CN112100973A - Mirror image via hole inspection and replacement method based on ALLEGRO software - Google Patents

Abstract

The invention discloses a mirror image via hole inspection and replacement method based on ALLEGRO software, which is characterized in that an inspection and replacement tool of a mirror image via hole is arranged in the ALLEGRO software, the inspection and replacement tool acquires a mirror image via hole list to be replaced according to requirements, and replaces the original mirror image via hole with a non-mirror image via hole by copying original via hole attribute data, deleting the original via hole, creating a new via hole, copying via hole attribute to the new via hole, thereby avoiding the test problem and the process problem caused by the mirror image via hole, ensuring the test efficiency and the product yield, automatically acquiring the mirror image via hole, providing a one-key replacement function of replacing a single via hole or all via holes, reducing the workload of designers caused by the mirror image via hole, improving the design efficiency and shortening the research and development period.

Description

A replacement method for mirrored via inspection based on ALLEGRO software

technical field

The invention relates to the technical field of PCB design, and more particularly, to a method for checking and replacing mirrored via holes based on ALLEGRO software.

Background technique

In the field of PCB board design, especially for server communication boards, test points are usually added on the R&D PCB board during R&D and design to test the function of the board in the later stage, which is convenient for debugging, improves design efficiency and shortens the R&D cycle. . In order to obtain better and more comprehensive debugging data, a large number of test points need to be provided, and the test point density is high. In the process of PCB board design, if there are mirrored test points, it is easy to cause incorrect selection of measuring tools during testing, which may lead to problems in testing. In addition, in some designs, the via pads close to the BGA side are required to be smaller than the via pads farther from the BGA. Since BGAs are all devices with high pitch density of electronic components, it is required that the small via pads are all on the same The safe distance can be guaranteed only on the side. If there are mirrored vias, the distance between the vias and the pins is too small, the production process is difficult to meet, and the board products produced will have the risk of short circuit. In this case, the mainstream software ALLEGRO for PCB board design does not have the inspection function for the problem of via mirroring. Designers need to export the coordinates of test points or vias and check them one by one, which increases the workload of designers and reduces design. Efficiency, lengthen the research and development cycle, and greatly improve the cycle used to produce products.

The above is insufficient and needs to be improved.

SUMMARY OF THE INVENTION

In order to overcome the deficiencies of the prior art, the present invention provides a replacement method for mirrored via inspection based on ALLEGRO software.

The technical scheme of the present invention is as follows:

A method of checking and replacing mirrored vias based on ALLEGRO software, creating a checking and replacing tool in ALLEGRO software, the checking and replacing tool obtains all the via information in the PCB file and records it in the first list, and according to the requirements of the checking options, the The vias that meet the requirements of the inspection options and are mirror controls are recorded in the second list. According to the requirements of the replacement options, extract the properties of the vias that meet the replacement options in the second list, delete the original vias, and create new vias. hole and copy the extracted via properties to the new via.

The above-mentioned mirrored via inspection and replacement method based on ALLEGRO software, the creation steps of the inspection and replacement tool include:

Step A1. Create a check and replace tool command and set the command window of the check and replace tool;

Step A2. Check replacement tool settings Check selection and replacement selection, check selection includes only test via check and all via check, replacement selection includes single via replacement and all via replacement, all checks The selection item and the replacement selection item both set the initial value respectively;

Step A3. Check the replacement tool to obtain all the via information in the PCB file and record it in the first list.

The above-mentioned method for checking and replacing mirrored vias based on ALLEGRO software, the step of checking the mirrored vias with the replacement tool includes:

Step B1. Receive an inspection order;

Step B2. The inspection options include the test via inspection item and all via inspection items. According to the comparison of the existing feedback value of the test via inspection item and all via inspection items with the initial value, determine the test via inspection item and all via inspection items. The selection state of the via inspection item, if the test via inspection item is in the selected state, go to step B3-1; if all the via inspection items are in the selected state, go to step B3-2;

Step B3-1. Determine whether the vias in the first list are mirrored controls one by one, and determine whether the vias in the first list contain test hole attributes. If the vias are both mirrored controls and test hole attributes, record the in the second list;

Step B3-2. Determine whether the vias in the first list are mirrored controls one by one, and if the vias are mirrored controls, record them in the second list.

