CN112020167B - Radio frequency heating equipment - Google Patents
Radio frequency heating equipment Download PDFInfo
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- CN112020167B CN112020167B CN201910471473.2A CN201910471473A CN112020167B CN 112020167 B CN112020167 B CN 112020167B CN 201910471473 A CN201910471473 A CN 201910471473A CN 112020167 B CN112020167 B CN 112020167B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/642—Cooling of the microwave components and related air circulation systems
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
- A47J37/06—Roasters; Grills; Sandwich grills
- A47J37/0623—Small-size cooking ovens, i.e. defining an at least partially closed cooking cavity
- A47J37/0629—Small-size cooking ovens, i.e. defining an at least partially closed cooking cavity with electric heating elements
- A47J37/0641—Small-size cooking ovens, i.e. defining an at least partially closed cooking cavity with electric heating elements with forced air circulation, e.g. air fryers
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Abstract
Description
技术领域technical field
本申请涉及微波加热技术领域,例如涉及一种射频加热设备。The present application relates to the technical field of microwave heating, for example, to a radio frequency heating device.
背景技术Background technique
目前,由于半导体固态射频源成本低和体积小的优势,以及半导体固态射频源发射的射频信号可控性良好的技术优势,越来越多的射频加热设备采用固态射频源产生用于加热的射频能量信号。固态射频源的输出功率可以在设定频率范围内调节,以满足对不同物品的加热需求。At present, due to the advantages of low cost and small size of semiconductor solid-state radio frequency sources, and the technical advantages of good controllability of radio frequency signals emitted by semiconductor solid-state radio frequency sources, more and more radio frequency heating equipment uses solid-state radio frequency sources to generate radio frequency for heating energy signal. The output power of the solid-state radio frequency source can be adjusted within the set frequency range to meet the heating needs of different items.
在很多射频加热设备中,如家用嵌入式射频烤箱,散热的进风和出风面积很有限,可供射频源安装的位置和允许体积也受限制,同时烤箱本身在工作中自发热,造成射频源工作环境温度较高。为达到需要的散热功率,通常需要选择高风量风扇。In many radio frequency heating devices, such as household embedded radio frequency ovens, the air inlet and outlet areas for heat dissipation are very limited, and the installation position and allowable volume of the radio frequency source are also limited. At the same time, the oven itself generates heat during operation, causing radio frequency The ambient temperature of the source is high. In order to achieve the required heat dissipation power, it is usually necessary to select a high air volume fan.
在实现本公开实施例的过程中,发现相关技术中至少存在如下问题:射频加热设备的高风量风扇通常噪音较高。In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art: the high-volume fan of the radio frequency heating device usually has relatively high noise.
发明内容Contents of the invention
为了对披露的实施例的一些方面有基本的理解,下面给出了简单的概括。所述概括不是泛泛评述,也不是要确定关键/重要组成元素或描绘这些实施例的保护范围,而是作为后面的详细说明的序言。In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is presented below. The summary is not intended to be an extensive overview nor to identify key/important elements or to delineate the scope of these embodiments, but rather serves as a prelude to the detailed description that follows.
本公开实施例提供了一种射频加热设备,以解决射频加热设备的高风量风扇,噪音较高的问题。An embodiment of the present disclosure provides a radio frequency heating device to solve the problem of a high-volume fan of the radio frequency heating device and high noise.
在一些实施例中,所述射频加热设备,包括:In some embodiments, the radio frequency heating device includes:
射频模块,被设置为对物体进行加热;a radio frequency module configured to heat the object;
主散热件,被设置为与所述射频模块接触连接;a main heat sink configured to be in contact with the radio frequency module;
辅散热件,被设置为与所述主散热件连接;an auxiliary heat sink configured to be connected to the main heat sink;
导热件,被设置为连接所述主散热件和所述辅散热件,使所述主散热件和所述辅散热件共同散热。The heat conduction element is configured to connect the main heat dissipation element and the auxiliary heat dissipation element, so that the main heat dissipation element and the auxiliary heat dissipation element jointly dissipate heat.
