CN112033041A - Ultramicro lattice refrigeration module - Google Patents

Abstract

The invention discloses a super-micro lattice refrigeration module, which comprises more than one pair of PN junction modules, an upper connecting sheet positioned at the upper end of each PN junction module, and a lower connecting sheet positioned at the lower end of each PN junction module, wherein the lower end surface of each upper connecting sheet is fixedly connected with the upper end surfaces of all PN junctions, the upper end surface of each lower connecting sheet is fixedly connected with the lower end surfaces of all PN junctions, a first vacuumed cavity layer structure is arranged in each upper connecting sheet, a second vacuumed cavity layer structure is arranged in each lower connecting sheet, and light flowing liquid layers are arranged in each first cavity layer structure and each second cavity layer structure; the invention also discloses a refrigerating device of the ultramicro-lattice refrigerating module; the ultramicro-lattice refrigeration module has high refrigeration efficiency and small volume, and can greatly reduce the manufacturing cost.

Description

An ultra-microlattice refrigeration module

technical field

The invention relates to the field of semiconductor refrigeration, in particular to an ultra-micro lattice refrigeration module.

Background technique

Semiconductor refrigeration technology has a long history. In application, the structure of semiconductor refrigeration sheet is usually used. Semiconductor refrigeration sheet, also called thermoelectric refrigeration sheet, is a kind of heat pump. Its advantage is that there are no sliding parts, and it is used in some occasions where space is limited, reliability is high, and there is no refrigerant pollution. Using the Peltier effect of semiconductor materials, when a direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple, and the purpose of cooling can be achieved. It is a refrigeration technology that produces negative thermal resistance, which is characterized by no moving parts and high reliability. However, at the same time, we also found in use that due to the influence of the external ambient temperature of the semiconductor refrigeration sheet during cooling, the heat dissipation capacity of the hot end of the outermost semiconductor refrigeration sheet is relatively limited, so that the cooling capacity of each semiconductor refrigeration sheet cannot be fully utilized. , In order to achieve the purpose of heat dissipation, many semiconductor refrigeration modules will also add active heat dissipation structures, such as fans, to the hot end of the cooling sheet to avoid burning the semiconductor cooling sheet. Poor, the volume increases, and the cost increases.

SUMMARY OF THE INVENTION

In view of the above problems, the present invention proposes an ultra-microlattice refrigeration module based on semiconductor refrigeration. The ultra-microlattice refrigeration module has high refrigeration efficiency, small volume, and can greatly reduce manufacturing costs.

In order to meet the above requirements, the present invention proposes an ultra-microlattice refrigeration module, which includes more than one pair of PN junction modules, an upper connecting piece located at the upper end of the PN junction module as a cold surface, and a lower end of the PN junction module. The lower connecting piece as the hot surface, the lower end face of the upper connecting piece forms a fixed connection with the upper end surfaces of all PN junctions, the upper end surface of the lower connecting piece forms a fixed connection with the lower end surfaces of all PN junctions, and the upper connecting piece is provided with The first cavity layer structure that is evacuated, the lower connecting piece is provided with a second cavity layer structure that is evacuated, and both the first cavity layer structure and the second cavity layer structure are provided with A light flowing liquid layer that can boil and vaporize at low temperature and transfer heat in 360 directions.

As a preferred option of the present invention, the light-weight flowing liquid layer is a single polymer flowing liquid, or a mixture of multiple polymer flowing liquids.

As a further preference of the present invention, the upper connecting piece, the lower connecting piece, the first cavity layer structure, and the second cavity layer structure are made of metal materials, or made of ceramic materials, or have good heat transfer properties. At the same time, between the cold side of the upper connecting piece, the hot side of the lower connecting piece, and both sides of the PN junction are attached, covered with a layer of thermal insulation film, or coated with a layer of Thermal insulation coating.

As a further preference of the present invention, the upper connecting piece and the lower connecting piece are of flat plate structure, or are the upper connecting piece of the curved structure and the lower connecting piece of the curved structure.

As a further preferred embodiment of the present invention, the first cavity layer structure and the second cavity layer structure are rectangular structures, or a curved first cavity layer structure and a curved second cavity layer structure.

As a further preference of the present invention, the first cavity layer structure and the second cavity layer structure have the same volume, or have different volumes.

