifications can be polished by the arranged polishing belt, so that the use efficiency is improved, and the problem that the edge planer cannot plane the circuit boards with different widths is effectively solved. And can promote the stores pylon through electronic pole and remove the conveyer belt top, reduce the distance between circuit board and the conveyer belt, conveniently place the conveyer belt with the circuit board on, improve the availability factor, effectively solve the inconvenient problem of circuit board removal, and effectively solve the inconvenient problem of anode plate installation.
Description
Technical Field
The invention relates to the technical field of special electronic equipment and instruments, in particular to an electroplating edge planing device for an overlong special high-density printed circuit board.
Background
The circuit board makes the circuit miniize, it is visual, play an important role in fixed circuit's batch production and optimization with electrical apparatus overall arrangement, when circuit board production, the lines that need remain with the circuit connection that counts are printed (corrosion-resistant medium) on the copper foil, dip in and corrode the copper foil that does not have protective coating in corrosive liquid, wash out the corrosivity raffinate, electroplate the circuit board afterwards and be used for protecting the lines, and dig the limit to the outer wall of circuit board and remove the burr, in order to accomplish processing, and present in order to satisfy the needs of various equipment, the circuit board also has different specifications, there is the miniaturely also has super long size type.
Present equipment, electroplate and often can place the circuit board in electrolyte, electroplate the circuit board through the electrolytic bath principle, but electroplate the back because current technology, can lead to the circuit board lateral wall to adhere to there is the burr, but because different circuit board width is different, the edge planer can not process the circuit board of difference, and the length of general overlength size circuit board is between eight hundred millimeters to two thousand millimeters, in the electroplating process, the anode plate can not be in the circuit board outside according to the even distribution of length of circuit board, it is not even when leading to the circuit board to electroplate, and add man-hour, can not be convenient remove the circuit board.
Disclosure of Invention
The invention aims to: in order to solve the problems that the edge planer cannot carry out edge planing on circuit boards with different widths, the circuit boards are not uniformly electroplated and the circuit boards are inconvenient to move, the electroplating edge planing device for the overlong special high-density printed circuit boards is provided.
In order to achieve the purpose, the invention provides the following technical scheme: an electroplating edge-planing device for an ultra-long special high-density printed circuit board comprises a base, wherein an electroplating mechanism is arranged at the top end of the base, anode hanging plates are arranged on two sides of the top end of the electroplating mechanism, each anode hanging plate comprises a supporting seat connected with the top end of the electroplating mechanism, a rotating plate is connected to the top end of the supporting seat, a spool is connected to the side face of the rotating plate, a plurality of groups of rotating grooves are formed in the outer wall of the spool, rotating rings are sleeved on the outer sides of the rotating grooves, hanging grooves are formed in the bottom ends of the rotating rings, anode plates are connected to the bottom ends of the hanging grooves, a water washing groove is connected to one side of the electroplating mechanism, a drying mechanism is arranged on one side of the water washing groove, which is far away from the electroplating mechanism, a conveying belt is arranged on one side of the drying mechanism, an edge-planing mechanism is sleeved on the outer side of the conveying belt, a discharge port is formed in the inner wall of the edge-planing mechanism, and traction rollers are arranged on two sides of the edge-planing mechanism, every group the tip of carry over pinch rolls all is connected with the gag lever post, the top of discharge port is located the inner wall of planing limit mechanism and has seted up the drive roll, the cylinder is installed to the below of discharge port in the inner wall of planing limit mechanism, the side-mounting of cylinder has the removal roller, the area of polishing has been cup jointed in the outside of drive roll, every group one side of gag lever post all is connected with return spring, drive mechanism has been seted up to the top of base, drive mechanism's bottom is located the top of base and installs the mechanism of hanging, hang the bottom of mechanism and install multiunit electric pole, every group the stores pylon has all been seted up to the output of electric pole, every group the tip of stores pylon all is connected with the carriage, multiunit cathode joint is installed to the output of electric pole, and cathode joint is located the top of every group stores pylon, the circuit board is installed on the top of stores pylon.
Preferably, the drain pipe has been seted up to the one end of electroplating mechanism, the one end of electroplating mechanism keeping away from the drain pipe has been seted up the overflow pipe, and the overflow pipe is located the top of drain pipe, the preheating tube has been seted up to the bottom of electroplating mechanism, the positive pole plug has been seted up to one side of supporting seat, and the positive pole plug is located the top of electroplating mechanism, the negative pole plug has been seted up to one side of supporting seat keeping away from the positive pole plug, and positive pole plug and negative pole plug all with external electrolysis power switch-on.
