CN112085137A - Implantable RFID tag device for detecting temperature - Google Patents
Implantable RFID tag device for detecting temperature Download PDFInfo
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- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
- G06K19/0717—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being capable of sensing environmental conditions such as temperature history or pressure
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- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
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- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2215/00—Details concerning sensor power supply
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Abstract
Description
技术领域technical field
本申请涉及可植入设备领域,尤其涉及一种用于检测温度的可植入RFID标签装置。The present application relates to the field of implantable devices, and in particular, to an implantable RFID tag device for detecting temperature.
背景技术Background technique
动物健康情况通过量体温判断,市场上有水银体温计,电子体温计。相关技术中,通过可穿戴式电子耳标,采用蓝牙技术加温度传感器加纽扣电池,表皮接触测温。其依靠温度传感器和耳皮接触,获得表皮温度,由于受到环境影响不代表真实温度。另外,穿戴式电子耳标脱落率高达百分之六十。Animal health is judged by measuring body temperature. There are mercury thermometers and electronic thermometers on the market. In the related art, through the wearable electronic ear tag, using Bluetooth technology, temperature sensor and button battery, the skin contact temperature is measured. It relies on the contact between the temperature sensor and the ear skin to obtain the skin temperature, which does not represent the real temperature due to the influence of the environment. In addition, the shedding rate of wearable electronic ear tags is as high as 60%.
本申请发明人发现,可植入设备能够检测体内温度,另外不易脱落。而相关技术中的电子温度计等体积较大,难以植入。并且,由于某些电子元件有毒有害,无法或不适宜长期在动物体内使用。并且,可植入设备在供电和通信性能上存在诸多问题。The inventors of the present application found that the implantable device can detect the body temperature and is not easy to fall off. However, the electronic thermometer in the related art is relatively bulky and difficult to implant. Moreover, because some electronic components are toxic and harmful, they cannot or are not suitable for long-term use in animals. In addition, implantable devices have many problems in power supply and communication performance.
发明内容SUMMARY OF THE INVENTION
为了解决上述技术问题或者至少部分地解决上述技术问题,本申请提供了一种用于检测温度的可植入RFID标签装置。In order to solve the above technical problems or at least partially solve the above technical problems, the present application provides an implantable RFID tag device for detecting temperature.
本申请提供的一种用于检测温度的可植入RFID标签装置,包括:介质基板,介质基板的介电常数介于100至300之间,损耗角小于等于0.05%;天线,天线为印制在介质基板上的微带天线,天线被设置为在被植入时接触检测实体,以使检测实体充当部分天线振子;温度传感器;RFID标签芯片,与天线及温度传感器耦合,被设置为从温度传感器获取温度数据,并通过天线发送温度数据及RFID标签的ID;以及,供电电路,与天线耦合,设置为向温度传感器和RFID标签芯片提供电力,供电电路包括:虚拟电池,包括设置于介质基板上的第一电极以及第二电极,虚拟电池被设置为存储在天线获得的电力信号;电荷泵电路,位于天线与虚拟电池之间,被设置为提升在天线获得的电力信号的电动势,以向虚拟电池充电。An implantable RFID tag device for detecting temperature provided by the present application includes: a dielectric substrate, the dielectric constant of the dielectric substrate is between 100 and 300, and the loss angle is less than or equal to 0.05%; an antenna, the antenna is printed A microstrip antenna on a dielectric substrate, the antenna being arranged to contact the detection entity when implanted so that the detection entity acts as part of the antenna element; a temperature sensor; an RFID tag chip, coupled to the antenna and the temperature sensor, arranged to receive temperature from the The sensor acquires temperature data, and sends the temperature data and the ID of the RFID tag through the antenna; and a power supply circuit, coupled with the antenna, is configured to provide power to the temperature sensor and the RFID tag chip, and the power supply circuit includes: a virtual battery, including a power supply circuit arranged on the medium substrate On the first electrode and the second electrode, the virtual battery is set to store the power signal obtained at the antenna; the charge pump circuit, located between the antenna and the virtual battery, is set to boost the electromotive force of the power signal obtained at the antenna to send Virtual battery charging.
在某些实施例中,温度传感器,被设置为植入检测实体时至少部分接接触检测实体,以检测检测实体的温度。In some embodiments, a temperature sensor, configured to be implanted in the detection entity at least partially contacts the detection entity, to detect the temperature of the detection entity.
在某些实施例中,可植入RFID标签装置还包括:防腐蚀涂层,设置在天线上;或者,天线为防腐蚀金属。In some embodiments, the implantable RFID tag device further includes: a corrosion-resistant coating disposed on the antenna; or, the antenna is a corrosion-resistant metal.
在某些实施例中,天线为通过镀银工艺设置在介质基板上的镀银层。In some embodiments, the antenna is a silver-plated layer disposed on the dielectric substrate through a silver-plating process.
在某些实施例中,供电电路还包括:蓄能阀门,被设置为使得所述虚拟电池在其电动势达到阀门时供电;以及稳压电路,与蓄能阀门耦合。In some embodiments, the power supply circuit further includes: an energy storage valve configured to supply power to the virtual battery when its electromotive force reaches the valve; and a voltage regulator circuit coupled to the energy storage valve.
在某些实施例中,还包括:绝缘覆盖层,至少设置于供电电路和RFID标签芯片,以在植入检测实体内时使供电电路和RFID标签芯片与检测实体绝缘。In some embodiments, an insulating cover layer is further included, at least disposed on the power supply circuit and the RFID tag chip, so as to insulate the power supply circuit and the RFID tag chip from the detection entity when implanted in the detection entity.
在某些实施例中,绝缘覆盖层为生物相容性材料。In certain embodiments, the insulating cover layer is a biocompatible material.
在某些实施例中,天线的工作频率范围为200Mhz至1000Mhz。In some embodiments, the operating frequency range of the antenna is 200Mhz to 1000Mhz.
在某些实施例中,介质基板为掺杂微量稀土元素的晶体结构陶瓷制成。In certain embodiments, the dielectric substrate is made of crystalline structure ceramics doped with trace rare earth elements.
在某些实施例中,晶体结构陶瓷的化学式为CaCu3Ti4O12。In certain embodiments, the chemical formula of the crystal structure ceramic is CaCu 3 Ti 4 O 12 .
本申请实施例提供的上述技术方案与现有技术相比具有如下优点:本申请实施例提供的该装置,实现了通过无线供能来准确地检测温度,并且体积微型化易于植入。Compared with the prior art, the above technical solutions provided by the embodiments of the present application have the following advantages: the device provided by the embodiments of the present application realizes accurate temperature detection through wireless power supply, and is miniaturized and easy to implant.
附图说明Description of drawings
此处的附图被并入说明书中并构成本说明书的一部分,示出了符合本发明的实施例,并与说明书一起用于解释本发明的原理。The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description serve to explain the principles of the invention.
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,对于本领域普通技术人员而言,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. In other words, on the premise of no creative labor, other drawings can also be obtained from these drawings.
