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CN112064025A - Manufacturing method of heat dissipation cover, case and variable pitch driving device - Google Patents

Manufacturing method of heat dissipation cover, case and variable pitch driving device Download PDF

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Publication number
CN112064025A
CN112064025A CN202011039355.3A CN202011039355A CN112064025A CN 112064025 A CN112064025 A CN 112064025A CN 202011039355 A CN202011039355 A CN 202011039355A CN 112064025 A CN112064025 A CN 112064025A
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China
Prior art keywords
heat dissipation
plate
ink
dissipation holes
equal
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Pending
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CN202011039355.3A
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Chinese (zh)
Inventor
汤桂衡
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Shenzhen Inovance Technology Co Ltd
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Shenzhen Inovance Technology Co Ltd
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Priority to CN202011039355.3A priority Critical patent/CN112064025A/en
Publication of CN112064025A publication Critical patent/CN112064025A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20181Filters; Louvers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a manufacturing method of a heat dissipation cover, which comprises the steps of carrying out screen printing on a plate, coating ink on the plate, and forming an ink pattern with a mesh shape; drying the plate coated with the ink; placing the dried plate into a corrosion tank, and corroding the mesh part which is not covered by the printing ink on the plate by using corrosive liquid in the corrosion tank to form heat dissipation holes; wherein, the area of the heat dissipation holes is less than or equal to 4mm, and the hole spacing between adjacent heat dissipation holes is less than or equal to 0.6 mm. The invention also discloses a heat dissipation cover, a chassis and variable pitch drive equipment. The invention enables the case formed by the plates to meet the heat dissipation requirement, has low cost and simple process, can shield the conventional external foreign matters from entering the case when the variable pitch driving equipment is assembled or operated, and prevents the variable pitch driving equipment from being damaged. Meanwhile, the area of the heat dissipation holes and the distance between the two heat dissipation holes are proper, and foreign matters are prevented from penetrating through the heat dissipation holes.

Description

Manufacturing method of heat dissipation cover, case and variable pitch driving device
Technical Field
The invention relates to the technical field of wind power equipment, in particular to a manufacturing method of a heat dissipation cover, the heat dissipation cover, a chassis and variable pitch driving equipment.
Background
The wind power generation is used as clean energy, and has obvious advantages. The variable-pitch driving equipment is used as a core component in the wind power system, and the requirement on the reliability of the variable-pitch driving equipment is very high. When the variable-pitch driving device works, a large amount of heat can be generated by internal devices of the variable-pitch driving device and is transmitted to the heat dissipation teeth of the heat radiator, air is forced to flow by the fan to take away the heat from the heat dissipation teeth, and normal work of the internal devices in a safe temperature range is guaranteed. In order to ensure that enough air quantity passes through the variable-pitch driving equipment case, the case is provided with a heat dissipation cover.
Due to the limitation of the processing technology factors, the size of the heat dissipation holes formed in the conventional heat dissipation cover is large, so that external foreign matters easily enter the inside of the variable-pitch driver through the heat dissipation holes when equipment is assembled or operated, and the variable-pitch driver fails; in addition, due to the limitation of the processing technology, the hole spacing between adjacent heat dissipation holes on the existing heat dissipation cover is also larger, so that the number of holes formed in the heat dissipation holes is influenced, and the heat dissipation effect is influenced.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of a heat dissipation cover, the heat dissipation cover, a case and a variable-pitch driving device, and aims to solve the problems that external foreign matters are easy to enter the device through heat dissipation holes due to large sizes of the heat dissipation holes in the existing heat dissipation cover, the device fails, hole intervals between adjacent heat dissipation holes in the existing heat dissipation cover are large, the number of holes formed in the heat dissipation holes is influenced, and the heat dissipation effect is further influenced.
In order to achieve the above object, the present invention provides a method for manufacturing a heat dissipation cover, the method comprising:
performing screen printing on a plate, and coating ink on the plate to form an ink pattern with a mesh shape;
drying the plate coated with the ink;
placing the dried plate into a corrosion tank, and corroding the mesh part which is not covered by the printing ink on the plate by using corrosive liquid in the corrosion tank to form heat dissipation holes; wherein, the area of the heat dissipation holes is less than or equal to 4mm, and the hole spacing between adjacent heat dissipation holes is less than or equal to 0.6 mm.