Preferably, the positive pole joint has been seted up to spool one end, the inside of spool is located the inner wall of rotary groove and has been seted up the electric piece that connects, the conducting ring has been seted up to the inner wall of rotary ring, and the bottom of conducting ring has seted up protruding piece, protruding piece runs through the rotary ring and extends to the inside of hanging the groove, protruding piece and the laminating of anode plate.
Preferably, the rotating shaft is arranged at the bottom end of the rotating plate, the rotating plate is rotatably connected with the supporting seat through the rotating shaft, and the rotating groove is rotatably connected with the line pipe through the rotating ring.
Preferably, the top of drying mechanism sets up the groove of slipping that matches with suspension mechanism, the multiunit flexible glue piece has been seted up to the inner wall of groove of slipping, the air inlet has all been seted up at drying mechanism's both ends, the gas vent has been seted up to drying mechanism's bottom, the multiunit fan has been seted up to drying mechanism's inside, and the multiunit fan is located the both sides of groove of slipping, every group all install the multiunit heating pipe between fan and the air inlet.
Preferably, the two sides of the traction mechanism, which are positioned on the base, are both provided with a high-bar frame, the top end of the high-bar frame is provided with a traction motor, and the output end of the traction motor is connected with a crawler belt.
Preferably, the top end of the hanging mechanism is provided with a clamping plate, the hanging mechanism is connected with the crawler belt in a clamping manner through the clamping plate, one side of the hanging mechanism is provided with an electricity receiving port, the end part of the electricity receiving port is connected with a cathode wire, and the cathode wire is communicated with each group of cathode connectors.
Preferably, the motor is installed to one side of planing limit mechanism, and the output of motor runs through the outer wall of planing limit mechanism and extends to the inside of planing limit mechanism, the drive roll is connected with the output of motor.
Preferably, every group the tip of gag lever post all is connected with return spring, and the gag lever post passes through return spring and the inner wall sliding connection who digs limit mechanism, every group the outer wall of gag lever post all is connected with two sets of carry over pinch rolls, the area block of polishing is between two sets of carry over pinch rolls.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention firstly puts the electroplated circuit board on the conveyor belt through the arranged edge planing mechanism and the conveyor belt, conveys the circuit board into the edge planing mechanism through the conveyor belt, firstly adjusts the polishing belt according to the width of the circuit board, firstly, the cylinder is started, the output end of the cylinder drives the moving roller to move, when the moving roller moves downwards, the moving roller stretches the polishing belt, the tension in the polishing belt is increased, the polishing belt contracts inwards and pulls a plurality of groups of traction rollers to approach each other, the limiting rod extrudes the return spring, thereby reducing the space between the polishing belts, when the output end of the cylinder moves upwards, the output end of the cylinder drives the moving roller to move upwards, the tension on the polishing belt is reduced, the polishing belt contracts, the return spring pushes the limiting rod to move, the limiting rod drives the moving roller to stretch the polishing belt, and the polishing belt can keep tight, therefore, the circuit boards with different specifications can be polished by the polishing belt, the use efficiency is improved, and the problem that the edge planer cannot plane the circuit boards with different widths is effectively solved;
2. through the anode hanging plate, the rotating plate, the line pipe, the rotating ring and the hanging groove, when the circuit board is electroplated, firstly, a proper number of anode plates are selected according to the length of the circuit board, the anode plate is clamped and connected with the rotary ring through the hanging groove, then the rotary plate is pushed to drive the wire tube to move downwards, the rotary ring rotates at the outer side of the wire tube through the rotary groove to enable the anode plate to be vertically inserted into the electroplating solution, the anode plates can be uniformly distributed on two sides of the circuit board, then the anode plug is inserted into the anode connector, the wire tube is communicated with the anode of the electrolytic power supply, the wire tube is communicated with the conducting ring through the electric connecting pieces arranged on the two sides, and the conducting ring is communicated with the anode plates through the protruding pieces arranged at the bottom ends, so that the electron flow can be facilitated, the anode plates can be communicated with the power supply, the subsequent electroplating process is facilitated, and the problem of inconvenience in installation of the anode plates is effectively solved;