Further, in step B2, the feedback value of the test via inspection item is the same as the initial value, the test via inspection item is in the selected state, the feedback value of the test via inspection item is different from the initial value, and the test via inspection item is not. In the selected state; the feedback value of all via inspection items is the same as the initial value, all via inspection items are in the selected state, the feedback value of all via inspection items is different from the initial value, and all via inspection items are not in the selected state.

Further, in step B3-1 or step B3-2, check the initial setting of the count value of the replacement tool, the count value is initially zero, and each time a mirrored via is determined, the count value is incremented by one, in step B3-1 or step B3 After -2, display the final count value in the count column.

Further, after step B3-1 or step B3-2, the center coordinates of all vias in the second list are acquired one by one, and the vias in the second list are displayed and highlighted in the display list according to the set format.

Further, according to the selection state of the via hole in the display list, the corresponding via hole center coordinate is obtained, and the display window of the PCB file is scaled with the coordinate as the center.

The above-mentioned method for checking and replacing mirrored vias based on ALLEGRO software, the step of checking and replacing the mirrored vias with a replacement tool includes:

Step C1. Receive a replacement command;

Step C2. The replacement options include a single via replacement item and all via replacement items. According to the comparison of the existing feedback values of the single via replacement item and all via replacement items with the initial value, determine the single via replacement item and all via replacement items. The selection state of the via replacement item, if the single via replacement item is in the selected state, execute step C3-1; if all the via replacement items are in the selected state, execute step C3-2;

Step C3-1 includes

Step C3-1-1. Determine the vias in the selected state in the second list;

Step C3-1-2. Obtain via information;

Step C3-1-3. Delete vias;

Step C3-1-4. Create a new via and copy the original via information to the new via;

Step C3-2 includes

Step C3-2-1. Obtain the information of the via holes in the second list;

Step C3-2-2. Delete the original via;

Step C3-2-3. Create a new via and copy the original via information to the new via;

Step C3-2-4. Cycle Step C3-2-1 to Step C3-2-3.

Further, in step C2, the feedback value of the single-via replacement item is the same as the initial value, the single-via replacement item is in the selected state, the feedback value of the single-via replacement item is different from the initial value, and the single-via replacement item is not. In the selected state; the feedback value of all via replacement items is the same as the initial value, all via replacement items are in the selected state, the feedback value of all via replacement items is different from the initial value, and all via replacement items are not in the selected state.

The above-mentioned mirrored via inspection and replacement method based on ALLEGRO software, the inspection and replacement tool judges whether the via is a mirrored control through the mirroring keyword. If the via attribute contains the mirroring keyword, the via is a mirroring control. The hole attribute does not contain the mirror keyword, and the via is not a mirror control.

According to the present invention of the above scheme, the beneficial effect is that the present invention sets up a mirrored via inspection and replacement tool in the ALLEGRO software, and the inspection and replacement tool obtains a list of mirrored vias to be replaced as required, and by copying the original via attribute data- The process of deleting original vias - creating new vias - copying via properties to new vias replaces the original mirrored vias with non-mirrored vias to avoid test problems and processes caused by mirrored vias The inspection and replacement tool can automatically obtain mirrored vias, provide single via replacement or one-key replacement of all vias, and reduce the workload of designers due to mirrored vias, thereby improving design efficiency. Shorten the development cycle.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for the present invention. In some embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

FIG. 1 is a flow chart of the present invention.

Figure 2 is a flow chart for the creation of the inspection and replacement tool.

FIG. 3 is an inspection flow chart for inspecting the replacement tool.

FIG. 4 is a flow chart of the replacement of the inspection replacement tool.

FIG. 5 is a schematic diagram of the window interface structure of the mirrored via inspection replacement tool.

FIG. 6 is a schematic diagram of the structure before the mirrored via is replaced.

FIG. 7 is a schematic diagram of the structure after the mirrored via is replaced.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

It should be noted that when a component is referred to as "disposing" another component, it can be directly or indirectly located on the other component. The terms "first", "second", etc. are only used for the purpose of description, and should not be construed as indicating or implying relative importance or implying indicating the number of technical features. "Several" means one or more than one, unless expressly specifically defined otherwise.

