CN112051648A - Novel multichannel analog light receiving and transmitting module - Google Patents

Abstract

The application relates to a novel multichannel analog light receiving and transmitting module. The novel multichannel analog light transceiver module comprises a first shell, a second shell and a circuit board assembly. The circuit board assembly is disposed between the first housing and the second housing. The circuit board assembly includes an electronic device and an optical device. And the second shell is provided with a radio frequency power supply multiplexing interface. The radio frequency interface and the power interface are integrated in a standard radio frequency power supply multiplexing interface and are arranged up and down, so that the novel multi-channel analog light receiving and transmitting module is simpler in appearance structure, smaller in size and higher in integration level. The radio frequency power supply multiplexing interface can not accumulate dust, improves the plugging performance, reduces the plugging operation frequency in practical application, and can prolong the service life.

Description

New Multi-Channel Analog Optical Transceiver Module

technical field

The present application relates to the field of optoelectronics, in particular to a novel multi-channel analog optical transceiver module.

Background technique

In the prior art, an optical transceiver module is usually composed of an optoelectronic device, a functional circuit, an optical interface, a radio frequency interface, etc. The optoelectronic device includes two channels for transmitting and one for receiving. Optical transceiver modules can be divided into 1×9, SFP, SFF, GBIC, XENPAK, XFP and other types according to the package. However, among the existing optical transceiver modules, the new multi-channel analog optical transceiver module has many various functional interfaces, which makes the structure of the optical transceiver module complex and the volume larger.

SUMMARY OF THE INVENTION

Based on this, in view of the above problems, a novel multi-channel analog optical transceiver module is provided.

A new type of multi-channel analog optical transceiver module, including:

a first shell and a second shell;

A circuit board assembly is arranged between the first casing and the second casing, the circuit board assembly includes an electronic device and an optical device, and the second casing is provided with a radio frequency power multiplexing interface.

In one embodiment, the second housing is further provided with a first installation hole, and the radio frequency power multiplexing interface is installed and adapted to the application interface through the first installation hole.

In one embodiment, the first casing and the second casing are respectively provided with isolation cavities, and the first casing and the second casing are relatively fastened to two sides of the circuit board assembly. In the case of the side, the isolation cavities of the first casing and the second casing accommodate the electronic device and the optical device, respectively, and isolate the electronic device and the optical device.

In one embodiment, a shielding ring is further included, disposed on the first casing or the second casing, and used for shielding the optical paths between the optical devices.

In one embodiment, when the first casing and the second casing are relatively fastened, an optical interface is formed at the contact portion of the first casing and the second casing, and the optical interface is connected to the The LC connector is adapted.

In one embodiment, the first casing and the second casing are provided with corresponding positioning grooves, which are used for positioning the light when the first casing and the second casing are relatively fastened. Interface positioning.

In one embodiment, it further includes an optical device, two bosses are provided on opposite side walls of the optical device, and when the optical device is installed between the first casing and the second casing, the The two bosses are respectively inserted into the positioning grooves of the first casing and the positioning grooves of the second casing.

In one embodiment, the first housing is provided with a fixing structure for preventing the LC connector inserted into the optical interface from falling off.

In one embodiment, the LC connector is further included, an elastic buckle is provided at one end of the LC connector inserted into the optical interface, and the fixing structure includes a side located on the optical interface and disposed on the first housing. The hole structure, when the LC connector is inserted into the optical interface, the elastic buckle is embedded in the square hole structure.

In one embodiment, the second housing is further provided with a second installation hole, and the novel multi-channel analog optical transceiver module is connected to the system through the second installation hole;

The first housing and the second housing are respectively provided with fixing holes, the novel multi-channel analog optical transceiver module further includes fixing screws, and the first housing and the second housing pass through the The fixing screw is connected through the fixing hole;

Thermal pads are provided between the first casing and the circuit board assembly, and between the circuit board assembly and the second casing.

