CN112103239A - Device for clamping silicon wafer in visual detection process of silicon wafer - Google Patents
Device for clamping silicon wafer in visual detection process of silicon wafer Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
Description
技术领域technical field
本发明涉及半导体制造技术领域,尤其涉及一种用于在硅片目视检测过程中夹持硅片的装置。The invention relates to the technical field of semiconductor manufacturing, in particular to a device for clamping silicon wafers during visual inspection of silicon wafers.
背景技术Background technique
随着信息时代的高速发展,社会对于电子芯片的需求量急速增长,与此同时,人们对于制作芯片的原材料硅片的质量要求也越来越高。With the rapid development of the information age, the society's demand for electronic chips has grown rapidly. At the same time, people have higher and higher requirements for the quality of silicon wafers, the raw material for making chips.
硅片的生产制造过程中可能会在硅片上产生缺陷,包括崩边、划痕、裂纹等,这些缺陷又会给下游的进一步生产利用带来极大的风险,因此对于硅片进行全方位的检验至关重要。对于300mm硅片来说,目视检查是一种重要的缺陷检测方法,该方法是指将强光灯产生的光束照射至硅片表面,同时对硅片表面及边缘部位中的被光束照亮的区域进行人眼目视检查,以将有缺陷的硅片拦截。During the manufacturing process of silicon wafers, defects may occur on the silicon wafers, including edge chipping, scratches, cracks, etc. These defects will bring great risks to further downstream production and utilization. inspection is crucial. For 300mm silicon wafers, visual inspection is an important defect detection method. This method refers to irradiating the beam generated by a strong light to the surface of the silicon wafer, and at the same time, the surface and edge of the silicon wafer are illuminated by the beam. The area is visually inspected by human eyes to intercept defective silicon wafers.
在人眼目视检查过程中,需要利用夹持装置对硅片进行夹持。然而,现有的夹持装置存在以下缺点:夹持装置的卡爪是通过与硅片的周缘接触来实现夹持的,卡爪的与硅片周缘邻近的部分会遮挡目视检测人员的视线,因此会产生检测盲区,造成夹持区域的漏检现象;而且另一方面,强光灯产生的光束不可避免地会照射在与硅片接触的卡爪上,由此形成强烈的反光,影响目视检测人员对缺陷的判断。这些情况都会造成存在缺陷的硅片进入下游生产工序,进而造成更大的生产损失。In the process of visual inspection by human eyes, it is necessary to use a clamping device to clamp the silicon wafer. However, the existing clamping device has the following disadvantages: the clamping claw of the clamping device realizes clamping by contacting the peripheral edge of the silicon wafer, and the part of the clamping claw adjacent to the peripheral edge of the silicon wafer will block the sight of the visual inspection personnel , so there will be a detection blind area, resulting in missed detection in the clamping area; on the other hand, the light beam generated by the strong light will inevitably irradiate on the claw in contact with the silicon wafer, thus forming a strong reflection, affecting Visual inspection personnel's judgment of defects. These situations can cause defective wafers to enter downstream production processes, resulting in greater production losses.
发明内容SUMMARY OF THE INVENTION
为解决上述技术问题,本发明实施例期望提供一种用于在硅片目视检测过程中夹持硅片的装置,能够避免检测盲区的形成,实现无死角地对硅片的周缘部位进行检测。In order to solve the above technical problems, the embodiments of the present invention are expected to provide a device for clamping silicon wafers during the visual inspection of silicon wafers, which can avoid the formation of detection blind spots and realize the detection of peripheral parts of silicon wafers without dead ends. .
