CN112053851B - A solid electrolytic capacitor with silver paste cathode - Google Patents
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 96
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 95
- 239000004332 silver Substances 0.000 title claims abstract description 95
- 239000003990 capacitor Substances 0.000 title claims abstract description 28
- 239000007787 solid Substances 0.000 title claims abstract description 12
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 239000003989 dielectric material Substances 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 5
- 239000003792 electrolyte Substances 0.000 claims description 4
- 238000005470 impregnation Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 239000010405 anode material Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000007784 solid electrolyte Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 238000002791 soaking Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 5
- 229920001940 conductive polymer Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
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Abstract
本发明提出一种含银浆阴极的固体电解电容器,所述电容器的阴极为一体化的覆银内芯,所述覆银内芯包括以多层经预浸银浆处理的素子堆叠而成的内芯,还包括覆于内芯外壁处的银浆固化层;所述银浆固化层的制备方法为,先向内置有内芯的模具注入银浆并对模具进行高频振动,再以高温对模具内的银浆进行固化,形成一体化的覆银内芯;本发明具有便于批量生产、改善器件ESR性能和寿命等优点。
The present invention provides a solid electrolytic capacitor containing a silver paste cathode. The cathode of the capacitor is an integrated silver-coated inner core. The inner core also includes a silver paste solidified layer covering the outer wall of the inner core; the preparation method of the silver paste solidified layer is as follows: firstly injecting silver paste into the mold with the inner core and vibrating the mold at high frequency, and then using a high temperature The silver paste in the mold is solidified to form an integrated silver-coated inner core; the invention has the advantages of being convenient for mass production, improving the ESR performance and life of the device, and the like.
Description
技术领域technical field
本发明涉及电子元件制造技术领域,尤其是一种含银浆阴极的固体电解电容器。The invention relates to the technical field of electronic component manufacturing, in particular to a solid electrolytic capacitor containing a silver paste cathode.
背景技术Background technique
高端电容器的市场需求逐步趋向高可靠性能、低ESR(等效串联电阻阻值)、小型化和大容量,特别是堆叠式固体电解电容,依次在高纯度铝箔表面形成电介质、导电高分子作为电解质、阴极引出层。将完成引出后的素子阳极通过焊接方式与引线框的阳极连接,通过导电胶将素子阴极与引线框的阴极连接形成叠层后芯子,最后通过注入树脂在封装模腔内固化成型,树脂外壳起到保护内部芯子的功能。在固体电解电容器的生产过程中,需要对固体电解电容器芯子阴极进行被银浆工作。The market demand for high-end capacitors is gradually trending towards high reliability, low ESR (equivalent series resistance), miniaturization and large capacity, especially for stacked solid electrolytic capacitors, which in turn form dielectrics and conductive polymers on the surface of high-purity aluminum foils as electrolytes , Cathode extraction layer. The lead-out element anode is connected to the anode of the lead frame by welding, and the element cathode is connected to the cathode of the lead frame through conductive glue to form a laminated core. It functions to protect the inner core. In the production process of solid electrolytic capacitors, it is necessary to perform silver paste work on the cathode of the solid electrolytic capacitor core.
现有技术的缺点在于:因为含浸方式实现单片素子含银阴极层,但堆叠结构实现层与层之间并联均需要点导电银膏方式实现,此类方法无论接触面积和连接质量均无法与一体银浆固化后的效果相媲美,导致产品难以实现超低ESR,且ESR正态分布分散,从而导致产品高频应用领域对超低ESR的需求难于满足,也制约了产品在高性能领域的应用,因其粘连界面容易在考核过程中物理脱离,导致ESR性能恶化。本发明要解决的技术问题,在于提供一种银浆阴极制备方法,可有效解决现有银浆含浸技术和点银膏叠层方法存在缺陷,具有便于批量生产、改善器件ESR性能和寿命等优点。The disadvantage of the prior art is: because the impregnation method realizes the silver-containing cathode layer of a single element, but the stacking structure realizes the parallel connection between the layers and requires a conductive silver paste method. The effect of the one-piece silver paste after curing is comparable, which makes it difficult for the product to achieve ultra-low ESR, and the ESR is normally distributed and dispersed, which makes it difficult to meet the demand for ultra-low ESR in the high-frequency application field of the product, and also restricts the product in the high-performance field. application, because the adhesion interface is easy to physically detach during the assessment process, resulting in the deterioration of ESR performance. The technical problem to be solved by the present invention is to provide a method for preparing a silver paste cathode, which can effectively solve the defects of the existing silver paste impregnation technology and the silver paste lamination method, and has the advantages of being convenient for mass production, improving the ESR performance and life of the device, etc. .