3. through the arranged traction mechanism, the suspension mechanism, the electric rod, the hanging frame and the moving frame, when the circuit board needs to be moved, the circuit board is firstly placed in the plurality of groups of hanging frames, the moving frame is pushed to extrude the outer wall of the circuit board, one side of the circuit board is contacted with the cathode joint, the cathode joint is communicated with the power connection port through the cathode wire, the cathode plug is spliced with the power connection port, the cathode wire is communicated with the electrolytic power supply, so that the circuit board forms the cathode in the electrolytic cell, the moving frame can be adjusted according to the width of the circuit board, so that the hanging frame can simultaneously hang different circuit boards, when the circuit board needs to be moved, the traction motor is started, the traction motor drives the track to rotate, the track drives the hanging frame to move through the clamping plate, when the hanging frame is arranged above the electroplating mechanism or the rinsing bath, the electric rod is started, so that the electric rod pushes the hanging frame and the circuit board to descend, make the circuit board can soak in electrolyte or washing liquid, conveniently process the circuit board, and when the stores pylon removed the conveyer belt top, electronic pole can promote the stores pylon and remove the conveyer belt top, reduces the distance between circuit board and the conveyer belt, conveniently places the conveyer belt with the circuit board on, improves the availability factor, has effectively solved the inconvenient problem of circuit board removal.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal structure of the electroplating mechanism according to the present invention;
FIG. 3 is a schematic view of a conduit structure according to the present invention;
FIG. 4 is a schematic cross-sectional view of the electrical contact of the present invention;
FIG. 5 is a schematic cross-sectional view of an electroplating mechanism according to the present invention;
FIG. 6 is a schematic view of the suspension mechanism of the present invention;
FIG. 7 is a schematic view of the internal structure of the drying mechanism according to the present invention;
FIG. 8 is a schematic structural view of the edge planer mechanism of the present invention;
FIG. 9 is a schematic view of the inner wall structure of the edge planer of the present invention;
fig. 10 is a schematic view of a mounting structure of a stopper rod according to the present invention.
In the figure: 1. a base; 2. an electroplating mechanism; 201. a drain pipe; 202. an overflow pipe; 203. a preheating pipe; 204. an anode plug; 205. a cathode plug; 3. an anode hanging plate; 301. a supporting seat; 302. rotating the plate; 303. a conduit; 304. rotating the ring; 305. an anode tap; 306. rotating the groove; 307. connecting a power strip; 308. conducting rings; 309. a projecting piece; 310. hanging a groove; 4. a rinsing bath; 5. a drying mechanism; 501. sliding into the groove; 502. a soft film; 503. a fan; 504. heating a tube; 505. an air inlet; 506. an exhaust port; 6. a suspension mechanism; 601. an electric rod; 602. a clamping plate; 603. an electric connection port; 604. a hanger; 605. a movable frame; 606. a cathode line; 607. a cathode terminal; 7. an edge planing mechanism; 701. a motor; 702. a drive roll; 703. polishing the belt; 704. a traction roller; 705. a cylinder; 706. a moving roller; 707. a limiting rod; 708. a return spring; 709. an outlet port; 8. a conveyor belt; 9. a traction mechanism; 901. a traction motor; 902. a crawler belt; 903. a high pole frame; 10. an anode plate; 11. a circuit board.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-10, an electroplating edge-shaving device for an ultra-long special high-density printed circuit board comprises a base 1, an electroplating mechanism 2 is disposed at the top end of the base 1, anode hanging plates 3 are disposed on both sides of the top end of the electroplating mechanism 2, each anode hanging plate 3 comprises a supporting seat 301 connected to the top end of the electroplating mechanism 2, the top end of the supporting seat 301 is connected to a rotating plate 302, a spool 303 is connected to the side surface of the rotating plate 302, a plurality of sets of rotating grooves 306 are disposed on the outer wall of the spool 303, a rotating ring 304 is sleeved on the outer side of the rotating groove 306, a hanging groove 310 is disposed at the bottom end of the rotating ring 304, an anode plate 10 is connected to the bottom end of the hanging groove 310, a washing groove 4 is connected to one side of the electroplating mechanism 2, a drying mechanism 5 is disposed on one side of the washing groove 4 away from the electroplating mechanism 2, a conveyor belt 8 is disposed on one side of the drying mechanism 5, an edge-shaving mechanism 7 is sleeved on the outer side of the conveyor belt 8, and a discharge port 709 is disposed on the inner wall of the edge-shaving mechanism 7, the two sides of the discharge port 709 are provided with traction rollers 704 on the inner wall of the edge planing mechanism 7, the end of each group of traction rollers 704 is connected with a limit rod 707, the upper part of the discharge port 709 is provided with a drive roller 702 on the inner wall of the edge planing mechanism 7, the lower part of the discharge port 709 is provided with an air cylinder 705 on the inner wall of the edge planing mechanism 7, the side surface of the air cylinder 705 is provided with a movable roller 706, the outer side of the drive roller 702 is sleeved with a polishing belt 703, one side of each group of limit rod 707 is connected with a return spring 708, the upper part of the base 1 is provided with a traction mechanism 9, the bottom end of the traction mechanism 9 is provided with a suspension mechanism 6 on the upper part of the base 1, the bottom end of the suspension mechanism 6 is provided with a plurality of groups of electric rods 601, the output end of each group of electric rods 601 is provided with a hanging frame 604, the end of each group of hanging frame 604 is connected with a movable frame 605, the output end of each group of electric rods 601 is provided with a plurality of cathode connectors 607, and the cathode connectors 607 are positioned at the top end of each group of hanging frame 604, the top end of the hanger 604 is mounted with the circuit board 11.