本发明的技术方案是这样实现的:The technical scheme of the present invention is realized as follows:
本发明实施例提供了一种用于在硅片目视检测过程中夹持硅片的装置,所述装置可以包括:An embodiment of the present invention provides a device for clamping a silicon wafer during visual inspection of a silicon wafer, and the device may include:
设置在所述硅片的不同直径方向上的至少两个卡爪对,每个卡爪对能够在与所述硅片的周缘接触以夹持所述硅片的夹持位置与离开所述硅片的周缘以松开所述硅片的松开位置之间移动;At least two pairs of jaws arranged in different diameter directions of the silicon wafer, each pair of jaws can be in contact with the periphery of the silicon wafer to clamp the silicon wafer at a clamping position and away from the silicon wafer the periphery of the wafer to release the silicon wafer to move between the release positions;
用于保持所述至少两个卡爪对的保持架,所述保持架设置有用于引导所述卡爪对在所述夹持位置与所述松开位置之间移动的移动引导部;a holder for holding the at least two pairs of jaws, the holder being provided with a movement guide for guiding the pair of jaws to move between the clamping position and the releasing position;
用于每个卡爪对的弹性复位构件,当所述卡爪对处于所述松开位置时,所述弹性复位构件产生将所述卡爪对复位至所述夹持位置的弹性回复力;an elastic reset member for each pair of jaws, which generates an elastic restoring force that resets the pair of jaws to the clamping position when the pair of jaws is in the release position;
与垂直于所述硅片的中心轴线同轴设置的凸轮,所述凸轮具有长轴和短轴;a cam arranged coaxially perpendicular to the central axis of the silicon wafer, the cam has a long axis and a short axis;
驱动机构,所述驱动机构用于使所述至少两个卡爪对与所述凸轮之间产生绕所述中心轴线的相对旋转运动,使得所述卡爪对能够处于与所述凸轮的长轴对准的第一相对位置以及与所述凸轮的短轴对准的第二相对位置,在所述第一相对位置中,所述凸轮抵抗所述弹性复位构件产生的弹性回复力将所述卡爪对保持在所述松开位置,在所述第二相对位置中,所述凸轮不对所述卡爪对产生作用。A driving mechanism, the driving mechanism is used to generate a relative rotational movement around the central axis between the at least two pairs of jaws and the cam, so that the pair of jaws can be positioned at the long axis of the cam an aligned first relative position and a second relative position aligned with the stub axis of the cam in which the cam pushes the card against an elastic return force generated by the elastic return member The pair of pawls remains in the released position, and in the second relative position, the cam does not act on the pair of pawls.
本发明实施例提供了一种用于在硅片目视检测过程中夹持硅片的装置,可以实现所述至少两个卡爪对交替地或顺序地对硅片进行夹持或松开,而且由于所述至少两个卡爪对设置在硅片的不同直径方向上,因此可以通过接触硅片的周缘中的不同的部位实现夹持,这样,当一个卡爪对由于与硅片的边缘中的第一部位接触而产生检测盲区,或者由于反射强光灯产生的光束而形成强烈反光时,可以通过另一卡爪对与硅片的边缘中的第二部位接触而对硅片进行夹持,而所述一个卡爪对可以远离硅片的边缘,由此消除其产生的检测盲区,并且使其不再形成强烈反光。The embodiment of the present invention provides a device for clamping a silicon wafer during a visual inspection of a silicon wafer, which can realize that the at least two pairs of jaws can clamp or release the silicon wafer alternately or sequentially, Moreover, since the at least two pairs of jaws are arranged in different diameter directions of the silicon wafer, clamping can be achieved by contacting different parts of the periphery of the silicon wafer. When the first part of the silicon wafer is in contact with the detection blind area, or the light beam generated by the reflected strong light forms a strong reflection, the silicon wafer can be clamped by contacting the second part of the edge of the silicon wafer through another pair of jaws. and the one pair of jaws can be kept away from the edge of the silicon wafer, thereby eliminating the detection blind area produced by it, and making it no longer form strong reflections.