In one embodiment, the drying the ink-coated sheet further comprises:
and carrying out water immersion treatment on the dried ink pattern to remove impurities on the ink pattern.
In one embodiment, the screen printing on the plate material, the applying the ink to the plate material, and the forming the ink pattern having the mesh shape, includes:
removing the anti-rust oil coated on the plate;
cleaning the plate;
drying the cleaned plate.
In an embodiment, the placing the dried board into an etching tank, etching the mesh part of the board not covered by the ink by using the etching solution in the etching tank, and forming the heat dissipation holes further includes:
removing the printing ink on the surface of the plate;
cleaning the plate to remove the liquid used for removing the printing ink on the surface of the plate;
and drying the surface of the plate.
In order to achieve the above object, the present invention further provides a heat dissipation cover, which includes a plate, wherein a plurality of corroded heat dissipation holes are formed in the plate, the area of each heat dissipation hole is less than or equal to 4mm, and the hole distance between adjacent heat dissipation holes is less than or equal to 0.6 mm.
In one embodiment, the heat dissipation holes are rectangular, and each side length of the rectangle is less than or equal to 2 mm; or the shape of the heat dissipation hole is circular, and the diameter of the circle is smaller than or equal to 2 mm.
In one embodiment, the plate is made of stainless steel.
In one embodiment, the plurality of heat dissipation holes in the plate are arranged in a circular or square shape.
In order to achieve the above object, the present invention further provides a chassis, including:
a base plate;
the box plates are arranged on the bottom plate, and two adjacent box plates are connected with each other;
the top plate is covered on one end of the box plates far away from the bottom plate, and the bottom plate, the box plates and the top plate are surrounded to form a box body structure;
the two box plates which are oppositely arranged in the box body structure adopt the heat dissipation cover.
In order to achieve the above object, the present invention further provides a pitch driving device, where the pitch driving device includes the above chassis, and the pitch driving device further includes:
the driving assembly is arranged inside the box body; and the number of the first and second groups,
and the heat dissipation fan is arranged between the two box plates which are oppositely arranged and provided with a plurality of heat dissipation holes.
The printing ink is coated on a plate to form a printing ink pattern with a mesh shape, the area covered by the printing ink belongs to an area which does not need to be corroded, the area with the mesh shape formed by the printing ink is a to-be-corroded area, metal in the area is exposed to facilitate subsequent etching operation, after the printing ink pattern is dried, the plate is placed in strong acid or strong alkali solution, the strong acid or strong alkali solution and the metal area which is not coated with the printing ink generate chemical reaction to form heat dissipation holes, the area of each heat dissipation hole is smaller than or equal to 4mm, and the hole distance is smaller than or equal to 0.6mm, so that a case formed by the plate meets heat dissipation requirements. Meanwhile, the area of the heat dissipation holes and the distance between the two heat dissipation holes are proper, and foreign matters are prevented from penetrating through the heat dissipation holes on the premise that the heat dissipation requirements are met.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a heat dissipation cover according to a first embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a method for fabricating a heat sink according to a second embodiment of the present invention;
FIG. 3 is a schematic flow chart illustrating a method for manufacturing a heat sink according to a third embodiment of the present invention;
FIG. 4 is a schematic flow chart illustrating a method for manufacturing a heat sink according to a fourth embodiment of the present invention;
FIG. 5 is a schematic structural diagram of an embodiment of a pitch drive apparatus according to the present invention;
FIG. 6 is a schematic structural diagram of a further embodiment of a pitch drive apparatus of the present invention;
FIG. 7 is a schematic structural diagram of a further embodiment of a pitch drive apparatus of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The main solution of the embodiment of the invention is as follows: the method comprises the steps of coating ink on a plate to form an ink pattern with a mesh shape, enabling the area covered by the ink to belong to an area which does not need to be corroded, enabling the area with the mesh shape formed by the ink to be a to-be-corroded area, exposing metal in the area to facilitate subsequent etching operation, placing the plate in strong acid or strong base solution after the ink pattern is dried, enabling the strong acid or strong base solution to chemically react with the metal area which is not coated with the ink to form heat dissipation holes, enabling the area of each heat dissipation hole to be smaller than or equal to 4mm, and enabling the hole spacing to be smaller than or equal to 0.6mm, enabling a case formed by the plate to meet heat dissipation requirements, being low in cost and simple in process, being capable of shielding conventional external foreign matters from entering the inside of the case when a variable pitch driving. Meanwhile, the area of the heat dissipation holes and the distance between the two heat dissipation holes are proper, and foreign matters are prevented from penetrating through the heat dissipation holes on the premise that the heat dissipation requirements are met.
