CN112033043B - One-way heat conduction device - Google Patents
One-way heat conduction device Download PDFInfo
- Publication number
- CN112033043B CN112033043B CN202010985261.9A CN202010985261A CN112033043B CN 112033043 B CN112033043 B CN 112033043B CN 202010985261 A CN202010985261 A CN 202010985261A CN 112033043 B CN112033043 B CN 112033043B
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- Prior art keywords
- heat conduction
- heat
- plate
- conduction plate
- working medium
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- 238000007789 sealing Methods 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 8
- 239000012267 brine Substances 0.000 claims description 5
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 abstract description 36
- 238000005057 refrigeration Methods 0.000 abstract description 19
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/06—Walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
- F28D20/021—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material and the heat-exchanging means being enclosed in one container
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
本发明提供了一种单向导热装置，包括第一导热板、框体和第二导热板，第一导热板、框体和第二导热板密封形成内部空腔，空腔内容纳有导热工质，第二导热板与半导体冷端进行热量传递使第二导热板的温度降低，进而使空腔内第二导热板上的导热工质由第一相态变为第二相态，导热工质凝固后体积膨胀至与第一导热板接触，经导热工质实现第二导热板到第一导热板的热量交换，制冷完成后半导体断电，半导体热端的高温热量传递至冷端并通过第二导热板使导热工质受热变化为第一相态，导热工质体积变小与第一导热板不再接触传导热量，半导体热端的热量就无法直接传递至已降温的一侧，导热装置结构简单且能独立实现单向导热功能。
The present invention provides a one-way heat conduction device, comprising a first heat conduction plate, a frame and a second heat conduction plate. The first heat conduction plate, the frame and the second heat conduction plate are sealed to form an internal cavity. A heat conduction medium is contained in the cavity. The second heat conduction plate transfers heat with a semiconductor cold end to reduce the temperature of the second heat conduction plate, thereby causing the heat conduction medium on the second heat conduction plate in the cavity to change from a first phase to a second phase. After solidification, the heat conduction medium expands in volume to contact with the first heat conduction plate, and heat exchange from the second heat conduction plate to the first heat conduction plate is achieved through the heat conduction medium. After refrigeration is completed, the semiconductor is powered off, and the high-temperature heat of the hot end of the semiconductor is transferred to the cold end through the second heat conduction plate, so that the heat conduction medium is heated and changes to the first phase. The volume of the heat conduction medium decreases and no longer contacts the first heat conduction plate to conduct heat, so that the heat of the hot end of the semiconductor cannot be directly transferred to the side that has been cooled. The heat conduction device has a simple structure and can independently realize the one-way heat conduction function.
Description
Technical Field
The invention relates to the technical field of refrigeration equipment, in particular to a unidirectional heat conduction device.
Background
The heat conduction device is widely used in combination with various refrigerating and heating devices, such as semiconductor refrigerating devices of a cold and hot cup, a refrigerator and the like. In order to prevent refrigeration failure caused by heat re-transfer to an inner cavity after power failure of a semiconductor refrigerating piece, the existing semiconductor refrigerating device generally uses heat insulation cotton to separate the refrigerating device from a low-temperature storage cavity, transfers heat through a metal cold-conducting block, but still causes heat at a hot end of a semiconductor to be transferred to the low-temperature storage cavity, or adopts an additional electromagnetic component to control movement of the heat-conducting device to realize contact between the heat-conducting device and the inner cavity when power is on, and separates the heat-conducting device from the inner cavity when power is off so as to prevent refrigeration failure caused by heat returning after power failure, but the additional electromagnetic component makes the whole semiconductor refrigerating device complex in structure and large in occupied space.
Disclosure of Invention
The invention aims to solve the technical problem of providing the unidirectional heat conduction device which has a simple structure and can independently realize unidirectional heat conduction function.
In order to solve the technical problems, the invention adopts the following technical scheme:
The utility model provides a unidirectional heat conduction device, includes first heat-conducting plate, framework and second heat-conducting plate, and first heat-conducting plate, framework and second heat-conducting plate are sealing connection in proper order forms inside cavity, hold the heat conduction working medium in the cavity, and on the heat conduction working medium was arranged in the cavity on the second heat-conducting plate, heat conduction working medium was equipped with the clearance between first heat-conducting plate when first phase, heat conduction working medium contacted with first heat-conducting plate when second phase.