图1为本申请实施例提供的可植入装置与外部组件的系统一种实施方式的硬件结构示意图;FIG. 1 is a schematic diagram of a hardware structure of an implementation manner of a system of an implantable device and an external component provided by an embodiment of the present application;
图2为本申请实施例提供的可植入装置的电路系统一种实施方式的硬件示意图;FIG. 2 is a hardware schematic diagram of an implementation manner of a circuit system of an implantable device according to an embodiment of the present application;
图3为本申请实施例提供的可植入装置的电路系统另一种实施方式的硬件示意图;FIG. 3 is a schematic hardware diagram of another implementation manner of the circuit system of the implantable device provided by the embodiment of the present application;
图4为本申请实施例提供的供电电路一种实施方式的电路结构示意图;FIG. 4 is a schematic diagram of a circuit structure of an implementation manner of a power supply circuit provided in an embodiment of the present application;
图5为本申请实施例提供的电荷泵电路一种实施方式的电路结构示意图;FIG. 5 is a schematic diagram of a circuit structure of an implementation manner of a charge pump circuit provided by an embodiment of the present application;
图6为本申请实施例提供的虚拟电池的结构示意图;FIG. 6 is a schematic structural diagram of a virtual battery provided by an embodiment of the present application;
图7为本申请实施例提供的虚拟电池的等效电路示意图;7 is a schematic diagram of an equivalent circuit of a virtual battery provided by an embodiment of the present application;
图8为本申请实施例提供的天线结构及绝缘覆盖层的结构示意图;FIG. 8 is a schematic structural diagram of an antenna structure and an insulating cover layer provided by an embodiment of the present application;
图9为本申请实施例提供的天线结构另一实施方式的结构示意图;FIG. 9 is a schematic structural diagram of another implementation manner of an antenna structure provided by an embodiment of the present application;
图10为本申请实施例提供的可植入装置一种实施方式的立体图;FIG. 10 is a perspective view of an implementation manner of the implantable device provided in the embodiment of the application;
图11A为本申请实施例提供的天线反射地的结构及与介质基板的位置关系示意图;11A is a schematic diagram of a structure of an antenna reflection ground and a positional relationship with a dielectric substrate provided by an embodiment of the present application;
图11B为本申请实施例提供的天线振子的展开结构及与介质基板的位置关系示意图;FIG. 11B is a schematic diagram of the unfolded structure of the antenna element and the positional relationship with the dielectric substrate according to the embodiment of the present application;
图11C为本申请实施例提供的天线短路片的结构及与介质基板的位置关系示意图;11C is a schematic diagram of the structure of the antenna short-circuit chip and the positional relationship with the dielectric substrate provided by the embodiment of the present application;
图11D为本申请实施例提供的阻抗匹配微带线、电路系统的结构及与介质基板的位置关系示意图;11D is a schematic diagram of the structure of the impedance matching microstrip line, the circuit system, and the positional relationship with the dielectric substrate provided by the embodiment of the present application;
图12为本申请实施例提供的通过无线供能的可植入装置一种实施方式的硬件结构示意图;FIG. 12 is a schematic diagram of a hardware structure of an implementation manner of an implantable device powered by wireless according to an embodiment of the present application;
图13为本申请实施例提供的通过无线供能的可植入传感器装置一种实施方式的硬件结构示意图;FIG. 13 is a schematic diagram of the hardware structure of an implementation manner of an implantable sensor device powered by wireless provided in an embodiment of the present application;
图14为本申请实施例提供的用于检测温度的可植入RFID标签装置一种实施方式的硬件结构示意图;FIG. 14 is a schematic diagram of the hardware structure of an embodiment of the implantable RFID tag device for detecting temperature provided by the embodiment of the application;
图15为本申请实施例提供的可植入装置一种实施方式的硬件结构示意图;以及FIG. 15 is a schematic diagram of a hardware structure of an implementation manner of an implantable device provided by an embodiment of the present application; and
图16为本申请实施例提供的用于获取动物体温的可植入RFID标签装置一种实施方式的硬件结构示意图。FIG. 16 is a schematic diagram of the hardware structure of an implementation manner of an implantable RFID tag device for acquiring animal body temperature according to an embodiment of the present application.
具体实施方式Detailed ways
应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
在后续的描述中,使用用于表示元件的诸如“模块”、“部件”或“单元”的后缀仅为了有利于本发明的说明,其本身没有特定的意义。因此,“模块”、“部件”或“单元”可以混合地使用。In the following description, suffixes such as 'module', 'component' or 'unit' used to represent elements are used only to facilitate the description of the present invention and have no specific meaning per se. Thus, "module", "component" or "unit" may be used interchangeably.
本申请的一些实施例涉及可植入装置,其具有体积小以便于植入的改进特征结构。本申请的一些实施例涉及可植入装置,其具有供能和/或天线通信性能的改进特征结构,其可植入实体内。本申请的一些实施例涉及对无线供能的改进特征结构,实现多角度、多种距离以及相对运动时稳定地无线供能。本申请的一些实施例涉及对天线性能的改进特征结构,实现使实体充当部分天线振子,由此保证天线性能同时降低可植入装置的体积。本申请的一些实施例涉及对可植入装置在液体环境、周围组织(例如肌肉、脂肪等)中通信性能的改进结构特征,使得天线能够抗周围组织的反射。Some embodiments of the present application relate to implantable devices having improved features that are small in size to facilitate implantation. Some embodiments of the present application relate to implantable devices having improved features for powering and/or antenna communication performance that can be implanted within an entity. Some embodiments of the present application relate to improved feature structures for wireless power supply to achieve stable wireless power supply at multiple angles, multiple distances, and relative motion. Some embodiments of the present application relate to improved features for antenna performance, enabling entities to act as part of the antenna element, thereby ensuring antenna performance while reducing the size of the implantable device. Some embodiments of the present application relate to improved structural features of an implantable device for communication performance in liquid environments, surrounding tissue (eg, muscle, fat, etc.) such that the antenna is resistant to reflections from surrounding tissue.
在某些实施例中,实体为绝缘体,例如木制或其他绝缘材质的物品等。在某些实施例中,实体为导电体。在某些实施例中,实体为动物体(包括人体)。可植入装置至少部分与导电体(例如,动物体的周围组织)接触并导通,例如微带天线与导电体接触并导通,使得被植入实体充当部分天线阵子,以在保证天线性能的同时降低微带天线的体积。In some embodiments, the entity is an insulator, such as wood or other insulating materials. In some embodiments, the entity is an electrical conductor. In certain embodiments, the entity is an animal body (including a human body). The implantable device is at least partially in contact with and conducts with electrical conductors (for example, surrounding tissue of an animal body), for example, a microstrip antenna is in contact with and conducts with electrical conductors, so that the implanted entity acts as part of the antenna element to ensure antenna performance. while reducing the size of the microstrip antenna.
在某些实施例中,可植入装置具有能够获取被植入实体相关信息的传感器单元,例如温度传感器、湿度传感器,以及其他各种类型的传感器。在某些实施例中,传感器单元至少部分与被植入实体接触,使得传感器单元能够检测被植入实体相关的信息。In some embodiments, the implantable device has a sensor unit capable of acquiring information about the implanted entity, such as temperature sensors, humidity sensors, and various other types of sensors. In some embodiments, the sensor unit is at least partially in contact with the implanted entity such that the sensor unit can detect information related to the implanted entity.