Referring to fig. 1, fig. 1 is a method for manufacturing a heat dissipation cover of the present invention, the method for manufacturing the heat dissipation cover includes:
step S10, screen printing is carried out on the plate, and ink is coated on the plate to form an ink pattern with a mesh shape;
screen printing consists of five major elements, namely a screen plate, a squeegee blade, ink, a printing table, and a substrate. The basic principle of screen printing is as follows: the basic principle that the meshes of the image-text part and the non-image-text part of the screen printing plate are ink-permeable and ink-impermeable is utilized for printing. When printing, ink is poured into one end of the screen printing plate, a scraping scraper plate is used for applying a certain pressure on the ink part on the screen printing plate, and meanwhile, the ink moves towards the other end of the screen printing plate. The ink is pressed by the scraper blade from the mesh of the image-text part to the printing material during the movement. The printing mark is fixed in a certain range due to the viscous action of the ink, the scraper blade is always in line contact with the screen printing plate and the printing stock in the printing process, the contact line moves along with the movement of the scraper blade, and a certain gap is kept between the screen printing plate and the printing stock, so that the screen printing plate generates a reaction force to the scraper blade through the self tension in the printing process, and the reaction force is called as a rebound force. Under the action of resilience force, the screen printing plate is in movable line contact with the printed material, and other parts of the screen printing plate are separated from the printed material. The ink and the silk screen are fractured, the printing size precision is ensured, and the smearing of printing stocks is avoided. When the scraper blade scrapes the whole page, the scraper blade is lifted, and meanwhile, the screen printing plate is also lifted, and the ink is slightly scraped back to the initial position. This is now a print stroke.
In this embodiment, the case may be surrounded by a plate, and a square shape is taken as an example as an entire body, a heat sink may be placed inside the case to exchange heat with hot air inside the case, so that, in order to facilitate air circulation, ink may be coated on the plate to form an ink pattern having a mesh shape, the area covered by the ink belongs to an area that does not need to be corroded, and the mesh-shaped area formed by the ink is a to-be-corroded area, and metal in the area is exposed to facilitate subsequent etching operation;
step S20, drying the plate coated with the printing ink;
in this embodiment, in order to prevent the change of the mesh shape pattern caused by the non-drying of the ink, the ink pattern is subjected to a drying process;
it is understood that the drying method includes natural drying or drying, wherein the natural drying time is greater than or equal to 1.5 hours, the drying time is 6 to 9 minutes, and the drying temperature is 58 to 80 ℃. On the dried plate, the ink patterns are completely stuck on the plate and are not easy to fall off.
Step S30, placing the dried plate into a corrosion tank, and corroding the mesh part, which is not covered by the ink, on the plate by using corrosive liquid in the corrosion tank to form heat dissipation holes; wherein, the area of the heat dissipation holes is less than or equal to 4mm, and the hole spacing between adjacent heat dissipation holes is less than or equal to 0.6 mm.
In the embodiment, the plate is placed in the strong acid or strong alkali solution, the strong acid or strong alkali solution and the metal area which is not coated with the printing ink generate a chemical reaction to form the heat dissipation holes, the area of each heat dissipation hole is smaller than or equal to 4mm, and the hole distance is smaller than or equal to 0.6mm, so that a case formed by the plate meets the heat dissipation requirement.