Based on the above technology, the present invention also discloses a refrigeration device for an ultra-microlattice refrigeration module, which includes a control end and a refrigeration end, the control end includes a control circuit board, and the refrigeration end includes: a plurality of mutually electrically conductive The connected refrigeration modules form a refrigeration module combination; the control end further includes: a drive control module and an operation end for controlling the temperature of the refrigeration module combination, the drive control module, the operation end and the control circuit board Electrical connection; the refrigeration module assembly is electrically connected to the control circuit board, the drive control module, and the operating terminal.

Preferably, the plurality of electrically connected refrigeration modules are connected in series with each other, or in parallel with each other, or in a combination of series and parallel.

Further preferably, the number of the combination of refrigeration modules may be one group, or more than one group, the number of the drive control module may be one, or more than one, and the one drive is electrically connected to a group of refrigeration module combinations. , or one drive is electrically connected to a group of more than one refrigeration module combination.

Further preferably, the present invention also includes a wireless remote control terminal, the wireless remote control terminal includes a wireless communication module, a microprocessor, and an APP-based control terminal, the wireless communication module and the microprocessor are electrically connected. The microprocessor is electrically connected with the control circuit board and the refrigeration module, and the APP-based control terminal and the wireless communication module form a wireless communication connection.

After adopting the above-mentioned technology, the present invention has the following advantages:

1. In the present invention, a vacuum sealed cavity is set in the metal heat sink, and a free-flowing polymer liquid is injected into the sealed cavity. However, it is cooled and liquefied at the cold end near the semiconductor refrigerating sheet, which greatly improves the heat dissipation efficiency and finally improves the cooling efficiency;

2. The structure of the present invention is compact, and no additional heat dissipation components are needed to assist heat dissipation, so that the overall structure of the heat dissipation module is miniaturized, and the material cost is also reduced;

3. The present invention adopts a combination of a suitable number of drives and a suitable number of refrigeration module arrays, which can further improve the refrigeration efficiency and further optimize the structure;

4. The present invention adopts the combination of remote wireless control and refrigeration structure, which can realize intelligent control and supervision.

Description of drawings

Figure 1 shows the external and internal structure diagrams when the structure of the present invention is rectangular;

Figure 2 shows the external and internal structure diagrams when the structure of the present invention is a curved surface;

Figure 3 shows the overall structural frame diagram of the refrigeration device in the present invention;

FIG. 4 shows the appearance structure diagram of the refrigeration module of the present invention after the heat insulating film is attached or the heat insulating coating is applied.

Among them, 1. PN junction module; 2. Upper connecting piece; 3. Lower connecting piece; 4. First cavity layer structure; 5. Second cavity layer structure; 6. Lightweight flowing liquid layer; 7. Curved surface structure Upper connecting piece; 8. Lower connecting piece of curved surface structure; 9. Structure of first cavity layer of curved surface; 10. Structure of second cavity layer of curved surface; 11. Control circuit board; 12. Refrigeration module; 13. Drive control module; 14 , operation end; 15, wireless communication module; 16, microprocessor; 17, APP-based control terminal; 18, heat insulation film; 19, heat insulation coating.

Detailed ways

The present invention will be described in further detail below by using specific embodiments.

As can be seen from FIG. 1 , an ultra-microlattice refrigeration module includes more than one pair of PN junction modules 1 , an upper connecting piece 2 located at the upper end of the PN junction module 1 as a cold surface, and a heat sink located at the lower end of the PN junction module 1 . In the connection of the three, the lower end face of the upper connecting sheet 2 forms a solid connection with the upper end faces of all PN junction modules 1, and the upper end face of the lower connecting sheet 3 forms with the lower end faces of all PN junction modules 1. fixed.

At the same time, the upper connecting piece 2 is provided with a first cavity layer structure 4 that is evacuated, the lower connecting piece 3 is provided with a second cavity layer structure 5 that is evacuated, and the first cavity layer structure 4 Both the inner and the second cavity layer structure 5 are provided with a light flowing liquid layer 6 that can boil and vaporize at low temperature and can transfer heat in 360 directions.

In the present invention, the preferred light fluid liquid layer 6 may be a single polymer fluid fluid or a mixture of multiple polymer fluid fluids in actual use.