The unidirectional heat conducting device has the beneficial effects that the outer side of the first heat conducting plate is in contact with a cavity needing refrigeration, the outer side of the second heat conducting plate is in contact with the cold end of the semiconductor refrigeration device, when the unidirectional heat conducting device works, the second heat conducting plate is in heat transfer with the cold end of the semiconductor refrigeration device to reduce the temperature of the second heat conducting plate, so that the heat conducting working medium on the second heat conducting plate in the cavity is solidified from a first phase state to a second phase state, the volume of the heat conducting working medium is expanded to be in contact with the first heat conducting plate after solidification, at the moment, the heat exchange from the second heat conducting plate to the first heat conducting plate is realized through the heat conducting working medium, the power of the semiconductor refrigeration device is cut off after refrigeration is finished, the heat of the hot end of the semiconductor refrigeration device is transferred to the cold end and is exchanged with the heat conducting working medium in the cavity through the heat transfer of the second heat conducting plate, the heat conducting working medium is changed into the first phase state by heat, the heat conducting working medium is reduced in volume and is not in contact with the first heat conducting plate, the heat of the hot end of the semiconductor sheet cannot be directly transferred to a cooled container, and the unidirectional heat conducting device is simple in structure and can be independently realized.
Drawings
Fig. 1 is a schematic longitudinal section view of a unidirectional heat conduction device according to a first embodiment of the present invention when a heat conduction working medium is in a first phase;
fig. 2 is a schematic longitudinal section view of a unidirectional heat conduction device according to the first embodiment of the present invention in a second phase of a heat conduction medium;
fig. 3 is an exploded view of a unidirectional heat conduction device according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a first heat conducting plate of a unidirectional heat conducting device according to a first embodiment of the present invention;
fig. 5 is a schematic structural diagram of a small refrigerator according to a second embodiment of the present invention.
Description of the reference numerals:
10. a case housing; 11 parts of an inner container, 12 parts of a unidirectional heat conduction device, 13 parts of a semiconductor refrigeration device, 14 parts of a radiator, 15 parts of a sealed heat insulation bracket, 16 parts of a box cover;
121. The heat conducting plate comprises a first heat conducting plate 122, a frame body 123, a second heat conducting plate 124, a heat conducting working medium 125, a cavity 126 and a convex column.
Detailed Description
In order to describe the technical content, the constructional features, the achieved objects and effects of the present invention in detail, the following description is made in connection with the embodiments and the accompanying drawings.
Referring to fig. 1 to 4, a unidirectional heat conduction device includes a first heat conduction plate, a frame body and a second heat conduction plate, where the first heat conduction plate, the frame body and the second heat conduction plate are sequentially connected in a sealing manner to form an internal cavity, a heat conduction working medium is contained in the cavity, the heat conduction working medium is placed on the second heat conduction plate in the cavity, a gap is arranged between the heat conduction working medium and the first heat conduction plate in a first phase state, and the heat conduction working medium contacts the first heat conduction plate in a second phase state.
The unidirectional heat conducting device has the beneficial effects that the outer side of the first heat conducting plate is in contact with the heat exchange space, the outer side of the second heat conducting plate is in contact with the cold end of the semiconductor, when the unidirectional heat conducting device works, the second heat conducting plate is in heat transfer with the cold end of the semiconductor so as to reduce the temperature of the second heat conducting plate, the heat conducting working medium on the second heat conducting plate in the cavity is solidified from a first phase state to a second phase state, the volume of the heat conducting working medium is expanded to be in contact with the first heat conducting plate after solidification, at the moment, the first heat conducting plate realizes heat exchange through the heat conducting working medium and the second heat conducting plate, the semiconductor is powered off after refrigeration is finished, the high-temperature heat of the semiconductor hot end is transferred to the cold end and generates heat exchange through the heat conducting working medium in the cavity, the heat conducting working medium is subjected to the first phase state, the volume of the heat conducting working medium is reduced, the heat conducting working medium is not in contact with the first heat conducting plate, the heat of the hot end of the semiconductor sheet cannot be directly transferred to a cooled container, and the unidirectional heat conducting device is simple in structure and can independently realize the unidirectional heat conducting function.
Further, a convex column is arranged on one surface of the first heat conducting plate facing the second heat conducting plate.
As can be seen from the above description, the provision of the stud can increase the thickness of the first heat conductive plate and reduce the vertical distance between the first heat conductive plate and the second heat conductive plate.
Further, a plurality of convex columns are uniformly and alternately arranged on one surface of the first heat conducting plate, which faces the second heat conducting plate.
As can be seen from the above description, the plurality of the projections uniformly arranged facilitate uniform heat transfer.
Further, a gap is formed between the heat conducting working medium and the convex column in the first phase state, and the heat conducting working medium is contacted with the convex column in the second phase state.