发明内容SUMMARY OF THE INVENTION
本发明提出一种含银浆阴极的固体电解电容器,具有便于批量生产、改善器件ESR性能和寿命等优点。The present invention provides a solid electrolytic capacitor containing a silver paste cathode, which has the advantages of being convenient for mass production, improving the ESR performance and service life of the device, and the like.
本发明采用以下技术方案。The present invention adopts the following technical solutions.
一种含银浆阴极的固体电解电容器,所述电容器的阴极为一体化的覆银内芯,所述覆银内芯包括以多层经预浸银浆处理的素子堆叠而成的内芯,还包括覆于内芯外壁处的银浆固化层;所述银浆固化层的制备方法为,先向内置有内芯的模具注入银浆并对模具进行高频振动,再以高温对模具内的银浆进行固化,形成一体化的覆银内芯。A solid electrolytic capacitor containing a silver paste cathode, the cathode of the capacitor is an integrated silver-coated inner core, and the silver-coated inner core comprises an inner core formed by stacking multiple layers of elements treated with pre-impregnated silver paste, It also includes a silver paste solidified layer covering the outer wall of the inner core; the preparation method of the silver paste solidified layer is as follows: firstly injecting silver paste into a mold with a built-in inner core and vibrating the mold with high frequency, and then using a high temperature to irrigate the inside of the mold. The silver paste is solidified to form an integrated silver-coated inner core.
所述电容器的制备工序包括素子加工工序和素子堆叠工序;The preparation process of the capacitor includes an element processing process and an element stacking process;
所述素子加工工序包括:The element processing procedure includes:
步骤A1、在电容阳极材料表面上形成氧化膜使之可作为氧化膜介质材料;Step A1, forming an oxide film on the surface of the capacitor anode material so that it can be used as an oxide film dielectric material;
步骤A2、使用阻隔胶在氧化膜介质材料处划分电容阴极区和阳极区;Step A2, using a barrier glue to divide the capacitor cathode area and the anode area at the oxide film dielectric material;
步骤A3、在氧化膜介质材料阴极区外表面上形成导电高分子聚合物作为固体电解质层;Step A3, forming a conductive polymer as a solid electrolyte layer on the outer surface of the cathode region of the oxide film dielectric material;
步骤A4、在电解质层外表面形成导电碳阴极层;Step A4, forming a conductive carbon cathode layer on the outer surface of the electrolyte layer;
步骤A5、在导电碳阴极层外表面形成导电银阴极层使含银导电阴极成型;Step A5, forming a conductive silver cathode layer on the outer surface of the conductive carbon cathode layer to shape the silver-containing conductive cathode;
所述素子堆叠工序包括:The element stacking process includes:
步骤B1、将各层素子压紧后形成具有叠层结构的内芯芯子;Step B1, compressing each layer of elements to form an inner core with a laminated structure;
步骤B2、将多片素子的阳极和引线框阳极通过焊接连接;Step B2, connecting the anodes of the plurality of elements and the anodes of the lead frame by welding;
步骤B3、使用模具注入银浆使内芯芯子固化为一体化覆银内芯;Step B3, using a mold to inject silver paste to solidify the inner core into an integrated silver-coated inner core;
步骤B4、将固化后的一体化覆银内芯进行封装。Step B4, encapsulating the cured integrated silver-coated inner core.
所述步骤A5采用的方法包括,将完成导电碳阴极层的素子预浸含银量为45-65%银浆的方法;The method used in the step A5 includes the method of pre-impregnating the element with the conductive carbon cathode layer with a silver content of 45-65% silver paste;
所述步骤B1采用的方法包括,在逐层堆叠素子时把引线框阴极工件放于素子中间,从而把引线框阴极工件夹在叠层结构中间的办法。The method used in the step B1 includes the method of placing the lead frame cathode workpiece in the middle of the elements when stacking the elements layer by layer, so as to sandwich the lead frame cathode workpiece in the middle of the stacked structure.