Please refer to fig. 2, a drain pipe 201 is disposed at one end of the electroplating mechanism 2, an overflow pipe 202 is disposed at one end of the electroplating mechanism 2 away from the drain pipe 201, the overflow pipe 202 is located above the drain pipe 201, a preheating pipe 203 is disposed at a bottom end of the electroplating mechanism 2, an anode plug 204 is disposed at one side of the supporting base 301, the anode plug 204 is located at a top end of the electroplating mechanism 2, a cathode plug 205 is disposed at one side of the supporting base 301 away from the anode plug 204, the anode plug 204 and the cathode plug 205 are both connected to an external electrolytic power source, the electroplating mechanism 2 is filled with an electrolyte, the anode plate 10 is inserted into the electrolyte during the electroplating process, the circuit board 11 is placed into the electrolyte, and the circuit board 11 can be electroplated after being powered on.
Please refer to fig. 3 and 4, an anode connector 305 is disposed at one end of the conduit 303, a power connection tab 307 is disposed on an inner wall of the rotary slot 306 inside the conduit 303, a conductive ring 308 is disposed on an inner wall of the rotary ring 304, a protrusion 309 is disposed at a bottom end of the conductive ring 308, the protrusion 309 penetrates the rotary ring 304 and extends into the hanging slot 310, the protrusion 309 is attached to the anode plate 10, and the anode plate 10 can be contacted with an anode of the electrolytic power supply through the conductive ring 308 and the protrusion 309, thereby facilitating the processing.
Please refer to fig. 4, the bottom end of the rotating plate 302 is provided with a rotating shaft, the rotating plate 302 is rotatably connected with the supporting seat 301 through the rotating shaft, the rotating groove 306 is rotatably connected with the conduit 303 through the rotating ring 304, when the rotating plate 302 changes position, the rotating ring 304 can rotate in the rotating groove 306, so that the anode plate 10 is always kept in a vertical state.
Please refer to fig. 1 and fig. 6, a sliding groove 501 matched with the hanging mechanism 6 is formed at the top end of the drying mechanism 5, a plurality of sets of flexible films 502 are formed on the inner wall of the sliding groove 501, air inlets 505 are formed at both ends of the drying mechanism 5, an air outlet 506 is formed at the bottom end of the drying mechanism 5, a plurality of sets of fans 503 are formed inside the drying mechanism 5, the plurality of sets of fans 503 are located at both sides of the sliding groove 501, a plurality of sets of heating pipes 504 are installed between each set of fans 503 and the air inlets 505, and the cleaned circuit board 11 is dried to facilitate subsequent edge planing processing.
Please refer to fig. 1, the two sides of the base 1 of the traction mechanism 9 are both provided with a high-bar frame 903, the top end of the high-bar frame 903 is provided with a traction motor 901, the output end of the traction motor 901 is connected with a track 902, and the traction mechanism 9 can move the suspension mechanism 6, thereby facilitating the movement of the suspension mechanism 6.