在某些实施例中,可植入装置具有一个多个其他部件,例如能够向被植入实体施加作用的装置,向被植入实体施加作用的装置可包括医疗治疗单元。医疗治疗单元可包括电极对,电极对可以将神经肌肉电刺激(NMES)脉冲递送到神经。In certain embodiments, the implantable device has one or more other components, such as a device capable of applying an effect to an implanted entity, which may include a medical treatment unit. The medical treatment unit may include electrode pairs that may deliver neuromuscular electrical stimulation (NMES) pulses to nerves.
参考图1所示,可植入装置100包括:介质基板101、天线102和电路系统103,天线102和电路系统103设置在介质基板101上。在本申请实施例中,天线102为设置在介质基板101上的微带天线(microstrip antenna),天线102可接收和发射射频(RF)信号。在某些实施例中,天线102的工作频率范围为200Mhz至1000Mhz。Referring to FIG. 1 , the
在某些实施例中,可植入装置100的电路系统103从外部组件200接收电力。在某些实施例中,可植入装置100的电路系统103可包括电源(图中为示出),电路系统103由电源供电。In certain embodiments,
在某些实施例中,外部组件200包括天线201和电路系统202,天线201能够发送和接收RF信号。外部组件200通过天线201发送RF信号,以无线地向可植入装置100传输电力信号和/或通信信号,通信信号包括控制命令等。在一些实施例中,外部组件200通过天线201接收可植入装置100发送的通信信号,通信信号包括控制命令、传感器单元检测的数据,以及可植入装置100的身份信息等。In some embodiments,
在本申请实施例中,可植入装置100与外部组件100进行短距离无线通信,例如无线射频识别(Radio Frequency Identification,简称为RFID)。In the embodiment of the present application, the
在某些实施例中,介质基板101的薄片,介质基板101一面附上薄层作为接地板,另一面用光刻腐蚀方法制成一定形状的金属贴片,利用微带线对贴片馈电构成天线102。在一些实施例中,金属贴片为一细长带,此时天线102称为微带振子天线。在另一些实施例中,金属贴片为一个面积单元。天线102与电路系统103之间通过阻抗匹配微带线耦合。In some embodiments, a thin sheet of the
在某些实施例中,参考图2所示,电路系统103包括供电电路1031和通信电路1032。在某些实施例中,参考图3所示,电路系统103包括:供电电路1031、通信电路1032和传感器单元1033。供电电路1031存储在天线获得的电力,并向通信电路1032提供电力。通信电路1032处理在天线102获得的通信信号,并通过天线102向外部组件200发射通信信号。在某些实施例中,电力信号和通信信号被调制以同时被接收。在另一些实施例中,电力信号和通信信息被分别接收。In some embodiments, as shown with reference to FIG. 2 , the
在某些实施例中,可植入装置100被配置为植入导电体内,因此可植入装置100的电路系统103上设置绝缘覆盖层,以将电路体系统103与导电体绝缘。在一些实施例中,可植入装置100被配置为植入生物体内(例如,动物的肌肉组织),绝缘覆盖层为生物相容性材料(例如生物医用胶),以降低或避免生物排异现象。In some embodiments, the
在某些实施中,可植入装置100被植入的环境具有腐蚀性(例如生物体的肌肉、体液等)。在一些实施例中,可植入装置100的天线102的至少部分由防腐蚀金属(例如银,但不限于此)制成。在另一些实施例中,可植入装置100的天线102的至少部分表面设置有防腐蚀涂层(例如,银,但不限于此)。In some implementations, the environment in which the
介质基板Dielectric substrate
在本申请实施例中,采用高介电常数的介质基板101。高介电常数的材料参见现有技术,本文对此不做赘述。在某些实施例中,介质基板101的介电常数介于100至300之间、且损耗角低于0.05%。由此,降低天线102的体积,降低天线102与电路系统103之间阻抗匹配微带线的体积。In the embodiments of the present application, a
在某些实施例中,介质基板101采用掺杂微量稀土元素的晶体结构陶瓷制成。晶体结构陶瓷具有优越的强度、硬度、绝缘性、热传导、耐高温、耐氧化、耐腐蚀、耐磨耗、高温强度等特点。由此,避免可植入装置温度过高而导致性能下降。作为一个示例,采用化学式为CaCu3Ti4O12晶体结构陶瓷的,并掺杂微量稀土钼等元素,调节介电系数改善损耗角,制成介电常数在100和300之间、损耗角0.05%内的介质基板。In some embodiments, the
在某些实施例中,介质基板为长条状,以便于将可植入装置100植入被植入实体内,但本申请实施例并不限于此。在某些实施例中,通过介电常数介于100至300之间、且损耗角低于0.05%的介质基板101,可植入装置100的体积小于1.2mm*1.6mm*16mm。In some embodiments, the dielectric substrate is elongated, so as to facilitate implanting the
无线供能Wireless power supply
在本申请实施例中,外部组件200通过天线201发射RF信号。可植入装置100的天线102接收外部组件200发射的RF信号,此时可植入装置100的天线102上有电荷。天线102上的电荷的强度与可植入装置100与外部组件200之间的距离相关,天线102与天线201之间的角度相关。由于距离和/或角度的不同,以及外部组件200相对于可植入装置100运动(例如植入动物体内时)时,导致天线102上的电荷不是恒定的,由此导致供电不稳定。In the embodiment of the present application, the
在某些实施例中,参考图4所示,供电电路1031包括:虚拟电池10311,被设置为存储电力并提供电力;以及电荷泵电路10312,位于天线102与虚拟电池10311之间,被设置为提升在天线102获得的电力信号的电动势,以向虚拟电池10311充电。In some embodiments, referring to FIG. 4 , the
电荷泵电路10312将在天线102获得的微弱电荷、波动电荷提升到一定伏特势能,一定伏特势能对虚拟电池10311充电存储电能。也就是说,天线102的电荷流经荷泵电路10312升压,然后存储在虚拟电池10311。由此,使得供电电路能够稳定地向电路系统103的其他部分供电,由此可在外部组件200与可植入装置100处于各种位置关系时,均能稳定的无线供能。尤其是外部组件200与可植入装置100相对运动时,亦能稳定的无限功能。在本申请实施例中,该势能可根据需要设定。The
在本申请实施例中,电荷泵电路10312可采用各种类型的用于升压的电荷泵电路。作为非限制性示例,参考图5所示,电荷泵电路10312采用电容和二极管构成,具有体积小、成本低的特点。电荷泵电路10312整个工作过程的核心部分为电容充放电过程。图5中虚线部分表示包含任意数量的同样结构的元件。In this embodiment of the present application, the
参考图6所示,虚拟电池10311包括设置于介质基板101上的第一电极10311a以及第二电极10311b。第一电极10311a与第二电极10311b相对设置,使得电介质材料10311c介于第一电极10311a与第二电极10311b之间,形成电容器。虚拟电池10311两电极之间的电介质材料10311c为介质基板101的部分。作为示例性性说明,第一电极10311a与第二电极10311b印刷在介质基板101上。Referring to FIG. 6 , the dummy battery 10311 includes a
参考图7所示,为虚拟电池10311的等效图。虚拟电池10311存储的电荷量Q=V*C,其中,V为电动势,C为电容量。虚拟电池10311的第一电极10311a与第二电极10311b形成的电容器,其电容量C=ε0*ε*A/δ,其中,ε为电介质材料10311c的介电常数,A为第一电极10311a、第二电极10311b的面积,δ为第一电极10311a与第二电极10311b之间的距离。Referring to FIG. 7 , it is an equivalent diagram of the virtual battery 10311 . The amount of charge stored in the virtual battery 10311 is Q=V*C, where V is the electromotive force and C is the electric capacity. The capacitor formed by the