附图说明Description of drawings
图1为本发明实施例提供的一种用于在硅片目视检测过程中夹持硅片的装置的俯视示意图;FIG. 1 is a schematic top view of a device for clamping a silicon wafer during visual inspection of a silicon wafer according to an embodiment of the present invention;
图2为本发明实施例提供的一种用于在硅片目视检测过程中夹持硅片的装置的正视示意图;FIG. 2 is a schematic front view of a device for clamping a silicon wafer during visual inspection of a silicon wafer according to an embodiment of the present invention;
图3为本发明实施例提供的一种用于在硅片目视检测过程中夹持硅片的装置的工作过程的示意图,其中凸轮从图1中示出的位置旋转至图示位置;3 is a schematic diagram of a working process of an apparatus for clamping a silicon wafer during a visual inspection of a silicon wafer according to an embodiment of the present invention, wherein the cam rotates from the position shown in FIG. 1 to the position shown in the figure;
图4为本发明实施例提供的一种用于在硅片目视检测过程中夹持硅片的装置的工作过程的示意图,其中凸轮从图3中示出的位置旋转至图示位置;4 is a schematic diagram of a working process of a device for clamping a silicon wafer during a visual inspection of a silicon wafer according to an embodiment of the present invention, wherein the cam rotates from the position shown in FIG. 3 to the position shown in the figure;
图5为本发明实施例提供的一种用于在硅片目视检测过程中夹持硅片的装置的工作过程的示意图,其中凸轮从图4中示出的位置旋转至图示位置;5 is a schematic diagram of a working process of an apparatus for clamping a silicon wafer during a visual inspection of a silicon wafer according to an embodiment of the present invention, wherein the cam rotates from the position shown in FIG. 4 to the position shown in the figure;
图6为本发明实施例提供的一种用于在硅片目视检测过程中夹持硅片的装置的工作过程的示意图,其中凸轮从图5中示出的位置旋转至图示位置;6 is a schematic diagram of a working process of an apparatus for clamping a silicon wafer during a visual inspection of a silicon wafer according to an embodiment of the present invention, wherein the cam rotates from the position shown in FIG. 5 to the position shown in the illustration;
图7为本发明实施例提供的一种用于在硅片目视检测过程中夹持硅片的装置的工作过程的示意图,其中凸轮从图6中示出的位置旋转至图示位置;7 is a schematic diagram of a working process of an apparatus for clamping a silicon wafer during a visual inspection of a silicon wafer according to an embodiment of the present invention, wherein the cam rotates from the position shown in FIG. 6 to the position shown in the figure;