所述模具内设有矩形的模具腔,模具顶部设有注入口;The mold is provided with a rectangular mold cavity, and the top of the mold is provided with an injection port;
在执行步骤B3时,先把内芯芯子置于模具腔中,再从模具的顶部注入口向模具腔内注入含银量为35-55%银浆,使用高频振动技术对模具振动,使注入模具腔的银浆能填满素子于素子之间的间隙以及内芯芯子与模具腔腔壁之间的空间,然后进行高温固化。When performing step B3, first place the inner core in the mold cavity, then inject silver paste with a silver content of 35-55% into the mold cavity from the top injection port of the mold, and use high-frequency vibration technology to vibrate the mold. The silver paste injected into the mold cavity can fill the gap between the elements and the space between the inner core and the cavity wall of the mold cavity, and then is cured at high temperature.
所述高温固化为使用150°C高温对注入模具腔的银浆固化30分钟。Described high temperature curing is to use 150 ℃ of high temperature to solidify the silver paste injected into the mold cavity for 30 minutes.
所述模具包括上模和下模。The mold includes an upper mold and a lower mold.
在步骤A5中对素子预浸的银浆,其含银量高于步骤B3中向模具注入的银浆。In step A5, the silver paste pre-impregnated for the element has a higher silver content than the silver paste injected into the mold in step B3.
本发明所述方案的优点在于能有效解决现有银浆含浸技术和点银膏叠层方法存在缺陷,具有便于批量生产、改善器件ESR和寿命等优点。The advantages of the solution of the present invention are that it can effectively solve the defects of the existing silver paste impregnation technology and dot silver paste stacking method, and has the advantages of being convenient for mass production, improving the ESR and life of the device, and the like.
附图说明Description of drawings
下面结合附图和具体实施方式对本发明进一步详细的说明:The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments:
附图1是本发明所述电容器的示意图;Accompanying
附图2是本发明所述电容器另一方向上的示意图;Accompanying
附图3是步骤B3的示意图;Accompanying
附图4是步骤B3的另一示意图;Accompanying drawing 4 is another schematic diagram of step B3;
附图5是模具的示意图;Accompanying drawing 5 is the schematic diagram of mould;
图中:1-阳极;2-阻隔胶;3-阴极;4-引线框阴极工件;5-素子;6-模具;7-模具腔;8-上模;9-下模。In the figure: 1-anode; 2-barrier glue; 3-cathode; 4-lead frame cathode workpiece; 5-element; 6-mold; 7-mold cavity; 8-upper mold; 9-lower mold.
具体实施方式Detailed ways
如图所示,一种含银浆阴极的固体电解电容器,所述电容器的阴极2为一体化的覆银内芯,所述覆银内芯包括以多层经预浸银浆处理的素子5堆叠而成的内芯,还包括覆于内芯外壁处的银浆固化层;所述银浆固化层的制备方法为,先向内置有内芯的模具6注入银浆并对模具进行高频振动,再以高温对模具内的银浆进行固化,形成一体化的覆银内芯。As shown in the figure, a solid electrolytic capacitor containing a silver paste cathode, the
所述电容器的制备工序包括素子加工工序和素子堆叠工序;The preparation process of the capacitor includes an element processing process and an element stacking process;
所述素子加工工序包括:The element processing procedure includes:
步骤A1、在电容阳极材料表面上形成氧化膜使之可作为氧化膜介质材料;Step A1, forming an oxide film on the surface of the capacitor anode material so that it can be used as an oxide film dielectric material;
步骤A2、使用阻隔胶3在氧化膜介质材料处划分电容阴极区和阳极区;Step A2, using the
步骤A3、在氧化膜介质材料阴极区外表面上形成导电高分子聚合物作为固体电解质层;Step A3, forming a conductive polymer as a solid electrolyte layer on the outer surface of the cathode region of the oxide film dielectric material;
步骤A4、在电解质层外表面形成导电碳阴极层;Step A4, forming a conductive carbon cathode layer on the outer surface of the electrolyte layer;
步骤A5、在导电碳阴极层外表面形成导电银阴极层使含银导电阴极成型;Step A5, forming a conductive silver cathode layer on the outer surface of the conductive carbon cathode layer to shape the silver-containing conductive cathode;
所述素子堆叠工序包括:The element stacking process includes:
步骤B1、将各层素子压紧后形成具有叠层结构的内芯芯子;Step B1, compressing each layer of elements to form an inner core with a laminated structure;
步骤B2、将多片素子的阳极1和引线框阳极通过焊接连接;Step B2, connecting the
步骤B3、使用模具注入银浆使内芯芯子固化为一体化覆银内芯;Step B3, using a mold to inject silver paste to solidify the inner core into an integrated silver-coated inner core;
步骤B4、将固化后的一体化覆银内芯进行封装。Step B4, encapsulating the cured integrated silver-coated inner core.