在本申请实施例中,为了降低虚拟电池10311的体积,使用高介电常数的电介质材料10311c。在某些实施例中,电介质材料10311c的介电常数介于100之间300,由此,使得同样面积电容相差30倍。在某些实施例中,虚拟电池10311的体积小于0.8mm*0.8mm*2mm,且可储存大量电荷,满足电路系统能量需求。In this embodiment of the present application, in order to reduce the volume of the dummy battery 10311, a high dielectric constant
在某些实施例中,参考图4所示,供电电路1031还包括:蓄能阀门10313,被设置为使得虚拟电池1031在其电动势达到阀门时供电,以提高供电电压的稳定性。蓄能阀门10313可参见现有技术,本申请实施例对此不作赘述。由此,使得电路系统103的其他部分电路在稳定的电压下工作,尤其是使得传感器单元1033工作电压更为稳定,从而提交检测数据的准确性。In some embodiments, as shown in FIG. 4 , the
在某些实施例中,参考图4所示,供电电路1031还包括:稳压电路10314,与蓄能阀门10313耦合。稳压电路10314可参见现有技术,本申请实施例对此不作赘述。由此,使得电路系统103的其他部分电路在稳定的电压下工作,尤其是使得传感器单元1033工作电压更为稳定,从而提交检测数据的准确性。In some embodiments, as shown in FIG. 4 , the
在本申请实施例中,天线的工作频率范围为200Mhz至1000Mhz时,供电电路1031可在至少1米远、外部组件200的60°扇区内稳定的无线供能。In the embodiment of the present application, when the operating frequency range of the antenna is 200Mhz to 1000Mhz, the
无线布局Wireless layout
在本申请实施例中,天线102为设置在介质基板101上的微带天线,例如,天线102的至少部分通过电镀等工艺设置在介质基板101上。微带天线具有体积小的特点。在某些实施例中,介质基板101的介电常数介于100至300之间、且损耗角低于0.05%,由此大幅降低天线102的体积。以通讯频率为915MHz为例,915MHz的波长33cm,采用四分之一波长单极子天线模型,则天尺寸长不低于8cm,通过在高介电常数的介质基板101上设置微带天线,天线振子的长度可为16mm,也就是天线尺寸从8cm缩小到16mm。In this embodiment of the present application, the antenna 102 is a microstrip antenna disposed on the
在某些实施例中,天线102上设置有防腐蚀涂层。在某些实施例中,天线102为防腐蚀金属(例如,银)。在某些实施例中,天线102为通过镀银工艺设置在介质基板101上的镀银层。由此,实现可植入装置在具有腐蚀性环境的被植入实体内使用。In some embodiments, the antenna 102 is provided with an anti-corrosion coating. In certain embodiments, the antenna 102 is a corrosion-resistant metal (eg, silver). In some embodiments, the antenna 102 is a silver-plated layer disposed on the
在某些实施例中,可植入装置100被配置为植入导电的实体内,例如,活体动物、食用肉类、导电液体,以及其他导电的实体。在本申请实施例中,参考图8所示,可植入装置100的电路系统103被绝缘覆盖层104覆盖,以将电路系统103与被植入实体绝缘。In certain embodiments, the
在某些实施例中,可植入装置100被配置为植入生物体内,绝缘覆盖层104为生物相容性材料,以避免或降低生物的排异现象,例如,生物医用胶。In some embodiments, the
参考图8所示,天线102包括天线振子1021和天线反射地1022。在某些实施例中,天线振子1021与被植入实体接触并导通,使得被植入实体充当部分天线振子,由此提高天线增益。在某些实施例中,天线反射地1022与被植入实体接触并导通。在另一些实施例中,天线反射地1022与被植入实体绝缘。Referring to FIG. 8 , the antenna 102 includes an
在某些实施例中,可植入装置100植入实体后,天线102等部件与实体接触,部分实体具有腐蚀性(例如生物体或者食用肉类等含水含盐的环境),因此,天线102的天线振子1021和天线反射地1022可由防腐蚀金属(例如银)制成。在另一些实施例中,天线振子1021和天线反射地1022的表面可印刷防腐蚀涂层,例如,在天线振子1021和天线反射地1022的表面镀银,但不限于此。在某些实施例中,天线振子1021和天线反射地1022为通过镀银工艺设置在所述介质基板上的镀银层。In some embodiments, after the
参考图9所示,在某些实施例中,可植入装置100的天线102包括天线振子1021、天线反射地1022和天线短路片1023。天线振子1021设置在介质基板101的一面,天线反射地1022设置在介质基板101的另一面,使得天线振子1021与天线反射地1022相对设置。天线短路片1023设置在介质基板101的侧面,将天线振子1021与天线反射地1022短接。当可植入装置100植入生物体内时,生物体与天线振子1021接触并导通,使得生物体充当等效天线振子。在某些实施例中,天线振子1021与生物体接触并导通,由可植入装置100的天线振子1021充当2%的天线振子,生物体充当98%的振子等效体。由此,大大增加天线辐射面,提高天线增益。Referring to FIG. 9 , in some embodiments, the antenna 102 of the
在某些实施例中,当可植入装置100植入生物体内时,天线反射地1022与生物体接触并导通,由生物体充当部分天线反射地。In certain embodiments, when the
可植入装置100植入生物体内时,天线102被生物体的肌肉、脂肪等周围组织包裹。体外的电波穿透周围组织到达可植入装置100,存在电波在不同没接传播,会导致反射而使得天线性能下降。When the
在某些实施例中,参考图10所示,可植入装置100的介质基板101呈微型长方体状,应当理解,此处的长方体为大致的形状,而非数学意义上的长方体。天线102和电路系统103设置在呈长方体状的介质基板101上。天线102包括:天线振子1021、天线反射地1022和天线短路片1023。天线短路片1023将天线振子1021与天线反射地1022短接。In some embodiments, as shown in FIG. 10 , the
参考图10和11A所示,天线反射地1022,设置在介质基板101上尺寸较大的第一侧面1011的第一部分1011a。参考图10和11B所示,天线振子1021,设置在与第一侧面1011平行的第二侧面1012、尺寸较小的第三侧面1013,以及第一侧面1011的第二部分1011b。天线振子1021被设置为在植入体内时接触周围组织,以使周围组织充当部分天线振子。参考图10和11C所示,天线短路片1023,设置在与第三侧面1013平行的第四侧面1014,被设置为将天线振子1021与天线反射地1022短接。Referring to FIGS. 10 and 11A , the
在某些实施例中,参考图10和图11D所示,电路系统103,设置在与第一侧面1011垂直的第五侧面1015上。参考图10、图11A、11B和11D所示,第一阻抗匹配微带线105a,设置在天线振子1021与电路系统103之间;以及第二阻抗匹配微带线105b,设置在天线反射地1022与电路系统103之间。参考图11A、11B和11D所示,第一阻抗匹配微带线105a与天线振子1021位于第二侧面1012的部分耦合。第二阻抗匹配微带线105b与天线反射地1022耦合。In some embodiments, as shown in FIG. 10 and FIG. 11D , the
在某些实施例中,在电路系统103上设置绝缘覆盖层104,以将电路系统103与生物体的周围组织绝缘,可选地,绝缘覆盖层104为生物相容性材料,例如生物医用胶,以避免或降低生物体的排异现象。In some embodiments, an insulating
在某些实施例中,在天线振子1021、天线反射地1022和天线短路片1023中至少部分设置防腐蚀涂层,例如在其表面镀银。在另一些实施例中,在天线振子1021、天线反射地1022和天线短路片1023由防腐蚀金属制成。In some embodiments, an anti-corrosion coating is provided at least in part in the
在某些实施例中,当被植入生物体内时,在天线振子1021、天线反射地1022和天线短路片1023与生物体的周围组织接触并导通,利用周围组织的等价充当天线填充材料对抗反射。在一些实施例中,天线反射地1022和/或天线短路片1023与生物体的周围组织绝缘。In some embodiments, when implanted in a living body, the
在某些实施例中,天线102的工作频率范围为200Mhz至1000Mhz。In some embodiments, the operating frequency range of the antenna 102 is 200Mhz to 1000Mhz.