Since the connecting piece 3 as the hot surface is provided with the second cavity layer structure 5 that is evacuated, after the light flowing liquid layer 6 is injected into the second cavity layer structure 5, the light flowing liquid layer 6 is in a weightless state, Heat transfer can be limited in 360-degree directions, thereby improving cooling efficiency.

Of course, the second cavity layer structure 5 can also be in a negative pressure state, and the light flowing liquid layer 6 can also be in a weightless state, and the effect of restricting heat transfer in a 360-degree direction can also be achieved.

In terms of material selection, the upper connecting piece 2, the lower connecting piece 3, the first cavity layer structure 4, and the second cavity layer structure 5 in the present invention are made of metal materials with good thermal conductivity and cooling performance, or Made of ceramic material or superconducting material with good heat transfer. At the same time, it can be a rigid structure or a flexible and bendable structure.

It can be seen from FIG. 4 that a layer of thermal insulation film 18 is attached or covered between the cold surface of the upper connecting piece 2, the hot surface of the lower connecting piece 3, and the two sides of the PN junction 1. layer of thermal barrier coating 19 .

Whether it is by sticking or covering the heat insulating film 18 or by applying the heat insulating coating 19 , the main purpose is that the heat insulating film 18 or the heat insulating coating 19 with larger thermal resistance can be Effectively avoid the mutual influence of the temperature of the cold and hot surfaces due to the short distance between the PN junction 1.

Moreover, in terms of shape, the upper connecting piece 2 and the lower connecting piece 3 in the present invention can be a flat plate structure, or a curved structure upper connecting piece 7 and a curved surface structure lower connecting piece 8 (see FIG. 2 ).

Corresponding to the above structure, the first cavity layer structure 4 and the second cavity layer structure 5 in the present invention can be rectangular structures, or the first cavity layer structure 9 with a curved surface and the second cavity layer structure with a curved surface. 10.

The main purpose of setting a curved structure or a flat structure is: different use environments require different shapes and structures. For example, in the conventional case, the refrigeration module structure of the flat structure can be used, and in unconventional cases, such as some curved surfaces , Under the irregular shape structure, the cooling module structure that can be adapted to curved surfaces or even irregular shapes can be used.

In the present invention, the volumes of the first cavity layer structure 4 and the second cavity layer structure 5 are the same or different. All are the protection scope of the present invention.

As can be seen from FIG. 3 , the present invention is based on the above technology, and also discloses a refrigeration device for an ultra-microlattice refrigeration module, which includes a control end and a refrigeration end. In the present invention, the preferred control end includes a control circuit board 11 . , the preferred refrigeration end includes: a plurality of refrigeration modules 12 electrically connected to each other (consisting of more than one pair of PN junction modules 1 in the present invention, the upper connecting piece 2 located at the upper end of the PN junction module 1, and the lower end of the PN junction module 1). The lower connecting piece 3 forms a separate refrigeration module 12), thereby forming a refrigeration module combination; at the same time, the control terminal in the present invention also includes: a drive control module 13 and an operation terminal for controlling the temperature of the refrigeration module combination. 14. In connection, the drive control module 13, the operation terminal 14 and the control circuit board 11 are electrically connected; the refrigeration module combination is electrically connected to the control circuit board 11, the drive control module 13, and the operation terminal 14.

In the present invention, the structures of several electrically connected refrigeration modules 12 may be connected in series, or in parallel with each other, or in a combination of series and parallel. At the same time, the number of refrigeration module combinations may be one group, or more than one group, and the number of drive control modules 13 may be one, or more than one, and in terms of connection structure, one drive control module 13 may be electrically connected One group of refrigeration module assemblies, or one drive control module 13 is electrically connected to more than one group of refrigeration module assemblies, or one or more drive control modules 13 are electrically connected to more than one group of refrigeration module assemblies. Such a structure can further improve the cooling efficiency and area.

In the present invention, the drive control module 13 is driven by a constant current, which can effectively protect the PN junction 1 and avoid the problem that the cooling effect of the PN junction 1 is deteriorated due to temperature changes.

Continue to look at FIG. 3, the present invention also includes a wireless remote control terminal, the wireless remote control terminal includes a wireless communication module 15, a microprocessor 16, and an APP-based control terminal 17, the wireless communication module 15 and the microprocessor 16 Electrical connection, the microprocessor 16 is electrically combined with the control circuit board 11 and the refrigeration module, and the APP-based control terminal 17 and the wireless communication module 15 form a wireless communication connection.