所述步骤A5采用的方法包括,将完成导电碳阴极层的素子预浸含银量为45-65%银浆的方法;The method used in the step A5 includes the method of pre-impregnating the element with the conductive carbon cathode layer with a silver content of 45-65% silver paste;
所述步骤B1采用的方法包括,在逐层堆叠素子时把引线框阴极工件4放于素子中间,从而把引线框阴极工件夹在叠层结构中间的办法。The method used in the step B1 includes the method of placing the lead frame cathode workpiece 4 in the middle of the elements when stacking the elements layer by layer, thereby sandwiching the lead frame cathode workpiece in the middle of the stacked structure.
所述模具内设有矩形的模具腔7,模具顶部设有注入口;The mold is provided with a rectangular mold cavity 7, and the top of the mold is provided with an injection port;
在执行步骤B3时,先把内芯芯子置于模具腔中,再从模具的顶部注入口向模具腔内注入含银量为35-55%银浆,使用高频振动技术对模具振动,使注入模具腔的银浆能填满素子于素子之间的间隙以及内芯芯子与模具腔腔壁之间的空间,然后进行高温固化。When performing step B3, first place the inner core in the mold cavity, then inject silver paste with a silver content of 35-55% into the mold cavity from the top injection port of the mold, and use high-frequency vibration technology to vibrate the mold. The silver paste injected into the mold cavity can fill the gap between the elements and the space between the inner core and the cavity wall of the mold cavity, and then is cured at high temperature.
所述高温固化为使用150°C高温对注入模具腔的银浆固化30分钟。Described high temperature curing is to use 150 ℃ of high temperature to solidify the silver paste injected into the mold cavity for 30 minutes.
所述模具包括上模8和下模9。The mold includes an
在步骤A5中对素子预浸的银浆,其含银量高于步骤B3中向模具注入的银浆。In step A5, the silver paste pre-impregnated for the element has a higher silver content than the silver paste injected into the mold in step B3.
实施例:Example:
将完成导电碳阴极层的素子预含浸含银量为65%银浆,再根据工艺需要将引线框阴极夹在中间将素子逐层堆叠,形成叠层结构,将此叠层后形成的芯子放置矩形模具腔内,模具合模后,从顶部注入口向模腔内注入含银量为55%银浆,使用高频振动技术,使银浆填满素子于素子之间和芯子与模具四个界面之间的空间,使用150°C高温固化30分钟;将完成银浆固化的芯子取出,进行封装处理。Pre-impregnate the elements with the conductive carbon cathode layer with a silver content of 65% silver paste, and then sandwich the lead frame cathodes according to the process requirements to stack the elements layer by layer to form a laminated structure. Place it in a rectangular mold cavity. After the mold is closed, inject silver paste with a silver content of 55% into the mold cavity from the top injection port. Use high-frequency vibration technology to fill the silver paste between the elements and between the core and the mold. The space between the four interfaces is cured at a high temperature of 150°C for 30 minutes; the core that has been cured with the silver paste is taken out and packaged.
将上述单片电容器元件进行高温考核数据如下表所示:The high temperature assessment data of the above monolithic capacitor components are shown in the following table:
。 .
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JP2010050218A (en) * | 2008-08-20 | 2010-03-04 | Nec Tokin Corp | Laminated three terminal type solid electrolytic capacitor, and method of manufacturing the same |
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