图8为本发明实施例提供的一种用于在硅片目视检测过程中夹持硅片的装置的凸轮的长轴与光束的照亮区域的位置关系的示意图;8 is a schematic diagram of the positional relationship between the long axis of a cam of a device for holding a silicon wafer during visual inspection of a silicon wafer and an illuminated area of a light beam according to an embodiment of the present invention;
图9为本发明实施例提供的另一种用于在硅片目视检测过程中夹持硅片的装置的俯视示意图;FIG. 9 is a schematic top view of another device for clamping silicon wafers during visual inspection of silicon wafers according to an embodiment of the present invention;
图10为本发明实施例提供的一种用于在硅片目视检测过程中夹持硅片的装置的正视示意图,其中详细地示出了卡爪半部的杆部和抵接部。FIG. 10 is a schematic front view of an apparatus for clamping a silicon wafer during visual inspection of a silicon wafer according to an embodiment of the present invention, wherein the rod part and the abutting part of the jaw half are shown in detail.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
参见图1和图2,本发明实施例提供了一种在硅片W的目视检测过程中夹持硅片W的装置100,其中图1中通过虚线圆形示意性地示出该硅片W,所述装置100可以包括:Referring to FIG. 1 and FIG. 2 , an embodiment of the present invention provides an
设置在所述硅片W的不同直径方向上的至少两个卡爪对110,其中,图1中示例性地示出了三个卡爪对110,即第一卡爪对110-1、第二卡爪对110-2和第三卡爪对110-3,并且如在图1中示出的,第一卡爪对110-1包括两个卡爪半部110-1A和110-1B,第二卡爪对110-2包括两个卡爪半部110-2A和110-2B,第三卡爪对110-3包括两个卡爪半部110-3A和110-3B,每个卡爪对110能够在与所述硅片W的周缘接触以夹持所述硅片W的夹持位置与离开所述硅片W的周缘以松开所述硅片W的松开位置之间移动,如在图1中示出的,第一卡爪对110-1处于松开位置,而第二卡爪对110-2和第三卡爪对110-3处于夹持位置;At least two pairs of
用于保持所述至少两个卡爪对110的保持架120,所述保持架120设置有用于引导所述卡爪对110在所述夹持位置与所述松开位置之间移动的移动引导部121,其中,图1中仅示意性地示出了用于引导卡爪半部110-1A的移动引导部121,可以理解的是,该移动引导部121例如可以是形成在保持架120中的通孔或凹槽;A
用于每个卡爪对110的弹性复位构件130,当所述卡爪对110处于所述松开位置时,所述弹性复位构件130产生将所述卡爪对110复位至所述夹持位置的弹性回复力;A
与垂直于所述硅片W的中心轴线X同轴设置的凸轮140,所述凸轮140具有长轴L和短轴S,如在图1中通过点划线示出的;A
如在图2中示出的驱动机构150,所述驱动机构150用于使所述至少两个卡爪对110与所述凸轮140之间产生绕所述中心轴线X的相对旋转运动,使得所述卡爪对110能够处于与所述凸轮140的长轴L对准的第一相对位置以及与所述凸轮140的短轴S对准的第二相对位置,其中图1中示出了凸轮140的长轴L与卡爪对110对准的情形,图5中示出了凸轮140的短轴S与卡爪对110对准的情形,在所述第一相对位置中,所述凸轮140抵抗所述弹性复位构件130产生的弹性回复力将所述卡爪对110保持在所述松开位置,在所述第二相对位置中,所述凸轮140不对所述卡爪对110产生作用。As shown in the
下文中以凸轮140顺时针旋转以产生所述至少两个卡爪对110与凸轮140之间的相对旋转运动为例对装置100的工作过程进行详细描述。Hereinafter, the working process of the
参见图3,凸轮140从图2中示出的位置(通过虚线示出)旋转至图3中示出的位置(通过实线示出)。在此过程中,凸轮140的长轴L逐渐偏离卡爪对110-1,由此,卡爪对110-1在弹性复位构件130产生的弹性回复力的作用下沿着径向向内的方向移动,直至抵靠凸轮140上的与卡爪对110-1对准的部位。Referring to FIG. 3 , the