An inspection and replacement method of mirrored vias based on ALLEGRO software, as shown in Figure 1, creates an inspection and replacement tool in ALLEGRO software, and the inspection and replacement tool obtains all the via information in the PCB file and records it in the first list, and selects it according to the inspection According to the requirement indication of the replacement option, the vias that meet the requirements of the inspection option and are mirror controls are recorded in the second list, and according to the requirement indication of the replacement option, the via properties that meet the replacement option in the second list are extracted, and the original one is deleted. Via, creates a new via and copies the extracted via properties to the new via.

As shown in Figure 2, Figure 3, and Figure 4, the steps for creating and replacing a mirrored via inspection tool include:

Step A1. Create the Check Replace Tool command and set the Check Replace tool's command window.

Step A2. Check replacement tool settings Check selection and replacement selection, check selection includes only test via check and all via check, replacement selection includes single via replacement and all via replacement, all checks The selection item and the replacement selection item both set the initial value respectively.

In the ALLEGRO software, use the axlCmdRegister function to create the check and replace tool command, and use the axlFormSetField function, axlUIWPrint function, etc. to set the window interface of the check and replace tool, as shown in Figure 5.

The check and replace tool window includes a selection area (Options), a count bar (Number), a display list, a replacement area (Change), and several selection function buttons. Among them, there are two single selection items set in the selection area, namely, only test vias inspection items and all vias inspection items. The former only checks the vias with test hole properties, and the latter checks all the vias in the PCB file. The Count column shows the number of mirrored vias that the Check Replace tool checked out on demand. The inspection result is displayed in the display list, that is, the list of mirrored vias in the PCB file obtained after inspection as required. The format includes serial number, via network name and via coordinates, as shown in Figure 6 and Figure 7. Two single options are set in the replacement area, namely the single via replacement item and the all via replacement item. All vias shown in the list. The function buttons include a check command button (Check) and a replacement command button (Change). After the user selects in the selection area, click the check command button to make the check replacement tool execute the check command; after the user selects in the replacement area, click the replacement command button. , instructs the Check Replace tool to execute the replace command.

Step A3. Check the replacement tool to obtain all the via information in the PCB file and record it in the first list. Check and replace tool by opening VIA CLASS/TOP (via top layer) and VIA CLASS/BOTTOM (via bottom layer) pay attention to get all the via information in the PCB file. Therefore, designers need to Open the VIA (via) level so that the inspection replacement tool can obtain via information as a data basis for later runs.

Step B1. Receive an inspection order. The designer issues a check command to the check replacement tool through the check command button. After clicking the check command button, the check replacement tool starts the check module and performs the screening check function for the vias in the first list.

Step B2. According to the comparison between the existing feedback values of the test via inspection item and all via inspection items and the initial value, determine the selection status of the test via inspection item and all via inspection items. When the state is selected, go to step B3-1, and if all the via inspection items are in the selected state, go to step B3-2.

Step B3-1. Determine whether the vias in the first list are mirrored controls one by one, and determine whether the vias in the first list contain test hole attributes. If the vias are both mirrored controls and test hole attributes, record the in the second list.

Step B3-2. Determine whether the vias in the first list are mirrored controls one by one, and if the vias are mirrored controls, record them in the second list.

In step B3-1 or step B3-2, the inspection and replacement tool captures the mirror keyword in the PCB file through the isMirrored function for vias that include mirrored attributes, and judges whether the via is a mirrored via. The mirrored via has a mirror keyword in its attributes. The isMirrored function captures the mirror keyword (t, 'GEOMETRY) and outputs the feedback value according to the presence or absence of the mirror keyword. Check the replacement tool to obtain the feedback value of the isMirrored function as "" t", it is determined that the via is a mirrored via, and if the feedback value of the isMirrored function is "nil", it is determined that the via is not a mirrored via. For the test hole attribute, the test hole attribute is determined by judging whether the via belongs to the test hole set. If the via hole is included in the test hole set, the via hole contains the test hole attribute. Test hole properties are not included.

In step B3-1 or step B3-2, check the initial setting count value, each time a mirrored via is determined, the count value is incremented by one. Display the final count value in the count column.

After step B3-1 or step B3-2, after the second list is obtained, the center coordinates of all vias in the list are obtained in a loop one by one, and the display format is set at the same time, and displayed one by one in the display list. In addition, all vias in the second list are highlighted through the axlHighlightObject function, which is convenient for designers to find related vias.