In the technical scheme provided by the embodiment, the plate is coated with the ink through screen printing to form the ink pattern with the mesh shape, the plate is placed in the strong acid or strong alkali solution for etching, and the ink pattern is provided with the heat dissipation holes to be etched, and other areas are covered by the ink, so that the parts in the heat dissipation holes are corroded by the strong acid or strong alkali solution, and the heat dissipation holes penetrating through the plate are finally formed. By the manufacturing method, the integrated chassis can be etched to obtain the heat dissipation holes with the specified size. Compared with the traditional process for arranging the heat dissipation cover on the case, the manufacturing method does not need to weld the heat dissipation cover on a plate, so that the cost for improving the corrosion resistance of a welding position by spraying is reduced, the problem of low heat dissipation effect caused by spraying substances on the opening area of the heat dissipation holes can be solved while the manufacturing cost is saved, meanwhile, the area of the heat dissipation holes and the distance between the two heat dissipation holes are proper, and foreign matters are prevented from penetrating through the heat dissipation holes on the premise of meeting the heat dissipation requirement.
It can be understood that the printing ink patterns can be coated on the whole plate through screen printing, the whole plate is placed in strong acid or strong alkali solution, and after the plate is corroded and the radiating holes meeting the process requirements are formed in the plate, the whole plate is punched to form the integrated case.
It can be understood that the etching of the invention can adopt electrochemical etching besides adopting strong acid or strong base solution, and the plate is used as an anode, and the electrolyte is used for electrifying and the anode is dissolved, thereby achieving the purpose of etching the heat dissipation holes, reducing the environmental pollution and having no harm to the health of operators.
Referring to fig. 2, fig. 2 is a second embodiment of the method for manufacturing a heat dissipation cover according to the present invention, and based on the first embodiment, after step S20, the method further includes:
and step S21, performing water immersion treatment on the dried ink pattern to remove impurities on the ink pattern.
In this embodiment, since dust exists in the air, the dried ink pattern needs to be subjected to water immersion treatment, the water immersion is performed with clear water, and the plate is dried again, and the final plate can be subjected to etching operation.
Referring to fig. 3, fig. 3 is a third embodiment of the method for manufacturing a heat dissipation cover according to the present invention, and based on the first embodiment, before the step S10, the method further includes:
step S11, removing the anti-rust oil coated on the plate;
step S12, cleaning the plate;
and step S13, drying the cleaned plate.
In this embodiment, since the anti-rust oil is coated on the board during transportation or storage of the board to prevent the board from rusting, before the preset pattern is printed, the anti-rust oil on the board needs to be removed, for example, a special detergent for removing industrial oil may be used, after the anti-rust oil is removed, the board is cleaned with clean water, and is dried, so that the board meets the process standard of coating ink.
Referring to fig. 4, fig. 4 is a fourth embodiment of the method for manufacturing a heat dissipation cover of the present invention, and based on the first embodiment, after step S30, the method further includes:
step S31, removing the ink on the surface of the plate;
step S32, cleaning the plate to remove the liquid used for removing the ink on the surface of the plate;
and step S33, drying the surface of the plate.
In this embodiment, after the etching operation is completed, the plate is away from the strong acid or strong alkali solution, and the heat dissipation holes are formed, so that the residual strong acid or strong alkali solution or reaction waste liquid and the like on the plate need to be removed, so as to facilitate subsequent processing of the plate. It is understood that a cleaning solution that is neutralized with a strong acid or strong alkali solution may be used to completely clean the remaining strong acid or strong alkali solution or reaction waste liquid, etc. on the board.
After removing the residual strong acid or strong base solution or reaction waste liquid and the like on the plate, the plate can be washed by clear water, so that the reaction liquid is not attached to the ink on the surface of the plate, and the plate is dried to remove the hardened ink on the plate. The ink removing method mainly comprises the following steps: and (3) immersing the board into NaOH alkali liquor, controlling the temperature, immersing until the printing ink drops, then selecting clear water for washing, and drying to form the finished board with the heat dissipation holes.
In the technical scheme provided by this embodiment, after the etching operation is completed, the ink on the board needs to be removed to obtain a finished case with heat dissipation holes, so as to facilitate the subsequent manual inspection for qualification.
Referring to fig. 5 to 7, the present invention further provides a heat dissipation cover (not shown in the drawings), which includes a plate (not labeled in the drawings), wherein a plurality of corroded heat dissipation holes a are formed in the plate, the area of each heat dissipation hole a is less than or equal to 4mm, and the hole pitch between adjacent heat dissipation holes a is less than or equal to 0.6 mm.
The wind power generation is used as clean energy, and has obvious advantages. The variable pitch driving device 100 is used as a core component in the wind power system, and the requirement on the reliability of the variable pitch driving device 100 is very high.
