CN112051872A - Small-sized TEC temperature control equipment - Google Patents

Abstract

The invention discloses small-sized TEC temperature control equipment, which is characterized in that a first upper semiconductor refrigerating sheet group, a second upper semiconductor refrigerating sheet group, a first lower semiconductor refrigerating sheet group and a second lower semiconductor refrigerating sheet group are arranged, and an upper separation cavity and a lower separation cavity are arranged, so that the temperature in the upper separation cavity and the temperature in the lower separation cavity can be equal by a temperature controller, the temperature in the upper separation cavity or the lower separation cavity is between the temperature in the object placing cavity and the external temperature, the temperature in the object placing cavity is a target control temperature, the difference between the temperature in the object placing cavity and the temperature in the upper separation cavity or the lower separation cavity is effectively reduced, the precision of temperature control and the precision of the temperature in the object placing cavity are effectively ensured, and the precision of the temperature in the TEC temperature control equipment.

Description

Small TEC temperature control equipment

technical field

The invention specifically relates to a small TEC temperature control device, and relates to the related field of the temperature control device.

Background technique

At present, TEC temperature control equipment is generally a high-performance temperature control system realized on the basis of semiconductor refrigeration sheet using the principle of semiconductor refrigeration, which generally has the performance of high control accuracy, high stability and long life. However, for some small TEC temperature control equipment, it often requires extremely high accuracy of the internal temperature. In actual use, although the temperature control accuracy is high, due to the temperature difference between the inside and outside, this temperature difference effect will make the temperature control The temperature inside the equipment changes, especially when the temperature difference is large or the outside temperature is changing, because it is difficult to maintain a constant balance between the heat generated by the cooling sheet and the heat loss due to the temperature difference, and the internal temperature will fluctuate to a certain extent. This fluctuation is often affected by the angle of the temperature difference, which in turn affects the control accuracy.

SUMMARY OF THE INVENTION

Therefore, in order to solve the above deficiencies, the present invention provides a small TEC temperature control device.

The present invention is achieved by constructing a small TEC temperature control device, which includes a main body in a rectangular parallelepiped structure, and the main body in a rectangular parallelepiped structure includes two largest surfaces with the largest area and oppositely arranged, wherein the two largest surfaces are respectively The upper top surface and the lower bottom surface are characterized in that the inner side wall of the upper top surface is provided with a first upper semiconductor refrigeration sheet group, and a second upper semiconductor refrigeration sheet group is provided below the first upper semiconductor refrigeration sheet group; and

An upper compartment is arranged between the first upper semiconductor refrigeration sheet group and the second upper semiconductor refrigeration sheet group;

An upper protective plate is arranged on the lower side of the second upper semiconductor refrigeration chip group;

A first lower semiconductor refrigerating sheet group is arranged on the inner side wall of the lower bottom surface, and a second lower semiconductor refrigerating sheet group is arranged above the first lower semiconductor refrigerating sheet group;

A lower compartment is arranged between the first lower semiconductor refrigeration sheet group and the second lower semiconductor refrigeration sheet group;

A lower protective plate is fixed above the second lower semiconductor refrigeration sheet group;

A storage cavity is configured between the upper protective plate and the lower protective plate, and a temperature sensor is arranged in the upper compartment, the lower compartment and the storage cavity;

It also includes a temperature controller, the first upper semiconductor refrigeration sheet group, the second upper semiconductor refrigeration sheet group, the first lower semiconductor refrigeration sheet group, the second lower semiconductor refrigeration sheet group and each temperature sensor are all related to the temperature. the controller controls the connection; and

The temperature controller is configured to make the temperature in the upper compartment and the lower compartment equal, and the temperature in the upper compartment or the lower compartment is located between the temperature in the storage compartment and the outside temperature. In the meantime, the temperature in the storage chamber is the target control temperature.

Further, preferably, the outer surface of the main body is also provided with an outside temperature sensor for detecting the outside temperature, and the absolute value of the difference between the temperature in the upper compartment or the lower compartment and the outside temperature is the first temperature difference value, so The absolute value of the difference between the temperature in the storage cavity and the temperature in the upper compartment or the lower compartment is a second temperature difference value, and the first temperature difference value is at least three times the magnitude of the second temperature difference value.