本公开实施例提供的射频加热设备,可以实现以下技术效果:The radio frequency heating equipment provided by the embodiments of the present disclosure can achieve the following technical effects:
本公开实施例通过主散热件和辅散热件等多个散热件结合的方式,增大射频加热设备的散热面积,提高散热效率,在低风量风扇的情况下也可以获得良好的散热效果,避免现有技术中提高风扇规格带来的增大噪声的影响。The embodiment of the present disclosure increases the heat dissipation area of the radio frequency heating equipment and improves the heat dissipation efficiency by combining multiple heat dissipation elements such as the main heat dissipation element and the auxiliary heat dissipation element, and can also obtain a good heat dissipation effect in the case of a low air volume fan, avoiding In the prior art, the impact of increasing the noise caused by increasing the specification of the fan.
以上的总体描述和下文中的描述仅是示例性和解释性的,不用于限制本申请。The foregoing general description and the following description are exemplary and explanatory only and are not intended to limit the application.
附图说明Description of drawings
一个或多个实施例通过与之对应的附图进行示例性说明,这些示例性说明和附图并不构成对实施例的限定,附图中具有相同参考数字标号的元件示为类似的元件,附图不构成比例限制,并且其中:One or more embodiments are exemplified by the corresponding drawings, and these exemplifications and drawings do not constitute a limitation to the embodiments. Elements with the same reference numerals in the drawings show similar elements, The drawings are not limited to scale and in which:
图1是本公开实施例提供的一种射频加热设备的结构示意图;Fig. 1 is a schematic structural diagram of a radio frequency heating device provided by an embodiment of the present disclosure;
图2是本公开实施例提供的一种射频加热设备的结构示意图;Fig. 2 is a schematic structural diagram of a radio frequency heating device provided by an embodiment of the present disclosure;
图3是本公开实施例提供的一种射频加热设备的结构示意图。Fig. 3 is a schematic structural diagram of a radio frequency heating device provided by an embodiment of the present disclosure.
附图标记:Reference signs:
101:射频模块;102:主散热件;103:辅散热件;104:导热件;105:通风风道;1051:进风口;1052:出风口;106:风扇;107:隔热层;108:外壳。101: RF module; 102: main heat sink; 103: auxiliary heat sink; 104: heat conduction; 105: air duct; 1051: air inlet; 1052: air outlet; 106: fan; 107: heat insulation layer; 108: shell.
具体实施方式Detailed ways
为了能够更加详尽地了解本公开实施例的特点与技术内容,下面结合附图对本公开实施例的实现进行详细阐述,所附附图仅供参考说明之用,并非用来限定本公开实施例。在以下的技术描述中,为方便解释起见,通过多个细节以提供对所披露实施例的充分理解。然而,在没有这些细节的情况下,一个或多个实施例仍然可以实施。在其它情况下,为简化附图,熟知的结构和装置可以简化展示。In order to understand the characteristics and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The attached drawings are only for reference and description, and are not intended to limit the embodiments of the present disclosure. In the following technical description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.
本文提及的射频模块包括用于发射射频信号的射频源及对射频信号进行处理的功率放大器等模块。射频加热设备在加热过程中会自发热,导致射频模块工作环境温度升高,温度过高会降低射频模块的工作效率。相关技术中,通过设置高风量风扇加快散热,以避免射频模块工作环境温度过高。本公开实施例提供一种不同的提高射频加热设备散热效率的方案,在低风量风扇的情况下也可以获得良好的散热效果。The radio frequency module mentioned in this article includes modules such as a radio frequency source for transmitting radio frequency signals and a power amplifier for processing radio frequency signals. The RF heating equipment will generate heat during the heating process, which will cause the temperature of the working environment of the RF module to rise. If the temperature is too high, the working efficiency of the RF module will be reduced. In the related art, heat dissipation is accelerated by setting a high-volume fan, so as to prevent the working environment temperature of the radio frequency module from being too high. The embodiments of the present disclosure provide a different solution for improving the heat dissipation efficiency of the radio frequency heating device, and a good heat dissipation effect can also be obtained in the case of a fan with a low air volume.
如图1所示,本公开实施例提供了一种射频加热设备,包括:As shown in Figure 1, an embodiment of the present disclosure provides a radio frequency heating device, including:
射频模块101,被设置为对物体进行加热。The
主散热件102,被设置为与射频模块101接触连接。The
辅散热件103,被设置为与主散热件102连接。The
导热件104,被设置为连接主散热件102和辅散热件103,使主散热件102和辅散热件103共同散热,以增大散热件的散热面积,避免与射频模块101接触连接的主散热件102温度过高,散热压力大,散热不及时对射频模块101造成影响,降低射频模块101的工作效率。The
本公开实施例通过主散热件和辅散热件等多个散热件结合的方式,增大射频加热设备的散热面积,提高散热效率,在低风量风扇的情况下也可以获得良好的散热效果,避免现有技术中提高风扇规格带来的增大噪声的影响。The embodiment of the present disclosure increases the heat dissipation area of the radio frequency heating equipment and improves the heat dissipation efficiency by combining multiple heat dissipation elements such as the main heat dissipation element and the auxiliary heat dissipation element, and can also obtain a good heat dissipation effect in the case of a low air volume fan, avoiding In the prior art, the impact of increasing the noise caused by increasing the specification of the fan.