参见图4,凸轮140从继续从图3中示出的位置(通过虚线示出)旋转至图4中示出的位置(通过实线示出)。在此过程中,卡爪对110-1进一步在弹性复位构件130产生的弹性回复力的作用下沿着径向向内的方向移动,直至与硅片W的周缘接触而处于夹持位置,此时卡爪对110-1仍然抵靠在凸轮140上。Referring to FIG. 4 , the
参见图5,凸轮140继续从图4中示出的位置(通过虚线示出)旋转至图5中示出的位置(通过实线示出),即凸轮140的短轴S与卡爪对110-1对准。在此过程中,卡爪对110-1由于与硅片W的周缘接触而无法进一步径向向内移动,而凸轮140上的与卡爪对110-1对准的部位与卡爪对110-1之间的距离逐渐增大,或者说凸轮140不对卡爪对110-1产生作用。Referring to FIG. 5 , the
参见图6,凸轮140继续从图5中示出的位置(通过虚线示出)旋转至图6中示出的位置(通过实线示出),即刚刚再次抵靠卡爪对110-1,而在此过程中卡爪对110-1一直没有受到凸轮140的作用因此一直处于夹持位置或者说没有产生沿径向方向的移动。Referring to Figure 6, the
参见图7,凸轮140继续从图6中示出的位置(通过虚线示出)旋转至图7中示出的位置(通过实线示出)。在此过程中,凸轮140的长轴L逐渐靠近卡爪对110-1,由此,凸轮140逆着弹性复位构件130产生的弹性回复力使卡爪对110-1沿着径向向外的方向移动。Referring to Figure 7, the
最后,凸轮140从图7中示出的位置旋转至图1中示出的位置,在此过程中,卡爪对110-1进一步沿着径向向外的方向移动,直至与凸轮140的长轴L对准,如在图1中示出的。Finally, the
综上所述,在凸轮140旋转一周的过程中,卡爪对110-1能够实现对硅片W的夹持和松开,而另一方面,由于在硅片W的不同直径方向上设置有至少两个卡爪对110,因此可以理解的是所述至少两个卡爪对110也能够实现对硅片W的夹持和松开。由此,可以实现所述至少两个卡爪对110交替地或顺序地对硅片W进行夹持或松开,而且由于所述至少两个卡爪对110设置在硅片W的不同直径方向上,因此可以通过接触硅片W的周缘中的不同的部位实现夹持,这样,当一个卡爪对110由于与硅片W的边缘中的第一部位接触而产生检测盲区,或者由于反射强光灯产生的光束而形成强烈反光时,可以通过另一卡爪对110与硅片W的边缘中的第二部位接触而对硅片W进行夹持,而所述一个卡爪对110可以远离硅片W的边缘,由此消除其产生的检测盲区,并且使其不再形成强烈反光。To sum up, in the process of one rotation of the
对于装置100中凸轮140的形状,参见图1,在本发明的优选实施例中,所述凸轮140在平行于所述硅片W的平面中的截面可以呈椭圆形。椭圆形是具有长轴和短轴的,而且构成椭圆形的曲线是平顺或者说光滑的,由此可以使卡爪对110平稳地在径向方向上移动,或者说不会使卡爪对110在沿着径向方向移动的过程中产生速度突变。For the shape of the
在本发明的优选实施例中,所述至少两个卡爪对110可以在所述硅片W的周向方向上均匀分布。例如,在图1中示出的三个卡爪对110的情况下,相邻的两个卡爪对110在硅片W的周向方向上的夹角可以为60度,又例如在装置100包括四个卡爪对110的情况下(附图中未示出),相邻的两个卡爪对110在硅片W的周向方向上的夹角可以为45度,以此类推。与非均匀分布的卡爪对相比,均匀分布的卡爪对能够实现对硅片W的更稳定的夹持。In a preferred embodiment of the present invention, the at least two
在本发明的优选实施例中,所述至少两个卡爪对110中的一个卡爪对110处于所述松开位置时,其他卡爪对110处于所述夹持位置。换言之,在所述至少两个卡爪对110与凸轮140之间进行相对旋转运动的过程中,只有一对卡爪对110是处于松开位置的,这样,可以通过尽可能多的卡爪对110对硅片进行夹持,有利于夹持的稳定性。可以理解的是,上述方案可以通过根据硅片W的直径合理地选择凸轮140的长轴L和短轴S的长度以及卡爪对110在硅片W的径向方向上的长度而容易地实现。例如从图3和图6中可以看出,图中绘制的凸轮140的长轴L和短轴S的长度以及卡爪对110在硅片W的径向方向上的长度即可实现上述方案。更具体地,如在图3和图6中示出的,当凸轮140抵靠第一卡爪对110-1时,第二卡爪对110-2和第三卡爪对110-3与凸轮140之间都存在间隙。In a preferred embodiment of the present invention, when one
对于所述至少两个卡爪对110与凸轮140之间的相对旋转运动的实现方式,在本发明的一个示例中,所述至少两个卡爪对110是固定不动的,而所述驱动机构150驱动所述凸轮140绕所述中心轴线X相对于所述至少两个卡爪对110旋转,由此以简单方式实现所述至少两个卡爪对110与凸轮140之间的相对旋转运动。For the realization of the relative rotational movement between the at least two pairs of