Further, preferably, the upper protective plate and the lower protective plate are both made of a plate structure made of a thermally conductive material.

Further, preferably, both the upper compartment and the lower compartment are provided with a temperature equalizing plate, the temperature equalizing plate is made of a heat insulating material, and the equalizing holes are densely arranged on the temperature equalizing plate .

Further, preferably, an opening and closing door is further provided on the left side or the right side of the main body in the rectangular parallelepiped structure.

Further, as a preference, the upper top surface and the lower bottom surface have the same structure, and both include a sealed external heat preservation cover and a protective grille, and the front and rear sides of the main body of the cuboid structure are provided on the left and right sides of the top and bottom. There are positioning clamps, the protective grille is provided with a plurality of grid grooves arranged at intervals and extending along the front and rear, the leftmost and rightmost grid grooves are respectively clamped and fixed on the positioning clamps, The sealed outer heat preservation cover is sealed and connected to the outer side of the protective grille.

Further, preferably, the first upper semiconductor refrigeration sheet group and the first lower semiconductor refrigeration sheet group have the same structure, the second upper semiconductor refrigeration sheet group and the second lower semiconductor refrigeration sheet group have the same structure, and the upper partition The cavity is the same size as the lower compartment.

Further, preferably, the first upper semiconductor refrigeration sheet group and the first lower semiconductor refrigeration sheet group each include a plurality of semiconductor refrigeration wheel groups arranged at intervals and arranged in a straight line, and the semiconductor refrigeration wheel group includes a plurality of coaxial For the semiconductor refrigerating wheels provided, each semiconductor refrigerating wheel is supported and arranged by a support, and the semiconductor refrigerating wheels are made by stacking semiconductor refrigerating sheets.

Further, preferably, the second upper semiconductor refrigerating sheet group and the second lower semiconductor refrigerating sheet group have the same structure, and both include a heat-conducting metal plate and a semiconductor refrigerating sheet arranged on the heat-conducting metal plate. fixed on the thermally conductive metal plate.

Further, preferably, the sealed outer heat preservation cover is slidably sealed and connected to the outer side of the protective grille, so that the sealed outer heat preservation cover can be detachably slid open.

The present invention has the following advantages: the small TEC temperature control equipment provided by the present invention has the following advantages compared with the same type of equipment:

(1) The small-sized TEC temperature control device according to the present invention, by arranging the first upper semiconductor refrigeration sheet group, the second upper semiconductor refrigeration sheet group, the first lower semiconductor refrigeration sheet group, and the second lower semiconductor refrigeration sheet group, and The upper compartment and the lower compartment are arranged, so that the temperature control mechanism can make the temperature in the upper compartment and the lower compartment equal, and the temperature in the upper compartment or the lower compartment is located in the storage compartment Between the internal temperature and the external temperature, the temperature in the storage chamber is the target control temperature, which effectively reduces the difference between the temperature in the storage chamber and the temperature in the upper or lower compartment, and effectively ensures the accuracy and maintenance of temperature control. The accuracy of the temperature in the storage cavity improves the accuracy of the temperature in the TEC temperature control equipment;

(2) The absolute value of the difference between the temperature in the upper compartment or the lower compartment and the outside temperature of the present invention is the first temperature difference value, and the absolute value of the difference between the temperature in the storage compartment and the temperature in the upper compartment or the lower compartment is the second temperature difference value, and the first temperature difference value is at least three times the size of the second temperature difference value, which can effectively reduce the second temperature difference value, and because the temperature in the upper compartment and the lower compartment does not require extremely high precision, Therefore, the first temperature difference value is large, and the temperature in the upper compartment or the lower compartment can be roughly constant, while the second temperature difference value is small, which can ensure the high accuracy of the temperature in the storage chamber and realize the high precision of the temperature in the storage chamber. Control, reduce the adverse effect of external temperature difference or external temperature change on the temperature control in the storage cavity.