During operation, the internal devices of the variable pitch drive device 100 generate a large amount of heat, the heat is transferred to the heat dissipation teeth of the radiator, and the heat is taken away from the heat dissipation teeth by forcing air to flow through the fan, so that the internal devices can work normally within a safe temperature range. Due to the limitation of the processing technology factors, the size of the heat dissipation holes formed in the conventional heat dissipation cover is large, so that external foreign matters easily enter the inside of the variable-pitch driver through the heat dissipation holes when equipment is assembled or operated, and the variable-pitch driver fails; in addition, due to the limitation of the processing technology, the hole spacing between adjacent heat dissipation holes on the existing heat dissipation cover is also larger, so that the number of holes formed in the heat dissipation holes is influenced, and the heat dissipation effect is influenced.
Secondly, although the size of the heat dissipation holes is less than or equal to 2m x 2mm, the hole spacing is more than or equal to 1 time of the thickness of the part material, and the heat dissipation effect is affected due to the insufficient opening area of the heat dissipation holes. A heat dissipation cover of a small-size heat dissipation hole A is characterized in that a metal mesh grid (not less than 10 meshes) is welded on a plate for manufacturing a case, the size of the heat dissipation hole A is not more than 2mm x 2mm, namely the area of the heat dissipation hole A is not more than 4mm, and the hole spacing is not more than 0.6 mm.
The plate with the radiating holes A of which the size is less than or equal to 2mm x 2mm and the hole spacing is less than or equal to 0.6mm is manufactured by the manufacturing method of the radiating cover, the integrated chassis with the radiating holes A is manufactured by utilizing the plate, the radiating requirement is met, the cost is low, the process is simple, and the conventional external foreign matters can be prevented from entering the interior of the chassis when the variable pitch driving equipment 100 is assembled or operated, so that the variable pitch driving equipment 100 is prevented from being damaged.
Specifically, the heat dissipation hole A is rectangular, and the side length of each rectangle is less than or equal to 2 mm; or the shape of the heat dissipation hole A is circular, and the diameter of the circle is smaller than or equal to 2 mm. As an alternative embodiment, the shape of the heat dissipation hole A can be a rectangle, wherein each side is less than or equal to 2mm, so that the area of the heat dissipation hole A is less than or equal to 4 mm. The shape of the heat dissipation hole A can also be circular, wherein, the diameter is less than or equal to 2mm, so that the area of the heat dissipation hole A is less than or equal to 4 mm.
Specifically, the plate is made of stainless steel. In this embodiment, the plate can be made of stainless steel material so as to form a plurality of heat dissipation holes a through a corrosion process, and meanwhile, the stainless steel can improve the heat dissipation effect of the whole case.
Secondly, the plate manufactured by adopting the stainless steel and the corrosion process does not need surface anti-corrosion treatment, and the plate with the heat dissipation holes A and capable of resisting salt spray corrosion can be obtained.
Specifically, a plurality of heat dissipation holes A on the plate are arranged in a circular or square shape. In this embodiment, in order to further prevent the external foreign objects from passing through the heat dissipation holes a, a plurality of heat dissipation holes a on one board may be arranged in a square structure, or a plurality of heat dissipation holes a on a board may be arranged in a circular structure. When the machine case is formed by utilizing the two boards, the area of the radiating holes A which are arranged in the square shape is larger than that of the radiating holes A which are arranged in the circular shape, wherein the radiating holes A which are arranged in the circular shape form an air inlet, so that external foreign matters can be effectively prevented from entering the machine case, and the radiating holes A which are arranged in the square shape form an air blowing port, so that internal impurities can be effectively discharged to the outside.
The present invention also provides a chassis (not labeled in the figures), comprising: a base plate 11; the box plates 10 are arranged on the bottom plate 11, and two adjacent box plates 10 are connected with each other; the top plate (not shown in the figure) is covered on one end, away from the bottom plate 11, of the box plates 10, and the bottom plate 11, the box plates 10 and the top plate are surrounded to form a box body structure; the two box plates which are oppositely arranged in the box body structure adopt the heat dissipation cover. The specific structure of the heat dissipation cover refers to the above embodiments, and since the chassis adopts all the technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.
It will be appreciated that the box board 10 is made from sheet material.