Embodiments of the present application provide a novel multi-channel analog optical transceiver module. The novel multi-channel analog optical transceiver module includes a first housing, a second housing and a circuit board assembly. The circuit board assembly is disposed between the first housing and the second housing. The circuit board assembly includes electronic devices and optical devices. The second casing is provided with a radio frequency power multiplexing interface. The radio frequency interface and the power interface are integrated into a standard radio frequency power multiplexing interface and installed up and down, so that the appearance structure of the new multi-channel analog optical transceiver module is more concise, the volume is reduced, and the integration degree is improved. The radio frequency power multiplexing interface does not accumulate dust, improves the plugging performance, reduces the frequency of plugging operations in practical applications, and can improve the service life.

Description of drawings:

FIG. 1 is a novel multi-channel analog optical transceiver module provided by an embodiment of the present application;

2 is an exploded diagram of a novel multi-channel analog optical transceiver module provided by an embodiment of the present application;

3 is a bottom view of a novel multi-channel analog optical transceiver module provided by an embodiment of the present application;

4 is a schematic diagram of a first housing of a novel multi-channel analog optical transceiver module provided by an embodiment of the present application;

5 is a cross-sectional view of a novel multi-channel analog optical transceiver module provided by an embodiment of the present application;

Description of reference numbers:

first shell 1

second housing 4

circuit board assembly 3

shield ring 9

Optical interface 5

Positioning slot 10

Fixed structure 11

RF power multiplexing interface 6

The first mounting hole 8

Second mounting hole 7

set screw 2

LC connector 12

Optical device 13 .

Detailed ways

The following describes in detail the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to be used to explain the present application, but should not be construed as a limitation to the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " The orientation or positional relationship indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "clockwise", "counterclockwise", etc. The orientation or positional relationship shown in the figures is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a reference to the present invention. Application restrictions.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of this application, unless stated otherwise, "plurality" means two or more, unless otherwise expressly defined.

In this application, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrally connected; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

Referring to FIGS. 1-3 , an embodiment of the present application provides a novel multi-channel analog optical transceiver module. The novel multi-channel analog optical transceiver module includes a first casing 1 , a second casing 4 and a circuit board assembly 3 . The circuit board assembly 3 is disposed between the first casing 1 and the second casing 4 . The circuit board assembly 3 includes electronic devices and optical devices. The second housing 4 is provided with a radio frequency power multiplexing interface. In one embodiment, the RF power multiplexing interface may be a board-to-board connector. The board-to-board connector may be a standard Samtec board-to-board connector.

Referring to FIG. 3 , the second housing 4 is provided with a radio frequency power multiplexing interface 6 . The RF power multiplexing interface 6 may be disposed on the side of the second casing 4 away from the first casing 1 . That is, the radio frequency power multiplexing interface 6 is arranged at the bottom of the novel multi-channel analog optical transceiver module. The radio frequency interface and the power interface are integrated into a standard radio frequency power multiplexing interface 6 and installed up and down, that is, the standard radio frequency power multiplexing interface 6 has a male-female connector plug-in structure up and down, which has the advantage of saving space. In addition, the radio frequency interface and the power interface are integrated into a standard radio frequency power multiplexing interface 6, so that the appearance structure of the novel multi-channel analog optical transceiver module is more concise and the integration degree is improved.

The appearance structure of the novel multi-channel analog optical transceiver module is more concise, and the integration degree is improved. , and improve the plug-in performance, reduce the frequency of plug-in operations in practical applications, and improve the service life. Further, in the plug-in structure of male and female connectors, the male connector is arranged at the bottom of the new multi-channel analog optical transceiver module and is wrapped by the second housing 4, and the male and female connectors are The two casings 4 are wrapped and will not be exposed to the environment, so the RF power multiplexing interface 6 is not easy to accumulate dust.