通过图10、图11A至11D所示的天线102的布局,在可植入装置被植入生物体等实体时,天线102能够抗生物体等实体的反射作用,实现多方向立体发送和接收RF信号。With the layout of the antenna 102 shown in FIGS. 10 and 11A to 11D , when the implantable device is implanted in a body such as a body, the antenna 102 can resist the reflection effect of the body such as a body, and realize multi-directional stereo transmission and reception of RF signals .
应当理解,图10、图11A至11D所示的天线102的布局,仅作为示例性说明,本领域技术人员能够在本文的技术上,根据需要调整天线部件的大小、设置位置等。It should be understood that the layout of the antenna 102 shown in FIG. 10 and FIGS. 11A to 11D is only for exemplary illustration, and those skilled in the art can adjust the size, setting position, etc. of the antenna components as needed based on the technology herein.
实施例1Example 1
本申请实施例1提供了一种通过无线供能的可植入装置,该可植入装置通过无线供能,并且能够在多角度、多具体、以及相对运动时稳定供能,保证可植入装置工作的稳定性。该可植入装置还具有微型化便于植入的特点。Embodiment 1 of the present application provides an implantable device powered by wireless. The implantable device is powered by wireless, and can stably supply power in multi-angle, multi-specific, and relative motion, ensuring implantable power. The stability of the device operation. The implantable device is also miniaturized for easy implantation.
参考图12所示,本申请实施例1提供通过无线供能的可植入装置,包括:介质基板10;天线20,天线20为设置在介质基板10上的微带天线;以及供电电路30,与天线20耦合。12, Embodiment 1 of the present application provides an implantable device powered by wireless, including: a dielectric substrate 10; an antenna 20, where the antenna 20 is a microstrip antenna disposed on the dielectric substrate 10; and a power supply circuit 30, coupled to the antenna 20 .
在某些实施例中,介质基板10的介电常数介于100之间300。在某些实施例中,介质基板10的介质损耗小于0.05%。介质基板10参考本文前述对介质基板101的说明,在此不再赘述。In some embodiments, the dielectric constant of the dielectric substrate 10 is between 100 and 300. In some embodiments, the dielectric loss of the dielectric substrate 10 is less than 0.05%. For the dielectric substrate 10, reference is made to the foregoing description of the
在该实施例中,供电电路30,包括:虚拟电池31,包括设置于介质基板上的第一电极以及第二电极,第一电极和第二电极及两者之间的介电材料形成电容(参考图6所示),虚拟电池31被设置为存储电力并提供电力;以及电荷泵电路32,位于天线20与虚拟电池31之间,被设置为提升在天线20获得的电力信号的电动势,以向虚拟电池31充电。在某些实施例中,天线20,被设置为在植入时接触被植入实体,以使被植入实体充当部分天线振子。In this embodiment, the power supply circuit 30 includes: a
在某些实施例中,参考图12所示,供电电路30还包括:蓄能阀门33,被设置为使得虚拟电池31在其电动势达到阀门时供电;以及稳压电路34,与蓄能阀门33耦合。In some embodiments, as shown in FIG. 12 , the power supply circuit 30 further includes: an energy storage valve 33 , which is set to make the
在某些实施例中,在天线20上设置防腐蚀涂层。在某些实施例中,天线20为防腐蚀金属。在某些实施例中,天线20为通过镀银工艺设置在介质基板10上的镀银层。由此,使得可植入装置能够在具有腐蚀性环境的被植入实体内使用。In some embodiments, an anti-corrosion coating is provided on the antenna 20 . In some embodiments, the antenna 20 is a corrosion-resistant metal. In some embodiments, the antenna 20 is a silver-plated layer disposed on the dielectric substrate 10 through a silver-plating process. Thereby, the implantable device is enabled to be used within an implanted entity having a corrosive environment.
在某些实施例中,该通过无线供能的可植入装置还包括:绝缘覆盖层,设置在供电电路30上,以使该可植入装置在植入导电体内时供电电路30与导电体绝缘。在某些实施例中,导电体为生物体,绝缘覆盖层为生物相容性材料。In some embodiments, the wirelessly powered implantable device further comprises: an insulating cover layer disposed on the power supply circuit 30, so that the power supply circuit 30 and the conductor are connected to the power supply circuit 30 when the implantable device is implanted in the conductor. insulation. In certain embodiments, the electrical conductor is a living body and the insulating cover layer is a biocompatible material.
在某些实施例中,参考图12所示,该可植入装置还包括:通信电路40,该通信电路40与天线20耦合,被设置为通过天线20接收和/或发送通信信号。在某些实施例中,通信电路40为RFID标签芯片。In certain embodiments, as shown with reference to FIG. 12 , the implantable device further includes a communication circuit 40 coupled to the antenna 20 and configured to receive and/or transmit communication signals through the antenna 20 . In some embodiments, the communication circuit 40 is an RFID tag chip.
在某些实施例中,天线20可参考本文对天线102的说明,在此不再赘述。In some embodiments, the antenna 20 may refer to the description of the antenna 102 in this document, which will not be repeated here.
实施例2Example 2
本申请实施例2提供了一种通过无线供能的可植入传感器装置,该可植入传感器装置通过无线供能,并且具有能够检测与被植入实体相关的数据的传感器单元。该可植入传感器装置还具有微型化便于植入的特点。Embodiment 2 of the present application provides an implantable sensor device powered by wireless, the implantable sensor device is powered by wireless and has a sensor unit capable of detecting data related to an implanted entity. The implantable sensor device also has the characteristics of miniaturization and easy implantation.