在一些实施例中,导热件104为导热板或毛细管。In some embodiments, the
其中,导热件104为导热板或毛细管,换热面积大,换热效率高,可以快速将主散热件102的热量传导至辅散热件103,提高射频加热设备的散热效率。Wherein, the
在一些实施例中,当导热件104为毛细管时,为实现将主散热件102的热量快速传导至辅散热件103,导热件104包括多根毛细管。可选的,多根毛细管形成毛细管网。在毛细管壁薄,导热性良好的基础上,多根毛细管交叠增大了散热面积,加快了主散热件102与辅散热件103之间的热量传递,提高射频加热设备的散热效率。In some embodiments, when the
在不同的实施例中,主散热件102和辅散热件103的设置位置会有所不同。In different embodiments, the positions of the
在一些实施例中,如图2所示,所述主散热件102设置于通风风道105的出风口1052处。In some embodiments, as shown in FIG. 2 , the
其中,主散热件102与射频模块101接触连接,主散热件102和射频模块101设置在通风风道105的出风口1052,保证射频模块101运行过程中产生的部分热量直接由出风口1052处散发至射频加热设备外。Wherein, the
射频模块101运行过程中产生的部分热量造成周围空气温度上升,空气温度升高则会上升。Part of the heat generated during the operation of the
在一些实施例中,为便于散热,如图2所示,出风口1052设置射频加热设备的侧壁临近顶部的位置。图2中箭头方向为通风风道105中空气流动方向。In some embodiments, in order to dissipate heat, as shown in FIG. 2 , the
在一些实施例中,如图3所示,所述出风口1052设置于所述射频加热设备的顶部。图3中箭头方向为通风风道105中空气流动方向。In some embodiments, as shown in FIG. 3 , the
其中,出风口1052设置于射频加热设备的顶部,则主散热件102对应设置于射频加热设备的顶部,便于高温气体快速散发至射频加热设备外,以提高射频加热设备的散热效率。Wherein, the
在一些实施例中,如图2或图3所示,辅散热件103设置于通风风道105的进风口1051处。In some embodiments, as shown in FIG. 2 or FIG. 3 , the
其中,通风风道105的进风口1051出气体温度较低,辅散热件103设置于通风风道105的进风口1051处,避免辅散热件103与主散热件102近距离设置造成局部温度过高降低射频加热设备的工作效率。辅散热件103与主散热件102分别设置于通风风道105的进风口1051处和出风口1052处,利于通风风道105内温度均匀分布,减小低风量风扇的运行压力,提高射频加热设备的散热效率。Wherein, the gas temperature at the
在一些实施例中,所述进风口1051设置于所述所述射频加热设备的侧壁或所述所述射频加热设备的底部中的一处以上。In some embodiments, the
进风口1051设置于射频加热设备的侧壁或射频加热设备的底部,使进风口1051低于出风口1052,便于温度较高的气体由位置较高的进风口1051顺利散发至射频加热设备之外。The
在一些实施例中,所述主散热件102和所述辅散热件103为翅片式散热件。In some embodiments, the
其中,翅片式散热件增大散热面积,有助于提高射频加热设备散热效率。Among them, the finned heat sink increases the heat dissipation area, which helps to improve the heat dissipation efficiency of the radio frequency heating equipment.