As can be seen from the above description, the heat conducting working medium contacts the protruding columns of the first heat conducting plate in the working state, so that the consumption of the heat conducting working medium can be reduced, the phase transition can be realized faster, and the cost is saved.
Further, the heat conducting working medium is water or brine.
From the above description, it can be seen that water or brine is used as the heat conducting working medium, and the heat conducting performance is good when the freezing points of water and brine are high and the brine is solid, so that the heat conducting efficiency can be improved.
Further, the frame body is a heat insulation frame body.
From the above description, it is apparent that the frame body made of the heat insulating material can effectively block heat transfer between the first heat conductive plate and the second heat conductive plate.
Further, the first heat conducting plate, the frame body and the second heat conducting plate are connected in a sealing mode through screws.
As is apparent from the above description, the first heat-conducting plate, the frame body and the second heat-conducting plate are connected by the screw seal, so that the connection is more sealed to prevent the heat-conducting working medium from leaking.
Referring to fig. 1 to 4, a first embodiment of the present invention is as follows:
The unidirectional heat conduction device 12 comprises a first heat conduction plate 121, a frame 122 and a second heat conduction plate 123, wherein the first heat conduction plate 121 and the second heat conduction plate 123 are aluminum plates, the frame 122 is a heat insulation frame made of EVA heat insulation materials, and the first heat conduction plate 121, the frame 122 and the second heat conduction plate 123 are sequentially placed and are in sealing connection by adopting screws at four corners;
The first heat conducting plate 121 is uniformly provided with a plurality of convex columns 126 along the direction of the second heat conducting plate 123, 92% of the volume of the heat conducting working medium 124 is injected into the cavity 125, the volume of the heat conducting working medium 124 is saline, the volume of the cavity 125 is the volume between the plane formed by the lower surface of the convex columns 126 and the upper surface of the second heat conducting plate 123, the heat conducting working medium 124 is separated from the convex columns 126 in the liquid state, and the heat conducting working medium 124 is contacted with the convex columns 126 in the solid state. In other equivalent embodiments, the heat-conducting working medium can be other working mediums capable of realizing the change of the first phase state and the second phase state, the quantity of the heat-conducting working medium can be changed according to actual requirements, and the frame body can be made of other heat-insulating materials.
Referring to fig. 1,2 and 5, a second embodiment of the present invention is as follows:
The small refrigerator comprises a refrigerator body shell 10, an inner container 11, a semiconductor refrigerating device 13, a radiator 14 and a unidirectional heat conduction device 12 in the first embodiment, wherein the inner container 11, the semiconductor refrigerating device 13, the radiator 14 and the unidirectional heat conduction device 12 are arranged in the refrigerator body shell 10, the radiator 14 is arranged at the inner bottom of the refrigerator body shell 10, the semiconductor refrigerating device 13 is arranged above the radiator 14, the hot end of the semiconductor refrigerating device 13 faces to the lower radiator 14, the cold end of the semiconductor refrigerating device 13 faces upwards and is clung to a second heat conduction plate 123 of the unidirectional heat conduction device 12, and the inner container 11 is arranged above the unidirectional heat conduction device 12 and clung to a first heat conduction plate 121 of the unidirectional heat conduction device 12;
The small refrigerator further comprises a sealing heat insulation support 15 and a box cover 16, the semiconductor refrigeration device 13 and the unidirectional heat conduction device 12 are arranged on the sealing heat insulation support 15, the sealing heat insulation support 15 separates the heat ends of the radiator 14 and the semiconductor refrigeration device 13 from one side of the cold end of the semiconductor refrigeration device 13, the inner container 11 is in sealing connection with the opening at the upper end of the box body shell 10, and the box cover 16 can tightly cover the inner container 11 to isolate heat exchange with the outside.
When the small refrigerator of the embodiment works, after the semiconductor refrigerating device 13 is electrified, the cold end is in contact with the unidirectional heat conduction device 12 to exchange heat, and the unidirectional heat conduction device 12 is in heat exchange with the inner container 11, so that the temperature inside the small refrigerator is reduced to realize low-temperature preservation, and the heat end of the semiconductor refrigerating device 13 radiates heat through the radiator 14 at the bottom;
When the power is stopped, the semiconductor refrigeration device 13 stops working, the hot end and the cold end generate heat exchange, so that the cold end heats up to further transfer the heat to the unidirectional heat conduction device 12, and at the moment, the heat conduction working medium 122 in the unidirectional heat conduction device 12 absorbs the heat and changes from the second phase state to the first phase state and is not contacted with the first heat conduction plate 121 any more, thereby separating the direct heat exchange between the hot end and the first heat conduction plate 121 and between the hot end and the upper liner 11, so that the heat of the hot end is not transferred to the liner 11 to reduce the refrigeration effect after the semiconductor refrigeration device 13 stops working.