Description of drawings

Fig. 1 is the structural representation after the present invention disassembles the upper top surface;

Fig. 2 is the top-view structure schematic diagram of the first upper semiconductor refrigeration chip group of the present invention;

Fig. 3 is the principle structure schematic diagram of the present invention;

FIG. 4 is an enlarged schematic view of the position A in FIG. 1 of the present invention.

Detailed ways

The present invention will be described in detail below with reference to the accompanying drawings 1-4, and the technical solutions in the embodiments of the present invention will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. . Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The present invention provides a small TEC temperature control device through improvement, which includes a main body in a rectangular parallelepiped structure, and the main body in a rectangular parallelepiped structure includes two largest surfaces with the largest area and oppositely arranged, wherein the two largest surfaces are the upper The top surface 2 and the lower bottom surface 1 are characterized in that the inner side wall of the upper top surface is provided with a first upper semiconductor refrigeration sheet group 3, and a second upper semiconductor refrigeration sheet group is provided below the first upper semiconductor refrigeration sheet group 3. Group 5; and

An upper compartment 4 is arranged between the first upper semiconductor refrigeration sheet group 3 and the second upper semiconductor refrigeration sheet group 5;

The lower side of the second upper semiconductor refrigeration chip group 5 is provided with an upper protective plate 6;

A first lower semiconductor refrigeration chip group 11 is disposed on the inner side wall of the lower bottom surface, and a second lower semiconductor refrigeration chip group 9 is disposed above the first lower semiconductor refrigeration chip group 11;

A lower compartment 10 is arranged between the first lower semiconductor refrigeration sheet group 11 and the second lower semiconductor refrigeration sheet group 9;

A lower protective plate 8 is fixedly arranged above the second lower semiconductor refrigeration chip group 9;

A storage cavity 7 is configured between the upper protective plate and the lower protective plate, and a temperature sensor is arranged in the upper compartment, the lower compartment and the storage cavity;

It also includes a temperature controller, the first upper semiconductor refrigeration plate group 3, the second upper semiconductor refrigeration plate group 5, the first lower semiconductor refrigeration plate group 11, the second lower semiconductor refrigeration plate group 9 and each temperature sensor are all in control connection with said temperature controller; and

The temperature controller is configured to make the temperature in the upper compartment and the lower compartment equal, and the temperature in the upper compartment or the lower compartment is located between the temperature in the storage compartment and the outside temperature. In the meantime, the temperature in the storage chamber is the target control temperature.

In this embodiment, the outer surface of the main body is further provided with an outside temperature sensor for detecting the outside temperature, and the absolute value of the difference between the temperature in the upper compartment or the lower compartment and the outside temperature is the first temperature difference value, The absolute value of the difference between the temperature in the storage chamber and the temperature in the upper compartment or the lower compartment is a second temperature difference value, and the first temperature difference value is at least three times the magnitude of the second temperature difference value.

The upper protective plate and the lower protective plate are all plate structures made of thermally conductive materials.

Both the upper compartment 4 and the lower compartment are provided with a temperature equalizing plate, the temperature equalizing plate is made of a heat insulating material, and the equalizing holes are densely arranged on the temperature equalizing plate.

An opening and closing door 12 is also provided on the left side or the right side of the main body in the rectangular parallelepiped structure.

The upper top surface 2 and the lower bottom surface 1 have the same structure, and both include a sealed outer heat preservation cover 16 and a protective grille 14. The front side 17 and the rear side 18 of the main body of the rectangular parallelepiped structure are on the left and right sides of the top and bottom. A positioning card post 13 is provided, a plurality of grid grooves 15 arranged at intervals and extending along the front and rear are provided on the protective grille, and the leftmost and rightmost grid grooves are respectively clamped and fixed on the positioning card. On the column, the sealed outer heat preservation cover 16 is sealed and connected to the outer side of the protective grille.

The first upper semiconductor refrigeration sheet group 3 and the first lower semiconductor refrigeration sheet group 11 have the same structure, the second upper semiconductor refrigeration sheet group 5 and the second lower semiconductor refrigeration sheet group 9 have the same structure, and the upper compartment The same size as the lower compartment.