在一些实施例中,所述主散热件102和所述辅散热件103的散热翅片沿平行于所述通风风道105内气体流动方向设置,减小散热翅片对气体的阻力,加快通风风道105内气体流动速度,提高射频的散热效率,避免加热设备避免散热不及时,导致射频加热设备内部温度过高,降低射频模块101运行效率。In some embodiments, the heat dissipation fins of the main
在一些实施例中,所述辅散热件103的散热面积大于所述主散热件102的散热面积。In some embodiments, the heat dissipation area of the
可选的,辅散热件103包括两个以上,辅散热件103的总散热面积大于主散热件102的散热面积。可选的,仅包括一个辅散热件103,该散热件的散热面积大于主散热件102的散热面积。Optionally, the
其中,主散热件102与射频模块101接触连接,在将主散热件102的热量传导至辅散热件103过程中,伴随着热量的散发,因此,便于将更多的热量传导至温度较低的进风口1051处,辅散热件103的总散热面积大于主散热件102的散热面积。Wherein, the
在一些实施例中,所述通风风道105由所述射频加热设备的隔热层107和外壳108围成。In some embodiments, the
射频加热设备在加热过程中,加热腔中工作温度达到180℃~250℃,避免温度过高造成射频模块101损坏,或对周围物品产生伤害,射频加热设备在加热腔外设置有隔热层107,隔热层107与外壳108之间围成通风风道105,利于射频模块101散热。During the heating process of the radio frequency heating equipment, the working temperature in the heating chamber reaches 180°C to 250°C, so as to avoid damage to the
在一些实施例中,如图2和图3所示,射频加热设备还包括:风扇106。在图2和图3中,风扇106设置于通风风道105的出风口1052处。In some embodiments, as shown in FIG. 2 and FIG. 3 , the radio frequency heating device further includes: a
可选的,风扇106设置于所述通风风道105的进风口1051、所述通风风道105内或所述通风风道105的出风口1052中的一处以上。Optionally, the
其中,在通风风道105的进风口1051处设置风扇106,用于调节进入进风口1051的风量。出风口1052处设置风扇106,用于调节排出通风风道105的风量。在通风风道105内设置风扇106,用于调节通风风道105内空气流速。Wherein, a
在一些实施例中,采用设置两个以上的风扇106以加快通风风道105内空气的流动速度,以提高散热效率。其中,两个以上的风扇106设置于不同位置。In some embodiments, more than two
以上描述和附图充分地示出本文的具体实施方案,以使本领域的技术人员能够实践它们。一些实施方案的部分和特征可以被包括在或替换其他实施方案的部分和特征。本文的实施方案的范围包括权利要求书的整个范围,以及权利要求书的所有可获得的等同物。本文中,术语“第一”、“第二”等仅被用来将一个元素与另一个元素区分开来,而不要求或者暗示这些元素之间存在任何实际的关系或者顺序。实际上第一元素也能够被称为第二元素,反之亦然。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的结构、装置或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种结构、装置或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的结构、装置或者设备中还存在另外的相同要素。本文中各个实施例采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似部分互相参见即可。The above description and drawings sufficiently illustrate specific embodiments herein to enable those skilled in the art to practice them. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of the embodiments herein includes the full scope of the claims, and all available equivalents of the claims. Herein, the terms "first", "second", etc. are only used to distinguish one element from another element without requiring or implying any actual relationship or order between these elements. In fact the first element can also be called the second element and vice versa. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a structure, means or apparatus comprising a series of elements includes not only those elements but also other elements not expressly listed elements, or also elements inherent in the structure, device or equipment. Without further limitations, an element defined by the phrase "comprising a" does not preclude the presence of additional identical elements in the structure, device or equipment comprising said element. Various embodiments herein are described in a progressive manner, each embodiment focuses on the differences from other embodiments, and the same and similar parts of the various embodiments may be referred to each other.
本文中的术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本文和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本公开的限制。在本文的描述中,除非另有规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是机械连接或电连接,也可以是两个元件内部的连通,可以是直接相连,也可以通过中间媒介间接相连,对于本领域的普通技术人员而言,可以根据具体情况理解上述术语的具体含义。The terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", " The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this text and simplifying the description, rather than indicating or implying that the referred device or element must Having a particular orientation, being constructed in a particular orientation, and operating in a particular orientation, therefore, are not to be construed as limitations of the present disclosure. In the description herein, unless otherwise stipulated and limited, the terms "installation", "connection" and "connection" should be interpreted in a broad sense, for example, it can be a mechanical connection or an electrical connection, and it can also be the internal communication of two components, It may be directly connected or indirectly connected through an intermediary, and those skilled in the art can understand the specific meanings of the above terms according to specific situations.
本公开并不局限于上面已经描述并在附图中示出的结构,并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。The present disclosure is not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
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CN105744799A (en) * | 2014-12-12 | 2016-07-06 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation apparatus and heat dissipation system |
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