参考图13所示,本申请实施例2提供的通过无线供能的可植入传感器装置,包括:介质基板10;天线20,天线20为设置在介质基板10上的微带天线;传感器单元50;通信电路40,与天线20及传感器单元50耦合,被设置为从传感器单元60获取检测数据,并通过天线20发送检测数据;以及供电电路30,与天线20耦合,设置为向传感器单元50和通信电路40供电,供电电路30包括:虚拟电池31,包括设置于介质基板上的第一电极以及第二电极,虚拟电池31被设置为存储在天线获得的电力信号。Referring to FIG. 13 , the wirelessly powered implantable sensor device provided in Embodiment 2 of the present application includes: a dielectric substrate 10 ; an antenna 20 , where the antenna 20 is a microstrip antenna disposed on the dielectric substrate 10 ; a sensor unit 50 A communication circuit 40, coupled with the antenna 20 and the sensor unit 50, is configured to acquire detection data from the sensor unit 60, and to transmit the detection data through the antenna 20; The communication circuit 40 supplies power, and the power supply circuit 30 includes: a
在某些实施例中,参考图13所示,供电电路30还包括:电荷泵电路32,位于天线20与虚拟电池之间,被设置为提升在天线20获得的电力信号的电动势,以向虚拟电池31充电。在某些实施例中,参考图13所示,供电电路30还包括:蓄能阀门33,被设置为使得虚拟电池31在其电动势达到阀门时供电;以及稳压电路34,与蓄能阀门33耦合。In some embodiments, as shown in FIG. 13 , the power supply circuit 30 further includes: a charge pump circuit 32 located between the antenna 20 and the dummy battery, and configured to boost the electromotive force of the power signal obtained at the antenna 20 , so as to send a charge pump circuit 32 to the dummy battery. The
在某些实施例中,传感器单元50,被设置为植入检测实体时至少部分接触检测实体,以检测检测实体相关的信息。In some embodiments, the sensor unit 50, configured to be implanted with the detection entity, at least partially contacts the detection entity to detect information related to the detection entity.
在某些实施例中,天线20被设置为在可植入传感器装置在植入导电体内时接触导电体,以使导电体充当部分天线振子。In certain embodiments, the antenna 20 is arranged to contact the electrical conductor when the implantable sensor device is implanted within the electrical conductor, so that the electrical conductor acts as part of the antenna element.
在某些实施例中,可植入传感器装置还包括:防腐蚀涂层,设置在天线20上。In certain embodiments, the implantable sensor device further includes: an anti-corrosion coating disposed on the antenna 20 .
在某些实施例中,可植入传感器装置还包括:绝缘覆盖层,至少设置于供电电路30和通信电路40,以使可植入传感器装置在植入导电体内时供电电路和通信电路与导电体绝缘。在某些实施例中,导电体为生物体,绝缘覆盖层为生物相容性材料。In some embodiments, the implantable sensor device further includes: an insulating cover layer disposed on at least the power supply circuit 30 and the communication circuit 40, so that the power supply circuit and the communication circuit can be connected to the electrical conductor when the implantable sensor device is implanted in the conductor. body insulation. In certain embodiments, the electrical conductor is a living body and the insulating cover layer is a biocompatible material.
在某些实施例中,天线20可参考本文对天线102的说明,在此不再赘述。介质基板10参考本文前述对介质基板101的说明,在此不再赘述。In some embodiments, the antenna 20 may refer to the description of the antenna 102 in this document, which will not be repeated here. For the dielectric substrate 10, reference is made to the foregoing description of the
在实施例2中,外部组件200与可植入传感器装置通信,无线地向可植入传感器装置提供电力和通信信号,使得可植入传感器装置通过该电力进行检测和检测数据的发送。In Embodiment 2, the
实施例3Example 3
本申请实施例3提供了一种用于检测温度的可植入RFID标签装置,该可植入RFID标签装置通过RFID通信和无线供能,并具有温度传感器,通过该温度传感器检测被植入实体的温度,通过RFID标签芯片向外部组件发送温度信息和RFID标签装置的ID。Embodiment 3 of the present application provides an implantable RFID tag device for detecting temperature, the implantable RFID tag device is powered by RFID communication and wireless, and has a temperature sensor, through which an implanted entity is detected. The temperature information and the ID of the RFID tag device are sent to the external components through the RFID tag chip.
参考图14所示,本申请实施例提供的用于检测温度的可植入RFID标签装置,包括:介质基板10;天线20,天线20为印制在介质基板上10的微带天线;温度传感器51;RFID标签芯片41,与天线20及温度传感器51耦合,被设置为从温度传感器51获取温度数据,并通过天线20发送温度数据及RFID标签的ID;以及供电电路30,与天线20耦合,设置为向温度传感器51和RFID标签芯片41提供电力,供电电路30包括:虚拟电池31,包括设置于介质基板10上的第一电极以及第二电极,虚拟电池31被设置为存储在天线20获得的电力信号。Referring to FIG. 14 , the implantable RFID tag device for detecting temperature provided by the embodiment of the present application includes: a dielectric substrate 10; an antenna 20, where the antenna 20 is a microstrip antenna printed on the dielectric substrate 10; a temperature sensor 51; the
在某些实施例中,参考图14所示,供电电路30还包括:电荷泵电路32,位于天线20与虚拟电池之间,被设置为提升在天线20获得的电力信号的电动势,以向虚拟电池31充电。在某些实施例中,参考图14所示,供电电路30还包括:蓄能阀门33,被设置为使得虚拟电池31在其电动势达到阀门时供电;以及稳压电路34,与蓄能阀门33耦合。In some embodiments, as shown in FIG. 14 , the power supply circuit 30 further includes: a charge pump circuit 32 located between the antenna 20 and the dummy battery, and configured to boost the electromotive force of the power signal obtained at the antenna 20 , so as to send the electric power to the dummy battery. The
在某些实施例中,温度传感器51,被设置为植入检测实体时至少部分接接触检测实体,以检测检测实体的温度。In some embodiments, the temperature sensor 51 is arranged to at least partially contact the detection entity when implanted in the detection entity to detect the temperature of the detection entity.
在某些实施例中,天线20被设置为在可植入RFID标签装置在植入导电体内时接触导电体,以使导电体充当部分天线振子。In certain embodiments, the antenna 20 is configured to contact the electrical conductor when the implantable RFID tag device is implanted within the electrical conductor, so that the electrical conductor acts as part of the antenna element.
在某些实施例中,可植入RFID标签装置还包括:防腐蚀涂层,设置在天线20上。In certain embodiments, the implantable RFID tag device further includes: an anti-corrosion coating disposed on the antenna 20 .
在某些实施例中,可植入RFID标签装置还包括:绝缘覆盖层,至少设置于供电电路30和RFID标签芯片51,以使可植入RFID标签装置在植入导电体内时供电电路30和RFID标签芯片51与导电体绝缘。在某些实施例中,导电体为生物体,绝缘覆盖层为生物相容性材料,例如生物医用胶。In some embodiments, the implantable RFID tag device further includes: an insulating cover layer, which is provided at least on the power supply circuit 30 and the RFID tag chip 51, so that the implantable RFID tag device can supply power to the circuit 30 and the RFID tag chip 51 when the implantable RFID tag device is implanted in the conductor. The RFID tag chip 51 is insulated from the conductor. In some embodiments, the electrical conductor is a living body, and the insulating cover layer is a biocompatible material, such as a biomedical glue.