在实践中,用于目视检测硅片的强光灯产生的光束仅会照亮硅片的部分区域而不是全部,而通常强光灯是固定不动的或者说强光灯产生的光束是不产生移动的,因此,需要使硅片进行旋转以使光束能够照亮硅片的全部区域,因此,在本发明的优选实施例中,所述凸轮140是固定不动的,而所述驱动机构150驱动所述至少两个卡爪对110绕所述中心轴线X相对于所述凸轮140旋转。由此,被卡爪对110夹持的硅片W会一起进行旋转,使得硅片W的全部区域都能够被光束照亮。In practice, the light beam generated by the strong light used for visual inspection of silicon wafers will only illuminate part of the wafer but not all, and usually the strong light is fixed or the light beam generated by the strong light is There is no movement, therefore, the silicon wafer needs to be rotated so that the light beam can illuminate the entire area of the silicon wafer. Therefore, in the preferred embodiment of the present invention, the
在卡爪对110与硅片W一起旋转的情况下,所希望的是,如图8所示,当卡爪半部110-1A顺时针旋转进入到被强光灯产生的光束照亮的区域(通过阴影示出的)中时,第一卡爪对110-1是处于松开位置的,以对硅片W的周缘中的与卡爪半部110-1A对应的部位进行检查,或者使卡爪半部110-1A不产生反光,因此,在本发明的优选实施例中,参见图8,所述凸轮140的长轴L的延伸长线与照亮所述硅片W的周缘的光束相交。With the pair of
可以理解的是,对于上述的弹性复位构件130,可以有多种实现方式,比如弹性复位构件130可以是设置在卡爪对110的两个卡爪半部之间的比如处于拉伸状态的螺旋弹簧,然而,在本发明的优选实施例中,参见图1,所述弹性复位构件130包括用于每个卡爪对110的每个卡爪半部的螺旋弹簧,所述螺旋弹簧的第一端部固定连接至所述保持架120,所述螺旋弹簧的第二端部固定连接至所述卡爪半部。通过这种设置方式,不仅可以使卡爪对110整体处于夹持位置和松开位置,而且可以使每个卡爪半部处于夹持位置和松开位置。It can be understood that, for the above-mentioned
当卡爪对110在松开位置和夹持位置之间移动时,卡爪对会沿着凸轮140的表面滑动,为了使这种滑动以更有利的方式进行,在本发明的优选实施例中,参见图9,每个卡爪对110-1、110-2和110-3的每个卡爪半部110-1A、110-1B、110-2A、110-2B、110-3A、110-3B设置有滚轮随动件111,所述滚轮随动件111构造成在所述至少两个卡爪对110与所述凸轮140相对旋转运动的过程中在所述凸轮140的表面滚动。When the
上述卡爪半部可以有多种实现方式,在本发明的优选实施例中,参见图10每个卡爪对110的每个卡爪半部包括杆部112和抵接部113,所述杆部112平行于所述硅片W延伸,所述抵接部113设置在所述杆部112的径向向外的端部处并且垂直于所述杆部112延伸以在所述卡爪对110处于所述夹持位置中时与所述硅片W的边缘接触。The above-mentioned jaw halves can be implemented in various ways. In a preferred embodiment of the present invention, referring to FIG. 10 , each jaw half of each
需要说明的是:本发明实施例所记载的技术方案之间,在不冲突的情况下,可以任意组合。It should be noted that the technical solutions described in the embodiments of the present invention may be combined arbitrarily unless there is a conflict.
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention. should be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.
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Effective date of registration: 20241120 Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Country or region after: China Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Country or region before: China |