Please refer to fig. 6, the top end of the suspension mechanism 6 is provided with a clamping plate 602, the suspension mechanism 6 is clamped and connected with the caterpillar 902 through the clamping plate 602, one side of the suspension mechanism 6 is provided with an electric connection port 603, the end of the electric connection port 603 is connected with a cathode wire 606, and the cathode wire 606 is connected with each group of cathode connectors 607, so that the circuit board 11 can be connected with the cathode of the electrolytic power supply, thereby facilitating the electroplating of the circuit board 11.
Please refer to fig. 9, a motor 701 is installed at one side of the edge planer mechanism 7, an output end of the motor 701 penetrates through an outer wall of the edge planer mechanism 7 and extends into the edge planer mechanism 7, a driving roller 702 is connected to an output end of the motor 701, and the motor 701 can provide power for the polishing belt 703, so that the polishing belt 703 polishes the circuit board 11.
Please refer to fig. 8 and 10, the end of each set of limiting rod 707 is connected to a return spring 708, the limiting rod 707 is slidably connected to the inner wall of the edge planer 7 through the return spring 708, the outer wall of each set of limiting rod 707 is connected to two sets of pulling rollers 704, and the polishing belt 703 is clamped between the two sets of pulling rollers 704, so that the pulling rollers 704 can clamp the polishing belt 703, and the polishing belt 703 changes the interval therebetween, thereby facilitating polishing different polishing belts 703.
The working principle is as follows: when the device is used, firstly, the circuit board 11 is placed in a plurality of groups of hangers 604, the movable frame 605 is pushed, the movable frame 605 extrudes the outer wall of the circuit board 11, one side of the circuit board 11 is contacted with the cathode connector 607, the cathode connector 607 is communicated with the power connection port 603 through the cathode wire 606, the cathode plug 205 is plugged with the power connection port 603, the cathode wire 606 is communicated with the electrolytic power supply, so that the circuit board 11 forms a cathode in an electrolytic cell, the movable frame 605 can be adjusted according to the width of the circuit board 11, so that different circuit boards 11 can be simultaneously hung by the hangers 604, when the circuit board 11 needs to be moved, the traction motor 901 is started, the traction motor 901 drives the crawler belt to rotate, the crawler belt 902 drives the hangers 604 to move through the clamping plate 602, when the hanging rack 604 is arranged above the electroplating mechanism 2 or the rinsing bath 4, the electric rod 601 is started, the electric rod 601 drives the hanging rack 604 and the circuit board 11 to descend, the circuit board 11 can be soaked in electrolyte or cleaning liquid, the circuit board 11 is convenient to process, and when the hanging rack 604 moves above the conveyor belt 8, the electric rod 601 can drive the hanging rack 604 to move above the conveyor belt 8, the distance between the circuit board 11 and the conveyor belt 8 is reduced, the circuit board 11 is convenient to place on the conveyor belt 8, the use efficiency is improved, when the circuit board 11 is electroplated, firstly, according to the length of the circuit board 11, a proper number of anode plates 10 are selected, the anode plates 10 are clamped and connected with the swivel 304 through the hanging bath 310, then, the swivel plate 302 is driven to drive the line tube 303 to move downwards, the swivel plate 304 rotates outside the line tube 303 through the swivel tank 306, the anode plates 10 can be vertically inserted into the electroplating liquid, the anode plates 10 can be uniformly distributed on two sides of the circuit board 11, then the anode plug 204 is inserted into the anode joint, the conduit 303 is communicated with the anode of the electrolytic power supply, the conduit 303 is communicated with the conductive ring 308 through the electric connecting pieces 307 arranged on the two sides, the conductive ring 308 is communicated with the anode plate 10 through the protruding piece 309 arranged at the bottom end, the electron flow can be facilitated, the anode plate 10 can be communicated with the power supply, then the circuit board 11 is put into the electrolyte through the hanging rack 604, the circuit board 11 is electrified through the cathode plug 205, so that metal ions in the electrolyte are electrified and attached to the outer wall of the circuit board 11, the circuit board 11 is electroplated, after the electroplating is finished, the hanging rack 604 enters the drying mechanism 5, the fan 503 and the heating pipe 504 are started, outside air is sucked through the air inlet 505, the circuit board 11 is dried through hot air, and moist air flow is discharged through the air outlet 506, putting the electroplated circuit board 11 on a conveyor belt 8, conveying the circuit board 11 into a beveling mechanism 7 through the conveyor belt 8, firstly adjusting the polishing belt 703 according to the width of the circuit board 11, firstly starting an air cylinder 705, driving a moving roller 706 to