After the vias in the second list are displayed in the display list, the designer chooses to obtain the selection items in the display list through the axlFormListGetSelItems function, extract the coordinate information of the selected vias, split them, use the axlSingleSelectPoint function to lock the coordinates, and then use the axlSingleSelectPoint function to lock the coordinates. Taking this coordinate as the center, zoom through the axlZoomToDbid function, so that the PCB display window is enlarged to display the selected via hole, which is convenient for designers to find and modify in the next step.

Step C1. Receive a replacement command. The designer issues replacement commands to the Check Replace tool through the Replace Command button. After clicking the Replace command button, the Check Replace tool starts the Replace module and performs the replace function on the vias in the first list.

Step C2. According to the comparison between the existing feedback values of the single via replacement item and all the via replacement items and the initial value, determine the selection status of the single via replacement item and all the via replacement items. When the state is selected, step C3-1 is performed, and if all via replacement items are in the selected state, step C3-2 is performed.

Step C3-1 includes

Step C3-1-1. Determine the vias in the selected state in the second list.

Step C3-1-2. Obtain via information.

Step C3-1-3. Delete vias.

Step C3-1-4. Create a new via and copy the original via information to the new via.

Step C3-2 includes

Step C3-2-1. Obtain the information of the via holes in the second list.

Step C3-2-2. Delete the original via.

Step C3-2-3. Create a new via and copy the original via information to the new via.

Step C3-2-4. Cycle Step C3-2-1 to Step C3-2-3.

In step C3-1 or step C3-2, whether it is for a single via in the selected state or for all vias in the second list, the inspection and replacement tool first extracts the attribute data of the via, including the pad name, net Name, via coordinates, via type, etc., temporarily store these attribute data, then delete the original via through the axlDeleteObject function, create a new via with the axlDBCreateVia function, and copy the previously extracted attribute data to the newly created via. hole, where the test hole attribute is re-assigned by the axlTestPoint function. As such, the newly created vias are not mirrored vias, and the Check Replace tool does a good job of replacing mirrored vias. In step C3-2, the next via operation is performed only after the inspection and replacement tool completes the process of extracting the properties of a via hole - deleting the original via hole - creating a new via hole - copying the properties of the via hole. After the replacement function is completed, that is, step C3-1-4 or step C3-2-4 lags, the check replacement tool performs a pop-up prompting that the replacement work has been completed.

In step C3-1-2 or step C3-2-1, when the via hole is a test via hole, since normally, the test symbol of the test hole exists in TOP (top layer) or BOTTOM (bottom layer), therefore, In the process of acquiring test via information, it is necessary to first determine whether the via contains test attributes. If it contains test attributes, it is necessary to obtain the test symbol of the corresponding via from the top or bottom layer to copy it to the new test hole attribute. , so as to ensure the integrity and correctness of the test hole properties.

In step A2, step B2 and step C2, all options are set with initial values. Since the options in each step are single-choice, and they are all two-choice situations, the initial value setting of options includes selection and Two cases are not selected. When the test via check item is selected, the feedback value of the selected item is the same as the initial value, and the check replacement tool executes the test via check; if the test via check item is not selected, the feedback value is different from the initial value. The Check Replacement tool performs all via checks. Similarly, when all via inspection items are selected, the feedback value of the selected item is the same as the initial value, and the inspection and replacement tool executes all via inspections; if all via inspection items are not selected, the feedback value of the selected item is The value is different from the initial value, and the check replacement tool performs a test via check. In step C2, when the single via replacement item is in the selected state, the feedback value is the same as the initial value, and the inspection and replacement tool executes the single via replacement function. On the contrary, when the single via replacement item is not in the selected state, the feedback value is the same as the initial value. Differently, the Check Replace tool performs all via replacement functions. When all via replacement items are selected, the feedback value is the same as the initial value, and the check replacement tool executes all via replacement functions; when all via replacement items are not selected, the feedback value is different from the initial value, and the check replacement tool executes a single Via replacement function.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

Claims (10)

1. A mirror image via hole inspection and replacement method based on ALLEGRO software is characterized in that an inspection and replacement tool is created in the ALLEGRO software, the inspection and replacement tool acquires all via hole information in a PCB file and records the via hole information in a first list, via holes meeting the requirements of inspection options and serving as mirror image controls are recorded in a second list according to the requirements of inspection options, via hole attributes meeting the requirements of replacement options in the second list are extracted according to the requirements of the replacement options, original via holes are deleted, new via holes are created, and the extracted via hole attributes are copied to the new via holes.