The first upper semiconductor refrigeration plate group 3 and the first lower semiconductor refrigeration plate group 11 both include a plurality of semiconductor refrigeration wheel groups arranged at intervals and arranged in a straight line, and the semiconductor refrigeration wheel group includes a plurality of coaxially arranged semiconductor refrigeration wheel groups. The refrigerating wheel 19, each semiconductor refrigerating wheel is supported and arranged by the support 20, and the semiconductor refrigerating wheel is made by stacking semiconductor refrigerating sheets.

The second upper semiconductor refrigerating sheet group 5 and the second lower semiconductor refrigerating sheet group 9 have the same structure, and both include a heat-conducting metal plate 22 and a semiconductor refrigerating sheet 21 arranged on the heat-conducting metal plate. on the thermally conductive metal plate.

The sealed outer thermal insulation cover 16 is slidably and sealedly connected to the outer side of the protective grille, so that the sealed outer thermal insulation cover can be detachably slid open.

The small TEC temperature control device of the present invention is provided with a first upper semiconductor refrigerating chip group, the second upper semiconductor refrigerating chip group, a first lower semiconductor refrigerating chip group, and a second lower semiconductor refrigerating chip group, and an upper partition is provided. In this way, the temperature control mechanism can make the temperature in the upper compartment and the lower compartment equal, and the temperature in the upper compartment or the lower compartment is the same as the temperature in the storage compartment Between the temperature of the storage chamber and the outside temperature, the temperature in the storage chamber is the target control temperature, which effectively reduces the difference between the temperature in the storage chamber and the temperature in the upper or lower compartment, effectively ensures the accuracy of temperature control and maintains the temperature in the storage chamber. The accuracy of the temperature improves the accuracy of the temperature in the TEC temperature control device; the absolute value of the difference between the temperature in the upper compartment or the lower compartment and the outside temperature in the present invention is the first temperature difference value, and the temperature in the storage compartment is the same as the temperature in the upper compartment. Or the absolute value of the temperature difference in the lower compartment is the second temperature difference value, and the first temperature difference value is at least three times the size of the second temperature difference value, which can effectively reduce the second temperature difference value. The temperature in the compartment does not require extremely high precision, therefore, the first temperature difference is large, which can achieve a roughly constant temperature in the upper compartment or the lower compartment, while the second temperature difference is small, which can ensure the temperature in the storage compartment. High precision, realizes high-precision control of the temperature in the storage cavity, and reduces the adverse effect of the external temperature difference or the change of the external temperature on the temperature control in the storage cavity.

The basic principles and main features of the present invention and the advantages of the present invention are shown and described above, and the standard parts used in the present invention can be purchased from the market, and the special-shaped parts can be customized according to the descriptions in the specification and drawings. The specific connection method of each part adopts the conventional methods such as mature bolts, rivets and welding in the prior art, and the machinery, parts and equipment adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection in the prior art. method, which will not be described in detail here.