在某些实施例中,天线20可参考本文对天线102的说明,在此不再赘述。介质基板10参考本文前述对介质基板101的说明,在此不再赘述。In some embodiments, the antenna 20 may refer to the description of the antenna 102 in this document, which will not be repeated here. For the dielectric substrate 10, reference is made to the foregoing description of the
在实施例3中,可植入RFID标签装置与RFID读写器通信。在可植入RFID标签装置进入RFID读写器的通信范围后,RFID读写器通过其天线发射RF信号。可植入RFID标签装置接收该RF信号,从中获取电力,并将电力提供给RFID标签芯片和温度传感器。RFID标签芯片与RFID读写器通信,RFID读写器向RFID标签芯片发送测温命令,RFID标签芯片响应于该测温命令,从温度传感器获取温度数据。RFID标签芯片将获取到的温度数据和RFID标签的ID发送给RFID读写器。RFID读写器取得温度数据和RFID标签的ID。In Example 3, the implantable RFID tag device communicates with an RFID reader. After the implantable RFID tag device enters the communication range of the RFID reader, the RFID reader transmits an RF signal through its antenna. The implantable RFID tag device receives this RF signal, extracts power from it, and supplies the power to the RFID tag chip and temperature sensor. The RFID tag chip communicates with the RFID reader, the RFID reader sends a temperature measurement command to the RFID tag chip, and the RFID tag chip acquires temperature data from the temperature sensor in response to the temperature measurement command. The RFID tag chip sends the acquired temperature data and the ID of the RFID tag to the RFID reader. The RFID reader/writer obtains the temperature data and the ID of the RFID tag.
在某些实施例中,RFID读写器固定设置与某一位置,可植入RFID标签装置的被植入实体(例如动物体)靠近该位置,并进入RFID读写器通信范围后,进行前述测温过程。In some embodiments, the RFID reader/writer is fixed at a certain position, and the implanted entity (such as an animal body) that can implant the RFID tag device approaches the position and enters the communication range of the RFID reader/writer, and performs the aforementioned temperature measurement process.
在某些实施例中,RFID读写器(例如手持设备)能够相对于与可植入RFID标签装置的被植入实体移动,本申请实施例对此不做限定。In some embodiments, the RFID reader/writer (eg, a handheld device) can move relative to the implanted entity with the implantable RFID tag device, which is not limited in this embodiment of the present application.
实施例4Example 4
本申请实施例4提供了一种可植入装置,该可植入装置在被植入生物体内时,其天线与生物体的肌肉、脂肪等周围组织接触,从而使得生物体充当部分天线元件,并且通过天线布局设置,该可植入装置能够抗周围组织的反射。Embodiment 4 of the present application provides an implantable device. When the implantable device is implanted into a living body, its antenna is in contact with surrounding tissues such as muscle and fat of the living body, so that the living body acts as a part of the antenna element, And through the antenna layout, the implantable device is resistant to reflections from surrounding tissue.
参考图15所示,本申请实施例提供的可植入装置,包括:介质基板10;以及天线20,设置在介质基板10上。Referring to FIG. 15 , the implantable device provided by the embodiment of the present application includes: a dielectric substrate 10 ; and an antenna 20 , which is disposed on the dielectric substrate 10 .
本申请实施例的天线20的布局参见参考图10、11A至11D所示,介质基板呈长方体状,天线20(对应于天线102)包括天线反射地1022,设置在介质基板上尺寸较大的第一侧面1011的第一部分1011a;天线振子1021,天线振子1021设置在与第一侧面1011平行的第二侧面1012、尺寸较小的第三侧面1013,以及第一侧面1011的第二部分1011b;天线振子1021被设置为在植入体内时接触周围组织,以使周围组织充当部分天线振子;以及天线短路片1023,设置在与第三侧面1013平行的第四侧面1014,被设置为将天线振子1021与天线反射地1022短接。10, 11A to 11D, the layout of the antenna 20 in the embodiment of the present application is shown in reference to FIGS. 10 and 11A to 11D. The dielectric substrate is in the shape of a rectangular parallelepiped. The
在某些实施例中,该可植入装置还包括:电路系统300。电路系统300的设置位置参考图10和图11D所示,电路系统300(对应于电路系统103)设置在与第一侧面1011垂直的第五侧面1015上;电路系统300(对应于电路系统103)上设置有绝缘覆盖层104,以将电路系统30(对应于电路系统103)与周围组织绝缘。电路系统300与天线20之间通过微带线进行阻抗匹配。参考图10及图11D所示,第一阻抗匹配微带线105a,设置在天线振子1021与电路系统300(对应于电路系统103)之间。第二阻抗匹配微带线105b,设置在天线反射地1022与电路系统300(对应于电路系统103)之间。In certain embodiments, the implantable device further includes: circuitry 300 . 10 and 11D, the circuit system 300 (corresponding to the circuit system 103) is arranged on the
在某些实施例中,可植入装置还包括:防腐蚀涂层,设置在天线20上。在某些实施例中,天线反射地1022、天线振子1021以及天线短路片1023为印刷银条。在某些实施例中,天线振子1021完全覆盖第二侧面1012以及第三侧面1013。In some embodiments, the implantable device further includes: an anti-corrosion coating disposed on the antenna 20 . In some embodiments, the
在某些实施例中,天线20可参考本文对天线102的说明,在此不再赘述。介质基板10参考本文前述对介质基板101的说明,在此不再赘述。In some embodiments, the antenna 20 may refer to the description of the antenna 102 in this document, which will not be repeated here. For the dielectric substrate 10, reference is made to the foregoing description of the
在某些实施例中,电路系统20上的绝缘覆盖层为生物相容性材料。In some embodiments, the insulating cover layer on circuit system 20 is a biocompatible material.
在某些实施例中,天线20,被设置为向电路系统300提供电力信号和/或通信信号。电路系统300,被设置为接收天线的电力信号和/或通信信号。In some embodiments, the antenna 20 is configured to provide power signals and/or communication signals to the circuitry 300 . The circuitry 300 is configured to receive power signals and/or communication signals from the antenna.
在某些实施例中,电路系统300可包括本文前述的供电电路30,在此不再赘述。In some embodiments, the circuit system 300 may include the power supply circuit 30 described above, which will not be repeated here.
实施例5Example 5
本申请实施例5提供了一种用于获取动物体温的可植入RFID标签装置,该可植入RFID标签装置具有温度传感器。当可植入RFID标签装置植入动物体时,通过外部组件向RFID标签芯片和温度传感器无线供能,RFID标签芯片获取温度传感器检测的动物体温,并向外部组件发送RFID标签的ID和体温数据。Embodiment 5 of the present application provides an implantable RFID tag device for acquiring the body temperature of an animal, and the implantable RFID tag device has a temperature sensor. When the implantable RFID tag device is implanted into the animal body, the RFID tag chip and the temperature sensor are wirelessly powered through the external components, and the RFID tag chip obtains the animal body temperature detected by the temperature sensor, and sends the ID and body temperature data of the RFID tag to the external components. .