The present invention further provides a pitch driving apparatus 100, where the pitch driving apparatus 100 includes the above-mentioned chassis (not labeled in the figures), and the pitch driving apparatus 100 further includes: a driving assembly 20 disposed inside the case; and a heat dissipation fan (not shown) for dissipating heat of the driving assembly 20, wherein the heat dissipation fan is disposed between the two box boards 10 which are oppositely disposed and provided with a plurality of heat dissipation holes a. The specific structure of the chassis refers to the above embodiments, and since the pitch drive device 100 adopts all technical solutions of all the above embodiments, at least all beneficial effects brought by the technical solutions of the above embodiments are achieved, and are not described in detail herein.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A manufacturing method of a heat dissipation cover is characterized by comprising the following steps:
performing screen printing on a plate, and coating ink on the plate to form an ink pattern with a mesh shape;
drying the plate coated with the ink;
placing the dried plate into a corrosion tank, and corroding the mesh part which is not covered by the printing ink on the plate by using corrosive liquid in the corrosion tank to form heat dissipation holes; wherein, the area of the heat dissipation holes is less than or equal to 4mm, and the hole spacing between adjacent heat dissipation holes is less than or equal to 0.6 mm.
2. The method of manufacturing a heat sink cover according to claim 1, wherein the step of drying the plate coated with the ink further comprises:
and carrying out water immersion treatment on the dried ink pattern to remove impurities on the ink pattern.
3. The method of manufacturing a heat dissipation cover as claimed in claim 1, wherein the screen printing on the plate material to apply the ink to the plate material to form the ink pattern having the mesh shape comprises:
removing the anti-rust oil coated on the plate;
cleaning the plate;
drying the cleaned plate.
4. The method for manufacturing a heat dissipation cover according to claim 1, wherein the step of placing the dried plate into an etching tank, etching the mesh portion of the plate not covered by the ink with an etching solution in the etching tank, and forming the heat dissipation holes further comprises:
removing the printing ink on the surface of the plate;
cleaning the plate to remove the liquid used for removing the printing ink on the surface of the plate;
and drying the surface of the plate.
5. The heat dissipation cover is characterized by comprising a plate, wherein a plurality of corroded heat dissipation holes are formed in the plate, the area of each heat dissipation hole is smaller than or equal to 4mm, and the hole distance between every two adjacent heat dissipation holes is smaller than or equal to 0.6 mm.
6. The heat dissipation cover of claim 5, wherein the heat dissipation hole is rectangular, and each side of the rectangle is less than or equal to 2 mm; or the shape of the heat dissipation hole is circular, and the diameter of the circle is smaller than or equal to 2 mm.
7. The heat sink cover of claim 5, wherein said sheet material is stainless steel.
8. The heat sink cover according to any of claims 5 to 7, wherein the plurality of heat dissipating holes are arranged in a circular or square shape.
9. A chassis, comprising:
a base plate;
the box plates are arranged on the bottom plate, and two adjacent box plates are connected with each other;
the top plate is covered on one end of the box plates far away from the bottom plate, and the bottom plate, the box plates and the top plate are surrounded to form a box body structure;
the heat dissipation cover of any one of claims 1-5 is adopted by a group of two oppositely arranged box plates in the box body structure.
10. A pitch drive apparatus, characterized in that the pitch drive apparatus comprises the chassis of claim 9, the pitch drive apparatus further comprising:
the driving assembly is arranged inside the box body; and the number of the first and second groups,
and the heat dissipation fan is arranged between the two box plates which are oppositely arranged and provided with a plurality of heat dissipation holes.
CN202011039355.3A 2020-09-28 2020-09-28 Manufacturing method of heat dissipation cover, case and variable pitch driving device Pending CN112064025A (en)

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CN202011039355.3A CN112064025A (en) 2020-09-28 2020-09-28 Manufacturing method of heat dissipation cover, case and variable pitch driving device

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CN213680893U (en) * 2020-09-28 2021-07-13 深圳市汇川技术股份有限公司 Heat dissipation cover, case and variable-pitch driving equipment

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CN213680893U (en) * 2020-09-28 2021-07-13 深圳市汇川技术股份有限公司 Heat dissipation cover, case and variable-pitch driving equipment

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Application publication date: 20201211