In one embodiment, the second housing 4 is further provided with a first mounting hole 8 . The RF power multiplexing interface 6 is installed and adapted to the application interface through the first installation hole 8 . The number of the first mounting holes 8 may be two, which are correspondingly disposed on the side of the second housing 4 away from the first housing 1 . The first mounting holes 8 may be pin holes. When connecting the new multi-channel analog optical transceiver module to the application interface, the first mounting hole 8 can be used as the docking standard, so that the new multi-channel analog optical transceiver module can be quickly connected to the application. the purpose of the interface. The application interface may be an application module with a female connector of a radio frequency power multiplexing connector connected to the novel multi-channel analog optical transceiver module. The application module is correspondingly provided with a pin port. The first installation hole 8 and the corresponding pin opening of the application module can be a pin connection structure, which can play a guiding role and facilitate the insertion of the connector.

In one embodiment, the first housing 1 and the second housing 4 are respectively provided with isolation cavities. When the first shell 1 and the second shell 4 are relatively fastened to the two sides of the circuit board assembly 3, the isolation cavities of the first shell 1 and the second shell 4 are respectively The electronic device and the optical device are housed and isolated from the electronic device and the optical device.

The first casing 1 and the second casing 4 can be arranged correspondingly. The first casing 1 and the second casing 4 sandwich the circuit board assembly 3 to form the novel multi-channel analog optical transceiver module. The circuit board assembly 3 may include a circuit board, and the electronic device and the optical device may be respectively integrated on the circuit board. The circuit board assembly 3 can realize the conversion function of optical signal and electrical signal. The electronic device and the optical device can be soldered on the circuit board. The isolation cavity of the first shell 1 and the isolation cavity of the second shell 4, respectively, when the first shell 1 and the second shell 4 are fastened to each other. A receiving cavity is formed with the circuit board. The electronic device and the optical device may be respectively located in the accommodating cavity, that is, accommodated in the isolation cavity. It can be understood that the material for forming the isolation cavity may be a material with electromagnetic shielding effect. Through the isolation cavity, the electronic device and the optical device can be isolated to avoid mutual influence between the electronic device and the optical device, so as to improve the working performance of the novel multi-channel analog optical transceiver module.

Referring to FIG. 4 , in one embodiment, the circuit board can be fixed between the first housing 1 and the second housing 4 by fixing structures such as screws, and is connected with the first housing 1 It is surrounded by a sealed isolation cavity, which can shield the interference of radio frequency signals of various optical paths.

Referring to FIG. 2 again, the electronic devices on the lower surface of the circuit board (PCB) may be wrapped in a large cavity of the base (the second housing 4 ). The circuit board will be screwed on top to make the lower surface of the circuit board closely adhere to the base, and the sealant will be applied. On the surface of the circuit board, there are four radio frequency paths with two receptions and two transmissions, and four optical paths corresponding to the optical devices.

Please refer to FIG. 4 and FIG. 5 , there are 4 cavities, that is, 4 cavities of the opposite sex, on the corresponding positions of the cover plate (the first housing 1 ), these cavities, the end face of the optical device, the shielding ring 9 4 opposing shielding cavities are formed to prevent signal interference from each channel. Sealant is applied to the contact position between the cover plate and the upper surface of the PCB.

In one embodiment, the novel multi-channel analog optical transceiver module further includes a shielding ring 9 . The shielding ring 9 is made of a glass-silver conductive material with silicone elasticity, which can tightly fill the gaps between the first casing 1 and the second casing 4 and the optical device to form a good conductive whole. Play the role of shielding signal interference. The shielding ring 9 is disposed on the first casing 1 or the second casing 4 . The shielding ring 9 is used to shield the radio frequency channel between the optical devices. The multi-channel optical device is composed of multiple receiving and transmitting channels, which are converted into various RF signal channels by transmitting and receiving analog light. The shielding ring 9 is sleeved on the outer casing of each channel of the optical device to fill the gap between the first casing 1 and the second casing 4 and the optical device, so as to shield the interference and crosstalk of the radio frequency signals of each channel of the optical device. effect. Between the base and the cover is a PCB board, which is clamped in the middle by applying sealant and then locking with screws. Each radio frequency circuit on the PCB is divided into independent spaces by the cavity hollowed out on the inner wall of the cover to prevent signal interference and crosstalk.