参考图16所示,本申请实施例提供的用于获取动物体温的可植入RFID标签装置,包括:介质基板10;天线20,设置在介质基板10上;以及,体温检测电路60。体温检测电路60包括:温度传感器61,设置为检测温度并产生温度信号;RFID标签芯片62,设置为获取温度传感器61的温度信号,并通过天线20发送该温度信号和RFID标签的ID。Referring to FIG. 16 , the implantable RFID tag device for acquiring animal body temperature provided by this embodiment of the present application includes: a dielectric substrate 10 ; an antenna 20 , which is disposed on the dielectric substrate 10 ; and a body temperature detection circuit 60 . The body temperature detection circuit 60 includes: a temperature sensor 61 configured to detect temperature and generate a temperature signal; an RFID tag chip 62 configured to acquire the temperature signal of the temperature sensor 61 and send the temperature signal and the ID of the RFID tag through the antenna 20 .
本申请实施例的天线20的布局参见参考图10、11A至11D所示,介质基板呈长方体状,天线20(对应于天线102)包括:天线反射地1022,设置在介质基板上尺寸较大的第一侧面1011的第一部分1011a;天线振子1021,天线振子1021设置在与第一侧面1011平行的第二侧面1012、尺寸较小的第三侧面1013,以及第一侧面1011的第二部分1011b;天线振子1021被设置为在植入体内时接触周围组织,以使周围组织充当部分天线振子;以及天线短路片1023,设置在与第三侧面1013平行的第四侧面1014,被设置为将天线振子1021与天线反射地1022短接。10, 11A to 11D, the layout of the antenna 20 in the embodiment of the present application is shown in reference to FIGS. 10 and 11A to 11D. The dielectric substrate is in the shape of a rectangular parallelepiped. The
体温检测电路60的设置位置参考图10和图11D所示,体温检测电路60(对应于电路系统103)设置在与第一侧面1011垂直的第五侧面1015上;体温检测电路60(对应于电路系统103)上设置有绝缘覆盖层104,以将体温检测电路60(对应于电路系统103)与周围组织绝缘。体温检测电路60与天线20之间通过微带线进行阻抗匹配。参考图10及图11D所示,第一阻抗匹配微带线105a,设置在天线振子1021与体温检测电路60(对应于电路系统103)之间。第二阻抗匹配微带线105b,设置在天线反射地1022与体温检测电路60之间。10 and 11D, the body temperature detection circuit 60 (corresponding to the circuit system 103) is arranged on the
在本申请实施例中,体温检测电路60上设置有绝缘覆盖层,以将体温检测电路60与周围组织绝缘。In the embodiment of the present application, the body temperature detection circuit 60 is provided with an insulating cover layer to insulate the body temperature detection circuit 60 from surrounding tissues.
在某些实施例中,该可植入RFID标签装置通过无线供能,参考图16所示,其还包括:供电电路30,与天线20耦合,供电电路30包括:虚拟电池31,包括设置于介质基板上的第一电极和第二电极,被设置为存储电力并向体温检测电路60提供电力;以及电荷泵电路32,位于天线20与虚拟电池31之间,被设置为提升在天线20获得的电力信号的电动势,以向虚拟电池31充电。其中,供电电路30由绝缘覆盖层覆盖,以将供电电路30与周围组织绝缘。In some embodiments, the implantable RFID tag device is powered by wireless, as shown in FIG. 16 , it further includes: a power supply circuit 30 coupled to the antenna 20 , and the power supply circuit 30 includes: a
在某些实施例中,参考图16所示,供电电路30还包括:蓄能阀门33,被设置为使得虚拟电池31在其电动势达到阀门时向供电;稳压电路34,与蓄能阀门耦合。In some embodiments, as shown in FIG. 16 , the power supply circuit 30 further includes: an energy storage valve 33 , which is set so that the
在某些实施例中,可植入RFID标签装置还包括:防腐蚀涂层,设置在天线20上。在某些实施例中,天线反射地1022、天线振子1021以及天线短路片1023为印刷银条。In certain embodiments, the implantable RFID tag device further includes: an anti-corrosion coating disposed on the antenna 20 . In some embodiments, the
在某些实施例中,天线振子1021完全覆盖第二侧面以及第三侧面。In some embodiments, the
在某些实施例中,天线20可参考本文对天线102的说明,在此不再赘述。介质基板10参考本文前述对介质基板101的说明,在此不再赘述。In some embodiments, the antenna 20 may refer to the description of the antenna 102 in this document, which will not be repeated here. For the dielectric substrate 10, reference is made to the foregoing description of the
在某些实施例中,绝缘覆盖层为生物相容性材料。In certain embodiments, the insulating cover layer is a biocompatible material.
在实施例5中,可植入RFID标签装置与RFID读写器通信。植入可植入RFID标签装置的动物体进入RFID读写器的通信范围,RFID读写器通过其天线发射RF信号。可植入RFID标签装置接收该RF信号,从中获取电力,并将电力提供给RFID标签芯片和温度传感器。RFID标签芯片与RFID读写器通信,RFID读写器向RFID标签芯片发送测温命令,RFID标签芯片响应于该测温命令,从温度传感器获取温度数据。RFID标签芯片将获取到的温度数据和RFID标签的ID发送给RFID读写器。RFID读写器取得温度数据和RFID标签的ID。In Example 5, an implantable RFID tag device communicates with an RFID reader/writer. The animal body implanted with the implantable RFID tag device enters the communication range of the RFID reader, and the RFID reader transmits RF signals through its antenna. The implantable RFID tag device receives this RF signal, extracts power from it, and supplies the power to the RFID tag chip and temperature sensor. The RFID tag chip communicates with the RFID reader, the RFID reader sends a temperature measurement command to the RFID tag chip, and the RFID tag chip acquires temperature data from the temperature sensor in response to the temperature measurement command. The RFID tag chip sends the acquired temperature data and the ID of the RFID tag to the RFID reader. The RFID reader/writer obtains the temperature data and the ID of the RFID tag.
在某些实施例中,RFID读写器固定设置与某一位置,被植入可植入RFID标签装置的动物体靠近该位置,并进入RFID读写器通信范围后,进行前述测温过程。In some embodiments, the RFID reader/writer is fixed at a certain position, and the animal body implanted with the implantable RFID tag device approaches the position and enters the communication range of the RFID reader/writer, and then performs the aforementioned temperature measurement process.
在某些实施例中,RFID读写器(例如手持设备)能够相对于与可被植入可植入RFID标签装置的动物体移动,本申请实施例对此不做限定。In some embodiments, the RFID reader/writer (eg, a handheld device) can move relative to an animal body into which the implantable RFID tag device can be implanted, which is not limited in this embodiment of the present application.
需要说明的是,在本文中,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。It should be noted that, herein, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, It also includes other elements not expressly listed or inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.
上述本发明实施例序号仅仅为了描述,不代表实施例的优劣。The above-mentioned serial numbers of the embodiments of the present invention are only for description, and do not represent the advantages or disadvantages of the embodiments.
上面结合附图对本发明的实施例进行了描述,但是本发明并不局限于上述的具体实施方式,上述的具体实施方式仅仅是示意性的,而不是限制性的,本领域的普通技术人员在本发明的启示下,在不脱离本发明宗旨和权利要求所保护的范围情况下,还可做出很多形式,这些均属于本发明的保护之内。The embodiments of the present invention have been described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific embodiments, which are merely illustrative rather than restrictive. Under the inspiration of the present invention, without departing from the scope of protection of the present invention and the claims, many forms can be made, which all belong to the protection of the present invention.
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