In summary, the invention provides a unidirectional heat conduction device with simple structure and capable of independently realizing unidirectional heat conduction function, the outer side of a first heat conduction plate is in contact with a heat exchange space, the outer side of a second heat conduction plate is in contact with a semiconductor cold end, during operation, the second heat conduction plate is in heat transfer with the semiconductor cold end to reduce the temperature of the second heat conduction plate, so that a heat conduction working medium on the second heat conduction plate in a cavity is solidified from a first phase state to a second phase state, the heat conduction working medium is solidified and then expands in volume to be in contact with the first heat conduction plate, at the moment, the first heat conduction plate realizes heat exchange with the second heat conduction plate through the heat conduction working medium, after refrigeration is completed, the semiconductor is powered off, high-temperature heat of the semiconductor hot end is transferred to the cold end and generates heat exchange through the heat conduction working medium in the cavity, the heat conduction working medium is subjected to the first phase state, the heat conduction working medium volume is reduced and is not in contact with the first heat conduction working medium, and the heat of the heat conduction working medium at the hot end cannot be directly transferred to a cooled container, and the structure of the heat conduction device is simple and can independently realize unidirectional heat conduction function.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (5)
1. The unidirectional heat conduction device is characterized by comprising a first heat conduction plate, a frame body and a second heat conduction plate, wherein the first heat conduction plate, the frame body and the second heat conduction plate are sequentially connected in a sealing mode to form an internal cavity, a heat conduction working medium is contained in the cavity and is arranged on the second heat conduction plate in the cavity, a gap is reserved between the heat conduction working medium and the first heat conduction plate in a first phase state, the heat conduction working medium is in contact with the first heat conduction plate in a second phase state, a convex column is arranged on one surface of the first heat conduction plate facing the second heat conduction plate, and the frame body is a heat insulation frame body.
2. The unidirectional thermal conductive apparatus of claim 1, wherein the plurality of bosses are uniformly and intermittently disposed on a side of the first thermal conductive plate facing the second thermal conductive plate.
3. The unidirectional thermal conductive apparatus of claim 1, wherein the thermal conductive working substance has a gap between the first phase and the stud, and wherein the thermal conductive working substance contacts the stud in the second phase.
4. The unidirectional thermal conductive apparatus of claim 1, wherein the thermal conductive working medium is water or brine.
5. The unidirectional thermal conductive apparatus of claim 1, wherein the first thermal conductive plate, the frame, and the second thermal conductive plate are sealingly connected using screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010985261.9A CN112033043B (en) | 2020-09-18 | 2020-09-18 | One-way heat conduction device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010985261.9A CN112033043B (en) | 2020-09-18 | 2020-09-18 | One-way heat conduction device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112033043A CN112033043A (en) | 2020-12-04 |
| CN112033043B true CN112033043B (en) | 2025-04-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010985261.9A Active CN112033043B (en) | 2020-09-18 | 2020-09-18 | One-way heat conduction device |
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| Country | Link |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110715568A (en) * | 2019-09-26 | 2020-01-21 | 广西大学 | One-way cold guide pipe utilizing phase change conduction |
| CN212619456U (en) * | 2020-09-18 | 2021-02-26 | 厦门优佰仕电子科技有限公司 | One-way heat conduction device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090194263A1 (en) * | 2008-02-05 | 2009-08-06 | Bernardes Marco Aurelio Dos Santos | Methods and mechanisms for thermal semi conduction |
| CN106871679B (en) * | 2017-02-23 | 2019-01-11 | 深圳市皇钜科技有限公司 | The unidirectional heat transfer structure of high temperature resistant |
| CN207925627U (en) * | 2018-02-08 | 2018-09-28 | 华南理工大学 | A kind of battery modules heat management device of heat pipe and phase-change material coupling |
| CN210072530U (en) * | 2019-07-10 | 2020-02-14 | 河北烯创科技有限公司 | One-way heat-conducting plate of graphite alkene |
-
2020
- 2020-09-18 CN CN202010985261.9A patent/CN112033043B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110715568A (en) * | 2019-09-26 | 2020-01-21 | 广西大学 | One-way cold guide pipe utilizing phase change conduction |
| CN212619456U (en) * | 2020-09-18 | 2021-02-26 | 厦门优佰仕电子科技有限公司 | One-way heat conduction device |
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| CN112033043A (en) | 2020-12-04 |
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