In one embodiment, when the first casing 1 and the second casing 4 are relatively fastened, an optical interface 5 is formed at the contact portion of the first casing 1 and the second casing 4 , The optical interface 5 is adapted to the LC connector. It can be understood that the opening edge of the first housing 1 may have a part of the structure of the optical interface 5 , and the opening edge of the second housing 4 may have a part of the structure of the optical interface 5 . The opening of the first casing 1 and the opening edge of the second casing 4 are spliced together to form the optical interface 5 . The optical interface 5 can be inserted into the LC connector. The optical interface 5 is directly machined and formed on the first housing 1 and the second housing 4, which can greatly reduce the size of the novel multi-channel analog optical transceiver module itself and save costs. By changing the optical interface 5 with pigtails and LC connectors to the optical interface 5 that can be plugged with standard LC connectors, no intermediate adapter flange is required during application, which reduces the number of intermediate adapters and does not need to be reserved. The position of the fiber coil reduces the tedious process of assembling various parts, saves the application space, makes the application more miniaturized and the installation is diversified.

In one embodiment, the first casing 1 and the second casing 4 are provided with corresponding positioning grooves 10 . The positioning slot 10 is used for positioning the optical interface 5 when the first casing 1 and the second casing 4 are relatively fastened. When the first shell 1 and the second shell 4 are fastened relative to each other, the positioning groove 10 of the first shell 1 and the second shell 4 can be used as a reference for alignment to ensure that the The optical interface 5 formed by the first housing 1 and the second housing 4 reaches the standard of being able to plug and unplug with the LC connector.

Referring to FIG. 5 , in one embodiment, an optical device 13 may also be included. The opposite side walls of the optical device 13 may be provided with two bosses, and the first housing 1 and the second housing 4 may be provided with one positioning slot 10 respectively. When the optical device 13 is installed between the first casing 1 and the second casing 4, the two bosses can enter the positioning groove 10 of the first casing and the In the positioning groove 10 of the second housing 4 , the spatial position of the optical port of the optical device 13 can be ensured.

In one embodiment, the first housing 1 is provided with a fixing structure 11 . The fixing structure 11 is used to prevent the LC connector 12 inserted into the optical interface 5 from falling off. The fixing structure 11 may be two square hole structures.

In one embodiment, the LC connector 12 may also be included. The end of the LC connector 12 inserted into the optical interface 5 is provided with an elastic buckle, and the fixing structure 11 includes a square hole structure disposed on the first housing 1 and located in the optical interface 5 . The LC connector 12 When the optical interface 5 is inserted, the elastic buckle is inserted into the square hole structure to prevent the LC connector 12 from falling off.

In one embodiment, the second housing 4 is further provided with a second mounting hole 7 . The novel multi-channel analog optical transceiver module is connected to the system through the second mounting hole 7 . The number of the second mounting holes 7 may be eight, which are arranged at four corners of the second housing 4 on average. The second mounting hole 7 may be a threaded hole. The novel multi-channel analog optical transceiver module can be connected to the system through the cooperation of the screw and the threaded hole.

In one embodiment, a thermal pad is provided between the first casing 1 and the circuit board assembly 3 , and between the circuit board assembly 3 and the second casing 4 . The heat conducting pads are respectively provided on both sides of the circuit board assembly 3 , which facilitates the timely discharge of heat and ensures the normal operation of the novel multi-channel analog optical transceiver module. In one embodiment, the thermally conductive pad may be a thermally conductive silicone pad.