move by the output end of the air cylinder 705, when the moving roller 706 moves downwards, enabling the moving roller 706 to stretch the polishing belt 703, increasing the tension in the polishing belt 703, enabling the polishing belt 703 to contract inwards and pulling a plurality of groups of traction rollers 704 to approach each other, enabling a limiting rod 707 to extrude a return spring 708, thereby reducing the space between the polishing belts 703, facilitating the polishing of the circuit board 11 with smaller width, when the output end of the air cylinder 705 moves upwards, driving the moving roller 706 to move upwards by the output end of the air cylinder 705, reducing the tension on the polishing belt 703, enabling the polishing belt 703 to contract, enabling the return spring 708 to push the limiting rod 707 to move, enabling the limiting rod 707 to drive the moving roller 706 to stretch the polishing belt 703, make the area of polishing 703 can keep tight, conveniently polish to the great circuit board 11 of width to make the area of polishing 703 can polish to the circuit board 11 of different specifications, remove circuit board 11 under the drive of conveyer belt 8 between the area of polishing 703 that finishes of regulation, the area of polishing 703 and the laminating of circuit board 11 outer wall, the area of polishing 703 is polished circuit board 11 in the pivoted, and the circuit board 11 that polishes passes through.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
1. The utility model provides an extra long special type high density printed circuit board electroplates device of digging limit, includes the base, its characterized in that: the electroplating mechanism is arranged at the top end of the base, anode hanging plates are arranged on two sides of the top end of the electroplating mechanism, each anode hanging plate comprises a supporting seat connected with the top end of the electroplating mechanism, a rotating plate is connected to the top end of the supporting seat, a spool is connected to the side face of the rotating plate, a plurality of groups of rotating grooves are formed in the outer wall of the spool, a rotating ring is sleeved on the outer side of each rotating groove, a hanging groove is formed in the bottom end of each rotating ring, an anode plate is connected to the bottom end of each hanging groove, a water washing groove is connected to one side of the electroplating mechanism, a drying mechanism is arranged on the side, away from the electroplating mechanism, of the water washing groove, a conveying belt is arranged on one side of the drying mechanism, an edge planing mechanism is sleeved on the outer side of the conveying belt, a discharge port is formed in the inner wall of the edge planing mechanism, traction rollers are arranged on the inner wall of the two sides of the discharge port, and the end part of each traction roller is connected with a limiting rod, the top of discharge port is located the inner wall of planing limit mechanism and has seted up the drive roll, the cylinder is installed in the inner wall of planing limit mechanism to the below of discharge port, the side-mounting of cylinder has the removal roller, the area of polishing has been cup jointed in the outside of drive roll, every group one side of gag lever post all is connected with return spring, drive mechanism has been seted up to the top of base, drive mechanism's bottom is located the top of base and installs suspension mechanism, hang the bottom of mechanism and install multiunit electric pole, every group the stores pylon has all been seted up to electric pole's output, every group the tip of stores pylon all is connected with the carriage release, multiunit cathode joint is installed to electric pole's output, and cathode joint is located the top of every group stores pylon, the circuit board is installed on the top of stores pylon.
2. The electroplating beveling device for the overlong special high-density printed circuit board as claimed in claim 1, wherein: the one end of electroplating the mechanism has seted up the drain pipe, the one end of electroplating the mechanism and keeping away from the drain pipe has seted up the overflow pipe, and the overflow pipe is located the top of drain pipe, the preheating tube has been seted up to electroplating the bottom of mechanism, the positive pole plug has been seted up to one side of supporting seat, and the positive pole plug is located the top of electroplating the mechanism, the negative pole plug has been seted up to one side that the positive pole plug was kept away from to the supporting seat, and positive pole plug and negative pole plug all with external electrolysis switch-on.
3. The electroplating beveling device for the overlong special high-density printed circuit board as claimed in claim 1, wherein: the positive pole joint has been seted up to spool one end, the inside of spool is located the inner wall of rotary groove and has seted up the connection piece, the conducting ring has been seted up to the inner wall of swivel, and the bottom of conducting ring has seted up protruding piece, protruding piece runs through the swivel and extends to the inside of hanging the groove, protruding piece and anode plate laminating.