Different from the traditional control mode, when the wireless remote control terminal is set, the refrigeration system of the present invention can be remotely controlled. For example, the remote refrigeration system can be operated and monitored in real time through a smartphone, without the need for real-time personnel. Beside the equipment (through the microprocessor 16, the various operating parameters of the refrigeration module combination can be processed, and then sent to the APP-based control terminal 17 through the wireless communication module 15).

The above are only the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the technical principle of the present invention, several improvements and modifications can also be made. These improvements and Variations should also be considered within the scope of protection of the present invention.

Claims (10)

1. An ultra-microlattice refrigeration module, comprising more than one pair of PN junction modules, an upper connecting piece located at the upper end of the PN junction module as a cold surface, and a lower end located at the lower end of the PN junction module as a hot surface. Connecting piece, the lower end face of the upper connecting piece forms a fixed connection with the upper end surfaces of all PN junctions, and the upper end surface of the lower connecting piece forms a fixed connection with the lower end surfaces of all PN junctions, and it is characterized in that the upper connecting piece is provided with a drawing A vacuum first cavity layer structure, the lower connecting piece is provided with a vacuum second cavity layer structure, and both the first cavity layer structure and the second cavity layer structure are provided with low temperature It is a light flowing liquid layer that can boil and vaporize phase change and transfer heat in 360 directions. 2 . The ultra-microlattice refrigeration module according to claim 1 , wherein the light-weight flowing liquid layer is a single polymer flowing liquid, or a mixture of multiple polymer flowing liquids. 3 . 3. The ultra-microlattice refrigeration module according to claim 1, wherein the upper connecting piece, the lower connecting piece, the first cavity layer structure and the second cavity layer structure are made of metal materials , or made of ceramic material, or made of superconducting material with good heat transfer; at the same time, it is located between the cold surface of the upper connecting piece, the hot surface of the lower connecting piece and both sides of the PN junction. It is designed, covered with a layer of thermal insulation film, or coated with a layer of thermal insulation coating. 4 . The ultra-microlattice refrigeration module according to claim 1 , wherein the upper connecting piece and the lower connecting piece are of flat plate structure, or the upper connecting piece of curved structure and the lower connecting piece of curved structure. 5 . 5 . The ultra-microlattice refrigeration module according to claim 1 , wherein the first cavity layer structure and the second cavity layer structure have a rectangular structure, or a curved first cavity layer structure. 6 . and a curved second cavity layer structure. 6 . The ultra-microlattice refrigeration module according to claim 1 , wherein the first cavity layer structure and the second cavity layer structure have the same volume or different volumes. 7 . 7. A refrigeration device based on the ultra-microlattice refrigeration module according to claim 1, comprising a control end and a refrigeration end, the control end comprising a control circuit board, wherein the refrigeration end comprises: A plurality of refrigeration modules are electrically connected to each other, thereby forming a refrigeration module combination; the control end further includes: a drive control module and an operation end for controlling the temperature of the refrigeration module combination, the drive control module, the operation end It is electrically connected with the control circuit board; the refrigeration module combination is electrically connected with the control circuit board, the drive control module and the operation terminal. 8 . The refrigerating device of the ultra-microlattice refrigerating module according to claim 7 , wherein the plurality of refrigerating modules electrically connected are connected in series, or in parallel with each other, or in a combination of series and parallel. 9 . 9 . The refrigeration device of the ultra-microlattice refrigeration module according to claim 7 , wherein the number of the combination of the refrigeration modules can be one group, or more than one group, and the number of the drive control modules can be: 10 . One, or more than one, the one driver is electrically connected to a group of refrigeration module assemblies, or one driver is electrically connected to more than one group of refrigeration module assemblies. 10. The refrigeration device of the ultra-microlattice refrigeration module according to claim 7, further comprising a wireless remote control terminal, the wireless remote control terminal comprises a wireless communication module, a microprocessor, and a In the APP-based control terminal, the wireless communication module is electrically connected with the microprocessor, the microprocessor is electrically combined with the control circuit board and the refrigeration module, and the APP-based control terminal and the wireless communication module form a wireless communication connect.

Images