In one embodiment, the first casing 1 and the second casing 4 are respectively provided with fixing holes correspondingly. The novel multi-channel analog optical transceiver module further includes a fixing screw 2 . The first casing 1 and the second casing 4 are connected through the fixing hole by the fixing screw 2 . The first housing 1 may be a rectangular structure. Four corners of the rectangular structure may form stepped structures, and each of the stepped structures may be provided with one of the fixing holes. Openings may also be provided at positions of the second housing 4 corresponding to the fixing holes. By passing the fixing screw 2 through the fixing hole and the second through hole, the first casing 1 and the second casing 4 can be connected. Therefore, the connection between the first casing 1 , the circuit board assembly 3 and the second casing 4 is tighter, and the anti-vibration performance is improved.

The novel multi-channel analog optical transceiver module eliminates the need for a long pigtail with an optical connector by setting the optical interface 5, and is flexible in installation and use. The new multi-channel analog optical transceiver module integrates the pluggable RF power multiplexing interface 6 and the pluggable standard LC optical connector the optical interface 5, which has a high degree of integration and is very convenient for packaging, transportation and system use. . The structure formed by the first housing 1 , the second housing 4 and the circuit board assembly 3 has dust-proof capability, greatly improved anti-vibration performance, and can be used in motion systems and harsh environments.

The above are only the preferred embodiments of the present application. It should be pointed out that for those skilled in the art, some improvements can be made without departing from the principles of the present application, and these improvements should also be regarded as the present invention. The scope of protection applied for.

Claims (10)

1. A novel multichannel analog optical transceiver module, comprising:

a first housing and a second housing;

the circuit board assembly is arranged between the first shell and the second shell and comprises an electronic device and an optical device, and the second shell is provided with a radio frequency power supply multiplexing interface.

2. The novel multichannel analog optical transceiver module as claimed in claim 1, wherein the second housing further has a first mounting hole, and the rf power multiplexing interface is adapted to the application interface through the first mounting hole.

3. The novel multichannel analog optical transceiver module as claimed in claim 1, wherein the first housing and the second housing are respectively provided with an isolation cavity, and when the first housing and the second housing are relatively fastened to two sides of the circuit board assembly, the isolation cavities of the first housing and the second housing respectively accommodate and isolate the electronic device and the optical device.

4. The novel multichannel analog optical transceiver module as claimed in claim 2, further comprising a shielding ring disposed on the first housing or the second housing for shielding the optical path between the optical devices.

5. The novel multichannel analog optical transceiver module as claimed in claim 1, wherein when said first housing and said second housing are engaged with each other, an optical interface is formed at a portion where said first housing and said second housing are in contact, and said optical interface is adapted to said LC connector.

6. The novel multichannel analog optical transceiver module as claimed in claim 5, wherein said first housing and said second housing are provided with corresponding positioning slots for positioning said optical interface when said first housing and said second housing are mated.

7. The novel multichannel analog optical transceiver module as claimed in claim 6, further comprising an optical device, wherein two bosses are disposed on opposite side walls of the optical device, and when the optical device is installed between the first housing and the second housing, the two bosses are respectively inserted into the positioning groove of the first housing and the positioning groove of the second housing.

8. The novel multichannel analog optical transceiver module as claimed in claim 5, characterized in that said first housing is provided with a fixing structure for preventing said LC connectors inserted into said optical interface from falling off.

9. The novel multichannel analog optical transceiver module as claimed in claim 8, further comprising the LC connector, wherein an end of the LC connector inserted into the optical interface is provided with an elastic buckle, the fixing structure includes a square hole structure disposed on the first housing and located at the optical interface, and when the LC connector is inserted into the optical interface, the elastic buckle is embedded into the square hole structure.

10. The novel multichannel analog optical transceiver module as claimed in claim 1, wherein the second housing further has a second mounting hole, and the novel multichannel analog optical transceiver module is connected to the system through the second mounting hole;

the first shell and the second shell are respectively provided with fixing holes correspondingly, the novel multichannel analog light transceiver module further comprises fixing screws, and the first shell and the second shell are connected through the fixing screws penetrating through the fixing holes;

thermal pads are disposed between the first housing and the circuit board assembly, and between the circuit board assembly and the second housing.

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