The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A small TEC temperature control device, comprising a main body in a rectangular parallelepiped structure, and the main body in a rectangular parallelepiped structure includes two largest surfaces with the largest area and oppositely arranged, wherein the two largest surfaces are the upper top surface (2) and a lower bottom surface (1), characterized in that the inner side wall of the upper top surface is provided with a first upper semiconductor refrigeration sheet group (3), and a second upper semiconductor refrigeration sheet group (3) is provided below the first upper semiconductor refrigeration sheet group (3). an upper semiconductor refrigeration chip group (5); and An upper compartment (4) is arranged between the first upper semiconductor refrigeration sheet group (3) and the second upper semiconductor refrigeration sheet group (5); The lower side of the second upper semiconductor refrigeration chip group (5) is provided with an upper protective plate (6); A first lower semiconductor refrigeration sheet group (11) is arranged on the inner side wall of the lower bottom surface, and a second lower semiconductor refrigeration sheet group (9) is arranged above the first lower semiconductor refrigeration sheet group (11); A lower compartment (10) is arranged between the first lower semiconductor refrigeration sheet group (11) and the second lower semiconductor refrigeration sheet group (9); A lower protective plate (8) is fixedly arranged above the second lower semiconductor refrigeration sheet group (9); A storage cavity (7) is configured between the upper protective plate and the lower protective plate, and a temperature sensor is arranged in the upper compartment, the lower compartment and the storage cavity; Also includes a temperature controller, the first upper semiconductor refrigeration sheet group (3), the second upper semiconductor refrigeration sheet group (5), the first lower semiconductor refrigeration sheet group (11), and the second lower semiconductor refrigeration sheet group (9) and each temperature sensor are all connected with the temperature controller; and The temperature controller is configured to make the temperature in the upper compartment and the lower compartment equal, and the temperature in the upper compartment or the lower compartment is located between the temperature in the storage compartment and the outside temperature. In the meantime, the temperature in the storage chamber is the target control temperature. 2. The small TEC temperature control device according to claim 1, characterized in that: the outer surface of the main body is also provided with an outside temperature sensor for detecting the outside temperature, and the temperature in the upper compartment or the lower compartment is the same as the outside temperature. The absolute value of the temperature difference is the first temperature difference value, the absolute value of the difference between the temperature in the storage cavity and the temperature in the upper compartment or the lower compartment is the second temperature difference value, and the first temperature difference value is at least the second temperature difference Three times the size of the value. 3 . The small TEC temperature control device according to claim 1 , wherein the upper protective plate and the lower protective plate are both made of a plate structure made of thermally conductive materials. 4 . 4. The small TEC temperature control device according to claim 1, characterized in that: both the upper compartment (4) and the lower compartment are provided with a temperature equalizing plate, and the temperature equalizing plate is made of a heat insulating material. is formed, and the equalizing holes are densely arranged on the temperature equalizing plate. 5 . The small TEC temperature control device according to claim 1 , wherein an opening and closing door ( 12 ) is further provided on the left side or the right side of the main body having a rectangular parallelepiped structure. 6 . 6. The small TEC temperature control device according to claim 5, characterized in that: the upper top surface (2) and the lower bottom surface (1) have the same structure, and both include a sealed outer heat preservation cover (16), a protective grille (14) ), the left and right sides of the top and bottom of the front side (17) and the rear side (18) of the main body of the rectangular parallelepiped structure are provided with positioning clips (13), and the protective grille is provided with a plurality of spacers The grid grooves (15) are arranged and extend along the front and rear, the leftmost and rightmost grid grooves are respectively clamped and fixed on the positioning clamps, and the sealed outer heat preservation cover (16) is sealed and connected to the the outside of the protective grille. 7. The small TEC temperature control device according to claim 1, characterized in that: the first upper semiconductor refrigeration chip group (3) and the first lower semiconductor refrigeration chip group (11) have the same structure, and the second upper semiconductor refrigeration chip group (11) has the same structure. The refrigerating sheet group (5) and the second lower semiconductor refrigerating sheet group (9) have the same structure, and the upper compartment and the lower compartment have the same volume size. 8. The small TEC temperature control device according to claim 1, characterized in that: the first upper semiconductor refrigeration sheet group (3) and the first lower semiconductor refrigeration sheet group (11) both comprise a plurality of spaced apart A semiconductor refrigerating wheel set arranged in a straight line, the semiconductor refrigerating wheel set includes a plurality of coaxially arranged semiconductor refrigerating wheels (19), each semiconductor refrigerating wheel is supported and arranged by a support (20), and the semiconductor refrigerating wheel is composed of semiconductor refrigerating wheels (19). Refrigeration sheets are superimposed. 9. The small TEC temperature control device according to claim 1, characterized in that: the second upper semiconductor refrigeration sheet group (5) and the second lower semiconductor refrigeration sheet group (9) have the same structure, and both comprise a thermally conductive metal plate ( 22) and a semiconductor refrigeration sheet (21) arranged on a heat-conducting metal plate, each of which is affixed and fixed on the heat-conducting metal plate at intervals. 10. The small TEC temperature control device according to claim 6, characterized in that: the sealed outer heat preservation cover (16) is slidably and sealedly connected to the outside of the protective grille, so as to facilitate the sealing of the outer heat preservation cover Detachable slide open.

Images