2. The method of claim 1, wherein the step of creating a check-and-replace tool comprises:

a1, creating a command for checking a replacement tool and setting a command window for checking the replacement tool;

a2, setting an inspection selection item and a replacement selection item by an inspection replacement tool, wherein the inspection selection item comprises only a testing via hole inspection item and all via hole inspection items, the replacement selection item comprises a single via hole replacement item and all via hole replacement items, and all the inspection selection items and all the replacement selection items are respectively set with initial values;

and A3, the inspection replacement tool acquires all via hole information in the PCB file and records the via hole information in the first list.

3. The method of claim 1, wherein the step of inspecting the mirror via of the replacement tool comprises inspecting the mirror via of the replacement tool

Step B1, receiving a checking command;

b2, checking the selection items including a test via hole check item and all via hole check items, judging the selection states of the test via hole check item and all via hole check items according to the comparison of the existing feedback values of the test via hole check item and all via hole check items with the initial values, executing the step B3-1 if the test via hole check item is in the selected state, and executing the step B3-2 if all via hole check items are in the selected state;

step B3-1, judging whether the via holes in the first list are mirror image controls one by one, judging whether the via holes in the first list contain test hole attributes, and recording the via holes in the second list if the via holes are mirror image controls and contain test hole attributes;

and step B3-2, judging whether the via holes in the first list are mirror image controls one by one, and if the via holes are mirror image controls, recording the via holes in the second list.

4. The mirror via inspection replacement method based on ALLEGRO software as claimed in claim 3, wherein in step B2, the feedback value of the test via inspection item is the same as the initial value, the test via inspection item is in the selected state, the feedback value of the test via inspection item is not the same as the initial value, and the test via inspection item is not in the selected state; the feedback values of all the via hole checking items are the same as the initial values, all the via hole checking items are in a selection state, the feedback values of all the via hole checking items are different from the initial values, and all the via hole checking items are not in the selection state.

5. The method of claim 3, wherein in step B3-1 or step B3-2, the replacement tool is checked to set a count value initially to zero, the count value is incremented every time a mirror via is determined, and the final count value is displayed in the count field after step B3-1 or step B3-2.

6. The method as claimed in claim 3, wherein after step B3-1 or step B3-2, the center coordinates of all vias in the second list are obtained one by one, and the vias in the second list are displayed and highlighted in the display list according to a set format.

7. The method as claimed in claim 6, wherein the coordinates of the center of the corresponding via hole are obtained according to the selection status of the via hole in the display list, and the display window of the PCB file is scaled by using the coordinates as the center.

8. The method of claim 1, wherein the step of checking the replacement tool to replace the mirrored via comprises:

step C1, receiving a replacement command;

c2. replacement selection items comprise a single via hole replacement item and all via hole replacement items, the selection states of the single via hole replacement item and all via hole replacement items are judged according to the comparison of the existing feedback values of the single via hole replacement item and all via hole replacement items with the initial values, if the single via hole replacement item is in the selected state, the step C3-1 is executed, and if all via hole replacement items are in the selected state, the step C3-2 is executed;

step C3-1 includes

Step C3-1-1, determining the via hole in the second list in the selected state;

step C3-1-2, obtaining the information of the via hole;

c3-1-3, deleting the via hole;

step C3-1-4, creating a new via hole and copying the original via hole information to the new via hole;

step C3-2 includes

Step C3-2-1, obtaining the information of the via holes in the second list;

c3-2-2, deleting the original via hole;

step C3-2-3, creating a new via hole and copying the original via hole information to the new via hole;

step C3-2-4. step C3-2-1 to step C3-2-3 are cycled.

9. The mirror via inspection replacement method based on allegoro software as claimed in claim 8, wherein in step C2, the feedback value of the single via replacement is the same as the initial value, the single via replacement is in the selected state, the feedback value of the single via replacement is not the same as the initial value, and the single via replacement is not in the selected state; the feedback values of all the via hole replacement items are the same as the initial values, all the via hole replacement items are in a selection state, the feedback values of all the via hole replacement items are different from the initial values, and all the via hole replacement items are not in the selection state.

10. The method as claimed in claim 1, wherein the inspection and replacement tool determines whether the via is a mirror control by using a mirror keyword, and if the via attribute contains the mirror keyword, the via is the mirror control, and if the via attribute does not contain the mirror keyword, the via is not the mirror control.

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