4. The electroplating beveling device for the overlong special high-density printed circuit board as claimed in claim 1, wherein: the bottom of commentaries on classics board has seted up the pivot, the commentaries on classics board rotates through pivot and supporting seat to be connected, the rotary trough rotates through change ring and spool to be connected.
5. The electroplating beveling device for the overlong special high-density printed circuit board as claimed in claim 1, wherein: the sliding groove that matches with the mechanism that hangs is seted up on drying mechanism's top, the multiunit flexible glue piece has been seted up to the inner wall of sliding groove, drying mechanism's both ends have all been seted up the air inlet, the gas vent has been seted up to drying mechanism's bottom, drying mechanism's inside has been seted up the multiunit fan, and the multiunit fan is located the both sides of sliding groove, every group all install the multiunit heating pipe between fan and the air inlet.
6. The electroplating beveling device for the overlong special high-density printed circuit board as claimed in claim 1, wherein: the high-pole frame is arranged on two sides of the base of the traction mechanism, the traction motor is arranged at the top end of the high-pole frame, and the output end of the traction motor is connected with the crawler belt.
7. The electroplating beveling device for the overlong special high-density printed circuit board as claimed in claim 6, wherein: the suspension mechanism is characterized in that a clamping plate is arranged at the top end of the suspension mechanism, the suspension mechanism is connected with the crawler belt in a clamping mode through the clamping plate, an electricity receiving port is arranged on one side of the suspension mechanism, a cathode wire is connected to the end portion of the electricity receiving port, and the cathode wire is connected with each group of cathode connectors.
8. The electroplating beveling device for the overlong special high-density printed circuit board as claimed in claim 1, wherein: the motor is installed to one side of planing limit mechanism, and the output of motor runs through the outer wall of planing limit mechanism and extends to the inside of planing limit mechanism, the drive roll is connected with the output of motor.
9. The electroplating beveling device for the overlong special high-density printed circuit board as claimed in claim 1, wherein: every group the tip of gag lever post all is connected with return spring, and the gag lever post passes through return spring and the inner wall sliding connection who digs limit mechanism, every group the outer wall of gag lever post all is connected with two sets of carry over pinch rolls, the band block of polishing is between two sets of carry over pinch rolls.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011042150.0A CN112105159B (en) | 2020-09-28 | 2020-09-28 | Electroplating edge planing device for super-long special high-density printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011042150.0A CN112105159B (en) | 2020-09-28 | 2020-09-28 | Electroplating edge planing device for super-long special high-density printed circuit board |
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| CN112105159B true CN112105159B (en) | 2021-11-30 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1360089A (en) * | 2000-12-20 | 2002-07-24 | 张简志贞 | Electroplating device for circuit board |
| CN1742119A (en) * | 2003-01-23 | 2006-03-01 | 株式会社荏原制作所 | Plating device and plating method |
| CN207904406U (en) * | 2018-02-06 | 2018-09-25 | 深圳市亿方电子有限公司 | A kind of circuit board electroplating production line |
| CN208414599U (en) * | 2018-06-05 | 2019-01-22 | 江西旭昇电子有限公司 | horizontal electroplating device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9677190B2 (en) * | 2013-11-01 | 2017-06-13 | Lam Research Corporation | Membrane design for reducing defects in electroplating systems |
-
2020
- 2020-09-28 CN CN202011042150.0A patent/CN112105159B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1360089A (en) * | 2000-12-20 | 2002-07-24 | 张简志贞 | Electroplating device for circuit board |
| CN1742119A (en) * | 2003-01-23 | 2006-03-01 | 株式会社荏原制作所 | Plating device and plating method |
| CN207904406U (en) * | 2018-02-06 | 2018-09-25 | 深圳市亿方电子有限公司 | A kind of circuit board electroplating production line |
| CN208414599U (en) * | 2018-06-05 | 2019-01-22 | 江西旭昇电子有限公司 | horizontal electroplating device |
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| CN112105159A (en) | 2020-12-18 |
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Effective date of registration: 20211110 Address after: 224700 Xindong village, east of provincial road 231, economic development zone, Jianhu County, Yancheng City, Jiangsu Province Applicant after: Jiangsu Yanhai electroplating Center Co., Ltd Address before: 510000 plant 1, No. 10, Bangsheng 2nd Road, Jinghu Avenue, Xinhua Street, Huadu District, Guangzhou, Guangdong Applicant before: Guangzhou Wanchang audio Co., Ltd |
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